Tire pressure sensor chip test sorting machine

Abstract

The invention provides a tire pressure sensor chip testing and sorting machine. The tire pressure sensor chip testing and sorting machine comprises a pressure controller assembly, an air storage tank assembly, a charging tray feeding and discharging mechanism and the like. The invention has the following beneficial effects: the scheme adopts a pre-heating mode and a rapid air pressure control mode; according to the principle of the pre-heating mode, the chip is heated to the required temperature in advance and then carried to the test seat for calibration, the series connection mode of heating and testing is changed into the parallel connection mode, the heating time is shortened, meanwhile, the temperatures of all the test suction heads do not affect one another, the temperatures of all the test suction heads can be independently adjusted, and the temperature precision is improved. The principle of the rapid air pressure control mode is that a pressure controller is matched with an air storage tank to assist air supply for boosting, a vacuum generator is matched to assist air exhaust for depressurization, pressure is applied only to a sensor hole in the upper surface of a chip, the volume of controlled air is greatly reduced, and the time required for controlling the air pressure in place is greatly shortened. The calibration test time of the pressure and the temperature of the tire pressure sensor is shortened through two optimization, and the production efficiency is improved.

Description

Technical Field

[0001] The invention belongs to the field of chip testing, and in particular relates to a tire pressure sensor chip testing and sorting machine. Background Art

[0002] The existing tire pressure sensor chip testing and sorting machines are mainly of the temperature box type. The temperature box is a sealed structure with a heater and a test seat. The chips are placed manually or by an automatic loading and unloading robot into the test seat in the box. The number of chips placed at a time is dozens to hundreds. Then the box cover is closed, the heater heats the chip to the specified temperature, and the external pressure controller applies different air pressure values ​​to the box to complete the pressure and temperature calibration of the chip. This structure heats the chip from room temperature to high temperature before calibration, and the heating time is relatively long. When heated in the same space, the chips are far or near from the heat source, and the temperature of each chip cannot be guaranteed to be consistent. The chip is in a pressure environment as a whole in the box, and the gas volume in the box controlled by the pressure controller is relatively large. It takes a long time for the pressure controller to switch between different pressures. These factors have caused problems such as inaccurate chip temperature calibration and low machine output per unit time. Summary of the invention

[0003] In view of this, the present invention aims to provide a tire pressure sensor chip testing and sorting machine to solve at least one problem existing in the above-mentioned prior art.

[0004] To achieve the above object, the technical solution of the present invention is achieved as follows: A tire pressure sensor chip testing and sorting machine comprises a pressure controller assembly, an air storage tank assembly, an electromagnetic valve assembly, a tray in-and-out mechanism, a refrigerator, a preheating tray assembly, a preheating sheet tray assembly, a material transport trolley, a test suction head arm, a hot air gun assembly, a loading suction head arm, a unloading suction head arm, a tray conveying arm assembly, a vacuum generator assembly, a test seat assembly, a frame, a hood and a large plate. The pressure controller assembly, the air storage tank assembly and the electromagnetic valve assembly are all mounted on the top of the hood, the vacuum generator assembly is mounted below the electromagnetic valve assembly, the hood and the tray in-and-out mechanism are mounted on the frame, the refrigerator is mounted inside the frame, and the large plate is also mounted on the frame, the preheating tray assembly, the preheating sheet tray assembly, the material transport trolley, the test suction head arm, the hot air gun assembly, the loading suction head arm, the unloading suction head arm, the tray conveying arm assembly and the test seat assembly are all mounted on the large plate.

[0005] Further, the pressure controller assembly includes a calibration pressure controller module, a gas tank pressure controller module 1, a gas tank pressure controller module 2, a gas tank pressure controller module 3, and a gas tank pressure controller module 4; the gas tank pressure controller module 1, the gas tank pressure controller module 2, the gas tank pressure controller module 3, and the gas tank pressure controller module 4 are respectively arranged on one side of the calibration pressure controller module, and the gas tank pressure controller module 1, the gas tank pressure controller module 2, the gas tank pressure controller module 3, and the gas tank pressure controller module 4 are arranged in an array; The gas tank assembly includes gas tank one, gas tank two, gas tank three, and gas tank four. Gas tank four, gas tank three, gas tank two, and gas tank one are installed in sequence from left to right on the other side of the calibration pressure controller module.

[0006] Furthermore, the solenoid valve assembly includes a gas tank deflation solenoid valve assembly, a test tip A solenoid valve assembly, a test tip B solenoid valve assembly and a calibration pressure module solenoid valve assembly. The test tip A solenoid valve assembly and the test tip B solenoid valve assembly are symmetrically arranged, and a gas tank deflation solenoid valve assembly and a calibration pressure module solenoid valve assembly are respectively provided on one side of the test tip A solenoid valve assembly and the test tip B solenoid valve assembly.

[0007] Furthermore, the vacuum generator assembly includes a vacuum generator body, a vacuum generator manifold and an air inlet connector. The vacuum generator body is mounted on the vacuum generator manifold, and air inlet connectors are respectively mounted on the upper and lower ends of the vacuum generator manifold.

[0008] Further, the pre-heating plate assembly includes a pre-heating plate unit 1, a pre-heating plate unit 2, a pre-heating plate blowing rod 1 and a pre-heating plate blowing rod 2, all of which are located on the large plate, and a pre-heating plate blowing rod 1 and a pre-heating plate blowing rod 2 are respectively arranged on one side of the pre-heating plate unit 1 and the pre-heating plate unit 2; The material transport trolley includes an A trolley assembly, a B trolley assembly, a trolley blowing rod 1, a trolley blowing rod 2, a trolley blowing rod 1, and a trolley blowing rod 2, all of which are located on a large plate. The A trolley assembly and the B trolley assembly are symmetrically arranged, and a trolley blowing rod 1 and a trolley blowing rod 2 are respectively installed between the A trolley assembly and the B trolley assembly, and a trolley blowing rod 1 and a trolley blowing rod 2 are respectively installed on one side of the A trolley assembly.

[0009] Furthermore, the pre-heating plate unit 1 includes a pre-heating plate body, a pre-heating plate mounting plate, a heating plate body, a heating plate protection plate and a pre-heating plate support. The pre-heating plate body, the pre-heating plate mounting plate, the heating plate body and the heating plate protection plate are arranged in sequence from top to bottom, and both sides of the heating plate protection plate are installed to the large plate through the pre-heating plate support.

[0010] Furthermore, the A trolley assembly includes an A trolley base, an A trolley heating rod, an A trolley mounting plate and an A trolley body. The A trolley mounting plate is installed on the top of the A trolley base, the A trolley body is installed on the top of the A trolley mounting plate, and the A trolley heating rod is installed inside the A trolley mounting plate.

[0011] Furthermore, the A trolley blowing rod comprises a blowing rod cover, a blowing rod body and a blowing rod base, the blowing rod body is installed inside the blowing rod base, the blowing rod cover is installed on the top of the blowing rod base, and the blowing rod body and the blowing rod cover are both provided with blowing holes.

[0012] Furthermore, the preheating sheet material tray assembly includes a hot air gun, a preheating sheet bottom plate, a preheating sheet discharge tray and a preheating sheet body. The hot air gun is installed at the bottom of the preheating sheet bottom plate, and the preheating sheet discharge tray is installed above the preheating sheet bottom plate. The surface of the preheating sheet discharge tray is provided with placement slots for placing a plurality of preheating sheet bodies.

[0013] Furthermore, the test seat assembly includes a test seat heating rod, a test seat heating frame, a test seat blowing rod, a test seat body, a test seat blowing guide block, a chip to be tested and a test seat mounting plate. The test seat heating frame is a hollow rectangular frame structure. The test seat blowing rod is installed inside the hollow rectangular frame structure. The test seat heating rod is installed inside the test seat heating frame. The test seat mounting plate is installed below the test seat heating frame. A number of test seat bodies and test seat blowing guide blocks are installed on the surface of the test seat mounting plate. A number of blowing rod air outlet holes are provided on the test seat blowing rod, a guide block air duct is provided on the test seat blowing guide block, a test seat air duct is provided in the test seat body, and a pressure sensor is also provided on the chip to be tested.

[0014] Furthermore, the test tip arm includes a test tip assembly, a test arm horizontal movement assembly, a test arm A vertical movement assembly, a test arm B vertical movement assembly and a test arm mounting plate, the test tip assembly is installed at the bottom of the test arm mounting plate, and the test arm horizontal movement assembly, the test arm A vertical movement assembly, and the test arm B vertical movement assembly are installed at the top of the test arm mounting plate.

[0015] Furthermore, the test tip assembly includes a test tip base, a test tip mounting seat, a tip heating rod, a tip temperature sensor, a test tip body, a sealing ring and a tip blowing rod. Several test tip mounting seats are installed at the bottom of the test tip base, a test tip body is installed on each test tip mounting seat, and each test tip mounting seat is also respectively installed with a tip heating rod, a tip temperature sensor, and a sealing ring, and a tip blowing rod is also installed on one side of the test tip mounting seat.

[0016] Compared with the prior art, the tire pressure sensor chip testing and sorting machine described in the present invention has the following advantages: The tire pressure sensor chip testing and sorting machine described in the present invention adopts a pre-heating method and a rapid air pressure control method. The principle of the pre-heating method is to heat the chip to the required temperature in advance, and then transport it to the test seat for calibration. The heating and testing are changed from a series method to a parallel method, which reduces the heating time. At the same time, the temperature of each test nozzle does not affect each other, and each temperature can be adjusted independently, which improves the temperature accuracy. The principle of the rapid air pressure control method is that the pressure controller is matched with the air storage tank to assist in air supply to boost the pressure, and the vacuum generator is matched to assist in air extraction to reduce the pressure. Pressure is only applied to the sensor holes on the upper surface of the chip. The controlled gas volume is greatly reduced, and the time required for air pressure control is greatly reduced. The two optimizations reduce the calibration test time of the tire pressure sensor pressure and temperature, and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings: Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present invention; Figure 2 It is an exploded schematic diagram of the overall structure according to an embodiment of the present invention; Figure 3 It is a partial top view schematic diagram of the overall structure according to an embodiment of the present invention; Figure 4 It is a partial schematic diagram of the overall structure according to an embodiment of the present invention; Figure 5 A schematic diagram of a solenoid valve assembly according to an embodiment of the present invention; Figure 6 This is a schematic diagram of a pre-warming plate assembly according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the connection between the pre-warming plate assembly and the material transport trolley according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the connection between the pre-warming plate assembly and the material transport trolley according to an embodiment of the present invention; Fig. 9 A schematic diagram of a pre-warming plate unit according to an embodiment of the present invention; Fig.10 This is a schematic diagram of the A trolley assembly according to an embodiment of the present invention; Fig.11 This is a schematic diagram of a blow dryer rod of a trolley A according to an embodiment of the present invention; Fig.12 This is a schematic diagram of a preheating sheet tray assembly according to an embodiment of the present invention; Fig.13 A schematic diagram of a test socket assembly according to an embodiment of the present invention; Fig.14 A bottom view schematic diagram of a test socket assembly according to an embodiment of the present invention; Fig.15 A cross-sectional schematic diagram of a test socket assembly according to an embodiment of the present invention; Fig.16 This is a schematic diagram of a test pipette tip arm according to an embodiment of the present invention; Fig.17 This is a schematic diagram of a test tip assembly according to an embodiment of the present invention; Fig.18 It is a partial cross-sectional schematic diagram of a test tip assembly and a test seat according to an embodiment of the present invention; Fig.19 This is a schematic diagram of the pneumatic principle described in an embodiment of the present invention.

[0018] Description of reference numerals: 1. Pressure controller assembly; 2. Gas tank assembly; 3. Solenoid valve assembly; 4. Material tray in and out mechanism; 5. Refrigerator; 6. Preheating tray assembly; 7. Preheating sheet material tray assembly; 8. Material transport trolley; 9. Test suction head arm; 10. Hot air gun assembly; 11. Loading suction head arm; 12. Unloading suction head arm; 13. Material tray conveying arm assembly; 14. Vacuum generator assembly; 15. Test seat assembly; 16. Rack; 17. Machine cover; 18. Large board; 101. Calibration pressure controller module; 102. Gas tank pressure controller module one; 103. Gas tank pressure controller module two; 104. Gas tank pressure controller module three; 105. Gas tank pressure controller module four; 201, gas tank one; 202, gas tank two; 203, gas tank three; 204, gas tank four; 301, gas tank deflation solenoid valve assembly; 302, test suction head A solenoid valve assembly; 303, test suction head B solenoid valve assembly; 304, calibration pressure module solenoid valve assembly; 601, pre-heating plate unit 1; 602, pre-heating plate unit 2; 603, pre-heating plate blowing rod 1; 604, pre-heating plate blowing rod 2; 6011, pre-heating plate body; 6012, pre-heating plate mounting plate; 6013, heating plate body; 6014, heating plate protection plate; 6015, pre-heating plate support; 701, hot air gun; 702, preheating plate bottom plate; 703, preheating plate discharge tray; 704, preheating plate body; 801, A trolley assembly; 802, B trolley assembly; 803, A trolley blower rod one; 804, A trolley blower rod two; 805, B trolley blower rod one; 806, B trolley blower rod two; 8011, A trolley base; 8012, A trolley heating rod; 8013, A trolley mounting plate; 8014, A trolley body; 8031. a blow dryer rod-a cover plate; 8032. a blow dryer rod-a body; 8033. a blow dryer rod-a base; 901, test suction head assembly; 902, test arm horizontal movement assembly; 903, test arm A vertical movement assembly; 904, test arm B vertical movement assembly; 9011, test tip base; 9012, test tip mounting base; 9013, tip heating rod; 9014, tip temperature sensor; 9015, test tip body; 9016, sealing ring; 9017, tip blowing rod; 1401, vacuum generator body; 1402, vacuum generator manifold; 1403, air inlet connector; 151. Test seat heating rod; 152. Test seat heating frame; 153. Test seat blowing rod; 154. Test seat body; 155. Test seat blowing guide block; 156. Chip to be tested; 157. Test seat mounting plate; 153A, air outlet of the blowing rod; 154A, air duct of the test socket; 155A, air duct of the guide block; 156A, pressure sensor. DETAILED DESCRIPTION

[0019] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0020] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0021] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0022] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0023] like Figures 1 to 19 As shown, a tire pressure sensor chip testing and sorting machine includes a pressure controller component 1, an air tank component 2, a solenoid valve component 3, a tray in and out mechanism 4, a refrigerator 5, a preheating tray component 6, a preheating sheet tray component 7, a material transport trolley 8, a test suction head arm 9, a hot air gun component 10, a loading suction head arm 11, a unloading suction head arm 12, a tray conveying arm assembly 13, a frame 16, a machine cover 17 and a large plate 18.

[0024] Figure 1 It is a front view of the equipment, including a pressure controller assembly 1, a gas storage tank assembly 2, a solenoid valve assembly 3, a tray in-and-out mechanism 4, a refrigerator 5, a frame 16, and a hood 17. The pressure controller assembly 1, the gas storage tank assembly 2, and the solenoid valve assembly 3 are installed on the top of the hood 17, the hood 17 and the tray in-and-out mechanism 4 are installed on the frame 16, and the refrigerator 5 is installed inside the frame 16.

[0025] Figure 2 It is a back view of the equipment, including a preheating plate assembly 6, a preheating plate material plate assembly 7, a material transport trolley 8, a test suction head arm 9, a hot air gun assembly 10, a loading suction head arm 11, a unloading suction head arm 12, a material plate conveying arm assembly 13 and a large plate 18. The large plate 18 is mounted on the frame 16, and the remaining components are mounted on the large plate 18.

[0026] Figure 3It is a top view after hiding the hood 17 and installing the components on the hood 17. The tray in-and-out mechanism 4 is used for feeding and unloading chips, and the test suction head arm 9, the loading suction head arm 11 and the unloading suction head arm 12 are used to carry chips. The chip to be tested enters from the left tray in-and-out mechanism 4, and is carried to the pre-heating tray assembly 6 and the material transport trolley 8 by the loading suction head arm 11. The test suction head arm 9 sucks the chip and puts it back to the material transport trolley 8 after completing the test. The unloading suction head arm 12 sucks the tested chip from the material transport trolley 8 and puts it on the right tray in-and-out mechanism 4 to complete the chip sorting. The tray transfer arm assembly 13 is used for tray transportation between each tray in-and-out mechanism 4. The pressure controller assembly 1 provides a high-pressure test environment for the chip. The pre-heating tray assembly 6, the material transport trolley 8, the test suction head assembly 901, the hot air gun assembly 10 and the refrigerator 5 provide a normal temperature or high temperature test environment.

[0027] Figure 4 It is a position diagram of various components installed on the hood 17, including a calibration pressure controller module 101, an air tank pressure controller module one 102, an air tank pressure controller module two 103, an air tank pressure controller module three 104, an air tank pressure controller module four 105, an air tank one 201, an air tank two 202, an air tank three 203, an air tank four 204, and a vacuum generator assembly 14. One or two control modules can be installed in a pressure controller assembly 1 host, including a calibration pressure controller module 101 and a gas tank pressure controller module, wherein the calibration pressure controller module 101 is used to accurately control the pressure provided to the chip, the gas tank pressure controller module controls the pressure in the gas tank, the gas tank pressure controller module 1 102 controls the gas tank 1 201, the gas tank pressure controller module 2 103 controls the gas tank 2 202, the gas tank pressure controller module 3 104 controls the gas tank 3 203, and the gas tank pressure controller module 4 105 controls the gas tank 4 204. The vacuum generator assembly 14 is installed on the lower side of the top surface of the hood 17 to provide vacuum pressure for sucking the chip and assist the pressure controller assembly 1 in degassing and depressurizing.

[0028] Figure 5 It is a structural diagram of the solenoid valve assembly 3, including a gas tank deflation solenoid valve assembly 301, a test suction head A solenoid valve assembly 302, a test suction head B solenoid valve assembly 303, and a calibration pressure module solenoid valve assembly 304. The gas tank deflation solenoid valve assembly 301 is used to control the time for the gas tank to deflate to the chip end. The test suction heads of the solenoid valve assembly 3 are divided into two groups, A and B. The test suction head A solenoid valve assembly 302 is used to control the switching between high air pressure and vacuum of the test suction head A, and the test suction head B solenoid valve assembly 303 is used to control the switching between high air pressure and vacuum of the test suction head B. When switching to the high air pressure mode, high air pressure is introduced into the chip end, and when switching to the vacuum mode, the chip end is adsorbed by the vacuum suction cup. The calibration pressure module solenoid valve assembly 304 is used to control the connection and disconnection between the calibration pressure module and the chip end.

[0029] Figure 6 It is a structural diagram of the vacuum generator assembly 14, including a vacuum generator body 1401, a vacuum generator manifold 1402, and an air inlet connector 1403. The vacuum generator body 1401 is installed on the vacuum generator manifold 1402, and the vacuum generator body 1401 is set to 16 pieces, which can provide a single suction of 16 chips.

[0030] Figure 7 It is an installation position diagram of the preheating plate assembly 6, the material transport trolley 8 and the test socket assembly 15, including the preheating plate unit 1 601, the preheating plate unit 2 602, the A trolley assembly 801, the B trolley assembly 802, and the test socket assembly 15. The preheating plate assembly 6 of the equipment is set in two groups to increase the number of preheating chips. The material transport trolley 8 is set in two groups, A and B, to improve the material transport efficiency. The test socket assembly 15 is set between the two groups of material transport trolleys 8 and is the chip test station.

[0031] Figure 8 It is a diagram of the installation position of the blowing rods under the pre-heating plate assembly 6 and the material transport trolley 8, including the pre-heating plate blowing rod 1 603, the pre-heating plate blowing rod 2 604, the A trolley blowing rod 1 803, the A trolley blowing rod 2 804, the B trolley blowing rod 1 805, and the B trolley blowing rod 2 806. One blowing rod (pre-heating plate blowing rod 1 603, pre-heating plate blowing rod 2 604) is arranged under each pre-heating plate, and two blowing rods (A trolley blowing rod 803, A trolley blowing rod 2 804, B trolley blowing rod 1 805, B trolley blowing rod 2 806) are arranged under each material transport trolley 8. The blowing rods blow out cold air to reduce the temperature of the pre-heating plate assembly 6 and the material transport trolley 8.

[0032] Fig. 9 It is a structural diagram of a preheating plate unit 601, including a preheating plate body 6011, a preheating plate mounting plate 6012, a heating plate body 6013, a heating plate protection plate 6014, and a preheating plate support 6015. The preheating plate body 6011 is used to place chips, the preheating plate mounting plate 6012 is used to place the preheating plate body 6011, the heating plate body 6013 is attached to the bottom of the preheating plate mounting plate 6012 to heat the preheating plate body 6011, the heating plate protection plate 6014 is installed under the heating plate body 6013, and the preheating plate support 6015 fixes the entire assembly on the large plate 18.

[0033] Fig.10It is a structural diagram of the A-cart assembly 801, including the A-cart base 8011, the A-cart heating rod 8012, the A-cart mounting plate 8013, and the A-cart body 8014. The A-cart base 8011 is used to drive the A-cart body 8014 to move and transport chips, the A-cart heating rod 8012 is used to heat the chip and is installed inside the A-cart mounting plate 8013, and the A-cart body 8014 is installed on the top, with 16 chip placement slots, which can carry 16 chips at a time.

[0034] Fig.11 It is a structural diagram of a blower bar 803 of a trolley A, including a blower bar cover plate 8031, a blower bar body 8032, and a blower bar base 8033. Blowing holes are provided on the blower bar body 8032 and the blower bar cover plate 8031, and cold air is passed through the blower bar body 8032. The blower bar cover plate 8031 ​​and the blower bar base 8033 are made of heat-insulating materials to isolate the blower bar body 8032 from contact with the outside air, so as to avoid condensation on the outer surface of the blower bar body 8032 due to low temperature.

[0035] Fig.12 It is a structural diagram of the preheating sheet tray assembly 7, including a hot air gun 701, a preheating sheet bottom plate 702, a preheating sheet discharge tray 703, and a preheating sheet body 704. The hot air gun 701 is used to heat the normal temperature or low temperature gas blown into the test seat assembly 15, so that the temperature of the test seat assembly 15 reaches the required temperature. The preheating sheet bottom plate 702 is used to install the preheating sheet discharge tray 703, and the preheating sheet discharge tray 703 is provided with a plurality of slots for placing the preheating sheet bodies 704. The device can hold 16 preheating sheet bodies 704. The preheating sheet bodies 704 are made of heat-conducting materials. When the test suction head body 9015 sucks the preheating sheet body 704 and presses it into the test seat, the preheating sheet body 704 transfers the temperature of the test suction head body 9015 and the test seat assembly 15, so that the temperatures of the two tend to be consistent, and the temperature test environment of the chip reaches a stable state before the test.

[0036] Fig.13 It is the upper part of the structure diagram of the test seat assembly 15, including a test seat heating rod 151, a test seat heating frame 152, and a test seat blowing rod 153. The test seat heating rod 151 is installed inside the test seat heating frame 152, and the test seat blowing rod 153 is installed inside the test seat heating frame 152, and is connected to the external hot air gun 701 using an air pipe.

[0037] Fig.14It is the lower part of the structural diagram of the test seat assembly 15, including a test seat body 154, a test seat blowing guide block 155, a test seat mounting plate 157, and a blowing rod air outlet 153A. The test seat body 154 can be connected and communicated with the chip, and is a chip testing station. The equipment is equipped with 16 test seat bodies 154, and 16 chips can be tested at a time. The test seat blowing guide block 155 and the blowing rod air outlet 153A are docked, and the high-temperature or low-temperature gas of the blowing rod can be introduced into the test seat body 154, so that the temperature of the test seat body 154 reaches the required temperature. The test seat mounting plate 157 is used to fix the test seat body 154 and transfer the temperature of the heating rod to the test seat body 154.

[0038] Fig.15 It is a cross-sectional view of the test seat assembly 15, including the guide block air duct 155A, the test seat air duct 154A, and the chip to be tested 156. The airflow enters the test seat body 154 through the blowing rod and the guide block, and is discharged from the other end of the test seat body 154, completing the gas temperature conduction to the test seat body 154, and the heating rod temperature is transferred to the test seat body 154 through the heating frame and the test seat mounting plate 157, and both provide the required temperature environment for the chip.

[0039] Fig.16 It is a structural diagram of the test suction head arm 9, including a test suction head assembly 901, a test arm horizontal moving assembly 902, a test arm A vertical moving assembly 903, and a test arm B vertical moving assembly 904. The test suction head assembly 901 sucks the suction chip, the test arm horizontal moving assembly 902 is set as one group, driving two groups of test suction head bodies 9015 to move simultaneously, and the test arm vertical moving assembly is set as two groups, driving the test suction head body 9015 to rise and fall separately.

[0040] Fig.17 It is a structural diagram of one set of test tip assemblies 901, including a test tip base 9011, a test tip mounting seat 9012, a tip heating rod 9013, a tip temperature sensor 9014, a test tip body 9015, a sealing ring 9016, and a tip blowing rod 9017. The test tip base 9011 is connected to an external test arm, and 16 sets of test tip bodies 9015 are installed below. The tip heating rod 9013 is installed in the test tip mounting seat 9012, and the heat generated provides the required temperature environment for the chip. The tip temperature sensor 9014 measures the ambient temperature in real time and feeds back to the control system so that the temperature can be stably controlled within the required range. The tip blowing rod 9017 blows out cold air to reduce the temperature of the tip. The sealing ring 9016 contacts and adheres to the upper surface of the chip to seal the air pressure in the pipeline.

[0041] Fig.18It is a cross-sectional view of the test tip assembly 901, including the test seat body 154, the chip to be tested 156, the pressure sensor 156A, the tip temperature sensor 9014, the test tip body 9015, and the sealing ring 9016. The pressure sensor 156A is a structure on the chip to be tested 156 that senses the gas pressure and generates an electrical signal, and is surrounded by the sealing ring 9016. The sealing ring 9016 prevents the pressure from leaking beyond the range, so that the chip pressure sensor 156A can receive the correct pressure stimulation.

[0042] Fig.19 This is a pneumatic principle diagram. The gas source is filtered by the gas source processing element, and the clean gas enters the vacuum generator assembly 14, the gas tank assembly 2 and the calibration pressure controller module 101. The vacuum generator assembly 14 is used to absorb the chip and assist in reducing the gas pressure at the chip end. The gas tank pressure control module is used to control the gas pressure in the gas tank to the required value, which is usually slightly greater than the corresponding calibration pressure. The calibration pressure controller module 101 directly controls the calibration pressure required by the chip end, and has two control modes: increasing and reducing pressure. One workflow is that the solenoid valve 1 is turned on, the vacuum generator assembly 14 generates a vacuum, the chip is sucked, and after the chip is placed in the test seat assembly 15, the solenoid valve 1 is closed, the solenoid valve 2 and the solenoid valve 3 are turned on at the same time, the gas storage tank is deflated, and the pressure calibration module starts the control. The solenoid valve 2 is closed after the gas storage tank is deflated within the program setting time, and the calibration pressure controller module 101 continues to control the pressure to the required pressure range. At this time, the pressure sensor 156A on the chip senses the pressure stimulation and generates an electrical signal. The test system program matches the current pressure value of the pressure calibration module with the current electrical signal value and writes it into the chip internal program, so that the chip has the ability to correctly sense pressure. When the pressure needs to be reduced during the test, the solenoid valve 1 is turned on, the vacuum generator assembly 14 sucks gas out, the calibration pressure controller module 101 reduces the pressure, the solenoid valve 1 is closed within the program setting time, and the calibration pressure control module continues to control the pressure within the required range. At this time, the vacuum generator assembly 14 plays a role in assisting in reducing the pressure, reducing the time consumption of reducing the pressure. When the test is finished, the solenoid valve 3 is closed, the solenoid valve 1 is turned on, the vacuum generator assembly 14 sucks out all the air to generate a vacuum, and the chip is adsorbed and moved out of the test seat.

[0043] Advantages of the present invention: This solution adopts a pre-heating method and a rapid air pressure control method. The principle of the pre-heating method is to heat the chip to the required temperature in advance, and then move it to the test seat for calibration. The heating and testing are changed from a series method to a parallel method, which reduces the heating time. At the same time, the temperature of each test nozzle does not affect each other, and each temperature can be adjusted independently, which improves the temperature accuracy. The principle of the rapid air pressure control method is that the pressure controller is equipped with an air tank to assist in air supply to increase the pressure, and the vacuum generator is used to assist in air extraction to reduce the pressure. Pressure is only applied to the sensor holes on the upper surface of the chip. The controlled gas volume is greatly reduced, and the time required for air pressure control is greatly reduced. The two optimizations reduce the calibration test time of the tire pressure sensor pressure and temperature, and improve production efficiency.

[0044] Example 1 When testing at room temperature of 25°C, the refrigerator 5 blows out cold air, which passes through the pipe and the blowing rod to reduce the temperature of the preheating plate assembly 6, the material transport trolley 8, the test seat assembly 15 and the test suction head body 9015 to below 25°C. Combined with the heating function of each component, it heats itself back to temperature and keeps it at 25°C. The number of test suction head bodies 9015 is set to 16, and the temperature of each suction head does not affect each other, and each temperature can be adjusted independently, which improves the temperature accuracy. The chip 156 to be tested enters the equipment from the tray in and out mechanism 4, and the loading suction head arm 11 sucks the chip and puts it into the preheating plate assembly 6. After the chip is preheated to 25°C, the loading suction head arm 11 sucks the chip and puts it into the material transport trolley 8. The material transport trolley 8 transports the chip to the test area, and the test suction head arm 9 sucks the chip and presses it into the test seat assembly 15. The calibration pressure controller module 101 applies the required pressure to the chip end, and the gas tank assembly 2 deflates the chip end within a period of time controlled by the program, and the auxiliary pressure boost reduces the time consumption. After the pressure at the chip end is stable, the test program reads the current pressure value, pairs it with the electrical signal generated by the pressure sensor 156A on the chip when it is stimulated, and writes it into the chip's built-in program. The test program also reads the current ambient temperature and the electrical signal generated by the temperature sensor built into the chip (not shown in the figure) when it is stimulated, and pairs it with the chip's built-in program. After these two steps, the chip has the ability to correctly sense pressure and temperature. If it is necessary to reduce the pressure to a lower required value during the test, the vacuum generator assembly 14 will evacuate and release the pressure within a period of time controlled by the program to assist in reducing the pressure and reduce time. When the test is completed, the vacuum generator assembly 14 extracts all the air to form a negative pressure, the test suction head arm 9 sucks the chip out of the test seat, and puts it into the material transport trolley 8. The material transport trolley 8 transports the tested chip out of the test area, and the unloading suction head arm 12 sucks the tested chip and classifies it into the discharge tray of the tray in and out mechanism 4, completing the calibration test and sorting of the chip.

[0045] During the high temperature test at 70°C, the refrigerator 5 is turned off, and the temperature of the preheating plate assembly 6, the material transport trolley 8, the test seat assembly 15 and the test tip body 9015 is raised to 70°C and maintained. The number of test tip bodies 9015 is set to 16, and the temperature of each tip does not affect each other, and each temperature can be adjusted independently, which improves the temperature accuracy. Because the temperature difference between the surface of the test seat assembly 15 and the air is large under high temperature conditions, the heat dissipation of the test seat assembly 15 is serious, causing the actual temperature of the test seat assembly 15 to fail to reach 70°C (at room temperature of 25°C, the temperature difference between the surface of the test seat assembly 15 and the air is very small, the heat dissipation is not obvious, and the actual temperature of the test seat assembly 15 is close to 25°C. The lack of heat dissipation causes the actual temperature to be low). At this time, the actual temperature of the surface of the test seat assembly 15 needs to be preheated to 70°C to ensure that the chip has the correct temperature environment for testing. The preheating method of the test seat assembly 15 is as follows: the loading suction head arm 11 sucks the preheating sheet from the preheating sheet tray assembly 7 and puts it on the material transport trolley 8. The material transport trolley 8 carries the preheating sheet to the test area. The test suction head arm 9 sucks the preheating sheet and presses it into the test seat assembly 15. After a period of time, the ambient temperature of the test seat assembly 15 reaches 70°C. The test suction head arm 9 sucks the preheating sheet and moves it out of the test seat assembly 15 and puts it back to its original position. While the test seat assembly 15 is preheating, the chip 156 to be tested has been simultaneously transported to the preheating tray for preheating. After the test seat assembly 15 is preheated, the chip can be tested. The test process is the same as the above-mentioned normal temperature test process.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A tire pressure sensor chip testing and sorting machine, characterized in that: The invention comprises a pressure controller assembly (1), an air storage tank assembly (2), an electromagnetic valve assembly (3), a tray in-and-out mechanism (4), a refrigerator (5), a preheating tray assembly (6), a preheating plate tray assembly (7), a material transport trolley (8), a test suction head arm (9), a hot air gun (701) assembly (10), a loading suction head arm (11), a unloading suction head arm (12), a tray conveying arm assembly (13), a vacuum generator assembly (14), a test seat assembly (15), a frame (16), a machine cover (17) and a large plate (18), wherein the pressure controller assembly (1), the air storage tank assembly (2) and the electromagnetic valve assembly (3) The vacuum generator assembly (14) is installed on the top of the hood (17), the vacuum generator assembly (14) is installed below the solenoid valve assembly (3), the hood (17) and the tray in-and-out mechanism (4) are installed on the frame (16), the refrigerator (5) is installed inside the frame (16), and a large plate (18) is also installed on the frame (16), and the preheating plate assembly (6), the preheating plate material tray assembly (7), the material transport trolley (8), the test suction head arm (9), the hot air gun (701) assembly (10), the loading suction head arm (11), the unloading suction head arm (12), the tray conveying arm assembly (13) and the test seat assembly (15) are all installed on the large plate (18).

2. A tire pressure sensor chip testing and sorting machine according to claim 1, characterized in that: The pressure controller assembly (1) comprises a calibration pressure controller module (101), a gas storage tank pressure controller module one (102), a gas storage tank pressure controller module two (103), a gas storage tank pressure controller module three (104), and a gas storage tank pressure controller module four (105); the gas storage tank pressure controller module one (102), the gas storage tank pressure controller module two (103), the gas storage tank pressure controller module three (104), and the gas storage tank pressure controller module four (105) are respectively arranged on one side of the calibration pressure controller module (101), and the gas storage tank pressure controller module one (102), the gas storage tank pressure controller module two (103), the gas storage tank pressure controller module three (104), and the gas storage tank pressure controller module four (105) are arranged in an array; The gas storage tank assembly (2) comprises gas storage tank one (201), gas storage tank two (202), gas storage tank three (203), and gas storage tank four (204); gas storage tank four (204), gas storage tank three (203), gas storage tank two (202), and gas storage tank one (201) are installed in sequence from left to right on the other side of the calibration pressure controller module (101).

3. The tire pressure sensor chip testing and sorting machine according to claim 1, characterized in that: The solenoid valve assembly (3) comprises a gas storage tank deflation solenoid valve assembly (301), a test suction head A solenoid valve assembly (302), a test suction head B solenoid valve assembly (303) and a calibration pressure module solenoid valve assembly (304); the test suction head A solenoid valve assembly (302) and the test suction head B solenoid valve assembly (303) are symmetrically arranged; and the gas storage tank deflation solenoid valve assembly (301) and the calibration pressure module solenoid valve assembly (304) are respectively arranged on one side of the test suction head A solenoid valve assembly (302) and the test suction head B solenoid valve assembly (303).

4. The tire pressure sensor chip testing and sorting machine according to claim 1, characterized in that: The vacuum generator assembly (14) comprises a vacuum generator body (1401), a vacuum generator manifold (1402) and an air inlet connector (1403); the vacuum generator body (1401) is mounted on the vacuum generator manifold (1402); and the air inlet connectors (1403) are respectively mounted at the upper and lower ends of the vacuum generator manifold (1402).

5. The tire pressure sensor chip testing and sorting machine according to claim 1, characterized in that: The pre-heating plate assembly (6) comprises a pre-heating plate unit 1 (601), a pre-heating plate unit 2 (602), a pre-heating plate blowing rod 1 (603) and a pre-heating plate blowing rod 2 (604), all of which are located on the large plate (18); the pre-heating plate unit 1 (601) and the pre-heating plate unit 2 (602) are provided with a pre-heating plate blowing rod 1 (603) and a pre-heating plate blowing rod 2 (604) on one side thereof respectively; The material transport trolley (8) comprises an A trolley assembly (801), a B trolley assembly (802), an A trolley blowing rod 1 (803), an A trolley blowing rod 2 (804), a B trolley blowing rod 1 (805), and a B trolley blowing rod 2 (806), all of which are located on a large plate (18); the A trolley assembly (801) and the B trolley assembly (802) are symmetrically arranged; the B trolley blowing rod 1 (805) and the B trolley blowing rod 2 (806) are respectively installed between the A trolley assembly (801) and the B trolley assembly (802); and the A trolley blowing rod 1 (803) and the A trolley blowing rod 2 (804) are respectively installed on one side of the A trolley assembly (801).

6. A tire pressure sensor chip testing and sorting machine according to claim 5, characterized in that: The pre-heating plate unit 1 (601) comprises a pre-heating plate body (6011), a pre-heating plate mounting plate (6012), a heating plate body (6013), a heating plate protection plate (6014) and a pre-heating plate support (6015), wherein the pre-heating plate body (6011), the pre-heating plate mounting plate (6012), the heating plate body (6013) and the heating plate protection plate (6014) are arranged in sequence from top to bottom, and both sides of the heating plate protection plate (6014) are mounted to the large plate (18) via the pre-heating plate support (6015); The A trolley assembly (801) comprises an A trolley base (8011), an A trolley heating rod (8012), an A trolley mounting plate (8013) and an A trolley body (8014); the A trolley mounting plate (8013) is mounted on the top of the A trolley base (8011); the A trolley body (8014) is mounted on the top of the A trolley mounting plate (8013); and the A trolley heating rod (8012) is mounted inside the A trolley mounting plate (8013); The A trolley blowing rod (803) comprises a blowing rod cover (8031), a blowing rod body (8032) and a blowing rod base (8033), wherein the blowing rod body (8032) is installed inside the blowing rod base (8033), and the blowing rod cover (8031) is installed on the top of the blowing rod base (8033), and the blowing rod body (8032) and the blowing rod cover (8031) are both provided with blowing holes.

7. The tire pressure sensor chip testing and sorting machine according to claim 1, characterized in that: The preheating sheet material tray assembly (7) comprises a hot air gun (701), a preheating sheet bottom plate (702), a preheating sheet material tray (703) and a preheating sheet body (704); the hot air gun (701) is installed at the bottom of the preheating sheet bottom plate (702); the preheating sheet material tray (703) is installed above the preheating sheet bottom plate (702); and the surface of the preheating sheet material tray (703) is provided with placement slots for placing a plurality of preheating sheet bodies (704).

8. The tire pressure sensor chip testing and sorting machine according to claim 1, characterized in that: The test seat assembly (15) comprises a test seat heating rod (151), a test seat heating frame (152), a test seat blowing rod (153), a test seat body (154), a test seat blowing guide block (155), a chip to be tested (156) and a test seat mounting plate (157); the test seat heating frame (152) is a hollow rectangular frame structure, the test seat blowing rod (153) is installed inside the hollow rectangular frame structure, the test seat heating rod (151) is installed inside the test seat heating frame (152), and the test seat heating frame (154) is a hollow rectangular frame structure. A test seat mounting plate (157) is installed below (152), and a plurality of test seat bodies (154) and a test seat blowing guide block (155) are installed on the surface of the test seat mounting plate (157); a plurality of blowing rod air outlet holes (153A) are provided on the test seat blowing rod (153), and a guide block air duct (155A) is provided on the test seat blowing guide block (155); a test seat air duct (154A) is provided in the test seat body (154), and a pressure sensor (156A) is also provided on the chip to be tested (156).

9. The tire pressure sensor chip testing and sorting machine according to claim 1, characterized in that: The test suction head arm (9) comprises a test suction head assembly (901), a test arm horizontal movement assembly (902), a test arm A vertical movement assembly (903), a test arm B vertical movement assembly (904) and a test arm mounting plate, wherein the test suction head assembly (901) is mounted at the bottom of the test arm mounting plate, and the test arm horizontal movement assembly (902), the test arm A vertical movement assembly (903), and the test arm B vertical movement assembly (904) are mounted at the top of the test arm mounting plate.

10. A tire pressure sensor chip testing and sorting machine according to claim 9, characterized in that: The test tip assembly (901) comprises a test tip base (9011), a test tip mounting seat (9012), a tip heating rod (9013), a tip temperature sensor (9014), a test tip body (9015), a sealing ring (9016) and a tip blowing rod (9017). A plurality of test tip mounting seats (9012) are mounted at the bottom of the test tip base (9011), a test tip body (9015) is mounted on each test tip mounting seat (9012), and each test tip mounting seat (9012) is also respectively mounted with a tip heating rod (9013), a tip temperature sensor (9014) and a sealing ring (9016), and a tip blowing rod (9017) is also mounted on one side of the test tip mounting seat (9012).

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