Mold changing trolley, control method and control device for mold changing trolley

Abstract

The present application relates to the technical field of mold replacement, and discloses a mold changing trolley, a control method and a control device for the mold changing trolley. The mold changing trolley includes: a movable base, which can automatically move to a set area corresponding to the stamping machine when receiving a mold changing instruction sent by the stamping machine; a mold changing assembly, which is arranged on the movable base, and is used to unload the currently used mold from the stamping machine and install the mold to be replaced into the stamping machine. The present application does not require a fixed mold changing bracket to be installed on one side of the stamping machine, thereby reducing the space occupied by the stamping machine. There is also no need for manual operation of the crane and forklift, which improves the efficiency of mold replacement and reduces the safety risk of mold replacement.

Description

Technical Field

[0001] The present application relates to the technical field of mold replacement, for example, to a mold changing trolley, a control method and a control device for the mold changing trolley. Background Art

[0002] At present, stamping machines are usually used to produce sheet metal door shells for refrigerators. When producing sheet metal door shells for refrigerators of different models, the mold of the stamping machine needs to be replaced.

[0003] In the related art, it is usually necessary to manually replace the mold installed in the punching machine by operating a crane or a forklift, or it is necessary to fix a film replacement bracket on one side of the punching machine to replace the mold installed in the punching machine.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art:

[0005] The solution of manually replacing the mold installed in the punching machine by operating a crane or forklift has low efficiency and high safety risks. The solution of replacing the mold installed in the punching machine by fixing a film replacement bracket on one side of the punching machine can improve the efficiency of replacing the mold, but it will increase the space occupied by the punching machine. Therefore, how to improve the efficiency of replacing the mold and reduce the safety risk of replacing the mold while reducing the space occupied by the punching machine has become a technical problem that needs to be solved urgently.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0008] The disclosed embodiments provide a die changing trolley, a control method and a control device for the die changing trolley, which can not only reduce the space occupied by a stamping machine, but also improve the efficiency of changing the mold and reduce the safety risk of changing the mold.

[0009] In some embodiments, the mold changing trolley includes: a movable base, which can automatically move to a set area corresponding to the stamping machine when receiving a mold changing instruction sent by the stamping machine; a mold changing assembly, which is arranged on the movable base and is used to unload the mold currently in use from the stamping machine and install the mold to be replaced into the stamping machine.

[0010] Optionally, the mold changing assembly includes: a mold loading carrier, which can be docked with the mold opening of the stamping machine, and is used to unload the mold to be disassembled that is currently in use from the stamping machine, or to install the mold to be replaced into the stamping machine; a standby mold carrier, which is arranged on one side of the mold loading carrier and is connected to the mold loading carrier through a roller, and is used to carry the mold to be replaced; a mold unloading carrier, which is arranged on one side of the mold loading carrier and is connected to the mold loading carrier through a roller, and is used to carry the mold to be disassembled.

[0011] Optionally, the mold carrier includes: a carrier plate; a mold lifter, which is arranged on the carrier plate and is used to lift the mold to be replaced on the carrier plate so that the height of the mold to be replaced is adapted to the height of the position for installing the mold in the stamping machine; a push-pull assembly, which is used to push the mold to be replaced into the stamping machine for installing the mold position, or to pull the mold to be removed out of the stamping machine for installing the mold position.

[0012] Optionally, the mold changing trolley also includes: a first baffle cylinder, which is arranged between the mold loading carrier and the spare mold carrier, and is used to prevent the mold to be replaced from moving freely between the mold loading carrier and the spare mold carrier; and / or, a second baffle cylinder, which is arranged between the mold loading carrier and the mold unloading carrier, and is used to prevent the mold to be disassembled from moving freely between the mold loading carrier and the mold unloading carrier; and / or, a third baffle cylinder, which is arranged on the side where the mold loading carrier is docked with the mold opening of the stamping machine, and is used to prevent the mold to be disassembled or the mold to be replaced from moving freely between the mold loading carrier and the mold opening of the stamping machine.

[0013] In some embodiments, a control method for a mold changing trolley is applied to a mold changing trolley as described above, and the control method includes: in response to a mold changing instruction sent by a target stamping machine, controlling a movable base to move to a target setting area corresponding to the target stamping machine; docking the mold changing assembly with the mold opening of the target stamping machine; controlling the mold changing assembly to unload the currently used mold to be disassembled from the target stamping machine, and installing the mold to be replaced into the target stamping machine.

[0014] Optionally, the mold changing assembly includes a mold loading carrier, a standby mold carrier and a mold unloading carrier, and controls the mold changing assembly to unload the mold to be removed that is currently in use from the target stamping machine, and install the mold to be replaced into the target stamping machine, including: controlling the mold loading carrier to pull out the mold to be removed from the target stamping machine, and transferring the mold to be removed to the mold unloading carrier; controlling the standby mold carrier to transfer the mold to be replaced to the mold loading carrier, and controlling the mold loading carrier to push the mold to be replaced into the target stamping machine.

[0015] Optionally, the die loading carrier includes: a carrier plate, a die lifter and a push-pull assembly; controlling the die loading carrier to pull the die to be disassembled from the target stamping machine and transfer the die to be disassembled to the die unloading carrier, including: sending a die unloading instruction to the target stamping machine, so that the target stamping machine controls the die clamp for clamping the die to be disassembled to release the die to be disassembled, and after lifting the die to be disassembled to a target height, sending a die unloading completion instruction to the die changing trolley; in response to the die unloading completion instruction, controlling the die lifter to rise to a height corresponding to the target height; controlling the push-pull assembly to connect with the die to be disassembled, pulling the die to be disassembled to the carrier plate, and transferring the die to be disassembled to the die unloading carrier.

[0016] Optionally, the die loading carrier includes: a carrier plate, a die lifter and a push-pull assembly; controlling the spare die carrier to transfer the die to be replaced to the die loading carrier, and controlling the die loading carrier to push the die to be replaced into a target stamping machine, including: sending a die loading instruction to the target stamping machine to raise the position for installing the die in the target stamping machine to a target height, and releasing the die clamp for clamping the die thereon; controlling the spare die assembly to transfer the die to be replaced to the carrier plate, and controlling the die lifter to drag the die to be replaced to a height corresponding to the target height; controlling the push-pull assembly to push the die to be replaced to the position for installing the die in the target stamping machine, and sending a die loading completion instruction to the target stamping machine, so that the target stamping machine controls the die clamp to clamp the die to be replaced.

[0017] Optionally, the mold changing trolley also includes a first baffle cylinder, a second baffle cylinder and a third baffle cylinder; the mold changing assembly includes a mold loading carrier, a spare mold carrier and a mold unloading carrier; in the process of controlling the mold changing assembly to unload the mold to be disassembled currently in use from the target stamping machine, or to install the mold to be replaced into the target stamping machine, the control method also includes: controlling the first baffle cylinder and the second baffle cylinder to extend, and the third baffle cylinder to retract; in the process of transferring the mold to be replaced on the spare mold carrier to the mold loading carrier, or transferring the mold to be disassembled on the mold loading carrier to the spare mold carrier, the control method also includes: controlling the first baffle cylinder and the second baffle cylinder to retract, and the third baffle cylinder to extend.

[0018] In some embodiments, a control device for a mold changing trolley includes a processor and a memory storing program instructions, and the processor is configured to execute the control method for the mold changing trolley as described above when running the program instructions.

[0019] The mold changing trolley, control method and control device for the mold changing trolley provided in the embodiments of the present disclosure can achieve the following technical effects:

[0020] In an embodiment of the present disclosure, a die-changing trolley including a movable base and a die-changing assembly is proposed. When a stamping machine needs to replace the die to be disassembled that is currently in use, the movable base can automatically move to a set area of ​​the stamping machine for replacing the die in response to a die-changing instruction sent by the stamping machine. After arriving at the set area, the die-changing assembly can automatically dock with the die opening of the stamping machine, can unload the die to be disassembled that is currently in use from the stamping machine, and install the die to be replaced into the stamping machine. In this way, there is no need to fix a die-changing bracket on one side of the stamping machine, thereby reducing the space occupied by the stamping machine. There is also no need to manually operate a crane or forklift, thereby improving the efficiency of replacing the die and reducing the safety risk of replacing the die.

[0021] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:

[0023] Figure 1 is a schematic diagram of a mold changing trolley provided in an embodiment of the present disclosure;

[0024] Figure 2 is a schematic diagram of a mold changing assembly provided by an embodiment of the present disclosure;

[0025] Figure 3 is a schematic diagram of a mold carrier provided by an embodiment of the present disclosure;

[0026] Figure 4 is a schematic diagram of another mold changing trolley provided in an embodiment of the present disclosure;

[0027] Figure 5 is a schematic diagram of a control method for a mold changing trolley provided in an embodiment of the present disclosure;

[0028] Figure 6 is a schematic diagram of another control method for a mold changing trolley provided in an embodiment of the present disclosure;

[0029] Figure 7 is a schematic diagram of a control device for a mold changing trolley provided in an embodiment of the present disclosure;

[0030] Figure 8 It is a schematic diagram of another control device for a mold changing trolley provided in an embodiment of the present disclosure.

[0031] Description of reference numerals:

[0032] 10. Mold changing trolley;

[0033] 100. Movable base;

[0034] 200, mold changing assembly; 210, mold loading carrier; 211, carrier plate; 212, mold lifter; 213, push-pull assembly; 220, standby mold carrier; 230, unloading mold carrier; 240, first baffle cylinder; 250, second baffle cylinder; 260, third baffle cylinder;

[0035] 700 (800), a control device for a mold changing trolley; 701, a first control module; 702, a second control module; 703, a third control module; 801, a processor; 802, a memory; 803, a communication interface; 804, a bus. DETAILED DESCRIPTION

[0036] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0037] The terms "first", "second", etc. in the specification and claims of the embodiments of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so as to describe the embodiments of the embodiments of the present disclosure described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0038] Unless otherwise stated, the term "plurality" means two or more.

[0039] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B indicates: A or B.

[0040] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0041] The term "correspondence" may refer to an association relationship or a binding relationship. The correspondence between A and B means that there is an association relationship or a binding relationship between A and B.

[0042] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0043] like Figure 1 As shown, the die changing trolley 10 provided in the embodiment of the present disclosure includes: a movable base 100 and a die changing assembly 200. When the movable base 100 receives a die changing instruction sent by a punching machine, it can automatically move to a set area corresponding to the punching machine. The die changing assembly 200 is arranged on the movable base 100, and is used to unload the currently used die to be removed from the punching machine, and install the die to be replaced into the punching machine.

[0044] Specifically, the set area is an area designated for changing dies on the die opening side of the punching machine.

[0045] Specifically, when a punching machine needs to replace the mold currently used therein, a mold changing instruction will be sent to the mold changing trolley 10. By setting the mold changing assembly 200 on the movable base 100, after receiving the mold changing instruction, the movable base 100 can drive the mold changing assembly 200 to move to the set area and align the mold changing assembly 200 with the mold opening of the punching machine.

[0046] Specifically, by providing the die changing assembly 200, the die to be removed currently in use in the punching machine can be automatically unloaded, and the die to be replaced can be automatically installed in the punching machine. In this way, when replacing the die of the punching machine, the user does not need to manually operate auxiliary tools such as a crane and a forklift, which can reduce the risk of manually operating the crane and forklift to collide with the punching machine and cause damage to the punching machine.

[0047] In the disclosed embodiment, a die changing trolley 10 including a movable base 100 and a die changing assembly 200 is proposed. When a stamping machine needs to replace the currently used die to be disassembled, the movable base 100 can automatically move to the set area of ​​the stamping machine for replacing the die in response to the die changing instruction sent by the stamping machine. After arriving at the set area, the die changing assembly 200 can automatically dock with the die opening of the stamping machine, and can unload the currently used die to be disassembled from the stamping machine and install the die to be replaced into the stamping machine. In this way, there is no need to fix the die changing bracket on one side of the stamping machine, which reduces the space occupied by the stamping machine. There is also no need to manually operate the crane and forklift, which improves the efficiency of changing the die and reduces the safety risk of changing the die.

[0048] like Figure 2As shown, in some embodiments, the mold changing assembly 200 includes: a mold loading carrier 210, a standby mold carrier 220 and a mold unloading carrier 230. The mold loading carrier 210 can be docked with the mold opening of the punching machine, and is used to unload the mold to be disassembled currently in use from the punching machine, or to install the mold to be replaced into the punching machine. The standby mold carrier 220 is arranged on one side of the mold loading carrier 210, and is connected to the mold loading carrier 210 through a roller for carrying the mold to be replaced. The mold unloading carrier 230 is arranged on one side of the mold loading carrier 210, and is connected to the mold loading carrier 210 through a roller for carrying the mold to be disassembled.

[0049] Specifically, by providing the die carrier 210, after the die carrier 210 is docked with the die opening of the punching machine, the die to be disassembled currently in use can be unloaded from the punching machine, or the die to be replaced can be installed in the punching machine.

[0050] Specifically, a die unloading carrier 230 is provided on one side of the die loading carrier 210 and is connected to the die loading carrier 210 through a roller. After the die loading carrier 210 unloads the die to be unloaded currently used from the punching machine, the die to be unloaded can be transferred to the die unloading carrier 230. In this way, the unloaded die to be unloaded can be prevented from affecting the subsequent installation of the die to be replaced, and the die to be unloaded can be retained.

[0051] Specifically, by arranging a spare mold assembly on one side of the mold loading carrier 210 and connecting it to the mold loading carrier 210 through a roller, the mold to be replaced can be placed on the spare mold assembly in advance, thereby reducing the preparation time of the mold to be replaced. After the mold loading carrier 210 unloads the mold to be removed from the punching machine and transfers the mold to be removed to the mold unloading carrier 230, the spare mold carrier 220 can transfer the mold to be replaced to the mold loading carrier 210 through the roller.

[0052] Specifically, a plurality of die-changing trolleys 10 are arranged in the press workshop, and a type of die to be replaced is placed on the spare die carrier 220 of each die-changing trolley 10. The die-changing instruction issued by the press carries the type of the die to be replaced, and at this time, the die-changing trolley 10 with the die to be replaced of this type will respond to the die-changing instruction.

[0053] It should be noted that the replacement components are Figure 2 The two ends A and B of the middle mold carrier 210 are butted against the die opening of the punching machine. The specific butting method can be that the two ends A and B of the mold carrier 210 overlap the lower wall of the die opening of the punching machine.

[0054] In the embodiment of the present disclosure, by providing a mold loading carrier 210 in the mold changing assembly 200, and providing a standby mold carrier 220 and a mold unloading carrier 230 connected by roller transmission on both sides of the mold loading carrier 210, it is possible to unload the mold to be disassembled currently in use from the stamping machine and install the mold to be replaced into the stamping machine, while also being able to retain the mold to be disassembled and reduce the preparation time of the mold to be replaced.

[0055] like Figure 3 As shown, in some embodiments, the die carrier 210 includes: a carrier plate 211, a die lifter 212 and a push-pull assembly 213. The die lifter 212 is disposed on the carrier plate 211, and is used to lift the die to be replaced on the carrier plate 211, so that the height of the die to be replaced is adapted to the height of the position for installing the die in the punching machine. The push-pull assembly 213 is used to push the die to be replaced to the position for installing the die in the punching machine, or to pull the die to be removed out of the position for installing the die in the punching machine.

[0056] Specifically, the carrier plate 211 is used to receive the mold to be replaced transferred from the standby mold carrier 220, and to receive the mold to be removed unloaded from the punching machine. Since the heights of the mold openings of different punching machines may be different. Therefore, in the embodiment of the present disclosure, a mold lifter 212 is provided on the carrier plate 211. In this way, when the mold to be removed is unloaded from the punching machine, or the mold to be replaced is pushed into the punching machine, the height of the mold carrier 210 can correspond to the height of the mold opening of the punching machine.

[0057] Specifically, by setting the push-pull assembly 213, when the mold to be removed needs to be unloaded from the punching machine, the push-pull assembly 213 can be controlled to connect with the removed mold, and the removed mold can be pulled out to the carrier plate 211. When the mold to be replaced needs to be installed in the punching machine, the push-pull assembly 213 can be controlled to connect with the mold to be replaced, and the mold to be replaced can be pushed from the carrier plate 211 into the punching machine.

[0058] like Figure 2 As shown, in some embodiments, the die-changing trolley 10 further includes: a first baffle cylinder 240, a second baffle cylinder 250, and a third baffle cylinder 260. The first baffle cylinder 240 is disposed between the die-loading carrier 210 and the spare die carrier 220, and is used to prevent the die to be replaced from moving freely between the die-loading carrier 210 and the spare die carrier 220. The second baffle cylinder 250 is disposed between the die-loading carrier 210 and the die-removing carrier 230, and is used to prevent the die to be removed from moving freely between the die-loading carrier 210 and the die-removing carrier 230. The third baffle cylinder 260 is disposed on the side where the die-loading carrier 210 is docked with the die opening of the punching machine, and is used to prevent the die to be removed or the die to be replaced from moving freely between the die-loading carrier 210 and the die opening of the punching machine.

[0059] Specifically, by arranging the first baffle cylinder 240 between the mold loading carrier 210 and the standby mold loading carrier 220, the first baffle cylinder 240 can be controlled to retract during the process of transferring the mold to be replaced to the mold loading carrier 210, and can be controlled to extend during other processes. In this way, the mold to be replaced can be prevented from moving randomly when not being transferred, thereby improving the safety of the mold changing trolley 10.

[0060] Specifically, by arranging the second baffle cylinder 250 between the mold loading carrier 210 and the mold unloading carrier 230, the second baffle cylinder 250 can be controlled to retract during the process of transferring the mold to be removed to the mold unloading carrier 230, and can be controlled to extend during other processes. In this way, the mold to be removed can be prevented from moving randomly when not being transferred, thereby improving the safety of the mold changing trolley 10.

[0061] Specifically, by arranging a third baffle cylinder 260 on the side where the die carrier 210 is connected to the die opening of the punching machine, when the die set to be replaced is not pushed out to the impact machine, or when the die to be removed is not pulled out of the punching machine, the die to be removed or the die to be replaced can be prevented from moving freely between the die carrier 210 and the die opening of the punching machine. In this way, the working safety of the die changing trolley 10 is improved.

[0062] like Figure 4 As shown, in some embodiments, the mold changing trolley 10 further includes a control device 700 (800) for the mold changing trolley. The control device for the mold changing trolley is disposed on the movable base 100 and is electrically connected to the movable base 100 and the mold changing assembly 200.

[0063] Optionally, the control device for the die change trolley includes a processor, which can control the movable base 100 to move to a target setting area corresponding to the target punching machine in response to the die change instruction sent by the target punching machine. The die change assembly 200 can be controlled to dock with the die opening of the target punching machine. The die change assembly 200 can be controlled to unload the currently used die to be removed from the target punching machine, and install the die to be replaced into the target punching machine, so as to realize automatic die change of the target punching machine.

[0064] In combination with the above-mentioned mold changing trolley, the embodiment of the present disclosure provides a control method for the mold changing trolley, such as Figure 5 As shown, the control method includes:

[0065] S501, the processor controls the movable base to move to a target setting area corresponding to the target stamping machine in response to a die change instruction sent by the target stamping machine.

[0066] Specifically, in the stamping workshop, multiple die-changing trolleys are provided, each of which is used to replace a type of die. The die-changing instruction sent by the target stamping machine carries the model of the die to be replaced. Therefore, the die-changing trolley that responds to the die-changing instruction sent by the target stamping machine needs to be a die-changing trolley that can replace the die model in the die-changing instruction.

[0067] Specifically, the target setting area is a part of the area demarcated on one side of the die opening of the target punching machine. By controlling the movable base to move to the target setting area, it is convenient for the die changing trolley to replace the die to be disassembled currently used in the target punching machine. Therefore, after receiving the die change instruction, the processor needs to respond to the die change instruction and control the movable base to move to the target setting area.

[0068] Specifically, the movable base is a small car (e.g., AGV, Automatic Guided Vehicle) that can sense the surrounding environment through sensors to achieve autonomous navigation and obstacle avoidance. Autonomous navigation is achieved through laser sensors, infrared sensors, ultrasonic sensors, etc., and the navigation process is planned and controlled according to the position of the preset path and set area. Obstacle avoidance is achieved through laser radar, infrared sensors, ultrasonic sensors, etc.

[0069] Specifically, markers are pre-installed on each stamping machine in the stamping workshop. When the mold of the target stamping machine needs to be replaced, the movable base can automatically move to the target setting area corresponding to the target stamping machine based on the markers on the target stamping machine through SLAM (Simultaneous localization and mapping) technology.

[0070] S502: The processor docks the die change assembly with the die opening of the target punching machine.

[0071] Specifically, in order to avoid the situation where the mold falls due to a gap between the mold changing assembly and the mold opening of the target punching machine during the process of mold unloading or mold loading, in the implementation of the present disclosure, after the movable base reaches the target setting area, it is necessary to control the mold changing assembly to dock with the mold opening of the target punching machine.

[0072] S503, the processor controls the die changing assembly to unload the die to be removed that is currently in use from the target stamping machine, and install the die to be replaced into the target stamping machine.

[0073] In the disclosed embodiment, when the target stamping machine needs to replace the currently used die to be removed, the user only needs to control the target stamping machine to issue a die change command, and the movable base can respond to the die change command and automatically move to the target setting area corresponding to the target stamping machine. After reaching the target setting area, the die change assembly can automatically dock with the die opening of the stamping machine, and can unload the currently used die to be removed from the target stamping machine, and install the die to be replaced into the target stamping machine. In this way, there is no need to fix the die change trolley on one side of the target stamping machine, which reduces the space occupied by the target stamping machine. There is also no need to manually operate the crane and forklift, which improves the efficiency of changing the mold and reduces the safety risk of changing the mold.

[0074] The disclosed embodiment provides another control method for a mold changing trolley, such as Figure 6 As shown, the control method includes:

[0075] S601, the processor controls the movable base to move to a target setting area corresponding to the target stamping machine in response to a die change instruction sent by the target stamping machine.

[0076] S602, the processor docks the die changing assembly with the die opening of the target punching machine, wherein the die loading carrier includes a carrier plate, a die lifter and a push-pull assembly.

[0077] S603, the processor controls the die loading carrier to pull out the die to be removed from the target stamping machine, and transfers the die to be removed to the die unloading carrier.

[0078] Specifically, after controlling the die loading carrier to unload the currently used die to be disassembled from the stamping machine, the die to be disassembled is transported to the die unloading carrier. This can prevent the unloaded die to be disassembled from affecting the subsequent installation of the die to be replaced, and the die to be disassembled can be retained.

[0079] Optionally, the die loading carrier includes: a carrier plate, a die lifter and a push-pull assembly; controlling the die loading carrier to pull the die to be disassembled from the target stamping machine and transfer the die to be disassembled to the die unloading carrier, including: sending a die unloading instruction to the target stamping machine, so that the target stamping machine controls the die clamp for clamping the die to be disassembled to release the die to be disassembled, and after lifting the die to be disassembled to a target height, sending a die unloading completion instruction to the die changing trolley; in response to the die unloading completion instruction, controlling the die lifter to rise to a height corresponding to the target height; controlling the push-pull assembly to connect with the die to be disassembled, pulling the die to be disassembled to the carrier plate, and transferring the die to be disassembled to the die unloading carrier.

[0080] S604, the processor controls the standby mold carrier to transfer the mold to be replaced to the loading mold carrier, and controls the loading mold carrier to push the mold to be replaced into the target stamping machine.

[0081] Specifically, the mold to be replaced is placed on the spare mold assembly in advance. After the mold loading carrier unloads the mold to be removed from the punching machine and transfers the mold to be removed to the unloading mold carrier, the spare mold carrier is controlled to transfer the mold to be replaced to the mold loading carrier through a roller, and then the mold loading carrier is controlled to push the mold to be replaced into the target punching machine, without manually placing the mold to be replaced on the mold loading carrier.

[0082] Optionally, the die loading carrier includes: a carrier plate, a die lifter and a push-pull assembly; controlling the spare die carrier to transfer the die to be replaced to the die loading carrier, and controlling the die loading carrier to push the die to be replaced into a target stamping machine, including: sending a die loading instruction to the target stamping machine to raise the position for installing the die in the target stamping machine to a target height, and releasing the die clamp for clamping the die thereon; controlling the spare die assembly to transfer the die to be replaced to the carrier plate, and controlling the die lifter to drag the die to be replaced to a height corresponding to the target height; controlling the push-pull assembly to push the die to be replaced to the position for installing the die in the target stamping machine, and sending a die loading completion instruction to the target stamping machine, so that the target stamping machine controls the die clamp to clamp the die to be replaced.

[0083] In the disclosed embodiment, after the currently used mold to be disassembled is unloaded from the punching machine, the mold to be disassembled can be automatically transferred to the unloading mold carrier, so as to avoid the unloaded mold to be disassembled affecting the subsequent installation of the mold to be replaced, and at the same time, the mold to be disassembled can be retained. Before the mold to be replaced is installed on the punching machine, the mold to be replaced can be automatically transferred to the mold loading carrier by the standby mold assembly, without the need to manually place the mold to be replaced on the mold loading carrier. In this way, the efficiency of replacing the punching machine mold is further improved.

[0084] In some embodiments, the mold changing trolley also includes a first baffle cylinder, a second baffle cylinder and a third baffle cylinder; the mold changing assembly includes a mold loading carrier, a spare mold carrier and a mold unloading carrier; in the process of controlling the mold changing assembly to unload the mold to be disassembled currently in use from the target stamping machine, or to install the mold to be replaced into the target stamping machine, the control method also includes: controlling the first baffle cylinder and the second baffle cylinder to extend, and the third baffle cylinder to retract; in the process of transferring the mold to be replaced on the spare mold carrier to the mold loading carrier, or transferring the mold to be disassembled on the mold loading carrier to the spare mold carrier, the control method also includes: controlling the first baffle cylinder and the second baffle cylinder to retract, and the third baffle cylinder to extend.

[0085] Specifically, in the process of controlling the mold changing assembly to unload the mold to be disassembled currently in use from the target stamping machine, or installing the mold to be replaced into the target stamping machine, by controlling the first baffle cylinder and the second baffle cylinder to extend and the third baffle cylinder to retract, the mold to be disassembled or the mold to be replaced can be prevented from moving to the two sides of the mold loading carrier, thereby improving the safety of the mold changing trolley.

[0086] Specifically, in the process of transferring the mold to be replaced on the spare mold carrier to the mold loading carrier, or transferring the mold to be disassembled on the mold loading carrier to the spare mold carrier, by controlling the first baffle cylinder and the second baffle cylinder to retract and the third baffle cylinder to extend, it can be avoided that the mold to be disassembled or the mold to be replaced continues to move toward the mold mouth of the stamping machine after moving to the mold loading carrier, collides with the stamping machine, and causes damage to the stamping machine.

[0087] Combination Figure 7 As shown, the embodiment of the present disclosure provides a control device 700 for a mold changing trolley, and the control device 700 for the mold changing trolley can be applied to the mold changing trolley proposed in the above embodiment. The control device 700 for the mold changing trolley includes: a first control module 701, a second control module 702 and a third control module 703. The first control module 701 is configured to control the movable base to move to a target setting area corresponding to the target stamping machine in response to a mold changing instruction sent by the target stamping machine. The second control module 702 is configured to dock the mold changing assembly with the mold opening of the target stamping machine. The third control module 703 is configured to control the mold changing assembly to unload the currently used mold to be disassembled from the target stamping machine, and install the mold to be replaced into the target stamping machine.

[0088] Combination Figure 8 As shown, the embodiment of the present disclosure provides a control device 800 for a mold changing trolley, and the control device 800 for a mold changing trolley includes: a processor (processor) 801 and a memory (memory) 802. Optionally, the device may also include a communication interface (Communication Interface) 803 and a bus 804. Among them, the processor 801, the communication interface 803, and the memory 802 can communicate with each other through the bus 804. The communication interface 803 can be used for information transmission. The processor 801 can call the logic instructions in the memory 802 to execute the control method for the mold changing trolley of the above embodiment.

[0089] In addition, the logic instructions in the memory 802 described above may be implemented in the form of software functional units and when sold or used as independent products, may be stored in a computer-readable storage medium.

[0090] The memory 802 is a computer-readable storage medium that can be used to store software programs and computer executable programs, such as program instructions / modules corresponding to the method in the embodiment of the present disclosure. The processor 801 executes functional applications and data processing by running the program instructions / modules stored in the memory 802, that is, realizing the control method for the mold changing trolley in the above embodiment.

[0091] The memory 802 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and an application required for at least one function; the data storage area may store data created according to the use of the terminal device, etc. In addition, the memory 802 may include a high-speed random access memory and may also include a non-volatile memory.

[0092] An embodiment of the present disclosure provides a computer-readable storage medium storing computer-executable instructions, wherein the computer-executable instructions are configured to execute the above-mentioned control method for a mold changing trolley.

[0093] The technical solution of the embodiment of the present disclosure can be embodied in the form of a software product, which is stored in a storage medium and includes one or more instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in the embodiment of the present disclosure. The aforementioned storage medium may be a non-transient storage medium, such as: a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, and other media that can store program codes.

[0094] The above description and the accompanying drawings fully illustrate the embodiments of the present disclosure so that those skilled in the art can practice them. Other embodiments may include structural, logical, electrical, process and other changes. The embodiments represent only possible changes. Unless explicitly required, separate components and functions are optional, and the order of operation may vary. The parts and features of some embodiments may be included in or replace the parts and features of other embodiments. Moreover, the words used in this application are only used to describe the embodiments and are not used to limit the claims. As used in the description of the embodiments and the claims, unless the context clearly indicates, the singular forms of "a", "an" and "the" are intended to include plural forms as well. Similarly, the term "and / or" as used in this application refers to any and all possible combinations of listings containing one or more associated ones. In addition, when used in the present application, the term "comprise" and its variants "comprises" and / or comprising refer to the presence of stated features, wholes, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or groups thereof. In the absence of further restrictions, the elements defined by the sentence "comprising a ..." do not exclude the presence of other identical elements in the process, method or device comprising the elements. In this article, each embodiment may focus on the differences from other embodiments, and the same and similar parts between the various embodiments may refer to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method part disclosed in the embodiments, then the relevant parts can refer to the description of the method part.

[0095] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software may depend on the specific application and design constraints of the technical solution. The technicians may use different methods for each specific application to implement the described functions, but such implementations should not be considered to exceed the scope of the embodiments of the present disclosure. The technicians may clearly understand that, for the convenience and simplicity of description, the specific working processes of the systems, devices and units described above may refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here.

[0096] In the embodiments disclosed herein, the disclosed methods and products (including but not limited to devices, equipment, etc.) can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units can be only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between each other shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms. The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to implement this embodiment. In addition, each functional unit in the embodiment of the present disclosure may be integrated in a processing unit, or each unit may exist physically alone, or two or more units may be integrated in one unit.

[0097] The flowchart and block diagram in the accompanying drawings show the possible architecture, function and operation of the system, method and computer program product according to the embodiment of the present disclosure. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of the code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. In some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which can depend on the functions involved. In the description corresponding to the flowchart and the block diagram in the accompanying drawings, the operations or steps corresponding to different boxes can also occur in a different order from the order disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which can depend on the functions involved. Each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented by a dedicated hardware-based system that performs the specified functions or actions, or may be implemented by a combination of dedicated hardware and computer instructions.

Claims

1. A mold changing trolley, characterized in that: include: The movable base can automatically move to the set area corresponding to the punching machine when receiving the die change command sent by the punching machine; The die changing assembly is arranged on a movable base, and is used for unloading the die to be removed currently in use from the punching machine, and installing the die to be replaced into the punching machine.

2. The mold changing trolley according to claim 1, characterized in that: The mold change kit includes: The die loading carrier can be docked with the die opening of the punching machine to unload the currently used die from the punching machine, or to install the die to be replaced into the punching machine; The standby mold carrier is arranged on one side of the mold loading carrier and is connected to the mold loading carrier through a roller for carrying the mold to be replaced; The mold unloading carrier is arranged on one side of the mold loading carrier and is connected to the mold loading carrier through a roller for carrying the mold to be disassembled.

3. The mold changing trolley according to claim 2, characterized in that: The molded parts include: Carrier board; A die lifter is provided on the carrier plate and is used to lift the die to be replaced on the carrier plate so that the height of the die to be replaced is adapted to the height of the position for installing the die in the punching machine; The push-pull assembly is used to push the mold to be replaced into the stamping machine for the mold installation position, or to pull the mold to be removed out of the stamping machine for the mold installation position.

4. The mold changing trolley according to claim 2, characterized in that: The die change trolley also includes: A first baffle cylinder is disposed between the mold loading carrier and the standby mold loading carrier, and is used to prevent the mold to be replaced from moving freely between the mold loading carrier and the standby mold loading carrier; and / or, A second baffle cylinder is disposed between the mold loading carrier and the mold unloading carrier to prevent the mold to be disassembled from moving freely between the mold loading carrier and the mold unloading carrier; and / or, The third baffle cylinder is arranged on the side where the die carrier and the die opening of the punch press are connected, and is used to prevent the die to be removed or replaced from moving freely between the die carrier and the die opening of the punch press.

5. A control method for a die-changing trolley, applied to the die-changing trolley according to any one of claims 1 to 4, characterized in that: Control methods include: In response to a die change instruction sent by a target punching machine, controlling the movable base to move to a target setting area corresponding to the target punching machine; docking the die change assembly with the die opening of the target punching machine; The die changing assembly is controlled to unload the die to be removed currently in use from the target punching machine, and to install the die to be replaced into the target punching machine.

6. The control method according to claim 5, characterized in that: The die changing assembly includes a die loading carrier, a standby die loading carrier, and a die unloading carrier, and controls the die changing assembly to unload the die to be removed from the target stamping machine and install the die to be replaced into the target stamping machine, including: Control the die loading carrier to pull out the die to be removed from the target punching machine, and transfer the die to be removed to the die unloading carrier; The standby die carrier is controlled to transfer the die to be replaced to the die loading carrier, and the die loading carrier is controlled to push the die to be replaced into the target punching machine.

7. The control method according to claim 6, characterized in that: The die loading carrier includes: a carrier plate, a die lifter and a push-pull assembly; controlling the die loading carrier to pull out the die to be removed from the target punching machine and transferring the die to be removed to the die unloading carrier includes: Sending a die unloading instruction to the target punching machine, so that the target punching machine controls the die clamp for clamping the die to release the die to be removed, and after lifting the die to be removed to the target height, sends a die unloading completion instruction to the die changing trolley; In response to the die unloading completion instruction, controlling the die lifter to rise to a height corresponding to the target height; The push-pull assembly is controlled to be connected to the mold to be disassembled, the mold to be disassembled is pulled out to the carrier plate, and the mold to be disassembled is transferred to the mold unloading carrier.

8. The control method according to claim 6, characterized in that: The die loading carrier includes: a carrier plate, a die lifter and a push-pull assembly; controlling the standby die carrier to transfer the die to be replaced to the die loading carrier, and controlling the die loading carrier to push the die to be replaced into the target punching machine, including: Sending a die loading instruction to a target punching machine so that a position for installing a die in the target punching machine rises to a target height, and a die clamp for clamping the die thereon is released; Control the spare mold assembly to transfer the mold to be replaced to the carrier plate, and control the mold lifter to drag the mold to be replaced to a height corresponding to the target height; The push-pull assembly is controlled to push the mold to be replaced to a position in the target punching machine for installing the mold, and a mold installation completion instruction is sent to the target punching machine, so that the target punching machine controls the clamp to clamp the mold to be replaced.

9. The control method according to any one of claims 5 to 8, characterized in that: The die-changing trolley further comprises a first baffle cylinder, a second baffle cylinder and a third baffle cylinder; the die-changing assembly comprises a die-loading carrier, a standby die carrier and a die-unloading carrier; In the process of controlling the die changing assembly to unload the currently used die to be removed from the target punching machine, or to install the die to be replaced into the target punching machine, the control method further includes: Control the first baffle cylinder and the second baffle cylinder to extend, and the third baffle cylinder to retract; In the process of transferring the mold to be replaced on the spare mold carrier to the loading mold carrier, or transferring the mold to be removed on the loading mold carrier to the spare mold carrier, the control method further includes: The first baffle cylinder and the second baffle cylinder are controlled to retract, and the third baffle cylinder is controlled to extend.

10. A control device for a mold changing trolley, comprising a processor and a memory storing program instructions, characterized in that: The processor is configured to execute the control method for the mold change trolley according to any one of claims 5 to 8 when running the program instructions.

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