A laser selective melting forming device with automatic leveling of substrate

Abstract

The present invention relates to a laser selective melting forming device with automatic leveling of a substrate, which belongs to the field of additive manufacturing technology and solves the problem of low automation of substrate leveling in the prior art. The present invention includes a forming cavity, a piston unit, a powder spreading unit, a cylinder assembly, a cylinder bottom plate and a substrate leveling unit; the cylinder assembly is fixedly arranged on the cylinder bottom plate, and the forming cavity is fixedly arranged on the top of the cylinder assembly; the powder spreading unit is arranged inside the forming cavity and can reciprocate along the length direction of the forming cavity; the piston unit is located in the cylinder assembly and can move up and down relative to the forming cavity; the piston unit includes a forming substrate; the substrate leveling unit is arranged in the cylinder assembly and can drive the forming substrate to perform leveling movement to adjust the parallelism between the forming substrate and the reference platform of the forming cavity. The present invention adopts a photoelectric sensor, PLC control, and a servo motor to form a closed-loop positioning system, which has a higher degree of automation and precision, and the positioning accuracy error is ≤0.06mm.

Description

Technical Field

[0001] The invention relates to the technical field of additive manufacturing, and in particular to a laser selective melting forming device with automatic leveling of a substrate. Background Art

[0002] Laser selective melting forming technology selectively irradiates pre-spread metal powder by focusing a fine laser light source, and stacks it layer by layer into three-dimensional metal parts. Compared with traditional casting and forging technology, laser selective melting forming technology can obtain rapidly solidified non-equilibrium structure, small internal grains, excellent comprehensive mechanical properties, and can form parts with any complex structure. It provides new ideas for lightweight aircraft structure, topological optimization design and manufacturing, and has become an important development direction for advanced manufacturing in the aerospace field.

[0003] In the use of traditional laser selective melting forming equipment, the substrate leveling preparation work needs to be carried out before the equipment starts printing. In an existing substrate leveling scheme, the distance to the substrate surface is measured by three laser rangefinders set on the fixed plate above the forming cabin, two of the three laser rangefinders are located on the left and one is located on the right; then the first fine-tuning motor located on the left side of the forming platform is adjusted according to the average value of the distances measured by the two laser rangefinders on the left, and after the distances measured by the two laser rangefinders on the left meet the requirements, the second fine-tuning motor located on the right side of the forming platform is adjusted according to the distance measured by the laser rangefinder on the right until it meets the requirements. However, in this scheme, its detection method can only identify unevenness on the left and right sides, and cannot identify unevenness in the front and back directions; the forming platform can only be adjusted in the manner of rising or falling on the right side and / or rising or falling on the left side, that is, it can only rotate around the axis extending in the front and back directions, and it is impossible to achieve all-round adjustment of the forming platform.

[0004] In another existing substrate leveling solution, a micrometer assembly is used to slide along the slide rail to detect the horizontality of the printed substrate, and the substrate is leveled by a ball head adjustment assembly and two horizontal fine-tuning assemblies. During the leveling process, it is necessary to manually adjust the fine-tuning screws in the two horizontal fine-tuning assemblies. After each fine-tuning of the two screws, it is necessary to move the micrometer assembly left and right along the slide rail, and manually observe the micrometer pointer. If the swing error of the micrometer pointer is not within the allowable range of parallelism, continue to fine-tune the two screws until the swing error of the micrometer pointer is within the allowable range of parallelism. In this solution, it is necessary to manually observe the test results and manually adjust the screws. The degree of automation is low, and the adjustment process is complicated and time-consuming. At the same time, since the micrometer is fixedly set on the slider, its reciprocating movement can actually only detect whether a cross-section of the corresponding micrometer head of the substrate is horizontal in the left and right directions, and it is also unable to detect whether the substrate is horizontal in the front and back directions. Summary of the invention

[0005] In view of the above analysis, an embodiment of the present invention aims to provide a laser selective melting forming device with automatic substrate leveling, so as to solve the problem of low automation level of substrate leveling.

[0006] On the one hand, the present invention provides a laser selective melting forming device with automatic leveling of a substrate, comprising a forming cavity, a piston unit, a powder spreading unit, a cylinder assembly, a cylinder bottom plate and a substrate leveling unit; wherein the cylinder assembly is fixedly arranged on the cylinder bottom plate, and the forming cavity is fixedly arranged on the top of the cylinder assembly; the powder spreading unit is arranged inside the forming cavity and can reciprocate along the length direction of the forming cavity; the piston unit is located in the cylinder assembly and can move up and down relative to the forming cavity; the piston unit includes a forming substrate; the substrate leveling unit is arranged in the cylinder assembly and can drive the forming substrate to perform a leveling movement to adjust the parallelism between the forming substrate and the reference platform of the forming cavity.

[0007] Furthermore, the powder spreading unit includes a linear power module, a powder spreading trolley and a position detection component; the linear power module is arranged on the two side walls of the forming cavity, and the linear power module drives the powder spreading trolley to move back and forth; the position detection component is arranged on the front side of the powder spreading trolley, and can detect the distance between the powder spreading trolley and the plane below.

[0008] Furthermore, the position detection component includes a plurality of photoelectric sensors, which are divided into two groups and arranged horizontally on the front side of the powder spreading vehicle.

[0009] Furthermore, the first group of photoelectric sensors are respectively arranged at two ends of the powder spreading trolley to detect the distance between the powder spreading trolley and the reference platform of the forming cavity.

[0010] Furthermore, the second group of photoelectric sensors is arranged on the inner side of the first group of photoelectric sensors to detect the distance between the powder spreading trolley and the forming substrate.

[0011] Furthermore, the number of the plurality of photoelectric sensors is at least four.

[0012] Furthermore, the second group of photoelectric sensors is arranged inside the first group of photoelectric sensors and close to the edge of the forming substrate.

[0013] Furthermore, the piston unit also includes an adjustment bottom plate, which is arranged below the forming substrate, and the adjustment bottom plate can drive the forming substrate to move up and down.

[0014] Furthermore, the piston unit also includes an automatic piston lifting component, and the automatic piston lifting component can drive the adjustment base plate to move up and down.

[0015] Furthermore, two positioning pins are arranged on the upper surface of the adjusting base plate, and two pin holes are correspondingly arranged on the lower surface of the forming base plate, and a clearance fit is adopted between the positioning pins and the pin holes.

[0016] Furthermore, the maximum diameter gap between the pin hole and the positioning pin does not exceed 1 mm.

[0017] Furthermore, the substrate leveling unit includes a PLC controller and an actuator, and the PLC controller controls the operation of the actuator according to data fed back by the position detection component.

[0018] Furthermore, the actuator includes three groups of substrate adjustment screw modules and three servo motors.

[0019] Furthermore, the outer protective shell of the substrate adjustment screw module is fixedly set on the lower surface of the adjustment base plate, the servo motor is set at the bottom of the substrate adjustment screw module, and the internal push rod of the substrate adjustment screw module can pass through the through hole on the adjustment base plate, directly contact the lower surface of the forming substrate and perform a lifting action, so that the forming substrate is in a floating support state.

[0020] Furthermore, two of the three groups of substrate adjustment screw rod modules are respectively arranged at two ends of one side of the adjustment base plate, and the other group is arranged in the middle of the other side of the adjustment base plate.

[0021] Furthermore, a ball joint is arranged at the top of the three sets of substrate adjustment screw rod modules, and three hemispherical grooves are arranged correspondingly at the bottom of the forming substrate. The three sets of substrate adjustment screw rod modules are connected to the forming substrate via a ball joint.

[0022] Furthermore, the piston unit also includes an elastic sealing ring, and the elastic sealing ring is arranged between the forming base plate and the adjusting base plate.

[0023] On the other hand, the present invention further provides a method for automatically leveling a substrate of a laser selective melting forming device, characterized in that the laser selective melting forming device for automatically leveling a substrate as described above is used.

[0024] Furthermore, the substrate automatic leveling method comprises the following steps:

[0025] S1: The linear power module drives the powder spreading trolley with the position detection component to move above the reference platform of the forming cavity and the forming substrate to detect the position relationship of the forming substrate relative to the reference platform;

[0026] S2: Based on the data fed back by the position detection component, the PLC controller performs calculations and determines whether the position deviation value exceeds the adjustable range;

[0027] S3: If the position deviation exceeds the adjustable range, the adjustment is terminated, and the industrial control system prompts the relevant operator to conduct troubleshooting; otherwise, the PLC controller performs analysis and calculation according to the preset algorithm to obtain the displacement direction and displacement of the three sets of base plate adjustment screw modules;

[0028] S4: The PLC controller controls the three groups of substrate adjustment screw modules to perform lifting and lowering adjustment actions so that the forming substrate and the reference platform are parallel to each other.

[0029] Furthermore, it also includes step S5: running step S1 again to determine whether the parallelism between the forming substrate and the reference platform reaches the target range. If it does not reach the standard, continue to adjust; if it has reached the standard, the leveling is completed.

[0030] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0031] (1) The laser selective melting forming equipment with automatic substrate leveling of the present invention can realize the left-right flipping and / or front-back flipping, as well as the up-and-down movement of the substrate through the substrate leveling unit, and can automatically detect the parallelism between the substrate and the reference platform, and can automatically adjust according to the detection result, and the adjustment can be in place once, which can improve the automation level of the laser selective melting forming equipment in continuous operation, and is conducive to realizing the dark factory mode of the laser selective melting forming equipment in continuous operation.

[0032] (2) The present invention uses a dynamic line scanning method in which the powder spreading assembly drives four photoelectric sensors to move back and forth, which can accurately identify the spatial angle between the molding substrate and the reference platform. Compared with the prior art solution that can only identify the angle in one direction, the measurement result is more accurate; at the same time, it can also effectively avoid the interference of accidental factors such as local processing errors, defects, foreign matter, etc. on the surface of large-size substrates on the measurement result.

[0033] (3) The present invention realizes automatic leveling of the forming substrate through three sets of substrate adjustment screw rod modules. These three sets of substrate adjustment screw rod modules operate independently, and can realize left-right flipping and / or front-back flipping of the forming substrate, and can be adjusted in place at one time. Compared with the scheme of adjusting the left side first and then the right side in the prior art, the adjustment efficiency is improved; compared with the scheme that can only adjust the unevenness of the left and right sides, the adjustment effect is improved; the processing error of the forming substrate itself (substrate thickness, upper and lower surface parallelism) can be effectively compensated. At the same time, the influence of the piston lifting unit's working accuracy on the parallelism of the forming substrate can also be corrected.

[0034] (4) The present invention can realize the automation of automatic leveling and positioning of the substrate, and no human intervention is required during the automatic positioning process, thereby reducing the error caused by human factors. The closed-loop positioning system is composed of photoelectric sensors, PLC control, and servo motors, with a higher degree of automation and accuracy, and the positioning accuracy error is ≤0.06mm.

[0035] (5) The adjustment base plate in the present invention can realize the receiving and pre-positioning functions of large-sized formed substrates, increase the fault tolerance of the automated lifting process, and play a better compensation effect on the processing accuracy error of large-sized substrates in the fully automated, unmanned factory production mode.

[0036] In the present invention, the above-mentioned technical solutions can also be combined with each other to achieve more preferred combination solutions. Other features and advantages of the present invention will be described in the subsequent description, and some advantages can become obvious from the description, or can be understood by practicing the present invention. The purpose and other advantages of the present invention can be achieved and obtained through the contents particularly pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The drawings are only for the purpose of illustrating particular embodiments and are not to be considered limiting of the present invention. Like reference symbols denote like components throughout the drawings.

[0038] Figure 1 It is a structural schematic diagram of the laser selective melting forming equipment for automatic leveling of substrates of the present invention (part of the cylinder assembly and the side wall and top plate of the forming cavity are removed);

[0039] Figure 2 This is a schematic diagram of the structure of the powder spreading trolley and position detection components;

[0040] Figure 3 It is a structural schematic diagram of a substrate leveling unit;

[0041] Figure 4 It is a structural schematic diagram of the piston unit;

[0042] Figure 5 Schematic diagram of the relative position relationship between the forming substrate and the forming cavity reference platform and the adjustment bottom plate before and after leveling, wherein (a) is the state before leveling, and (b) is the state after leveling;

[0043] Figure 6 It is a structural schematic diagram of the cylinder assembly.

[0044] Reference numerals:

[0045] 1-position detection component; 2-piston unit; 3-piston automatic lifting component; 4-high-precision linear power module; 5-reference platform; 6-cylinder assembly; 7-powder spreading trolley; 8-high-precision photoelectric sensor; 9-lifting ear; 10-forming base plate; 11-adjustment base plate; 12-base plate adjustment screw module; 13-servo motor; 14-locating pin; 15-cylinder base plate; 16-screw module; 17-flange push rod. DETAILED DESCRIPTION

[0046] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, wherein the accompanying drawings constitute a part of the present invention and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not used to limit the scope of the present invention.

[0047] Example 1

[0048] like Figures 1 to 4 As shown, the present invention provides a laser selective melting forming device with automatic substrate leveling, the forming device comprises: a forming cavity, a powder spreading unit, a piston unit 2, a cylinder assembly 6, a cylinder bottom plate 15 and a substrate leveling unit.

[0049] The cylinder bottom plate 15 is fixedly mounted on a frame or a workbench (not shown), and the cylinder assembly 6 includes four side walls, the structure of which is as follows: Figure 6 As shown, it is fixedly arranged on the cylinder bottom plate 15. The forming cavity is fixedly arranged on the top of the cylinder assembly 6.

[0050] See also Figure 1 The forming chamber has a reference platform 5, four side walls surrounding the reference platform 5, and a top plate located above the reference platform 5. The periphery of the reference platform 5 is fixedly arranged on the top of the cylinder assembly 6, and the middle of the reference platform 5 has an opening, and the forming base plate 10 in the piston unit 2 is arranged in the opening and can move up and down relative to the opening to adjust the powder spreading height.

[0051] The powder spreading unit includes a high-precision linear power module 4, a powder spreading trolley and a position detection assembly 1. Two parallel guide rails are arranged on the two side walls along the length direction of the forming cavity, and the two ends of the powder spreading trolley 7 are respectively arranged on the two guide rails through the lifting ears 9 and can slide relative to the guide rails.

[0052] The high-precision linear power module 4 is matched with the guide rail to drive the powder spreading trolley 7 to move back and forth. The high-precision linear power module 4 is installed on the inner walls on both sides of the forming chamber, and can be a gear rack mechanism driven by a motor. The high-precision linear power module 4 can also be other drive components. The powder spreading trolley 7 is fixedly connected to the output end of the high-precision linear power module 4 through the lifting lug 9, which can realize the reciprocating movement of the position detection component 1 in the horizontal direction.

[0053] The position detection assembly 1 is fixedly arranged on the outer surface of one side of the powder spreading trolley. The position detection assembly 1 includes four high-precision photoelectric sensors 8, which are arranged on the side wall of the front side or the rear side of the powder spreading trolley 7, and are used to transmit and receive photoelectric signals to sense the parallelism between the forming substrate 10 and the reference platform 5. Obviously, the position detection assembly 1 can also include six or eight high-precision photoelectric sensors 8 to improve the measurement accuracy.

[0054] Specifically, see Figure 2 , four high-precision photoelectric sensors 8 are arranged in a row in the horizontal direction on the side wall of the powder spreading trolley 7. The four high-precision photoelectric sensors 8 are divided into two groups, the first group is the first sensor, and the second group is the second sensor. The two first sensors are respectively arranged at the two ends of the side wall to sense the distance between them and the reference platform 5; the remaining two second sensors are respectively arranged at the inner sides of the two first sensors to sense the distance between them and the forming substrate 10. The second sensor is set at a position corresponding to the edge of the forming substrate 10. The farther the distance between the two second sensors, the more accurate the detection result.

[0055] The high-precision photoelectric sensors 8 at both ends are installed close to the gap between the forming substrate 10 and the forming cavity, in order to reduce the error caused by the measurement position.

[0056] The high-precision linear power module 4 drives the powder spreading trolley 7 to move back and forth once, and the height distribution of the forming substrate 10 and the reference platform 5 along the length direction of the track can be obtained. Through data processing, the three-dimensional expression of the plane where the forming substrate 10 and the reference platform 5 are located can be obtained.

[0057] By using a dynamic line scanning method in which the powder spreading trolley 7 drives the four photoelectric sensors 8 to move back and forth, the spatial angle between the molding substrate 10 and the reference platform 5 can be accurately identified. Compared with the prior art solution that can only identify the angle in one direction, the measurement result is more accurate; at the same time, it can also effectively avoid the interference of accidental factors such as local processing errors, defects, foreign matter, etc. on the surface of large-size substrates on the measurement results.

[0058] See also Figure 3 , Figure 4 The piston unit 2 includes a forming base plate 10, an adjustment base plate 11 and a piston automatic lifting assembly 3. Figure 4 , the piston automatic lifting assembly 3 packs two sets of electric cylinder assemblies. The electric cylinder assembly includes a screw module 16, a flange push rod 17 and a servo motor. The outer protective shell of the screw module 16 is installed and fixed on the cylinder bottom plate 15, the bottom of the flange push rod 17 of the electric cylinder assembly is connected to the output end of the screw module 16, and the top of the flange push rod 17 of the electric cylinder assembly is connected and fixed to the adjustment bottom plate 11, and can drive the adjustment bottom plate 11 to move up and down to achieve lifting.

[0059] See also Figure 1 , Figure 3 The forming substrate 10 is located on the adjustment base plate 11. Two pin holes are left on the lower surface of the forming substrate 10 along the symmetry axis. Two threaded holes are processed on the upper surface of the adjustment base plate 11 along the symmetry axis, and positioning pins 14 are pre-installed. The positioning pins 14 and the pin holes of the forming substrate 10 are clearance-matched to constrain the displacement and rotation of the forming substrate 10 in the horizontal direction, and the maximum diameter clearance between the pin holes and the positioning pins 14 is required to be no more than 1 mm.

[0060] With such a configuration, the forming substrate 10 can be fixed on the adjusting base plate 11 , and can be driven up and down by the flange push rod 17 of the electric cylinder assembly together with the adjusting base plate 11 , and can make slight movements relative to the adjusting base plate 11 .

[0061] The substrate leveling unit includes a PLC controller and an actuator. The PLC controller controls the position detection component 1 to detect the parallelism between the forming substrate 10 and the reference platform 5, and controls the actuator to drive the adjustment base plate 11 to move according to the detection result, thereby adjusting the parallelism between the forming substrate 10 and the reference platform 5 to within a reasonable range.

[0062] The actuator includes three sets of base plate adjustment screw modules 12 and three servo motors 13. Figure 3 As shown. The outer protective shell of the substrate adjustment screw rod module 12 is fixedly arranged on the lower surface of the adjustment base plate 11, and the servo motor 13 is arranged at the bottom of the substrate adjustment screw rod module 12. Driven by the servo motor 13, the internal push rod of the substrate adjustment screw rod module 12 can pass through the through hole reserved in the adjustment base plate 11, directly contact the lower surface of the forming substrate 10 and perform a lifting action, so that the forming substrate 10 is in a floating support state.

[0063] Through this setting, the PLC controller can calculate the distance that each of the three sets of substrate adjustment screw modules 12 should move according to the detection result of the position detection component 1, and then control the three sets of substrate adjustment screw modules 12 to move to the target position respectively, thereby adjusting the surface of the forming substrate 10 to tilt a certain angle relative to the adjustment base plate 11, such as Figure 5 As shown, the parallelism between the forming substrate 10 and the reference platform 5 of the forming cavity is adjusted.

[0064] Since the three sets of substrate adjustment screw modules 12 operate independently, the forming substrate 10 can be flipped left and right and / or front and back, and can be adjusted in place at one time. Compared with the solution of adjusting the left side first and then the right side in the prior art, the adjustment efficiency is improved; compared with the solution that can only adjust the unevenness of the left and right sides, the adjustment effect is improved; the processing error of the forming substrate itself (substrate thickness, upper and lower surface parallelism) can be effectively compensated. At the same time, the influence of the piston lifting unit's working accuracy on the parallelism of the forming substrate can also be corrected.

[0065] Preferably, two of the three groups of substrate adjustment screw modules 12 are respectively arranged at the two ends of one side of the adjustment base plate 11, and the other group is arranged in the middle of the other side. In this arrangement, corresponding to the same displacement of any one or more substrate adjustment screw modules 12, the rotation amplitude of the forming substrate 10 is the smallest, so the adjustment accuracy of the forming substrate 10 is the highest.

[0066] Furthermore, a ball joint is provided at the top of the three sets of substrate adjustment screw rod modules 12, and three hemispherical grooves are correspondingly provided at the bottom of the forming substrate 10, and the three sets of substrate adjustment screw rod modules 12 are connected to the forming substrate 10 through a ball joint. With this arrangement, the forming substrate 10 can rotate freely relative to the substrate adjustment screw rod modules 12, thereby avoiding interference.

[0067] Furthermore, the piston unit 2 also includes an elastic sealing ring, which is arranged between the forming substrate 10 and the adjustment base plate 11. Specifically, a sealing groove is provided near the edges of the adjustment base plate 11, and an elastic sealing ring is provided in the sealing groove. The upper edge of the elastic sealing ring is fixedly connected to the bottom of the forming substrate 10, and the lower edge is fixedly connected to the sealing groove of the adjustment base plate 11. When the forming substrate 10 is tilted relative to the adjustment base plate 11, the elastic sealing ring can be elastically deformed to adapt to the change in the distance between the two. Through this arrangement, the piston unit 2 can be sealed to prevent dust, debris, etc. from entering.

[0068] Example 2

[0069] Embodiment 2 of the present invention relates to a method for automatically leveling a substrate of a laser selective melting forming device, using the laser selective melting forming device for automatically leveling a substrate in Embodiment 1.

[0070] The automatic substrate leveling method comprises the following steps:

[0071] S0: Before positioning begins, the forming substrate 10 is placed on the upper surface of the adjusting base plate 11, and the forming substrate 10 is positioned in the horizontal direction by two positioning pins 14, but is not fixed.

[0072] S1: The high-precision linear power module 4 drives the powder spreading trolley 7 with the position detection component 1 to move above the reference platform 5 of the forming cavity and the forming substrate 10 to detect the position relationship of the forming substrate 10 relative to the reference platform 5.

[0073] Specifically, the detection method is to transmit, receive and compare photoelectric signals through four high-precision photoelectric sensors 8 to measure the relative height deviation of the forming substrate 10 relative to the reference platform 5 of the forming cavity.

[0074] S2: Based on the data fed back by the position detection component 1, the PLC controller performs calculations and determines whether the position deviation value exceeds the adjustable range.

[0075] S3: If the position deviation exceeds the adjustable range, the adjustment is terminated, and the industrial control system prompts the relevant operators to conduct troubleshooting, such as checking the machining accuracy of the forming substrate 10, confirming whether there are foreign objects between the forming substrate 10 and the adjustment base plate 11, etc.; otherwise, the PLC controller performs analysis and calculation according to the preset algorithm to obtain the displacement direction and displacement of the three sets of substrate adjustment screw modules 12;

[0076] S4: The PLC controller sends a control instruction and a corresponding displacement to the servo motor 13 to control the three sets of substrate adjustment screw modules 12 to perform lifting and lowering adjustment actions, and uses a three-point positioning method to make the forming substrate 10 and the reference platform 5 parallel to each other.

[0077] Furthermore, step S5 is included: executing step S1 again to determine whether the parallelism between the forming substrate 10 and the reference platform 5 reaches the target range. If it does not reach the standard, continue to adjust; if it has reached the standard, the leveling is completed.

[0078] Specifically, after the adjustment action is completed, the height position change of the forming substrate 10 will be detected by the position detection component 1, and the measurement result will be transmitted to the PLC controller to determine whether further adjustment is required. Through the above complete closed-loop control, the parallelism error of the forming substrate 10 relative to the forming cavity reference platform 5 can be finally achieved to be ≤0.06mm.

[0079] like Figure 5 As shown, after the forming substrate 10 is placed on the upper surface of the adjustment base plate 11, the upper surface of the forming substrate 10 has an angle relative to the forming cavity reference platform 5. After the above positioning and adjustment steps, the upper surface of the forming substrate 10 is parallel to the forming cavity reference platform 5.

[0080] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by any technician familiar with the technical field within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention.

Claims

1. A laser selective melting forming device with automatic substrate leveling, characterized in that: It includes a forming chamber, a piston unit, a powder spreading unit, a cylinder assembly, a cylinder bottom plate and a base plate leveling unit; Wherein, the cylinder assembly is fixedly arranged on the cylinder bottom plate, and the forming cavity is fixedly arranged on the top of the cylinder assembly; The powder spreading unit is arranged inside the forming cavity and can reciprocate along the length direction of the forming cavity; The piston unit is located in the cylinder assembly and can move up and down relative to the forming cavity; the piston unit includes a forming base plate; The substrate leveling unit is disposed in the cylinder assembly and can drive the forming substrate to perform a leveling movement to adjust the parallelism between the forming substrate and a reference platform of the forming cavity.

2. The laser selective melting forming equipment for automatic substrate leveling according to claim 1 is characterized in that: The powder spreading unit includes a linear power module, a powder spreading trolley and a position detection component; the linear power module is arranged on the two side walls of the forming cavity, and the linear power module drives the powder spreading trolley to move back and forth; the position detection component is arranged on the front side of the powder spreading trolley, and can detect the distance between the powder spreading trolley and the plane below.

3. The laser selective melting forming equipment for automatic substrate leveling according to claim 2, characterized in that: The position detection component includes a plurality of photoelectric sensors, which are divided into two groups and arranged horizontally on the front side of the powder spreading vehicle.

4. The laser selective melting forming equipment for automatic substrate leveling according to claim 3 is characterized in that: The first group of photoelectric sensors are arranged at both ends of the powder spreading trolley to detect the distance between the powder spreading trolley and the reference platform of the forming cavity.

5. The laser selective melting forming equipment for automatic substrate leveling according to claim 4, characterized in that: The second group of photoelectric sensors is arranged on the inner side of the first group of photoelectric sensors, and is used to detect the distance between the powder spreading trolley and the forming substrate.

6. The laser selective melting forming equipment for automatic substrate leveling according to any one of claims 3 to 5, characterized in that: The number of the plurality of photosensors is at least four.

7. The laser selective melting forming equipment for automatic substrate leveling according to claim 5, characterized in that: The second group of photosensors is disposed inside the first group of photosensors and close to the edge of the forming substrate.

8. The laser selective melting forming equipment for automatic substrate leveling according to claim 1, characterized in that: The piston unit further comprises an adjusting bottom plate, which is arranged below the forming base plate and can drive the forming base plate to move up and down.

9. The laser selective melting forming equipment for automatic substrate leveling according to claim 8, characterized in that: The piston unit also includes an automatic piston lifting component, which can drive the adjustment base plate to move up and down.

10. A method for automatically leveling a substrate of a laser selective melting forming device, characterized in that: A laser selective melting forming device for automatically leveling a substrate according to any one of claims 1 to 9 is used.

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