Full-automatic mirror polishing device for silicon ring

Abstract

The invention discloses a full-automatic mirror polishing device for a silicon ring, and belongs to the field of silicon ring polishing. Comprising a polishing mechanism, a bottom plate is arranged below the polishing mechanism, and a vertical plate is fixedly connected to the right side of the upper surface of the bottom plate; a lifting mechanism is arranged on the left side of the vertical plate; a placing mechanism is arranged on the left side of the upper surface of the bottom plate; a cleaning mechanism is arranged on the left side of the bottom plate; the polishing mechanism comprises a mounting plate, a cylinder is rotationally connected to the lower surface of the mounting plate through a rotating shaft, a mounting frame is fixedly connected to the bottom end of the cylinder, and two first through sliding grooves are formed in the upper surface of the mounting frame; the vacuum pump is started, the silicon ring is adsorbed through the adsorption disc, it is ensured that the silicon ring cannot move easily during grinding, the second motor is started, the adsorption disc is controlled to rotate under meshing of the third gear and the fourth gear, the edge of the silicon ring rotates to be ground, and grinding is more comprehensive.

Description

Technical Field

[0001] The invention relates to the field of silicon ring polishing, in particular to a full-automatic mirror polishing device for a silicon ring. Background Art

[0002] The silicon ring is used to carry the wafer during the wafer processing. The thickness of the silicon ring used in different processes is different. Therefore, in the production and preparation of the silicon ring, it is necessary to grind the back of the silicon ring through a polishing mechanism to reduce the thickness of the silicon ring. When grinding, it is necessary to first perform rough grinding to speed up the grinding speed, and then perform fine grinding to achieve the required thickness;

[0003] Patent: CN221792005U discloses a grinding and thinning device for a single crystal silicon ring, comprising a frame, a moving frame is installed on the frame through a horizontal moving mechanism, a lifting frame is installed on the moving frame through a vertical moving mechanism, a rotating frame is rotatably installed on the lifting frame, the rotating frame is driven to rotate by a first rotating driving mechanism, two first rotating motors are vertically installed on the rotating frame, the two first rotating motors are symmetrically arranged along the rotation center of the rotating frame, the output shaft of the first rotating motor is fixed with a mounting plate downward, a fine grinding head and a rough grinding head are respectively installed on the two mounting plates, a rotating table rotatably installed on the frame is provided below the rotating frame, the rotating table is driven to rotate by a second rotating mechanism, a plurality of adsorption holes are provided on the rotating table, the adsorption holes are connected to a vacuum generator, and an infrared rangefinder corresponding to the rotating table is installed on the rotating frame, so that the same device has the functions of rough grinding and fine grinding at the same time, which can reduce the investment cost of the equipment;

[0004] In the above technology, the fine grinding head and the coarse grinding head need two motors to control the rotation for grinding respectively, and the electric push rod needs to be pushed repeatedly to increase the grinding range during grinding. In addition, the above technology cannot clean the debris generated by the polishing of the silicon ring surface in time, and needs to be improved. For this reason, we propose a fully automatic mirror polishing device for silicon rings. Summary of the invention

[0005] Purpose of the invention: The purpose of the present invention is to provide a fine grinding head and a rough grinding head that only need a single motor to control the rotation for grinding, and there is no need to repeatedly push the electric push rod to increase the grinding range during grinding; another purpose of the present invention is to provide a device that can promptly clean up the debris generated by the polishing of the silicon ring surface.

[0006] Technical solution: A fully automatic mirror polishing device for a silicon ring, comprising a polishing mechanism, a bottom plate is arranged below the polishing mechanism, and a vertical plate is fixedly connected to the right side of the upper surface of the bottom plate;

[0007] A lifting mechanism is provided on the left side of the vertical plate;

[0008] A placement mechanism is provided on the left side of the upper surface of the bottom plate;

[0009] A cleaning mechanism is provided on the left side of the bottom plate;

[0010] The polishing mechanism includes a mounting plate, the lower surface of the mounting plate is rotatably connected to a cylinder via a rotating shaft, the bottom end of the cylinder is fixedly connected to a mounting frame, the upper surface of the mounting frame is provided with two through-type slide grooves 1, the opposite sides of the two slide grooves 1 are integrally formed with contraction grooves, the inside of the contraction groove is slidably connected to a sliding plate, the opposite sides of the two sliding plates are located on the inner sides of the two slide grooves 1 and are fixedly connected to shaft sleeves, the inner side of the shaft sleeve is rotatably connected to a shaft column via a rotating shaft, the bottom ends of the two shaft columns are respectively fixedly connected to a fine grinding head and a coarse grinding head, and the top end of the shaft column is fixedly connected to a gear 1;

[0011] A slide groove 2 is provided on the upper surface of the mounting plate, and two slide rods are fixedly connected inside the slide groove 2. The outer side walls of the two slide rods are slidably connected to an L-shaped bracket. The inner side of the L-shaped bracket is fixedly connected to motor 1, and the bottom end of the output shaft of motor 1 is fixedly connected to gear 2.

[0012] Furthermore, an electric push rod is fixedly connected to the upper surface of the mounting plate, the bottom end of the output end of the electric push rod passes through the bottom of the mounting plate and is fixedly connected to a toggle column, a spiral groove is provided on the outer wall of the cylinder, and the rear end of the toggle column extends to the interior of the spiral groove and is slidably connected to the spiral groove.

[0013] Furthermore, a spring is fixedly connected between the slide groove 1 and the slide plate.

[0014] Furthermore, a cam is fixedly connected to the outer side wall of the output shaft of the motor, a connecting ring groove is provided on the upper surface of the cam, a connecting column is slidably connected inside the connecting ring groove, and an L-shaped support rod is fixedly connected between the top of the connecting column and the upper surface of the mounting plate.

[0015] Furthermore, the lifting mechanism includes a fixing bar, the upper surface of which is fixedly connected to an electric push rod 2, the bottom end of the output end of the electric push rod 2 passes through the bottom of the fixing bar and is fixedly connected to a lifting bar, the left side of the lifting bar is fixedly connected to the right side of the mounting plate, and the right side of the fixing bar is fixedly connected to the left side of the vertical plate.

[0016] Furthermore, two vertical rods are fixedly connected to the lower surface of the fixing bar, and the bottom ends of the vertical rods penetrate the lifting bar and are slidably connected to the lifting bar.

[0017] Furthermore, the placement mechanism includes an adsorption plate, the lower surface of the adsorption plate is fixedly connected to a vacuum pump, the lower surface of the placement mechanism is fixedly connected to a shaft, the lower surface of the shaft is rotatably connected to the upper surface of the base plate via a rotating shaft, the outer side wall of the shaft is fixedly connected to a gear three, the upper surface of the base plate is located on the left side of the shaft and is fixedly connected to a motor two, the top end of the output shaft of the motor two is fixedly connected to a gear four, and the gear four is meshingly connected to the gear three.

[0018] Furthermore, the cleaning mechanism includes a fixed head, the upper surface of the fixed head is rotatably connected to a spiral tube via a rotating shaft, the outer wall of the spiral tube is fixedly connected to a gear five, the gear five is meshingly connected to the gear four, the internal thread of the spiral tube is connected to a screw rod, the outer wall of the screw rod is fixedly connected to a wiping strip, and the lower surface of the wiping strip is removably equipped with wiping cotton.

[0019] Furthermore, a material guide seat is provided on the outer side wall of the adsorption disk, and a connecting seat is fixedly connected between the material guide seat and the bottom plate.

[0020] Beneficial effect: Start the vacuum pump, and use the adsorption plate to adsorb the silicon ring to ensure that the silicon ring will not move easily during grinding. By starting the motor 2, the adsorption plate is controlled to rotate under the meshing of gear 3 and gear 4, so that the silicon ring can be polished while rotating, and the grinding is more comprehensive;

[0021] When the motor 2 is started and controls the adsorption plate to rotate, the gear 4 will mesh with the gear 5 to drive the screw and the spiral tube to rotate together, thereby driving the wiping strip to rotate, and then the wiping cotton can wipe the surface of the silicon ring, so as to achieve the effect of grinding edge cleaning, and the screw can extend from the inside of the spiral tube to control the height of the wiping strip, so as to facilitate wiping silicon rings of different thicknesses;

[0022] Control the electric push rod 1 to extend or retract, and at this time, the mounting frame at the bottom of the cylinder will be rotated through the toggle column and the spiral groove, so as to control the gear 1 of the rough grinding head or the gear 1 at the bottom of the fine grinding head to mesh with the gear 2, so that the fine grinding head or the rough grinding head can be controlled to rotate and grind separately;

[0023] When the motor is started and the fine grinding head or the coarse grinding head is controlled to rotate and grind, the cam can repeatedly squeeze and push the motor 1 to move left and right repeatedly during the rotation process. At this time, under the push of the spring, the gear 2 and the gear 1 can always be in a meshing state. At the same time, the gear 1 meshing with the gear 2 is pushed to move left and right repeatedly, thereby driving the coarse grinding head or the fine grinding head to move left and right repeatedly, thereby increasing the grinding range. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a structural schematic diagram of the polishing mechanism of the present invention;

[0026] Figure 3 It is a schematic diagram of the connection structure of the cylinder, the electric push rod, the mounting frame, the fine grinding head and the rough grinding head of the present invention;

[0027] Figure 4 It is a schematic diagram of the connection structure of the motor 1, the cam, the gear 2, the L-shaped bracket and the slide rod of the present invention;

[0028] Figure 5 It is a schematic diagram of the side view connection structure of the lifting mechanism and the vertical plate of the present invention;

[0029] Figure 6 It is a schematic diagram of the connection structure of the placing mechanism and the cleaning mechanism of the present invention.

[0030] In the figure: 1, polishing mechanism; 2, bottom plate; 3, vertical plate; 4, lifting mechanism; 5, placing mechanism; 6, cleaning mechanism; 7, material guide seat; 8, connecting seat; 101, mounting plate; 102, cylinder; 103, mounting frame; 104, slideway 1; 105, contraction groove; 106, sliding plate; 107, sleeve; 108, shaft column; 109, fine grinding head; 110, rough grinding head; 111, gear 1; 112, slideway 2; 113, slide rod; 114, L-shaped bracket; 115, motor 1; 116, gear 2; 117, electric push Rod one; 118, toggle column; 119, spiral groove; 120, spring; 121, cam; 122, connecting ring groove; 123, connecting column; 124, L-shaped support rod; 401, fixing bar; 402, electric push rod two; 403, lifting bar; 404, vertical rod; 501, adsorption plate; 502, vacuum pump; 503, shaft; 504, gear three; 505, motor two; 506, gear four; 601, fixing head; 602, screw tube; 603, gear five; 604, screw; 605, wiping bar; 606, wiping cotton. DETAILED DESCRIPTION

[0031] In order to make the technical solution of the present invention clearer, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0032] Example 1

[0033] like Figure 1 As shown, a fully automatic mirror polishing device for a silicon ring is provided, comprising a polishing mechanism 1, a bottom plate 2 is arranged below the polishing mechanism 1, and a vertical plate 3 is fixedly connected to the right side of the upper surface of the bottom plate 2;

[0034] The outer wall of the adsorption disk 501 is provided with a material guide seat 7, and a connecting seat 8 is fixedly connected between the material guide seat 7 and the bottom plate 2;

[0035] The bottom plate 2 and the vertical plate 3 form the frame of the device, and the material guide seat 7 and the connecting seat 8 are used to guide the debris cleaned after grinding.

[0036] like Figure 5 As shown, a lifting mechanism 4 is provided on the left side of the vertical plate 3;

[0037] The lifting mechanism 4 includes a fixing bar 401, the upper surface of which is fixedly connected to an electric push rod 2 402, the bottom end of the output end of the electric push rod 2 402 passes through the bottom of the fixing bar 401, and is fixedly connected to a lifting bar 403, the left side of the lifting bar 403 is fixedly connected to the right side of the mounting plate 101, and the right side of the fixing bar 401 is fixedly connected to the left side of the vertical plate 3;

[0038] The lower surface of the fixed bar 401 is fixedly connected with two vertical rods 404, and the bottom ends of the vertical rods 404 penetrate the lifting bar 403 and are slidably connected with the lifting bar 403;

[0039] By controlling the electric push rod 2 402 to retract, under the guidance of the vertical rod 404, the lifting bar 403 can be controlled to rise or fall, thereby controlling the polishing mechanism 1 to rise or fall, thereby controlling the polishing mechanism 1 to approach the silicon ring for polishing or move away from the silicon ring, which is convenient for replacing the silicon ring.

[0040] A placement mechanism 5 is provided on the left side of the upper surface of the bottom plate 2;

[0041] The placement mechanism 5 includes an adsorption disk 501, a vacuum pump 502 is fixedly connected to the lower surface of the adsorption disk 501, a shaft 503 is fixedly connected to the lower surface of the placement mechanism 5, the lower surface of the shaft 503 is rotatably connected to the upper surface of the bottom plate 2 via a rotating shaft, a gear 3 504 is fixedly connected to the outer wall of the shaft 503, a motor 2 505 is fixedly connected to the upper surface of the bottom plate 2 located on the left side of the shaft 503, a gear 4 506 is fixedly connected to the top of the output shaft of the motor 2 505, and the gear 4 506 is meshed with the gear 3 504;

[0042] Before polishing, place the silicon ring on the upper surface of the adsorption plate 501, start the vacuum pump 502, and adsorb the silicon ring through the adsorption plate 501 to ensure that the silicon ring will not move easily during polishing. By starting the motor 2 505, the adsorption plate 501 is controlled to rotate under the meshing of gear 3 504 and gear 4 506, so that the silicon ring can be polished while rotating, and the polishing is more comprehensive.

[0043] A cleaning mechanism 6 is provided on the left side of the bottom plate 2;

[0044] The cleaning mechanism 6 includes a fixed head 601, the upper surface of the fixed head 601 is rotatably connected to a screw tube 602 via a rotating shaft, the outer wall of the screw tube 602 is fixedly connected to a gear 5 603, the gear 5 603 is meshed and connected with a gear 4 506, the inner thread of the screw tube 602 is connected to a screw rod 604, the outer wall of the screw rod 604 is fixedly connected to a wiping strip 605, and the lower surface of the wiping strip 605 is detachably mounted with a wiping cotton 606;

[0045] When motor 2 505 is started and controls the adsorption plate 501 to rotate, gear 4 506 will engage with gear 5 603 to drive the screw 604 and the screw tube 602 to rotate together, thereby driving the wiping strip 605 to rotate, and then the wiping cotton 606 can wipe the surface of the silicon ring, so as to achieve the effect of cleaning the polished edge, and the screw 604 can extend from the inside of the screw tube 602 to control the height of the wiping strip 605, so as to facilitate the wiping of silicon rings of different thicknesses.

[0046] like Figure 2 , Figure 3 and Figure 4 As shown, the polishing mechanism 1 includes a mounting plate 101, the lower surface of the mounting plate 101 is rotatably connected to a cylinder 102 via a rotating shaft, the bottom end of the cylinder 102 is fixedly connected to a mounting frame 103, the upper surface of the mounting frame 103 is provided with two through-type slide grooves 104, the opposite sides of the two slide grooves 104 are integrally formed with contraction grooves 105, the inside of the contraction groove 105 is slidably connected to a sliding plate 106, the opposite sides of the two sliding plates 106 are located on the inner sides of the two slide grooves 104 and are fixedly connected to shaft sleeves 107, the inner side of the shaft sleeve 107 is rotatably connected to a shaft column 108 via a rotating shaft, the bottom ends of the two shaft columns 108 are respectively fixedly connected to a fine grinding head 109 and a coarse grinding head 110, and the top of the shaft column 108 is fixedly connected to a gear 111;

[0047] A second slide groove 112 is provided on the upper surface of the mounting plate 101, and two slide bars 113 are fixedly connected inside the second slide groove 112, and an L-shaped bracket 114 is slidably connected to the outer side walls of the two slide bars 113, and a motor 115 is fixedly connected to the inner side of the L-shaped bracket 114, and a gear 2 116 is fixedly connected to the bottom end of the output shaft of the motor 115;

[0048] The upper surface of the mounting plate 101 is fixedly connected with an electric push rod 117, the bottom end of the output end of the electric push rod 117 penetrates the bottom of the mounting plate 101, and is fixedly connected with a toggle column 118. The outer wall of the cylinder 102 is provided with a spiral groove 119, and the rear end of the toggle column 118 extends to the inside of the spiral groove 119 and is slidably connected with the spiral groove 119;

[0049] A spring 120 is fixedly connected between the slide slot 104 and the sliding plate 106;

[0050] A cam 121 is fixedly connected to the outer side wall of the output shaft of the motor 115, a connecting ring groove 122 is provided on the upper surface of the cam 121, a connecting column 123 is slidably connected inside the connecting ring groove 122, and an L-shaped support rod 124 is fixedly connected between the top of the connecting column 123 and the upper surface of the mounting plate 101;

[0051] During grinding, the motor 115 is started to control the gear 2 116 to rotate, and the electric push rod 117 can be controlled to extend or retract. At this time, the mounting frame 103 at the bottom of the cylinder 102 is driven to rotate by driving the column 118 and the spiral groove 119, so as to control the gear 1 111 of the rough grinding head 110 or the gear 1 111 at the bottom of the fine grinding head 109 to mesh with the gear 2 116, so that the fine grinding head 109 or the rough grinding head 110 can be controlled to rotate and grind separately;

[0052] When the motor 115 is started and controls the fine grinding head 109 or the rough grinding head 110 to rotate and grind, the cam 121 can repeatedly squeeze and push the motor 115 to move left and right repeatedly during the rotation process. At this time, under the push of the spring 120, the gear 2 116 and the gear 1 111 can always be in a meshing state. At the same time, the gear 111 meshed with the gear 2 116 is pushed to move left and right repeatedly, thereby driving the rough grinding head 110 or the fine grinding head 109 to move left and right repeatedly, thereby increasing the grinding range.

[0053] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A fully automatic mirror polishing device for a silicon ring, comprising a polishing mechanism (1), characterized in that: A bottom plate (2) is arranged below the polishing mechanism (1), and a vertical plate (3) is fixedly connected to the right side of the upper surface of the bottom plate (2); A lifting mechanism (4) is provided on the left side of the vertical plate (3); A placement mechanism (5) is provided on the left side of the upper surface of the bottom plate (2); A cleaning mechanism (6) is provided on the left side of the bottom plate (2); The polishing mechanism (1) comprises a mounting plate (101), the lower surface of the mounting plate (101) is rotatably connected to a cylinder (102) via a rotating shaft, the bottom end of the cylinder (102) is fixedly connected to a mounting frame (103), the upper surface of the mounting frame (103) is provided with two through-type slide grooves (104), the opposite sides of the two slide grooves (104) are integrally formed with contraction grooves (105), the inner sliding grooves (105) of the contraction grooves (105) are The two sliding plates (106) are rotatably connected to the two slide grooves (104); the opposite sides of the two sliding plates (106) are located on the inner sides of the two slide grooves (104) and are fixedly connected to the shaft sleeves (107); the inner side of the shaft sleeves (107) is rotatably connected to the shaft column (108) via a rotating shaft; the bottom ends of the two shaft columns (108) are respectively fixedly connected to a fine grinding head (109) and a rough grinding head (110); the top end of the shaft column (108) is fixedly connected to a gear (111); A second slide groove (112) is provided on the upper surface of the mounting plate (101), two slide bars (113) are fixedly connected inside the second slide groove (112), the outer side walls of the two slide bars (113) are slidably connected to an L-shaped bracket (114), the inner side of the L-shaped bracket (114) is fixedly connected to a motor one (115), and the bottom end of the output shaft of the motor one (115) is fixedly connected to a gear two (116).

2. The fully automatic mirror polishing device for a silicon ring according to claim 1, characterized in that: An electric push rod (117) is fixedly connected to the upper surface of the mounting plate (101), the bottom end of the output end of the electric push rod (117) passes through the bottom of the mounting plate (101) and is fixedly connected to a toggle column (118), a spiral groove (119) is formed on the outer wall of the cylinder (102), and the rear end of the toggle column (118) extends to the inside of the spiral groove (119) and is slidably connected to the spiral groove (119).

3. The fully automatic mirror polishing device for a silicon ring according to claim 1, characterized in that: A spring (120) is fixedly connected between the first slide groove (104) and the sliding plate (106).

4. The fully automatic mirror polishing device for a silicon ring according to claim 1, characterized in that: A cam (121) is fixedly connected to the outer side wall of the output shaft of the motor 1 (115); a connecting ring groove (122) is provided on the upper surface of the cam (121); a connecting column (123) is slidably connected inside the connecting ring groove (122); an L-shaped support rod (124) is fixedly connected between the top end of the connecting column (123) and the upper surface of the mounting plate 1 (101).

5. The fully automatic mirror polishing device for a silicon ring according to claim 1, characterized in that: The lifting mechanism (4) comprises a fixing bar (401), the upper surface of which is fixedly connected to a second electric push rod (402), the bottom end of the output end of the second electric push rod (402) passes through the bottom of the fixing bar (401) and is fixedly connected to a lifting bar (403), the left side of the lifting bar (403) is fixedly connected to the right side of the mounting plate (101), and the right side of the fixing bar (401) is fixedly connected to the left side of the vertical plate (3).

6. The fully automatic mirror polishing device for a silicon ring according to claim 5, characterized in that: Two vertical rods (404) are fixedly connected to the lower surface of the fixing bar (401), and the bottom ends of the vertical rods (404) penetrate the lifting bar (403) and are slidably connected to the lifting bar (403).

7. The fully automatic mirror polishing device for a silicon ring according to claim 1, characterized in that: The placement mechanism (5) comprises an adsorption plate (501), the lower surface of which is fixedly connected to a vacuum pump (502), the lower surface of which is fixedly connected to an axle (503), the lower surface of which is rotationally connected to the upper surface of the base plate (2) via a rotating shaft, the outer wall of which is fixedly connected to a gear three (504), the upper surface of which is located on the left side of the axle (503) and fixedly connected to a motor two (505), the top end of the output shaft of the motor two (505) being fixedly connected to a gear four (506), the gear four (506) being meshingly connected to the gear three (504).

8. The fully automatic mirror polishing device for a silicon ring according to claim 7, characterized in that: The cleaning mechanism (6) comprises a fixed head (601), the upper surface of the fixed head (601) is rotatably connected to a screw tube (602) via a rotating shaft, the outer wall of the screw tube (602) is fixedly connected to a gear five (603), the gear five (603) is meshingly connected to the gear four (506), the inner thread of the screw tube (602) is connected to a screw rod (604), the outer wall of the screw rod (604) is fixedly connected to a wiping strip (605), and the lower surface of the wiping strip (605) is detachably mounted with a wiping cotton (606).

9. The fully automatic mirror polishing device for a silicon ring according to claim 7, characterized in that: A material guide seat (7) is provided on the outer side wall of the adsorption disk (501), and a connecting seat (8) is fixedly connected between the material guide seat (7) and the bottom plate (2).

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