Wafer beveling device and method with fine dust removal function

Abstract

The invention provides a wafer beveling machining device and method with a fine dust removal function, and belongs to the technical field of wafer machining. The wafer beveling machining device comprises an equipment box and a conveying table top at the top of the equipment box, a closed shed is connected to the top of the conveying table top through multiple sets of stand columns, and a working table top is arranged at the bottom of the closed shed; a liftable transportation assembly is arranged between the transportation table top and the working table top, a closed opening corresponding to the transportation assembly is formed in the bottom of the working table top, and an edge chamfering assembly for processing a wafer is arranged at the top of the working table top and comprises a laser transmitter and a laser barrier plate; a dust removal assembly is arranged in the closed shed and comprises a centrifugal fan and a dust collection filter bag, the centrifugal fan is arranged at the top of the working table corresponding to the beveling assembly, and the dust collection filter bag is arranged on one side of the conveying table to collect chippings or dust, so that it is ensured that laser can be focused on the edge of the wafer; the problem that a traditional beveling device easily affects the machining quality is solved, dust diffusion is avoided, and the beveling precision is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip processing, and more specifically, particularly relates to a chip chamfering processing device and method with fine dust removal. Background Art

[0002] With the development of electronic technology, the performance requirements for quartz crystal resonators are becoming increasingly stringent. Their performance depends to a large extent on the processing quality of the wafer, and wafer chamfering is one of the most important links in the wafer processing process.

[0003] In recent years, laser cutting technology has gradually been used in the field of wafer chamfering due to its advantages of high precision, non-contact processing, and small heat-affected zone. However, when laser cutting wafers, the wafer material will be instantly vaporized and melted, generating a large number of tiny dust particles. If these dust particles are not removed promptly and effectively, the dust in the air will easily affect the transmission and focusing effects of the laser, and adhere to the surface of the wafer, affecting the cutting accuracy and causing the edge flatness of the wafer to decrease. In addition, the dust in the air also poses a threat to the health of operators, and long-term inhalation may lead to health problems such as respiratory diseases. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a chip chamfering processing device and method with fine dust removal, so as to solve the technical problems in the prior art that the traditional chamfering processing device cannot remove dust particles in time, which easily affects the transmission and focusing effect of the laser and affects the processing quality. In addition, the dust diffused in the air also poses a threat to the health of the operator.

[0005] The purpose and effect of the wafer chamfering processing device and method with fine dust removal of the present invention are achieved by the following specific technical means: A wafer chamfering processing device with fine dust removal comprises an equipment box and a transport table, wherein the transport table is arranged on the top of the equipment box, the top of the transport table is connected to a closed shed through multiple groups of columns, a work table is arranged at the bottom of the closed shed, a liftable transport component is arranged between the transport table and the work table, a closed opening is opened at the bottom of the work table corresponding to the transport component, a chamfering component for processing circular wafers is arranged on the top of the work table, the chamfering component comprises a laser emitter and a laser blocking plate, the laser emitter and the laser blocking plate are arranged on one side of the closed opening, a dust removal component is arranged in the closed shed, the dust removal component comprises a centrifugal fan and a dust filter bag, the centrifugal fan is arranged on the top of the work table corresponding to the chamfering component, and the dust filter bag is arranged on one side of the transport table.

[0006] In a preferred embodiment, a first mounting slot is provided on the top of the work table, a first mounting seat is provided at the bottom of the first mounting slot, the centrifugal fan is installed on the top of the first mounting seat, an air inlet cover is provided on one side of the first mounting seat corresponding to the air inlet of the centrifugal fan, a first filter plate is provided in the air inlet cover, a socket is provided on one side of the air inlet cover, one end of the first filter plate is connected with a handle through the socket, a second mounting slot is provided at the bottom of the work table, a second mounting seat is provided at the bottom of the second mounting slot, a slot is provided on the top of the second mounting seat, the dust filter bag is detachably installed in the slot, a switchable maintenance plate is provided on one side of the second mounting seat, a collecting cover is provided on the top of the second mounting slot, and a liquid guide slot connected to the collecting cover is provided on the top of the work table corresponding to the transport component.

[0007] In a preferred embodiment, the dust removal assembly also includes a fan, a guide cover is provided at the bottom of the second mounting seat, one end of the connecting pipe is connected to the bottom of the guide cover, a through slot is provided at the top of the transport platform, the other end of the connecting pipe passes through the through slot and is connected to the liquid storage tank in the equipment box, the fan is provided at the bottom of the transport platform, the air inlet end of the fan is connected to the connecting pipe through an air inlet pipe, the air inlet pipe is inclined relative to the connecting pipe, an air outlet is provided on one side of the equipment box, the air outlet end of the fan is connected to the air outlet through an air outlet pipe, two groups of switchable door panels are provided on one side of the closed shed, a third mounting through slot is provided on the top of the closed shed, air curtain machines are provided in the third mounting through slot corresponding to the two groups of door panels, and a second filter plate is detachably provided on the top of the third mounting through slot.

[0008] In a preferred embodiment, the chamfering assembly also includes two groups of first slide rails and two groups of first electric sliders, the first slide rails are provided on both sides of the closed opening, the first electric slider is slidably provided on the first slide rails, one group of the first electric sliders is provided with an arc-shaped mounting plate on the top, the arc-shaped mounting plate is provided with an arc-shaped slide rail on the top, the second electric slider is slidably provided on the arc-shaped slide rail, a third mounting seat is installed on the top of the second electric slider, one end of the third mounting seat is connected to the first mounting fork through the first electric telescopic rod, two groups of first guide grooves are also provided at one end of the third mounting seat, two groups of guide rods are provided on one side of the first mounting fork, the two groups of guide rods are respectively slidably connected to the two groups of first guide grooves, the first mounting fork is provided with a first fixed seat and the laser emitter at both ends correspondingly, and the laser blocking plate is provided on the first fixed seat.

[0009] In a preferred embodiment, a screw slide is provided on the top of another group of the first electric sliders, a first drive motor is provided at one end of the screw slide, a second mounting fork is provided on the top of the slider on the screw slide, a rotatable grinding wheel is provided on the second mounting fork, a grinding motor is provided at one end of the second mounting fork, the grinding motor is connected to the grinding wheel via a main shaft, a plurality of grinding grooves of different sizes are provided on the grinding wheel, a second fixed seat is provided on the top of the second mounting fork, a liquid spray nozzle facing the grinding wheel is provided on the second fixed seat, a liquid storage tank for containing grinding liquid is provided in the equipment box, a water pump is provided in the liquid storage tank, and the water pump is connected to the liquid spray nozzle via an infusion tube.

[0010] In a preferred embodiment, the transport component includes three groups of second slide rails, and three groups of second slide rails are correspondingly arranged on the top of the transport platform, one of the second slide rails is slidably provided with a third electric slider, a lifting opening is provided on the top of the transport platform, and the closed opening and one side of the lifting opening are provided with mounting grooves, the lifting screw slide is installed in two groups of the mounting grooves, a second driving motor is provided at the bottom end of the lifting screw slide, the slider on the lifting screw slide is connected to the lifting plate, and one group of the second slide rails is installed on the top of the lifting plate.

[0011] In a preferred embodiment, the transport component also includes a rotating motor, a rotating seat is provided on the top of the third electric slider, a rotatable rotating part is provided on the rotating seat, the rotating motor is provided on one side of the rotating seat, the rotating motor main shaft is connected to the rotating part, one side of the rotating part is connected to a sliding part through a second electric telescopic rod, two groups of guide plates are also provided on one side of the rotating part, both groups of guide plates are provided with second guide grooves, both ends of the sliding part are respectively slidably connected with the two groups of the second guide grooves, a rotating motor is provided on the side of the sliding part away from the rotating part, the rotating motor main shaft is connected to one end of the rotating shaft, and the other end of the rotating shaft is provided with a suction cup for fixing the wafer.

[0012] In a preferred embodiment, two groups of connecting brackets are connected to one side of the rotating part by screws, and one end of the two groups of connecting brackets are connected to the mounting bracket, a first mounting hole is opened on one side of the mounting bracket corresponding to the suction cup, a bearing is arranged in the first mounting hole, one end of the fixing rod can be rotatably inserted into the bearing, the fixing rod and the rotating shaft are located on the same axis, and an anti-slip pad is arranged at the other end of the fixing rod, one side of the anti-slip pad can contact the circular chip, and a mounting cover is arranged on one side of the first mounting hole, and two groups of limit plates are also arranged on the rotating seat, and buffer pads are arranged on the top of the two groups of limit plates, and the top of the two groups of buffer pads can contact with the two groups of guide plates.

[0013] In a preferred embodiment, two groups of fourth mounting seats are arranged on the top of the work table, and the two groups of fourth mounting seats are respectively located on both sides of the closed opening, and a first mounting hole is opened on the corresponding side of the two groups of fourth mounting seats, bearings are arranged in the two groups of the first mounting holes, and a rotatable fixing rod is arranged in the two groups of the bearings, and the two groups of fixing rods and the rotating shaft are located on the same axis, a mounting cover plate is arranged on one side of the first mounting hole, and an anti-slip pad is arranged at one end of the two groups of fixing rods, and one side of the anti-slip pad can contact the circular chip, a mounting rod is arranged on one side of the two groups of fourth mounting seats, and an infrared receiver is arranged on the mounting rod, and the side of the sliding member away from the rotating member is also connected to the first mounting plate by screws, and a second mounting hole is opened on the first mounting plate, and an infrared transmitter is arranged in the second mounting hole corresponding to the infrared receiver.

[0014] A method for using a wafer chamfering processing device with fine dust removal comprises the following steps: Step 1: Wafer loading; Placing the wafer to be processed on the suction cup of the transport assembly, and then starting the second electric telescopic rod to push the sliding member to move toward the fixing rod until the wafer is clamped between the suction cup and the fixing rod, thereby fixing the wafer; Step 2: Transport to the processing location and close the processing area; Start the third electric slider to move it to the second slide rail on the top of the lifting plate, start the second drive motor to drive the lifting screw slide to work, so that the lifting plate rises from the lifting opening until it moves to the closed opening, and at the same time, the closed opening at the bottom of the closed shed is closed to form a relatively closed processing space; Step 3: Laser chamfering: The rotating motor is started to drive the rotating member to rotate precisely 90 degrees toward the laser emitter. At this time, the bottoms of the two sets of guide plates are in contact with one set of limit plates to realize the positioning of the rotating member. One set of the first electric slider is started to slide on the first slide rail to drive the laser emitter and the laser blocking plate to approach the wafer. Then, the second electric slider is started to move on the arc slide rail to adjust the emission angle of the laser emitter. The laser emitter is started to emit a laser beam toward the laser blocking plate. At the same time, the rotating motor is started to drive the wafer to rotate at a uniform speed so that the laser beam acts on the edge of the wafer to realize the chamfering of the wafer. Step 4: Grinding and chamfering: After the laser chamfering process is completed, the rotating motor rotates in the opposite direction, driving the rotating part to rotate 180 degrees toward the grinding wheel, so that the two groups of the guide plates are in contact with the top of the other group of the limit plates, and positioning is performed again, and then the other group of the first electric sliders is started to move the grinding wheel and the grinding motor toward the wafer, and the first drive motor is started to adjust the position of the grinding wheel so that the required grinding groove on the grinding wheel is aligned with the wafer, and then the rotating motor is started to drive the wafer to rotate, and at the same time, the grinding motor is started to drive the grinding wheel to rotate at a high speed, and the wafer is ground and chamfered. During the grinding process, the liquid spray nozzle will spray grinding liquid to the wafer, and the grinding liquid is provided by the water pump in the liquid storage tank through the infusion tube; Step 5: Dust removal operation: The centrifugal fan continuously works to generate airflow, blowing the debris or dust generated during the processing to the collection cover. At the same time, the operation of the fan forms suction at the collection cover. Under the blowing and suction action, the debris or dust is collected and falls into the dust filter bag. The grinding liquid used in the grinding process can enter the collection cover along the liquid guide groove, and after being filtered by the dust filter bag, it enters the liquid storage tank along the connecting pipe to achieve recycling. Since the air inlet pipe at one end of the fan is arranged obliquely upward relative to the connecting pipe, the grinding liquid cannot enter the air inlet pipe under the action of gravity, ensuring its normal operation. Step 6: Unloading and resetting; After the processing is completed, the rotating motor is started to reset the rotating part, and then the second driving motor is started to lower the lifting plate from the closed opening to the lifting opening through the lifting screw slide, so that the second slide rail on the lifting plate is docked with the other two groups of the second slide rails on the transport table, and the third electric slider is started to move to the picking position to remove the processed round wafer. A wind wall is formed on the closed opening under the action of the centrifugal fan to ensure that the closed shed remains in a relatively closed state.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. Through the setting of the dust removal component, when the device is used, an airflow is generated by a centrifugal fan to blow the debris or dust generated during the processing process to the collection cover. The operation of the fan forms suction at the collection cover. Under the action of blowing and suction, the debris or dust is collected and falls into the dust filter bag to prevent dust from diffusing in the air and adhering to the laser transmitter, laser baffle and wafer surface. This keeps the transmission path of the laser beam clean at all times, ensuring that the laser can be focused on the edge of the wafer, improving the accuracy and stability of the chamfering process, and solving the problem that traditional chamfering processing devices easily affect the processing quality, so that the processed wafer edge is smoother and the dimensional error is smaller; and, preventing dust from floating around in the workshop, not only reduces the health risks of respiratory diseases caused by long-term inhalation of dust by operators, but also makes the entire production workshop meet environmental protection standards and requirements, reducing the potential environmental governance costs caused by dust pollution.

[0016] 2. Through the setting of the chamfering component, when using the device, it has two chamfering processing methods through the laser emitter and the grinding wheel, which enhances the adaptability to different processing needs. First, the high-precision and non-contact characteristics of laser chamfering can be used to quickly complete the initial chamfering and shape the general outline of the chip; the subsequent grinding wheel grinding chamfering uses multiple sets of grinding grooves of different sizes to grind specific parts, meet the diverse chamfering process requirements, and effectively expand the processing range.

[0017] 3. Through the setting of the transport component and the closed shed, when the device is used, the second drive motor is started to drive the lifting screw slide to work, and the lifting plate is raised from the lifting opening to the closed opening, so as to close the closed opening at the bottom of the closed shed, forming a relatively closed processing space. The dust, debris, etc. generated during the processing can be confined in the closed space, which is convenient for the subsequent dust removal components to be centrally and efficiently processed, avoiding the spread of pollution to the entire workshop, which not only protects the workshop environment, but also ensures the normal operation of other equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of the structure of the first embodiment of the present invention after assembly; Figure 2 is a schematic diagram of the structure of the first embodiment of the present invention after expansion; Figure 3 It is a schematic diagram of the structure after the dust removal component and the closed shed in the present invention are separated; Figure 4 It is a schematic diagram of the structure of the centrifugal fan and the air inlet cover after being separated in the present invention; Figure 5 It is a schematic diagram of the structure after the dust collection filter bag and the second mounting base are assembled in the present invention; Figure 6 yes Figure 5 Schematic diagram of the structure after splitting; Figure 7 It is a schematic diagram of the structure of the liquid storage tank after being disassembled in the present invention; Figure 8 It is a schematic diagram of the structure after the arc-shaped slide rail and the third mounting seat are assembled in the present invention; Fig. 9 yes Figure 8 Schematic diagram of the structure after splitting; Fig.10 It is a schematic diagram of the structure after the second mounting fork and the grinding wheel are separated in the present invention; Fig.11 It is a schematic diagram of the structure after the work surface and the transport component are assembled in the present invention; Fig.12 It is a schematic diagram of the structure after the transport component of the present invention is assembled; Fig.13 yes Fig.12 Schematic diagram of the structure after splitting; Fig.14 It is a flow chart of steps of a method for using a wafer chamfering processing device with fine dust removal according to the present invention; Fig.15 This is a schematic diagram of the structure of the transport component after assembly in the second embodiment of the present invention; Fig.16 It is a schematic diagram of the structure after the transport component in the second embodiment of the present invention is disassembled.

[0019] In the figure, the corresponding relationship between the component names and the figure numbers is as follows: 101, equipment box; 102, transport table; 103, column; 104, closed shed; 105, work table; 106, closed opening; 107, round wafer; 108, liquid storage tank; 109, door panel; 201, centrifugal fan; 202, dust filter bag; 203, first installation slot; 204, first mounting seat; 205, air inlet cover; 206, first filter plate; 207, socket; 208, handle; 209, second installation slot; 210, second mounting seat; 211, maintenance panel; 212, fan; 213, guide cover; 214, Connecting pipe; 215, air inlet pipe; 216, air outlet; 217, air outlet pipe; 218, third installation slot; 219, air curtain; 220, second filter plate; 221, collection cover; 222, liquid guide slot; 301, laser transmitter; 302, laser blocking plate; 303, first slide rail; 304, first electric slider; 305, arc-shaped installation plate; 306, arc-shaped slide rail; 307, second electric slider; 308, third installation seat; 309, first electric telescopic rod; 310, first installation fork; 311, first guide slide groove; 312, guide rod; 313, first fixed seat; 314, screw slide; 315, first drive motor; 316, second mounting fork; 317, grinding wheel; 318, grinding motor; 319, grinding groove; 320, second fixed seat; 321, spray nozzle; 322, water pump; 323, infusion tube; 401, second slide rail; 402, third electric slider; 403, lifting opening; 404, mounting groove; 405, lifting screw slide; 406, second drive motor; 407, lifting plate; 408, rotating motor; 409, rotating seat; 410, rotating member; 411, The second electric telescopic rod; 412, sliding member; 413, guide plate; 414, second guide slot; 415, rotating motor; 416, rotating shaft; 417, suction cup; 418, connecting bracket; 419, mounting bracket; 420, first mounting hole; 421, bearing; 422, fixing rod; 423, anti-skid pad; 424, mounting cover; 425, fourth mounting seat; 426, mounting rod; 427, infrared receiver; 428, first mounting plate; 429, second mounting hole; 430, infrared transmitter; 431, limit plate; 432, buffer pad. DETAILED DESCRIPTION

[0020] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the technical solutions of the present invention, but cannot be used to limit the scope of protection of the present invention.

[0021] Embodiment 1: As shown in the attached Figures 1 to 14 As shown: The present invention provides a wafer chamfering processing device with fine dust removal, comprising an equipment box 101 and a transport table 102. The equipment box 101 stands at the bottom to provide support for the entire device, and a transport table 102 is arranged on the top thereof. The transport table 102 is connected to a closed shed 104 through multiple groups of columns 103 above the transport table 102, so as to construct a relatively independent processing space; a work table 105 is arranged at the bottom of the closed shed 104, and a transport component that can be raised and lowered is arranged between the transport table 102 and the work table 105, which is responsible for the transfer of wafers between different tables, and a closed opening 106 is opened at the bottom of the work table 105 corresponding to the transport component, so as to The lifting and lowering action of the transport component provides a channel. A chamfering component for processing the circular wafer 107 is arranged on the top of the work table 105. The chamfering component includes a laser emitter 301 and a laser blocking plate 302. A laser emitter 301 and a laser blocking plate 302 are arranged on one side of the closed opening 106. Furthermore, the dust removal component arranged in the closed shed 104 includes a centrifugal fan 201 and a dust filter bag 202. The centrifugal fan 201 can be of DT model. A centrifugal fan 201 is arranged at the position corresponding to the chamfering component on the top of the work table 105, and a dust filter bag 202 is arranged on one side of the transport table 102 to collect dust and debris.

[0022] Please refer to Figure 3 and Figure 4As shown, a first mounting slot 203 is provided on the top of the work surface 105, a first mounting seat 204 is provided at the bottom of the first mounting slot 203, a centrifugal fan 201 is provided on the top of the first mounting seat 204, and an air inlet cover 205 is provided on one side of the first mounting seat 204 corresponding to the air inlet of the centrifugal fan 201 to prevent external dust from mixing into the processing space; a first filter plate 206 is provided inside the air inlet cover 205 to intercept dust particles; in order to facilitate replacement, a socket 207 is provided on one side of the air inlet cover 205, and one end of the first filter plate 206 is penetrated The socket 207 is connected to the handle 208. When the first filter plate 206 needs to be cleaned or replaced, the operator only needs to hold the handle 208 to pull the first filter plate 206 out of the socket 207, and then insert the new first filter plate 206 along the socket 207. A second installation slot 209 is provided at the bottom of the workbench 105, and a second mounting seat 210 is provided at the bottom of the second installation slot 209. A detachable dust filter bag 202 is provided in the slot provided at the top of the second mounting seat 210 to capture dust during the chamfering process. The dust collector 202 is convenient for cleaning and maintaining the dust filter bag 202. By opening the maintenance plate 211, the dust filter bag 202 can be taken out of the through slot. A collection cover 221 is arranged on the top of the second installation through slot 209. When the centrifugal fan 201 is running, a strong airflow is generated to blow the dust or debris generated during the processing to the collection cover 221. The dust and debris fall into the dust filter bag 202 below, effectively preventing the dust from flying in the air and adhering to the laser emitter. The emitter 301 and the surface of the round wafer 107 ensure that the laser can be smoothly focused on the edge of the wafer, improve the accuracy and stability of the chamfering process, and solve the problem that the traditional chamfering process device is easy to affect the processing quality, so that the edge flatness of the processed wafer is better and the dimensional error is smaller; the top of the work table 105 corresponds to the transportation component and is also provided with a liquid guide groove 222 connected to the collection cover 221. The grinding liquid used in the grinding process can flow into the collection cover 221 along the liquid guide groove 222 and be filtered and purified through the dust filter bag 202.

[0023] Please refer to Figure 3 , Figure 5 and Figure 6As shown, the dust removal component also includes a fan 212, and the fan 212 can be selected as the CF-11-2A model; a guide cover 213 is arranged at the bottom of the second mounting seat 210, and one end of a connecting pipe 214 is connected to the bottom of the guide cover 213. A through groove is opened on the top of the transport table 102 to provide a passage for the other end of the connecting pipe 214. After passing through the through groove, the connecting pipe 214 is connected to the liquid storage tank 108 in the equipment box 101. In this way, the grinding liquid filtered by the dust filter bag 202 The air can then flow back to the liquid storage tank 108 along the connecting pipe 214, realizing recycling, which saves resources and is environmentally friendly and efficient; a fan 212 is arranged at the bottom of the transport platform 102, and its air inlet end is connected to the connecting pipe 214 through the air inlet pipe 215. After the fan 212 is started and operated, suction can be formed at the collection cover 221, further enhancing the collection capacity of the collection cover 221 for debris or dust, effectively preventing dust from floating around in the workshop, and reducing the risk of respiratory diseases caused by long-term inhalation of dust by operators. Health risks such as air inlet pipe 215 are arranged obliquely upward relative to connecting pipe 214, so that the grinding liquid can only flow downstream under the action of gravity and cannot enter air inlet pipe 215, thereby ensuring the normal and stable operation of the dust removal component; an air outlet 216 is provided on one side of the equipment box 101, and the air outlet end of the fan 212 is connected to the air outlet 216 through an air outlet pipe 217; two sets of switchable door panels 109 are provided on one side of the closed shed 104, providing a convenient passage for the inspection and maintenance of the chamfering component; the closed shed 10 A third installation slot 218 is provided at the top, and an air curtain 219 is provided at the position corresponding to the two sets of door panels 109 in the third installation slot 218. The air curtain 219 can be of the RM-150-09 model. When the air curtain 219 is started, an air curtain is formed behind the door panels 109. When the two sets of door panels 109 are opened, the closed shed 104 can still be kept in a relatively closed state to prevent the intrusion of dust and impurities from the outside. A second filter plate 220 is detachably provided at the top of the third installation slot 218.

[0024] Please refer to Figure 7 , Figure 8 and Fig. 9As shown, the chamfering assembly also includes two groups of first slide rails 303 and two groups of first electric sliders 304. The first slide rails 303 are arranged on both sides of the closed opening 106. The first electric sliders 304 are slidably arranged on the first slide rails 303. A curved mounting plate 305 is arranged on the top of one group of the first electric sliders 304. A curved slide rail 306 is arranged on the top of the curved mounting plate 305. A second electric slider 307 is slidably arranged on the curved slide rail 306. A third mounting seat 308 is installed on the top of the second electric slider 307. One end of the third mounting seat 308 is connected to the first mounting fork 310 through a first electric telescopic rod 309. One end of the third mounting seat 308 is also provided with a There are two groups of first guide grooves 311, and two groups of guide rods 312 are arranged on one side of the first mounting fork 310. The two groups of guide rods 312 are slidably connected with the two groups of first guide grooves 311 respectively, so as to realize sliding guidance. The first mounting fork 310 is provided with a first fixing seat 313 and a laser emitter 301 at both ends respectively. The laser emitter 301 can select the YLR-1000-SM-TT model; the laser blocking plate 302 arranged on the first fixing seat 313 and the laser emitter 301 complement each other. Through the setting of the laser emitter 301, the advantages of high precision and non-contact of laser chamfering can be utilized to quickly outline the general outline of the wafer and complete the preliminary chamfering work.

[0025] Please refer to Figure 7 and Fig.10 As shown, a screw slide 314 is arranged on the top of another group of first electric sliders 304, and a first driving motor 315 is arranged at one end of the screw slide 314. A second mounting fork 316 is arranged on the top of the slider on the screw slide 314, and a rotatable grinding wheel 317 is arranged on the second mounting fork 316. A grinding motor 318 is arranged at one end of the second mounting fork 316. The main shaft of the grinding motor 318 is connected to the grinding wheel 317. When the grinding motor 318 is started, the grinding wheel 317 rotates at a high speed. The grinding wheel 317 is provided with a plurality of grinding grooves 319 of different sizes, and the corresponding grinding grooves 319 can be selected according to actual processing requirements. The grinding groove 319 performs chamfering on the circular wafer 107 to meet the diverse chamfering process requirements and effectively expand the processing range; a second fixing seat 320 is arranged on the top of the second mounting fork 316, and a liquid spray nozzle 321 facing the grinding wheel 317 is arranged on the second fixing seat 320. A liquid storage tank 108 for storing grinding liquid in the equipment box 101, and a water pump 322 in the liquid storage tank 108 is connected to the liquid spray nozzle 321 through an infusion tube 323 to ensure that during the grinding process, the liquid spray nozzle 321 can spray the grinding liquid in time to play a role in cooling, lubricating and cleaning, thereby improving the grinding effect and wafer quality.

[0026] Please refer to Fig.11As shown, the transport component includes three groups of second slide rails 401, and the three groups of second slide rails 401 are arranged on the top of the transport table 102. A slidable third electric slider 402 is provided on one group of the second slide rails 401. A mounting groove 404 is provided on one side of the lifting opening 403 and the closed opening 106. A lifting screw slide 405 is installed in the two groups of mounting grooves 404. A second driving motor 406 is provided at the bottom of the lifting screw slide 405. When the second driving motor 406 is started to drive the lifting screw slide 405 to work, the slider on the lifting screw slide 405 drives the lifting plate 407 to rise, so that the lifting plate 407 can be moved from the lifting opening 403 to the closed opening 106, so as to achieve the closure of the closed opening 106 at the bottom of the closed shed 104, forming a relatively closed processing space, and limiting the dust, debris, etc. generated in the processing process within the closed space, creating favorable conditions for the treatment of the dust removal component, and avoiding the spread of pollution to the entire workshop.

[0027] Please refer to Fig.12 and Fig.13 As shown, the transport assembly also includes a rotating motor 408, a rotating seat 409 is provided on the top of the third electric slider 402, a rotating member 410 is provided on the rotating seat 409, a rotatable rotating member 410 is provided on the rotating seat 409, a rotating motor 408 is provided on one side of the rotating seat 409, the main shaft of the rotating motor 408 is connected to the rotating member 410, and the rotating member 410 can be driven to rotate by starting the rotating motor 408; one side of the rotating member 410 is connected to the sliding member 412 through the second electric telescopic rod 411, and the rotating member 410 is connected to the sliding member 412 through the second electric telescopic rod 411. Two groups of guide plates 413 are also provided on one side to guide the direction of the sliding member 412. Second guide grooves 414 are provided on the two groups of guide plates 413, and the two ends of the sliding member 412 are slidably connected with the two groups of second guide grooves 414 respectively; a rotating motor 415 is provided on the side of the sliding member 412 away from the rotating member 410, and the main shaft of the rotating motor 415 is connected to one end of the rotating shaft 416, and a suction cup 417 for fixing the round wafer 107 is provided at the other end of the rotating shaft 416, which provides reliable protection for the wafer fixation during the processing.

[0028] Please refer to Fig.13As shown, one side of the rotating member 410 is connected to two groups of connecting brackets 418 by screws, and one end of the two groups of connecting brackets 418 is connected to the mounting bracket 419. A first mounting hole 420 is opened on one side of the mounting bracket 419 corresponding to the suction cup 417, and a bearing 421 is arranged in the first mounting hole 420. One end of the fixing rod 422 is rotatably inserted into the bearing 421, and the fixing rod 422 and the rotating shaft 416 are located on the same axis. An anti-skid pad 423 is arranged at the other end of the fixing rod 422, and one side of the anti-skid pad 423 can contact the round wafer 107 to further stabilize the wafer; a mounting cover plate 424 arranged on one side of the first mounting hole 420 provides a protective barrier for the internal components, and two groups of limiting plates 431 are also arranged on the rotating seat 409. The tops of the two groups of limiting plates 431 are provided with buffer pads 432, and the tops of the two groups of buffer pads 432 can contact the two groups of guide plates 413, and play a buffering and limiting role during the rotation of the rotating member 410 to prevent collision damage and ensure the stability of the equipment operation.

[0029] Please refer to Fig.15 and Fig.16 As shown, two groups of fourth mounting seats 425 are arranged on the top of the work surface 105, and the two groups of fourth mounting seats 425 are respectively located on both sides of the closed opening 106. The first mounting holes 420 are opened on the corresponding sides of the two groups of fourth mounting seats 425. Bearings 421 are arranged in the two groups of first mounting holes 420. Rotatable fixing rods 422 are arranged in the two groups of bearings 421. The two groups of fixing rods 422 and the rotating shaft 416 are located on the same axis. A mounting cover plate 424 is arranged on one side of the first mounting hole 420, and an anti-slip pad 423 is arranged at one end of the two groups of fixing rods 422. One side of the anti-slip pad 423 can contact the circular chip 107, and one side of the two groups of fourth mounting seats 425 is provided with a mounting rod 426, and an infrared receiver 427 is provided on the mounting rod 426, and the infrared receiver 427 can be selected from the CHQ model; the side of the sliding member 412 away from the rotating member 410 is also connected to the first mounting plate 428 by screws, and a second mounting hole 429 is opened on the first mounting plate 428, and an infrared transmitter 430 is provided in the second mounting hole 429 corresponding to the infrared receiver 427, and the infrared transmitter 430 can be selected from the JAN7805-012 model.

[0030] A method for using a wafer chamfering processing device with fine dust removal comprises the following steps: Step 1: Wafer loading; The wafer 107 to be processed is placed on the suction cup 417 of the transport assembly. At this time, the suction cup 417 initially stabilizes the wafer by its own suction force. Then, the second electric telescopic rod 411 is started to push the sliding member 412 to move steadily along the second guide slot 414 toward the fixing rod 422 until the wafer 107 is clamped between the suction cup 417 and the fixing rod 422. The clamping force on both sides provides reliable fixation for the wafer 107, ensuring that it will not be easily displaced during subsequent transportation and processing. Step 2: Transport to the processing location and close the processing area; After the wafer is fixed, the third electric slider 402 is started to slide on the second slide rail 401 and move to the second slide rail 401 on the top of the lifting plate 407. Then, the second drive motor 406 is started to drive the lifting screw slide 405 to start working. The slider on the lifting screw slide 405 drives the lifting plate 407 to rise and move from the lifting opening 403 to the closed opening 106, so as to close the closed opening 106 at the bottom of the closed shed 104, thereby constructing a relatively closed processing space, effectively isolating the processing area from the outside world, preventing external dust and impurities from mixing in and interfering with the processing accuracy, and limiting the dust and debris generated during the processing in the closed space, creating good conditions for the dust removal component to function and preventing the pollution from spreading to the entire workshop. Step 3: Laser chamfering: After the processing space is closed, the rotating motor 408 is started to drive the rotating member 410 to rotate 90 degrees toward the laser emitter 301. At this time, the bottom of the two sets of guide plates 413 contacts one set of limit plates 431 to achieve the locking of the rotating member 410. Next, one set of the first electric sliders 304 is started, and the first electric slider 304 slides on the first slide rail 303, driving the laser emitter 301 and the laser blocking plate 302 to approach the wafer 107. Then, the second electric slider 307 is started to slide on the arc slide rail 303. 06 moves up, adjusts the emission angle of the laser emitter 301, ensures that the laser beam can act on the edge of the wafer, and when everything is ready, starts the laser emitter 301 to emit a high-energy laser beam to the laser blocking plate 302. At the same time, starts the rotating motor 415 to drive the round wafer 107 to rotate at a constant speed. Under the relative motion of the laser beam and the wafer, the high-precision and non-contact characteristics of the laser chamfering are used to gradually carve the edge of the wafer, quickly complete the preliminary chamfering, and shape a contour that roughly meets the requirements, laying a solid foundation for subsequent further processing; Step 4: Grinding and chamfering: When the laser chamfering process is completed, the rotating motor 408 rotates in the opposite direction to drive the rotating member 410 to rotate 180 degrees toward the grinding wheel 317. At this time, the two sets of guide plates 413 contact the top of the other set of limit plates 431 to achieve precise positioning again. Subsequently, another set of first electric sliders 304 are started to slide on the first slide rail 303 to drive the grinding wheel 317 and the grinding motor 318 to approach the circular wafer 107. The first drive motor 315 is started to drive the slider on the screw slide 314 to move to adjust the position of the grinding wheel 317 so that the required grinding groove 319 on the grinding wheel 317 is aligned with the circular wafer 107. Then, the rotating motor 415 is started to drive the grinding wheel 317 to align with the circular wafer 107. The movable wafer 107 rotates, and the grinding motor 318 is started to drive the grinding wheel 317 to rotate at a high speed. With multiple groups of grinding grooves 319 of different sizes on the grinding wheel 317, the operator can choose to grind the wafer 107 according to actual processing needs to meet the diverse chamfering process requirements. During the grinding process, the liquid spray nozzle 321 will spray the grinding liquid to the wafer 107 in time. The grinding liquid is transported by the water pump 322 in the liquid storage tank 108 through the liquid infusion tube 323. The grinding liquid is sprayed on the contact part between the grinding wheel 317 and the wafer to play a role of cooling and lubrication, reduce the damage of friction heat to the wafer, improve the grinding effect, and ensure the quality of the wafer; Step 5: Dust removal operation: During the entire processing, dust removal is carried out synchronously. The centrifugal fan 201 runs continuously and stably to generate a strong airflow, blowing the debris or dust generated during the processing to the collection cover 221. At the same time, the fan 212 runs to form suction at the collection cover 221. Under the synergistic effect of the blowing and the suction, the debris or dust is collected and falls into the dust filter bag 202, effectively preventing dust from spreading in the air and preventing it from adhering to the surface of the laser emitter 301, the grinding wheel 317 and the wafer 107, ensuring the cleanliness of the processing environment and the normal operation of each component. Normal operation and processing accuracy; the grinding liquid used in the grinding process will flow into the collection cover 221 along the liquid guide groove 222, and after being filtered by the dust filter bag 202, it will enter the liquid storage tank 108 along the connecting pipe 214, so as to realize the recycling of the grinding liquid; because the air inlet pipe 215 at one end of the fan 212 is arranged obliquely upward relative to the connecting pipe 214, the grinding liquid can only flow downstream under the action of gravity and cannot enter the air inlet pipe 215, thereby ensuring the normal and stable operation of the entire dust removal and liquid recovery system, and providing a strong guarantee for continuous processing; Step 6: Unloading and resetting; After the processing is completed, the rotating motor 408 is started to drive the rotating part 410 to reset, and then the second driving motor 406 is started to drive the lifting screw slide 405 to work, so that the lifting plate 407 descends from the closed opening 106 until it returns to the lifting opening 403, and the second slide rail 401 on the lifting plate 407 is docked with the other two sets of second slide rails 401 on the transport table 102. Finally, the third electric slider 402 is started to slide on the second slide rail 401 and move to the pick-up position to remove the processed round wafer 107; during the entire unloading process, a wind wall is formed on the closed opening 106 under the action of the centrifugal fan 201, which effectively prevents dust and other pollutants in the closed shed 104 from spreading to the external environment, ensuring that the closed shed 104 always remains in a relatively closed state.

[0031] Embodiment 2: Based on the wafer chamfering processing device and method with fine dust removal provided in Embodiment 1 of the present application, Embodiment 2 of the present application proposes a wafer chamfering processing device and method with fine dust removal. This Embodiment 2 is only a preferred mode of Embodiment 1, and the implementation of Embodiment 2 will not affect the independent implementation of Embodiment 1. The second Embodiment 2 of the present invention will be further described below.

[0032] Please refer to Fig.15 and Fig.16 As shown, two groups of fourth mounting seats 425 are arranged on the top of the work table 105, and the two groups of fourth mounting seats 425 are symmetrically arranged on both sides of the closed opening 106, and each group of fourth mounting seats 425 has a first mounting hole 420 on its corresponding side, and bearings 421 are embedded in the two groups of first mounting holes 420, and fixed rods 422 are rotatably arranged in the inner rings of the two groups of bearings 421. The two groups of fixed rods 422 and the rotating shaft 416 are all located on the same axis. A cover plate 424 is installed on one side of the first mounting hole 420 to cover it, which plays a role in protecting the internal bearing 421 and preventing foreign objects such as dust and debris from invading and affecting its rotation performance; one end of the two groups of fixed rods 422 is provided with an anti-slip Pad 423, when the circular wafer 107 needs to be processed, one side of the anti-slip pad 423 can be firmly in contact with the circular wafer 107, providing additional support and friction for the wafer, ensuring that the wafer will not be easily displaced under high-speed rotation, grinding and other processing actions, thereby ensuring the accuracy and quality of the processing; at the same time, one side of the two groups of fourth mounting seats 425 are provided with mounting rods 426, and the mounting rods 426 are provided with infrared receivers 427. The first mounting plate 428 is connected to the side of the sliding member 412 away from the rotating member 410 by screws, providing a reliable mounting platform; a second mounting hole 429 is opened on the first mounting plate 428, and an infrared transmitter 430 is provided corresponding to the position of the infrared receiver 427.

[0033] Compared with the embodiment 1 in which the limit plate 431 is used to align the round wafer 107 with the laser emitter 301 and the grinding wheel 317 respectively, the embodiment 2 is provided with a mounting rod 426 on one side of the fourth mounting seat 425, and an infrared receiver 427 is provided on the mounting rod 426. The first mounting plate 428 is connected to the side of the sliding member 412 away from the rotating member 410 by screws, and an infrared emitter 430 is provided on the first mounting plate 428. The main difference is that the infrared receiver 427 and the infrared emitter 430 can be used to monitor the relative position between the round wafer 107 and the processing component in real time, which can not only quickly confirm whether the round wafer 107 is in place before processing, but also avoid initial errors caused by errors. In addition, the infrared receiver 427 can continuously track the dynamic changes of the wafer 107 during the processing, and once a slight displacement is detected, such as an offset caused by rotational vibration or other external interference, the infrared receiver 427 can quickly capture the change of the infrared signal to adjust the rotating motor 408 to ensure that the wafer 107 and the laser emitter 301 or the grinding wheel 317 maintain the best processing alignment state; therefore, compared with the use of the limit plate 431 for mechanical positioning, the positioning accuracy during the processing can be improved, and the defective rate of processing caused by inaccurate positioning can be reduced, thereby further optimizing the quality of the wafer chamfering processing; the remaining conditions are consistent with the first embodiment, so this embodiment will not be repeated.

[0034] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A wafer chamfering processing device with fine dust removal, comprising an equipment box (101) and a transport table (102), characterized in that: The transport table (102) is arranged on the top of the equipment box (101); the top of the transport table (102) is connected to a closed shed (104) via a plurality of sets of columns (103); a work table (105) is arranged at the bottom of the closed shed (104); a transport component that can be raised and lowered is arranged between the transport table (102) and the work table (105); a closed opening (106) is provided at the bottom of the work table (105) corresponding to the transport component; and a reverse rotation plate for processing a wafer (107) is arranged on the top of the work table (105). The invention relates to a chamfering assembly, wherein the chamfering assembly comprises a laser emitter (301) and a laser blocking plate (302), the laser emitter (301) and the laser blocking plate (302) are arranged on one side of the closed opening (106), a dust removal assembly is arranged in the closed shed (104), the dust removal assembly comprises a centrifugal fan (201) and a dust collection filter bag (202), the centrifugal fan (201) is arranged on the top of the work surface (105) corresponding to the chamfering assembly, and the dust collection filter bag (202) is arranged on one side of the transport surface (102).

2. A wafer chamfering processing device with fine dust removal according to claim 1, characterized in that: A first mounting slot (203) is provided on the top of the work surface (105), a first mounting seat (204) is provided at the bottom of the first mounting slot (203), the centrifugal fan (201) is installed on the top of the first mounting seat (204), an air inlet cover (205) is provided on one side of the first mounting seat (204) corresponding to the air inlet of the centrifugal fan (201), a first filter plate (206) is provided in the air inlet cover (205), a socket (207) is provided on one side of the air inlet cover (205), one end of the first filter plate (206) passes through the socket (207) and is connected to a handle (206). 08), a second installation slot (209) is provided at the bottom of the work surface (105), a second installation seat (210) is provided at the bottom of the second installation slot (209), a slot is provided at the top of the second installation seat (210), the dust filter bag (202) is detachably installed in the slot, a maintenance plate (211) that can be opened and closed is provided on one side of the second installation seat (210), a collection cover (221) is provided at the top of the second installation slot (209), and a liquid guide slot (222) in communication with the collection cover (221) is provided at the top of the work surface (105) corresponding to the transport component.

3. A wafer chamfering processing device with fine dust removal according to claim 2, characterized in that: The dust removal assembly also includes a fan (212); a guide cover (213) is provided at the bottom of the second mounting seat (210); one end of a connecting pipe (214) is connected to the bottom of the guide cover (213); a through slot is provided at the top of the transport platform (102); the other end of the connecting pipe (214) passes through the through slot and is connected to a liquid storage tank (108) in the equipment box (101); the fan (212) is provided at the bottom of the transport platform (102); an air inlet end of the fan (212) is connected to the connecting pipe (214) via an air inlet pipe (215); the air inlet pipe (215) The equipment box (101) is provided with an air outlet (216) on one side thereof and is arranged obliquely relative to the connecting pipe (214); an air outlet end of the fan (212) is connected to the air outlet (216) via an air outlet pipe (217); two groups of switchable door panels (109) are provided on one side of the closed shed (104); a third mounting slot (218) is provided on the top of the closed shed (104); air curtains (219) are provided in the third mounting slot (218) corresponding to the two groups of door panels (109); and a second filter plate (220) is detachably provided on the top of the third mounting slot (218).

4. The wafer chamfering processing device with fine dust removal according to claim 1, characterized in that: The chamfering assembly further comprises two groups of first slide rails (303) and two groups of first electric sliders (304), the first slide rails (303) being arranged on both sides of the closed opening (106), the first electric sliders (304) being slidably arranged on the first slide rails (303), one group of the first electric sliders (304) being provided with an arc-shaped mounting plate (305) on the top, the arc-shaped mounting plate (305) being provided with an arc-shaped slide rail (306) on the top, the arc-shaped slide rail (306) being provided with a second electric slider (307) being slidably arranged on the second electric slider (307), the third mounting seat (307) being installed on the top of the second electric slider (307). 8), one end of the third mounting seat (308) is connected to the first mounting fork (310) through the first electric telescopic rod (309), and one end of the third mounting seat (308) is also provided with two groups of first guide slots (311), one side of the first mounting fork (310) is provided with two groups of guide rods (312), and the two groups of guide rods (312) are respectively slidably connected to the two groups of first guide slots (311), and the first two ends of the first mounting fork (310) are respectively provided with a first fixed seat (313) and the laser emitter (301), and the laser blocking plate (302) is provided on the first fixed seat (313).

5. A wafer chamfering processing device with fine dust removal according to claim 4, characterized in that: A screw slide (314) is arranged at the top of another group of the first electric slide blocks (304), a first drive motor (315) is arranged at one end of the screw slide block (314), a second mounting fork (316) is arranged at the top of the slide block on the screw slide block (314), a rotatable grinding wheel (317) is arranged on the second mounting fork (316), a grinding motor (318) is arranged at one end of the second mounting fork (316), a main shaft of the grinding motor (318) is connected to the grinding wheel (317), and the grinding wheel ( A plurality of grinding grooves (319) of different sizes are provided on the second mounting fork (317); a second fixing seat (320) is provided on the top of the second mounting fork (316); a liquid spray nozzle (321) facing the grinding wheel (317) is provided on the second fixing seat (320); a liquid storage tank (108) for containing grinding liquid is provided in the equipment box (101); a water pump (322) is provided in the liquid storage tank (108); and the water pump (322) is connected to the liquid spray nozzle (321) via a liquid infusion tube (323).

6. The wafer chamfering processing device with fine dust removal according to claim 1, characterized in that: The transport assembly comprises three groups of second slide rails (401), and three groups of second slide rails (401) are correspondingly arranged on the top of the transport platform (102), and a third electric slider (402) is slidably arranged on one of the second slide rails (401). A lifting opening (403) is provided on the top of the transport platform (102), and mounting grooves (404) are provided on one side of the closed opening (106) and the lifting opening (403). A lifting screw slide (405) is installed in two groups of the mounting grooves (404), and a second driving motor (406) is provided at the bottom end of the lifting screw slide (405). The slider on the lifting screw slide (405) is connected to a lifting plate (407), and one group of the second slide rails (401) is installed on the top of the lifting plate (407).

7. A wafer chamfering processing device with fine dust removal according to claim 6, characterized in that: The transport assembly further comprises a rotating motor (408); a rotating seat (409) is disposed on the top of the third electric slider (402); a rotatable rotating member (410) is disposed on the rotating seat (409); the rotating motor (408) is disposed on one side of the rotating seat (409); a main shaft of the rotating motor (408) is connected to the rotating member (410); a sliding member (412) is connected to one side of the rotating member (410) via a second electric telescopic rod (411); and a rotating member (410) is further disposed on one side. There are two groups of guide plates (413), and the two groups of guide plates (413) are both provided with second guide grooves (414). The two ends of the sliding member (412) are respectively slidably connected to the two groups of the second guide grooves (414). A rotating motor (415) is arranged on the side of the sliding member (412) away from the rotating member (410). The main shaft of the rotating motor (415) is connected to one end of a rotating shaft (416), and the other end of the rotating shaft (416) is provided with a suction cup (417) for fixing the round wafer (107).

8. The wafer chamfering processing device with fine dust removal according to claim 7, characterized in that: One side of the rotating member (410) is connected to two groups of connecting brackets (418) by screws. One end of the two groups of connecting brackets (418) is connected to a mounting bracket (419). One side of the mounting bracket (419) is provided with a first mounting hole (420) corresponding to the suction cup (417). A bearing (421) is provided in the first mounting hole (420). One end of a fixing rod (422) is rotatably inserted into the bearing (421). The fixing rod (422) is connected to the rotating shaft (416). Located on the same axis, the other end of the fixing rod (422) is provided with an anti-skid pad (423), one side of the anti-skid pad (423) can contact the circular wafer (107), one side of the first mounting hole (420) is provided with a mounting cover plate (424), and two groups of limit plates (431) are also provided on the rotating seat (409), and the tops of the two groups of limit plates (431) are provided with buffer pads (432), and the tops of the two groups of buffer pads (432) can contact the two groups of guide plates (413).

9. A wafer chamfering processing device with fine dust removal according to claim 7, characterized in that: Two groups of fourth mounting seats (425) are arranged on the top of the work surface (105), and the two groups of fourth mounting seats (425) are respectively located on both sides of the closed opening (106). The two groups of fourth mounting seats (425) are provided with a first mounting hole (420) on the corresponding side, and the two groups of first mounting holes (420) are provided with bearings (421), and the two groups of bearings (421) are provided with rotatable fixing rods (422), and the two groups of fixing rods (422) are located on the same axis as the rotating shaft (416), and a mounting cover plate (424) is provided on one side of the first mounting hole (420). A non-slip pad (423) is provided at one end of the fixed rod (422), and one side of the non-slip pad (423) can contact the circular chip (107). A mounting rod (426) is provided on one side of the two groups of the fourth mounting seats (425), and an infrared receiver (427) is provided on the mounting rod (426). The side of the sliding member (412) away from the rotating member (410) is also connected to a first mounting plate (428) by screws, and a second mounting hole (429) is opened on the first mounting plate (428), and an infrared transmitter (430) is provided in the second mounting hole (429) corresponding to the infrared receiver (427).

10. A method for using a wafer chamfering device with fine dust removal according to any one of claims 1 to 9, characterized in that: The following steps are included: Step 1: Wafer loading; Placing a wafer (107) to be processed on a suction cup (417) of a transport assembly, and then starting a second electric telescopic rod (411) to push a sliding member (412) to move toward a fixing rod (422) until the wafer (107) is clamped between the suction cup (417) and the fixing rod (422), thereby fixing the wafer (107); Step 2: Transport to the processing location and close the processing area; Starting the third electric slider (402) to move it to the second slide rail (401) at the top of the lifting plate (407), starting the second drive motor (406) to drive the lifting screw slide (405) to work, so that the lifting plate (407) rises from the lifting opening (403) until it moves to the closed opening (106), and at the same time, the closed opening (106) at the bottom of the closed shed (104) is closed to form a relatively closed processing space; Step 3: Laser chamfering: The rotating motor (408) is started to drive the rotating member (410) to rotate precisely 90 degrees toward the laser emitter (301). At this time, the bottoms of the two groups of guide plates (413) are in contact with one group of limit plates (431) to achieve the positioning of the rotating member (410). One group of first electric sliders (304) is started to slide on the first slide rail (303) to drive the laser emitter (301) and the laser blocking plate (302) to approach the wafer (107). Then, the second electric slider (307) is started to move on the arc-shaped slide rail (306) to adjust the emission angle of the laser emitter (301). The laser emitter (301) is started to emit a laser beam toward the laser blocking plate (302). At the same time, the rotating motor (415) is started to drive the wafer (107) to rotate at a uniform speed so that the laser beam acts on the edge of the wafer (107) to achieve chamfering of the wafer (107). Step 4: Grinding and chamfering: After the laser chamfering process is completed, the rotating motor (408) rotates in the opposite direction, driving the rotating member (410) to rotate 180 degrees toward the grinding wheel (317), so that the two groups of the guide plates (413) contact the top of the other group of the limit plates (431) to position them again, and then start the other group of the first electric sliders (304) to move the grinding wheel (317) and the grinding motor (318) toward the wafer (107), and start the first drive motor (315) to adjust the position of the grinding wheel (317) so that the The required grinding groove (319) on the grinding wheel (317) is aligned with the wafer (107), and then the rotating motor (415) is started to drive the wafer (107) to rotate, and at the same time, the grinding motor (318) is started to drive the grinding wheel (317) to rotate at a high speed, so as to grind and chamfer the wafer (107). During the grinding process, the liquid spray nozzle (321) sprays grinding liquid toward the wafer (107), and the grinding liquid is provided by the water pump (322) in the liquid storage tank (108) through the liquid infusion tube (323); Step 5: Dust removal operation: The centrifugal fan (201) continuously operates to generate airflow, blowing the debris or dust generated during the processing toward the collection cover (221). At the same time, the fan (212) operates to form a suction force at the collection cover (221). Under the blowing and suction action, the debris or dust is collected and falls into the dust collection filter bag (202). The grinding liquid used in the grinding process can enter the collection cover (221) along the liquid guide groove (222), and after being filtered by the dust collection filter bag (202), it enters the liquid storage tank (108) along the connecting pipe (214) to achieve recycling. Since the air inlet pipe (215) at one end of the fan (212) is arranged obliquely upward relative to the connecting pipe (214), the grinding liquid cannot enter the air inlet pipe (215) under the action of gravity, thereby ensuring its normal operation. Step 6: Unloading and resetting; After the processing is completed, the rotating motor (408) is started to reset the rotating part (410), and then the second driving motor (406) is started to lower the lifting plate (407) from the closed opening (106) to the lifting opening (403) through the lifting screw slide (405), so that the second slide rail (401) on the lifting plate (407) is docked with the other two groups of the second slide rails (401) on the transport platform (102), and the third electric slider (402) is started to move to the pick-up position to remove the processed round wafer (107). Under the action of the centrifugal fan (201), a wind wall is formed on the closed opening (106) to ensure that the closed shed (104) remains in a relatively closed state.

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