Molding and assembly method of an airborne electronic pod

Abstract

The application provides a forming and assembling method of an airborne electronic pod, and the forming and assembling method comprises the following steps: radome forming: adopting a skin honeycomb sandwich structure, and obtaining the radome through hot-pressing curing forming; shell forming: adopting the skin honeycomb sandwich structure, and obtaining the shell through hot-pressing curing forming by using prefabricated blocks for pre-embedding in local areas; electronic pod forming: obtaining the electronic pod by gluing and riveting the shell and the radome through positioning by a jig through a profile and a hole position. In addition, the application further discloses an airborne lightweight electronic pod, which is prepared by using the forming method. The airborne lightweight electronic pod is light in weight, good in consistency, and the manufacturing method is relatively simple.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of airborne electronic pod production, and particularly relates to a forming and assembling method of an airborne electronic pod. BACKGROUND

[0002] An electronic pod is an important component of weapon equipment and an important military material for electronic reconnaissance and jamming in war. The electronic pod has the characteristics of a large variety, lightweight, wave-transparent, and load-bearing combination. In recent years, the development of electronic and radar technology has made great progress, and more requirements such as lightweight, serialization, and low cost have been put forward for the electronic pod.

[0003] Patent document CN116534266B discloses an airborne high-rigidity and lightweight electronic pod body and an assembling method. The technical solution is as follows: an airborne high-rigidity and lightweight electronic pod body, comprising an upper beam, a lower beam, a side cover plate connected between the upper beam and the lower beam, a plurality of frames connected between the upper beam and the lower beam, and a lifting lug assembly connected to the upper beam; the main bodies of the upper beam and the lower beam are thin-walled, a plurality of transversely arranged and a plurality of longitudinally arranged reinforcing ribs are arranged on the thin-walled upper beam, the upper beam is provided with a thickened reinforcing area, and the lifting lug assembly is connected to the reinforcing area of the upper beam; the main body of the frame is a thin plate, and the thin plate is provided with a flange around the thin plate. However, the focus of patent document CN116534266B does not involve materials.

[0004] In the prior art, electronic pods made of various materials have emerged, and the current electronic pod forming methods mainly include RTM, vacuum glue injection forming, and autoclave forming. However, the electronic pod obtained by RTM or vacuum glue injection forming is heavy and has poor consistency, and the cost of autoclave forming is high.

[0005] Therefore, it is desirable to obtain a forming and assembling method of an airborne lightweight electronic pod, which is light in weight, good in consistency, and low in production cost. SUMMARY

[0006] In view of the defects in the prior art, the purpose of the present application is to provide a forming and assembling method of an airborne electronic pod.

[0007] According to the forming and assembling method of the airborne electronic pod provided by the present application, the following steps are included:

[0008] Antenna cover forming step: a skin honeycomb sandwich structure is adopted, and an antenna cover is obtained by heat pressing and curing forming;

[0009] The shell forming step: adopting the skin honeycomb sandwich structure, locally using the prefabricated block pre-embedding, placing the reinforcing rib pre-installed part in the lay-up structure of the box, and obtaining the shell containing the reinforcing rib pre-installed block through hot pressing and curing forming;

[0010] The electronic pod forming: positioning the shell and the radome through the profile and hole position by using the tooling, and obtaining the electronic pod through gluing and riveting.

[0011] Preferably, the reinforcing rib preform is made of high-strength glass fiber fabric prepreg hot-pressed.

[0012] Preferably, in the radome forming step, lay-up is performed.

[0013] During the lay-up, for the wave-transparent area, the lay-up sequence is: the high-strength glass fiber fabric prepreg is used as the inner skin, and then pre-pressing is performed.

[0014] After pre-pressing, the body resin film is placed on the inner skin as the inner adhesive film.

[0015] The aramid paper honeycomb is placed on the inner adhesive film as the core material; and the body resin film is placed on the aramid paper honeycomb as the outer adhesive film.

[0016] Finally, the high-strength glass fiber fabric prepreg is laid on the inner adhesive film as the outer skin.

[0017] Preferably, for the part where the radome is connected with the shell, the lay-up sequence is: the high-strength glass fiber fabric prepreg is used as the inner skin, the high-strength glass fiber fabric prepreg is used as the reinforcing rib, and the high-strength glass fiber fabric prepreg is used as the outer skin.

[0018] Preferably, in the shell forming step, lay-up is performed.

[0019] During the lay-up, the lay-up sequence is: the high-strength glass fiber fabric prepreg is used as the inner skin, and then pre-pressing is performed; after pre-pressing, the body resin film is placed on the inner skin as the inner adhesive film; the aramid paper honeycomb is placed on the inner adhesive film as the core material; the body resin film is placed on the aramid paper honeycomb as the outer adhesive film; and finally, the high-strength glass fiber fabric prepreg is laid on the outer adhesive film as the outer skin.

[0020] Preferably, for the part where the shell is connected with the radome, the lay-up sequence is: the high-strength glass fiber fabric prepreg is used as the inner skin, the high-strength glass fiber fabric prepreg is used as the reinforcing rib, and the high-strength glass fiber fabric prepreg is used as the outer skin.

[0021] Preferably, for the stiffener part, the lay-up sequence is: high-strength glass fiber fabric prepreg whole multi-layer as inner skin, body adhesive film, high-strength glass fiber prepreg, body adhesive film, high-strength glass fiber fabric prepreg whole multi-layer as outer skin.

[0022] Preferably, in the electronic pod forming step, assembling is performed.

[0023] When assembling, the assembling sequence is: riveting the support plate nut at the hole position of the aluminum alloy butt frame; using a tool and a pin screw to glue the aluminum alloy butt frame to the ends of the shell, and then performing riveting reinforcement; using a tool and a pin screw to glue the aluminum alloy butt frame to the end of the antenna cover, and then performing riveting reinforcement; using a tool and a pin screw to position the shell, and using a hexagonal screw to install the antenna cover through the aluminum alloy butt frame at the two ends of the shell.

[0024] Preferably, the mold forms of the antenna cover and the shell are both in the form of a male mold.

[0025] According to the present application, an airborne electronic pod is provided, which is manufactured by using the forming and assembling method of the airborne electronic pod.

[0026] Compared with the prior art, the present application has the following beneficial effects:

[0027] 1. The present application uses prepreg forming, and the product weight deviation control reaches ±1%;

[0028] 2. The present application uses lightweight high-strength aramid paper honeycomb as a filler, which is more easily shaped and laid up, and facilitates the adhesion of the prepreg and the core material during the forming process;

[0029] 3. The present application uses high-strength glass fiber preform as a stiffener, which can ensure higher mechanical working conditions and is convenient to form;

[0030] 4. The present application uses prepreg, body adhesive film, honeycomb core material, body adhesive film, and prepreg to co-cure and form, which can effectively ensure the structural properties of the product, has good wave permeability and structural strength, the forming process is simple, low-cost, and has good quality consistency;

[0031] 5. Compared with the prior art of hot press tank forming, the present application has low cost; and compared with RTM or vacuum injection molding, the present application has light weight and good consistency. BRIEF DESCRIPTION OF DRAWINGS

[0032] Other features, objects, and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments, made with reference to the accompanying drawings:

[0033] Figure 1 The structure diagram of the airborne lightweight electronic pod described in Example 1;

[0034] Figure 2 A structure diagram of a forming die for a radome of the airborne lightweight electronic pod according to Embodiment 1 is shown in the figure;

[0035] Figure 3 A structure diagram of a forming die for a shell of the airborne lightweight electronic pod according to Embodiment 1 is shown in the figure;

[0036] Figure 4 A structure diagram of a gluing assembly tool for the airborne lightweight electronic pod according to Embodiment 1 is shown in the figure;

[0037] The figure shows:

[0038] a radome 1;

[0039] a shell 2. DETAILED DESCRIPTION

[0040] The present application will be described in detail below with specific embodiments. The following embodiments will help those skilled in the art to further understand the present application, but do not limit the present application in any form. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present application. These are within the scope of the present application.

[0041] The purpose of the present application is to provide a forming and assembly method for an airborne lightweight electronic pod, which is formed by prepreg and uses lightweight and high-strength glass fiber as a skin and aramid paper honeycomb with excellent wave transmission as a core material, so that the weight deviation of the airborne lightweight electronic pod product prepared in the present application is controlled to ±1%, and the product is light in weight, strong in protection, and wide in electromagnetic frequency range.

[0042] In this embodiment 1, the airborne lightweight electronic pod is formed by the following steps, which include:

[0043] Radome forming: a skin-honeycomb sandwich structure is used to obtain the radome by hot pressing and curing;

[0044] Shell forming: a skin-honeycomb sandwich structure is used, a local area is pre-embedded with a prefabricated block, a reinforcing rib preform is placed in the layup structure of the box, and a shell containing a reinforcing rib preform is obtained by hot pressing and curing; wherein the reinforcing rib preform is made of high-strength glass fiber fabric prepreg hot pressing; in the present application, the reinforcing rib preform obtained by hot pressing of high-strength glass fiber fabric prepreg has higher specific strength and wave transmission efficiency than traditional 3240 epoxy plates. Therefore, the parts of the airborne lightweight electronic pod of the present application are lighter in weight and stronger in functionality, and are very suitable for the production of high-demand electronic hangers, while other processes have no advantage in this respect.

[0045] The electronic pod is formed by combining the radome and the shell to obtain an airborne lightweight electronic pod, wherein the shell and the radome are combined by gluing and riveting through positioning by profile and hole site by using a tool.

[0046] Compared with the traditional autoclave forming and RTM, the electronic pod with better performance is obtained by the method. Moreover, compared with the traditional autoclave process and RTM process, the forming method is more convenient to operate, does not need to rely on autoclave equipment, and the mold is simple and low in cost.

[0047] The forming of the radome specifically includes the following steps:

[0048] Step A1: radome raw material preparation;

[0049] Step B1: radome layering;

[0050] Step C1: curing, wherein the vacuum degree is greater than or equal to 95% during the whole curing process; the temperature is increased from room temperature to 85°C at a rate of 1-3°C / min, and then the temperature is kept at 85°C for 30 min; the temperature is increased from 85°C to 135°C at a rate of 1-3°C / min, and the temperature is kept at 135°C for 3 h;

[0051] Step D1: demolding.

[0052] In the step A1, the radome raw material includes high-strength glass fiber fabric prepreg, aramid paper honeycomb core and body resin film.

[0053] In the step B1, when layering, for the wave-transparent area, the layering sequence is that the high-strength glass fiber fabric prepreg is three layers as an inner skin, and then pre-pressing is performed; after pre-pressing, the body resin film is placed on the inner skin as an inner adhesive film; the aramid paper honeycomb is placed on the inner adhesive film as a core material; the body resin film is placed on the aramid paper honeycomb as an outer adhesive film; and finally, the high-strength glass fiber fabric prepreg is two layers as an outer skin.

[0054] For the part where the radome is connected with the shell, the layering sequence is that the high-strength glass fiber fabric prepreg is three layers as an inner skin, 24 layers of high-strength glass fiber fabric prepreg with a width of 20 mm, and the high-strength glass fiber fabric prepreg is three layers as an outer skin.

[0055] In the step D1, after the temperature of the furnace is reduced to 60°C, the furnace is discharged and demolding is performed.

[0056] The forming of the shell specifically includes the following steps:

[0057] Step A2: shell raw material preparation;

[0058] Step B2: shell layering;

[0059] Step C2: curing, wherein the vacuum degree is ≥95% during the whole curing process; the temperature is raised from room temperature to 85℃ at a rate of 1-3℃ / min, and then kept at 85℃ for 30 min; the temperature is raised from 85℃ to 135℃ at a rate of 1-3℃ / min, and then kept at 135℃ for 3h;

[0060] Step D2: demolding.

[0061] In the step A2, the shell raw material comprises high-strength glass fiber fabric prepreg, aramid paper honeycomb core and body resin film.

[0062] In the step B2, the laying sequence is as follows: the high-strength glass fiber fabric prepreg is laid as the inner skin in three layers as a whole, and then pre-pressed; after pre-pressing, the body resin film is placed on the inner skin as the inner adhesive film; the aramid paper honeycomb is placed on the inner adhesive film as the core material; the body resin film is placed on the aramid paper honeycomb as the outer adhesive film; and finally, the high-strength glass fiber fabric prepreg is laid on the outer adhesive film as the outer skin in two layers.

[0063] For the part where the shell is connected with the radome, the laying sequence is as follows: the high-strength glass fiber fabric prepreg is laid as the inner skin in three layers as a whole, 24 layers of high-strength glass fiber fabric prepreg with a width of 20mm, and the high-strength glass fiber fabric prepreg is laid as the outer skin in three layers as a whole.

[0064] For the part of the reinforcing rib, the laying sequence is as follows: the high-strength glass fiber fabric prepreg is laid as the inner skin in three layers as a whole, the body adhesive film, the high-strength glass fiber prepreg with a thickness of 4.5mm, the body adhesive film, and the high-strength glass fiber fabric prepreg is laid as the outer skin in three layers as a whole.

[0065] The electronic pod forming specifically comprises the following steps:

[0066] Step A3: electronic pod assembly preparation;

[0067] Step B3: electronic pod adhesive assembly;

[0068] Step C3: curing, using room temperature epoxy adhesive, and completing the adhesive assembly after curing for 24h at room temperature;

[0069] Step D4: demolding.

[0070] In the step A3, the electronic pod assembly comprises 90° countersunk rivets, adhesive, radome, shell, aluminum alloy butt joint frame, hexagonal screw and backing plate nut.

[0071] In the step B3, the assembly sequence is as follows: riveting the support plate nut at the hole position of the aluminum alloy butt frame; gluing the aluminum alloy butt frame to the ends of the shell by using a tool and a pin screw, and then riveting and reinforcing; gluing the aluminum alloy butt frame to the end of the radome by using a tool and a pin screw, and then riveting and reinforcing; positioning the shell by using a tool and a pin screw, and installing the radome at the ends of the shell through the aluminum alloy butt frame by using a hexagonal screw.

[0072] The application will be described in more detail below.

[0073] In the preferred examples, the radome and the shell mold of the application are in the form of a male mold, which ensures the size of the inner cavity of the electronic pod and is beneficial to reducing the influence of irregular inner cavity on the wave transmission of electronic equipment. Moreover, compared with the electronic pod using the prior art, the application uses aramid paper honeycomb as the internal core material, so that the quality is lighter and the wave transmission is better.

[0074] The application also provides an airborne lightweight electronic pod, which is light in weight, high in strength, good in wave transmission and good in consistency, and is very suitable for electronic pods.

[0075] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0076] The specific embodiments of the application are described above. It should be understood that the application is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essential content of the application. In the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other arbitrarily.

Claims

1. A method for molding and assembling an airborne electronic pod, characterized in that, The application relates to a forming and assembling method of an airborne electronic pod. The forming step of the radome: a skin honeycomb sandwich structure is adopted, and the radome is obtained through hot-pressing and curing forming; The forming step of the shell: a skin honeycomb sandwich structure is adopted, a local area is embedded with a prefabricated block, a reinforcing rib pre-setting piece is arranged in the layer structure of the box body, and the shell containing the reinforcing rib pre-setting block is obtained through hot-pressing and curing forming; The electronic pod is formed by using a tool to position the shell and the radome through a profile and a hole position, and the electronic pod is obtained through glue jointing and riveting of the shell and the radome; The reinforcing rib pre-setting piece is made of high-strength glass fiber fabric pre-impregnated material through hot-pressing forming; In the forming step of the radome, layering is carried out; During layering, for the wave-transparent area, the layering sequence is as follows: the high-strength glass fiber fabric pre-impregnated material is used as the whole multilayer inner skin, and then pre-pressing is carried out; After pre-pressing, the body resin adhesive film is placed on the inner skin as the inner adhesive film; The aramid paper honeycomb is placed on the inner adhesive film as the core material; the body resin adhesive film is placed on the aramid paper honeycomb as the outer adhesive film; Finally, the high-strength glass fiber fabric pre-impregnated material is placed on the outer adhesive film as the outer skin; For the connecting part of the radome and the shell, the layering sequence is as follows: the high-strength glass fiber fabric pre-impregnated material is used as the whole multilayer inner skin, the high-strength glass fiber fabric pre-impregnated material is used as the multilayer outer skin, and the high-strength glass fiber fabric pre-impregnated material is used as the whole multilayer outer skin; In the forming step of the shell, layering is carried out; During layering, the layering sequence is as follows: the high-strength glass fiber fabric pre-impregnated material is used as the whole multilayer inner skin, and then pre-pressing is carried out; after pre-pressing, the body resin adhesive film is placed on the inner skin as the inner adhesive film; the aramid paper honeycomb is placed on the inner adhesive film as the core material; the body resin adhesive film is placed on the aramid paper honeycomb as the outer adhesive film; finally, the high-strength glass fiber fabric pre-impregnated material is placed on the outer adhesive film as the outer skin; For the connecting part of the shell and the radome, the layering sequence is as follows: the high-strength glass fiber fabric pre-impregnated material is used as the whole multilayer inner skin, the high-strength glass fiber fabric pre-impregnated material is used as the multilayer outer skin, and the high-strength glass fiber fabric pre-impregnated material is used as the whole multilayer outer skin.

2. The method of claim 1, wherein: For the reinforcing rib part, the layering sequence is as follows: the high-strength glass fiber fabric pre-impregnated material is used as the whole multilayer inner skin, the body adhesive film, the high-strength glass fiber pre-setting piece, the body adhesive film, and the high-strength glass fiber fabric pre-impregnated material is used as the whole multilayer outer skin.

3. The method of forming and assembling an electronic overhead cabin according to claim 1, wherein, In the forming step of the electronic pod, assembling is carried out; During assembling, the assembling sequence is as follows: The aluminum alloy butt joint frame hole position is riveted with a support plate nut; the aluminum alloy butt joint frame is glued to the two ends of the shell by using a tool and a pin screw, and then riveting is carried out for reinforcement; the aluminum alloy butt joint frame is glued to the end part of the radome by using a tool and a pin screw, and then riveting is carried out for reinforcement; the shell is positioned by using a tool and a pin screw, and the radome is installed at the two ends of the shell by using a hexagonal screw through the aluminum alloy butt joint frame.

4. The method of claim 1, wherein the method further comprises: Both the radome and the shell mold adopt a male mold form.

5. An electronic overhead cabin, characterized in that The airborne electronic pod is manufactured by using the forming and assembling method of any one of claims 1 to 4.

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