Rotary electroforming device
By introducing a rotating device, a liquid supply device and a reflow device into the electroforming device, the substrate rotation and circulating flow of the electroforming liquid are achieved, which solves the problems of uneven casting layers and bubble pits in electroforming, and significantly improves the electroforming quality.
Patent Information
- Application Number
- CN202411978758.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-04-08
AI Technical Summary
In the existing electroforming process, metal ions are unevenly deposited, resulting in uneven thickness of the cast layer. At the same time, the bubbles generated during electroforming are difficult to discharge and are easily attached to the electroforming anode plate, forming bubble pits, affecting the quality of electroforming.
The rotary electroforming device is adopted, including a rotating device, a liquid supply device and a reflow device. The substrate is driven to rotate through the rotating device, and the liquid circulation flow of the liquid supply device and the reflow device is combined to promote the uniform distribution of metal ions and prevent bubble aggregation.
It effectively improves the uniformity of the casting layer, prevents the formation of bubble pits, and improves the electroforming quality.
Smart Images
Figure CN119776918A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of electroforming, and in particular to a rotary electroforming device. Background Art
[0002] Electroforming is an electrochemical process that produces metal parts by depositing metal on a cathode core mold to obtain a replica. The most widely used electroforming metals are copper, nickel, and iron. In recent years, with the rapid development of various industrial technologies such as electronics, machinery, and materials, the rapid development of electroforming technology has been promoted. As a precision manufacturing technology, electroforming is mainly used to produce a variety of precise, special-shaped, complex, and subtle parts that are difficult to produce by mechanical processing methods or have high processing costs. It has been successfully applied in high-tech fields such as aerospace, nuclear industry, and micro-mechanics, and has received increasing attention.
[0003] However, the disadvantage of the existing electroforming process is that metal ions will be deposited downward during the electroforming process, resulting in uneven thickness of the casting layer. In addition, during electroforming, water molecules are electrolyzed to produce hydrogen, which is not easy to be discharged from the electroforming liquid and is easily attached to the electroforming anode plate, resulting in bubble pits, which affects the quality of electroforming. Summary of the invention
[0004] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a rotary electroforming device, which can effectively improve the uniformity of the casting layer and prevent the generation of bubble pits.
[0005] In order to achieve the above object, the technical solution adopted by the present invention is as follows:
[0006] A rotary electroforming device comprises: a rotary device, an electroforming device arranged under the rotary device, a liquid supply device installed on one side of the electroforming device, an electroforming cell installed on the liquid supply device, and a reflux device installed on the electroforming cell; one end of the reflux device is connected to the electroforming cell, and the other end is connected to the electroforming device.
[0007] Preferably, the rotating device includes a device box, a rotating electric cylinder installed on the device box, a rotating shaft installed on the rotating electric cylinder, a motor installed on the rotating shaft, a connecting shaft installed on the motor, and an electroplating frame installed on the connecting shaft; the rotating device is installed on the electroplating device through the device box.
[0008] Preferably, the electroforming frame includes a threaded head, a plug-in plate installed on the threaded head, a socket provided on the plug-in plate, and a plug-in strip installed on the socket; the electroforming frame is screwed into the connecting shaft through the threaded head; and the substrate is inserted into the plug-in plate through the socket.
[0009] Preferably, the electroforming device comprises an electroforming box and an electroforming anode plate installed in the electroforming box; the electroforming anode plate is arranged obliquely in the electroforming box.
[0010] Preferably, the inclination angle of the electroformed anode plate is θ, and 0°<θ≤90°.
[0011] Preferably, after the electroforming frame enters the electroforming device, the plug plate on the electroforming frame is parallel to the electroforming anode plate.
[0012] Preferably, the liquid supply device includes a liquid extraction pipe installed on the electroforming cell, a water pump connected to the liquid extraction pipe, an infusion pipe installed on the water pump, and an inclined tube arranged at the port of the infusion pipe; the inclined tube is arranged between the plug plate and the electroforming anode plate, and is arranged parallel to the electroforming anode plate.
[0013] Preferably, the reflux device comprises a liquid inlet pipe installed on the electroforming device, a controller connected to the liquid inlet pipe, and a liquid outlet pipe installed on the controller; the reflux device is connected to the electroforming cell via the liquid outlet pipe.
[0014] Compared with the prior art, this application has the following beneficial effects:
[0015] The liquid supply device and the reflux device of the present invention cooperate with each other, so that the electroforming liquid in the electroforming device can circulate and flow, promoting the uniform distribution of metal ions in the electroforming liquid. At the same time, the substrate is installed on the rotating device. Through the rotating function of the rotating device, the substrate is electroformed during rotation. The rotation of the substrate drives the stirring of the electroforming liquid, which can effectively prevent the accumulation of bubbles in the process of metal ion deposition and cause pinholes. Moreover, the rotation of the substrate also prevents the edge effect of the current from causing uneven thickness of the casting layer. Under the dual effects of liquid flow and substrate rotation, the uniformity of the casting layer can be effectively improved.
[0016] The present invention not only drives the flow of the electroforming liquid through the rotation of the rotating device, but also prevents the bubbles generated in the electroforming liquid from adhering to the electroforming workpiece, and accelerates the discharge of the bubbles from the electroforming liquid. At the same time, the present invention also adopts a liquid supply device, in which an inclined tube is provided. The inclined tube is arranged between the plug plate and the electroforming anode plate and is arranged parallel to the electroforming anode plate. This arrangement can quickly push the bubbles between the plug plate and the electroforming anode plate to the surface of the electroforming liquid under the action of the liquid discharge force while discharging the liquid, thereby discharging the bubbles, which greatly improves the discharge speed of the bubbles. Under the joint action of the rotating device and the liquid supply device, the bubbles are effectively prevented from adhering to the substrate to produce bubble pits. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present invention, but are not intended to limit the present invention.
[0018] Figure 1 It is a structural schematic diagram of a rotary electroforming device according to the present invention;
[0019] Figure 2 for Figure 1 A schematic cross-sectional structure diagram of ;
[0020] Figure 3 for Figure 1 A schematic diagram of the side structure of the central rotating device;
[0021] Figure 4 for Figure 3 Schematic diagram of the explosion structure of the electroforming frame;
[0022] Figure 5 for Figure 4 A side view structural schematic diagram of;
[0023] Figure 6 for Figure 5 A schematic diagram of the top view of the structure of the middle plug board;
[0024] Figure 7 for Figure 1 Schematic diagram of the status structure when installing or removing the electroforming frame. DETAILED DESCRIPTION
[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings. The components of the embodiments of the present invention described and shown in the accompanying drawings can be arranged and designed in various configurations. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0026] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0027] Unless otherwise defined, the technical terms or scientific terms used in this patent document shall have the usual meanings understood by persons with ordinary skills in the field to which the invention belongs. The words "first", "second" and similar words used in the patent specification and claims of the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "one" or "the" do not indicate a quantity limitation, but indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. "Center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.
[0028] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the features of the following embodiments can be combined with each other.
[0029] Embodiment 1:
[0030] Existing electroforming equipment uses static electroforming, specifically, the substrate is sunk into the electroforming liquid, and the substrate is electroformed by passing an electric current. During the electroforming process, the electroforming liquid and the substrate remain stationary. In order to prevent bubbles from adhering to the substrate, the substrate is placed vertically. Although such operation can reduce the adhesion of bubbles to the substrate to a certain extent, it creates a new problem. During the electroforming process, metal ions will be deposited under the action of gravity. In this way, the metal ions under the electroforming liquid are more than those above, and the lower end of the substrate receives more metal ions, which will cause the thickness of the entire substrate casting layer to be uneven.
[0031] like Figure 1 As shown, a rotary electroforming device comprises: a rotating device 10, an electroforming device 20 arranged under the rotating device 10, a liquid supply device 30 installed on one side of the electroforming device 20, an electroforming cell 40 installed on the liquid supply device 30, and a reflux device 50 installed on the electroforming cell 40; one end of the reflux device 50 is connected to the electroforming cell 40, and the other end is connected to the electroforming device 20.
[0032] During electroforming, the substrate to be electroformed is first mounted on the rotating device 10, and then the rotating device 10 is placed in the electroforming device 20. Then, the electroforming liquid in the electroforming pool 40 is injected into the electroforming device 20 through the liquid supply device 30. After filling, the electroforming liquid in the electroforming device 20 is refluxed into the electroforming pool 40 through the reflux device 50. By controlling the liquid supply device 30 and the reflux device 50, the amount of electroforming liquid entering and leaving is made equal, and then the electroforming device 20 and the rotating device 10 are powered on for electroforming.
[0033] In order to prevent the occurrence of uneven thickness of the substrate casting layer, the present embodiment first adopts a liquid supply device 30 and a reflux device 50. By controlling the liquid flow rates of the two, the liquid inlet and liquid outlet of the electroforming liquid in the electroforming device 20 are made equal. In this way, the liquid in the electroforming device 20 can flow, which can effectively prevent the deposition of metal ions in the electroforming liquid, thereby making the substrate casting layer uniform.
[0034] Furthermore, a rotating device 10 is installed on the electroforming device 20. Through the rotating function of the rotating device 10, the substrate is rotated in the electroforming liquid during electroforming, so that the four sides of the substrate are evenly combined with the metal ions in the electroforming liquid. According to on-site measurements, such a design can reduce the thickness of the casting layer on the four sides of the substrate from 0.5μm to 0.2μm, effectively improving the uniformity of the substrate casting layer; at the same time, the rotation of the rotating device 10 can improve and accelerate the flow of the electroforming liquid in the electroforming device 20, more effectively prevent the deposition of metal ions, and further improve the uniformity of the substrate casting layer; and the use of the rotating device 10 to accelerate the flow of the electroforming liquid also improves the discharge of bubbles from the electroforming liquid, preventing bubbles from adhering to the substrate to form bubble pits.
[0035] like Figures 2 to 7 As shown, the rotating device 10 includes a device box 11, a rotating electric cylinder 12 installed on the device box 11, a rotating shaft 13 installed on the rotating electric cylinder 12, a motor 14 installed on the rotating shaft 13, a connecting shaft 15 installed on the motor 14, and an electroforming frame 16 installed on the connecting shaft 15 (as shown in FIG. Figure 3 ); the rotating device 10 is installed on the electroforming device 20 through the device box 11.
[0036] The substrate is mounted on an electroforming frame 16, the electroforming frame 16 is mounted on a connecting shaft 15, and the connecting shaft 15 is equipped with a motor 14 (such as Figure 2 ), the motor 14 drives the connecting shaft 15 to rotate, thereby realizing the rotation of the electroforming frame 16.
[0037] When the electroforming frame 16 is installed or removed, the rotary cylinder 12 installed on the device box 11 is first started. Under the rotation of the rotary cylinder 12, the rotary shaft 13 is driven to rotate, and the motor 14 installed on the rotary shaft 13 is driven to rotate. When the rotary shaft 13 rotates to the position as shown in FIG. Figure 7 When in the position shown, the electroforming frame 16 can be installed on or removed from the connecting shaft 15.
[0038] Furthermore, the electroforming frame 16 includes a threaded head 161, a plug plate 162 mounted on the threaded head 161, a socket 163 provided on the plug plate 162, and a plug strip 164 (such as Figures 4 to 6 ); the electroforming frame 16 is screwed into the connecting shaft 15 through the threaded head 161; the substrate is inserted into the plug plate 162 through the socket 163.
[0039] Before installing the electroforming frame 16, the substrate is inserted into the plug plate 162 through the socket 163, and then the plug strip 164 is inserted into the socket 163 to seal the socket 163 to prevent the substrate from being thrown out of the plug plate 162 during the rotation of the electroforming frame 16; after the electroforming is completed, the electroforming frame 16 is removed, the plug strip 164 is pulled out, and the substrate can be taken out.
[0040] Furthermore, the electroforming device 20 includes an electroforming box 21, an electroforming anode plate 22 (such as Figure 2 ); the electroforming anode plate 22 is arranged obliquely in the electroforming box 21.
[0041] Furthermore, the inclination angle of the electroformed anode plate 22 is θ (e.g. Figure 2 ), and 0°<θ≤90°.
[0042] Further, after the electroforming frame 16 enters the electroforming device 20, the plug plate 162 on the electroforming frame 16 is parallel to the electroforming anode plate 22 (eg, Figure 2 ).
[0043] During electroforming, the electroforming frame 16 is connected to the negative pole of the power supply, and the electroforming anode plate 22 is connected to the positive pole of the power supply. After power is turned on, according to the electroforming principle, the metal ions on the electroforming anode plate 22 will flow to the substrate on the electroforming frame 16, and then be assimilated by the substrate electrode, thereby electroforming the metal onto the substrate.
[0044] In the above process, the water in the electroforming liquid will also be decomposed to form hydrogen, thereby generating bubbles. In order to prevent the bubbles from adhering to the substrate and generating bubble pits, the electroforming anode plate 22 is tilted in the electroforming box 21 in this embodiment. On the one hand, it allows the bubbles to have space to float up. On the other hand, the plug plate 162 on the electroforming frame 16 is parallel to the electroforming anode plate 22. When the electroforming frame 16 rotates, the electroforming liquid can be more effectively stirred to flow, which can not only effectively prevent the deposition of metal ions, but also effectively accelerate the discharge of bubbles.
[0045] When the inclination angle of the electroforming anode plate 22 is 60°, both the uniformity of the casting layer of the substrate and the bubble discharge speed are optimal.
[0046] Furthermore, the liquid supply device 30 includes a liquid extraction pipe 31 installed on the electroforming cell 40, a water pump 32 connected to the liquid extraction pipe 31, a liquid infusion pipe 33 installed on the water pump 32, and an inclined pipe 34 (such as Figure 2 ); the inclined tube 34 is arranged between the plug plate 162 and the electroforming anode plate 22, and is arranged parallel to the electroforming anode plate 22.
[0047] The liquid supply device 30 extracts the electroforming liquid in the electroforming cell 40 through the liquid extraction pipe 31 by means of the water pump 32 , and outputs it to the electroforming device 20 through the liquid delivery pipe 33 .
[0048] An inclined tube 34 is provided on the port of the liquid infusion tube 33, and the inclined tube 34 is arranged between the plug plate 162 and the electroforming anode plate 22, and is arranged parallel to the electroforming anode plate 22, and is arranged at the bottom. With such a design, when the liquid is discharged, a liquid driving force will be generated to quickly push the bubbles between the plug plate 162 and the electroforming anode plate 22 away from the plug plate 162, and discharge the electroforming liquid to prevent the bubbles from adhering to the substrate in the plug plate 162, thereby effectively preventing the formation of bubble pits on the substrate.
[0049] Furthermore, the reflux device 50 includes a liquid inlet pipe 51 installed on the electroforming device 20, a controller 52 connected to the liquid inlet pipe 51, and a liquid outlet pipe 53 (such as Figure 2 ); the reflux device 50 is connected to the electroforming cell 40 through a liquid outlet pipe 53.
[0050] When the electroforming liquid fills the electroforming box 21 , the reflux device 50 uses the gravity of the liquid to cause the liquid to flow from the liquid inlet pipe 51 in the electroforming box 21 to the liquid outlet pipe 53 through the controller 52 , and then flow into the electroforming pool 40 from the liquid outlet pipe 53 .
[0051] The controller 52 may be a control valve, which is not limited in this embodiment.
[0052] When the electroforming box 21 is filled with electroforming liquid, the amount of electroforming liquid entering the electroforming box 21 and the amount of electroforming liquid flowing out of the electroforming box 21 at the same time are set to be consistent by controlling the water pump 32 and the controller 52. In this way, when the electroforming liquid flows, the electroforming liquid can always fill the entire electroforming box 21. Through this setting, the electroforming liquid can also be driven to flow, preventing metal ion deposition, and effectively improving the uniformity of the casting layer.
[0053] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims
1. A rotary electroforming device, characterized in that: include: A rotating device (10), an electroforming device (20) arranged under the rotating device (10), a liquid supply device (30) installed on one side of the electroforming device (20), an electroforming cell (40) installed on the liquid supply device (30), and a reflux device (50) installed on the electroforming cell (40); one end of the reflux device (50) is connected to the electroforming cell (40), and the other end is connected to the electroforming device (20).
2. A rotary electroforming device according to claim 1, characterized in that: The rotating device (10) comprises a device box (11), a rotating electric cylinder (12) mounted on the device box (11), a rotating shaft (13) mounted on the rotating electric cylinder (12), a motor (14) mounted on the rotating shaft (13), a connecting shaft (15) mounted on the motor (14), and an electroforming frame (16) mounted on the connecting shaft (15); the rotating device (10) is mounted on an electroforming device (20) via the device box (11).
3. A rotary electroforming device according to claim 2, characterized in that: The electroforming frame (16) comprises a threaded head (161), an inserting plate (162) mounted on the threaded head (161), a socket (163) provided on the inserting plate (162), and an inserting strip (164) mounted on the socket (163); the electroforming frame (16) is screwed into the connecting shaft (15) through the threaded head (161); and the base plate is inserted into the inserting plate (162) through the socket (163).
4. A rotary electroforming device according to claim 3, characterized in that: The electroforming device (20) comprises an electroforming box (21) and an electroforming anode plate (22) installed in the electroforming box (21); the electroforming anode plate (22) is arranged obliquely in the electroforming box (21).
5. A rotary electroforming device according to claim 4, characterized in that: The inclination angle of the electroformed anode plate (22) is θ, and 0°<θ≤90°.
6. A rotary electroforming device according to claim 5, characterized in that: After the electroforming frame (16) enters the electroforming device (20), the plug plate (162) on the electroforming frame (16) is parallel to the electroforming anode plate (22).
7. A rotary electroforming device according to claim 6, characterized in that: The liquid supply device (30) comprises a liquid extraction pipe (31) installed on the electroforming cell (40), a water pump (32) connected to the liquid extraction pipe (31), a liquid infusion pipe (33) installed on the water pump (32), and an inclined pipe (34) arranged at the end of the liquid infusion pipe (33); the inclined pipe (34) is arranged between the plug plate (162) and the electroforming anode plate (22), and is arranged parallel to the electroforming anode plate (22).
8. A rotary electroforming device according to claim 1, characterized in that: The reflux device (50) comprises a liquid inlet pipe (51) installed on the electroforming device (20), a controller (52) connected to the liquid inlet pipe (51), and a liquid outlet pipe (53) installed on the controller (52); the reflux device (50) is connected to the electroforming cell (40) via the liquid outlet pipe (53).