An ultrasonic sensor and its control method, and electronic equipment

Abstract

This invention discloses an ultrasonic sensor and its control method and electronic device. The ultrasonic sensor includes: a first transmitting probe, a second transmitting probe, a first receiving probe, a second receiving probe, and a microprocessor. The microprocessor sends a square wave signal to the first and second transmitting probes. The first transmitting probe generates a first ultrasonic signal based on the square wave signal, and the second transmitting probe generates a second ultrasonic signal based on the square wave signal. The first receiving probe receives the first ultrasonic signal and generates a first echo signal based on the first ultrasonic signal, which is then sent to the microprocessor. The second receiving probe receives the second ultrasonic signal and generates a second echo signal based on the second ultrasonic signal, which is then sent to the microprocessor. The microprocessor calculates the flow rate, temperature, and number of bubbles in the fluid. The ultrasonic sensor provided by this invention can simultaneously detect multiple parameters of a fluid, such as flow rate, temperature, and number of bubbles.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and in particular to an ultrasonic sensor and its control method and electronic equipment. Background Technology

[0002] An ultrasonic sensor is a sensor that utilizes the properties of ultrasonic waves for detection. It is widely used in industries such as manufacturing, medicine, and automotive. Its working principle involves emitting ultrasonic signals and detecting parameters such as the position, distance, velocity, thickness, and density of the object being measured based on information such as the reflection, attenuation, and Doppler effect of the ultrasonic signals.

[0003] Existing ultrasonic sensors require multiple sensors to be integrated inside the pipe for fluid parameter detection, necessitating pipe demolition for installation. This makes the sensors more susceptible to wear and corrosion, reducing their lifespan. Furthermore, existing ultrasonic sensors can only detect one parameter, such as flow rate, temperature, or bubbles. Measuring multiple parameters requires multiple sensors, leading to high costs and complex installation. Summary of the Invention

[0004] This invention provides an ultrasonic sensor and its control method and electronic device to solve the problems of existing ultrasonic sensors being susceptible to environmental influences and only being able to detect a single parameter.

[0005] In a first aspect, the present invention provides an ultrasonic sensor, which includes: a first transmitting probe, a second transmitting probe, a first receiving probe, a second receiving probe, and a microprocessor;

[0006] The first transmitting probe and the first receiving probe are inclined and opposite to each other on both sides of the pipe through which the fluid flows, and the second transmitting probe and the second receiving probe are inclined and opposite to each other on both sides of the pipe; the first transmitting probe and the second receiving probe are spaced apart on one side of the pipe, and the first receiving probe and the second transmitting probe are spaced apart on the other side of the pipe.

[0007] The first transmitting probe, the second transmitting probe, the first receiving probe, and the second receiving probe are all connected to the microprocessor. The microprocessor sends a square wave signal to the first transmitting probe and the second transmitting probe. The first transmitting probe generates a first ultrasonic signal based on the square wave signal, and the second transmitting probe generates a second ultrasonic signal based on the square wave signal. The first receiving probe receives the first ultrasonic signal and generates a first echo signal based on the first ultrasonic signal, which is then sent to the microprocessor. The second receiving probe receives the second ultrasonic signal and generates a second echo signal based on the second ultrasonic signal, which is then sent to the microprocessor. The microprocessor calculates the flow rate, temperature, and number of bubbles in the fluid.

[0008] Optionally, the first transmitting probe includes: a first inverter, a second inverter, a third inverter, a fourth inverter, a fifth inverter, a first resistor, a second resistor, and a first transmitting transducer;

[0009] The input terminals of the first inverter, the second inverter, and the third inverter are all connected to the microprocessor. The output terminal of the first inverter is connected to the input terminals of the fourth inverter and the fifth inverter. The output terminals of the fourth inverter and the fifth inverter are both connected to the first electrode of the first transmitting transducer. The first resistor is connected between the first electrode of the first transmitting transducer and the first power supply.

[0010] The output terminals of the second inverter and the third inverter are both connected to the second electrode of the first transmitting transducer. The second resistor is connected between the second electrode of the first transmitting transducer and the first power supply. The first transmitting transducer is used to transmit the first ultrasonic signal.

[0011] Optionally, the second transmitting probe includes: a sixth inverter, a seventh inverter, an eighth inverter, a ninth inverter, a tenth inverter, a third resistor, a fourth resistor, and a second transmitting transducer;

[0012] The input terminals of the sixth, seventh, and eighth inverters are all connected to the microprocessor. The output terminal of the sixth inverter is connected to the input terminals of the ninth and tenth inverters. The output terminals of the ninth and tenth inverters are both connected to the first electrode of the second transmitting transducer. The third resistor is connected between the first electrode of the second transmitting transducer and the first power supply.

[0013] The output terminals of the seventh inverter and the eighth inverter are both connected to the second electrode of the second transmitting transducer. The fourth resistor is connected between the second electrode of the second transmitting transducer and the first power supply. The second transmitting transducer is used to transmit the second ultrasonic signal.

[0014] Optionally, the first receiving probe includes: a fifth resistor, a sixth resistor, a seventh resistor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a first receiving chip, and a first receiving transducer;

[0015] The first receiving transducer is used to receive the first ultrasonic signal. The first electrode of the first receiving transducer is connected to the first pin of the first receiving chip, and the second electrode of the first receiving transducer is grounded. The first capacitor is connected between the first pin of the first receiving chip and ground, and the second capacitor is connected between the sixth pin of the first receiving chip and ground. The fourth pin of the first receiving chip is grounded.

[0016] The third capacitor is connected between the third pin of the first receiving chip and ground; the fourth capacitor is connected between the first end of the fifth resistor and ground; the second end of the fifth resistor is connected to the second pin of the first receiving chip; the sixth resistor is connected between the seventh pin of the first receiving chip and the second power supply; the seventh resistor is connected between the eighth pin and the fifth pin of the first receiving chip; the seventh pin of the first receiving chip is used to output the first echo signal.

[0017] Optionally, the first receiving chip includes the CX20106 chip.

[0018] Optionally, the second receiving probe includes: an eighth resistor, a ninth resistor, a tenth resistor, a fifth capacitor, a sixth capacitor, a seventh capacitor, an eighth capacitor, a second receiving chip, and a second receiving transducer;

[0019] The second receiving transducer is used to receive the second ultrasonic signal. The first electrode of the second receiving transducer is connected to the first pin of the second receiving chip, and the second electrode of the second receiving transducer is grounded. The fifth capacitor is connected between the first pin of the second receiving chip and ground, and the sixth capacitor is connected between the sixth pin of the second receiving chip and ground. The fourth pin of the second receiving chip is grounded.

[0020] The seventh capacitor is connected between the third pin of the second receiving chip and ground; the eighth capacitor is connected between the first end of the eighth resistor and ground; the second end of the eighth resistor is connected to the second pin of the second receiving chip; the ninth resistor is connected between the seventh pin of the second receiving chip and the second power supply; and the tenth resistor is connected between the eighth pin and the fifth pin of the second receiving chip. The seventh pin of the second receiving chip is used to output the second echo signal.

[0021] Optionally, the second receiving chip includes the CX20106 chip.

[0022] Optionally, the ultrasonic sensor may also include: a display device;

[0023] The display device is connected to the microprocessor and is used to display data on the flow rate, temperature, and number of bubbles of the fluid calculated by the microprocessor.

[0024] Secondly, the present invention provides a control method for an ultrasonic sensor, wherein the control method is applied to an ultrasonic sensor, the ultrasonic sensor including a first transmitting probe, a second transmitting probe, a first receiving probe, a second receiving probe, and a microprocessor; the first transmitting probe and the first receiving probe are inclined and oppositely disposed on both sides of a pipe through which fluid flows, and the second transmitting probe and the second receiving probe are inclined and oppositely disposed on both sides of the pipe; the first transmitting probe and the second receiving probe are spaced apart on one side of the pipe, and the first receiving probe and the second transmitting probe are spaced apart on the other side of the pipe; the first transmitting probe, the second transmitting probe, the first receiving probe, and the second receiving probe are all connected to the microprocessor;

[0025] Control methods include:

[0026] The microprocessor sends a square wave signal to the first and second transmitting probes;

[0027] The first transmitting probe generates a first ultrasonic signal based on the square wave signal, and the second transmitting probe generates a second ultrasonic signal based on the square wave signal.

[0028] The first receiving probe receives the first ultrasonic signal and generates a first echo signal based on the first ultrasonic signal, which is then sent to the microprocessor. The second receiving probe receives the second ultrasonic signal and generates a second echo signal based on the second ultrasonic signal, which is then sent to the microprocessor.

[0029] The microprocessor calculates the flow rate, temperature, and number of bubbles in the fluid.

[0030] Thirdly, the present invention provides an electronic device, wherein the electronic device includes the ultrasonic sensor provided in the first aspect above.

[0031] The technical solution of this invention uses an external clamp-on ultrasonic sensor. This eliminates the need for integration inside the pipe, avoiding any damage to the pipe. The probe is simply clamped to the pipe's periphery, protecting the sensor from fluid abrasion and corrosion, allowing for long-term stable operation and significantly extending its lifespan. Furthermore, the ultrasonic sensor provided by this invention can simultaneously detect multiple parameters such as fluid flow rate, temperature, and bubble count, simplifying the measurement system, reducing costs, and facilitating installation. The external clamp-on ultrasonic sensor can be applied to TOC analyzers. Since magnetic levitation pumps have high requirements for medium temperature and bubble conditions, the ultrasonic sensor provided by this invention can detect multiple fluid parameters. The operating status of the external magnetic levitation pump provides supporting information and can serve as an input to limit the pump's operation, ensuring the overall safe and reliable operation of the TOC analyzer.

[0032] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the structure of an ultrasonic sensor provided in an embodiment of the present invention;

[0035] Figure 2 This is a waveform diagram of a square wave signal, a first echo signal, and a second echo signal provided in an embodiment of the present invention;

[0036] Figure 3 This is a schematic diagram of the connection between a first transmitting probe and a microprocessor provided in an embodiment of the present invention;

[0037] Figure 4 This is a schematic diagram of the connection between a second transmitting probe and a microprocessor provided in an embodiment of the present invention;

[0038] Figure 5 This is a schematic diagram of the connection between a first receiving probe and a microprocessor provided in an embodiment of the present invention;

[0039] Figure 6 This is a schematic diagram of the connection between a second receiving probe and a microprocessor provided in an embodiment of the present invention;

[0040] Figure 7 This is a schematic diagram of another ultrasonic sensor provided in an embodiment of the present invention;

[0041] Figure 8 This is a flowchart of a control method for an ultrasonic sensor provided in an embodiment of the present invention;

[0042] Figure 9 A schematic diagram of an electronic device that can be used to implement embodiments of the present invention is shown. Detailed Implementation

[0043] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0044] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0045] Figure 1 This is a schematic diagram of the structure of an ultrasonic sensor provided in an embodiment of the present invention, as shown below. Figure 1 As shown, the ultrasonic sensor includes: a first transmitting probe 1, a second transmitting probe 2, a first receiving probe 3, a second receiving probe 4, and a microprocessor 5. The first transmitting probe 1 and the first receiving probe 3 are inclined and opposite to each other on both sides of the pipe 20 through which the fluid flows. The second transmitting probe 2 and the second receiving probe 4 are also inclined and opposite to each other on both sides of the pipe 20. The first transmitting probe 1 and the second receiving probe 4 are spaced apart on one side of the pipe 20, and the first receiving probe 3 and the second transmitting probe 2 are spaced apart on the other side of the pipe 20. All three transmitters are connected to the microprocessor 5. The microprocessor 5 sends a square wave signal TRIG to the first transmitting probe 1 and the second transmitting probe 2. The first transmitting probe 1 generates a first ultrasonic signal based on the square wave signal TRIG, and the second transmitting probe 2 generates a second ultrasonic signal based on the square wave signal TRIG. The first receiving probe 3 receives the first ultrasonic signal and generates a first echo signal ECHO1 based on the first ultrasonic signal, which is then sent to the microprocessor 5. The second receiving probe 4 receives the second ultrasonic signal and generates a second echo signal ECHO2 based on the second ultrasonic signal, which is then sent to the microprocessor 5. The microprocessor 5 is used to calculate the flow rate, temperature, and number of bubbles in the fluid.

[0046] Specifically, the ultrasonic sensor provided in this embodiment of the invention is an external clamp-on ultrasonic sensor, which is clamped onto the pipe 20 through which the fluid flows. The external clamp-on ultrasonic sensor includes two transmitting probes, two receiving probes, and a microprocessor 5. The first transmitting probe 1 and the first receiving probe 3 are tilted relative to each other, with an angle θ between them and the pipe 20. The second transmitting probe 2 and the second receiving probe 4 are also tilted relative to each other, with an angle θ between them and the pipe 20.

[0047] Figure 2 This is a waveform diagram of a square wave signal, a first echo signal, and a second echo signal provided in an embodiment of the present invention, as shown below. Figure 1 and Figure 2 As shown, microprocessor 5 outputs a square wave signal TRIG to the first transmitting probe 1 and the second transmitting probe 2. The first transmitting probe 1 processes the square wave signal TRIG and outputs a first ultrasonic signal. The first ultrasonic signal passes through the pipe wall of pipe 20 and the fluid inside pipe 20, interacting with the fluid and pipe wall. The first receiving probe 3 receives the first ultrasonic signal, amplifies, filters, integrates, compares, and shapes it, and then outputs a first echo signal ECHO1 to microprocessor 5. Similarly, the second transmitting probe 2 processes the square wave signal TRIG and outputs a second ultrasonic signal. The second ultrasonic signal passes through the pipe wall of pipe 20 and the fluid inside pipe 20, interacting with the fluid and pipe wall. The second receiving probe 4 receives the second ultrasonic signal, amplifies, filters, integrates, compares, and shapes it, and then outputs a second echo signal ECHO2 to microprocessor 5.

[0048] Microprocessor 5 calculates the time difference t1 between sending the square wave signal TRIG and receiving the first echo signal ECHO1, and the time difference t2 between sending the square wave signal TRIG and receiving the second echo signal ECHO2. The fluid flow direction within pipe 20 is... Figure 1 When the middle arrow indicates the direction, t2 is greater than t1, and the fluid flow direction within pipe 20 is the same as... Figure 1 When the directions indicated by the middle arrows are opposite, t2 is less than t1. Microprocessor 5 calculates the transmission time t0 of the first and second ultrasonic signals in the pipe wall of pipe 20 as:

[0049]

[0050] Where d is the thickness of the pipe wall, and c0 is the transmission speed of the first and second ultrasonic waves in the pipe wall.

[0051] The microprocessor 5 calculates the fluid velocity v based on the transmission time t0 of the first and second ultrasonic signals in the pipe wall of the pipe 20, the time difference t1 between sending the square wave signal TRIG and receiving the first echo signal ECHO1, and the time difference t2 between sending the square wave signal TRIG and receiving the second echo signal ECHO2.

[0052]

[0053] Where L is the inner diameter of pipe 20.

[0054] The microprocessor 5 can calculate the flow rate of the fluid based on the fluid velocity v and the cross-sectional area of ​​the pipe 20. The microprocessor 5 also calculates the transmission velocity c of the ultrasonic wave in the fluid when the fluid is stationary based on the transmission time t0 of the first and second ultrasonic signals in the pipe wall of the pipe 20, the time difference t1 between transmitting the square wave signal TRIG and receiving the first echo signal ECHO1, and the time difference t2 between transmitting the square wave signal TRIG and receiving the second echo signal ECHO2.

[0055]

[0056] Microprocessor 5 then combines the relationship between temperature and ultrasonic transmission speed:

[0057] c=1468+3.68*(T-10)-0.0279(T-10) 2

[0058] The microprocessor 5 can calculate the fluid temperature T based on the transmission speed c of ultrasonic waves in the fluid when the fluid is stationary.

[0059] The microprocessor 5 can detect the number of bubbles in the fluid based on the changes in amplitude and waveform of the received first echo signal ECHO1 and second echo signal ECHO2.

[0060] With the development of industrial automation and intelligence, higher demands are placed on the real-time performance and multi-parameter monitoring capabilities of fluid monitoring. The clamp-on ultrasonic sensor provided in this invention, as a non-contact sensor, can monitor various parameters of the fluid medium, such as temperature, flow rate, liquid level, and concentration. Applying the clamp-on ultrasonic sensor to a Total Organic Carbon (TOC) analyzer enables multi-parameter detection of the outlet medium characteristics of the magnetic levitation pump in the TOC analyzer, improving detection efficiency and accuracy, and providing diagnostic information for the operating status of the magnetic levitation pump in the TOC analyzer.

[0061] The technical solution of this invention uses an external clamp-on ultrasonic sensor. This eliminates the need for integration inside the pipe, avoiding any damage to the pipe. The probe is simply clamped to the pipe's periphery, protecting the sensor from fluid abrasion and corrosion, allowing for long-term stable operation and significantly extending its lifespan. Furthermore, the ultrasonic sensor provided by this invention can simultaneously detect multiple parameters such as fluid flow rate, temperature, and bubble count, simplifying the measurement system, reducing costs, and facilitating installation. The external clamp-on ultrasonic sensor can be applied to TOC analyzers. Since magnetic levitation pumps have high requirements for medium temperature and bubble conditions, the ultrasonic sensor provided by this invention can detect multiple fluid parameters. The operating status of the external magnetic levitation pump provides supporting information and can serve as an input to limit the pump's operation, ensuring the overall safe and reliable operation of the TOC analyzer.

[0062] Optionally, based on the above embodiments, Figure 3 This is a schematic diagram of the structure connecting a first transmitting probe and a microprocessor according to an embodiment of the present invention, as shown below. Figure 3 As shown, the first transmitting probe 1 includes: a first inverter N1, a second inverter N2, a third inverter N3, a fourth inverter N4, a fifth inverter N5, a first resistor R1, a second resistor R2, and a first transmitting transducer Tr1. The input terminals of the first inverter N1, the second inverter N2, and the third inverter N3 are all connected to the microprocessor 5. The output terminal of the first inverter N1 is connected to the input terminals of the fourth inverter N4 and the fifth inverter N5. The output terminals of the fourth inverter N4 and the fifth inverter N5 are both connected to the first electrode of the first transmitting transducer Tr1. The first resistor R1 is connected between the first electrode of the first transmitting transducer Tr1 and the first power supply V1. The output terminals of the second inverter N2 and the third inverter N3 are both connected to the second electrode of the first transmitting transducer Tr1. The second resistor R2 is connected between the second electrode of the first transmitting transducer Tr1 and the first power supply V1. The first transmitting transducer Tr1 is used to transmit a first ultrasonic signal.

[0063] Specifically, the first transmitting probe 1 can consist of five inverters, two resistors, and one transmitting transducer. All five inverters can use 74LS04 chips, the resistance of the first resistor R1 and the second resistor R2 can be 1kΩ, and the voltage of the first power supply V1 can be 3.3V. The I / O port of the microprocessor 5 can output a 40kHz square wave signal TRIG. The square wave signal TRIG is sent to the second electrode of the first transmitting transducer Tr1 via a first-stage inverter consisting of the second inverter N2 or the third inverter N3. The square wave signal TRIG is also sent to the first electrode of the first transmitting transducer Tr1 via a two-stage inverter consisting of the first inverter N1 and either the fourth inverter N4 or the fifth inverter N5. This push-pull connection method applies the square wave signal TRIG to both ends of the first transmitting transducer Tr1, which can improve the transmission intensity of the first ultrasonic signal. The fourth inverter N4 and the fifth inverter N5 are connected in parallel, and the second inverter N2 and the third inverter N3 are connected in parallel, which can improve the driving capability. The first pull-up resistor R1 and the second pull-up resistor R2 can improve the driving capability of the inverter output high level on the one hand, and increase the damping effect of the first transmitting transducer Tr1 on the other hand, shortening its free oscillation time.

[0064] Optionally, based on the above embodiments, Figure 4 This is a schematic diagram of the connection between a second transmitting probe and a microprocessor provided in an embodiment of the present invention, as shown below. Figure 4 As shown, the second transmitting probe 2 includes: a sixth inverter N6, a seventh inverter N7, an eighth inverter N8, a ninth inverter N9, a tenth inverter N10, a third resistor R3, a fourth resistor R4, and a second transmitting transducer Tr2. The input terminals of the sixth inverter N6, the seventh inverter N7, and the eighth inverter N8 are all connected to the microprocessor 5. The output terminal of the sixth inverter N6 is connected to the input terminals of the ninth inverter N9 and the tenth inverter N10. The output terminals of the ninth inverter N9 and the tenth inverter N10 are both connected to the first electrode of the second transmitting transducer Tr2. The third resistor R3 is connected between the first electrode of the second transmitting transducer Tr2 and the first power supply V1. The output terminals of the seventh inverter N7 and the eighth inverter N8 are both connected to the second electrode of the second transmitting transducer Tr2. The fourth resistor R4 is connected between the second electrode of the second transmitting transducer Tr2 and the first power supply V1. The second transmitting transducer Tr2 is used to transmit a second ultrasonic signal.

[0065] Specifically, the second transmitting probe 2 can consist of five inverters, two resistors, and one transmitting transducer. All five inverters can use 74LS04 chips, the resistance values ​​of the third resistor R3 and the fourth resistor R4 can be 1kΩ, and the voltage of the first power supply V1 can be 3.3V. The I / O port of the microprocessor 5 can output a 40kHz square wave signal TRIG. The square wave signal TRIG is sent to the second electrode of the second transmitting transducer Tr2 via a first-stage inverter consisting of the seventh inverter N7 or the eighth inverter N8. The square wave signal TRIG is also sent to the first electrode of the second transmitting transducer Tr2 via a two-stage inverter consisting of the sixth inverter N6 and the ninth inverter N9 or the tenth inverter N10. This push-pull connection method applies the square wave signal TRIG to both ends of the second transmitting transducer Tr2, which can improve the transmission intensity of the second ultrasonic signal. The ninth inverter N9 and the tenth inverter N10 are connected in parallel, and the seventh inverter N7 and the eighth inverter N8 are connected in parallel, which can improve the driving capability. The pull-up resistors R3 and R4 can improve the driving capability of the inverter output high level, and also increase the damping effect of the second transmitting transducer Tr2, shortening its free oscillation time.

[0066] Optionally, based on the above embodiments, Figure 5 This is a schematic diagram of the structure connecting a first receiving probe and a microprocessor according to an embodiment of the present invention, as shown below. Figure 5 As shown, the first receiving probe 3 includes: a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, a first receiving chip U1, and a first receiving transducer Re1. The first receiving transducer Re1 receives the first ultrasonic signal. The first electrode of the first receiving transducer Re1 is connected to the first pin of the first receiving chip U1, and the second electrode of the first receiving transducer Re1 is grounded to GND. The first capacitor C1 is connected between the first pin of the first receiving chip U1 and ground GND. The second capacitor C2 is connected between the sixth pin of the first receiving chip U1 and ground GND; the fourth pin of the first receiving chip U1 is grounded to GND. The third capacitor C3 is connected between the third pin of the first receiving chip U1 and ground GND. The fourth capacitor C4 is connected between the first end of the fifth resistor R5 and ground GND, and the second end of the fifth resistor R5 is connected to the second pin of the first receiving chip U1. The sixth resistor R6 is connected between the seventh pin of the first receiving chip U1 and the second power supply V2, and the seventh resistor R7 is connected between the eighth pin and the fifth pin of the first receiving chip U1. The seventh pin of the first receiving chip U1 is used to output the first echo signal ECHO1.

[0067] Specifically, the first receiving probe 3 can be composed of a first receiving chip U1 and three resistors and four capacitors surrounding it. The resistance values ​​of the fifth resistor R5 and the sixth resistor R6 can be 10kΩ, and the resistance value of the seventh resistor R7 can be 220kΩ. The capacitance value of the first capacitor C1 can be 56nF, the capacitance value of the second capacitor C2 can be 330uF, the capacitance value of the third capacitor C3 can be 3.3uF, and the capacitance value of the fourth capacitor C4 can be 1uF. The first receiving transducer Re1 receives the first ultrasonic signal sent by the first transmitting probe 1 and converts it into an electrical signal, which is output to the first pin of the first receiving chip U1. After amplification, filtering, integration, comparison, and shaping processing inside the first receiving chip U1, the seventh pin of the first receiving chip U1 outputs the first echo signal ECHO1 to the microprocessor 5 for processing. When the first echo signal ECHO1 is high, it indicates that no first ultrasonic signal has been received. When the first ultrasonic signal is received, the first echo signal ECHO1 generates a falling edge. If the first ultrasonic signal is continuously received, the first echo signal ECHO1 is a periodic pulse wave.

[0068] Optional, continue to refer to Figure 5 The first receiving chip U1 includes the CX20106 chip.

[0069] Specifically, the first receiving chip U1 can be a CX20106 chip. The first pin of the first receiving chip U1 corresponds to the first pin of the CX20106 chip, the second pin of the first receiving chip U1 corresponds to the second pin of the CX20106 chip, the third pin of the first receiving chip U1 corresponds to the third pin of the CX20106 chip, the fourth pin of the first receiving chip U1 corresponds to the fourth pin of the CX20106 chip, the fifth pin of the first receiving chip U1 corresponds to the fifth pin of the CX20106 chip, the sixth pin of the first receiving chip U1 corresponds to the sixth pin of the CX20106 chip, the seventh pin of the first receiving chip U1 corresponds to the seventh pin of the CX20106 chip, and the eighth pin of the first receiving chip U1 corresponds to the eighth pin of the CX20106 chip.

[0070] Optionally, based on the above embodiments, Figure 6 This is a schematic diagram of the connection between a second receiving probe and a microprocessor provided in an embodiment of the present invention, as shown below. Figure 6As shown, the second receiving probe 4 includes: an eighth resistor R8, a ninth resistor R9, a tenth resistor R10, a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, an eighth capacitor C8, a second receiving chip U2, and a second receiving transducer Re2. The second receiving transducer Re2 receives the second ultrasonic signal. The first electrode of the second receiving transducer Re2 is connected to the first pin of the second receiving chip U2, and the second electrode of the second receiving transducer Re2 is grounded (GND). The fifth capacitor C5 is connected between the first pin of the second receiving chip U2 and ground (GND), and the sixth capacitor C6 is connected between the sixth pin of the second receiving chip U2 and ground (GND). The fourth pin of the second receiving chip U2 is grounded (GND). The seventh capacitor C7 is connected between the third pin of the second receiving chip U2 and ground (GND), and the eighth capacitor C8 is connected between the first end of the eighth resistor R8 and ground (GND). The second end of the eighth resistor R8 is connected to the second pin of the second receiving chip U2. The ninth resistor R9 is connected between the seventh pin of the second receiver chip U2 and the second power supply V2, and the tenth resistor R10 is connected between the eighth pin and the fifth pin of the second receiver chip U2; the seventh pin of the second receiver chip U2 is used to output the second echo signal.

[0071] Specifically, the second receiving probe 4 can be composed of the second receiving chip U2 and its peripheral components: three resistors and four capacitors. The resistance values ​​of the eighth resistor R8 and the ninth resistor R9 can be 10kΩ, and the resistance value of the tenth resistor R10 can be 220kΩ. The capacitance value of the fifth capacitor C5 can be 56nF, the capacitance value of the sixth capacitor C6 can be 330uF, the capacitance value of the seventh capacitor C7 can be 3.3uF, and the capacitance value of the eighth capacitor C8 can be 1uF. The second receiving transducer Re2 receives the second ultrasonic signal transmitted by the second transmitting probe 2 and converts it into an electrical signal, outputting it to the first pin of the second receiving chip U2. After amplification, filtering, integration, comparison, and shaping within the second receiving chip U2, the seventh pin of the second receiving chip U2 outputs the second echo signal ECHO2 to the microprocessor 5 for processing. When the second echo signal ECHO2 is high, it indicates that no second ultrasonic signal has been received. When the second ultrasonic signal is received, the second echo signal ECHO2 generates a falling edge. If the second ultrasonic signal is continuously received, the second echo signal ECHO2 becomes a periodic pulse wave.

[0072] Optional, continue to refer to Figure 6 The second receiving chip U2 includes the CX20106 chip.

[0073] Specifically, the second receiving chip U2 can be a CX20106 chip. The first pin of the second receiving chip U2 corresponds to the first pin of the CX20106 chip, the second pin of the second receiving chip U2 corresponds to the second pin of the CX20106 chip, the third pin of the second receiving chip U2 corresponds to the third pin of the CX20106 chip, the fourth pin of the second receiving chip U2 corresponds to the fourth pin of the CX20106 chip, the fifth pin of the second receiving chip U2 corresponds to the fifth pin of the CX20106 chip, the sixth pin of the second receiving chip U2 corresponds to the sixth pin of the CX20106 chip, the seventh pin of the second receiving chip U2 corresponds to the seventh pin of the CX20106 chip, and the eighth pin of the second receiving chip U2 corresponds to the eighth pin of the CX20106 chip.

[0074] Optionally, based on the above embodiments, Figure 7 This is a schematic diagram of another ultrasonic sensor provided in an embodiment of the present invention, as shown below. Figure 7 As shown, the ultrasonic sensor also includes a display device 6. The display device 6 is connected to the microprocessor 5 and is used to display data on the flow rate, temperature, and number of bubbles of the fluid calculated by the microprocessor 5.

[0075] Specifically, the parameters such as fluid flow rate, temperature, and number of bubbles calculated by the microprocessor 5 can be displayed on the display device 6, making it easy for staff to understand the various parameters of the fluid in a timely manner.

[0076] Figure 8 This is a flowchart of a control method for an ultrasonic sensor provided in an embodiment of the present invention, wherein the control method is applied to the ultrasonic sensor, such as... Figure 1 As shown, the ultrasonic sensor includes a first transmitting probe 1, a second transmitting probe 2, a first receiving probe 3, a second receiving probe 4, and a microprocessor 5. The first transmitting probe 1 and the first receiving probe 3 are inclined and opposite to each other on both sides of the pipe 20 through which the fluid flows. The second transmitting probe 2 and the second receiving probe 4 are also inclined and opposite to each other on both sides of the pipe 20. The first transmitting probe 1 and the second receiving probe 4 are spaced apart on one side of the pipe 20, and the first receiving probe 3 and the second transmitting probe 2 are spaced apart on the other side of the pipe 20. The first transmitting probe 1, the second transmitting probe 2, the first receiving probe 3, and the second receiving probe 4 are all connected to the microprocessor 5. The control method includes:

[0077] S100: The microprocessor sends a square wave signal to the first and second transmitting probes.

[0078] Specifically, such as Figure 1 and Figure 2As shown, the ultrasonic sensor provided in this embodiment of the invention is an external clamp-on ultrasonic sensor, which is clamped onto the pipe 20 through which the fluid flows. The external clamp-on ultrasonic sensor includes two transmitting probes, two receiving probes, and a microprocessor 5. The first transmitting probe 1 and the first receiving probe 3 are tilted relative to each other, forming an angle θ with the pipe 20. The second transmitting probe 2 and the second receiving probe 4 are also tilted relative to each other, forming an angle θ with the pipe 20. The microprocessor 5 outputs a square wave signal TRIG to the first transmitting probe 1 and the second transmitting probe 2.

[0079] S110: The first transmitting probe generates a first ultrasonic signal based on the square wave signal, and the second transmitting probe generates a second ultrasonic signal based on the square wave signal.

[0080] Specifically, such as Figure 1 As shown, the first transmitting probe 1 processes the square wave signal TRIG and outputs a first ultrasonic signal, and the second transmitting probe 2 processes the square wave signal TRIG and outputs a second ultrasonic signal.

[0081] S120: The first receiving probe receives the first ultrasonic signal and generates a first echo signal to the microprocessor based on the first ultrasonic signal; the second receiving probe receives the second ultrasonic signal and generates a second echo signal to the microprocessor based on the second ultrasonic signal.

[0082] Specifically, such as Figure 1 and Figure 2 As shown, the first ultrasonic signal passes through the pipe wall of pipe 20 and the fluid inside pipe 20, interacting with the fluid and pipe wall. The first receiving probe 3 receives the first ultrasonic signal, amplifies, filters, integrates, compares, and shapes the first ultrasonic signal, and then outputs the first echo signal ECHO1 to the microprocessor 5. The second ultrasonic signal passes through the pipe wall of pipe 20 and the fluid inside pipe 20, interacting with the fluid and pipe wall. The second receiving probe 4 receives the second ultrasonic signal, amplifies, filters, integrates, compares, and shapes the second ultrasonic signal, and then outputs the second echo signal ECHO2 to the microprocessor 5.

[0083] S130: Microprocessor calculates fluid flow rate, temperature, and bubbles.

[0084] Specifically, such as Figure 1 and Figure 2 As shown, microprocessor 5 calculates the time difference between sending the square wave signal TRIG and receiving the first echo signal ECHO1 as t1, and the time difference between sending the square wave signal TRIG and receiving the second echo signal ECHO2 as t2. The fluid flow direction within pipe 20 is... Figure 1 When the middle arrow indicates the direction, t2 is greater than t1, and the fluid flow direction within pipe 20 is the same as... Figure 1 When the directions indicated by the middle arrows are opposite, t2 is less than t1. Microprocessor 5 calculates the transmission time t0 of the first and second ultrasonic signals in the pipe wall of pipe 20 as:

[0085]

[0086] Where d is the thickness of the pipe wall, and c0 is the transmission speed of the first and second ultrasonic waves in the pipe wall.

[0087] The microprocessor 5 calculates the fluid velocity v based on the transmission time t0 of the first and second ultrasonic signals in the pipe wall of the pipe 20, the time difference t1 between sending the square wave signal TRIG and receiving the first echo signal ECHO1, and the time difference t2 between sending the square wave signal TRIG and receiving the second echo signal ECHO2.

[0088]

[0089] Where L is the inner diameter of pipe 20.

[0090] The microprocessor 5 can calculate the flow rate of the fluid based on the fluid velocity v and the cross-sectional area of ​​the pipe 20. The microprocessor 5 also calculates the transmission velocity c of the ultrasonic wave in the fluid when the fluid is stationary based on the transmission time t0 of the first and second ultrasonic signals in the pipe wall of the pipe 20, the time difference t1 between transmitting the square wave signal TRIG and receiving the first echo signal ECHO1, and the time difference t2 between transmitting the square wave signal TRIG and receiving the second echo signal ECHO2.

[0091]

[0092] Microprocessor 5 then combines the relationship between temperature and ultrasonic transmission speed:

[0093] c=1468+3.68*(T-10)-0.0279(T-10) 2

[0094] The microprocessor 5 can calculate the fluid temperature T based on the transmission speed c of ultrasonic waves in the fluid when the fluid is stationary.

[0095] The microprocessor 5 can detect the number of bubbles in the fluid based on the changes in amplitude and waveform of the received first echo signal ECHO1 and second echo signal ECHO2.

[0096] This invention provides an electronic device. Figure 9A schematic diagram of an electronic device 10 that can be used to implement embodiments of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0097] like Figure 9 As shown, the electronic device 10 includes at least one microprocessor 5 and a memory, such as a read-only memory (ROM) 12 or a random access memory (RAM) 13, communicatively connected to the at least one microprocessor 5. It also includes a first transmitting probe 1, a second transmitting probe 2, a first receiving probe 3, and a second receiving probe 4. The first transmitting probe 1, the second transmitting probe 2, the first receiving probe 3, and the second receiving probe 4 are communicatively connected to the microprocessor 5 via a bus 14. The first transmitting probe 1 and the second transmitting probe 2 receive square wave signals transmitted by the microprocessor 5, and the microprocessor 5 receives first echo signals and second echo signals generated by the first receiving probe 3 and the second receiving probe 4. The memory stores a computer program executable by the at least one microprocessor 5. The microprocessor 5 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 into the random access memory (RAM) 13. The RAM 13 can also store various programs and data required for the operation of the electronic device 10. The microprocessor 5, the ROM 12, and the RAM 13 are interconnected via the bus 14. Input / output (I / O) interface 15 is also connected to bus 14.

[0098] Multiple components in electronic device 10 are connected to I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of displays, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0099] The microprocessor 5 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the microprocessor 5 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The microprocessor 5 performs the various methods and processes described above, such as the control methods for ultrasonic sensors.

[0100] In some embodiments, the control method for the ultrasonic sensor may be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program may be loaded into and / or mounted on electronic device 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by microprocessor 5, one or more steps of the control method for the ultrasonic sensor described above may be performed. Alternatively, in other embodiments, microprocessor 5 may be configured to perform the control method for the ultrasonic sensor by any other suitable means (e.g., by means of firmware).

[0101] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0102] Computer programs used to implement the methods of the present invention can be written in any combination of one or more programming languages. These computer programs can be provided to the processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the microprocessor 5, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer programs can be executed entirely on the machine, partially on the machine, as a standalone software package partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0103] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0104] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0105] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or computing systems that include middleware components (e.g., application servers), or computing systems that include frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0106] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0107] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0108] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. An ultrasonic sensor, characterized by, The application relates to a flowmeter for measuring the flow rate, temperature and bubble quantity of fluid. The first transmitting probe, the second transmitting probe, the first receiving probe, the second receiving probe and the microprocessor are arranged on the two sides of a pipeline through which the fluid flows. The first transmitting probe and the first receiving probe are arranged on the two sides of the pipeline, and the second transmitting probe and the second receiving probe are arranged on the two sides of the pipeline. The first transmitting probe, the second transmitting probe, the first receiving probe and the second receiving probe are connected with the microprocessor. The microprocessor sends a square wave signal to the first transmitting probe and the second transmitting probe. ； The first transmitting probe generates a first ultrasonic wave signal according to the square wave signal. The first receiving probe receives the first ultrasonic wave signal and generates a first echo signal to the microprocessor according to the first ultrasonic wave signal. ； The second receiving probe receives the second ultrasonic wave signal and generates a second echo signal to the microprocessor according to the second ultrasonic wave signal. The microprocessor calculates the flow rate, temperature and bubble quantity of the fluid. ； ； The flow rate of the fluid is calculated according to the flow velocity and the cross-sectional area of the pipeline. The flow velocity of the fluid is calculated according to the following formula:

2. The ultrasonic sensor of claim 1, wherein The transmission time of the first ultrasonic wave signal and the second ultrasonic wave signal in the pipeline wall is calculated according to the following formula: The temperature of the fluid is calculated according to the following formula: The microprocessor detects the bubble quantity in the fluid according to the amplitude and waveform change of the received first echo signal and second echo signal. The first transmitting probe comprises a first inverter, a second inverter, a third inverter, a fourth inverter, a fifth inverter, a first resistor, a second resistor and a first transmitting transducer. The input ends of the first inverter, the second inverter and the third inverter are connected with the microprocessor. The output end of the first inverter is connected with the input ends of the fourth inverter and the fifth inverter. The output ends of the fourth inverter and the fifth inverter are connected with the first electrode of the first transmitting transducer. The first resistor is connected between the first electrode of the first transmitting transducer and a first power supply. The output end of the second inverter and the output end of the third inverter are connected with the second electrode of the first transmitting transducer, and the second resistor is connected between the second electrode of the first transmitting transducer and the first power supply; and the first transmitting transducer is used for transmitting the first ultrasonic signal.

3. The ultrasonic sensor of claim 1, wherein, The second transmitting probe comprises a sixth inverter, a seventh inverter, an eighth inverter, a ninth inverter, a tenth inverter, a third resistor, a fourth resistor and a second transmitting transducer. The input end of the sixth inverter, the input end of the seventh inverter and the input end of the eighth inverter are connected with the microprocessor, the output end of the sixth inverter is connected with the input end of the ninth inverter and the input end of the tenth inverter, the output end of the ninth inverter and the output end of the tenth inverter are connected with the first electrode of the second transmitting transducer, and the third resistor is connected between the first electrode of the second transmitting transducer and the first power supply. The output end of the seventh inverter and the output end of the eighth inverter are connected with the second electrode of the second transmitting transducer, the fourth resistor is connected between the second electrode of the second transmitting transducer and the first power supply, and the second transmitting transducer is used for transmitting the second ultrasonic signal.

4. The ultrasonic sensor of claim 1, wherein, The first receiving probe comprises a fifth resistor, a sixth resistor, a seventh resistor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a first receiving chip and a first receiving transducer. The first receiving transducer is used for receiving the first ultrasonic signal, the first electrode of the first receiving transducer is connected with the first pin of the first receiving chip, and the second electrode of the first receiving transducer is grounded; the first capacitor is connected between the first pin of the first receiving chip and the ground, and the second capacitor is connected between the sixth pin of the first receiving chip and the ground; the fourth pin of the first receiving chip is grounded. The third capacitor is connected between the third pin of the first receiving chip and the ground, the fourth capacitor is connected between the first end of the fifth resistor and the ground, the second end of the fifth resistor is connected with the second pin of the first receiving chip; the sixth resistor is connected between the seventh pin of the first receiving chip and the second power supply, and the seventh resistor is connected between the eighth pin and the fifth pin of the first receiving chip; and the seventh pin of the first receiving chip is used for outputting the first echo signal.

5. The ultrasonic sensor of claim 4, wherein, The first receiving chip comprises a CX20106 chip.

6. The ultrasonic sensor of claim 1, wherein, The second receiving probe comprises an eighth resistor, a ninth resistor, a tenth resistor, a fifth capacitor, a sixth capacitor, a seventh capacitor, an eighth capacitor, a second receiving chip and a second receiving transducer. The second receiving transducer is used for receiving the second ultrasonic signal, the first electrode of the second receiving transducer is connected with the first pin of the second receiving chip, and the second electrode of the second receiving transducer is grounded; the fifth capacitor is connected between the first pin of the second receiving chip and the ground, and the sixth capacitor is connected between the sixth pin of the second receiving chip and the ground; and the fourth pin of the second receiving chip is grounded. The seventh capacitor is connected between a third pin of the second receiving chip and the ground, the eighth capacitor is connected between a first end of the eighth resistor and the ground, and a second end of the eighth resistor is connected with a second pin of the second receiving chip; the ninth resistor is connected between a seventh pin of the second receiving chip and the second power supply, and the tenth resistor is connected between an eighth pin and a fifth pin of the second receiving chip; the seventh pin of the second receiving chip is used for outputting the second echo signal.

7. The ultrasonic sensor of claim 6, wherein, The second receiving chip comprises a CX20106 chip.

8. The ultrasonic sensor of claim 1, wherein, Further comprising: a display device; the display device is connected with the microprocessor, and the display device is used for displaying data of flow rate, temperature and bubble quantity of the fluid calculated by the microprocessor.

9. A control method of an ultrasonic sensor, characterized by, The control method is applied to the ultrasonic sensor, the ultrasonic sensor comprises a first transmitting probe, a second transmitting probe, a first receiving probe, a second receiving probe and a microprocessor; the first transmitting probe and the first receiving probe are obliquely and oppositely arranged on two sides of a pipeline through which a fluid flows, and the second transmitting probe and the second receiving probe are obliquely and oppositely arranged on two sides of the pipeline; the first transmitting probe and the second receiving probe are spaced apart on one side of the pipeline, and the first receiving probe and the second transmitting probe are spaced apart on the other side of the pipeline; the first transmitting probe, the second transmitting probe, the first receiving probe and the second receiving probe are connected with the microprocessor; The control method comprises: the microprocessor sends a square wave signal to the first transmitting probe and the second transmitting probe; the first transmitting probe generates a first ultrasonic signal according to the square wave signal, and the second transmitting probe generates a second ultrasonic signal according to the square wave signal; the first receiving probe receives the first ultrasonic signal and generates a first echo signal to the microprocessor according to the first ultrasonic signal, and the second receiving probe receives the second ultrasonic signal and generates a second echo signal to the microprocessor according to the second ultrasonic signal; the microprocessor calculates flow rate, temperature and bubble quantity of the fluid; the microprocessor calculates the flow rate of the fluid according to the flow rate of the fluid and the cross-sectional area of the pipeline, and the flow rate of the fluid is calculated according to the following formula: ； wherein, v is the flow rate of the fluid, t1 is the time difference between sending the square wave signal and receiving the first echo signal, t2 is the time difference between sending the square wave signal and receiving the second echo signal, t0 is the transmission time of the first ultrasonic signal and the second ultrasonic signal in the pipe wall of the pipeline, and L is the inner diameter of the pipeline; the transmission time of the first ultrasonic signal and the second ultrasonic signal in the pipe wall of the pipeline is calculated according to the following formula: ； wherein, d is the thickness of the pipe wall, c0 is the transmission speed of the first ultrasonic signal and the second ultrasonic signal in the pipe wall, and θ is the included angle between the first transmitting probe, the first receiving probe, the second transmitting probe, the second receiving probe and the pipeline; the temperature of the fluid is calculated according to the following formula: ； ； wherein, c is the transmission speed of the ultrasonic signal in the fluid when the fluid is at rest, and T is the temperature of the fluid. The microprocessor detects the number of bubbles in the fluid based on the amplitude and waveform variations of the received first echo signal and second echo signal.

10. An electronic device, comprising: An ultrasonic sensor comprising the ultrasonic sensor of any one of claims 1-8.

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