Manufacturing component condition monitoring method, device, storage medium and program product

Abstract

The present invention relates to the technical field of piezoelectric sensors, and discloses a manufacturing component status monitoring method, equipment, storage medium and program product, including: collecting ultrasonic information of piezoelectric sensors during the curing process through ultrasonic sensors; obtaining the final rating of packaging quality according to ultrasonic velocity and curing completion time; determining the initial rating of packaging uniformity according to ultrasonic amplitude and ultrasonic vibration frequency; collecting image information of piezoelectric sensors through image collectors, adjusting the initial rating of packaging uniformity according to the image information, and obtaining the final rating of packaging uniformity; obtaining the comprehensive status evaluation value of the packaging machine after weighted summation of the final rating of packaging quality and the final rating of packaging uniformity, and the comprehensive status evaluation value is used to carry out status warning of the packaging machine. The present invention reduces the reliance on manual inspection, reduces the risk of human error and misjudgment, and improves production efficiency and consistency.

Description

Technical Field

[0001] The present invention relates to the technical field of piezoelectric sensors, and in particular to a method, device, storage medium and program product for monitoring the status of manufacturing components. Background Art

[0002] In the existing technology, the packaging process of piezoelectric sensors usually relies on manual inspection, which is not only inefficient but also easily affected by human factors, resulting in detection errors and quality fluctuations. Existing methods mostly rely on regular sampling and post-quality inspection, which cannot detect potential problems in time, thus affecting production efficiency and product consistency. This situation is particularly prominent in modern manufacturing, which cannot meet the growing market demand and high quality requirements.

[0003] Therefore, how to solve the problems of low efficiency and high error caused by manual inspection in the prior art is a technical problem that needs to be solved urgently. Summary of the invention

[0004] In view of this, the present invention proposes a manufacturing component status monitoring method, device, storage medium and program product, aiming to solve the problems of low efficiency and high error caused by manual inspection in the prior art.

[0005] In a first aspect, the present invention provides a method for monitoring the state of a manufacturing component, comprising:

[0006] After the packaging machine completes packaging of the components to be packaged of the piezoelectric sensor, ultrasonic information of the piezoelectric sensor during the curing process is collected by an ultrasonic sensor; wherein the ultrasonic information includes ultrasonic velocity, ultrasonic amplitude and ultrasonic frequency;

[0007] The curing state of the piezoelectric sensor is determined according to the ultrasonic velocity, an initial rating of the packaging quality is obtained according to the curing state, and the initial rating of the packaging quality is adjusted according to the ultrasonic velocity and the curing completion time to obtain a final rating of the packaging quality;

[0008] Determine the packaging uniformity of the piezoelectric sensor according to the ultrasonic amplitude, and determine the initial packaging uniformity score according to the packaging uniformity and the ultrasonic vibration frequency; collect image information of the piezoelectric sensor through an image collector, and judge whether to adjust the initial packaging uniformity score according to the image information. If it is judged to be adjusted, adjust the initial packaging uniformity score according to the image information to obtain the final packaging uniformity score;

[0009] The weighted sum of the final packaging quality score and the final packaging uniformity score is used to obtain a comprehensive status evaluation value of the packaging machine, which is used to provide status warning for the packaging machine.

[0010] In some embodiments, the curing state is one of a normal state, an over-curing state, and an incomplete curing state, and different curing states correspond to different initial scores of packaging quality; determining the curing state of the piezoelectric sensor according to the ultrasonic velocity, and obtaining the initial score of packaging quality according to the curing state, including:

[0011] If the ultrasonic wave velocity is within the standard ultrasonic wave velocity range, the curing state is determined to be a normal state, and an initial packaging quality score corresponding to the normal state is obtained;

[0012] If the ultrasonic velocity is greater than the maximum value of the standard ultrasonic velocity range, the curing state is determined to be an over-curing state, and an initial packaging quality score corresponding to the over-curing state is obtained;

[0013] If the ultrasonic velocity is less than the minimum value of the standard ultrasonic velocity range, the curing state is determined to be an incomplete curing state, and an initial packaging quality score corresponding to the incomplete curing state is obtained.

[0014] In some embodiments, the initial packaging quality score is adjusted according to the ultrasonic speed and the curing completion time to obtain a final packaging quality score, including:

[0015] Determine the velocity deviation value of the ultrasonic wave of the piezoelectric sensor during the curing process according to the ultrasonic wave velocity; wherein, if the ultrasonic wave velocity is greater than the maximum value of the standard ultrasonic wave velocity range, the velocity deviation value ΔV=ultrasonic wave velocity-maximum value of the standard ultrasonic wave velocity range; if the ultrasonic wave velocity is within the standard ultrasonic wave velocity range, the velocity deviation value ΔV=0; if the ultrasonic wave velocity is less than the minimum value of the standard ultrasonic wave velocity range, the velocity deviation value ΔV=minimum value of the standard ultrasonic wave velocity range-ultrasonic wave velocity;

[0016] Determine the curing time deviation value ΔT based on the standard curing time, ΔT=|curing completion time-standard curing time|;

[0017] The final package quality score is determined by the following formula:

[0018] Q = Q0-k1*ΔV-k2*ΔT;

[0019] In the above formula, Q represents the final packaging quality score, Q0 represents the initial packaging quality score, k1 represents the speed adjustment coefficient, the value range of k1 is 0-1, ΔV represents the speed deviation value, k2 represents the time adjustment coefficient, the value range of k2 is 0-1, and ΔT represents the curing time deviation value.

[0020] In some embodiments, the packaging uniformity is one of packaging uniformity, over-compaction and packaging non-uniformity, and the packaging uniformity of the piezoelectric sensor is determined according to the ultrasonic amplitude, including:

[0021] If the ultrasonic amplitude is within the standard amplitude range, the packaging uniformity of the piezoelectric sensor is determined to be uniform, and the standard amplitude range is determined based on the amplitude characteristics of the historical standard piezoelectric sensor; if the ultrasonic amplitude is greater than the maximum value of the standard amplitude range, the packaging uniformity of the piezoelectric sensor is determined to be over-compacted; if the ultrasonic amplitude is less than the minimum value of the standard amplitude range, the packaging uniformity of the piezoelectric sensor is determined to be uneven.

[0022] In some embodiments, determining the packaging uniformity of the piezoelectric sensor according to the ultrasonic amplitude includes:

[0023] If the ultrasonic amplitude is within the standard amplitude range, the packaging uniformity is determined to be the standard uniformity J0;

[0024] If the ultrasonic amplitude is not within the standard amplitude range, the amplitude deviation value of the ultrasonic amplitude is determined, and the packaging uniformity is determined by the following formula; wherein, if the ultrasonic amplitude is greater than or equal to the maximum value of the standard amplitude range, the amplitude deviation value ΔZ = ultrasonic amplitude - maximum value of the standard amplitude range; if the ultrasonic amplitude is less than the minimum value of the standard amplitude range, the amplitude deviation value ΔZ = minimum value of the standard amplitude range - ultrasonic amplitude;

[0025] J = ΔZ / (Zmax-Zmin);

[0026] In the above formula, J represents packaging uniformity, ΔZ represents amplitude deviation, Zmax represents the maximum value of the standard amplitude range, and Zmin represents the minimum value of the standard amplitude range.

[0027] In some embodiments, determining an initial packaging uniformity score according to packaging uniformity and ultrasonic vibration frequency includes:

[0028] Determine the absolute value of the frequency difference between the ultrasonic vibration frequency and the standard value of the ultrasonic vibration frequency |ΔP|;

[0029] The ultrasonic frequency score is determined according to the absolute value of the frequency difference by the following formula:

[0030] SP = SP0-|ΔP|*k3;

[0031] In the above formula, SP represents the ultrasonic frequency score, SP0 represents the ultrasonic frequency standard score, |ΔP| represents the absolute value of the frequency difference, k3 represents the frequency adjustment coefficient, and the value range of k3 is 0-1;

[0032] The standard uniformity score corresponding to the standard uniformity is adjusted according to the amplitude deviation value through the following formula to obtain the uniformity score:

[0033] SJ=SJ0-ΔZ*k4;

[0034] In the above formula, SJ represents the uniformity score, SJ0 represents the standard uniformity score, ΔZ represents the amplitude deviation value, k4 represents the amplitude adjustment coefficient, and the value range of k4 is 0-1;

[0035] The initial packaging uniformity score is obtained by weighted summing the ultrasonic frequency score and uniformity score using the following formula:

[0036] U0=SP*a+SJ*b;

[0037] In the above formula, U0 represents the initial packaging uniformity score, SP represents the ultrasonic vibration frequency score, a represents the frequency weight coefficient, SJ represents the uniformity score, b represents the uniformity weight coefficient, and a+b=1.

[0038] In some embodiments, collecting image information of the piezoelectric sensor and determining whether to adjust the initial packaging uniformity score according to the image information include:

[0039] Acquire defect features of the piezoelectric sensor in the image information, wherein the defect features include protrusions and / or depressions;

[0040] The total number of protrusions and / or depressions and the total area of ​​the protrusions and / or depressions are obtained, and it is determined whether to adjust the initial score of packaging uniformity according to the total number and the total area.

[0041] In some embodiments, judging whether to adjust the initial packaging uniformity score according to the total quantity and the total area includes:

[0042] If the total number is less than the maximum number and the total area is less than the maximum area, it is determined that the initial package uniformity score is not adjusted; otherwise, it is determined that the initial package uniformity score is adjusted.

[0043] In some embodiments, if it is determined to be an adjustment, the initial packaging uniformity score is adjusted according to the image information to obtain a final packaging uniformity score, including:

[0044] The initial package uniformity score is adjusted using the following formula to obtain the final package uniformity score:

[0045] U=U0-k5*U0-k6*U0;

[0046] In the above formula, U represents the final packaging uniformity score, U0 represents the initial packaging uniformity score, k5 represents the quantity adjustment coefficient, and the value range of k5 is 0-0.5; k6 represents the area adjustment coefficient, and the value range of k6 is 0-0.5; when the total quantity is less than the maximum quantity, k5=0; when the total area is less than the maximum area, k6=0.

[0047] In some embodiments, a weighted sum of the final packaging quality score and the final packaging uniformity score is used to obtain a comprehensive evaluation value of the packaging machine status, including:

[0048] The comprehensive evaluation value of the packaging machine status is determined by the following formula:

[0049] F = Q*α+U*β;

[0050] In the above formula, F represents the comprehensive evaluation value of the state, Q represents the final score of the packaging quality, α represents the weight coefficient, U represents the final score of the packaging uniformity, β represents the weight coefficient, and α+β=1.

[0051] In some embodiments, the warning level of the status warning is one of a first-level warning and a second-level warning, the warning level of the first-level warning is lower than the warning level of the second-level warning, and the method further includes:

[0052] If the comprehensive evaluation value of the status is greater than or equal to the first evaluation value, no status warning will be issued for the packaging machine; if the comprehensive evaluation value of the status is less than the first evaluation value and greater than the second evaluation value, a first-level warning will be issued for the packaging machine; if the comprehensive evaluation value of the status is less than or equal to the second evaluation value, a second-level warning will be issued for the packaging machine; wherein, the first evaluation value is greater than the second evaluation value.

[0053] In a second aspect, a manufacturing component status monitoring device is provided, comprising: an acquisition unit, a determination unit, and a processing unit;

[0054] An acquisition unit is used to collect ultrasonic information of the piezoelectric sensor during the curing process through an ultrasonic sensor after the packaging machine completes packaging of the to-be-packaged component of the piezoelectric sensor; wherein the ultrasonic information includes ultrasonic velocity, ultrasonic amplitude and ultrasonic frequency;

[0055] A determination unit, used to determine the curing state of the piezoelectric sensor according to the ultrasonic velocity, obtain an initial packaging quality score according to the curing state, and adjust the initial packaging quality score according to the ultrasonic velocity and the curing completion time to obtain a final packaging quality score;

[0056] The determination unit is further used to determine the packaging uniformity of the piezoelectric sensor according to the ultrasonic amplitude, and determine the initial packaging uniformity score according to the packaging uniformity and the ultrasonic vibration frequency; collect image information of the piezoelectric sensor through the image collector, and determine whether to adjust the initial packaging uniformity score according to the image information. If it is determined to be adjusted, the initial packaging uniformity score is adjusted according to the image information to obtain the final packaging uniformity score;

[0057] The processing unit is used to obtain a comprehensive evaluation value of the packaging machine's status by weighted summing up the final packaging quality score and the final packaging uniformity score. The comprehensive evaluation value of the status is used to issue a status warning to the packaging machine.

[0058] In a third aspect, a manufacturing component status monitoring device is provided, comprising a memory and a processor; the memory is used to store computer execution instructions, and the processor is connected to the memory through a bus; when the manufacturing component status monitoring device is running, the processor executes the computer execution instructions stored in the memory, so that the manufacturing component status monitoring device executes the manufacturing component status monitoring method described in the first aspect.

[0059] The manufacturing component status monitoring device may be a network device, or a part of a network device, such as a chip system in a network device. The chip system is used to support the network device to implement the functions involved in the first aspect and any possible implementation thereof, for example, to obtain, determine, and send the data and / or information involved in the above-mentioned manufacturing component status monitoring method. The chip system includes a chip, and may also include other discrete devices or circuit structures.

[0060] In a fourth aspect, a computer-readable storage medium is provided, the computer-readable storage medium comprising computer execution instructions, and when the computer execution instructions are executed on a computer, the computer executes the manufacturing component status monitoring method described in the first aspect.

[0061] In a fifth aspect, a computer program product is also provided, which includes computer instructions. When the computer instructions are executed on a manufacturing component status monitoring device, the manufacturing component status monitoring device executes the manufacturing component status monitoring method as described in the first aspect above.

[0062] It should be noted that the above-mentioned computer instructions may be stored in whole or in part on a computer-readable storage medium. The computer-readable storage medium may be packaged together with the processor of the manufacturing component status monitoring device, or may be packaged separately from the processor of the manufacturing component status monitoring device, which is not limited in the embodiments of the present application.

[0063] The description of the second, third, fourth and fifth aspects of the present application can refer to the detailed description of the first aspect.

[0064] In the embodiments of the present application, the name of the manufacturing component status monitoring device does not limit the device or functional module itself. In actual implementation, these devices or functional modules may appear with other names. For example, the receiving unit may also be called a receiving module, a receiver, etc. As long as the functions of each device or functional module are similar to those of the present application, they fall within the scope of the claims of the present application and their equivalent technologies.

[0065] By setting up a collection device for the packaging machine, the packaging machine can automatically determine the comprehensive evaluation value of the packaging machine's status through the collection device, thereby realizing automatic monitoring of the packaging process, which reduces the reliance on manual inspection, reduces the risk of human error and misjudgment, and improves production efficiency and product quality consistency. Secondly, real-time monitoring of packaging quality and packaging uniformity enables the packaging machine to immediately feedback abnormal conditions during the production process, facilitates timely adjustment of process parameters, and thus reduces the scrap rate. This preventive maintenance mechanism not only improves product quality, but also optimizes resource utilization and reduces production costs. In addition, the packaging machine uses a comprehensive evaluation value to provide status warnings, allowing operators to identify potential problems in advance, avoid equipment failures and production stagnation, and further improve the stability and reliability of the production line. Overall, this method makes the packaging machine more intelligent, promotes the efficiency of the manufacturing process and improves quality control. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0067] Figure 1 A schematic diagram of the structure of a manufacturing component status monitoring system provided in an embodiment of the present application;

[0068] Figure 2 A schematic diagram of the hardware structure of a manufacturing component status monitoring device provided in an embodiment of the present application;

[0069] Figure 3 A schematic diagram of a process for monitoring the state of a manufacturing component provided in an embodiment of the present application;

[0070] Figure 4 A schematic diagram of a process flow of another manufacturing component status monitoring method provided in an embodiment of the present application;

[0071] Figure 5 A schematic diagram of a process flow of another manufacturing component status monitoring method provided in an embodiment of the present application;

[0072] Figure 6 A schematic diagram of a process flow of another manufacturing component status monitoring method provided in an embodiment of the present application;

[0073] Figure 7 A schematic diagram of a process flow of another manufacturing component status monitoring method provided in an embodiment of the present application;

[0074] Figure 8A schematic diagram of a process flow of another manufacturing component status monitoring method provided in an embodiment of the present application;

[0075] Fig. 9 A schematic diagram of a process flow of another manufacturing component status monitoring method provided in an embodiment of the present application;

[0076] Fig.10 A schematic diagram of the structure of a manufacturing component status monitoring device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0077] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features described in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0078] It should be noted that, in the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0079] In order to facilitate the clear description of the technical solutions of the embodiments of the present application, in the embodiments of the present application, the words "first", "second", etc. are used to distinguish the same items or similar items with basically the same functions and effects. Those skilled in the art can understand that the words "first", "second", etc. are not limiting the quantity and execution order.

[0080] The manufacturing process of inductively coupled piezoelectric sensors includes several key steps. First, suitable piezoelectric materials (such as lead zirconate titanate) and inductive materials are selected, and then the materials are cut, formed and annealed to achieve the desired properties. On this basis, metal electrodes are deposited on the surface of the piezoelectric material, and the inductive coupling structure is designed, which usually involves the winding and connection of the inductive coil. Next, an automated assembly machine is used to precisely assemble the components, a laser welding machine connects the electrodes and circuit elements, and a bonding machine is used to bond the materials. Finally, packaging is performed using a hot press to ensure the sensor's waterproof and dustproof properties, followed by performance testing and calibration to ensure product quality and reliability.

[0081] In the prior art, the packaging process of piezoelectric sensors usually relies on manual inspection, which is not only inefficient but also susceptible to human factors, resulting in detection errors and quality fluctuations. In addition, the lack of real-time monitoring means makes it difficult to evaluate the curing state and packaging uniformity in the production process in real time, resulting in an increase in the defective rate and increased waste and rework costs. Existing methods mostly rely on regular sampling and post-quality inspections, which cannot detect potential problems in a timely manner, thus affecting production efficiency and product consistency. This situation is particularly prominent in modern manufacturing, and cannot meet the growing market demand and high-standard quality requirements.

[0082] Therefore, how to solve the problems of low efficiency and high error caused by manual inspection in the prior art is a technical problem that needs to be solved urgently.

[0083] In this regard, the present application provides a method for monitoring the status of manufacturing components, including: integrating an acquisition device including an ultrasonic sensor and an image collector in a packaging machine, so that the acquisition device can obtain ultrasonic information and image information of the piezoelectric sensor during the curing process. Afterwards, the final packaging quality score of the piezoelectric sensor can be determined by the ultrasonic velocity in the ultrasonic information, the packaging uniformity of the piezoelectric sensor can be obtained by the ultrasonic amplitude, and the final packaging uniformity score can be obtained by the packaging uniformity, ultrasonic vibration frequency and image information. Subsequently, the comprehensive evaluation value of the status of the packaging machine can be obtained through the final packaging quality score and the final packaging uniformity score, so that the status of the packaging machine can be warned through the comprehensive status evaluation value.

[0084] From the above, it can be seen that by setting a collection device for the packaging machine, the packaging machine can automatically determine the comprehensive evaluation value of the packaging machine's status through the collection device, thereby realizing automatic monitoring of the packaging process, which reduces the reliance on manual inspection, reduces the risk of human error and misjudgment, and improves production efficiency and product quality consistency. Secondly, real-time monitoring of packaging quality and packaging uniformity enables the packaging machine to immediately feedback abnormal conditions during the production process, facilitates timely adjustment of process parameters, and thus reduces the scrap rate. This preventive maintenance mechanism not only improves product quality, but also optimizes resource utilization and reduces production costs. In addition, the packaging machine uses a comprehensive evaluation value for status warning, allowing operators to identify potential problems in advance, avoid equipment failures and production stagnation, and further improve the stability and reliability of the production line. Overall, this method makes the packaging machine more intelligent, promotes the efficiency of the manufacturing process and improves quality control.

[0085] The manufacturing component status monitoring method provided in the embodiment of the present application can also be applied to Figure 1 In a manufacturing component condition monitoring system shown in FIG. Figure 1 As shown, the system includes: an electronic device 101 and a packaging machine 102.

[0086] The electronic device 101 is in communication connection with the packaging machine 102. The packaging machine 102 is provided with a component to be packaged of a piezoelectric sensor, and the packaging machine 102 may include a hot press, etc. The packaging machine 102 includes a collection device, which includes an ultrasonic sensor and an image collector.

[0087] In some embodiments, the electronic device 101 can obtain ultrasonic information and image information of the piezoelectric sensor during the curing process through the acquisition device integrated in the packaging machine 102. Afterwards, the electronic device 101 can determine the final packaging quality score of the piezoelectric sensor through the ultrasonic velocity in the ultrasonic information, obtain the packaging uniformity of the piezoelectric sensor through the ultrasonic amplitude, and obtain the final packaging uniformity score through the packaging uniformity, ultrasonic vibration frequency and image information. Subsequently, the electronic device 101 can obtain the comprehensive status evaluation value of the packaging machine 102 through the final packaging quality score and the final packaging uniformity score, so that the packaging machine 102 can be warned of the status through the comprehensive status evaluation value.

[0088] In this way, the packaging machine can automatically determine the comprehensive evaluation value of the packaging machine's status through the acquisition device, thereby realizing automatic monitoring of the packaging process, which reduces the reliance on manual inspection, reduces the risk of human error and misjudgment, and improves production efficiency and product quality consistency. Secondly, real-time monitoring of packaging quality and packaging uniformity enables the packaging machine to immediately feedback abnormal conditions during the production process, facilitating timely adjustment of process parameters, thereby reducing the scrap rate. This preventive maintenance mechanism not only improves product quality, but also optimizes resource utilization and reduces production costs. In addition, the packaging machine uses comprehensive evaluation values ​​for status warnings, allowing operators to identify potential problems in advance, avoid equipment failures and production stagnation, and further improve the stability and reliability of the production line. Overall, this method makes the packaging machine more intelligent and promotes the efficiency of the manufacturing process and the improvement of quality control.

[0089] In a possible implementation, the electronic device 101 may be a device integrated with the packaging machine 102 , or the electronic device 101 may be a device in the packaging machine 102 .

[0090] Optionally, the physical device of the electronic device 101 may be a terminal, a server, or other types of electronic devices.

[0091] Optionally, the terminal may be at least one of a smart phone, a smart watch, a desktop computer, a laptop computer, a virtual reality terminal, an augmented reality terminal, a wireless terminal, a laptop computer and the like.

[0092] Optionally, the above-mentioned server can be a server in a server cluster (consisting of multiple servers), or a chip in the server, or a system on a chip in the server, or can be implemented by a virtual machine (VM) deployed on a physical machine, which is not limited in the embodiments of the present application.

[0093] The basic hardware structure of electronic device 101 includes Figure 2 The components of the manufacturing component condition monitoring device shown in FIG. Figure 2 Taking the manufacturing component status monitoring device shown as an example, the hardware structure of the electronic device 101 is introduced.

[0094] like Figure 2 , which is a hardware structure diagram of a manufacturing component status monitoring device provided in an embodiment of the present application. The manufacturing component status monitoring device includes a processor 21, a memory 22, a communication interface 23, and a bus 24. The processor 21, the memory 22, and the communication interface 23 can be connected via a bus 24.

[0095] The processor 21 is the control center of the manufacturing component status monitoring device, which can be a processor or a general term for multiple processing elements. For example, the processor 21 can be a general-purpose central processing unit (CPU) or other general-purpose processors. Among them, the general-purpose processor can be a microprocessor or any conventional processor.

[0096] As an embodiment, the processor 21 may include one or more CPUs, such as Figure 2 CPU 0 and CPU 1 are shown in .

[0097] The memory 22 may be a read-only memory (ROM) or other type of static storage device that can store static information and instructions, a random access memory (RAM) or other type of dynamic storage device that can store information and instructions, an electrically erasable programmable read-only memory (EEPROM), a disk storage medium or other magnetic storage device, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and can be accessed by a computer, but is not limited thereto.

[0098] In a possible implementation, the memory 22 may exist independently of the processor 21, and the memory 22 may be connected to the processor 21 via a bus 24 to store instructions or program codes. When the processor 21 calls and executes the instructions or program codes stored in the memory 22, the manufacturing component status monitoring method provided in the following embodiments of the present application can be implemented.

[0099] In the embodiment of the present application, for the electronic device 101, the software programs stored in the memory 22 are different, so the functions implemented by the electronic device 101 are different. The functions performed by each device will be described in conjunction with the following flowchart.

[0100] In another possible implementation, the memory 22 may also be integrated with the processor 21 .

[0101] The communication interface 23 is used to connect the manufacturing component status monitoring device to other devices through a communication network, and the communication network may be Ethernet, wireless access network, wireless local area network (WLAN), etc. The communication interface 23 may include a receiving unit for receiving data and a sending unit for sending data.

[0102] The bus 24 may be an industry standard architecture (ISA) bus, a peripheral component interconnect (PCI) bus, or an extended industry standard architecture (EISA) bus. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 2 Only one thick line is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0103] It should be pointed out that Figure 2 The structure shown in the figure does not constitute a limitation on the manufacturing component condition monitoring device. Figure 2 In addition to the components shown, the manufacturing component condition monitoring device may include more or fewer components than shown, or combine certain components, or arrange the components differently.

[0104] The manufacturing component status monitoring method provided in the embodiment of the present application is described in detail below with reference to the accompanying drawings.

[0105] The manufacturing component status monitoring method provided in the embodiment of the present application is applied to Figure 1 The electronic device 101 in the manufacturing component condition monitoring system shown. Figure 3As shown, the manufacturing component condition monitoring method includes:

[0106] S301. After the components to be packaged of the piezoelectric sensor are packaged, ultrasonic information of the piezoelectric sensor during the curing process is collected by an ultrasonic sensor.

[0107] The components to be packaged of the piezoelectric sensor are placed on a packaging machine, which is provided with a collection device, which includes an ultrasonic sensor and an image collector. The ultrasonic information includes ultrasonic velocity, ultrasonic amplitude and ultrasonic frequency.

[0108] Specifically, the function of the packaging machine is to solidify and package the components to be packaged of the piezoelectric sensor, so the packaging process may include a curing process. In order to monitor the packaging process, a collection device may be provided in the packaging machine, and the collection device may include an ultrasonic sensor and an image collector. In this way, the collection device may obtain ultrasonic information of the piezoelectric sensor during the curing process through the ultrasonic sensor, thereby monitoring the curing state through the ultrasonic information.

[0109] S302, determining the curing state of the piezoelectric sensor according to the ultrasonic velocity, obtaining an initial packaging quality score according to the curing state, adjusting the initial packaging quality score according to the ultrasonic velocity and the curing completion time, and obtaining a final packaging quality score.

[0110] Specifically, during the curing process, the state of the components to be packaged of the piezoelectric sensor will slowly change, for example, from liquid to solid, and parameters such as density of different curing states will change, resulting in changes in the ultrasonic velocity. Therefore, the curing state of the piezoelectric sensor can be determined by the ultrasonic velocity, and the initial score of the packaging quality can be determined by the curing state. Afterwards, since the curing completion time also affects the quality of the package, late or early curing may affect the quality of the package. Therefore, the initial score of the packaging quality can be adjusted by the curing completion time. In addition, the curing state is related to the speed of the ultrasonic wave. Too high or too low a speed will also affect the quality of the package. Therefore, the initial score of the packaging quality can be adjusted by the ultrasonic velocity.

[0111] In a possible implementation, if the final initial score of the packaging quality is less than the curing threshold, a curing status warning is issued, thereby issuing a warning of the curing status of the piezoelectric sensor.

[0112] Correspondingly, if the final packaging quality score is less than the packaging quality threshold, a packaging quality warning is issued, thereby warning the packaging quality of the piezoelectric sensor. In this way, automatic monitoring of packaging quality can be achieved, and products with quality problems can be automatically screened out, thereby saving manpower, reducing human errors, and improving product quality overall.

[0113] S303. Determine the packaging uniformity of the piezoelectric sensor according to the ultrasonic amplitude, and determine the initial packaging uniformity score according to the packaging uniformity and the ultrasonic frequency; collect image information of the piezoelectric sensor through an image collector, and determine whether to adjust the initial packaging uniformity score according to the image information. If it is determined to be adjusted, adjust the initial packaging uniformity score according to the image information to obtain a final packaging uniformity score.

[0114] Specifically, when the ultrasonic wave passes through the component to be packaged, its amplitude will change due to the non-uniformity of the material of the component to be packaged. If there are gaps, bubbles or uneven density inside the component to be packaged, the reflection and attenuation of the ultrasonic wave will be different, which will affect the received ultrasonic wave amplitude. By presetting the standard value or range of the ultrasonic amplitude under different uniformities, the packaging uniformity of the piezoelectric sensor can be determined by the ultrasonic amplitude. The ultrasonic frequency can determine the uniformity of the component to be packaged. For example, a small frequency fluctuation indicates that the packaging is more uniform; a large frequency fluctuation may mean that there are non-uniform areas. Therefore, the initial score of the packaging uniformity can be determined by the ultrasonic frequency and the packaging uniformity.

[0115] Afterwards, the image information of the piezoelectric sensor can be obtained, and whether there are defects on the components to be packaged of the piezoelectric sensor can be identified based on the image information. If there are defects (or the number of defects is greater than a certain value), it is determined that the initial package uniformity score needs to be adjusted, such as subtracting a certain value from the initial package uniformity score to obtain the final package uniformity score. In this way, the final package uniformity score can reflect both the internal uniformity and the external uniformity. If there are no defects (or the number of defects is less than or equal to a certain value), the initial package uniformity score is determined as the final package uniformity score.

[0116] As can be seen from the above, the packaging uniformity can be used to determine the packaging quality inside the component to be packaged, and the image information can be used to determine whether there are packaging quality problems outside the component to be packaged. In this way, the packaging uniformity quality inside and outside the component to be packaged can be automatically monitored through packaging uniformity and image information, so that internal packaging uniformity problems that cannot be identified manually can be detected, which can improve detection efficiency and reduce manual errors.

[0117] It should be noted that the method of identifying whether there are defects based on image information can be to determine whether there are defects on the component to be packaged, or to identify the number of defects based on artificial intelligence (such as image recognition).

[0118] In a possible implementation, if the initial packaging uniformity score is less than the first uniformity threshold, a first packaging uniformity warning is issued, thereby issuing a warning on the uniformity inside the component to be packaged.

[0119] Correspondingly, if the final packaging uniformity score is less than the second uniformity threshold, a second packaging uniformity warning is issued, thereby issuing a warning for the uniformity of the entire (i.e., external and internal) component to be packaged. In this way, automatic monitoring of packaging uniformity can be achieved, and products with uneven packaging can be automatically screened out, thereby saving manpower, reducing human errors, and improving product quality overall.

[0120] S304 , obtaining a comprehensive evaluation value of the packaging machine status by weighted summing up the final packaging quality score and the final packaging uniformity score.

[0121] Among them, the comprehensive status evaluation value is used to provide status warning for the packaging machine.

[0122] Specifically, the comprehensive evaluation value of the state is jointly determined by the final score of the packaging quality and the final frequency division of the packaging uniformity. In this way, the state of the packaging machine can be determined by the comprehensive evaluation value of the state. For example, when the comprehensive evaluation value of the state is less than the evaluation value threshold, the state of the packaging machine is warned. In this way, the state of the packaging machine can be automatically monitored, and when there is a problem with the state of the packaging machine (that is, the above-mentioned comprehensive evaluation value of the state is less than the evaluation value threshold), a warning is issued in time, so that the operator can solve the problem in time.

[0123] It is understandable that the present invention realizes automatic monitoring of the packaging machine by integrating ultrasonic sensors and image collectors, which reduces the reliance on manual inspection, reduces the risk of human error and misjudgment, and improves production efficiency and consistency. Secondly, real-time monitoring of the curing state and packaging uniformity enables the packaging machine to immediately feedback abnormal conditions during the production process, which facilitates timely adjustment of process parameters, thereby reducing the scrap rate. This preventive maintenance mechanism not only improves product quality, but also optimizes resource utilization and reduces production costs. In addition, the packaging machine uses comprehensive evaluation values ​​for status warnings, allowing operators to identify potential problems in advance, avoid equipment failures and production stagnation, and further improve the stability and reliability of the production line. Overall, this method makes the packaging machine more intelligent, promotes the efficiency of the manufacturing process and improves quality control.

[0124] In some embodiments of the present application, Figure 3 ,like Figure 4As shown, the curing state is one of a normal state, an over-curing state and an incomplete curing state. Different curing states correspond to different initial scores of packaging quality. In the above S302, the curing state of the piezoelectric sensor is determined according to the ultrasonic velocity, and the initial score of packaging quality is obtained according to the curing state, including:

[0125] S401. If the ultrasonic wave velocity is within the standard ultrasonic wave velocity range, determine that the curing state is a normal state, and obtain an initial packaging quality score corresponding to the normal state.

[0126] S402: If the ultrasonic wave velocity is greater than the maximum value of the standard ultrasonic wave velocity range, the curing state is determined to be an over-curing state, and an initial packaging quality score corresponding to the over-curing state is obtained.

[0127] S403: If the ultrasonic wave velocity is less than the minimum value of the standard ultrasonic wave velocity range, the curing state is determined to be an incomplete curing state, and an initial packaging quality score corresponding to the incomplete curing state is obtained.

[0128] Specifically, a standard ultrasonic velocity range and three states of curing state can be preset, and different curing states correspond to different initial scores of packaging quality. In this way, the curing state can be determined by comparing the ultrasonic velocity with the standard ultrasonic velocity range, and the initial score of packaging quality corresponding to the curing state can be further determined.

[0129] It is understandable that by setting a standard ultrasonic velocity range and a scoring system for different curing states, an accurate judgment of the curing state of the piezoelectric sensor is achieved. This method first clarifies the classification of curing states, including normal state, over-curing state and incomplete curing state, and sets a corresponding initial score for packaging quality for each state. The standardized processing method not only improves the objectivity of the evaluation, but also ensures real-time monitoring of the curing state during the production process. When the ultrasonic velocity is within the standard range, the curing state is judged to be normal, which means that the packaging process is in line with expectations; when the ultrasonic velocity exceeds the maximum value, it indicates that there may be a risk of over-curing, which may cause the material to be fragile and the performance to deteriorate; conversely, if the ultrasonic velocity is lower than the minimum value, it indicates that the curing is incomplete, which may cause unstable sensor performance. By identifying these states in a timely manner, the production line can quickly adjust the process parameters, reduce the scrap rate, and improve product quality. The biggest advantage of this method is its automation and real-time nature, which enables every link in the production process to be effectively controlled, reduces the reliance on manual judgment, and thus improves the overall production efficiency and reliability.

[0130] In some embodiments of the present application, Figure 4 ,like Figure 5As shown, in the above S302, the initial packaging quality score is adjusted according to the ultrasonic speed and the curing completion time to obtain the final packaging quality score, including:

[0131] S501. Determine a velocity deviation value of the ultrasonic wave of the piezoelectric sensor during the curing process according to the ultrasonic wave velocity.

[0132] Among them, if the ultrasonic velocity is greater than the maximum value of the standard ultrasonic velocity range, the velocity deviation value ΔV = ultrasonic velocity - the maximum value of the standard ultrasonic velocity range; if the ultrasonic velocity is within the standard ultrasonic velocity range, the velocity deviation value ΔV = 0; if the ultrasonic velocity is less than the minimum value of the standard ultrasonic velocity range, the velocity deviation value ΔV = the minimum value of the standard ultrasonic velocity range - ultrasonic velocity.

[0133] Specifically, if the speed is within the standard ultrasonic speed range, it means that the curing state of the component to be packaged is normal, and the ultrasonic speed is normal at this time. Therefore, there is no need to adjust the initial score of the packaging quality through the ultrasonic speed, and the speed deviation value is 0. If the ultrasonic speed is outside the standard ultrasonic speed range, it can be determined that the curing state is abnormal. At this time, the speed deviation value of the ultrasonic speed can be used to indicate the deviation of the curing state from the normal state. For example, the greater the ultrasonic speed, the farther the curing state deviates from the normal state. At this time, the initial score of the packaging quality can be adjusted through the speed deviation value.

[0134] S502: Determine a curing time deviation value based on the standard curing time.

[0135] Wherein, the curing time deviation value ΔT=|curing completion time-standard curing time|.

[0136] Correspondingly, similar to the speed deviation value, the curing time deviation value can also indicate the deviation of the curing state relative to the normal state. For example, when the curing completion time is late, it can indicate that the curing state has a large deviation relative to the normal state.

[0137] Optionally, the standard curing time may be a time preset in advance manually, or may be an average value of the curing time within a certain period of time.

[0138] S503: Determine the final packaging quality score.

[0139] Among them, the final score of packaging quality can satisfy the following formula:

[0140] Q = Q0-k1*ΔV-k2*ΔT;

[0141] In the above formula, Q represents the final packaging quality score, Q0 represents the initial packaging quality score, k1 represents the speed adjustment coefficient, the value range of k1 is 0-1, ΔV represents the speed deviation value, k2 represents the time adjustment coefficient, the value range of k2 is 0-1, and ΔT represents the curing time deviation value.

[0142] Specifically, since both the speed of ultrasound and the curing completion time can represent the packaging quality, the initial packaging quality score can be adjusted by the speed deviation value and the curing time deviation value, thereby obtaining a final packaging quality score adjusted jointly by the speed deviation value and the curing time deviation value. In this way, the final packaging quality score can better represent the quality of the packaging.

[0143] Optionally, the speed adjustment coefficient and the time adjustment coefficient may be preset in advance.

[0144] It is understandable that the initial score of packaging quality has been effectively adjusted through comprehensive consideration of ultrasonic speed and curing completion time. First of all, it involves the calculation of the ultrasonic speed deviation value. If the speed exceeds the standard range, it means over-curing; if it is within the range, it is considered normal; if it is lower than the range, it indicates incomplete curing, and the production line can monitor the curing status in real time to avoid potential quality problems. At the same time, the deviation value of the curing completion time is also included in the evaluation to ensure that each packaging process can be completed within the standard time. Q0 is adjusted according to the deviation of speed and time to ensure that Q can more accurately reflect the actual packaging quality. The setting of adjustment coefficients k1 and k2 enables the system to flexibly respond to different production situations and has strong adaptability. It improves the accuracy and real-time performance of packaging quality evaluation and significantly reduces the scrap rate caused by curing problems. Through quantitative evaluation and timely feedback, the production team can quickly adjust the process parameters of the package to ensure product consistency and reliability.

[0145] In some embodiments of the present application, Figure 5 ,like Figure 6 As shown, the packaging uniformity is one of packaging uniformity, over-compaction and packaging unevenness. In the above S303, the packaging uniformity of the piezoelectric sensor is determined according to the ultrasonic amplitude, specifically including:

[0146] S601. If the ultrasonic amplitude is within the standard amplitude range, it is determined that the packaging uniformity of the piezoelectric sensor is packaging uniformity.

[0147] S602: If the ultrasonic amplitude is greater than the maximum value of the standard amplitude range, it is determined that the packaging uniformity of the piezoelectric sensor is over-compacted.

[0148] S603: If the ultrasonic amplitude is smaller than the minimum value of the standard amplitude range, it is determined that the packaging uniformity of the piezoelectric sensor is uneven packaging.

[0149] The standard amplitude range is determined based on the amplitude characteristics of the historical standard piezoelectric sensor. The standard piezoelectric sensor is a preset piezoelectric sensor.

[0150] Specifically, the ultrasonic amplitude of the historical standard piezoelectric sensor during the packaging process can be obtained, and the standard amplitude range can be set based on the historical ultrasonic amplitude. Afterwards, the packaging uniformity of the component to be packaged can be determined based on the ultrasonic amplitude corresponding to the part to be packaged and the standard amplitude range.

[0151] In some embodiments of the present application, Figure 5 ,like Figure 7 As shown, in the above S303, determining the packaging uniformity of the piezoelectric sensor according to the ultrasonic amplitude specifically includes:

[0152] S701. If the ultrasonic amplitude is within the standard amplitude range, the packaging uniformity is determined to be the standard uniformity J0.

[0153] Optionally, the standard uniformity is a uniformity preset in advance, and the standard amplitude range is also a range preset in advance.

[0154] S702: If the ultrasonic amplitude is not within the standard amplitude range, determine the amplitude deviation value of the ultrasonic amplitude, and calculate the packaging uniformity according to the amplitude deviation value.

[0155] Among them, if the ultrasonic amplitude is greater than or equal to the maximum value of the standard amplitude range, the amplitude deviation value ΔZ = ultrasonic amplitude - the maximum value of the standard amplitude range; if the ultrasonic amplitude is less than the minimum value of the standard amplitude range, the amplitude deviation value ΔZ = the minimum value of the standard amplitude range - ultrasonic amplitude.

[0156] The method for determining packaging uniformity satisfies the following formula:

[0157] J = ΔZ / (Zmax-Zmin);

[0158] In the above formula, J represents packaging uniformity, ΔZ represents amplitude deviation, Zmax represents the maximum value of the standard amplitude range, and Zmin represents the minimum value of the standard amplitude range.

[0159] Specifically, if the ultrasonic amplitude is within the standard amplitude range, it means that there is no problem with the packaging uniformity, so the packaging uniformity is set to the standard uniformity. If the ultrasonic amplitude is not within the standard amplitude range, the amplitude deviation value is determined, and the amplitude deviation value can indicate the deviation of the packaging uniformity from the normal packaging uniformity. Therefore, the packaging uniformity can be determined by the amplitude deviation value, thereby quantifying the packaging uniformity and improving the accuracy of the packaging uniformity.

[0160] In one possible implementation, if the packaging uniformity is not within the standard uniformity range, the packaging uniformity can be used to warn the components to be packaged, thereby indicating that there is a problem with the packaging uniformity of the components to be packaged. The packaging uniformity of the components to be packaged can be monitored in real time, which can reduce errors in manual monitoring and improve efficiency.

[0161] It can be understood that by analyzing the ultrasonic amplitude, an effective judgment of the uniformity of the piezoelectric sensor package is achieved. First, the present invention obtains the standard amplitude characteristics from historical data and sets the standard amplitude range accordingly. This standardization process ensures the objectivity of the evaluation. When the ultrasonic amplitude is within the standard range, it is judged that the package is uniform; if it exceeds the range, its deviation is further analyzed to ensure timely identification of potential production problems. It is convenient for the production line to monitor the packaging quality in real time, and it also allows the process parameters to be adjusted quickly in actual operation to reduce the scrap rate. The biggest advantage of this packaging uniformity evaluation method is that it improves the quality control capability in the production process and reduces performance problems caused by uneven packaging. By combining historical data with real-time monitoring, the production process is made more intelligent and efficient.

[0162] In some embodiments of the present application, Figure 7 ,like Figure 8 As shown, in the above S303, the initial score of packaging uniformity is determined according to the packaging uniformity and the ultrasonic vibration frequency, which specifically includes:

[0163] S801. Determine the absolute value of the frequency difference between the ultrasonic frequency and the standard value of the ultrasonic frequency, and determine the ultrasonic frequency score according to the absolute value of the frequency difference.

[0164] Among them, the ultrasonic vibration frequency score determined according to the absolute value of the frequency difference can satisfy the following formula:

[0165] SP = SP0-|ΔP|*k3;

[0166] In the above formula, SP represents the ultrasonic frequency score, SP0 represents the ultrasonic frequency standard score, |ΔP| represents the absolute value of the frequency difference, k3 represents the frequency adjustment coefficient, and the value range of k3 is 0-1.

[0167] Optionally, the standard value of the ultrasonic vibration frequency may be preset in advance.

[0168] Specifically, the standard value of the ultrasonic vibration frequency can be the amplitude value of the component to be packaged when the packaging uniformity is normal packaging. Therefore, if the amplitude value of the ultrasonic wave deviates from the standard value of the ultrasonic amplitude, it can indicate that the packaging uniformity of the component to be packaged deviates from the normal packaging state, that is, there is a problem with the packaging uniformity. In this case, the degree to which the packaging uniformity of the component to be packaged deviates from the normal packaging state can be indicated by the frequency domain difference. Therefore, the ultrasonic vibration frequency score can be obtained by the absolute value of the frequency difference, and the degree to which the packaging uniformity of the component to be packaged deviates from the normal packaging state can be indicated by the ultrasonic vibration frequency score.

[0169] S802: Adjust the standard uniformity score corresponding to the standard uniformity according to the amplitude deviation value to obtain a uniformity score.

[0170] Among them, the uniformity score satisfies the following formula:

[0171] SJ=SJ0-ΔZ*k4;

[0172] In the above formula, SJ represents the uniformity score, SJ0 represents the standard uniformity score, ΔZ represents the amplitude deviation value, k4 represents the amplitude adjustment coefficient, and the value range of k4 is 0-1.

[0173] Optionally, the standard uniformity score may be a preset score corresponding to the standard uniformity, and may represent a uniformity score when the packaging uniformity is normal packaging.

[0174] Specifically, corresponding to the frequency difference, the amplitude deviation value can also indicate the degree to which the package uniformity deviates from the normal package. Therefore, the standard uniformity score can be adjusted by the amplitude deviation value to obtain the uniformity score, which indicates the length of the package uniformity deviation from the normal package.

[0175] S803, weighted sum of the ultrasonic frequency score and the uniformity score to obtain an initial packaging uniformity score. The initial packaging uniformity score satisfies the following formula:

[0176] U0=SP*a+SJ*b;

[0177] In the above formula, U0 represents the initial uniformity score, SP represents the ultrasonic frequency score, a represents the frequency weight coefficient, SJ represents the uniformity score, and b represents the uniformity weight coefficient, where a+b=1.

[0178] Specifically, since both the ultrasonic frequency score and the uniformity score can indicate the degree of deviation from the normal packaging state, the initial uniformity score can be jointly determined by these two dimensions, so that the initial uniformity score can more accurately indicate the uniformity of the components to be packaged.

[0179] It can be understood that in some embodiments of the present application, the high-quality packaging of the piezoelectric sensor is ensured by combining the evaluation of packaging uniformity with the ultrasonic frequency. The ultrasonic frequency score SP is calculated by the formula using the absolute value of the frequency difference, and the score can be dynamically adjusted to reflect the actual situation in the production process. At the same time, by setting the standard uniformity score SJ0 and adjusting it according to the amplitude deviation value ΔZ to obtain the uniformity score SJ, and finally obtaining the initial uniformity score U0 by weighted summation, it is more comprehensive and flexible, and can fully reflect the various factors that affect the quality of piezoelectric sensors, thereby improving production efficiency and reducing scrap rates. At the same time, the standardization and automation characteristics of the method help reduce human errors and improve the overall reliability and consistency of the production line.

[0180] In some embodiments of the present application, Figure 8 ,like Fig. 9 As shown, in the above S303, the image information of the piezoelectric sensor is collected by the image collector, and it is determined whether to adjust the initial packaging uniformity score according to the image information, which specifically includes:

[0181] S901. Obtain defect features of the piezoelectric sensor in the image information.

[0182] The defect features include protrusions and / or depressions.

[0183] S902: Obtain the total number of protrusions and / or depressions and the total area of ​​the protrusions and / or depressions, and determine whether to adjust the initial packaging uniformity score according to the total number and the total area.

[0184] Specifically, the defect features of the piezoelectric sensor in the image information can be identified by artificial intelligence, so that the protrusions and depressions on the surface of the piezoelectric sensor can be identified. Afterwards, since the more and larger the defect features are, the more uneven the package is, so the total number and total area of ​​the protrusions and / or depressions can be used to determine whether to adjust the initial score of the package uniformity. It can be understood that by collecting the image information of the piezoelectric sensor and analyzing its defect features, the accuracy and reliability of the package quality assessment are significantly enhanced. Specifically, by marking the protrusions and depressions in the image, possible problems in the packaging process can be clearly identified. Further statistics on the number and total area of ​​these defects can provide quantitative data to support the adjustment of the initial score of the package uniformity, which can achieve more refined quality control, timely detect potential package defects, and prevent inferior products from entering the market. In addition, with the help of image analysis technology, the subjectivity and errors of manual inspection can be reduced, production efficiency can be improved, and the consistency and reliability of the final product can be ensured.

[0185] In a possible implementation, determining whether to adjust the initial package uniformity score based on the total number and the total area includes: if the total number is less than the maximum number, and the total area is less than the maximum area, determining not to adjust the initial package uniformity score; otherwise, determining to adjust the initial package uniformity score.

[0186] Specifically, since a small amount of protrusions and / or depressions is a normal phenomenon in the packaging process, if the total number of protrusions and / or depressions is less than the maximum number, and the total area is less than the maximum area, it can be determined that a small amount of protrusions and / or depressions exist, which is a normal phenomenon, and therefore the initial packaging uniformity score is not adjusted. Otherwise, it is determined to be adjusted, so that the packaging uniformity can be determined by the surface of the component to be packaged.

[0187] In some embodiments of the present application, in the above S303, if it is determined to be an adjustment, the initial packaging uniformity score is adjusted according to the image information to obtain a final packaging uniformity score, which specifically includes:

[0188] The initial packaging uniformity score is adjusted to obtain the final packaging uniformity score.

[0189] Among them, the final score of packaging uniformity satisfies the following formula:

[0190] U=U0-k5*U0-k6*U0;

[0191] In the above formula, U represents the final packaging uniformity score, U0 represents the initial packaging uniformity score, k5 represents the quantity adjustment coefficient, and the value range of k5 is 0-0.5, k6 represents the area adjustment coefficient, and the value range of k6 is 0-0.5; when the total quantity is less than the maximum quantity, k5 = 0; when the total area is less than the maximum area, k6 = 0. Optionally, the quantity adjustment coefficient and the area adjustment coefficient can be preset in advance.

[0192] Specifically, the initial packaging uniformity score can be processed by the total number and total area in the image information to obtain the final packaging uniformity score.

[0193] It can be understood that by setting the maximum number and area, the initial score of package uniformity is precisely adjusted, which enhances the flexibility and effectiveness of quality control. When the number and area of ​​the detected defects do not exceed the set threshold, the score remains unchanged, reflecting the tolerance for qualified products; otherwise, the score will be dynamically adjusted according to the number and area of ​​the defects. By introducing the quantity adjustment coefficient and the area adjustment coefficient, the score adjustment is made more detailed and reasonable. In particular, when the number or area of ​​defects is less than the maximum threshold, the correlation coefficient will be set to zero, which will not affect the score. The advantage of this method is that it not only provides a quantitative assessment of the package quality, but also effectively prevents unnecessary fluctuations in the score due to small defects, ensuring the stability and consistency of product quality. Through intelligent adjustment, the defect rate can be better reduced.

[0194] In some embodiments of the present application, in the above S304, the final score of the packaging quality and the final score of the packaging uniformity are weighted and summed to obtain a comprehensive evaluation value of the state of the packaging machine, which specifically includes:

[0195] The comprehensive evaluation value of the packaging machine status is calculated by the following formula:

[0196] F = Q*α+U*β;

[0197] In the above formula, F represents the comprehensive evaluation value of the state, Q represents the final score of the packaging quality, α represents the weight coefficient, U represents the final score of the packaging uniformity, β represents the weight coefficient, and α+β=1;

[0198] In some embodiments of the present application, the warning level of the status warning is one of the first-level warning and the second-level warning, and the warning level of the first-level warning is lower than the warning level of the second-level warning. The method provided in the embodiments of the present application also includes: if the comprehensive status evaluation value is greater than or equal to the first evaluation value, no status warning is performed on the packaging machine; if the comprehensive status evaluation value is less than the first evaluation value and greater than the second evaluation value, a first-level warning is performed on the packaging machine; if the comprehensive status evaluation value is less than or equal to the second evaluation value, a second-level warning is performed on the packaging machine; wherein, the first evaluation value is greater than the second evaluation value.

[0199] Specifically, since the comprehensive evaluation value of the state can indicate the state of the packaging machine, and different comprehensive evaluation values ​​of the state can be used to indicate different states of the packaging machine, different levels of early warning can be given to the packaging machine, so that the operator can perform different processing methods according to different early warning levels, so as to better meet the needs of users. It can be understood that by weighting and summing the final score of the packaging quality and the adjusted packaging uniformity score, the comprehensive evaluation value of the state of the packaging machine is obtained, which effectively integrates multiple quality indicators and provides a more comprehensive state evaluation. The weight coefficients α and β in the formula enable the evaluation process to be flexibly adjusted according to actual needs, making the influence of key indicators more prominent. By setting a clear early warning level, by comparing the comprehensive evaluation value of the state with the first evaluation value and the second evaluation value, potential problems can be quickly identified and corresponding early warning measures can be taken, the operating status of the packaging machine can be monitored in real time, quality problems can be discovered and prevented in time, and the risk of failure can be reduced, thereby ensuring the continuity of production and the quality stability of the product. At the same time, through graded early warning, operators can take corresponding response strategies for different levels of danger, which improves the efficiency and flexibility of production management. This intelligent early warning system provides enterprises with higher production safety and reliability.

[0200] In summary, the present invention realizes comprehensive monitoring of the packaging process of piezoelectric sensors by combining ultrasonic sensors and image collectors, thereby realizing state monitoring of packaging components, and can collect ultrasonic information in real time to judge the curing state and packaging uniformity of piezoelectric sensors. By setting the standard ultrasonic velocity and amplitude range, it is possible to accurately evaluate whether the curing state is normal, over-cured or incompletely cured, and assign corresponding initial scores for packaging quality according to different states. Subsequently, the score is further adjusted by considering the ultrasonic velocity deviation and the curing completion time; in addition, the packaging uniformity is analyzed using image information, defect features are marked, and the number and area of ​​protrusions and depressions are counted to determine whether the initial uniformity score needs to be adjusted, thereby ensuring the objectivity and reliability of the evaluation process. At the same time, by generating a comprehensive state evaluation value through weighted summation, and performing state warning according to a preset evaluation threshold, potential problems can be discovered in a timely manner and production risks can be reduced. Overall, the present application significantly improves production efficiency and product quality, and enhances product reliability.

[0201] The above mainly introduces the solution provided by the embodiment of the present application from the perspective of the method. In order to realize the above functions, it includes hardware structures and / or software modules corresponding to the execution of each function. Those skilled in the art should easily realize that, in combination with the units and algorithm steps of each example described in the embodiments disclosed herein, the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a function is executed in the form of hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present application.

[0202] The embodiment of the present application can divide the functional modules of the manufacturing component status monitoring device according to the above method example. For example, each functional module can be divided according to each function, or two or more functions can be integrated into one processing module. The above integrated module can be implemented in the form of hardware or in the form of software functional modules. Optionally, the division of modules in the embodiment of the present application is schematic and is only a logical function division. There may be other division methods in actual implementation.

[0203] like Fig.10 , which is a schematic diagram of the structure of a manufacturing component status monitoring device provided in an embodiment of the present application. Fig.10 The manufacturing component status monitoring device shown includes: an acquisition unit 1001, a determination unit 1002, and a processing unit 1003;

[0204] The acquisition unit 1001 is used to collect ultrasonic information of the piezoelectric sensor during the curing process through an ultrasonic sensor after the packaging machine completes packaging of the to-be-packaged component of the piezoelectric sensor; wherein the ultrasonic information includes ultrasonic velocity, ultrasonic amplitude and ultrasonic frequency;

[0205] A determination unit 1002 is used to determine the curing state of the piezoelectric sensor according to the ultrasonic velocity, obtain an initial packaging quality score according to the curing state, and adjust the initial packaging quality score according to the ultrasonic velocity and the curing completion time to obtain a final packaging quality score;

[0206] The determination unit 1002 is further used to determine the packaging uniformity of the piezoelectric sensor according to the ultrasonic amplitude, and determine the initial packaging uniformity score according to the packaging uniformity and the ultrasonic vibration frequency; collect image information of the piezoelectric sensor through the image collector, and determine whether to adjust the initial packaging uniformity score according to the image information. If it is determined to be adjusted, the initial packaging uniformity score is adjusted according to the image information to obtain a final packaging uniformity score;

[0207] The processing unit 1003 is used to obtain a comprehensive evaluation value of the packaging machine status by weighted summing up the final packaging quality score and the final packaging uniformity score. The comprehensive evaluation value of the status is used to issue a status warning to the packaging machine.

[0208] Optionally, the determination unit 1002 is specifically used to: if the ultrasonic velocity is within the standard ultrasonic velocity range, determine that the curing state is a normal state, and obtain an initial packaging quality score corresponding to the normal state; if the ultrasonic velocity is greater than the maximum value of the standard ultrasonic velocity range, determine that the curing state is an over-curing state, and obtain an initial packaging quality score corresponding to the over-curing state; if the ultrasonic velocity is less than the minimum value of the standard ultrasonic velocity range, determine that the curing state is an incomplete curing state, and obtain an initial packaging quality score corresponding to the incomplete curing state.

[0209] Optionally, the determination unit 1002 is specifically used to: determine the velocity deviation value of the ultrasonic wave of the piezoelectric sensor during the curing process according to the ultrasonic wave velocity; wherein, if the ultrasonic wave velocity is greater than the maximum value of the standard ultrasonic wave velocity range, the velocity deviation value ΔV=ultrasonic wave velocity-maximum value of the standard ultrasonic wave velocity range; if the ultrasonic wave velocity is within the standard ultrasonic wave velocity range, the velocity deviation value ΔV=0; if the ultrasonic wave velocity is less than the minimum value of the standard ultrasonic wave velocity range, the velocity deviation value ΔV=minimum value of the standard ultrasonic wave velocity range-ultrasonic wave velocity;

[0210] Determine the curing time deviation value ΔT based on the standard curing time, ΔT=|curing completion time-standard curing time|;

[0211] The final package quality score is determined by the following formula:

[0212] Q = Q0-k1*ΔV-k2*ΔT;

[0213] In the above formula, Q represents the final packaging quality score, Q0 represents the initial packaging quality score, k1 represents the speed adjustment coefficient, the value range of k1 is 0-1, ΔV represents the speed deviation value, k2 represents the time adjustment coefficient, the value range of k2 is 0-1, and ΔT represents the curing time deviation value.

[0214] Optionally, the determination unit 1002 is specifically used to: if the ultrasonic amplitude is within the standard amplitude range, determine that the packaging uniformity of the piezoelectric sensor is packaging uniform, and the standard amplitude range is determined based on the amplitude characteristics of historical standard piezoelectric sensors; if the ultrasonic amplitude is greater than the maximum value of the standard amplitude range, determine that the packaging uniformity of the piezoelectric sensor is over-compacted; if the ultrasonic amplitude is less than the minimum value of the standard amplitude range, determine that the packaging uniformity of the piezoelectric sensor is packaging uneven.

[0215] Optionally, the determination unit 1002 is specifically used to: if the ultrasonic amplitude is within the standard amplitude range, determine the packaging uniformity as the standard uniformity J0; if the ultrasonic amplitude is not within the standard amplitude range, determine the amplitude deviation value of the ultrasonic amplitude, and determine the packaging uniformity by the following formula; wherein, if the ultrasonic amplitude is greater than or equal to the maximum value of the standard amplitude range, the amplitude deviation value ΔZ = ultrasonic amplitude - maximum value of the standard amplitude range; if the ultrasonic amplitude is less than the minimum value of the standard amplitude range, the amplitude deviation value ΔZ = minimum value of the standard amplitude range - ultrasonic amplitude;

[0216] J = ΔZ / (Zmax-Zmin);

[0217] In the above formula, J represents packaging uniformity, ΔZ represents amplitude deviation, Zmax represents the maximum value of the standard amplitude range, and Zmin represents the minimum value of the standard amplitude range.

[0218] Optionally, the determining unit 1002 is specifically used to: determine the absolute value |ΔP| of the frequency difference between the ultrasonic vibration frequency and the standard value of the ultrasonic vibration frequency;

[0219] The ultrasonic frequency score is determined according to the absolute value of the frequency difference by the following formula:

[0220] SP = SP0-|ΔP|*k3;

[0221] In the above formula, SP represents the ultrasonic frequency score, SP0 represents the ultrasonic frequency standard score, |ΔP| represents the absolute value of the frequency difference, k3 represents the frequency adjustment coefficient, and the value range of k3 is 0-1;

[0222] The standard uniformity score corresponding to the standard uniformity is adjusted according to the amplitude deviation value through the following formula to obtain the uniformity score:

[0223] SJ=SJ0-ΔZ*k4;

[0224] In the above formula, SJ represents the uniformity score, SJ0 represents the standard uniformity score, ΔZ represents the amplitude deviation value, k4 represents the amplitude adjustment coefficient, and the value range of k4 is 0-1;

[0225] The initial packaging uniformity score is obtained by weighted summing the ultrasonic frequency score and uniformity score using the following formula:

[0226] U0=SP*a+SJ*b;

[0227] In the above formula, U0 represents the initial packaging uniformity score, SP represents the ultrasonic vibration frequency score, a represents the frequency weight coefficient, SJ represents the uniformity score, b represents the uniformity weight coefficient, and a+b=1.

[0228] Optionally, the determination unit 1002 is specifically used to: obtain defect features of the piezoelectric sensor in the image information, wherein the defect features include protrusions and / or depressions; obtain the total number of protrusions and / or depressions and the total area of ​​the protrusions and / or depressions, and determine whether to adjust the initial packaging uniformity score based on the total number and the total area.

[0229] Optionally, the determination unit 1002 is specifically configured to: if the total number is less than the maximum number and the total area is less than the maximum area, determine not to adjust the initial packaging uniformity score; otherwise, determine to adjust the initial packaging uniformity score.

[0230] Optionally, the determination unit 1002 is specifically configured to adjust the initial packaging uniformity score by the following formula to obtain a final packaging uniformity score:

[0231] U=U0-k5*U0-k6*U0;

[0232] In the above formula, U represents the final packaging uniformity score, U0 represents the initial packaging uniformity score, k5 represents the quantity adjustment coefficient, and the value range of k5 is 0-0.5; k6 represents the area adjustment coefficient, and the value range of k6 is 0-0.5; when the total quantity is less than the maximum quantity, k5=0; when the total area is less than the maximum area, k6=0.

[0233] Optionally, the processing unit 1003 is specifically configured to determine a comprehensive evaluation value of the state of the packaging machine by the following formula:

[0234] F = Q*α+U*β;

[0235] In the above formula, F represents the comprehensive evaluation value of the state, Q represents the final score of the packaging quality, α represents the weight coefficient, U represents the final score of the packaging uniformity, β represents the weight coefficient, and α+β=1.

[0236] Optionally, the processing unit 1003 is also used for: if the comprehensive evaluation value of the status is greater than or equal to the first evaluation value, no status warning is issued for the packaging machine; if the comprehensive evaluation value of the status is less than the first evaluation value and greater than the second evaluation value, a first-level warning is issued for the packaging machine; if the comprehensive evaluation value of the status is less than or equal to the second evaluation value, a second-level warning is issued for the packaging machine; wherein the first evaluation value is greater than the second evaluation value.

[0237] An embodiment of the present application further provides a computer-readable storage medium, which includes computer-executable instructions. When the computer-executable instructions are executed on a computer, the computer executes the manufacturing component status monitoring method provided in the above embodiment.

[0238] The embodiment of the present application also provides a computer program product, which can be directly loaded into a memory and contains software code. After being loaded and executed by a computer, the computer program product can implement the manufacturing component status monitoring method provided in the above embodiment.

[0239] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0240] The present application is described with reference to flowcharts and / or block diagrams of methods, devices (systems) and computer program products according to embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0241] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0242] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0243] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the present invention can still be modified or replaced by equivalents. Any modification or equivalent replacement that does not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A method for monitoring the state of a manufacturing component, characterized in that: The components to be packaged of the piezoelectric sensor are placed on a packaging machine, and a collection device is provided on the packaging machine. The collection device includes an ultrasonic sensor and an image collector. The method includes: After the packaging machine completes packaging of the components to be packaged of the piezoelectric sensor, the ultrasonic information of the piezoelectric sensor during the curing process is collected by the ultrasonic sensor; wherein the ultrasonic information includes ultrasonic velocity, ultrasonic amplitude and ultrasonic frequency; Determining a curing state of the piezoelectric sensor according to the ultrasonic velocity, obtaining an initial packaging quality score according to the curing state, and adjusting the initial packaging quality score according to the ultrasonic velocity and the curing completion time to obtain a final packaging quality score; Determine the packaging uniformity of the piezoelectric sensor according to the ultrasonic amplitude, and determine the initial packaging uniformity score according to the packaging uniformity and the ultrasonic vibration frequency; collect image information of the piezoelectric sensor by the image collector, and judge whether to adjust the initial packaging uniformity score according to the image information, and if it is judged to be adjusted, adjust the initial packaging uniformity score according to the image information to obtain the final packaging uniformity score; The weighted sum of the final packaging quality score and the final packaging uniformity score is used to obtain a comprehensive status evaluation value of the packaging machine, and the comprehensive status evaluation value is used to provide status warning for the packaging machine.

2. The manufacturing component status monitoring method according to claim 1, characterized in that: The curing state is one of a normal state, an over-curing state and an incomplete curing state, and different curing states correspond to different initial scores of packaging quality; The step of determining the curing state of the piezoelectric sensor according to the ultrasonic velocity and obtaining an initial packaging quality score according to the curing state includes: If the ultrasonic wave velocity is within the standard ultrasonic wave velocity range, determining that the solidification state is the normal state, and obtaining an initial packaging quality score corresponding to the normal state; If the ultrasonic velocity is greater than the maximum value of the standard ultrasonic velocity range, determining that the curing state is the over-curing state, and obtaining an initial packaging quality score corresponding to the over-curing state; If the ultrasonic wave velocity is less than the minimum value of the standard ultrasonic wave velocity range, the curing state is determined to be the incomplete curing state, and an initial packaging quality score corresponding to the incomplete curing state is obtained.

3. The manufacturing component status monitoring method according to claim 2, characterized in that: The initial packaging quality score is adjusted according to the ultrasonic speed and the curing completion time to obtain a final packaging quality score, including: Determine the velocity deviation value of the ultrasonic wave of the piezoelectric sensor during the curing process according to the ultrasonic wave velocity; wherein, if the ultrasonic wave velocity is greater than the maximum value of the standard ultrasonic wave velocity range, the velocity deviation value ΔV=ultrasonic wave velocity-maximum value of the standard ultrasonic wave velocity range; if the ultrasonic wave velocity is within the standard ultrasonic wave velocity range, the velocity deviation value ΔV=0; if the ultrasonic wave velocity is less than the minimum value of the standard ultrasonic wave velocity range, the velocity deviation value ΔV=minimum value of the standard ultrasonic wave velocity range-ultrasonic wave velocity; Determine the curing time deviation value ΔT based on the standard curing time, ΔT=|curing completion time-standard curing time|; The final rating of the package quality is determined by the following formula: Q = Q0-k1*ΔV-k2*ΔT; In the above formula, Q represents the final packaging quality score, Q0 represents the initial packaging quality score, k1 represents the speed adjustment coefficient, the value range of k1 is 0-1, ΔV represents the speed deviation value, k2 represents the time adjustment coefficient, the value range of k2 is 0-1, and ΔT represents the curing time deviation value.

4. The method for monitoring the state of a manufacturing component according to claim 1, characterized in that: The packaging uniformity is one of packaging uniformity, over-compaction and packaging unevenness, and determining the packaging uniformity of the piezoelectric sensor according to the ultrasonic amplitude includes: If the ultrasonic amplitude is within the standard amplitude range, the packaging uniformity of the piezoelectric sensor is determined to be packaging uniformity, and the standard amplitude range is determined based on the amplitude characteristics of the historical standard piezoelectric sensor; If the ultrasonic amplitude is greater than the maximum value of the standard amplitude range, it is determined that the packaging uniformity of the piezoelectric sensor is over-compacted; If the ultrasonic amplitude is smaller than the minimum value of the standard amplitude range, it is determined that the packaging uniformity of the piezoelectric sensor is packaging unevenness.

5. The method for monitoring the state of a manufacturing component according to claim 1, characterized in that: The step of determining the packaging uniformity of the piezoelectric sensor according to the ultrasonic amplitude includes: If the ultrasonic amplitude is within the standard amplitude range, the packaging uniformity is determined to be the standard uniformity J0; If the ultrasonic amplitude is not within the standard amplitude range, the amplitude deviation value of the ultrasonic amplitude is determined, and the packaging uniformity is determined by the following formula; wherein, if the ultrasonic amplitude is greater than or equal to the maximum value of the standard amplitude range, the amplitude deviation value ΔZ=ultrasonic amplitude-maximum value of the standard amplitude range; if the ultrasonic amplitude is less than the minimum value of the standard amplitude range, the amplitude deviation value ΔZ=minimum value of the standard amplitude range-ultrasonic amplitude; J = ΔZ / (Zmax-Zmin); In the above formula, J represents packaging uniformity, ΔZ represents amplitude deviation, Zmax represents the maximum value of the standard amplitude range, and Zmin represents the minimum value of the standard amplitude range.

6. The method for monitoring the state of a manufacturing component according to claim 5, characterized in that: Determining an initial packaging uniformity score according to the packaging uniformity and the ultrasonic vibration frequency includes: Determine the absolute value of the frequency difference between the ultrasonic vibration frequency and the standard value of the ultrasonic vibration frequency |ΔP|; The ultrasonic frequency score is determined according to the absolute value of the frequency difference by the following formula: SP = SP0-|ΔP|*k3; In the above formula, SP represents the ultrasonic frequency score, SP0 represents the ultrasonic frequency standard score, |ΔP| represents the absolute value of the frequency difference, k3 represents the frequency adjustment coefficient, and the value range of k3 is 0-1; The standard uniformity score corresponding to the standard uniformity is adjusted according to the amplitude deviation value by the following formula to obtain the uniformity score: SJ=SJ0-ΔZ*k4; In the above formula, SJ represents the uniformity score, SJ0 represents the standard uniformity score, ΔZ represents the amplitude deviation value, k4 represents the amplitude adjustment coefficient, and the value range of k4 is 0-1; The initial packaging uniformity score is obtained by weighted summing the ultrasonic frequency score and the uniformity score using the following formula: U0=SP*a+SJ*b; In the above formula, U0 represents the initial packaging uniformity score, SP represents the ultrasonic vibration frequency score, a represents the frequency weight coefficient, SJ represents the uniformity score, b represents the uniformity weight coefficient, and a+b=1.

7. The method for monitoring the state of a manufacturing component according to claim 1, characterized in that: The collecting image information of the piezoelectric sensor and determining whether to adjust the initial packaging uniformity score according to the image information includes: Acquire defect features of the piezoelectric sensor in the image information, wherein the defect features include protrusions and / or depressions; The total number of the protrusions and / or depressions and the total area of ​​the protrusions and / or depressions are obtained, and whether to adjust the initial packaging uniformity score is determined according to the total number and the total area.

8. The method for monitoring the state of a manufacturing component according to claim 7, characterized in that: The determining whether to adjust the initial packaging uniformity score according to the total number and the total area includes: If the total number is less than the maximum number and the total area is less than the maximum area, it is determined that the initial packaging uniformity score is not adjusted; otherwise, it is determined that the initial packaging uniformity score is adjusted.

9. The method for monitoring the state of a manufacturing component according to claim 8, characterized in that: If it is determined to be an adjustment, the initial packaging uniformity score is adjusted according to the image information to obtain a final packaging uniformity score, including: The initial packaging uniformity score is adjusted by the following formula to obtain the final packaging uniformity score: U=U0-k5*U0-k6*U0; In the above formula, U represents the final score of packaging uniformity, U0 represents the initial score of packaging uniformity, k5 represents the quantity adjustment coefficient, and the value range of k5 is 0-0.5, and k6 represents the area adjustment coefficient, and the value range of k6 is 0-0.5; Among them, when the total number is less than the maximum number, k5=0; when the total area is less than the maximum area, k6=0.

10. The method for monitoring the state of a manufacturing component according to claim 1, characterized in that: The weighted sum of the final packaging quality score and the final packaging uniformity score to obtain the comprehensive evaluation value of the packaging machine state includes: The comprehensive evaluation value of the state of the packaging machine is determined by the following formula: F = Q*α+U*β; In the above formula, F represents the comprehensive evaluation value of the state, Q represents the final score of the packaging quality, α represents the weight coefficient, U represents the final score of the packaging uniformity, β represents the weight coefficient, and α+β=1.

11. The method for monitoring the state of a manufacturing component according to claim 1, characterized in that: The warning level of the status warning is one of a first-level warning and a second-level warning, the warning level of the first-level warning is lower than the warning level of the second-level warning, and the method further includes: If the comprehensive evaluation value of the status is greater than or equal to the first evaluation value, no status warning is issued for the packaging machine; if the comprehensive evaluation value of the status is less than the first evaluation value and greater than the second evaluation value, the first level warning is issued for the packaging machine; if the comprehensive evaluation value of the status is less than or equal to the second evaluation value, the second level warning is issued for the packaging machine; wherein the first evaluation value is greater than the second evaluation value.

12. A manufacturing component condition monitoring device, characterized in that: include: A processor and a memory; wherein the memory is used to store one or more programs, and the one or more programs include computer-executable instructions. When the device is running, the processor executes the computer-executable instructions stored in the memory to enable the device to perform the method described in any one of claims 1 to 11.

13. A computer-readable storage medium, characterized in that: When the computer-executable instructions stored in the computer-readable storage medium are executed by a processor of an electronic device, the electronic device is capable of performing the method as claimed in any one of claims 1 to 11.

14. A computer program product, characterized in that The computer program product comprises: a computer program or instructions, and when the computer program or instructions are run on a computer, the computer is caused to perform the method according to any one of claims 1 to 11.

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