Temperature equalizing device for chip aging test and chip aging test device

Abstract

The invention provides a temperature equalizing device for a chip aging test and a chip aging test device, and belongs to the technical field of chip tests.The temperature equalizing device comprises a heating unit; at least one heat conduction unit, wherein each heat conduction unit is used for transferring heat to the corresponding chip to be tested; the temperature equalizing unit is arranged between the heating unit and the heat conducting unit; the temperature equalizing unit is used for distributing heat generated by the heating unit on the temperature equalizing unit and transmitting the distributed heat to each heat conduction unit. According to the invention, the temperature equalizing unit is connected between the heating unit and the heat conduction unit, so that when the plurality of chips to be tested are subjected to the aging test at the same time, the temperature transferred to the corresponding chips to be tested by each heat conduction unit can be ensured to be consistent, thereby ensuring that each chip to be tested is in the same test temperature condition during the chip aging test, and improving the test efficiency. The uniformity of temperature distribution on each to-be-tested chip is improved, and the temperature of all to-be-tested chips can be accurately controlled.

Description

Technical Field

[0001] The present invention belongs to the field of chip testing technology, and relates to an aging testing technology for multiple chips, and specifically is a temperature equalizing device for chip aging testing and a chip aging testing device. Background Art

[0002] As the complexity of chips increases, more and more functional modules are integrated inside the chips, and the manufacturing process is more advanced. Under this trend, how to conduct chip testing completely and effectively is crucial. The chip aging test requires that multiple chips be heated for a certain period of time at the same time under specific temperature conditions. The current testing method is to install multiple chip test boards in a heat preservation cover, which is used to provide a closed heating cavity, and provide a heat source above the heat preservation cover to provide the temperature conditions required for chip testing.

[0003] The heat source in the prior art is basically provided by a heat flow meter. The working principle of the heat flow meter is: the normal temperature gas (compressed air) with a certain pressure is successively introduced into the compressor after passing through the air filter and the dryer. The compressor cools the normal temperature gas into low temperature gas, and the low temperature gas is transported to the heating head position of the heat flow meter. The heating head has a heating tube and a temperature controller, which can heat the low temperature gas to the required temperature. During chip testing, the heating head is installed above the heat preservation cover, and there is an air outlet at the end of the heating head. The heated gas is blown from the air outlet to the heating cavity where the chip test board is located. Since the heated gas diffuses from the center of the chip test board to the edges around, when the number of chips measured at the same time is large, the temperature points and areas that need to be controlled on the chip test board are large, but due to the dissipation of the hot air flow, the temperature distribution on the chip test board will form a trend of decreasing gradient from the heat source to the surrounding areas, resulting in uneven temperature distribution of chips at different positions on the test board when multiple chip aging tests are performed, so that the temperature consistency conditions required for all chips to be tested cannot be met at the same time. Summary of the invention

[0004] In the prior art, when performing multiple chip aging heating tests, the chip temperature distribution at different positions on the test board is uneven, and there is a technical problem that the temperature consistency and precise temperature control cannot be met on all chips to be tested. To address this technical problem, the present invention proposes a temperature equalizing device for chip aging testing and a chip aging testing device.

[0005] The temperature equalization device for chip aging test of the present invention connects the temperature equalization unit between the heating unit and the heat conducting unit, and evenly distributes the heat generated by the heating unit on the temperature equalization unit before transferring it to the heat conducting unit. When multiple chips to be tested are simultaneously subjected to aging test, it can ensure that the temperature transferred to the corresponding chip to be tested by each heat conducting unit is consistent, thereby ensuring that each chip to be tested is under the same test temperature condition during the chip aging test, improving the uniformity of temperature distribution on each chip to be tested, and facilitating uniform and accurate control of the temperature of all chips to be tested.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0007] The present invention provides a temperature equalizing device for chip aging test, comprising:

[0008] Heating unit;

[0009] At least one heat transfer unit, each heat transfer unit is used to transfer heat to a corresponding chip to be tested;

[0010] and a temperature-averaging unit, which is arranged between the heating unit and the heat-conducting unit; the temperature-averaging unit is used to distribute the heat generated by the heating unit thereon and transfer the distributed heat to each heat-conducting unit.

[0011] It is further defined that the heat conduction unit includes a first connection end, an elastic member, a connecting rod, and a second connection end,

[0012] The first connection end is connected to the temperature balancing unit;

[0013] The connecting rod is connected to the first connecting end via the elastic member;

[0014] The second connection end is used to connect to the chip to be tested.

[0015] It is further defined that the second connecting end includes a guide member and a guide groove, and the guide member is placed in the guide groove;

[0016] The guide member rotates freely in the guide groove to adjust the bonding direction of the heat conduction unit and the chip to be tested, so that the bonding surface of each heat conduction unit and the chip to be tested is in the same plane.

[0017] It is further defined that the heat conduction unit also includes a sleeve, one end of the sleeve is connected to the first connecting end, the elastic member is placed in the sleeve and connected to the sleeve; the connecting rod passes through the other end of the sleeve and extends into the sleeve and is connected to the elastic member.

[0018] It is further defined that the second connection end is vertically pressed against the heated surface of the chip to be tested.

[0019] It is further defined that the temperature equalizing device further comprises a temperature control unit, and the temperature control unit comprises a temperature controller, a temperature sensing probe and a temperature sensing line.

[0020] The temperature sensing probe is installed on the heating unit and is used to detect the heating temperature of the heating unit;

[0021] The temperature sensing line connects the temperature sensing probe and the temperature controller, and transmits the heating temperature detected by the temperature sensing probe to the temperature controller;

[0022] The temperature controller is used to control the heating temperature of the heating unit and control the heating temperature of the heating unit to be maintained at a target temperature.

[0023] It is further defined that the target temperature is 25°C-300°C.

[0024] The present invention provides a chip aging test device, comprising a test circuit board and the above-mentioned temperature equalization device for chip aging test, wherein the test circuit board is used for mounting a chip to be tested.

[0025] It is further defined that the chip aging test device also includes test fixtures having the same number as the chips to be tested, the test fixtures are installed on a test circuit board, the chips to be tested are fixed to the test fixtures, and the upper end surface of the test fixtures is provided with test holes, and the heat conduction unit passes through the test holes to fit the chips to be tested.

[0026] It is further defined that the chip aging test device also includes a heat preservation cover, which is used to provide a closed heating cavity, and the temperature equalizing device, test circuit board and test fixture used for chip aging test are all located in the heating cavity.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] 1. The temperature equalization device for chip aging test of the present invention connects the temperature equalization unit between the heating unit and the heat conduction unit, and the heat generated by the heating unit can be quickly conducted on the temperature equalization unit, so that the heat is evenly distributed on the temperature equalization unit before being transferred to the heat conduction unit. When multiple chips to be tested are subjected to aging tests at the same time, it can ensure that the temperature transferred to the corresponding chip to be tested by each heat conduction unit is consistent, thereby ensuring that each chip to be tested is under the same test temperature conditions during the chip aging test, improving the uniformity of temperature distribution on each chip to be tested, and facilitating accurate control of the temperature of each chip to be tested.

[0029] 2. The heat transfer unit of the present invention corresponds to the chip to be tested one by one, so that there is point-to-point contact between the heat transfer unit and the chip to be tested, thereby ensuring the effectiveness of heat transfer.

[0030] 3. The heat conduction unit of the present invention includes an elastic member, which can provide a buffering force. On the one hand, the buffering force can adjust the distance between the temperature equalizing unit and the chip to be tested, so that each second connection end and the fitting surface of the corresponding chip to be tested are in the same horizontal plane, that is, it ensures that each second connection end can fully contact with the corresponding chip to be tested to ensure effective heat transfer; on the other hand, it can prevent the second connection end from hard contact with the chip to be tested, that is, prevent the chip to be tested from being damaged.

[0031] 4. The heat conduction unit of the present invention also includes a guide member, which can rotate freely in the guide groove to adjust the fitting direction of the second connection end and the chip to be tested, so that the fitting surface of each second connection end and the chip to be tested is in the same plane, that is, it can ensure that each second connection end can be vertically pressed on the corresponding chip to be tested to eliminate installation errors.

[0032] 5. The temperature control unit of the present invention can support 1000 hours of continuous chip aging test; in addition, during the heating process, the heat conduction unit is used as the heat conduction medium, and the temperature control unit will not be in direct contact with the test machine and the chip test board, avoiding the risk of machine downtime and chip test board damage.

[0033] 6. The chip aging test device of the present invention also includes a heat-insulating cover, which is used to provide a closed heating cavity. The heat-insulating cover plays a role of heat insulation and heat preservation to ensure the stability of the temperature in the heating cavity during the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 The present invention is a schematic diagram of a temperature equalizing device for chip aging test;

[0035] Figure 2 It is a schematic diagram of the installation of the temperature-averaging unit, the retractable thermal conductive needle and the test fixture;

[0036] Figure 3 This is a schematic diagram of the installation of the temperature averaging unit and the retractable heat conducting needle;

[0037] Figure 4 It is a schematic diagram of the structure of the thermal insulation cover;

[0038] Figure 5 It is a structural schematic diagram of the temperature-averaging unit;

[0039] Figure 6 is a schematic diagram of the structure of the heat transfer unit;

[0040] Figure 7 is a schematic diagram of a thermostat;

[0041] In the figure, 100-heating unit, 200-temperature averaging unit, 201-first connecting hole, 202-second connecting hole, 300-heat conducting unit, 301-first connecting end, 302-elastic member, 303-sleeve, 304-connecting rod, 305-guide member, 306-second connecting end, 400-test circuit board, 500-test fixture, 600-insulation cover, 700-temperature controller, 701-temperature sensing probe, 702-temperature sensing line, 703-plug. DETAILED DESCRIPTION

[0042] In order to make the technical solution of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in combination with the embodiments and drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of protection claimed, but merely represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] See also Figure 1 and Figure 3 The present invention provides a temperature equalization device for chip aging test, comprising: a heating unit 100; at least one heat conduction unit 300, each heat conduction unit 300 is used to transfer heat to the corresponding chip to be tested; and a temperature equalization unit 200, each heat conduction unit 300 corresponds to a chip to be tested, and the temperature equalization unit 200 is arranged between the heating unit 100 and the heat conduction unit 300; the temperature equalization unit 200 is used to distribute the heat generated by the heating unit 100 thereon, and transfer the distributed heat to each heat conduction unit 300. For details, see Figure 1 The heating unit 100, the temperature balancing unit 200 and the heat conducting unit 300 are arranged in sequence from top to bottom, wherein the lower surface (heat transfer surface) of the heating unit 100 is in contact with the upper surface (heat receiving surface) of the temperature balancing unit 200, and the lower surface (heat transfer surface) of at least one heat conducting unit 300 is connected to the lower surface (heat receiving surface) of the temperature balancing unit 200. The temperature balancing unit 200 can evenly distribute the heat generated by the heating unit 100 thereon, and transfer the evenly distributed heat to each heat conducting unit 300, so that the temperature transferred to the chip to be tested by each heat conducting unit 300 is consistent, thereby ensuring that when multiple chips are subjected to aging tests at the same time, each chip to be tested is under the same test temperature conditions, thereby improving the uniformity of temperature distribution on each chip to be tested, and facilitating precise control of the temperature of each chip to be tested.

[0044] See also Figure 6In the present invention, the heat conduction unit 300 includes a first connection end 301, an elastic member 302, a connecting rod 304 and a second connection end 306. The first connection end 301 is connected to the temperature balancing unit 200; the connecting rod 304 is connected to the first connection end 301 through the elastic member 302; and the second connection end 306 is used to connect to the chip to be tested.

[0045] In the present invention, the heat conduction unit 300 also includes a sleeve 303, one end of the sleeve 303 is connected to the first connection end 301, the elastic member 302 is placed in the sleeve 303 and connected to the sleeve 303; the connecting rod 304 passes through the other end of the sleeve 303 and extends into the sleeve 303 and is connected to the elastic member 302.

[0046] In the present invention, the second connection end 306 includes a guide member 305 and a guide groove, and the guide member 305 is placed in the guide groove; the guide member 305 rotates freely in the guide groove to adjust the bonding direction of the thermal conductive unit 300 and the chip to be tested, so that the bonding surface of each thermal conductive unit 300 and the chip to be tested is in the same plane.

[0047] Specifically, the top of the first connection end 301 is connected to the temperature balancing unit 200. Preferably, a thread is provided on the top of the first connection end 301. The top of the first connection end 301 is threadedly connected to the first connection hole 201 on the temperature balancing unit 200. The threaded connection method is also convenient for adjusting the height of the heat conducting unit 300. The bottom of the first connection end 301 is connected to the top end surface of the sleeve 303. The opening of the sleeve 303 is provided on the bottom end surface. The top of the elastic member 302 is fixedly connected to the top of the sleeve 303. The top of the connecting rod 304 extends along the opening of the sleeve 303. Enter the interior of the sleeve 303 and be fixedly connected with the bottom of the elastic member 302, the bottom of the connecting rod 304 is connected with the guide member 305, preferably, the guide member 305 is a universal spherical structure, and the guide groove is a spherical structure matching the shape of the guide member 305, so that the guide member 305 can rotate freely in the guide groove, and the second connecting end 306 is adjusted. The bonding direction of the chip to be tested is adjusted so that each second connecting end 306 and the bonding surface of the chip to be tested are in the same plane, that is, it can be ensured that each second connecting end 306 can be vertically pressed on the corresponding chip to be tested to eliminate the installation error. The guide groove is set at the top of the second connecting end 306, and the bottom of the second connecting end 306 is in contact with the heated surface of the chip to be tested. In the present invention, the elastic member 302 can be a rubber block, a plastic block or a spring, etc. As a preferred embodiment of the present invention, the elastic member 302 is a spring. The elastic member 302 is used to provide a buffering force for the second connection end 306. On the one hand, it adjusts the distance between the temperature equalizing unit 200 and the chip to be tested so that each second connection end 306 and the fitting surface of the chip to be tested are on the same horizontal plane; on the other hand, it prevents the second connection end 306 from making hard contact with the new connection to be tested, thereby protecting the chip to be tested.

[0048] As a preferred embodiment of the present invention, the second connection end 306 is vertically pressed on the heated surface of the chip to be tested, and the bottom end surface of the second connection end 306 is a plane, which is convenient for full contact with the heated surface of the chip to be tested, thereby increasing the heat transfer efficiency; at the same time, the heat conduction unit 300 and the chip to be tested are in point-to-point contact, thereby ensuring the effectiveness of heat transfer.

[0049] See also Figure 7 The temperature equalization device of the present invention also includes a temperature control unit, which includes a temperature controller 700, a temperature sensing probe 701 and a temperature sensing line 702. The temperature sensing probe 701 is installed on the heating unit 100 and is used to detect the heating temperature of the heating unit 100; the temperature sensing line 702 connects the temperature sensing probe 701 and the temperature controller 700, and transmits the heating temperature detected by the temperature sensing probe 701 to the temperature controller 700; the temperature controller 700 is used to control the heating temperature of the heating unit 100, and control the heating temperature of the heating unit 100 to be maintained at a target temperature. Specifically, the temperature controller 700 compares the heating temperature detected by the temperature sensing probe 701 with the target in real time. If the heating temperature detected by the temperature sensing probe 701 is lower than the target, the heating unit 100 is controlled to continue heating. If the heating temperature detected by the temperature sensing probe 701 reaches the target temperature, the heating unit 100 is controlled to keep warm.

[0050] Specifically, a plug 703 is provided on the thermostat 700 , and the thermostat 700 is powered by the plug 703 .

[0051] See also Figure 5 The temperature averaging unit 200 is provided with multiple rows of first connection holes 201, each row is provided with multiple holes, and each first connection hole 201 is connected to a corresponding heat conduction unit 300. Preferably, each first connection hole 201 on the temperature averaging unit 200 is detachably connected to the corresponding heat conduction unit 300, such as plug-in, threaded connection, etc. In addition, each first connection hole 201 on the temperature averaging unit 200 and the corresponding heat conduction unit 300 can also be connected in a non-detachable manner, such as welding, etc. A temperature sensing probe 701 is connected to the temperature averaging unit 200, and the heating temperature detected by the temperature sensing probe 701 is transmitted to the temperature controller 700 through the temperature sensing line 702. The temperature controller 700 controls the heating temperature and keeps the heating temperature at the target temperature, so as to realize the aging test of multiple chips to be tested under the same conditions.

[0052] As an expandable solution of the present invention, each row of first connection holes 201 can be controlled as a separate temperature control part. For example, when performing an aging test, a temperature sensing probe 701 can be connected to each row of first connection holes 201. Each temperature sensing probe 701 transmits the measured heating temperature to the temperature controller 700 through the corresponding temperature sensing line 702. The heating temperature of each row of first connection holes 201 is individually controlled by the temperature controller 700 to achieve simultaneous testing of chips to be tested with multiple different test requirements, and at the same time, achieve uniform temperature distribution of the parts corresponding to each row of first connection holes 201 on the temperature averaging unit 200. At this time, the parts corresponding to each row of first connection holes 201 on the temperature averaging unit 200 should be independent, and a heat insulation unit is set between two adjacent parts so that the heating temperatures between the two adjacent parts will not affect each other.

[0053] In the present invention, the temperature balancing unit 200 is further provided with a second connection hole 202, and the second connection hole 202 is used for assembly and connection with the heating unit 100. Specifically, a connection hole is provided at a corresponding position on the heating unit 100, and the heating unit 100 and the temperature balancing unit 200 are fixedly connected by bolts or screws that sequentially penetrate the connection hole on the heating unit 100 and the second connection hole 202 on the temperature balancing unit 200.

[0054] In the present invention, the target temperature is 25°C-300°C. Specifically, the target temperature can be 25°C, 50°C, 80°C, 100°C, 120°C, 150°C, 180°C, 200°C, 220°C, 250°C, 280°C or 300°C, etc. Preferably, the target temperature is 40°C-120°C. The control unit of the present invention can realize a wide range test of any temperature value within the range of 25°C-300°C.

[0055] Preferably, the temperature-averaging unit 200 in the present invention is a cast aluminum heating block; the entire heat-conducting unit 300 is a brass structure to improve thermal conductivity, and both the brass structure and the cast aluminum heating block have good thermal conductivity.

[0056] The present invention provides a chip aging test device, including a test circuit board 400 and the above-mentioned temperature equalization device for chip aging test. The test circuit board 400 is used to install the chip to be tested. Specifically, the chip to be tested is installed on the upper end surface of the test circuit board 400.

[0057] See also Figure 2In the present invention, the chip aging test device further includes a test fixture 500 having the same number as the number of the chips to be tested, the test fixture 500 is mounted on the test circuit board 400, the chips to be tested are fixed on the test fixture 500, the upper end surface of the test fixture 500 is provided with a test hole, and the heat conduction unit passes through the test hole to fit the chip to be tested. Specifically, the second connection end 306 passes through the test hole to fit the chip to be tested, the test fixture 500 is mounted on the upper end surface of the test circuit board 400, one test fixture 500 is correspondingly mounted with one chip to be tested, and the number of the heat conduction units 300 is greater than or equal to the number of the chips to be tested.

[0058] See also Figure 4 In the present invention, the chip aging test device also includes a heat preservation cover 600, which is used to provide a closed heating cavity. The temperature equalization device for chip aging test, the test circuit board 400 and the test fixture 500 are all located in the heating cavity.

[0059] Preferably, the heat-insulating cover 600 is a heat-insulating cover with heat-insulating properties.

[0060] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A temperature equalization device for chip aging test, characterized in that: include: A heating unit (100); At least one heat conduction unit (300), each heat conduction unit (300) being used to transfer heat to a corresponding chip to be tested; and a temperature balancing unit (200) disposed between the heating unit (100) and the heat conducting unit (300); the temperature balancing unit (200) is used to distribute the heat generated by the heating unit (100) thereon, and to transfer the distributed heat to each heat conducting unit (300).

2. The temperature equalizing device for chip aging test according to claim 1, characterized in that: The heat conduction unit (300) comprises a first connection end (301), an elastic member (302), a connecting rod (304) and a second connection end (306). The first connection end (301) is connected to the temperature equalizing unit (200); The connecting rod (304) is connected to the first connecting end (301) via the elastic member (302); The second connection end (306) is used to connect to the chip to be tested.

3. The temperature equalizing device for chip aging test according to claim 2, characterized in that: The second connecting end (306) comprises a guide member (305) and a guide groove, and the guide member (305) is placed in the guide groove; The guide member (305) rotates freely in the guide groove to adjust the bonding direction of the heat conduction unit (300) and the chip to be tested, so that the bonding surface of each heat conduction unit (300) and the chip to be tested is in the same plane.

4. The temperature equalizing device for chip aging test according to claim 2 or 3, characterized in that: The heat conduction unit (300) further comprises a sleeve (303), one end of the sleeve (303) being connected to the first connection end (301), the elastic member (302) being disposed in the sleeve (303) and being connected to the sleeve (303); the connecting rod (304) passing through the other end of the sleeve (303) and extending into the sleeve (303), and being connected to the elastic member (302).

5. The temperature equalizing device for chip aging test according to claim 2, characterized in that: The second connection end (306) is vertically pressed against the heated surface of the chip to be tested.

6. The temperature equalizing device for chip aging test according to claim 1, characterized in that: The temperature equalizing device further comprises a temperature control unit, wherein the temperature control unit comprises a temperature controller (700), a temperature sensing probe (701) and a temperature sensing line (702). The temperature sensing probe (701) is installed on the heating unit (100) and is used to detect the heating temperature of the heating unit (100); The temperature sensing line (702) connects the temperature sensing probe (701) and the temperature controller (700), and transmits the heating temperature detected by the temperature sensing probe (701) to the temperature controller (700); The temperature controller (700) is used to control the heating temperature of the heating unit (100), and controls the heating temperature of the heating unit (100) to be maintained at a target temperature.

7. The temperature equalizing device for chip aging test according to claim 6, characterized in that: The target temperature is 25°C-300°C.

8. A chip aging test device, characterized in that: The invention comprises a test circuit board (400) and a temperature equalizing device for chip aging test according to any one of claims 1 to 7, wherein the test circuit board (400) is used for mounting a chip to be tested.

9. The chip aging test device according to claim 8, characterized in that: The chip aging test device further comprises test fixtures (500) having the same number as the chips to be tested, wherein the test fixtures (500) are mounted on a test circuit board (400), the chips to be tested are fixedly connected to the test fixtures (500), and the upper end surface of the test fixtures (500) is provided with test holes, and the heat conduction unit (300) passes through the test holes and is bonded to the chips to be tested.

10. The chip aging test device according to claim 9, characterized in that: The chip aging test device further comprises a heat preservation cover (600), wherein the heat preservation cover (600) is used to provide a sealed heating cavity, and the temperature equalization device for chip aging test, the test circuit board (400) and the test fixture (500) are all located in the heating cavity.

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