A logic control method for voltage ionization based on current magnitude control
By monitoring the real-time temperature and roughness of the insulating material connection points, calculating the dust accumulation index and evaluating weights, measuring the interface exposure distance, detecting the short-circuit frequency, and updating the creepage distance in real-time to adjust the voltage, the power leakage problem caused by dust accumulation and humidity in high-voltage electrostatic discharge devices is solved, and the safety of the power system is improved.
Patent Information
- Application Number
- CN202411939481.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2044-12-26
AI Technical Summary
The existing high-voltage electrostatic discharge devices fail to effectively consider the humidity and dust accumulation of the insulating material connection points, resulting in breaking through the insulating material before the voltage reaches a fixed threshold, causing safety hazards such as power leakage.
By monitoring the real-time temperature and roughness of the insulating material connection points, calculating the dust accumulation index and evaluating weights, measuring the interface exposure distance, detecting short-circuit frequency, comprehensive risk index and creepage change coefficient, and updating creepage distance in real time to adjust voltage.
Improve the risk accuracy of evaluating the connection points of insulating materials, reduce the risk of insulating materials breakdown, and ensure the safety of the power system.
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Figure CN119781567B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of voltage control, and more specifically, the present invention relates to a logic control method for voltage ionization based on current magnitude control. Background Art
[0002] Voltage control technology is a technology used to regulate and manage voltage levels, widely used in power systems, electronic devices, and automation control fields. The application of voltage control technology to high-voltage electrostatic discharge devices can reasonably control high voltage and reduce the safety hazards brought by high voltage.
[0003] The prior art has the following deficiencies:
[0004] In the past, high-voltage electrostatic discharge devices monitored the voltage according to a fixed threshold set based on the creepage distance of insulating materials, without considering the changes in the creepage distance of insulating materials caused by the humidity and dust accumulation at the connection points of insulating materials, resulting in the breakdown of insulating materials before the voltage reaches the fixed threshold, causing safety hazards such as power leakage. Summary of the Invention
[0005] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a logic control method for voltage ionization based on current magnitude control, which calculates the real-time risk of connection points by analyzing the dust accumulation degree of connection points of insulating materials and monitoring the humidity in real time, and calculates the dynamic adjustment threshold of connection points to solve the problems proposed in the above background art.
[0006] To achieve the above object, the present invention provides the following technical solutions:
[0007] A logic control method for voltage ionization based on current magnitude control, comprising the following steps:
[0008] Step S1: Obtain the connection port areas of insulating materials in the high-voltage electrostatic discharge device, monitor the real-time temperature of each connection port area, and detect the roughness of the insulating materials at both ends of each connection port area;
[0009] Step S2: Calculate the average roughness of the corresponding connection port area according to the roughness of the insulating materials at both ends of each connection port area, and use the logistic regression algorithm to calculate the dust accumulation index of the corresponding connection port area by integrating the real-time temperature and the average roughness of each connection port area, and monitor the real-time humidity of each connection port area;
[0010] Step S3: Calculate the evaluation weight of the corresponding connection port area using the preference ranking method by integrating the real-time humidity of each connection port area and the dust accumulation index of the corresponding connection port area, measure the interface exposure distance of each connection port area, and generate the risk index of the corresponding connection port area according to the interface exposure distance and the evaluation weight of each connection port area;
[0011] Step S4: Detect the short - circuit frequency of the connection port area. Using the geometric mean algorithm, calculate the creepage change coefficient of each connection port area by integrating the risk index and the short - circuit frequency of the connection port area. Obtain the default creepage distance of each connection port area, and use the creepage change coefficient to update the default creepage distance of each connection port area in real - time. Adjust the voltage according to the real - time changing creepage distance of each connection port area.
[0012] In a preferred embodiment, in step S1, access the historical database to obtain each connection port area of the insulating material in the high - voltage electrostatic discharge device. Obtain the real - time temperature of each connection port area through a thermocouple, and use a laser scanning instrument to scan both ends of each connection port area of the insulating material in the high - voltage electrostatic discharge device to obtain the roughness of the insulating material at both ends of each connection port area.
[0013] In a preferred embodiment, in step S2, calculate the average value of the roughness of the insulating material at both ends of each connection port area as the roughness mean value of the corresponding connection port area;
[0014] Use the Max - Min normalization algorithm to perform tokenization processing on the real - time temperature of each connection port area: x nore = x - x min / x max - x min , where x is the real - time temperature of each connection port area, x nore is the standardized result of the real - time temperature of the corresponding connection port area, x max is the maximum value of the real - time temperature of all connection port areas, x min is the minimum value of the real - time temperature of all connection port areas.
[0015] In a preferred embodiment, in step S2, integrate the standardized result of the real - time temperature and the roughness mean value of each connection port area, and use the logistic regression algorithm to calculate the dust accumulation index of the corresponding connection port area: C = 1 / (1 + e^(-z)), where e is the natural base, z is the logistic regression parameter and z is the sum of the standardized result of the real - time temperature and the roughness of each connection port area, and C is the dust accumulation index of the corresponding connection port area.
[0016] In a preferred embodiment, in step S3, the interface exposure distance is the interval between the insulating materials at both ends of the connection port area;
[0017] Measure the interface exposure distance of each connection port area through a digital rangefinder. Use the Max - Min normalization algorithm for the real - time humidity and the interface exposure distance of each connection port area to obtain the standardized result of the real - time temperature and the standardized result of the interface exposure distance of each connection port area.
[0018] In a preferred embodiment, in step S3, the sum of the real-time temperature normalization results of each connection port area and the dust accumulation index of the corresponding connection port area is used as the weight index of the corresponding connection port area;
[0019] Using the preference ranking method, calculate the evaluation weight of the corresponding connection port area by synthesizing the weight index of each connection port area and the interface exposure distance normalization result. The specific steps are as follows:
[0020] After sorting each connection port area in descending order according to the weight index, assign the preset relative importance coefficient of each connection port area according to the sorting order, calculate the TTL index of each connection port area according to the assignment result, and calculate the evaluation weight of each connection port area according to the TTL index;
[0021] Multiply the interface exposure distance normalization result of each connection port area by the evaluation weight of the corresponding connection port area, and use the product result as the risk index of the corresponding connection port area.
[0022] In a preferred embodiment, in step S4, select a period of time as the analysis time, count the number of short circuits in each connection port area during the analysis time, use a current detector to monitor the current in each connection port area in real time, initialize the short circuit count of each connection port area to 0, and when the current in the connection port area exceeds the preset current threshold during the analysis time, increment the short circuit count by 1, and count the short circuit count of each connection port area during the analysis time.
[0023] In a preferred embodiment, in step S4, select the maximum value of the short circuit count values of all connection port areas, and use the ratio of the short circuit count value of the connection port area to the maximum value of the short circuit count values as the short circuit frequency of the corresponding connection port area;
[0024] Using the geometric mean algorithm, calculate the creepage change coefficient of each connection port area by synthesizing the risk index of the connection port area and the short circuit frequency of the connection port area. The formula is as follows: Where a is the risk index of the connection port area, b is the short circuit frequency of the corresponding connection port area, and p is the creepage change coefficient of the corresponding connection port area;
[0025] Calculate the average value of the creepage change coefficients of all connection port areas, and use the ratio of the creepage change coefficient of the connection port area to the average value of the creepage change coefficients of the connection port area as the adjustment ratio of the corresponding connection port area.
[0026] In a preferred embodiment, in step S4, access the historical database to obtain the default creepage distance of each connection port area, and divide the default creepage distance of each connection port area by the adjustment ratio of the corresponding connection port area to obtain the updated creepage distance;
[0027] The specific steps for adjusting the voltage according to the creepage distance of each connection port area are as follows:
[0028] Set a period of time as the adjustment time for timing, calculate the average creepage distance of each connection port area during the adjustment time, calculate the discharge current of the discharge needle and the zero electrode plate through the charged module, obtain the voltage reduction standard by multiplying the average creepage distance of each connection port area by a preset voltage conversion coefficient, compare the discharge current of the discharge needle and the zero electrode plate with a preset comparison threshold, and adjust according to the voltage reduction standard;
[0029] When the discharge current is lower than the comparison threshold, no adjustment is made; when the discharge current is higher than the comparison threshold, subtract the voltage reduction standard from the current voltage, then compare the discharge current with the comparison threshold, and repeat the adjustment until the discharge current is lower than the comparison threshold and stop. Take the finally obtained voltage value as the current voltage of the high-voltage electrostatic discharge device;
[0030] The discharge needle and the zero electrode plate are components in electrical engineering and high-voltage electrical experiments, and are used to study and test discharges.
[0031] The technical effects and advantages of a logic control method for voltage ionization based on current magnitude control in the present invention:
[0032] In the present invention, by obtaining each connection port area of the insulating material in the high-voltage electrostatic discharge device, monitoring the real-time temperature of each connection port area, detecting the roughness of the connection port area, calculating the dust accumulation index of the corresponding connection port area by integrating the real-time temperature and roughness of each connection port area, calculating the dust accumulation index can quickly reflect the dust accumulation degree of the connection port area, reduce the cost of a large number of dust accumulation measurements, monitor the real-time humidity of each connection port area, calculate the evaluation weight of the corresponding connection port area by integrating the real-time humidity of each connection port area and the dust accumulation index of the corresponding connection port area, measure the interface exposure distance of each connection port area, generate the risk index of the corresponding connection port area according to the interface exposure distance and evaluation weight of each connection port area, evaluate the change in creepage distance according to the risk index of the connection port, improve the accuracy of the evaluation result, and provide a data basis for subsequent corresponding adjustments for the connection port area. Detect the short-circuit frequency of the connection port area and obtain the default creepage distance of each connection port area, calculate the creepage change coefficient of each connection port area by integrating the risk index of the connection port area and the short-circuit frequency of the connection port area, update the default creepage distance of each connection port area in real time according to the creepage change coefficient, and adjust the voltage according to the real-time changing creepage distance of each connection port area to reduce the breakdown risk of the insulating material. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] Figure 1 It is a schematic diagram of a logic control method for voltage ionization based on current magnitude control in the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0034] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0035] The present invention obtains the connection port areas of the insulating material in the high-voltage electrostatic discharge device, monitors the real-time temperature of each connection port area, detects the roughness of the connection port area, calculates the dust accumulation index of the corresponding connection port area by comprehensively considering the real-time temperature and roughness of each connection port area, monitors the real-time humidity of each connection port area, calculates the evaluation weight of the corresponding connection port area by comprehensively considering the real-time humidity of each connection port area and the dust accumulation index of the corresponding connection port area, measures the interface exposure distance of each connection port area, generates the risk index of the corresponding connection port area according to the interface exposure distance and evaluation weight of each connection port area, detects the short-circuit frequency of the connection port area and obtains the default creepage distance of each connection port area, calculates the creepage change coefficient of each connection port area by comprehensively considering the risk index of the connection port area and the short-circuit frequency of the connection port area, updates the default creepage distance of each connection port area in real time according to the creepage change coefficient, and adjusts the voltage according to the real-time changing creepage distance of each connection port area to reduce the breakdown risk of the insulating material.
[0036] An embodiment, a logic control method for voltage ionization based on current magnitude control, as Figure 1 shown, includes the following steps:
[0037] Step S1: Obtain the connection port areas of the insulating material in the high-voltage electrostatic discharge device, monitor the real-time temperature of each connection port area, and detect the roughness of the insulating material at both ends of each connection port area;
[0038] Step S2: Calculate the average roughness of the corresponding connection port area according to the roughness of the insulating material at both ends of each connection port area, calculate the dust accumulation index of the corresponding connection port area by using the logistic regression algorithm by comprehensively considering the real-time temperature and average roughness of each connection port area, and monitor the real-time humidity of each connection port area;
[0039] Step S3: Calculate the evaluation weight of the corresponding connection port area by using the preference ranking method by comprehensively considering the real-time humidity of each connection port area and the dust accumulation index of the corresponding connection port area, measure the interface exposure distance of each connection port area, and generate the risk index of the corresponding connection port area according to the interface exposure distance and evaluation weight of each connection port area;
[0040] Step S4: Detect the short - circuit frequency in the connection port area. Using the geometric mean algorithm, calculate the creepage change coefficient for each connection port area by integrating the risk index and the short - circuit frequency in the connection port area. Obtain the default creepage distance for each connection port area, and use the creepage change coefficient to update the default creepage distance for each connection port area in real - time. Adjust the voltage according to the real - time changing creepage distance of each connection port area.
[0041] The specific implementation is as follows:
[0042] In step S1, access the historical database to obtain each connection port area of the insulating material in the high - voltage electrostatic discharge device. Obtain the real - time temperature of each connection port area through a thermocouple, and scan both ends of each connection port area of the insulating material in the high - voltage electrostatic discharge device using a laser scanning instrument to obtain the roughness of the insulating material at both ends of each connection port area.
[0043] The real - time temperature of the connection port area and the roughness of the insulating material at both ends are used to quickly evaluate the dust accumulation degree in the connection port area.
[0044] The higher the temperature of the connection port area, the faster the volatilization rate of the insulating material. When the high - voltage electrostatic discharge device cools down, the gaseous substances volatilized from the insulating material will re - condense, resulting in dust accumulation in the connection port area.
[0045] The higher the roughness of the insulating material at both ends of the connection port area, the stronger its surface adhesion, and it is more likely to generate static electricity. Strong adhesion is more likely to capture dust particles, and static electricity is easy to attract dust and pollutants in the air, leading to dust accumulation in the connection port area.
[0046] It should be noted that the historical database is a system for storing historical data and event information, which is used to obtain each connection port area of the insulating material in the voltage electrostatic discharge device in the above - mentioned context; the thermocouple is a temperature sensor used to monitor the real - time temperature of each connection port area; the laser scanner is a device for measuring the three - dimensional shape and characteristics of an object's surface, which can automatically calculate the surface roughness of an object. In this example, it is used to obtain the roughness of the insulating material at both ends of each connection port area.
[0047] In step S2, calculate the average value of the roughness of the insulating material at both ends of each connection port area as the roughness mean value of the corresponding connection port area, and use the Max - Min normalization algorithm to perform tokenization processing on the real - time temperature of each connection port area: x nore = x - x min / x max - x min , where x is the real - time temperature of each connection port area, x nore is the standardized result of the real - time temperature of the corresponding connection port area, x max is the maximum value of the real - time temperature of all connection port areas, xmin is the minimum real-time temperature of all connection port areas.
[0048] Using the logistic regression algorithm, calculate the dust accumulation index of the corresponding connection port area by integrating the real-time temperature normalization results and the mean roughness of each connection port area: C = 1 / (1 + e -z , where e is the natural base, z is the logistic regression parameter and z is the sum of the real-time temperature normalization result and the roughness of each connection port area, and C is the dust accumulation index of the corresponding connection port area.
[0049] Use a humidity sensor to monitor the real-time humidity of each connection port area. The higher the humidity of the connection port area, the more water molecules there are. Under the action of an electric field, the water molecules are ionized, and the generated ions will increase the conductivity of the gas, thereby increasing the power consumption risk of the connection port area.
[0050] It should be noted that the Max-Mix normalization algorithm is a data preprocessing method used to scale the eigenvalue to a specific range for easy analysis and processing; the humidity sensor is a device that measures the water vapor content in the air and is used in this example to monitor the real-time humidity of each connection port area.
[0051] In step S3, the dust accumulation index of the connection port area reflects the dust accumulation degree of the connection port area. The higher the dust accumulation degree of the connection port area, the more current conduction paths will be formed, increasing the current flow, thereby increasing the power consumption risk of the connection port area.
[0052] The interface exposure distance is the interval between the insulating materials at both ends of the connection port area, that is, the exposed length of the wire. The larger the interface exposure distance, when the dust accumulation in the connection port area is larger, the formed conduction path is larger, and it is also easier to contact more water molecules in the nearby air, resulting in an increase in the power consumption risk of the connection port area.
[0053] Measure the interface exposure distance of each connection port area through a digital rangefinder, and use the Max-Min normalization algorithm for the real-time humidity and interface exposure distance of each connection port area to obtain the real-time temperature normalization result and the interface exposure distance normalization result of each connection port area;
[0054] Sum the real-time temperature normalization result of each connection port area and the dust accumulation index of the corresponding connection port area as the weight index of the corresponding connection port area;
[0055] Comprehensively use the weight index of each connection port area and the interface exposure distance normalization result, and use the preference ranking method to calculate the evaluation weight of the corresponding connection port area. The specific steps are as follows:
[0056] Assign weights to the interface exposure distance normalization results of each connection port area as shown in Table 1 below:
[0057]
[0058] Table 1
[0059] It should be noted that the A, B, and C regions in Table 1 are three connection port regions listed in this embodiment. After sorting the connection port regions according to the magnitude of the weight index, they are sequentially corresponding to the A, B, and C regions in descending order.
[0060] Multiply the standardized result of the interface exposure distance of each connection port region by the evaluation weight of the corresponding connection port region, and use the product result as the risk index of the corresponding connection port region.
[0061] It should be noted that a digital rangefinder is a device for accurately measuring distances, which obtains measurement results through laser and ultrasonic technologies. In this example, it is used to measure the interface exposure distances of each connection region; in the above, only three connection port regions are used for distance measurement. As the number of connection port regions increases or decreases, the evaluation weights of different connection port regions will be automatically adjusted, which will not be elaborated here.
[0062] In step S4, select a period of time as the analysis time, count the number of short circuits in each connection port region within the analysis time, use a current detector to monitor the current in each connection port region in real time, initialize the short circuit count of each connection port region to 0, and when the current in the connection port region exceeds the preset current threshold within the analysis time, add 1 to the short circuit count, and count the short circuit count of each connection port region within the analysis time;
[0063] It should be noted that a current detector is a device for measuring current. In this example, it is used to monitor the current in each connection port region in real time.
[0064] Select the maximum value of the short circuit count values of all connection port regions, and use the ratio of the short circuit count value of the connection port region to the maximum value of the short circuit count values as the short circuit frequency of the corresponding connection port region;
[0065] Comprehensively use the geometric mean algorithm for the risk index of the connection port region and the short circuit frequency of the connection port region to calculate the creepage change coefficient of each connection port region. The formula is: Where a is the risk index of the connection port region, b is the short circuit frequency of the corresponding connection port region, and p is the creepage change coefficient of the corresponding connection port region.
[0066] Calculate the average value of the creepage change coefficients of all connection port regions, and use the ratio of the creepage change coefficient of the connection port region to the average value of the creepage change coefficients of the connection port region as the adjustment ratio of the corresponding connection port region.
[0067] The creepage distance refers to the shortest distance of the current path that creeps along the surface of an electrical device or insulating material. The greater the creepage distance, the better the insulation performance of the insulating material and the higher the electrical safety.
[0068] Access the historical database to obtain the default creepage distance of each connection port area, and divide the default creepage distance of each connection port area by the corresponding adjustment ratio of the connection port area to obtain the updated creepage distance;
[0069] It should be explained that because the adjustment ratio is updated in real time, the creepage distance of each connection port area is also updated in real time.
[0070] The specific steps to adjust the voltage according to the creepage distance of each connection port area are as follows:
[0071] Set a period of time as the adjustment time for timing, calculate the average value of the creepage distance of each connection port area during the adjustment time, calculate the discharge current of the discharge needle and the zero electrode plate through the charged module, obtain the voltage reduction standard by multiplying the average value of the creepage distance of each connection port area by the preset voltage conversion coefficient, compare the discharge current of the discharge needle and the zero electrode plate with the preset comparison threshold, and make adjustments according to the voltage reduction standard;
[0072] When the discharge current is lower than the comparison threshold, no adjustment is made; when the discharge current is higher than the comparison threshold, subtract the voltage reduction standard from the current voltage, then compare the discharge current with the comparison threshold, and make repeated adjustments until the discharge current is lower than the comparison threshold and stop. Take the finally obtained voltage value as the current voltage of the high-voltage electrostatic discharge device.
[0073] For example, the comparison threshold is 2uA and the voltage reduction standard is 200V. When the discharge current of the discharge needle and the zero electrode plate is higher than 2uA, subtract 200V from the current voltage and then make a loop judgment until the discharge current is lower than 2uA and stop the adjustment.
[0074] It should be noted that the discharge needle and the zero electrode plate are components in electrical engineering and high-voltage electrical experiments, used for researching and testing discharges to determine the device output; the above comparison threshold and voltage conversion coefficient are set by professionals in the field according to the actual situation. At the same time, multiple humidity thresholds can also be set for enhanced control, and the voltage reduction standard is reduced by multiplying it by the reduction ratio, so as to achieve precise adjustment of the voltage. For example, set the humidity thresholds to 90% and 80%, and the reduction ratio to 0.5. When the detected humidity reaches more than 90% of the maximum historical humidity in the detection area, subtract 200V from the current voltage and then make a loop judgment; when the detected humidity reaches between 80% and 90% of the maximum historical humidity in the detection area, subtract 100V from the current voltage and then make a loop judgment; when the detected humidity reaches 80% of the maximum historical humidity in the detection area, no voltage adjustment is made.
[0075] The above embodiments can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using software, the above embodiments can be implemented in whole or in part in the form of a computer program product.
[0076] Those of ordinary skill in the art will realize that the modules and algorithm steps of the examples described in connection with the embodiments disclosed herein can be implemented with electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in hardware or software depends on the specific application and the inventive constraints of the technical solution. A professional technician can use different methods for each specific application to implement the described functions, but such implementation should not be considered to exceed the scope of this application.
[0077] In addition, the functional modules in each of the embodiments of this application can be integrated into one processing module, or each module can exist physically alone, or two or more modules can be integrated into one module.
[0078] As described above, this is only the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in this application, and all should be covered by the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.
[0079] Finally: The above is only the preferred embodiment of the present invention and is not used to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A logic control method for voltage ionization based on current magnitude control, characterized in that: The following steps are included: Step S1: obtaining each connection port area of the insulating material in the high-voltage electrostatic discharge device, monitoring the real-time temperature of each connection port area, and detecting the roughness of the insulating material at both ends of each connection port area; Step S2: Calculating the mean roughness of the corresponding connection port area based on the roughness of the insulation material at both ends of each connection port area, calculating the dust accumulation index of the corresponding connection port area using a logistic regression algorithm based on the real-time temperature of each connection port area and the mean roughness value, and monitoring the real-time humidity of each connection port area; Step S3: Calculating the assessment weight of each connection port area using a priority diagram method based on the real-time humidity of each connection port area and the dust accumulation index of the corresponding connection port area, measuring the interface exposure distance of each connection port area, and generating a risk index for the corresponding connection port area based on the interface exposure distance and the assessment weight of each connection port area; Step S4: detecting the short-circuit frequency of the connector area, calculating the creepage variation coefficient of each connector area using a geometric mean algorithm based on the risk index of the connector area and the short-circuit frequency of the connector area, obtaining the default creepage distance of each connector area, using the creepage variation coefficient to update the default creepage distance of each connector area in real time, and adjusting the voltage according to the real-time change of the creepage distance of each connector area; In step S2, the average roughness of the insulating material at both ends of each connection port region is calculated as the average roughness of the corresponding connection port region; Use the Max-Min normalization algorithm to normalize the real-time temperature of each connection area: ,in is the real-time temperature of each connection port area, is the real-time temperature normalization result of the corresponding connection area, is the maximum real-time temperature of all connection areas. The minimum real-time temperature of all connection areas; In step S2, the dust accumulation index of the corresponding connection port area is calculated by combining the real-time temperature normalization results and the roughness mean value of each connection port area using a logistic regression algorithm: , where e is the natural base, z is the logistic regression parameter and z is the sum of the real-time temperature normalization result and the roughness of each connection area, and C is the dust accumulation index of the corresponding connection area.
2. The logic control method for voltage ionization based on current magnitude control according to claim 1, characterized in that: In step S1, a historical database is accessed to obtain the connection port areas of the insulating material in the high-voltage electrostatic discharge device, the real-time temperature of each connection port area is obtained using a thermocouple, and a laser scanning instrument is used to scan both ends of each connection port area of the insulating material in the high-voltage electrostatic discharge device to obtain the roughness of the insulating material at both ends of each connection port area; The historical database is used to obtain the various connection port areas of the insulating material in the voltage electrostatic discharge device in the historical records; the thermocouple is a temperature sensor used to monitor the real-time temperature of each connection port area; the laser scanner is a device that measures the three-dimensional shape and characteristics of the surface of an object and is used to obtain the roughness of the insulating material at both ends of each connection port area.
3. The logic control method for voltage ionization based on current magnitude control according to claim 1, characterized in that: In step S3, the interface exposure distance is the distance between the insulating materials at both ends of the connection port area; The interface exposure distance of each connection port area is measured by a digital distance meter, and the real-time humidity and interface exposure distance of each connection port area are normalized using a Max-Min normalization algorithm to obtain the real-time temperature normalization result and interface exposure distance normalization result of each connection port area; A digital distance meter is a device that accurately measures distances. It uses laser and ultrasonic technology to obtain measurement results and is used to measure the interface exposure distance of each connection area.
4. The logic control method for voltage ionization based on current magnitude control according to claim 3, characterized in that: In step S3, the normalized real-time temperature results of each connection port area and the dust accumulation index of the corresponding connection port area are summed to obtain a weight index of the corresponding connection port area; The weight index of each connection port area and the standardized results of the interface exposure distance are combined to calculate the evaluation weight of the corresponding connection port area using the priority diagram method. The specific steps are as follows: After sorting the connection port areas in descending order of weight index, assigning a preset relative importance coefficient to each connection port area according to the sorting order, calculating the TTL index of each connection port area based on the assignment result, and calculating the evaluation weight of each connection port area based on the TTL index; The standardized result of the interface exposure distance of each connection port area is multiplied by the assessment weight of the corresponding connection port area, and the product is used as the risk index of the corresponding connection port area; In the priority diagram method, the TTL indicator is used to describe the overall time efficiency of a task.
5. The logic control method for voltage ionization based on current magnitude control according to claim 1, characterized in that: In step S4, a period of time is selected as an analysis period, and the number of short circuits in each connector area is counted during the analysis period. The current in each connector area is monitored in real time using a current detector, and the short circuit count in each connector area is initialized to 0. When the current in the connector area exceeds a preset current threshold during the analysis period, the short circuit count is incremented by 1, and the short circuit count in each connector area during the analysis period is counted. A current detector is a device that measures current and is used to monitor the current in each connection area in real time.
6. The logic control method for voltage ionization based on current magnitude control according to claim 5, characterized in that: In step S4, the maximum short-circuit count value of all the connection port areas is selected, and the ratio of the short-circuit count value of the connection port area to the maximum short-circuit count value is used as the short-circuit frequency of the corresponding connection port area; The geometric mean algorithm is used to calculate the creepage variation coefficient of each connector area based on the risk index of the connector area and the short-circuit frequency of the connector area. The formula is: , where a is the risk index of the connector area, b is the short-circuit frequency of the corresponding connector area, and p is the creepage variation coefficient of the corresponding connector area; Calculate the average creepage variation coefficient of all connector areas, and use the ratio of the creepage variation coefficient of the connector area to the average creepage variation coefficient of the connector area as the adjustment ratio of the corresponding connector area.
7. The logic control method for voltage ionization based on current magnitude control according to claim 6, characterized in that: In step S4, access the historical database to obtain the default creepage distance of each connector area, and divide the default creepage distance of each connector area by the adjustment ratio of the corresponding connector area to obtain the updated creepage distance; The specific steps to adjust the voltage according to the creepage distance of each connection area are as follows: Set a period of time as the adjustment time, calculate the average creepage distance of each connector area during the adjustment time, calculate the discharge current of the discharge needle and the zero plate through the charging module, multiply the average creepage distance of each connector area by a preset voltage conversion coefficient to obtain the voltage reduction standard, compare the discharge current of the discharge needle and the zero plate with the preset comparison threshold, and make adjustments based on the voltage reduction standard; When the discharge current is lower than the comparison threshold, no adjustment is performed; when the discharge current is higher than the comparison threshold, the voltage reduction standard is subtracted from the current voltage, and the discharge current is compared with the comparison threshold. Adjustments are repeated until the discharge current is lower than the comparison threshold, and the final voltage value is used as the current voltage of the high-voltage electrostatic discharge device; Discharge needles and zero plates are components in electrical engineering and high-voltage electrical experiments used to study and test discharges.
Citation Information
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