Display device having input sensing unit

Abstract

There is provided a display device having an input sensing unit, the display device including: a base substrate including a front surface and a rear surface facing each other, and in which a module hole passing through the front surface and the rear surface is defined; a circuit layer including a driving element; a display element layer including a light emitting element; an encapsulation layer; and an input sensing unit. A wiring region surrounding the module hole is defined on the base substrate. The input sensing unit includes a first touch line, a second touch line, and a bridge pattern. The first touch line includes first touch sensing parts arranged in a preset direction. The second touch lines are insulated from and intersect the first touch lines. The bridge pattern is connected to the first touch sensing parts adjacent in the preset direction and disposed within the wiring area, and the module hole is between the first touch sensing parts adjacent in the preset direction. A slit is provided in the bridge pattern.

Description

[0001] This application is a divisional application of the invention patent application with application date of October 25, 2019, application number 201911024403.9, and name “Display device with input sensing unit”. Technical Field

[0002] Exemplary embodiments of the invention relate generally to a display device, and more particularly, to a display device including an input sensing unit. Background Art

[0003] The display device is activated according to the electrical signal. Such a display device may include a device composed of various electronic components such as a display unit that displays an image and an input sensing unit that senses an external input. The electronic components may be electrically connected to each other through signal lines that are arranged differently.

[0004] The display unit includes a light emitting element that generates an image. The input sensing unit may include a sensing electrode for sensing an external input. Such a display device in which the display unit and the input sensing unit are provided in one panel may have an undesirably large thickness and high process cost.

[0005] The above information disclosed in this Background section is only for understanding the background of the inventive concept and therefore it may contain information that does not constitute the prior art. Summary of the invention

[0006] Exemplary embodiments of the present invention provide a display device including a display panel having a module hole, which does not suffer from degradation in display quality when a touch sensing part disconnected by the module hole is electrically connected.

[0007] Additional features of the inventive concepts will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concepts.

[0008] Exemplary embodiments of the inventive concept provide a display device including a base substrate, a circuit layer, a display element, an encapsulation layer, and an input sensing unit.

[0009] The base substrate may include a front surface and a rear surface facing each other, a module hole passing through the front surface and the rear surface and defined in the base substrate, and an active area, a peripheral area and a wiring area defined on a plane, the peripheral area being adjacent to the active area and the wiring area surrounding the module hole.

[0010] The circuit layer may be disposed on the base substrate and include a driving element including a thin film transistor.

[0011] The display element layer may be disposed on the circuit layer and include a light emitting element disposed in the active area.

[0012] An encapsulation layer may be provided on the display element layer to seal the light emitting element.

[0013] The input sensing unit may be disposed on the encapsulation layer.

[0014] The input sensing unit may include a first touch sensing part, a first connection part, a second touch sensing part, a second connection part, a first bridge pattern, and a second bridge pattern.

[0015] The first touch sensing components may be arranged in a first direction. The first connecting component may be configured to connect adjacent first touch sensing components to each other. The second touch sensing components may be arranged in a second direction intersecting the first direction. The second connecting component may be configured to connect adjacent second touch sensing components to each other and be disposed on a layer different from the layer on which the first connecting component is disposed. The first bridge pattern may be connected to second touch sensing components adjacent to each other in the second direction and disposed in a wiring area, and the module hole is located between second touch sensing components adjacent to each other in the second direction. The second bridge pattern may be connected to first touch sensing components adjacent to each other in the first direction and disposed in a wiring area, and the module hole is located between second touch sensing components adjacent to each other in the first direction. The first slit may be disposed in at least one of the first bridge pattern and the second bridge pattern.

[0016] The first slit may be provided in a crossing portion between the first bridge pattern and the second bridge pattern.

[0017] The first slit may be disposed in the first bridge pattern to overlap the second bridge pattern.

[0018] The second slit may be disposed in the second bridge pattern to overlap the first bridge pattern.

[0019] The first bridge pattern and the second bridge pattern may be disposed on different layers from each other.

[0020] The first touch sensing part, the second touch sensing part, the second connection part and the first bridge pattern may be disposed on the same layer. The second bridge pattern may be disposed on the same layer as the first connection part.

[0021] The input sensing unit may include a first touch insulating layer and a second touch insulating layer. The first touch insulating layer may be disposed on the first touch sensing component, the second touch sensing component, the second connecting component, and the first bridge pattern. The second touch insulating layer may be disposed on the first connecting component and the first touch insulating layer. The second bridge pattern may be connected to the first touch sensing component through a contact hole disposed in the first touch insulating layer.

[0022] The first bridge pattern may include a sensing body pattern, a first sensing connection pattern, and a second sensing connection pattern. The sensing body pattern may be disposed within the wiring region and have a curved shape. The first sensing connection pattern may extend from one end of the sensing body pattern and be connected to one of the second touch sensing components. The second sensing connection pattern may extend from the other end of the sensing body pattern and be connected to another second touch sensing component in the second touch sensing component. The sensing body pattern may have a width greater than a width of each of the first sensing connection pattern and the second sensing connection pattern.

[0023] The second bridge pattern may include a transmission body pattern, a first transmission connection pattern, and a second transmission connection pattern. The transmission body pattern may be disposed in a wiring region and have a curved shape. The first transmission connection pattern may be connected to one end of the transmission body pattern and connected to one of the first touch sensing components. The second transmission connection pattern may be connected to the other end of the transmission body pattern and may be connected to another first touch sensing component in the first touch sensing component. The transmission body pattern may have a width greater than a width of each of the first transmission connection pattern and the second transmission connection pattern.

[0024] The transmission body pattern may be disposed on a layer different from a layer on which each of the first transmission connection pattern and the second transmission connection pattern is disposed.

[0025] The first touch sensing part, the second touch sensing part, the second connection part, the first bridge pattern and the transmission body pattern may be disposed on the same layer. The first transmission connection pattern, the second transmission connection pattern and the first connection part may be disposed on the same layer.

[0026] The first bridge pattern may include a sensing body pattern, a first sensing connection pattern, and a second sensing connection pattern. The sensing body pattern may be disposed in a wiring area and have a curved shape. The first sensing connection pattern may be connected to one end of the sensing body pattern, may be connected to one of the second touch sensing components, and may be disposed on a layer different from the layer on which the sensing body pattern is disposed. The second sensing connection pattern may be connected to the other end of the sensing body pattern, may be connected to another second touch sensing component in the second touch sensing component, and may be disposed on a layer different from the layer on which the sensing body pattern is disposed.

[0027] The second bridge pattern may include a transmission body pattern, a first transmission connection pattern, and a second transmission connection pattern. The transmission body pattern may be disposed in a wiring area and have a curved shape. The first transmission connection pattern may be connected to one end of the transmission body pattern, may be connected to one of the first touch sensing components, and may be disposed on a layer different from the layer on which the transmission body pattern is disposed. The second transmission connection pattern may be connected to the other end of the transmission body pattern, may be connected to another first touch sensing component in the first touch sensing component, and may be disposed on a layer different from the layer on which the transmission body pattern is disposed.

[0028] The first touch sensing part, the second touch sensing part, the second connection part, the sensing body pattern and the transmission body pattern may be arranged on the same layer. The first sensing connection pattern, the second sensing connection pattern, the first transmission connection pattern and the second transmission connection pattern may be arranged on the same layer.

[0029] Each of the sensing body pattern and the transmitting body pattern may surround the module hole and have a ring shape.

[0030] The first bridge pattern may further include an auxiliary sensing pattern disposed between the sensing body pattern and the module hole, and each of the first sensing connection pattern and the second sensing connection pattern may be connected to the auxiliary sensing pattern. The second bridge pattern may further include an auxiliary transmission pattern disposed between the transmission body pattern and the module hole, and each of the first transmission connection pattern and the second transmission connection pattern may be connected to the auxiliary transmission pattern.

[0031] The input sensing unit may further include a dummy pattern disposed in the wiring region and disposed between the first bridge pattern and the second bridge pattern.

[0032] The routing area may be surrounded by the active area in a plane.

[0033] Another exemplary embodiment of the inventive concept provides a display device including a base substrate, a circuit layer, a display element layer, an encapsulation layer, and an input sensing unit.

[0034] The base substrate may include a front surface and a rear surface facing each other, a module hole passing through the front surface and the rear surface and defined in the base substrate, and an active area, a peripheral area and a wiring area defined on a plane, the peripheral area being adjacent to the active area and the wiring area surrounding the module hole.

[0035] The circuit layer may be disposed on the base substrate and include a driving element including a thin film transistor.

[0036] The display element layer may be disposed on the circuit layer and include a light emitting element disposed in the active area.

[0037] An encapsulation layer may be provided on the display element layer to seal the light emitting element.

[0038] The input sensing unit may be disposed on the encapsulation layer.

[0039] The input sensing unit may include a first touch line, a second touch line, and a first bridge pattern.

[0040] The first touch line may include first touch sensing parts arranged in a first direction.

[0041] The second touch wire may include a second touch sensing part arranged in a second direction crossing the first direction, and may be insulated from the first touch wire.

[0042] The first bridge pattern may be disposed in the wiring region and connected to the second touch sensing parts adjacent to each other in the second direction and may have a first slit, and the module hole may be located between the second touch sensing parts adjacent to each other in the second direction.

[0043] The input sensing unit may further include a second bridge pattern. The second bridge pattern may be disposed in the wiring area and may be connected to the first touch sensing components adjacent to each other in the first direction, and the module hole is located between the first touch sensing components adjacent to each other in the first direction. The first slit may be disposed in an intersection between the first bridge pattern and the second bridge pattern.

[0044] A groove pattern configured to surround the module hole may be disposed between the wiring area and the module hole and in the base substrate.

[0045] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the inventive concept.

[0047] Figure 1 is a perspective view of a display device according to an exemplary embodiment of the inventive concept.

[0048] Figure 2 yes Figure 1 An exploded perspective view of a display device.

[0049] Figure 3 yes Figure 1 A block diagram of a display device.

[0050] Figure 4is an equivalent circuit diagram of a pixel of a display panel illustrating an exemplary embodiment of the inventive concept.

[0051] Figure 5 It is along Figure 2 A cross-sectional view taken along line II'.

[0052] Figure 6 yes Figure 4 A plan view of an input sensing unit and a base substrate.

[0053] Figure 7 It is along Figure 2 A cross-sectional view taken along line II-II'.

[0054] Figure 8 and Fig. 9 yes Figure 2 Floor plan of area XX'.

[0055] Fig.10 It is along Fig. 9 A cross-sectional view taken along line III-III'.

[0056] Fig.11 , Fig.12 , Fig.13 and Fig.14 According to another exemplary embodiment of the inventive concept Figure 2 Floor plan of area XX'. DETAILED DESCRIPTION

[0057] In the following description, for the purpose of explanation, many specific details are set forth to provide a thorough understanding of various exemplary embodiments of the invention. As used herein, "embodiment" is a non-limiting example of a device or method that adopts one or more of the inventive concepts disclosed herein. However, it is apparent that various exemplary embodiments can be practiced without these specific details or using one or more equivalent arrangements. In other cases, well-known structures and devices are shown in block diagram form to avoid unnecessary obscurity of various exemplary embodiments. In addition, various exemplary embodiments may be different, but not necessarily exclusive. For example, without departing from the inventive concept, the specific shape, configuration and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0058] Unless otherwise specified, the illustrated exemplary embodiments will be understood as providing exemplary features of different details of some ways in which the inventive concept can actually be implemented. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects, etc. (hereinafter, individually or collectively referred to as "elements") of the various embodiments may be further combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0059] The use of cross hatching and / or shading in the drawings is generally provided to make the boundaries between adjacent elements clear. Thus, unless otherwise specified, the presence or absence of cross hatching or shading does not convey or indicate the specific material, material properties, size, ratio, commonality between the elements shown and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, the size and relative size of the elements may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments may be implemented differently, a specific process sequence may be performed in a sequence different from that described. For example, two processes described in succession may be performed substantially simultaneously or in an order opposite to that described. In addition, the same reference numerals represent the same elements.

[0060] When an element such as a layer is referred to as being "on" another element or layer, "connected to" or "bonded to" another element or layer, the element may be directly on, directly connected to or directly bonded to the other element or layer, or there may be an intermediate element or layer. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to" or "directly bonded to" another element or layer, there are no intermediate elements or layers. For this purpose, the term "connected" may refer to a physical, electrical and / or fluid connection with or without an intermediate element. In addition, the D1 axis, the D2 axis, and the D3 axis are not limited to three axes of a rectangular coordinate system such as an x-axis, a y-axis, and a z-axis, but may be interpreted in a broader sense. For example, the D1 axis, the D2 axis, and the D3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0061] Although the terms "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, without departing from the disclosed teachings, the first element discussed below may be referred to as the second element.

[0062] For descriptive purposes, spatially relative terms such as "under," "below," "below," "down," "above," "up," "above," "higher," "side" (e.g., as in "sidewall"), etc., may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. Spatially relative terms are intended to include different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is flipped, an element described as "under" or "below" other elements or features would then be oriented as "above" the other elements or features. Thus, the exemplary term "under" may include both above and below orientations. In addition, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and as such, the spatially relative descriptive symbols used herein are interpreted accordingly.

[0063] The terms used here are for the purpose of describing specific embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one (kind / person)" and "said / the" as used here are also intended to include plural forms. In addition, when the terms "comprise", "include" and / or its variations are used in this specification, it is indicated that there are the described features, integral bodies, steps, operations, elements, components and / or their groups, but it is not excluded that there are or add one or more other features, integral bodies, steps, operations, elements, components and / or their groups. It is also noted that, as used here, the terms "substantially", "approximately" and other similar terms are used as approximate terms rather than as degree terms, and are used to explain the inherent deviations of measured values, calculated values ​​and / or provided values ​​that will be recognized by those of ordinary skill in the art.

[0064] Various exemplary embodiments are described herein with reference to cross-sectional illustrations and / or exploded illustrations that are schematic illustrations of idealized exemplary embodiments and / or intermediate structures. As such, variations from the illustrated shapes, such as due to manufacturing techniques and / or tolerances, are to be expected. Therefore, the exemplary embodiments disclosed herein should not necessarily be interpreted as limitations on the shapes of the specifically illustrated regions, but will include shape deviations, such as due to manufacturing. In this way, the regions shown in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and therefore are not necessarily intended to be limiting.

[0065] As is customary in the art, some exemplary embodiments are described and illustrated in the accompanying drawings according to functional blocks, units and / or modules. Those skilled in the art will appreciate that these blocks, units and / or modules are physically implemented by electronic (or optical) circuits such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements and wiring connections, which can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. In the case of implementing blocks, units and / or modules by microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and they can be optionally driven by firmware and / or software. It is also envisioned that each block, unit and / or module can be implemented by dedicated hardware, or implemented as a combination of dedicated hardware that performs some functions and processors (e.g., one or more programmed microprocessors and associated circuits) that perform other functions. In addition, without departing from the scope of the inventive concept, each block, unit and / or module of some exemplary embodiments can be physically divided into two or more interactive and discrete blocks, units and / or modules. Furthermore, the blocks, units and / or modules of some exemplary embodiments may be physically combined into more complex blocks, units and / or modules without departing from the scope of the inventive concept.

[0066] The memory can be any medium that participates in providing the code to one or more software, hardware and / or firmware components for execution. Such memory can be implemented in any appropriate form, including but not limited to non-volatile media, volatile media and transmission media. For example, non-volatile media include optical disks or magnetic disks. Volatile media include dynamic memory. Transmission media include coaxial cables, copper wires and optical fibers. Transmission media can also take the form of sound waves, light waves or electromagnetic waves. Common forms of computer-readable media include, for example, floppy disks, flexible disks, hard disks, magnetic tapes, any other magnetic media, compact disk read-only memory (CD-ROM), rewritable compact disks (CD-RW), digital video disks (DVD), rewritable DVDs (DVD-RW), any other optical media, punch cards, paper tapes, optical markers, any other physical media with hole patterns or other optically recognizable marker patterns, random access memory (RAM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM) flash erase programmable read-only memory, any other memory chip or film, carrier waves or any other medium through which information can be read, for example, controllers / processors.

[0067] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure is a part. Unless explicitly defined as such herein, terms such as those defined in general dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an ideal or overly formal sense.

[0068] Figure 1 is a perspective view of a display device according to an exemplary embodiment of the inventive concept. Figure 2 yes Figure 1 An exploded perspective view of a display device. Figure 3 yes Figure 1 In the following, reference will be made to Figures 1 to 3 A display device according to an exemplary embodiment of the inventive concept is described.

[0069] The display device EA may be a device activated according to an electrical signal. For example, the display device EA may include a tablet computer, a notebook, a computer, a smart TV, etc. In this exemplary embodiment, the display device EA including a smart phone will be described as an example.

[0070] like Figure 1 As shown in , the display device EA may display an image IM on its front surface. The front surface may be defined to be parallel to a surface defined by the first direction DR1 and the second direction DR2. The front surface may include a transmission area TA and a bezel area BZA adjacent to the transmission area TA.

[0071] The image IM is displayed on the transmissive area TA of the display device EA. Figure 1 An internet search window is shown as an example of the image IM. The transmissive area TA may have a rectangular shape parallel to the first direction DR1 and the second direction DR2. However, this is only an example, and the display device EA may have various shapes and is not limited to a specific embodiment.

[0072] The border area BZA is adjacent to the transmission area TA. The border area BZA may surround the transmission area TA. However, this is only an example. The border area BZA may be set to be adjacent to only one side of the transmission area TA or may be omitted entirely. The display device EA according to the inventive concept may include various exemplary embodiments and is not limited to a specific exemplary embodiment.

[0073] The normal direction of the front surface may correspond to the thickness direction of the display device EA (hereinafter, referred to as the third direction). In the present exemplary embodiment, the front surface (or top surface) or the rear surface (or bottom surface) of each member may be defined relative to the direction in which the image IM is displayed. The front surface and the rear surface face each other in the third direction DR3.

[0074] The directions indicated as the first direction DR1, the second direction DR2, and the third direction DR3 may be relative concepts and thus changed to different directions. Hereinafter, the first direction to the third direction may be directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3, respectively, and designated by the same reference numerals as those of the first direction DR1, the second direction DR2, and the third direction DR3, respectively.

[0075] The display device EA according to the inventive concept can sense the user's input TC applied from the outside. The user's input TC includes various types of external inputs such as a part of the user's body, light, heat or pressure. In the present exemplary embodiment, the user's input TC is shown as the user's hand applied to the front surface. However, this is only an example. For example, as described above, the user's input TC can have various shapes. The display device EA can sense the user's input TC applied to the side surface or the rear surface of the display device EA according to the structure of the display device EA, but the inventive concept is not limited in this way.

[0076] like Figure 1 and Figure 2 As shown in FIG. 1 , the display device EA includes a display panel EP, a window member WM, an electronic module EM and a receiving member BM. Figure 3 As shown in FIG, in addition to the display panel EP, the display device EA may further include a first electronic module EM1, a second electronic module EM2, and a power module PM. Figure 2 In, omitted Figure 4 In the following, reference will be made to Figures 1 to 3 The display device EA is described.

[0077] The display panel EP may display an image IM and sense an input TC. For example, the display panel EP may include a display unit DPU that displays an image IM and an input sensing unit ISU that senses an input TC. In the present exemplary embodiment, the input sensing unit ISU may sense an input applied to the window member WM.

[0078] The display panel EP may include an active area AA, a peripheral area NAA, and a hole area HA divided on a plane. The active area AA may be an area activated according to an electrical signal.

[0079] In the present exemplary embodiment, the active area AA may be an area on which the image IM is displayed and the input TC is sensed. However, this is only an example. For example, the area on which the image IM is displayed of the active area AA and the area on which the input TC is sensed of the active area AA may be separated from each other, but the inventive concept is not limited to a specific embodiment.

[0080] The peripheral area NAA may be an area covered by the frame area BZA. The peripheral area NAA is adjacent to the active area AA. The peripheral area NAA may surround the active area AA. A driving circuit or driving line for driving the active area AA may be disposed on the peripheral area NAA.

[0081] In the present exemplary embodiment, the display panel EP may be assembled in a state where the active area AA and the peripheral area NAA are flat so as to face the window member WM. However, this is merely an example. For example, a portion of the peripheral area NAA of the display panel EP may be curved. Here, a portion of the peripheral area NAA may be disposed to face the rear surface of the display device EA so as to reduce the area of ​​the bezel area BZA on the front surface of the display device EA. Alternatively, the display panel EP may be assembled in a state where a portion of the active area AA is curved. Optionally, in the display panel EP according to the inventive concept, the peripheral area NAA may be omitted.

[0082] The edge of the hole area HA may be surrounded by the active area AA. The hole area HA may be spaced apart from the peripheral area NAA on a plane, and the active area AA is located between the hole area HA and the peripheral area NAA.

[0083] The hole area HA may be an area in which the module hole MH is defined and a part of the peripheral area NAA of the area in which the module hole MH is defined. Therefore, the module hole MH may be surrounded on a plane by the active area AA on which the image IM is displayed.

[0084] At least one module hole MH passing through the display panel EP in the third direction DR3 may be defined in the display panel EP according to an exemplary embodiment of the inventive concept. The module hole MH may be a through hole connected from the front surface of the display panel EP to the rear surface of the display panel EP. A component disposed on the rear surface of the display panel EP to overlap with the module hole MH may be visible through the module hole MH at the front surface of the display panel EP. In the present embodiment, although the module hole MH has a cylindrical shape having a height in the third direction DR3, the embodiments of the inventive concept are not limited thereto. For example, the module hole MH may have a polygonal column shape, an elliptical column shape, a conical shape, etc., and is not limited to a specific embodiment.

[0085] The module hole MH overlaps the electronic module EM on a plane. The electronic module EM may receive an external input through the module hole MH. The electronic module EM may receive a signal input through the module hole MH to provide the signal to the display panel EP. The electronic module EM may be a module having a size sufficient to be accommodated in the module hole MH or having a size similar to at least the size of the module hole MH. The electronic module EM will be described in more detail below.

[0086] The window member WM is arranged on the front surface of the display device EA. The window member WM may be arranged on the front surface of the display panel EP to protect the display panel EP. For example, the window member WM may include a glass substrate, a sapphire substrate or a plastic film. The window member WM may have a single-layer or multi-layer structure. For example, the window member WM may have a laminated structure of a plurality of plastic films bonded to each other using an adhesive or a laminated structure of a glass substrate and a plastic film bonded to each other using an adhesive.

[0087] The window member WM may be divided into a transmission area TA and a frame area BZA. The transmission area TA may be an area through which incident light is transmitted. The transmission area TA may have a shape corresponding to the shape of the active area AA. For example, the transmission area TA overlaps the entire surface of at least a portion of the active area AA. The image IM displayed on the active area AA of the display panel EP may be seen from the outside through the transmission area TA.

[0088] The bezel area BZA may be an area having a light transmittance relatively smaller than that of the transmission area TA. The bezel area BZA defines the shape of the transmission area TA. The bezel area BZA may be disposed adjacent to the transmission area TA to surround the transmission area TA.

[0089] The border area BZA may have a predetermined color. The border area BZA may cover the peripheral area NAA of the display panel EP to prevent the peripheral area NAA from being seen from the outside. However, this is only an example. For example, in the window member WM according to the inventive concept, the border area BZA may be omitted.

[0090] The receiving member BM may be coupled to the window member WM. The receiving member BM may be disposed on the rear surface of the display device EA. The receiving member BM may be coupled to the window member WM to define an internal space.

[0091] The receiving member BM may include a material having a relatively high hardness. For example, the receiving member BM may include a variety of frames and / or flat plates made of glass, plastic, or metal. The receiving member BM may stably protect the components of the display device EA received in the internal space from external impacts. Figure 3 The display panel EP and various components may be accommodated in the inner space provided by the accommodation member BM.

[0092] Reference Figure 3 , the display device EA may include a power module PM, a first electronic module EM1, and a second electronic module EM2. The power module PM supplies power required for all operations of the display device EA. The power module PM may include a general battery module.

[0093] The first electronic module EM1 and the second electronic module EM2 may include various functional modules for driving the display device EA. The first electronic module EM1 may be directly mounted on a motherboard electrically connected to the display panel EP, or may be mounted on a separate board and electrically connected to the motherboard through a connector (not shown).

[0094] The first electronic module EM1 may include a control module CM, a wireless communication module TM, an image input module IIM, an audio input module AIM, a memory MM and an external interface PMIF. Some of the modules may not be mounted on the motherboard but are electrically connected to the motherboard through a flexible circuit board.

[0095] The control module CM controls the overall operation of the display device EA. The control module CM may be a microprocessor. For example, the control module CM may activate or deactivate the display panel EP. The control module CM may control other modules such as the image input module IIM or the audio input module AIM based on a touch signal received from the display panel EP.

[0096] The wireless communication module TM can send / receive wireless signals to / from other terminals by using Bluetooth or Wi-Fi lines. The wireless communication module TM can send / receive audio signals by using universal communication lines. The wireless communication module TM includes a transmitter TM1 that modulates and sends a signal to be sent and a receiver TM2 that demodulates a received signal.

[0097] The image input module IIM processes the image signal to convert the processed image signal into image data that can be displayed on the display panel EP. The audio input module AIM receives an external audio signal using a microphone during a recording mode or a voice recognition mode to convert the received audio signal into electrical sound data.

[0098] The external interface PMIF serves as an interface to an external charger, a wired / wireless data port, and a card slot (eg, a slot for a memory card and a SIM / UIM card).

[0099] The second electronic module EM2 may include an audio output module AOM, a light emitting module LM, a light receiving module LRM, and a camera module CMM. The above components may be directly mounted on a motherboard, may be mounted on a separate board and electrically connected to the display panel EP through a connector (not shown), or may be electrically connected to the first electronic module EM1.

[0100] The audio output module AOM converts audio data received from the wireless communication module TM or audio data stored in the memory MM to output the converted audio data to the outside.

[0101] The light emitting module LM generates and outputs light. The light emitting module LM may output infrared rays. The light emitting module LM may include an LED. The light receiving module LRM may sense infrared rays. The light receiving module LRM may be activated when infrared rays having a predetermined level or more are sensed. The light receiving module LRM may include a CMOS sensor. Infrared rays generated in the light emitting module LM may be output and then reflected by an external object (e.g., a finger or face of a user), and the reflected infrared rays may be incident into the light receiving module LRM. The camera module CMM captures external images.

[0102] Figure 2 The electronic module EM may receive an external input transmitted through the module hole MH or provide an output through the module hole MH. The electronic module EM may be one of the modules constituting the first electronic module EM1 and the second electronic module EM2. For example, the electronic module EM may be a camera, a speaker, or a sensor that senses light or heat. The electronic module EM may sense an external object received through the module hole MH, or provide a sound signal such as voice to the outside through the module hole MH. Here, the remaining components of the first electronic module EM1 and the second electronic module EM2 may be arranged at different positions, and therefore may not be shown. However, this is only an example. The electronic module EM may include a plurality of modules constituting the first electronic module EM1 and the second electronic module EM2, but is not limited to a specific exemplary embodiment. Although not shown, the display device EA according to the inventive concept may further include a transparent member disposed between the electronic module EM and the display panel EP. The transparent member may be an optically transparent film so that the external input transmitted through the module hole MH passes through the transparent member and is transmitted to the electronic module EM. The transparent member may be attached to the rear surface of the display panel EP or be disposed between the display panel EP and the electronic module EM without an adhesive layer. The display device EA according to the inventive concept may have various shapes and is not limited to a specific exemplary embodiment.

[0103] In the inventive concept, the display panel EP may include a module hole MH. Therefore, a separate space provided for the electronic module EM in the peripheral area NAA may be omitted. In addition, the module hole MH may be defined in a hole area HA surrounded by the active area AA, so that the electronic module EM is arranged to overlap with the transmission area TA but not with the frame area BZA. Therefore, the area of ​​the frame area BZA may be reduced to realize a display device EA with a narrow frame. In addition, when the electronic module EM is accommodated in the module hole MH, a compact display device EA may be realized.

[0104] Figure 4 is an equivalent circuit diagram showing a pixel PX of the display panel.

[0105] Reference Figure 4, one pixel PX according to an exemplary embodiment of the inventive concept may include a plurality of transistors T1 to T7 , a storage capacitor Cst, and a light emitting element (eg, an organic light emitting diode OD).

[0106] According to the inventive concept, the remaining components of the pixel PX except for the light emitting element OD, ie, the plurality of transistors T1 to T7 and the storage capacitor Cst may be defined as a driving element.

[0107] The thin film transistors T1 to T7 include a driving transistor T1 , a switching transistor T2 , a compensation transistor T3 , an initialization transistor T4 , a first light emission control transistor T5 , a second light emission control transistor T6 , and a bypass transistor T7 .

[0108] The pixel PX includes a first gate line 14 for transmitting an nth scan signal Sn to a switching transistor T2 and a compensation transistor T3, a second gate line 24 for transmitting an n-1th scan signal Sn-1 to an initialization transistor T4, a third gate line 34 for transmitting an n+1th scan signal Sn+1 to a bypass transistor T7, a light emitting line 15 for transmitting a light emitting control signal En to a first light emitting control transistor T5 and a second light emitting control transistor T6, a data line 16 for transmitting a data signal Dm, a power line 26 for transmitting a power supply voltage ELVDD, and an initialization voltage line 22 for transmitting an initialization voltage Vint by which the driving transistor T1 is initialized.

[0109] The gate electrode G1 of the driving transistor T1 is connected to the first electrode C1 of the storage capacitor Cst. The source electrode S1 of the driving transistor T1 is connected to the power line 26 via the first light emission control transistor T5. The drain electrode D1 of the driving transistor T1 is electrically connected to the anode of the light emitting element OD via the second light emission control transistor T6. The driving transistor T1 receives the data signal Dm according to the switching operation of the switching transistor T2 to supply the driving current Id to the light emitting element OD.

[0110] A gate electrode G2 of the switching transistor T2 is connected to the first gate line 14. A source electrode S2 of the switching transistor T2 is connected to the data line 16. A drain electrode D2 of the switching transistor T2 is connected to the source electrode S1 of the driving transistor T1 and is then connected to the power line 26 via the first light emission control transistor T5. The switching transistor T2 is turned on according to the nth scan signal Sn received through the first gate line 14 to perform a switching operation for transmitting the data signal Dm transmitted to the data line 16 to the source electrode S1 of the driving transistor T1.

[0111] The gate electrode G3 of the compensation transistor T3 is connected to the first gate line 14. The source electrode S3 of the compensation transistor T3 is connected to the drain electrode D1 of the driving transistor T1, and then connected to the anode of the light emitting element OD via the second light emission control transistor T6. The drain electrode D3 of the compensation transistor T3 is connected to the first electrode C1 of the storage capacitor Cst, the source electrode S4 of the initialization transistor T4, and the gate electrode G1 of the driving transistor T1. The compensation transistor T3 is turned on according to the n-th scan signal Sn transmitted through the first gate line 14 to connect the gate electrode G1 and the drain electrode D1 of the driving transistor T1 to each other, so that the driving transistor T1 is diode-connected.

[0112] The gate electrode G4 of the initialization transistor T4 is connected to the second gate line 24. The drain electrode D4 of the initialization transistor T4 is connected to the initialization voltage line 22. The source electrode S4 of the initialization transistor T4 is connected to the first electrode C1 of the storage capacitor Cst, the drain electrode D3 of the compensation transistor T3, and the gate electrode G1 of the driving transistor T1. The initialization transistor T4 is turned on according to the n-1th scan signal Sn-1 transmitted through the second gate line 24 to transmit the initialization voltage Vint to the gate electrode G1 of the driving transistor T1, thereby initializing the voltage of the gate electrode G1 of the driving transistor T1.

[0113] The gate electrode G5 of the first light emission control transistor T5 is connected to the light emission line 15. The first light emission control transistor T5 may be connected between the power line 26 and the driving transistor T1. The source electrode S5 of the first light emission control transistor T5 is connected to the power line 26. The drain electrode D5 of the first light emission control transistor T5 is connected to the source electrode S1 of the driving transistor T1 and the drain electrode D2 of the switching transistor T2. When the light emission control signal En is applied to the gate electrode G5 of the first light emission control transistor T5, the first light emission control transistor T5 is turned on so that the driving current Id flows through the light emitting element OD. The first light emission control transistor T5 may determine the timing of the driving current Id flowing to the light emitting element OD.

[0114] The gate electrode G6 of the second light emission control transistor T6 is connected to the light emission line 15. The second light emission control transistor T6 may be connected between the driving transistor T1 and the light emitting element OD. The source electrode S6 of the second light emission control transistor T6 is connected to the drain electrode D1 of the driving transistor T1 and the source electrode S3 of the compensation transistor T3. The drain electrode D6 of the second light emission control transistor T6 is electrically connected to the anode of the light emitting element OD. The first light emission control transistor T5 and the second light emission control transistor T6 are turned on according to the light emission control signal En transmitted through the light emission line 15. When the light emission control signal En is applied to the gate electrode G6 of the second light emission control transistor T6, the second light emission control transistor T6 is turned on so that the driving current Id flows through the light emitting element OD. The second light emission control transistor T6 may determine the timing of the driving current Id flowing to the light emitting element OD.

[0115] A gate electrode G7 of the bypass transistor T7 is connected to the third gate line 34. A source electrode S7 of the bypass transistor T7 is connected to the anode of the light emitting element OD. A drain electrode D7 of the bypass transistor T7 is connected to the initialization voltage line 22. The bypass transistor T7 is turned on according to the n+1th scan signal Sn+1 transmitted through the third gate line 34 to initialize the anode of the light emitting element OD.

[0116] The second electrode C2 of the storage capacitor Cst is connected to the power line 26. The first electrode C1 of the storage capacitor Cst is connected to the gate electrode G1 of the driving transistor T1, the drain electrode D3 of the compensation transistor T3, and the source electrode S4 of the initialization transistor T4.

[0117] The cathode of the light emitting element OD receives the reference voltage ELVSS. The light emitting element OD receives the driving current Id from the driving transistor T1 to emit light. The light emitting element OD includes a light emitting material. The light emitting element OD can generate light having a color corresponding to the light emitting material. The color of the light generated in the light emitting element OD can have one of red, green, blue and white.

[0118] According to another exemplary embodiment of the inventive concept, various changes may be made to the number and connection relationship of the transistors T1 to T7 constituting the pixel PX.

[0119] Figure 5 It is along Figure 2 A cross-sectional view taken along line II'.

[0120] Reference Figure 5 The display panel EP may include a base substrate BSS, a circuit layer DP-C, a display element layer DP-D, an encapsulation layer DP-E, and an input sensing unit ISU. The circuit layer DP-C and the display element layer DP-D may include a reference pixel PX. Figure 4 Describe the parts.

[0121] The pixel PX may be disposed on the active area AA. The pixel PX may generate light to realize the above-mentioned image IM. The pixel PX may be provided in plurality and arranged on the active area AA.

[0122] Figure 5 An example of a thin film transistor TR-P (hereinafter, referred to as a pixel transistor) and a light emitting element OD in the components of the pixel PX is shown. The pixel transistor TR-P can be connected to Figure 4 corresponds to the driving transistor T1.

[0123] The pixel transistor TR-P and the first insulating layer 10, the second insulating layer 20 and the third insulating layer 30 among the plurality of insulating layers may constitute a circuit layer DP-C. Each of the first insulating layer 10, the second insulating layer 20 and the third insulating layer 30 may include an organic material and / or an inorganic material and have a single-layer structure or a multi-layer structure. The circuit layer DP-C is disposed on the base substrate BSS.

[0124] The base substrate BSS includes a base layer BS and an auxiliary layer BL. The base layer BS may be an insulating base. The base layer BS may be set to be in a flexible state. For example, the base layer BS may include polyimide (PI). Alternatively, the base layer BS may be set to a rigid state. For example, the base layer BS may be made of various materials such as glass or plastic, but the inventive concept is not so limited.

[0125] The auxiliary layer BL is disposed on the base layer BS. The auxiliary layer BL may be directly disposed on the base layer BS to cover the front surface of the base layer BS. Therefore, the front surface of the auxiliary layer BL may be disposed as the front surface of the base substrate BSS, and the rear surface of the base layer BS may be disposed as the rear surface of the base substrate BSS.

[0126] The auxiliary layer BL includes an inorganic material. The auxiliary layer BL may include a barrier layer and / or a buffer layer. Therefore, the auxiliary layer BL may prevent oxygen or moisture introduced through the base layer BS from penetrating into the circuit layer DP-C or the display element layer DP-D, or may reduce the surface energy of the base substrate BSS so that the circuit layer DP-C is stably formed on the base substrate BSS.

[0127] In the base substrate BSS, at least one of the base layer BS and the auxiliary layer BL may be provided in plural and alternately stacked. Optionally, at least one of the barrier layer and the buffer layer constituting the auxiliary layer BL may be provided in plural, or may be omitted altogether. However, this is merely an example, and the inventive concept is not limited thereto. For example, the base substrate BSS according to the inventive concept may be implemented according to various exemplary embodiments, and is not limited to any one specific exemplary embodiment.

[0128] The pixel transistor TR-P includes a semiconductor pattern SP, a control electrode CE, an input electrode IE, and an output electrode OE. The semiconductor pattern SP is disposed on a base substrate BSS. The semiconductor pattern SP may include a semiconductor material. The control electrode CE is spaced apart from the semiconductor pattern SP and a first insulating layer 10 is between the control electrode CE and the semiconductor pattern SP. The control electrode CE may be connected to one electrode of each of the compensation transistor T3 and the storage capacitor Cst.

[0129] The input electrode IE and the output electrode OE may be spaced apart from the control electrode CE with the second insulating layer 20 between them. The input electrode IE and the output electrode OE of the pixel transistor TR-P may be connected to one side and the other side of the semiconductor pattern SP by passing through the first insulating layer 10 and the second insulating layer 20, respectively.

[0130] The third insulating layer 30 may be disposed on the second insulating layer 20 to cover the input electrode IE and the output electrode OE. In the pixel transistor TR-P, the semiconductor pattern SP may be disposed on the control electrode CE. Alternatively, the semiconductor pattern SP may be disposed on the input electrode IE and the output electrode OE. Alternatively, the input electrode IE and the output electrode OE may be disposed on the same layer and directly connected to the semiconductor pattern SP. The pixel transistor TR-P according to the inventive concept may have various structures, but is not limited to any one specific exemplary embodiment.

[0131] The light emitting element OD is disposed on the circuit layer DP-C. The light emitting element OD may constitute a display element layer DP-D together with a fourth insulating layer 40 among the plurality of insulating layers. The light emitting element OD includes a first electrode E1, a light emitting pattern LP, a control layer EL, and a second electrode E2. The fourth insulating layer 40 may include an organic material and / or an inorganic material and have a single-layer structure or a multi-layer structure.

[0132] The first electrode E1 may be connected to the pixel transistor TR-P by passing through the third insulating layer 30. Although not shown, the display panel EP may further include a separate connection electrode disposed between the first electrode E1 and the pixel transistor TR-P. Here, the first electrode E1 may be electrically connected to the pixel transistor TR-P through the connection electrode.

[0133] The fourth insulating layer 40 is disposed on the third insulating layer 30. An opening may be defined in the fourth insulating layer 40. The opening may expose at least a portion of the first electrode E1. The fourth insulating layer 40 may be a pixel defining layer.

[0134] The light emitting pattern LP may be disposed on the opening and on the first electrode E1 exposed by the opening. The light emitting pattern LP may include a light emitting material. For example, the light emitting pattern LP may be made of at least one of several materials that emit light having red, green, and blue colors and include a fluorescent material or a phosphorescent material. The light emitting pattern LP may include an organic light emitting material and an inorganic light emitting material. The light emitting pattern LP may emit light in response to a potential difference between the first electrode E1 and the second electrode E2.

[0135] The control layer EL is disposed between the first electrode E1 and the second electrode E2. The control layer EL is disposed adjacent to the light emitting pattern LP. The control layer EL controls the movement of charges to improve the light emitting efficiency and life of the light emitting element OD. The control layer EL may include at least one of a hole transport material, a hole injection material, an electron transport material, and an electron injection material.

[0136] In the present exemplary embodiment, the control layer EL may be disposed between the light emitting pattern LP and the second electrode E2. However, this is only an example. Instead, the control layer EL may be disposed between the light emitting pattern LP and the first electrode E1, and may be disposed as a plurality of layers stacked in the third direction DR3 with the light emitting pattern LP therebetween.

[0137] The control layer EL may have an overall shape extending from the active area AA to the peripheral area NAA. The control layer EL may be commonly provided to the plurality of pixels PX.

[0138] The second electrode E2 is disposed on the light emitting pattern LP. The second electrode E2 may face the first electrode E1. The second electrode E2 may have an overall shape extending from the active area AA to the peripheral area NAA. The second electrode E2 may be provided in common to a plurality of pixels PX. The light emitting element OD disposed on each pixel PX may receive a common power voltage (hereinafter, referred to as a second power voltage) through the second electrode E2.

[0139] The second electrode E2 may include a transmissive conductive material or a transflective conductive material. Therefore, the light generated in the light emitting pattern LP can be easily emitted in the third direction DR3 through the second electrode E2. However, this is only an example. The light emitting element OD according to the inventive concept may be driven in a bottom emission mode including a transmissive or semi-transmissive material, or may be driven in a double-side emission mode in which light is emitted from all of the front and rear surfaces, but the inventive concept is not limited to any one specific embodiment.

[0140] The encapsulation layer DP-E may be disposed on the light emitting element OD to encapsulate the light emitting element OD. The encapsulation layer DP-E may have an overall shape extending from the active area AA to the peripheral area NAA. The encapsulation layer DP-E may be provided in common to a plurality of pixels PX. Although not shown, a covering layer covering the second electrode E2 may be further disposed between the second electrode E2 and the encapsulation layer DP-E.

[0141] The encapsulation layer DP-E may include a first inorganic layer IOL1, an organic layer OL, and a second inorganic layer IOL2 sequentially stacked in the third direction DR3. However, the inventive concept is not limited thereto. For example, the encapsulation layer DP-E may also include a plurality of inorganic layers and a plurality of organic layers.

[0142] The first inorganic layer IOL1 may cover the second electrode E2. The first inorganic layer IOL1 may prevent external moisture or oxygen from penetrating into the light emitting element OD. For example, the first inorganic layer IOL1 may include silicon nitride, silicon oxide, or a combination thereof. The first inorganic layer IOL1 may be formed by a deposition process.

[0143] The organic layer OL may be disposed on the first inorganic layer 10L1 to contact the first inorganic layer 10L1. The organic layer OL may provide a flat surface on the first inorganic layer 10L1. A curvature formed on the top surface of the first inorganic layer 10L1 or particles existing on the first inorganic layer 10L1 may be covered by the organic layer OL to prevent the surface state of the top surface of the first inorganic layer 10L1 from affecting the components disposed on the organic layer OL. In addition, the organic layer OL may be used to reduce stress between layers contacting each other. The organic layer OL may include an organic material and be formed by a solution process such as spin coating, slit coating, and inkjet.

[0144] The second inorganic layer IOL2 may be disposed on the organic layer OL to cover the organic layer OL. When compared with the first inorganic layer IOL1 disposed under the organic layer OL, the second inorganic layer IOL2 may be relatively stably formed on a flat surface. The second inorganic layer IOL2 may encapsulate moisture released from the organic layer OL to prevent moisture from being introduced. The second inorganic layer IOL2 may include silicon nitride, silicon oxide, or a combination thereof. The second inorganic layer IOL2 may be formed by a deposition process.

[0145] The input sensing unit ISU may include a first conductive layer MTL1, a second conductive layer MTL2, a first touch insulating layer TSL1, and a second touch insulating layer TSL2.

[0146] The first conductive layer MTL1 may be disposed on the encapsulation layer DP-E.

[0147] The first conductive layer MTL1 may include a conductive material. For example, the first conductive layer MTL1 may include at least one of a metal, a transparent conductive oxide, and a conductive polymer. The first conductive layer MTL1 may be provided as a plurality of layers, but is not limited thereto.

[0148] The first touch insulation layer TSL1 may be disposed on the first conductive layer MTL1 to cover the first conductive layer MTL1.

[0149] The second conductive layer MTL2 may be disposed on the first touch insulating layer TSL1. For example, the second conductive layer MTL2 may include at least one of metal, transparent conductive oxide, and conductive polymer. The second conductive layer MTL2 may be provided as a plurality of layers, but is not limited thereto.

[0150] In the present exemplary embodiment, the second conductive layer MTL2 may be electrically connected to the first conductive layer MTL1 through a contact hole (not shown) passing through the first touch insulating layer TSL1 in a partial region of the first touch insulating layer TSL1. A touch line configuration of the input sensing unit ISU formed by using the first conductive layer MTL1 and the second conductive layer MTL2 will be described later.

[0151] The second touch insulation layer TSL2 may be disposed on the second conductive layer MTL2 to cover the second conductive layer MTL2.

[0152] The display panel EP according to an exemplary embodiment of the inventive concept may further include a thin film transistor TR-D (hereinafter, referred to as a control transistor) disposed in the peripheral area NAA, a plurality of signal patterns E-VSS, E-CNT, VIN, and CL, and a plurality of dam parts DM1 and DM2. The control transistor TR-D and the signal patterns E-VSS, E-CNT, VIN, and CL may constitute a circuit layer DP-C.

[0153] As an example, a control transistor TR-D having a structure corresponding to the pixel transistor TR-P is shown. For example, the control transistor TR-D may include a semiconductor pattern SP disposed on a base substrate BSS, a control electrode CE disposed on a first insulating layer 10, an input electrode IE and an output electrode OE disposed on a second insulating layer 20. Therefore, the pixel transistor TR-P and the control transistor TR-D may be formed by the same process at the same time, so that the process may be simplified and the process cost may be reduced. However, this is only an example. The control transistor TR-D according to an exemplary embodiment of the inventive concept may have a structure different from that of the pixel transistor TR-P, and is not limited to any one specific exemplary embodiment.

[0154] The signal patterns E-VSS, E-CNT, VIN, and CL may include a power line E-VSS, a connection electrode E-CNT, an initialization voltage line VIN, and a drive signal line CL. The power line E-VSS may correspond to a power terminal of the pixel PX. Therefore, the power line E-VSS supplies the second power voltage to the light emitting element OD. In the present exemplary embodiment, the second power voltage supplied to the pixel PX may be a common voltage for all pixels PX.

[0155] The power line E-VSS may be disposed on the second insulating layer 20 to constitute the circuit layer DP-C. The power line E-VSS may be formed by the same process as the input electrode IE or the output electrode OE of the control transistor TR-D. However, this is only an example. For example, the power line E-VSS may be disposed on a layer different from the layer of the input electrode IE and the output electrode OE of the control transistor TR-D, thereby being formed by a separate process, but is not limited to the specific exemplary embodiment.

[0156] The connection electrode E-CNT may be disposed on the third insulating layer 30 to constitute the display element layer DP-D. The connection electrode E-CNT is electrically connected to the power supply line E-VSS. The connection electrode E-CNT may extend from the top surface of the third insulating layer 30 to cover the top surface of the power supply line E-VSS exposed by the third insulating layer 30.

[0157] The second electrode E2 of the light emitting element OD extends from the active area AA and is connected to the connection electrode E-CNT. The connection electrode E-CNT can receive the second power voltage from the power line E-VSS. Therefore, the second power voltage can be transmitted to the second electrode E2 through the connection electrode E-CNT and provided to each pixel PX.

[0158] The connection electrode E-CNT may be disposed on the same layer as the first electrode E1 of the light emitting element OD and thus may be formed simultaneously with the first electrode E1. However, this is merely an example. The connection electrode E-CNT and the first electrode E1 may alternatively be disposed on different layers from each other.

[0159] The driving signal line CL may be provided in plural and disposed on the second insulating layer 20. The driving signal line CL may be provided in the peripheral area NAA. The driving signal line CL may be a wiring connected to a pad (also called a "pad") or a line constituting an integrated circuit IC. The driving signal lines CL may be provided to be spaced apart from each other in the first direction DR1 to independently transmit electrical signals.

[0160] An initialization voltage line VIN may be provided in the active area AA to supply an initialization voltage to the pixel PX. Although not shown, the initialization voltage line VIN may be provided in plurality to supply an initialization voltage to each pixel PX.

[0161] The drive signal line CL and the initialization voltage line VIN may be disposed on the same layer and formed by the same process at the same time. However, this is only an example. The drive signal line CL and the initialization voltage line VIN may alternatively be independently formed by separate processes, but the invention is not limited to any one specific exemplary embodiment.

[0162] The dam parts DM1 and DM2 are disposed in the peripheral area NAA. When the organic layer OL of the encapsulation layer TFE is formed, the dam parts DM1 and DM2 may prevent the organic layer OL from overflowing from the active area AA to the dam parts DM1 and DM2. Figure 5The dam parts DM1 and DM2 may be disposed adjacent to at least one side of the active area AA. The dam parts DM1 and DM2 may surround the active area AA on a plane. The dam parts DM1 and DM2 may be disposed in plural and include a first dam part DM1 and a second dam part DM2.

[0163] The first dam part DM1 may be disposed relatively closer to the active area AA than the second dam part DM2. The first dam part DM1 may be disposed to overlap the power line E-VSS in a plane. In this embodiment, the connection electrode E-CNT may pass between the first dam part DM1 and the power line E-VSS in a cross section.

[0164] In the present exemplary embodiment, the first dam part DM1 may be made of the same material as the fourth insulating layer 40, and the first dam part DM1 and the fourth insulating layer 40 may be formed at the same time through one mask. Therefore, a separate process for forming the first dam part DM1 may not be required, thereby reducing process costs and simplifying processes.

[0165] The second dam part DM2 may be disposed at an outer side relative to the first dam part DM1. The second dam part DM2 may be disposed at a position covering a portion of the power supply line E-VSS. In the present exemplary embodiment, the second dam part DM2 may have a multilayer structure including a first layer DM2-L1 and a second layer DM2-L2. For example, the first layer DM2-L1 and the third insulating layer 30 may be formed at the same time, and the second layer DM2-L2 and the fourth insulating layer 40 may be formed at the same time. Therefore, the second dam part DM2 may be easily formed even without performing a separate process.

[0166] In the present exemplary embodiment, the connection electrode E-CNT may be disposed to partially overlap the first layer DM2-L1 of the second dam part DM2. The connection electrode E-CNT may have one end inserted between the first layer DM2-L1 and the second layer DM2-L2. However, this is only an example. The connection electrode E-CNT may not extend to the second dam part DM2, but the inventive concept is not limited to any one specific exemplary embodiment.

[0167] The first inorganic layer IOL1 and the second inorganic layer IOL2 may extend from the active area AA to the outside of the second dam part DM2. The first inorganic layer IOL1 and the second inorganic layer IOL2 may cover the first dam part DM1 and the second dam part DM2. The organic layer OL may be disposed inside the second dam part DM2. However, this is only an example. A portion of the organic layer OL may alternatively extend to a region overlapping the first dam part DM1, but the inventive concept is not limited to any one specific embodiment.

[0168] Figure 6 yes Figure 4 A plan view of an input sensing unit and a base substrate.

[0169] The input sensing unit ISU may be implemented in a capacitive manner. The input sensing unit ISU may operate in one of a manner of extracting touch coordinates based on a capacitance change of a capacitor composed of two insulated touch wires extending in different directions and a manner of extracting touch coordinates based on a capacitance change of a capacitor composed of a plurality of touch electrodes having an effective area. Hereinafter, a structure in which the input sensing unit ISU operates in an electrical manner will be exemplarily described.

[0170] The input sensing unit ISU may sense a touch input into the active area AA of the display panel EP but may not sense a touch input into the peripheral area NAA.

[0171] The input sensing unit ISU may include sensing touch lines RX1 to RX5 , transmission touch lines TX1 to TX4 , sensing lines RL1 to RL5 , transmission lines TL1 to TL8 , and a touch pad TPD.

[0172] The sensing touch lines RX1 to RX5 are spaced apart from the transmission touch lines TX1 to TX4 .

[0173] The transmission touch lines TX1 to TX4 are insulated from and cross the sensing touch lines RX1 to RX5. Each of the transmission touch lines TX1 to TX4 includes a plurality of transmission touch sensing parts SP2 and a plurality of first connection parts CP1. The transmission touch sensing parts SP2 are arranged in a first direction DR1. Each first connection part CP1 connects two transmission touch sensing parts SP2 adjacent to each other among the transmission touch sensing parts SP2. Although not shown, each transmission touch sensing part SP2 may have a mesh shape having an opening therein.

[0174] Each of the sensing touch lines RX1 to RX5 includes a plurality of sensing touch sensing parts SP1 and a plurality of second connection parts CP2. The sensing touch sensing parts SP1 are arranged in the second direction DR2. Each second connection part CP2 connects two sensing touch sensing parts SP1 adjacent to each other among the sensing touch sensing parts SP1. Although not shown, each sensing touch sensing part SP1 may have a mesh shape having an opening therein.

[0175] In an exemplary embodiment of the inventive concept, the sensing touch sensing part SP1, the second connecting part CP2, and the transmitting touch sensing part SP2 may be disposed on a reference Figure 5 In the first conductive layer MTL1 described above, the first connection part CP1 may be arranged in reference to Figure 5Here, the first connection part CP1 may be connected to the transmission touch sensing part SP2 through a contact hole (not shown) defined in the first touch insulating layer TSL1. However, the inventive concept is not limited thereto. For example, according to another exemplary embodiment of the inventive concept, the sensing touch sensing part SP1, the second connection part CP2, and the transmission touch sensing part SP2 may be arranged in reference to Figure 5 In the second conductive layer MTL2 described above, the first connection component CP1 may be arranged in reference to Figure 5 The first conductive layer MTL1 is described.

[0176] The sensing touch lines RX1 to RX5 and the transmission touch lines TX1 to TX4 may constitute a touch capacitor. The input sensing unit ISU may sense a touch input coordinate based on a capacitance change of the touch capacitor.

[0177] Each of the sensing lines RL1 to RL5 may have one end connected to each of the sensing touch lines RX1 to RX5. Each of the sensing lines RL1 to RL5 may have the other end connected to each of the touch pads TPD. The sensing lines RL1 to RL5 may provide sensing signals received from the sensing touch lines RX1 to RX5 to a touch driving chip (TDC, not shown) through the touch pads TPD.

[0178] One end of each of the first transmission line TL1, the second transmission line TL2, the third transmission line TL3, and the fourth transmission line TL4 among the transmission lines TL1 to TL8 may be connected to one end of each of the transmission touch lines TX1 to TX4. Each of the first transmission line TL1, the second transmission line TL2, the third transmission line TL3, and the fourth transmission line TL4 may have the other end connected to each touch pad TPD. One end of each of the fifth transmission line TL5, the sixth transmission line TL6, the seventh transmission line TL7, and the eighth transmission line TL8 among the transmission lines TL1 to TL8 may be connected to the other end of each of the transmission touch lines TX1 to TX4. Each of the fifth transmission line TL5, the sixth transmission line TL6, the seventh transmission line TL7, and the eighth transmission line TL8 may have the other end connected to each touch pad TPD. Specifically, in the case of the first transmission touch line TX1, the first external transmission touch sensing component PTC1 which is provided in the first transmission touch line TX1 and is provided at the outermost side in the first direction DR1 is connected to the fifth transmission line TL5, and the second external transmission touch sensing component PTC2 which is provided in the first transmission touch line TX1 and is provided at the outermost side in the direction opposite to the first direction DR1 is connected to the first transmission line TL1.

[0179] The transmission lines TL1 to TL8 may provide a touch driving signal applied from a touch driving chip to the transmission touch lines TX1 to TX4 through the touch pad TPD.

[0180] The number of the sensing lines RL1 to RL5 may be the same as the number of the sensing touch lines RX1 to RX5 , and the number of the transmission lines TL1 to TL8 may be greater than the number of the transmission touch lines TX1 to TX4 .

[0181] According to an exemplary embodiment of the inventive concept, the display panel EP (see Figure 2 ) may have a rectangular shape in a plane. The base substrate BSS may have long sides extending in the first direction DR1 and short sides extending in the second direction DR2.

[0182] Each of the transmission touch lines TX1 to TX4 may have a length greater than that of each of the sensing touch lines RX1 to RX5. In order to solve a signal delay caused by a resistance value difference according to a length difference between each of the transmission touch lines TX1 to TX4 and each of the sensing touch lines RX1 to RX5, the transmission lines TL1 to TL8 may be connected to both ends of each of the transmission touch lines TX1 to TX4, and the sensing lines RL1 to RL5 may be connected to one end of each of the sensing touch lines RX1 to RX5.

[0183] Figure 7 It is along Figure 2 A cross-sectional view taken along line II-II'. Figure 8 and Fig. 9 yes Figure 2 Floor plan of area XX'. Figure 7 It may substantially correspond to the cross-sectional view of region XX'. Figure 8 and Fig. 9 A part of the components of the display panel EP is schematically shown. Fig.10 It is along Fig. 9 Specifically, Figure 8 shows a portion of a pixel PX and a signal line, Fig. 9 The input sensing unit ISU is shown. Figures 7 to 10 Describe the inventive concept.

[0184] The hole area HA may be surrounded by the active area AA in a plane. Figure 7 and Figure 8 , for convenience of description, the hole area HA is shown by a dotted line. The pixel PX may be disposed to be spaced apart from the module hole MH, and a portion of the pixel PX disposed adjacent to the hole area HA may be disposed along an edge of the hole area HA.

[0185] Reference Figure 7, the module hole MH is defined in the hole area HA. ​​The module hole MH may be defined in the center of the hole area HA. ​​The module hole MH may be a through hole to pass through the display panel EP. The module hole MH passes through the front surface and the rear surface of the base substrate BSS. Specifically, the module hole MH passes through a component disposed in the hole area HA in a layer disposed on the front surface of the base substrate BSS. Therefore, the first insulating layer 10, the second insulating layer 20, the third insulating layer 30, the control layer EL, the first inorganic layer IOL1, and the second inorganic layer IOL2 extending to the hole area HA may be penetrated to define the side surface of the module hole MH.

[0186] The display panel EP according to the present exemplary embodiment may further include a groove pattern GV defined in the hole area HA. ​​The groove pattern GV may be defined along the edge of the module hole MH. In the present exemplary embodiment, the groove pattern GV may surround the module hole MH. The groove pattern GV may have a circular shape similar to the circular shape of the module hole MH on a plane, but is not limited thereto. For example, the groove pattern GV may have a shape different from that of the module hole MH, may have a closed line shape including a polygonal shape, an elliptical shape, or an at least partially circular shape, or may be set in a shape including a plurality of partially cut patterns, but is not limited to any one specific exemplary embodiment.

[0187] The groove pattern GV may be a pattern recessed from the front surface of the display panel EP. A portion of a component of the display panel EP may be removed to form the groove pattern GV. Unlike the module hole MH, the groove pattern GV may not pass through the display panel EP. Therefore, the rear surface of the base substrate BSS overlapped with the groove pattern GV may not be opened due to the groove pattern GV.

[0188] The groove pattern GV may be defined to pass through the remaining portion except a portion of the base layer BS. In the present exemplary embodiment, the groove pattern GV may be formed by connecting a through portion defined in the auxiliary layer BL to a groove portion defined in the base layer BS. The inner surface of the groove pattern GV may be covered by the first inorganic layer IOL1 and the second inorganic layer IOL2.

[0189] The groove pattern GV may have an undercut shape including a tip portion TP protruding inwardly. The tip portion TP according to the present exemplary embodiment may be formed such that a portion of the auxiliary layer BL protrudes further to the inside of the groove pattern GV than the base layer BS. The display panel EP according to the inventive concept may have various layer structures as long as the tip portion TP is disposed on the groove pattern GV, without being limited to any one specific exemplary embodiment.

[0190] The display panel EP may further include a predetermined organic pattern EL-P disposed in the groove pattern GV. The organic pattern EL-P may be made of the same material as the control layer EL. Optionally, the organic pattern EL-P may also include the same material as the second electrode E2. The organic pattern EL-P may have a single-layer structure or a multi-layer structure.

[0191] The organic pattern EL-P may be disposed in the groove pattern GV while being spaced apart from the control layer EL and the second electrode E2. The organic pattern EL-P may be covered by the first inorganic layer IOL1 and thus may not be exposed to the outside.

[0192] According to the inventive concept, the groove pattern GV cuts off the continuity of the control layer EL connected from the side surface of the module hole MH to the active area AA. The control layer EL may be disconnected at the area overlapping with the groove pattern GV. The control layer EL may serve as a moving path for external contaminants such as moisture or air. The layer exposed by the module hole MH (for example, a path for moisture or air introduced from the control layer EL to be introduced into the active area AA via the hole area HA) may be disconnected due to the groove pattern GV. Therefore, the display panel EP in which the module hole MH is defined may have improved reliability.

[0193] The groove pattern GV includes a first groove pattern GV1 and a second groove pattern GV2. On a plane, the first groove pattern GV1 surrounds the module hole MH, and the second groove pattern GV2 surrounds the first groove pattern GV1. The module hole MH, the first groove pattern GV1, and the second groove pattern GV2 may be spaced apart from each other. In the present exemplary embodiment, the first groove pattern GV1 and the second groove pattern GV2 may have substantially the same shape. However, the inventive concept is not limited thereto. The first groove pattern GV1 and the second groove pattern GV2 may have shapes different from each other. According to another exemplary embodiment of the inventive concept, the groove pattern GV may further include at least one groove spaced apart from the second groove pattern GV2 and surrounding the second groove pattern GV2.

[0194] The first inorganic layer IOL1 may extend to a region in which the first groove pattern GV1 and the second groove pattern GV2 are disposed. The first inorganic layer IOL1 may be disposed in a region adjacent to the first groove pattern GV1 and the second groove pattern GV2 and along inner surfaces of the first groove pattern GV1 and the second groove pattern GV2. Therefore, the inner side of each of the first groove pattern GV1 and the second groove pattern GV2 may be covered by the first inorganic layer IOL1.

[0195] The encapsulation layer DP-E may be filled into the second groove pattern GV2 but may not be filled into the first groove pattern GV1.

[0196] The second inorganic layer IOL2 may extend to a region where the first and second groove patterns GV1 and GV2 are disposed. The second inorganic layer IOL2 may be disposed in a region adjacent to the first and second groove patterns GV1 and GV2 and along an inner surface of the first groove pattern GV1.

[0197] Therefore, the inner side of the first groove pattern GV1 may be covered by the second inorganic layer IOL2. Since the organic layer OL of the encapsulation layer DP-E is filled into the second groove pattern GV2, the second inorganic layer IOL2 may not be disposed on the inner surface of the second groove pattern GV2. The organic layer OL may be disposed between the first inorganic layer IOL1 and the second inorganic layer IOL2 in an area overlapping the second groove pattern GV2.

[0198] The first conductive layer MTL1 and the second conductive layer MTL2 may be disposed to overlap the second groove pattern GV2 within the hole area HA. ​​That is, in the case of a structure in which the organic layer OL is filled into the second groove pattern GV2, the first conductive layer MTL1 and the second conductive layer MTL2 may be disposed to overlap the second groove pattern GV2 and thus be disposed closer to the module hole MH.

[0199] In the display panel EP according to another exemplary embodiment of the inventive concept, the groove pattern GV may be omitted.

[0200] As described above, the pixel PX and the input sensing unit ISU are disposed to be spaced apart from the module hole MH on a plane. Figure 8 and Fig. 9 , the module hole MH and the pixel PX and the input sensing unit ISU near the module hole MH will be described.

[0201] Reference Figure 7 , a wiring area RA may be further defined in the hole area HA. ​​The wiring area RA may be defined outside the module hole MH. The wiring area RA may surround the module hole MH.

[0202] Reference Figure 8 , the pixels PX may be arranged to surround the hole area HA. ​​A portion of the pixels PX may be arranged along the edge of the hole area HA. ​​The pixels PX may be spaced apart from the module hole MH on a plane.

[0203] A plurality of signal lines SL1, SL2, SL3, and SL4 connected to the pixel PX may be disposed in the hole area HA. ​​The signal lines SL1, SL2, SL3, and SL4 may be connected to the pixel PX via the wiring area RA. Figure 8, for convenience of description, an example is shown in which a first signal line SL1, a second signal line SL2, a third signal line SL3, and a fourth signal line SL4, among a plurality of signal lines, are connected to the pixel PX.

[0204] In the active area AA, the first signal line SL1 extends in the first direction DR1. The first signal line SL1 is connected to the pixels PX arranged along the first direction DR1 and in the same column among the pixels PX. The first signal line SL1 may be connected to the data line 16 (see Figure 4 )correspond.

[0205] In the wiring area RA, the first signal line SL1 may have a meander shape. Figure 8 An example is shown in which the first signal line SL1 draws a semicircle along the outline of the module hole MH in the wiring area RA.

[0206] A portion of the pixels PX connected to the first signal line SL1 among the pixels PX may be disposed above the module hole MH, and the other portion of the pixels PX may be disposed below the module hole MH. Therefore, even if a portion of the pixels with respect to the module hole MH is omitted, the pixels PX in the same column connected to the first signal line SL1 may receive a data signal through the same line.

[0207] In the active area AA, the second signal line SL2 extends in the second direction DR2. The second signal line SL2 is connected to the pixels PX arranged along the second direction DR2 and in the same row among the pixels PX. The second signal line SL2 may be connected to the first gate line 14 (see Figure 4 )correspond.

[0208] In the wiring area RA, the second signal line SL2 may have a meander shape. Figure 8 An example is shown in which the second signal line SL2 performs semicircular routing along the outlines of the module hole MH and the groove pattern GV in the routing area RA.

[0209] A portion of the pixels PX connected to the second signal line SL2 among the pixels PX may be disposed at the left side of the module hole MH, and the other portion of the pixels PX may be disposed at the right side of the module hole MH. Therefore, even if a portion of the pixels with respect to the module hole MH is omitted, the pixels PX connected to the second signal line SL2 and in the same row may be turned on / off by substantially the same gate signal.

[0210] The display panel EP according to an exemplary embodiment of the inventive concept may further include a connection pattern disposed in the wiring area RA. Here, the first signal line SL1 may be disconnected at an area overlapping the hole area HA. ​​The disconnected portion of the first signal line SL1 may be connected by a connection pattern. Here, the connection pattern may be disposed on a layer different from the layer on which the first signal line SL1 is disposed, and may be connected to the first signal line SL1 through a contact hole. Similarly, the second signal line SL2 may be disconnected at an area overlapping the hole area HA, and a connection pattern of the second signal line SL2 connecting the disconnected portion of the second signal line SL2 may be further disposed. Here, the connection pattern may be disposed on a layer different from the layer on which the second signal line SL2 is disposed, and may be connected to the second signal line SL2 through a contact hole.

[0211] In the active area AA, the third signal line SL3 extends in the first direction DR1, and the fourth signal line SL4 extends in the second direction DR2. The third signal line SL3 may be spaced apart from the first signal line SL1, and the fourth signal line SL4 may be spaced apart from the second signal line SL2.

[0212] In the wiring area RA, each of the third signal line SL3 and the fourth signal line SL4 may have a meander shape. Figure 8 An example is shown in which the third signal line SL3 and the fourth signal line SL4 perform semicircular routing along the outlines of the module hole MH and the groove pattern GV in the routing area RA.

[0213] Each of the third signal line SL3 and the fourth signal line SL4 may be a reference Figure 4 One of the light emitting line 15, the power line 26 and the initialization voltage line 22 is described.

[0214] Reference Fig. 9 and Fig.10 , the sensing touch sensing part SP1 and the transmitting touch sensing part SP2 are spaced apart from each other.

[0215] Each of the sensing touch sensing part SP1 and the transmission touch sensing part SP2 may include a plurality of grid lines MSL crossing the first direction DR1 and the second direction DR2. The grid lines MSL may include a first grid line MSL1 extending in one direction and a second grid line MSL2 extending in a direction crossing the first grid line MSL1. The first grid line MSL1 and the second grid line MSL2 may be connected to each other to form the sensing touch sensing part SP1 and the transmission touch sensing part SP2 having a mesh shape.

[0216] The second connection parts CP2 are arranged in the second direction DR2. Each second connection part CP2 connects two touch sensing parts SP1 adjacent to each other in the second direction DR2. The second connection parts CP2 may be formed by first mesh lines MSL1 and second mesh lines MSL2.

[0217] The first connection parts CP1 extend in the first direction DR1. Each first connection part CP1 connects two transmission touch sensing parts SP2 adjacent to each other in the first direction DR1. Although not shown, each first connection part CP1 may have a rod shape and be formed by the first mesh line MSL1 and the second mesh line MSL2.

[0218] In this exemplary embodiment, referring to Figure 6 The sensing touch sensing part SP1, the transmission touch sensing part SP2 and the second connection part CP2 described may be arranged on the same layer, and the first connection part CP1 may be arranged on a different layer. Since the second connection part CP2 and the first connection part CP1 are arranged on different layers from each other, even if the second connection part CP2 and the first connection part CP1 are arranged to cross each other on a plane, the second connection part CP2 and the first connection part CP1 may be electrically insulated from each other. The second connection part CP2 may be directly connected to the sensing touch sensing part SP1, and the first connection part CP1 may be connected to the transmission touch sensing part SP2 through the contact hole CH1.

[0219] In the present exemplary embodiment, a portion of the sensing touch sensing part SP1 and a portion of the transmitting touch sensing part SP2 may be disconnected with respect to the module hole MH.

[0220] A portion of the transmission touch sensing part SP2 may be divided into an upper portion and a lower portion with respect to the module hole MH. A portion of the transmission touch sensing part SP2 may have a shape in which a portion overlapping the hole area HA is removed. A portion of the transmission touch sensing part SP2 having a shape in which a portion overlapping the hole area HA is removed may be defined as a transmission touch pattern ST. The transmission touch pattern ST may include a first transmission touch pattern ST1 disposed on one side of the hole area HA in the first direction DR1 and a second transmission touch pattern ST2 disposed on the other side of the hole area HA in the first direction DR1.

[0221] A portion of the sensing touch sensing part SP1 may be divided into a left portion and a right portion with respect to the module hole MH. A portion of the sensing touch sensing part SP1 may have a shape in which a portion overlapping the hole area HA is removed. A portion of the sensing touch sensing part SP1 having a shape in which a portion overlapping the hole area HA is removed may be defined as a sensing touch pattern RT. The sensing touch pattern RT may include a first sensing touch pattern RT1 disposed on one side of the hole area HA in the second direction DR2 and a second sensing touch pattern RT2 disposed on the other side of the hole area HA in the second direction DR2.

[0222] In the display panel EP according to an exemplary embodiment of the inventive concept, the input sensing unit ISU may further include a sensing bridge pattern SBL and a transmission bridge pattern TBL. The sensing bridge pattern SBL and the transmission bridge pattern TBL electrically connect the disconnected touch sensing components via the wiring area RA. Specifically, the sensing bridge pattern SBL may connect the first sensing touch pattern RT1 to the second sensing touch pattern RT2, and the transmission bridge pattern TBL may connect the first transmission touch pattern ST1 to the second transmission touch pattern ST2.

[0223] In the following exemplary embodiments, the sensing bridge pattern SBL may be defined as a first bridge pattern, and the transmission bridge pattern TBL may be defined as a second bridge pattern.

[0224] The sensing bridge pattern SBL and the transmission bridge pattern TBL may be disposed on different layers from each other. In the present embodiment, the sensing bridge pattern SBL may be disposed on the same layer as the sensing touch sensing part SP1, the second connection part CP2, and the transmission touch sensing part SP2, and the transmission bridge pattern TBL may be disposed on the same layer as the first connection part CP1. That is, the sensing bridge pattern SBL may be disposed on the same layer as the first connection part CP1. Figure 5 In the first conductive layer MTL1 described above, the transmission bridge pattern TBL may be arranged in reference to Figure 5 The second conductive layer MTL2 is described.

[0225] The sensing bridge pattern SBL may be directly connected to the first sensing touch pattern RT1 and the second sensing touch pattern RT2. The transmission bridge pattern TBL may be connected to the first transmission touch pattern ST1 and the second transmission touch pattern ST2 through contact holes CH-1, CH-2, CH-3, and CH-4. The contact holes CH-1, CH-2, CH-3, and CH-4 may be provided at Figure 5 The first touch insulating layer TSL1 is formed in the touch insulating layer TSL1.

[0226] According to the inventive concept, the sensing bridge pattern SBL may include a first sensing bridge pattern SBL1 and a second sensing bridge pattern SBL2. The first sensing bridge pattern SBL1 and the second sensing bridge pattern SBL2 may be spaced apart from each other. The first sensing bridge pattern SBL1 and the second sensing bridge pattern SBL2 may be supplementarily used to electrically connect the first sensing touch pattern RT1 and the second sensing touch pattern RT2 to each other. In addition, since each of the first sensing bridge pattern SBL1 and the second sensing bridge pattern SBL2 has a relatively larger length than the length of the second connection part CP2, two sensing bridge patterns SBL may be provided to reduce resistance.

[0227] The first sensing bridge pattern SBL1 may be disposed in the wiring area RA via an upper region of the module hole MH. The second sensing bridge pattern SBL2 may be disposed in the wiring area RA via a lower region of the module hole MH.

[0228] The first sensing bridge pattern SBL1 may include a first sensing body pattern SB1, a first sensing connection pattern SC1, and a second sensing connection pattern SC2 which are randomly distinguished from each other to explain the shape of the first sensing bridge pattern SBL1 and are thus substantially provided as a single body.

[0229] The first sensing body pattern SB1 may be disposed in the wiring area RA via an upper area of ​​the module hole MH. The first sensing body pattern SB1 may have a bent shape.

[0230] The first sensing connection pattern SC1 extends from one end of the first sensing body pattern SB1 and is connected to the first sensing touch pattern RT1. In the present exemplary embodiment, the first sensing connection pattern SC1 contacts the first sensing touch pattern RT1.

[0231] The second sensing connection pattern SC2 extends from the other end of the first sensing body pattern SB1 and is connected to the second sensing touch pattern RT2. In the present exemplary embodiment, the second sensing connection pattern SC2 contacts the second sensing touch pattern RT2.

[0232] The first sensing body pattern SB1 may have a width greater than a width of each of the first sensing connection pattern SC1 and the second sensing connection pattern SC2. The width of the first sensing body pattern SB1 may be controlled to adjust the resistance of the first sensing bridge pattern SBL1.

[0233] Each of the first sensing connection pattern SC1 and the second sensing connection pattern SC2 may be provided in plural. Therefore, even if a portion of the plurality of first sensing connection patterns SC1 and a portion of the plurality of second sensing connection patterns SC2 are disconnected from each other, the first sensing touch pattern RT1 and the second sensing touch pattern RT2 may be electrically connected to each other.

[0234] The second sensing bridge pattern SBL2 may include a second sensing body pattern SB2, a third sensing connection pattern SC3, and a fourth sensing connection pattern SC4. The second sensing bridge pattern SBL2 has substantially the same shape as the first sensing bridge pattern SBL1, and thus a detailed description thereof will be omitted.

[0235] According to the inventive concept, the transmission bridge pattern TBL may include a first transmission bridge pattern TBL1 and a second transmission bridge pattern TBL2. The first transmission bridge pattern TBL1 and the second transmission bridge pattern TBL2 may be spaced apart from each other. The first transmission bridge pattern TBL1 and the second transmission bridge pattern TBL2 may be supplementarily used to electrically connect the first transmission touch pattern ST1 and the second transmission touch pattern ST2 to each other. In addition, since each of the first transmission bridge pattern TBL1 and the second transmission bridge pattern TBL2 has a relatively larger length than the length of the first connection part CP1, two transmission bridge patterns TBL may be provided to reduce resistance.

[0236] The first transmission bridge pattern TBL1 may be disposed in the wiring area RA via a left area of ​​the module hole MH. The first transmission bridge pattern TBL1 may have one end connected to the first transmission touch pattern ST1 through a contact hole CH-1 and the other end connected to the second transmission touch pattern ST2 through a contact hole CH-2.

[0237] The second transmission bridge pattern TBL2 may be disposed in the wiring area RA via the right area of ​​the module hole MH. The second transmission bridge pattern TBL2 may have one end connected to the first transmission touch pattern ST1 through the contact hole CH-3 and the other end connected to the second transmission touch pattern ST2 through the contact hole CH-4.

[0238] The first transmission bridge pattern TBL1 may include a first transmission body pattern TB1, a first transmission connection pattern TC1, and a second transmission connection pattern TC2 which are randomly distinguished from each other to explain the shape of the first transmission bridge pattern TBL1 and are thus substantially provided as a single body.

[0239] The first transmission body pattern TB1 may be disposed in the wiring area RA via a left area of ​​the module hole MH. The first transmission body pattern TB1 may have a bent shape.

[0240] The first transmission connection pattern TC1 extends from one end of the first transmission body pattern TB1 and is connected to the first transmission touch pattern ST1 through the contact hole CH-1.

[0241] The second transmission connection pattern TC2 extends from the other end of the first transmission body pattern TB1 and is connected to the second transmission touch pattern ST2 through the contact hole CH-2.

[0242] The first transmission body pattern TB1 may have a width greater than a width of each of the first and second transmission connection patterns TC1 and TC2 . The width of the first transmission body pattern TB1 may be controlled to adjust the resistance of the first transmission bridge pattern TBL1 .

[0243] Each of the first and second transmission connection patterns TC1 and TC2 may be provided in plural. Therefore, even if a portion of the plurality of first transmission connection patterns TC1 and a portion of the plurality of second transmission connection patterns TC2 are disconnected from each other, the first and second transmission touch patterns ST1 and ST2 may be electrically connected to each other.

[0244] The second transmission bridge pattern TBL2 may include a second transmission body pattern TB2, a third transmission connection pattern TC3, and a fourth transmission connection pattern TC4. The second transmission bridge pattern TBL2 has substantially the same shape as the first transmission bridge pattern TBL1, and thus, a detailed description thereof will be omitted.

[0245] In the display device according to the inventive concept, pixels or touch sensing components spaced apart from each other about the module hole can be connected to each other through a signal line or a bridge pattern to maintain an organic / electrical connection between pixels or touch sensing components spaced apart from each other about the module hole, thereby facilitating electrical control of the pixels. Therefore, even if the module hole is confined to an area surrounded by the active area, the active area of ​​the display device can be stably driven.

[0246] According to the inventive concept, when compared with the active area AA, the sensing touch pattern RT and the transmission touch pattern ST adjacent to the module hole MH may have relatively low touch sensitivity near the module hole MH because a portion of the electrode is removed.

[0247] The first and second sensing bridge patterns SBL1 and SBL2 and the first and second transmission bridge patterns TBL1 and TBL2 may form capacitors within the wiring area RA to compensate for insufficient touch sensitivity of the sensing and transmission touch patterns RT and ST.

[0248] The slits SI1, SI2, SI3, and SI4 may be disposed in portions of the first sensing bridge pattern SBL1 and the second sensing bridge pattern SBL2 and the first transmission bridge pattern TBL1 and the second transmission bridge pattern TBL2. The slits SI1, SI2, SI3, and SI4 may be disposed in crossing portions (or referred to as crossing parts) between the first sensing bridge pattern SBL1 and the first transmission bridge pattern TBL1 and the second transmission bridge pattern TBL2 and between the second sensing bridge pattern SBL2 and the first transmission bridge pattern TBL1 and the second transmission bridge pattern TBL2.

[0249] In the present exemplary embodiment, an example is shown in which the first and second slits SI1 and SI2 are disposed in the first sensing bridge pattern SBL1 and the third and fourth slits SI3 and SI4 are disposed in the second sensing bridge pattern SBL2.

[0250] The first slit SI1 may be disposed in an intersection between the first sensing body pattern SB1 and the first transmission connection pattern TC1, the second slit SI2 may be disposed in an intersection between the first sensing body pattern SB1 and the third transmission connection pattern TC3, the third slit SI3 may be disposed in an intersection between the second sensing body pattern SB2 and the second transmission connection pattern TC2, and the fourth slit SI4 may be disposed in an intersection between the second sensing body pattern SB2 and the fourth transmission connection pattern TC4. The first slit SI1, the second slit SI2, the third slit SI3, and the fourth slit SI4 may overlap with the corresponding first transmission connection pattern TC1, the second transmission connection pattern TC2, the third transmission connection pattern TC3, and the fourth transmission connection pattern TC4.

[0251] The overlapping areas between the first sensing bridge pattern SBL1 and the first and second transmission bridge patterns TBL1 and TBL2 and between the second sensing bridge pattern SBL2 and the first and second transmission bridge patterns TBL1 and TBL2 can be minimized by the first, second, third, and fourth slits SI1, SI2, SI3, and SI4. Therefore, the first and second sensing bridge patterns SBL1 and SBL2 and the first and second transmission bridge patterns TBL1 and TBL2 can be prevented from being short-circuited to each other to minimize signal interference.

[0252] According to another exemplary embodiment of the inventive concept, one of the first and second sensing bridge patterns SBL1 and SBL2 may be omitted, and one of the first and second transmission bridge patterns TBL1 and TBL2 may be omitted.

[0253] Although not shown, according to another exemplary embodiment of the inventive concept, when each of the module hole MH and the hole area HA has enough space to connect to two or more transmission touch lines ( Figure 6 transmission touch lines TX1 to TX4) and two or more sensing touch lines ( Figure 6 When the size of the sensing touch lines RX1 to RX5 overlaps, the first sensing bridge pattern SBL1 and the second sensing bridge pattern SBL2 may be connected to the sensing touch lines ( Figure 6 Similarly, the first transmission bridge pattern TBL1 and the second transmission bridge pattern TBL2 may be connected to the transmission touch lines ( Figure 6 A transmission touch pattern in a portion of the transmission touch lines TX1 to TX4).

[0254] like Fig. 9 As shown in , the input sensing unit ISU may further include a dummy pattern DT. The dummy pattern DT may be disposed between the first sensing bridge pattern SBL1 and the second sensing bridge pattern SBL2 and between the first transmission bridge pattern TBL1 and the second transmission bridge pattern TBL2. The dummy pattern DT may be disposed to be spaced apart from the first sensing bridge pattern SBL1 and the second sensing bridge pattern SBL2 and the first transmission bridge pattern TBL1 and the second transmission bridge pattern TBL2.

[0255] The dummy pattern DT can be set in reference Figure 5 The first conductive layer MTL1 and the second conductive layer MTL2 are described.

[0256] The dummy pattern DT may prevent a region between the first and second sensing bridge patterns SBL1 and SBL2 and between the first and second transmission bridge patterns TBL1 and TBL2 from being viewed as a spot.

[0257] Fig.11 is a plan view of a portion of an input sensing unit according to another exemplary embodiment of the inventive concept. Fig.11 Another exemplary embodiment according to the inventive concept is shown. Figure 2 of area XX'.

[0258] The main description refers to Fig.11 The input sensing unit ISU1 described with reference to Fig. 9 The differences between the input sensing units ISU described will be Fig. 9 Parts not described are derived from the description.

[0259] Reference Fig.11 , the input sensing unit ISU1 may include a sensing bridge pattern SBP and a transmission bridge pattern TBP.

[0260] The sensing bridge pattern SBP may include a first sensing bridge pattern SBP1 and a second sensing bridge pattern SBP2. The first sensing bridge pattern SBP1 and the second sensing bridge pattern SBP2 are aligned with the reference Fig. 9 The described first and second sensing bridge patterns SBL1 and SBL2 are substantially the same, and thus their detailed descriptions will be omitted.

[0261] The transmission bridge pattern TBP may include a first transmission bridge pattern TBP1 and a second transmission bridge pattern TBP2 .

[0262] The first transmission bridge pattern TBP1 may include a first transmission body pattern TB-1, a first transmission connection pattern TC-1, and a second transmission connection pattern TC-2. The second transmission bridge pattern TBP2 may include a second transmission body pattern TB-2, a third transmission connection pattern TC-3, and a fourth transmission connection pattern TC-4.

[0263] The first transmission connection pattern TC-1, the second transmission connection pattern TC-2, the third transmission connection pattern TC-3, and the fourth transmission connection pattern TC-4 may be disposed on a layer different from the layer on which the first transmission body pattern TB-1 is disposed. In the present exemplary embodiment, the first sensing bridge pattern SBP1, the second sensing bridge pattern SBP2, the first transmission body pattern TB-1, and the second transmission body pattern TB-2 may be disposed on the same layer.

[0264] Each of the first transmission bus pattern TB-1 and the second transmission bus pattern TB-2 has the same Fig. 9 Each of the described first and second transfer bus patterns TB1 and TB2 has substantially the same shape, and thus, their detailed descriptions will be omitted.

[0265] The first transmission connection pattern TC-1 may have one end connected to the first transmission touch pattern ST1 through a contact hole CH-5 and the other end connected to the first transmission body pattern TB-1 through a contact hole CH-6.

[0266] The second transmission connection pattern TC-2 may have one end connected to the second transmission touch pattern ST2 through the contact hole CH-7 and the other end connected to the first transmission body pattern TB-1 through the contact hole CH-8.

[0267] The first slit SI1 and the second slit SI2 are disposed in the first sensing bridge pattern SBP1, and the third slit SI3 and the fourth slit SI4 are disposed in the second sensing bridge pattern SBP2. Fig. 9 The described first and second sensing bridge patterns SBL1 and SBL2 are substantially the same, and thus, their detailed descriptions will be omitted.

[0268] Fig.12 is a plan view of a portion of an input sensing unit according to an exemplary embodiment of the inventive concept. Fig.12 Another exemplary embodiment according to the inventive concept is shown. Figure 2 of area XX'. The main description refers to Fig.12 The input sensing unit ISU2 described in reference Fig.11 The difference between the input sensing unit ISU1 described will be Fig.11 Parts not described are derived from the description.

[0269] Reference Fig.12 , the input sensing unit ISU2 may include a sensing bridge pattern SBT and a transmission bridge pattern TBT.

[0270] The transmission bridge pattern TBT may include a first transmission bridge pattern TBT1 and a second transmission bridge pattern TBT2. The first transmission bridge pattern TBT1 and the second transmission bridge pattern TBT2 are similar to the reference Fig.11 The described first transmission bridge pattern TBP1 and the second transmission bridge pattern TBP2 are substantially the same, and thus, their detailed descriptions will be omitted.

[0271] The sensing bridge pattern SBT may include a first sensing bridge pattern SBT1 and a second sensing bridge pattern SBT2 .

[0272] The first sensing bridge pattern SBT1 may include a first sensing body pattern SB-1, a first sensing connection pattern SC-1, and a second sensing connection pattern SC-2. The second sensing bridge pattern SBL2 may include a second sensing body pattern SB-2, a third sensing connection pattern SC-3, and a fourth sensing connection pattern SC-4.

[0273] The first sensing connection pattern SC-1, the second sensing connection pattern SC-2, the third sensing connection pattern SC-3, and the fourth sensing connection pattern SC-4 may be disposed on a layer different from the layer on which the first sensing body pattern SB-1 is disposed. In the present embodiment, the first transmission bridge pattern TBT1, the second transmission bridge pattern TBT2, the first sensing body pattern SB-1, and the second sensing body pattern SB-2 may be disposed on the same layer. The first sensing connection pattern SC-1, the second sensing connection pattern SC-2, the third sensing connection pattern SC-3, and the fourth sensing connection pattern SC-4 may be disposed on the same layer as the reference layer. Fig.11 The described first transmission connection pattern TC-1, second transmission connection pattern TC-2, third transmission connection pattern TC-3 and fourth transmission connection pattern TC-4 are disposed on the same layer.

[0274] Each of the first sensing body pattern SB-1 and the second sensing body pattern SB-2 may have a Fig. 9 Each of the described first and second sensing body patterns SB1 and SB2 has substantially the same shape, and thus, their detailed descriptions will be omitted.

[0275] The first sensing connection pattern SC-1 may have one end connected to the first sensing touch pattern RT1 through a contact hole CH-9 and the other end connected to the first sensing body pattern SB-1 through a contact hole CH-10.

[0276] The second sensing connection pattern SC-2 may have one end connected to the first sensing touch pattern RT1 through the contact hole CH-11 and the other end connected to the first sensing body pattern SB-1 through the contact hole CH-12.

[0277] The slit may be disposed in a portion of a region where the first transmission bridge pattern TBT1 intersects the first and second sensing bridge patterns SBT1 and SBT2. In addition, the slit may be disposed in a portion of a region where the second transmission bridge pattern TBT2 intersects the first and second sensing bridge patterns SBT1 and SBT2.

[0278] An example is shown in which the fifth and sixth slits SI5 and SI6 are disposed in the first transmission bridge pattern TBT1 , and the seventh and eighth slits SI7 and SI8 are disposed in the second transmission bridge pattern TBT2 .

[0279] The fifth slit SI5 can be set in the intersection between the first sensing connection pattern SC-1 and the first transmission bridge pattern TBT1, the sixth slit SI6 can be set in the intersection between the third sensing connection pattern SC-3 and the first transmission bridge pattern TBT1, the seventh slit SI7 can be set in the intersection between the second sensing connection pattern SC-2 and the second transmission bridge pattern TBT2, and the eighth slit SI8 can be set in the intersection between the fourth sensing connection pattern SC-4 and the fourth transmission bridge pattern TBT2.

[0280] The overlapped areas between the first and second transmission bridge patterns TBT1 and TBT2 and the first and second sensing bridge patterns SBT1 and SBT2 can be minimized by the first to eighth slits SI1 to SI8. Therefore, the first and second sensing bridge patterns SBT1 and SBT2 can be prevented from being short-circuited with each other to minimize signal interference.

[0281] Fig.13 is a plan view of a portion of an input sensing unit according to another exemplary embodiment of the inventive concept. Fig.13 Another exemplary embodiment according to the inventive concept is shown. Figure 2 of area XX'.

[0282] The main description refers to Fig.13 The input sensing unit ISU3 described in reference Fig.12 The difference between the input sensing unit ISU2 described will be Fig.12 Parts not described are derived from the description.

[0283] The input sensing unit ISU3 may include a sensing bridge pattern SBT- 1 and a transmission bridge pattern TBT- 1 .

[0284] The sensing bridge pattern SBT-1 may include a sensing body pattern SB, a first sensing connection pattern SC-11, and a second sensing connection pattern SC-21.

[0285] The sensing body pattern SB may have Fig.12 The first sensing body pattern SB-1 and the second sensing body pattern SB-2 may be connected to each other. The sensing body pattern SB may surround the module hole MH and have a ring shape.

[0286] The first sensing connection pattern SC-11 may have Fig.12 The first sensing connection pattern SC-1 and the third sensing connection pattern SC-3 have substantially the same shape.

[0287] The second sensing connection pattern SC-21 may have Fig.12 The second sensing connection patterns SC-2 and the fourth sensing connection patterns SC-4 have substantially the same shape.

[0288] The transmission bridge pattern TBP1-1 may include a transmission body pattern TB, a first transmission connection pattern TC-11, and a second transmission connection pattern TC-21.

[0289] The transmission body pattern TB may have Fig.12 The first transmission body pattern TB-1 and the second transmission body pattern TB-2 are connected to each other. The transmission body pattern TB may surround the module hole MH and have a ring shape. Although the sensing body pattern SB surrounds the transmission body pattern TB in the present exemplary embodiment, the inventive concept is not limited thereto. According to another exemplary embodiment, the transmission body pattern TB may surround the sensing body pattern SB.

[0290] The first transmission connection pattern TC-11 may have Fig.11 The first transmission connection pattern TC-1 and the third transmission connection pattern TC-3 have substantially the same shape.

[0291] The second transmission connection pattern TC-21 may have Fig.11The second transmission connection pattern TC-2 and the fourth transmission connection pattern TC-4 have substantially the same shape.

[0292] Fig.14 is a plan view of a portion of an input sensing unit according to an exemplary embodiment of the inventive concept. Fig.14 Another exemplary embodiment according to the inventive concept is shown. Figure 2 of area XX'.

[0293] The main description refers to Fig.14 The input sensing unit ISU4 described in reference Fig.12 The difference between the input sensing unit ISU2 described will be Fig.12 Parts not described are derived from the description.

[0294] Reference Fig.14 , the sensing bridge pattern of the input sensing unit ISU4 may include a first sensing bridge pattern SBT11 and a second sensing bridge pattern SBT22 , and the transmission bridge pattern of the input sensing unit ISU4 may include a first transmission bridge pattern TBT11 and a second transmission bridge pattern TBT22 .

[0295] The first sensing bridge pattern SBT11 may include a first sensing body pattern SB-1, a first auxiliary sensing pattern SB-11, a first sensing connection pattern SC-12, and a second sensing connection pattern SC-22.

[0296] The first auxiliary sensing pattern SB-11 may be disposed between the first sensing body pattern SB-1 and the module hole MH. The first transmission body pattern TB-1 may be disposed in a portion of a region between the first sensing body pattern SB-1 and the first auxiliary sensing pattern SB-11.

[0297] The first sensing connection pattern SC-12 connects the first sensing touch pattern RT1, the first sensing body pattern SB-1, and the first auxiliary sensing pattern SB-11 to each other.

[0298] The second sensing connection pattern SC-22 connects the second sensing touch pattern RT2, the first sensing body pattern SB-1, and the first auxiliary sensing pattern SB-11 to each other.

[0299] The second sensing bridge pattern SBT22 has a structure symmetrical to that of the first sensing bridge pattern SBT11 , and thus, a detailed description thereof will be omitted.

[0300] The first transmission bridge pattern TBT11 may include a first transmission body pattern TB-1, a first auxiliary transmission pattern TB-11, a first transmission connection pattern TC-12, and a second transmission connection pattern TC-22.

[0301] The first auxiliary transmission pattern TB-11 may be disposed between the first transmission body pattern TB-1 and the module hole MH. The first auxiliary sensing pattern SB-11 may be disposed in a portion of a region between the first transmission body pattern TB-1 and the first auxiliary transmission pattern TB-11.

[0302] The first transmission connection pattern TC-12 connects the first transmission touch pattern ST1, the first transmission body pattern TB-1, and the first auxiliary transmission pattern TB-11 to each other.

[0303] The second transmission connection pattern TC-22 connects the second transmission touch pattern ST2, the first transmission body pattern TB-1, and the first auxiliary transmission pattern TB-11 to each other.

[0304] The second transmission bridge pattern TBT22 has a structure symmetrical to that of the first transmission bridge pattern TBT11 , and thus, a detailed description thereof will be omitted.

[0305] According to an exemplary embodiment of the inventive concept, when Fig.12 When compared with the capacitor formed by the sensing bridge pattern and the transmission bridge pattern, the capacitance of the capacitor can be increased by the first auxiliary transmission pattern TB-11 and the first auxiliary sensing pattern SB-11.

[0306] When with Fig.12 The input sensing unit ISU2 is compared with the reference Fig.14 The display device of the described input sensing unit ISU4 may further include first and second auxiliary sensing patterns to further compensate for insufficient sensitivity of the sensing touch pattern RT and the transmitting touch pattern ST.

[0307] In a display device according to an exemplary embodiment of the inventive concept, pixels or touch sensing components spaced apart from each other about a module hole can be connected to each other through a signal line or a bridge pattern to maintain an organic / electrical connection between pixels or touch sensing components spaced apart from each other about a module hole, thereby facilitating electrical control of the pixels. Therefore, even if the module hole is defined in an area surrounded by an active area, the active area of ​​the display device can be stably driven.

[0308] Furthermore, the sensing bridge pattern and the transmission bridge pattern may form a capacitor in a wiring region to compensate for insufficient touch sensitivity of the sensing touch pattern and the transmission touch pattern.

[0309] Furthermore, at least a portion of the sensing bridge pattern and the transmission bridge pattern may include a slit to minimize an overlapped area between the sensing bridge pattern and the transmission bridge pattern, thereby preventing a short circuit from occurring.

[0310] Although certain exemplary embodiments have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but is limited to the broader scope of the appended claims and various obvious modifications and equivalent arrangements as are apparent to those of ordinary skill in the art.

Claims

1. A display device, comprising: A base substrate, comprising a front surface and a rear surface facing each other, and an active area, a peripheral area, and a wiring area defined on a plane on the base substrate, a module hole passing through the front surface and the rear surface is defined in the base substrate, the peripheral area is adjacent to the active area, and the wiring area surrounds the module hole; A circuit layer, disposed on the base substrate and including a driving element including a thin film transistor; A display element layer, disposed on the circuit layer and including a light emitting element disposed in the effective area; An encapsulation layer, disposed on the display element layer to seal the light emitting element; as well as An input sensing unit is arranged on the packaging layer, in: The input sensing unit includes: first touch sensing components arranged in a first direction; a first connecting component configured to connect adjacent first touch sensing components to each other; second touch sensing components arranged in a second direction intersecting the first direction; a second connecting component configured to connect adjacent second touch sensing components to each other and disposed on a layer different from a layer on which the first connecting component is disposed; a first bridge pattern connected to a pair of second touch sensing components adjacent to each other in the second direction and with the module hole located therebetween among the second touch sensing components and disposed in the wiring area; a second bridge pattern connected to a pair of first touch sensing components adjacent to each other in the first direction and with the module hole located therebetween among the first touch sensing components and disposed in the wiring area; and a first slit disposed in at least one of the first bridge pattern and the second bridge pattern, wherein the first slit is disposed in an intersection between the first bridge pattern and the second bridge pattern, and the first bridge pattern and the second bridge pattern overlap at the intersection.

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