Rapid simulation method and device for three-dimensional ground temperature field

Abstract

The invention relates to the technical field of computers, in particular to a rapid simulation method and device for a three-dimensional ground temperature field. The method comprises the following steps: firstly, obtaining geometric parameters and material information of a ground scene, then determining a geometric model of the ground scene according to the geometric parameters, and endowing the geometric model with the material information, thereby obtaining a three-dimensional model of the ground scene. Then, material information, shadow information and a normal vector of each vertex are obtained, and materials, shadows and normal vectors of all pixel points in the surface element are obtained through GPU automatic interpolation; and searching in a preset temperature table according to the information so as to obtain temperature information of all vertexes and pixel points in the three-dimensional model. And endowing the temperature information of each vertex and the temperature information of all pixel points in each surface element into the three-dimensional model to obtain a three-dimensional ground temperature field. Therefore, the technical problem of how to improve the simulation speed of the three-dimensional ground temperature field can be solved.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and in particular to a method and device for quickly simulating a three-dimensional ground temperature field. Background Art

[0002] The ground temperature is affected by the near-ground atmospheric temperature, humidity, wind speed, wind direction, and shortwave direct solar radiation heat flux, shortwave sky scattered radiation heat flux, and longwave atmospheric emission radiation heat flux. In addition, for temperature simulation of complex three-dimensional ground scenes, different areas of the same scene will have different temperatures due to changes in the direction, height, and material of the surface. This brings two difficulties to the simulation: on the one hand, the solar and atmospheric radiation heat flux received by surface elements with different inclinations will vary significantly, leading to different temperatures; on the other hand, for ground scenes with a very large number of surface elements (generally millions to hundreds of millions), the method of calculating the heat flux and then calculating the temperature for each surface is time-consuming and unacceptable.

[0003] Based on this, there is an urgent need for a rapid simulation method and device for a three-dimensional ground temperature field to solve the technical problem of how to improve the simulation speed of the three-dimensional ground temperature field. Summary of the invention

[0004] In order to solve the technical problem of how to improve the simulation speed of a three-dimensional ground temperature field, an embodiment of the present invention provides a method and device for quickly simulating a three-dimensional ground temperature field.

[0005] In a first aspect, an embodiment of the present invention provides a method for rapid simulation of a three-dimensional ground temperature field, comprising:

[0006] Get the geometric parameters and material information of the ground scene;

[0007] Based on the geometric parameters, a geometric model of the ground scene is determined, and the material information is assigned to the geometric model to obtain a three-dimensional model of the ground scene; wherein the three-dimensional model includes a plurality of vertices, each three vertices constitute a face element, and each face element includes a plurality of pixel points;

[0008] Get the material information, shadow information and normal vector of each vertex, and the GPU automatically interpolates to get the material, shadow and normal vector of all pixels in the face;

[0009] Searching in a preset temperature table according to the material information, the shadow information and the normal vector to obtain temperature information of all vertices and pixels;

[0010] The temperature information of each vertex and the temperature information of all pixels in each face element are assigned to the three-dimensional model to obtain a three-dimensional ground temperature field.

[0011] In a second aspect, an embodiment of the present invention further provides a rapid simulation measurement device for a three-dimensional ground temperature field, comprising:

[0012] The first acquisition module is used to acquire geometric parameters and material information of the ground scene;

[0013] A first data processing module is used to determine a geometric model of a ground scene based on the geometric parameters, and assign the material information to the geometric model to obtain a three-dimensional model of the ground scene; wherein the three-dimensional model includes a plurality of vertices, each three vertices constitute a face element, and each face element includes a plurality of pixel points;

[0014] The second acquisition module is used to obtain the material information, shadow information and normal vector of each vertex. At the same time, the GPU automatically interpolates and obtains the material, shadow and normal vector of all pixels in the face element.

[0015] A second data processing module is used to search in a preset temperature table according to the material information, the shadow information and the normal vector to obtain temperature information of all vertices and pixels;

[0016] The third data processing module is used to assign the temperature information of each vertex and the temperature information of all pixels in each face element to the three-dimensional model to obtain a three-dimensional ground temperature field.

[0017] In a third aspect, an embodiment of the present invention further provides an electronic device, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the method described in any embodiment of the present invention is implemented.

[0018] In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium having a computer program stored thereon, which, when executed in a computer, causes the computer to execute the method described in any embodiment of the present invention.

[0019] The embodiment of the present invention provides a method and device for rapid simulation of a three-dimensional ground temperature field. The present invention first obtains the geometric parameters and material information of the ground scene, then determines the geometric model of the ground scene based on the geometric parameters, and assigns the material information to the geometric model, thereby obtaining a three-dimensional model of the ground scene. Among them, this three-dimensional model includes multiple vertices, and every three vertices constitute a face element. Subsequently, the material information, shadow information and normal vector of each vertex are obtained, and at the same time, the GPU automatically interpolates to obtain the material, shadow and normal vector of all pixels in the face element, and then searches in a preset temperature table based on this information to obtain the temperature information of all vertices and pixels. The temperature information of each vertex and the temperature information of all pixels in each face element are assigned to the three-dimensional model to obtain a three-dimensional ground temperature field. Through this configuration, the present invention can effectively improve the simulation speed of the three-dimensional ground temperature field. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 This is a flow chart of a rapid simulation method of a three-dimensional ground temperature field provided by an embodiment of the present invention;

[0022] Figure 2 is a hardware architecture diagram of an electronic device provided by an embodiment of the present invention;

[0023] Figure 3 It is a structural diagram of a rapid simulation device for three-dimensional ground temperature field provided by an embodiment of the present invention;

[0024] Figure 4 is a schematic diagram of a relative relationship between the ground and the sun provided by an embodiment of the present invention;

[0025] Figure 5 is a flowchart of a three-dimensional model assignment provided by an embodiment of the present invention;

[0026] Figure 6 It is a scene temperature simulation calculation diagram provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0028] Please refer to Figure 1 The embodiment of the present invention provides a method for rapid simulation of a three-dimensional ground temperature field, the method comprising:

[0029] Step 100: Obtain geometric parameters and material information of the ground scene;

[0030] Step 102: Based on the geometric parameters, determine the geometric model of the ground scene, and assign material information to the geometric model to obtain a three-dimensional model of the ground scene; wherein the three-dimensional model includes a plurality of vertices, each three vertices constitute a face element, and each face element includes a plurality of pixel points;

[0031] Step 104: Obtain material information, shadow information, and normal vector of each vertex, and the GPU automatically interpolates to obtain the material, shadow, and normal vector of all pixels in the face;

[0032] Step 106: Search in a preset temperature table according to the material information, shadow information and normal vector to obtain the temperature information of all vertices and pixels;

[0033] Step 108: assign the temperature information of each vertex and the temperature information of all pixels in each facet to the three-dimensional model to obtain a three-dimensional ground temperature field.

[0034] In an embodiment of the present invention, the present invention first obtains the geometric parameters and material information of the ground scene, then determines the geometric model of the ground scene based on the geometric parameters, and assigns the material information to the geometric model, thereby obtaining a three-dimensional model of the ground scene. Among them, this three-dimensional model includes multiple vertices, and every three vertices constitute a face element. Then, the material information, shadow information and normal vector of each vertex are obtained, and at the same time, the GPU automatically interpolates to obtain the material, shadow and normal vector of all pixels in the face element, and then searches in a preset temperature table based on this information to obtain the temperature information of all vertices and pixels. The temperature information of all vertices and the temperature information of all pixels in each face element are assigned to the three-dimensional model to obtain a three-dimensional ground temperature field. Compared with the prior art, the present invention can effectively improve the simulation speed of the three-dimensional ground temperature field.

[0035] Described below Figure 1 How the various steps are performed.

[0036] For step 100:

[0037] In one embodiment of the present invention, in terms of obtaining geometric parameters. For the shape of the ground, it is necessary to accurately measure its linear dimensions such as length, width, and height, and these data can be obtained by a high-precision laser rangefinder. For example, when measuring an irregularly shaped ground area, the laser rangefinder can perform multi-point measurements along a preset path, and then restore the actual contour shape of the ground through a data processing algorithm. At the same time, for the geometric features such as the slope and curvature of the ground, a professional topographic measuring instrument is used, such as a total station, which can measure the coordinates of ground points from different angles, and then calculate the slope and curvature values. Moreover, for various terrain undulations on the ground, such as hills, gullies, etc., it is necessary to record their position, size, shape and other parameters in detail, and it is necessary to combine aerial photogrammetry and ground control point measurement methods. Aerial photogrammetry can obtain large-area terrain images, and ground control point measurement is used for calibration and improvement of measurement accuracy. In terms of material information acquisition, it is necessary to analyze what kind of material the ground is composed of. If it is soil, it is necessary to determine the type of soil, whether it is clay, sand or loam, which can be done through soil sampling and analysis. Collect soil samples from different locations and send them to the laboratory for physical and chemical property analysis, including parameters such as particle size distribution, density, and water content. For other materials on the ground, such as rocks and vegetation, their distribution should also be recorded in detail. For rocks, their types should be analyzed, such as granite and limestone. Different types of rocks have different heat capacity and thermal conductivity. For vegetation, the type, coverage, and height of vegetation should be determined.

[0038] Regarding step 102:

[0039] In one embodiment of the present invention, first, the ground is abstracted into a digital spatial structure based on the measured linear dimensions, slope, curvature, and terrain undulations of the ground. For example, if the ground is a relatively flat area with a certain slope, it can be approximately represented by dividing it into a number of small plane units, and the shapes and positions of these small plane units are determined by geometric parameters. After determining the basic framework of the geometric model, the material information previously obtained is then assigned to the geometric model. For the distribution of different materials on the ground, corresponding settings are made in the model. If it is a soil area, according to the analysis results of the soil type, the properties of the type of soil are assigned to the corresponding part in the model. If there is an area covered with rocks or vegetation, the location and range of these materials are accurately marked in the model based on the analysis data, and their unique material properties are assigned. Through such operations, a three-dimensional model of the ground scene is obtained.

[0040] Regarding step 104:

[0041] like Figure 4As shown, in one embodiment of the present invention, after the three-dimensional model of the ground scene is constructed, the material information is obtained. Since the material information has been assigned to the entire geometric model before, the material information corresponding to each vertex can be obtained through the data association inside the model. For example, if a vertex is in an area previously marked as soil material, then the vertex inherits the relevant properties of the soil material, such as the type of soil (clay, sand, etc.) and the corresponding parameters such as thermal conductivity characteristics. For vertices located in rock or vegetation covered areas, the corresponding rock type, vegetation type and other specific material information are accurately extracted based on the existing material division settings in the model, which is helpful for the subsequent analysis of the differences in temperature changes of vertices of different materials. Position information obtains the position information of the vertex, which can be read directly from the coordinate system of the three-dimensional model. Each vertex in the three-dimensional model has its unique coordinate value in a specific spatial coordinate system, usually represented by a Cartesian coordinate system (X, Y, Z axis). Through the query function of the model, the specific position of each vertex in this coordinate system can be accurately obtained. For example, the coordinates of a vertex are (X1, Y1, Z1), which clearly defines the specific position of the vertex in the entire ground scene space, which plays a fundamental role in determining its spatial relationship with the surrounding environment and calculating the influencing factors such as lighting and shadows. Obtaining shadow information Obtaining the shadow information of the vertex is relatively complicated, and it is necessary to consider multiple factors such as the source direction of the light, the occlusion of other objects in the scene, and the lighting environment in which the model is located. It is generally implemented based on the ray tracing algorithm under simulated lighting conditions. First, set the incident angle and intensity of the light, just like the sun's rays in the real world have different irradiation angles and intensities at different times. Then, through the ray tracing algorithm, trace the propagation path of the light in the three-dimensional model from the starting point of the light along the set direction. When the light encounters other objects (such as raised terrain and tall vegetation in the model) to cause occlusion, the shadow information corresponding to the vertex in the occluded area is determined according to the occlusion situation. For example, if a vertex is located on the shady side of a tall building, after ray tracing calculations, it can be determined that the vertex is in the shadow, and the corresponding shadow degree, range and other detailed information can be marked, because the shadow situation will affect the heat received by the vertex, thereby affecting its temperature performance. Normal vector acquisition, for the normal vector acquisition of the vertex, it is a vector that characterizes the surface direction of the face element where the vertex is located. In a three-dimensional model, each face element has its own normal vector, and the vertex, as the basic element that constitutes the face element, its normal vector can be obtained by calculating the face element normal vector associated with it. The usual practice is that for a face element composed of three vertices, according to the coordinate positions of the three vertices, the normal vector of the face element is first calculated using mathematical operations such as vector cross multiplication, and then the face element normal vector is reasonably allocated to each vertex according to the connection relationship between the vertex and the face element.For example, for a plane triangle face, after calculating its three edge vectors and performing cross product to obtain the face normal vector, this normal vector is assigned to the three vertices that make up the face according to a certain weight, so that each vertex has its corresponding normal vector. Normal vectors in different directions will cause the vertex to reflect and absorb light differently, thus affecting its temperature state.

[0042] Regarding step 106:

[0043] In one embodiment of the present invention, the preset temperature table is constructed by the following steps:

[0044] Obtaining the position information and time information of the current simulated ground scene; wherein the position information includes the position information of each vertex of the simulated ground scene;

[0045] The position information and time information are input into a preset environmental radiation heat flux model to obtain the radiation heat flux; wherein the radiation heat flux includes the solar direct radiation heat flux in the shortwave spectrum, the solar scattered radiation heat flux in the shortwave spectrum, and the atmospheric emission radiation heat flux in the longwave spectrum;

[0046] The material information, shadow information and normal vector of each type of vertex are obtained, and the radiation heat flux, material information, shadow information and normal vector of each type of vertex are input into a preset temperature calculation model to obtain the temperature information of each type of vertex and construct a preset temperature table.

[0047] In the embodiment of the present invention, this environmental radiation heat flux model is a complex model established based on a large number of astronomical, meteorological and physical theories. In the model, the calculation of the direct solar radiation heat flux in the short-wave spectrum depends on factors such as the position of the sun (determined by the time and the position of the ground scene), the transparency of the atmosphere and the slope of the ground. For example, when the solar altitude angle is large and the atmospheric transparency is high, the direct solar radiation heat flux received by the ground vertex will be strong. The short-wave spectrum solar scattered radiation heat flux is related to scattering media such as aerosols and clouds in the atmosphere. Particulate matter in the atmosphere will scatter sunlight, so that there is a certain amount of short-wave radiation even in areas without direct sunlight. Time and position information will affect the distribution of scattering media in the atmosphere, and then affect the size of the solar scattered radiation heat flux. The long-wave spectrum atmospheric emission radiation heat flux mainly depends on factors such as the temperature, humidity and composition of the atmosphere. Under different time and position conditions, these parameters of the atmosphere will change. For example, at night or in a high humidity environment, the long-wave radiation heat flux emitted by the atmosphere will increase, and the position of the ground vertex is different, and the received atmospheric emission radiation heat flux will also be different due to the vertical temperature and humidity distribution of the atmosphere. After obtaining the radiation heat flux, the material information, shadow information and normal vector of each vertex need to be obtained to construct the temperature table. The material information determines the absorption, reflection and conduction characteristics of the vertex for radiation heat flux in different spectral bands. For example, different types of soil have different absorption capacities for solar radiation, and the material properties of rocks and vegetation will also cause them to perform differently in the heat exchange process. Shadow information reflects whether the vertex is blocked and the degree of blocking. The radiation heat flux received by the blocked vertex will be reduced, and shadow information is crucial for accurately calculating the heat balance of the vertex. The normal vector affects the incident angle and reflection direction of the radiation heat flux on the vertex surface. Normal vectors in different directions will change the absorption of the radiation heat flux by the vertex. The radiation heat flux, material information, shadow information and normal vector of each vertex are input into the preset temperature calculation model. This temperature calculation model comprehensively considers various heat exchange processes, including radiation absorption, heat conduction and convection. Through complex calculations, the temperature information of each vertex is obtained, and the preset temperature table is constructed based on this.

[0048] In one embodiment of the present invention, before the radiation heat flux, material information, shadow information and normal vector of each type of vertex are input into a preset temperature calculation model, the following steps are included:

[0049] Get the sun's incident direction;

[0050] Based on the normal vector and the incident direction of the sun, determine the angle correction factor;

[0051] When the radiation heat flux is the direct solar radiation heat flux in the shortwave spectrum or the scattered solar radiation heat flux in the shortwave spectrum, the radiation heat flux is multiplied by the angle correction coefficient to obtain the corrected radiation heat flux, and the corrected radiation heat flux is used as the final input of the preset temperature calculation model.

[0052] like Figure 4 As shown, in the embodiment of the present invention, since there are errors in the actual calculation process when directly using the radiation heat flux for calculation, the solar heat flux and the atmospheric heat flux need to be converted into the radiation energy actually received by the surface for different inclination angles during calculation, and the solar heat flux needs to be multiplied by the direction cosine of the angle between the sun's direction and the normal vector.

[0053] In one embodiment of the present invention, before the radiation heat flux, material information, shadow information and normal vector of each type of vertex are input into a preset temperature calculation model, the following steps are included:

[0054] When the radiation heat flux is the atmospheric radiation heat flux emitted in the long-wave spectrum, the radiation heat flux is multiplied by the tilt factor to obtain a corrected radiation heat flux, and the corrected radiation heat flux is used as the final input of the preset temperature calculation model;

[0055] Among them, the corrected radiation heat flux represents the part receiving sky radiation.

[0056] In the embodiment of the present invention, since there are errors in the actual calculation process when directly using the radiation heat flux for calculation, the atmospheric heat flux needs to be converted into the radiation energy actually received by the surface for different inclination angles during calculation, and the atmospheric heat flux needs to be multiplied by the inclination factor. Technical personnel in this field can customize the inclination factor according to actual usage.

[0057] Regarding step 108:

[0058] In one embodiment of the present invention, first, in the three-dimensional modeling software or the special temperature field simulation platform, there will be a specific data interface and assignment function. Through this function, the temperature value of each vertex can be associated with the corresponding vertex in the three-dimensional model. This is like putting a temperature label on each vertex, except that this label is stored in the attribute information of the model in the form of data. In the assignment process, for a large number of vertices in the three-dimensional model, it is necessary to ensure the one-to-one correspondence and accurate assignment of temperature information, starting from the first vertex, accurately assign the corresponding temperature information to the data structure of the vertex in the model. For example, using a loop algorithm, read the temperature data of each vertex in turn, and fill it into the temperature attribute field of the corresponding vertex in the model. When all vertices are assigned temperature information, the entire three-dimensional model is no longer just a spatial structure with geometric shapes and material attributes, but a complete three-dimensional ground temperature field model containing temperature information. This model can intuitively show the temperature distribution of different positions on the ground (i.e., the positions represented by different vertices).

[0059] like Figure 5 As shown, in the embodiment of the present invention, the three-dimensional model file contains the information of the vertices and facets of the triangular mesh. After reading the three-dimensional model, the normal information of the vertex (facet) needs to be read out. According to the sun position vector, the occlusion relationship of each part of the model is calculated, and the vertex (facet) in the shadow in the model is determined. The area in the shadow does not receive direct radiation from the sun, and its temperature will be lower than that under illumination. In the ground three-dimensional model, the material information of each triangular mesh can be assigned in the form of a texture image, and the position of each pixel of the texture image is determined according to its uv coordinate. In fact, different materials will exist at the same time on an inclined plane. Therefore, in the three-dimensional model of the ground, the resolution of the triangular mesh and the texture image is not necessarily the same, and there are also a large number of pixels of different materials in a triangular mesh (as shown in the attached figure). After reading the three-dimensional model, the spatial coordinates (x, y, z) and uv coordinates of the triangular mesh vertex can be read out accordingly, and the material information of the vertex can be determined. Through automatic interpolation by the GPU, the material of all pixels in the triangular mesh can be obtained, and the direction of the pixel (represented by the normal vector) is also the same. If the CPU reads the material, shadow, and normal information for each pixel, it will take a lot of time. The temperature interpolation calculation of this project is performed in the GPU: after calculating the temperature lookup table and loading the 3D model, the shadow and lighting areas are determined by calculating the sun's position. The GPU reads the material, shadow, and normal information of the triangle mesh vertices to obtain the temperature value of each vertex. In the rasterization stage, the vertex data (vertex temperature, texture coordinates, etc.) is interpolated and processed pixel by pixel to render the final temperature image.

[0060] The beneficial effect of the invention is that complex three-dimensional ground models contain millions or even hundreds of millions of vertices and facets, and the materials and tilt angles of each vertex and facet are different. Compared with calculating the temperature pixel by pixel, the method of first calculating the temperature lookup table and then interpolating greatly improves the calculation efficiency. Specifically, the calculation method for rapid simulation of the temperature of a three-dimensional ground scene can generate a surface temperature distribution at the level of tens of kilometers within minutes, supporting the generation of subsequent scene infrared optical characteristics.

[0061] In an embodiment of the present invention, the first step is to set the parameters required for calculating the ground temperature as follows: 8:00 Beijing time on March 1, 2024, temperature 25°C, humidity 0.8, sunny weather, visibility 20km. Calculate the temperature of each material within the range of 0-90 degrees (5° intervals) in pitch angle and 0-360 degrees (5° intervals) in azimuth of the face normal, and organize them into a shadow temperature lookup table and a light temperature lookup table. The second step: After reading in the three-dimensional model, first obtain the vertex normal vectors in each face element of the three-dimensional model, and automatically interpolate the normal vectors of all pixels in the face element by the GPU. Then use shadow judgment and material reading to obtain the vertex shadow judgment results and materials in each face element, and also automatically interpolate the GPU to obtain the shadow and material information of all pixels in the face element. At this point, the normal vectors, shadows, and material information of all pixels in the three-dimensional model are known. The third step: send the normal vectors, shadows, material information of all pixels and two temperature lookup tables to the GPU, and the GPU assigns a temperature value to each pixel according to the normal vector, shadow, and material. You can get Figure 6 , the colors in the image go from light to dark, indicating that the temperature increases successively.

[0062] like Figure 2 , Figure 3 As shown, the embodiment of the present invention provides a rapid simulation measurement device for three-dimensional ground temperature field. The device embodiment can be implemented by software, or by hardware or a combination of software and hardware. From the hardware level, Figure 2 As shown, it is a hardware architecture diagram of an electronic device where a rapid simulation measurement device for a three-dimensional ground temperature field provided by an embodiment of the present invention is located. Figure 2 In addition to the processor, memory, network interface, and non-volatile memory shown, the electronic device in the embodiment may also include other hardware, such as a forwarding chip responsible for processing messages, etc. Taking software implementation as an example, Figure 3 As shown, as a device in a logical sense, the CPU of the electronic device in which it is located reads the corresponding computer program in the non-volatile memory into the internal memory and runs it.

[0063] like Figure 3 As shown, this embodiment provides a rapid simulation measurement device for a three-dimensional ground temperature field, the device comprising:

[0064] The first acquisition module 300 is used to acquire geometric parameters and material information of a ground scene;

[0065] The first data processing module 302 is used to determine a geometric model of the ground scene based on the geometric parameters, and assign the material information to the geometric model to obtain a three-dimensional model of the ground scene; wherein the three-dimensional model includes a plurality of vertices, and every three vertices constitute a face element;

[0066] The second acquisition module 304 is used to obtain material information, shadow information and normal vector of each vertex;

[0067] A second data processing module 306 is used to search in a preset temperature table according to the material information, the shadow information and the normal vector, and the GPU automatically interpolates to obtain the material, shadow and normal vector of all pixels in the face, and searches according to the preset temperature table to obtain the temperature information of all vertices and pixels;

[0068] The third data processing module 308 is used to assign the temperature information of each vertex and the temperature information of all pixels in each facet to the three-dimensional model to obtain a three-dimensional ground temperature field.

[0069] In an embodiment of the present invention, the first acquisition module 300 can be used to execute step 100 in the above method embodiment, the first data processing module 302 can be used to execute step 102 in the above method embodiment, the second acquisition module 304 can be used to execute step 104 in the above method embodiment, the second data processing module 306 can be used to execute step 106 in the above method embodiment, and the third data processing module 308 can be used to execute step 108 in the above method embodiment.

[0070] In one embodiment of the present invention, the preset temperature table is constructed by the following steps:

[0071] Obtain the location information and time information of the current simulated ground scene;

[0072] The position information and the time information are input into a preset environmental radiation heat flux model to obtain the radiation heat flux; wherein the radiation heat flux includes the solar direct radiation heat flux in the shortwave spectrum, the solar scattered radiation heat flux in the shortwave spectrum, and the atmospheric emission radiation heat flux in the longwave spectrum;

[0073] The material information, shadow information and normal vector of each type of vertex are obtained, and the radiation heat flux, material information, shadow information and normal vector of each type of vertex are input into a preset temperature calculation model to obtain the temperature information of each type of vertex and construct the preset temperature table.

[0074] In one embodiment of the present invention, before inputting the radiation heat flux, material information, shadow information and normal vector of each type of vertex into a preset temperature calculation model, the process includes:

[0075] Get the sun's incident direction;

[0076] Determining an angle correction coefficient based on the normal vector and the incident direction of the sun;

[0077] When the radiation heat flux is the direct solar radiation heat flux in the shortwave spectrum or the scattered solar radiation heat flux in the shortwave spectrum, the radiation heat flux is multiplied by the angle correction coefficient to obtain a corrected radiation heat flux, and the corrected radiation heat flux is used as the final input of the preset temperature calculation model.

[0078] In one embodiment of the present invention, before inputting the radiation heat flux, material information, shadow information and normal vector of each type of vertex into a preset temperature calculation model, the process includes:

[0079] When the radiation heat flux is the radiation heat flux emitted by the atmosphere in the long-wave spectrum, the radiation heat flux is multiplied by the tilt factor to obtain a corrected radiation heat flux, and the corrected radiation heat flux is used as the final input of the preset temperature calculation model;

[0080] The corrected radiation heat flux represents part of the received sky radiation.

[0081] It is to be understood that the structure illustrated in the embodiment of the present invention does not constitute a specific limitation on a rapid simulation measurement device for a three-dimensional ground temperature field. In other embodiments of the present invention, a rapid simulation measurement device for a three-dimensional ground temperature field may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently. The components shown in the figure may be implemented in hardware, software, or a combination of software and hardware.

[0082] The information interaction, execution process and other contents between the modules in the above-mentioned device are based on the same concept as the embodiment of the method of the present invention. For the specific contents, please refer to the description in the embodiment of the method of the present invention, and no further description is given here.

[0083] An embodiment of the present invention further provides an electronic device, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, a rapid simulation method of a three-dimensional ground temperature field in any embodiment of the present invention is implemented.

[0084] An embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the processor executes a method for rapid simulation of a three-dimensional ground temperature field in any embodiment of the present invention.

[0085] Specifically, a system or device equipped with a storage medium can be provided, on which software program codes that implement the functions of any of the above-mentioned embodiments are stored, and a computer (or CPU or MPU) of the system or device can be enabled to read and execute the program codes stored in the storage medium.

[0086] In this case, the program code itself read from the storage medium can realize the function of any one of the above-mentioned embodiments, and thus the program code and the storage medium storing the program code constitute a part of the present invention.

[0087] The storage medium embodiments for providing the program code include a floppy disk, a hard disk, a magneto-optical disk, an optical disk (such as CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD+RW), a magnetic tape, a non-volatile memory card, and a ROM. Alternatively, the program code can be downloaded from a server computer by a communication network.

[0088] In addition, it should be clear that the functions of any of the above embodiments can be implemented not only by executing the program code read by the computer, but also by enabling an operating system operating on the computer to complete part or all of the actual operations based on instructions from the program code.

[0089] In addition, it can be understood that the program code read from the storage medium is written to a memory provided in an expansion board inserted into the computer or to a memory provided in an expansion module connected to the computer, and then based on the instructions of the program code, a CPU installed on the expansion board or expansion module is enabled to perform part or all of the actual operations, thereby realizing the functions of any of the above-mentioned embodiments.

[0090] It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0091] A person of ordinary skill in the art can understand that all or part of the steps of implementing the above method embodiments can be completed by hardware related to program instructions, and the aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it executes the steps of the above method embodiments; and the aforementioned storage medium includes: ROM, RAM, magnetic disk or optical disk, etc., various media that can store program codes.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A rapid simulation method for three-dimensional ground temperature field, characterized in that: include: Get the geometric parameters and material information of the ground scene; Based on the geometric parameters, a geometric model of the ground scene is determined, and the material information is assigned to the geometric model to obtain a three-dimensional model of the ground scene; wherein the three-dimensional model includes a plurality of vertices, each three vertices constitute a face element, and each face element includes a plurality of pixel points; Get the material information, shadow information and normal vector of each vertex, and the GPU automatically interpolates to get the material, shadow and normal vector of all pixels in the face; Searching in a preset temperature table according to the material information, the shadow information and the normal vector to obtain temperature information of all vertices and pixels; The temperature information of each vertex and the temperature information of all pixels in each face element are assigned to the three-dimensional model to obtain a three-dimensional ground temperature field.

2. The method according to claim 1, characterized in that The preset temperature table is constructed by the following steps: Obtain the location information and time information of the current simulated ground scene; The position information and the time information are input into a preset environmental radiation heat flux model to obtain the radiation heat flux; wherein the radiation heat flux includes the solar direct radiation heat flux in the shortwave spectrum, the solar scattered radiation heat flux in the shortwave spectrum, and the atmospheric emission radiation heat flux in the longwave spectrum; The material information, shadow information and normal vector of each type of vertex are obtained, and the radiation heat flux, material information, shadow information and normal vector of each type of vertex are input into a preset temperature calculation model to obtain the temperature information of each type of vertex and construct the preset temperature table.

3. The method according to claim 2, characterized in that Before inputting the radiation heat flux, material information, shadow information and normal vector of each type of vertex into a preset temperature calculation model, the method includes: Get the sun's incident direction; Determining an angle correction coefficient based on the normal vector and the incident direction of the sun; When the radiation heat flux is the direct solar radiation heat flux in the shortwave spectrum or the scattered solar radiation heat flux in the shortwave spectrum, the radiation heat flux is multiplied by the angle correction coefficient to obtain a corrected radiation heat flux, and the corrected radiation heat flux is used as the final input of the preset temperature calculation model.

4. The method according to claim 2, characterized in that: Before inputting the radiation heat flux, material information, shadow information and normal vector of each type of vertex into a preset temperature calculation model, the method includes: When the radiation heat flux is the radiation heat flux emitted by the atmosphere in the long-wave spectrum, the radiation heat flux is multiplied by the tilt factor to obtain a corrected radiation heat flux, and the corrected radiation heat flux is used as the final input of the preset temperature calculation model; The corrected radiation heat flux represents part of the received sky radiation.

5. A rapid simulation measurement device for three-dimensional ground temperature field, characterized in that: include: The first acquisition module is used to acquire geometric parameters and material information of the ground scene; A first data processing module is used to determine a geometric model of a ground scene based on the geometric parameters, and assign the material information to the geometric model to obtain a three-dimensional model of the ground scene; wherein the three-dimensional model includes a plurality of vertices, each three vertices constitute a face element, and each face element includes a plurality of pixel points; The second acquisition module is used to obtain the material information, shadow information and normal vector of each vertex, and the GPU automatically interpolates to obtain the material, shadow and normal vector of all pixels in the face; A second data processing module is used to search in a preset temperature table according to the material information, the shadow information and the normal vector to obtain temperature information of all vertices and pixels; The third data processing module is used to assign the temperature information of each vertex and the temperature information of all pixels in each face element to the three-dimensional model to obtain a three-dimensional ground temperature field.

6. The device according to claim 5, characterized in that The preset temperature table is constructed by the following steps: Obtain the location information and time information of the current simulated ground scene; The position information and the time information are input into a preset environmental radiation heat flux model to obtain the radiation heat flux; wherein the radiation heat flux includes the solar direct radiation heat flux in the shortwave spectrum, the solar scattered radiation heat flux in the shortwave spectrum, and the atmospheric emission radiation heat flux in the longwave spectrum; The material information, shadow information and normal vector of each type of vertex are obtained, and the radiation heat flux, material information, shadow information and normal vector of each type of vertex are input into a preset temperature calculation model to obtain the temperature information of each type of vertex and construct the preset temperature table.

7. The device according to claim 6, characterized in that Before inputting the radiation heat flux, material information, shadow information and normal vector of each type of vertex into a preset temperature calculation model, the method includes: Get the sun's incident direction; Determining an angle correction coefficient based on the normal vector and the incident direction of the sun; When the radiation heat flux is the direct solar radiation heat flux in the shortwave spectrum or the scattered solar radiation heat flux in the shortwave spectrum, the radiation heat flux is multiplied by the angle correction coefficient to obtain a corrected radiation heat flux, and the corrected radiation heat flux is used as the final input of the preset temperature calculation model.

8. The device according to claim 6, characterized in that Before inputting the radiation heat flux, material information, shadow information and normal vector of each type of vertex into a preset temperature calculation model, the method includes: When the radiation heat flux is the radiation heat flux emitted by the atmosphere in the long-wave spectrum, the radiation heat flux is multiplied by the tilt factor to obtain a corrected radiation heat flux, and the corrected radiation heat flux is used as the final input of the preset temperature calculation model; The corrected radiation heat flux represents part of the received sky radiation.

9. An electronic device, characterized in that: The method comprises a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the method according to any one of claims 1 to 4 is implemented.

10. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and when the computer program is executed in a computer, the computer is caused to execute the method according to any one of claims 1 to 4.

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