Lamp panel and display device

Abstract

According to the lamp panel and the display device, the lamp panel comprises a glass substrate, a plurality of light-emitting elements and a conductive circuit, the glass substrate is provided with an upper surface and a lower surface which are opposite, a plurality of through holes penetrating from the upper surface to the lower surface are formed in the glass substrate, and the through holes are filled with conductive materials; the light-emitting elements are arranged on the upper surface of the glass substrate and correspond to the through holes. The conductive circuit is arranged on the lower surface, opposite to the upper surface, of the glass substrate, and the conductive circuit is electrically connected with each light-emitting element through the conductive material in the through hole. A conductive circuit and a light-emitting element are arranged on different surfaces of a glass substrate, so that after the light-emitting element is bound with the conductive circuit, if the light-emitting element has defects, rework (rework or repair) of the light-emitting element does not affect the conductive circuit, for example, the conductive circuit on the back side is not damaged; or the conductive circuit does not influence the rework efficiency of the light-emitting element, so that the production efficiency of the lamp panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a light board and a display device. Background Art

[0002] Display devices include LED (Light Emitting Diode) display devices, Micro-LED (Micro-Light Emitting Diode) display devices, OLED (Organic Light Emitting Diode) display devices, and LCD (Liquid Crystal Display) display devices, etc. The above-mentioned display devices generally include a light board, which can be used as a light-emitting backboard or display substrate of the display device.

[0003] In the prior art, a light board generally includes a glass substrate, a conductive circuit arranged on the glass substrate, and a light-emitting element (such as an LED) bound to the conductive circuit. However, the production efficiency of the light board in the prior art is low. How to improve the production efficiency of the light board is an urgent problem to be solved in this industry. Summary of the invention

[0004] In order to solve the above problems, the lamp board and display device provided in the present application can improve the problem of low production efficiency of lamp boards in the prior art.

[0005] In order to solve the above problems, the first technical solution provided by the present application is: to provide a light board, comprising:

[0006] A glass substrate, wherein the glass substrate has an upper surface and a lower surface opposite to each other, and a plurality of through holes extending from the upper surface to the lower surface are formed on the glass substrate, wherein the through holes are filled with a conductive material;

[0007] A plurality of light emitting elements are arranged on the upper surface of the glass substrate and are arranged corresponding to the through holes;

[0008] A conductive circuit is arranged on the lower surface of the glass substrate opposite to the upper surface, and the conductive circuit is electrically connected to each of the light-emitting elements through the conductive material in the through hole.

[0009] In some embodiments, the upper surface of the glass substrate is only provided with a plurality of the light-emitting elements;

[0010] The conductive circuit includes a driving wiring and a light-emitting wiring.

[0011] In some embodiments, the glass substrate includes a plurality of residual glass strips, each of the residual glass strips extends along a first direction, and the plurality of residual glass strips are spliced ​​together along a second direction.

[0012] In some embodiments, the plurality of light-emitting elements include a plurality of rows of light-emitting elements arranged along the first direction, and each row of light-emitting elements includes a plurality of light-emitting elements;

[0013] The conductive circuit comprises a plurality of rows of conductive circuits extending along the first direction;

[0014] A row of the light-emitting elements and a row of the conductive lines are arranged on each of the residual glass strips; a row of the light-emitting elements and a row of the conductive lines on the same residual glass strip are electrically connected via the conductive material in the through holes.

[0015] In some embodiments, the plurality of light-emitting elements include a plurality of rows of light-emitting elements arranged along the first direction, and each row of light-emitting elements includes a plurality of light-emitting elements;

[0016] The conductive circuit comprises a plurality of rows of conductive circuits extending along the first direction;

[0017] A plurality of rows of light-emitting elements and a row of conductive lines are arranged on each of the residual glass strips; the plurality of rows of light-emitting elements and a row of conductive lines on the same residual glass strip are electrically connected via the conductive material in the through holes.

[0018] In some embodiments, the plurality of light-emitting elements on each of the residual glass strips are divided into a plurality of light-emitting element groups, and each of the light-emitting element groups includes at least one light-emitting element;

[0019] Each row of the conductive circuits includes a plurality of sub-conductive circuits, and a group of the light-emitting element groups on the same residual glass is electrically connected to one of the sub-conductive circuits through the conductive material in the through hole.

[0020] In some embodiments, each of the light-emitting elements has a first pin and a second pin, the first pin and the second pin are respectively arranged corresponding to a through hole, and the conductive circuit is electrically connected to the first pin and the second pin of each of the light-emitting elements through the conductive material in the through hole.

[0021] In some embodiments, a pad structure is disposed at one end of each through hole close to the light emitting element, the pad structure is electrically connected to the conductive material in the through hole, and a tin layer is coated on the pad structure;

[0022] The pins of the light emitting element are electrically connected to the conductive material in the through hole through a pad structure.

[0023] In some embodiments, each of the through holes includes a first hole segment close to the upper surface, a second hole segment close to the lower surface, and a third hole segment located between the first hole segment and the second hole segment;

[0024] Wherein, in a direction away from the third hole segment, the inner diameter of the first hole segment and the inner diameter of the second hole segment both gradually increase.

[0025] In order to solve the above problems, the second technical solution provided by the present application is: to provide a light board, comprising:

[0026] A glass substrate, the glass substrate comprising a first substrate and a second substrate stacked together, the first substrate having an upper surface and a lower surface opposite to each other, and the first substrate is provided with a plurality of through holes extending from the upper surface to the lower surface, wherein the through holes are filled with a conductive material;

[0027] A plurality of light emitting elements are arranged on a surface of the first substrate facing away from the second substrate and are arranged corresponding to the through holes;

[0028] A conductive circuit is arranged on a surface of the first substrate close to the second substrate and / or on a surface of the second substrate close to the first substrate, and the conductive circuit is electrically connected to each of the light-emitting elements through the conductive material in the through hole.

[0029] In some embodiments, only a plurality of the light-emitting elements are disposed on a surface of the first substrate facing away from the second substrate;

[0030] The conductive circuit includes a driving wiring and a light-emitting wiring.

[0031] In some embodiments, the first substrate and / or the second substrate includes a plurality of residual glass strips, each of the residual glass strips extends along a first direction, and a plurality of the residual glass strips are spliced ​​together along a second direction.

[0032] In some embodiments, the first substrate and the second substrate are connected to each other, and a sealed accommodation cavity is formed between the first substrate and the second substrate, the conductive circuit is located in the accommodation cavity, and the conductive circuit includes a first conductive circuit disposed on a surface of the first substrate close to the second substrate, and a second conductive circuit disposed on a surface of the second substrate close to the first substrate;

[0033] Wherein, a protective layer is arranged between the first conductive circuit and the second conductive circuit.

[0034] In some embodiments, the second substrate is of an integrally formed design.

[0035] In order to solve the above problems, the third technical solution provided in the present application is: to provide a display device, wherein the display device comprises the light board described in any one of the above items.

[0036] Different from the prior art, the beneficial effect of the present application is that the light board and display device provided by the present application, by arranging the conductive circuit and the light-emitting element on different surfaces of the glass substrate, after the light-emitting element is bound to the conductive circuit, if the light-emitting element is defective, the rework (rework or repair) of the light-emitting element will not affect the conductive circuit, for example, it will not damage the conductive circuit on the back; or the conductive circuit will not affect the rework efficiency of the light-emitting element, thereby improving the production efficiency of the light board. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0038] Figure 1 A partial structural cross-sectional view of an implementation of a light board provided in the first embodiment of the present application;

[0039] Figure 2 A partial structural cross-sectional view of the lamp panel provided in the first embodiment of the present application after the light-emitting element is removed;

[0040] Figure 3 A schematic structural diagram of a part of the structure of an implementation method of a light board provided in the first embodiment of the present application at a first viewing angle;

[0041] Figure 4 A schematic structural diagram of a part of the structure of another implementation manner of the light board provided in the first embodiment of the present application at a first viewing angle;

[0042] Figure 5 A schematic structural diagram of a part of the structure of an implementation manner of a light board provided in the first embodiment of the present application at a second viewing angle;

[0043] Figure 6 A schematic structural diagram of a part of the structure of another implementation manner of the light board provided in the first embodiment of the present application at a second viewing angle;

[0044] Figure 7 A schematic structural diagram of an implementation method of a through hole is provided for the first embodiment of the present application;

[0045] Figure 8 A structural schematic diagram of another implementation of a through hole is provided for the first embodiment of the present application;

[0046] Fig. 9 A partial structural cross-sectional view of another implementation of the light board provided in the first embodiment of the present application;

[0047] Fig.10 A partial structural cross-sectional view of an implementation of a light board provided in the second embodiment of the present application;

[0048] Fig.11 A partial structural cross-sectional view of another implementation of a light panel provided in the second embodiment of the present application;

[0049] Fig.12 A schematic diagram of a module of an embodiment of a display device provided in the present application.

[0050] Description of labels:

[0051] Glass substrate 10; residual glass 11; first substrate 101; second substrate 102;

[0052] Light emitting element 20; Light emitting element group 21;

[0053] Conductive circuit 30; connecting portion 301; row conductive circuit 31; sub-conductive circuit 32; first conductive circuit 33; second conductive circuit 34;

[0054] Through hole 40; first hole section 41; second hole section 42; third hole section 43;

[0055] Conductive material 50;

[0056] Pad structure 60;

[0057] Protective layer 70;

[0058] Display device 1000; light board 100;

[0059] First direction x; second direction y; third direction z. DETAILED DESCRIPTION

[0060] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0061] The terms "first", "second", "third", etc. in this application are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first", "second", "third" may explicitly or implicitly include at least one of the features.

[0062] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0063] In some scenarios, a glass-based light strip generally includes a glass substrate, a conductive circuit disposed on the glass substrate, and a light-emitting element bound to the conductive circuit. The glass-based light strip can be used to prepare a light board to be used as a light-emitting backplane or display substrate of a display device.

[0064] Among them, in the prior art, generally after a conductive circuit is prepared on a glass substrate, a light-emitting element is bound to the conductive circuit, and the conductive circuit and the light-emitting element are usually located on the same surface of the glass substrate.

[0065] Research has found that in the prior art, since the conductive circuit and the light-emitting element bound to the conductive circuit are usually located on the same surface of the glass substrate, after the light-emitting element is bound to the conductive circuit, if the light-emitting element is defective, the rework (rework or repair) of the light-emitting element will often damage the conductive circuit, or the presence of the conductive circuit will affect the rework efficiency of the light-emitting element, thereby affecting the production efficiency of the light board.

[0066] To solve the above problems, the present application provides a light board, in which the conductive circuit and the light-emitting element are respectively arranged on the relative upper and lower surfaces of a glass substrate, and the glass substrate has a through hole passing through the upper and lower surfaces, the through hole is filled with conductive material, and the conductive circuit and the light-emitting element are bound by the conductive material in the through hole.

[0067] By arranging the conductive circuit and the light-emitting element on different surfaces of the glass substrate, during the binding process between the light-emitting element and the conductive circuit, if the light-emitting element is defective, the rework (rework or repair) of the light-emitting element will not affect the conductive circuit, for example, the conductive circuit on the back will not be damaged; or the conductive circuit will not affect the rework efficiency of the light-emitting element, thereby improving the production efficiency of the light board.

[0068] See also Figure 1-Figure 6 , Figure 1 A partial structural cross-sectional view of an implementation of a light board provided in the first embodiment of the present application; Figure 2 A partial structural cross-sectional view of the lamp panel provided in the first embodiment of the present application after the light-emitting element is removed; Figure 3 A schematic structural diagram of a part of the structure of an implementation method of a light board provided in the first embodiment of the present application at a first viewing angle; Figure 4A schematic structural diagram of a part of the structure of another implementation manner of the light board provided in the first embodiment of the present application at a first viewing angle; Figure 5 A schematic structural diagram of a part of the structure of an implementation manner of a light board provided in the first embodiment of the present application at a second viewing angle; Figure 6 A schematic structural diagram of a portion of the structure of another implementation manner of the light board provided in the first embodiment of the present application at a second viewing angle.

[0069] Specifically, the light board provided in the first embodiment of the present application includes a glass substrate 10 , a plurality of light-emitting elements 20 and a conductive circuit 30 .

[0070] The glass substrate 10 is a single-layer glass substrate having an upper surface and a lower surface opposite to each other. The glass substrate 10 is provided with a plurality of through holes 40 extending from the upper surface to the lower surface. The through holes 40 are filled with a conductive material 50 .

[0071] The glass substrate 10 may be a whole sheet of glass cut from a large plate of glass, or the glass substrate 10 may be formed by splicing the remaining glass after the large plate of glass is cut into panel glass. In the first embodiment of the present application, in order to improve the utilization rate of the large plate of glass, the glass substrate 10 is formed by splicing the remaining glass after the large plate of glass is cut. For details, see Figure 3-Figure 6 The glass substrate 10 includes a plurality of residual glass strips 11, each of which extends along a first direction x, and the plurality of residual glass strips 11 are spliced ​​together along a second direction y; and the plurality of residual glass strips 11 have through holes 40 penetrating the residual glass strips 11 along a third direction z.

[0072] The first direction x, the second direction y and the third direction z all intersect. In the embodiment of the present application, the first direction x, the second direction y and the third direction z are all perpendicular.

[0073] In some embodiments, see Figure 7 , Figure 7 A structural schematic diagram of an implementation of a through hole is provided for the first embodiment of the present application. The through hole 40 may be a straight through hole, that is, the aperture of the through hole 40 remains unchanged in the third direction z, thereby facilitating the preparation of the through hole 40.

[0074] Alternatively, see Figure 8 , Figure 8A structural schematic diagram of another implementation of a through hole is provided for the first embodiment of the present application, wherein the through hole 40 may be a wedge-shaped hole; that is, each through hole 40 includes a first hole segment 41 close to the upper surface, a second hole segment 42 close to the lower surface, and a third hole segment 43 located between the first hole segment 41 and the second hole segment 42; wherein, in a direction away from the third hole segment 43, the inner diameter of the first hole segment 41 and the inner diameter of the second hole segment 42 both gradually increase. It can be understood that, since the inner diameters at both ends of the through hole 40 are larger, when the slurry of the conductive material 50 is filled to both ends of the through hole 40, the filling speed of the slurry is relatively slow and easy to observe, thereby improving the risk of the slurry of the conductive material 50 easily overflowing from the through hole 40.

[0075] The through hole 40 is filled with a conductive material 50 ; the conductive material 50 includes but is not limited to copper, silver, aluminum, conductive polymer, conductive ink, conductive glue, and the like.

[0076] Among them, a plurality of light-emitting elements 20 are arranged on the upper surface of the glass substrate 10 and are arranged corresponding to the through holes 40. Among them, the light-emitting elements 20 are used to emit light in the on state, and the light-emitting elements 20 can be LEDs, OLEDs, Micro LEDs, etc. The orthographic projection of the light-emitting elements 20 on the glass substrate 10 covers the through holes 40 corresponding thereto.

[0077] In one embodiment of the present application, each light-emitting element 20 has a first pin (not shown) and a second pin (not shown), one of the first pin and the second pin is a positive pin, and the other is a negative pin, and the first pin and the second pin are respectively arranged corresponding to a through hole 40, that is, one light-emitting element 20 corresponds to two through holes 40.

[0078] In some embodiments, in combination Figure 1 and Figure 2 Each through hole 40 is provided with a pad structure 60 at one end close to the light emitting element 20, and the pad structure 60 is electrically connected to the conductive material 50 in the through hole 40, and the pin of the light emitting element 20 is electrically connected to the conductive material 50 in the through hole 40 through the pad structure 60. Specifically, the pad structure 60 can improve the connection reliability between the conductive material 50 and the light emitting element 20, and can serve as an alignment mark when the light emitting element 20 is bound.

[0079] Furthermore, a tin layer (not shown) is coated on the pad structure 60. Specifically, the main purpose of coating the tin layer on the pad structure 60 is to promote welding between the light emitting element 20 and the pad structure 60, improve conductivity, and enhance corrosion resistance of the pad structure 60.

[0080] Specifically, in a humid or high temperature environment, oxides are easily formed on the surface of the metal pad structure 60, which not only affects its conductivity, but also may cause problems such as poor contact and increased resistance. Tin has good oxidation resistance and corrosion resistance, and can effectively prevent oxidation and corrosion of the pad structure 60 during use, thereby significantly improving its oxidation resistance and extending its service life.

[0081] In other embodiments, the pad structure 60 can be replaced by anisotropic conductive adhesive (AFC adhesive). Specifically, the AFC adhesive is attached to the upper surface of the glass substrate 10, and the light emitting element 20 is located on the surface of the AFC adhesive facing away from the glass substrate 10. The AFC adhesive can make the light emitting element 20 conduct with the conductive material 50 in the through hole 40 in the third direction z.

[0082] The conductive circuit 30 is disposed on the lower surface of the glass substrate 10 opposite to the upper surface, and the conductive circuit 30 is electrically connected to each light emitting element 20 through the conductive material 50 in the through hole 40. In one embodiment of the present application, the conductive circuit 30 is electrically connected to the first pin and the second pin of each light emitting element 20 through the conductive material 50 in the through hole 40.

[0083] Specifically, the conductive circuit 30 can be connected to an integrated circuit (IC) in the display device, wherein the conductive circuit 30 may include a connection portion 301, the IC is electrically connected to the conductive circuit 30 through the connection portion 301, and the IC controls the light-emitting element 20 to emit light through the conductive circuit 30. It can be understood that when the light board is used as a light-emitting substrate, the multiple light-emitting elements 20 on the light board can generate a specific picture under the control of the IC for the user to watch. When the light board is used as a backlight substrate, the multiple light-emitting elements 20 on the light board can emit light under the control of the IC to provide a backlight source for the display substrate.

[0084] Specifically, by arranging the conductive circuit 30 and the light-emitting element 20 on different surfaces of the glass substrate 10, after the light-emitting element 20 is bound to the conductive circuit 30, if there is a defect in the light-emitting element 20, the rework (rework or repair) of the light-emitting element 20 will not affect the conductive circuit 30, for example, the conductive circuit 30 on the back will not be damaged; or the conductive circuit 30 will not affect the rework efficiency of the light-emitting element 20, thereby improving the production efficiency of the light board.

[0085] It should be emphasized that in the embodiment of the present application, the upper surface of the glass substrate 10 is only provided with a plurality of light-emitting elements 20, but no conductive circuit 30. The conductive circuit 30 is provided on the lower surface of the glass substrate 10, and the conductive circuit 30 includes but is not limited to a driving line and a light-emitting line. Among them, the driving line includes but is not limited to a driving circuit, such as a 2T1C driving circuit, a 7T1C driving circuit, a 7T2C driving circuit, etc. The light-emitting line includes but is not limited to a data line, a scanning line, etc.

[0086] It can be understood that the light-emitting element 20 and the driving wiring and the light-emitting wiring are arranged on different surfaces of the glass substrate 10, and the rework (rework or repair) of the light-emitting element 20 will not affect the driving wiring, the light-emitting wiring, etc., or the conductive circuit 30 will not affect the rework efficiency of the light-emitting element 20, thereby improving the production efficiency of the light board.

[0087] See also Figure 3-Figure 6 , wherein the first viewing angle is the viewing angle toward the upper surface of the glass substrate 10; and the second viewing angle is the viewing angle toward the lower surface of the glass substrate 10. In some embodiments, the plurality of light-emitting elements 20 include a plurality of rows of light-emitting elements 20 arranged along the first direction x, and each row of light-emitting elements 20 includes a plurality of light-emitting elements 20; the conductive circuit 30 includes a plurality of rows of row conductive circuits 31 extending along the first direction x, and further, each row of row conductive circuits 31 also includes a connecting portion 301, and the connecting portion 301 is located at one end of the residual glass 11 for connecting to the IC. According to the size of the residual glass 11, the plurality of light-emitting elements 20 on each residual glass 11 can be arranged as one or more rows, and the plurality of conductive circuits 30 on each residual glass 11 can be arranged as one or more rows. This improves the utilization rate of the residual glass 11.

[0088] For example, combined with Figure 3 and Figure 5 A row of light emitting elements 20 and rows of conductive circuits 31 are disposed on each of the residual glass 11 ; a row of light emitting elements 20 and rows of conductive circuits 31 on the same residual glass 11 are electrically connected through the conductive material 50 in the through hole 40 .

[0089] For another example, not shown, each glass scrap 11 is provided with multiple rows of light emitting elements 20 and multiple rows of conductive circuits 31 having the same number as the multiple rows of light emitting elements 20 ; the multiple rows of light emitting elements 20 and the multiple rows of conductive circuits 31 on the same glass scrap 11 are electrically connected via the conductive material 50 in the through hole 40 .

[0090] For example, combining Figure 4 and Figure 6, multiple rows of light emitting elements 20 and rows of conductive circuits 31 are arranged on each of the residual glass 11 ; the multiple rows of light emitting elements 20 and the rows of conductive circuits 31 on the same residual glass 11 are electrically connected through the conductive material 50 in the through hole 40 .

[0091] Specifically, each piece of scrap glass 11 is provided with at least one row of light-emitting elements 20 and at least one row of conductive circuits 31 according to the size of each piece of scrap glass 11, so that the utilization rate of the scrap glass 11 can be improved, and when one or more light-emitting elements 20 on the scrap glass 11 are defective, the entire piece of scrap glass 11 can be directly replaced, thereby improving the production efficiency of the light board.

[0092] Furthermore, combined with Figure 3-Figure 6 The multiple light-emitting elements 20 on each residual glass 11 can be divided into multiple light-emitting element groups 21, each light-emitting element group 21 includes at least one light-emitting element 20; each row of conductive circuits 31 includes multiple sub-conductive circuits 32, and a group of light-emitting element groups 21 and a sub-conductive circuit 32 on the same residual glass 11 are electrically connected through the conductive material 50 in the through hole 40.

[0093] For example, each light emitting element group 21 includes one light emitting element 20 , or each light emitting element group 21 includes at least two adjacent light emitting elements 20 .

[0094] Among them, when each group of light-emitting element groups 21 includes at least two adjacent light-emitting elements 20, multiple light-emitting elements 20 can be connected in series or in parallel, and multiple light-emitting elements 20 can be connected in series or in parallel through series-parallel wiring arranged on the lower surface, or multiple light-emitting elements 20 are directly electrically connected to the same sub-conductive circuit 32 through the conductive material 50 in the corresponding through hole 40, thereby realizing series-parallel connection, which is not limited here.

[0095] Specifically, a group of light emitting elements 21 on the same residual glass 11 is electrically connected to a sub-conductive circuit 32 through the conductive material 50 in the through hole 40, so that a control effect of one lamp one drive or multiple lamps one drive can be achieved. It can be understood that the control method of one lamp one drive can improve the contrast and achieve refined control. The control method of multiple lamps one drive helps to improve the uniformity of picture brightness and color, and is conducive to reducing costs.

[0096] In one embodiment, see Fig. 9 , Fig. 9 This is a partial structural cross-sectional view of another embodiment of the light board provided in the first embodiment of the present application. A protective layer 70 is further provided on the lower surface of the glass substrate 10, and the protective layer 70 covers the conductive circuit 30. Specifically, the protective layer 70 can protect the conductive circuit 30 from corrosion and oxidation.

[0097] The material of the protective layer 70 may include hydrogenated silicon nitride (SiNx), so that the protective layer 70 has good insulation performance, stability, uniformity and cost-effectiveness.

[0098] See also Fig.10 and Fig.11 , Fig.10 A partial structural cross-sectional view of an implementation of a light board provided in the second embodiment of the present application; Fig.11 A partial structural cross-sectional view of another implementation of the light board provided in the second embodiment of the present application.

[0099] Specifically, the lamp board provided in the second embodiment of the present application is the same as the first embodiment in that the lamp board includes a glass substrate 10 , a plurality of light-emitting elements 20 and a conductive circuit 30 .

[0100] Among them, different from the first embodiment, the glass substrate 10 is a double-layer glass substrate, and the glass substrate 10 specifically includes a first substrate 101 and a second substrate 102 that are stacked, the first substrate 101 has a relative upper surface and a lower surface, and the first substrate 101 is provided with a plurality of through holes 40 that penetrate from the upper surface to the lower surface, and the through holes 40 are filled with a conductive material 50.

[0101] The first substrate 101 and the second substrate 102 may both be whole sheets of glass cut from a large plate glass, or at least one of the first substrate 101 and the second substrate 102 may also be formed by splicing residual glass after the large plate glass is cut into panel glass. In the second embodiment of the present application, in order to improve the utilization rate of the large plate glass, at least one of the first substrate 101 and the second substrate 102 is formed by splicing residual glass after the large plate glass is cut. Specifically, at least one of the first substrate 101 and the second substrate 102 includes a plurality of residual glass strips 11, each of which extends along a first direction x, and a plurality of residual glass strips 11 are spliced ​​together along a second direction y.

[0102] In one embodiment, the first substrate 101 is formed by splicing a plurality of residual glass strips 11 ; the second substrate 102 is a whole sheet of glass, that is, the second substrate 102 is an integrally formed design.

[0103] Specifically, the first substrate 101 is formed by splicing a plurality of residual glass strips 11, so as to improve the utilization rate of the large glass plate, and the second substrate 102 is formed in an integrated manner, so as to improve the overall rigidity of the light board.

[0104] In another embodiment, the first substrate 101 is a whole sheet of glass, that is, the first substrate 101 is an integrally formed design; the second substrate 102 is formed by splicing a plurality of residual glass strips 11 .

[0105] Specifically, the second substrate 102 is formed by splicing a plurality of residual glass strips 11, so that the utilization rate of the large glass plate can be improved, and the first substrate 101 is provided with an integrated molding design, so that the overall rigidity of the light board can be improved. In addition, for a direct display device, such as an OLED display device and a Micro-OLED display device, the light board is used as a display substrate, and since the light-emitting element 20 is provided on the first substrate 101, the integrated molding design of the first substrate 101 can ensure the display effect.

[0106] In another embodiment, the first substrate 101 and the second substrate 102 are both formed by splicing a plurality of residual glass strips 11. In this way, the utilization rate of the large plate glass can be further improved.

[0107] Among them, in the second embodiment of the present application, the shape and structure of the through hole 40 can be the same as the shape and structure of the through hole 40 in the first embodiment, and will not be described in detail here.

[0108] In the second embodiment of the present application, the conductive material 50 filled in the through hole 40 may be the same as the conductive material 50 in the first embodiment, and will not be described in detail here.

[0109] In the second embodiment of the present application, a pad structure 60 may be provided at one end of each through hole 40 close to the light emitting element 20, and a tin layer may be coated on the pad structure 60; or the pad structure 60 may be replaced by anisotropic conductive adhesive (AFC adhesive). For details, please refer to the relevant description in the first embodiment of the present application, which will not be repeated here.

[0110] In the second embodiment of the present application, a plurality of light-emitting elements 20 are disposed on a surface of the first substrate 101 away from the second substrate 102 (e.g., the upper surface of the first substrate 101). The structure and type of the light-emitting element 20 may be the same as the structure and type of the light-emitting element 20 in the first embodiment, and will not be described in detail herein. In addition, the surface of the first substrate 101 away from the second substrate 102 is only provided with a plurality of light-emitting elements 20, but no conductive circuit 30.

[0111] Among them, in the second embodiment of the present application, similar to the first embodiment of the present application, the conductive circuit 30 can be connected to the integrated circuit (IC) in the display device, and the conductive circuit 30 includes but is not limited to the driving wiring and the light-emitting wiring.

[0112] Similar to the first embodiment of the present application, in the second embodiment of the present application, the conductive circuit 30 may include multiple rows of conductive circuits 31, each row of conductive circuits 31 may include multiple sub-conductive circuits 32, and a group of light-emitting element groups 21 is electrically connected to a sub-conductive circuit 32 through the conductive material 50 in the through hole 40.

[0113] Unlike the first embodiment, in the second embodiment of the present application, the conductive circuit 30 can be arranged on the surface of the first substrate 101 close to the second substrate 102 (for example, the lower surface of the first substrate 101), and / or arranged on the surface of the second substrate 102 close to the first substrate 101 (for example, the upper surface of the second substrate 102).

[0114] For example, the conductive circuit 30 may be disposed only on the surface of the first substrate 101 close to the second substrate 102; or, the conductive circuit 30 may be disposed only on the surface of the second substrate 102 close to the first substrate 101; or, a portion of the conductive circuit 30 is disposed on the surface of the first substrate 101 close to the second substrate 102, and the other portion is disposed on the surface of the second substrate 102 close to the first substrate 101.

[0115] Specifically, the glass substrate 10 includes a first substrate 101 and a second substrate 102 that are stacked, and the conductive circuit 30 is arranged on the surface of the first substrate 101 close to the second substrate 102, and / or arranged on the surface of the second substrate 102 close to the first substrate 101. The glass substrate 10 can be provided with more conductive circuits 30 to cope with complex circuit situations.

[0116] By arranging the conductive circuit 30 and the light-emitting element 20 to be located on different surfaces, after the light-emitting element 20 is bound to the conductive circuit 30, if there is a defect in the light-emitting element 20, the rework (rework or repair) of the light-emitting element 20 will not affect the conductive circuit 30, for example, the conductive circuit 30 on the lower surface of the first substrate 101 and / or the upper surface of the second substrate 102 will not be damaged; or the conductive circuit 30 on the lower surface of the first substrate 101 and / or the upper surface of the second substrate 102 will affect the rework efficiency of the light-emitting element 20, thereby improving the production efficiency of the light board.

[0117] In addition, the conductive circuit 30 is located on the surfaces of the stacked first substrate 101 and the second substrate 102 close to each other, which can effectively improve the corrosion of the conductive circuit 30 by external water vapor, thereby protecting the conductive circuit 30.

[0118] In one embodiment, see Fig.10 The first substrate 101 and the second substrate 102 are connected to each other, and a closed accommodating cavity is formed between the first substrate 101 and the second substrate 102. The conductive circuit 30 is located in the accommodating cavity, and the conductive circuit 30 includes a first conductive circuit 33 arranged on a surface of the first substrate 101 close to the second substrate 102, and a second conductive circuit 34 arranged on a surface of the second substrate 102 close to the first substrate 101.

[0119] A protective layer 70 is disposed between the first conductive circuit 33 and the second conductive circuit 34 . The protective layer 70 can insulate the first conductive circuit 33 and the second conductive circuit 34 and further prevent the first conductive circuit 33 and the second conductive circuit 34 from being oxidized and corroded.

[0120] The material of the protective layer 70 may include hydrogenated silicon nitride (SiNx), so that the protective layer 70 has good insulation performance, stability, uniformity and cost-effectiveness.

[0121] The thickness of the protective layer 70 is 5-10um, for example, the thickness of the insulating layer can be 5um, 7um or 10um, etc., which is not limited here. Specifically, if the thickness of the protective layer 70 is too thin, its insulation performance and stability will be affected. If the thickness of the protective layer 70 is too thick, the cost will be increased and it will be unfavorable to make the product thinner and lighter.

[0122] See also Fig.12 , Fig.12 A schematic diagram of a module of an embodiment of a display device provided in the present application.

[0123] Specifically, the present application further provides a display device 1000, which includes a light board 100, wherein the light board 100 includes the light board provided by any of the above embodiments.

[0124] Among them, the types of display devices 1000 include but are not limited to LED (Light Emitting Diode) display devices, Micro-LED (Micro-Light Emitting Diode) display devices, OLED (Organic Light Emitting Diode) display devices and LCD (Liquid Crystal Display) display devices, etc. The light board 100 can be used as a light-emitting backplane or display substrate of the display device.

[0125] For example, when the display device 1000 is an LCD display device, the light panel 100 can be used as a light-emitting back panel of the display device.

[0126] For another example, when the type of the display device 1000 is an LED display device, a Micro-LED display device or an OLED display device, the light board 100 can be used as a display substrate of the display device.

[0127] The above are only implementation methods of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A light board, characterized in that: include: A glass substrate, wherein the glass substrate has an upper surface and a lower surface opposite to each other, and a plurality of through holes extending from the upper surface to the lower surface are formed on the glass substrate, wherein the through holes are filled with a conductive material; A plurality of light emitting elements are arranged on the upper surface of the glass substrate and are arranged corresponding to the through holes; A conductive circuit is arranged on the lower surface of the glass substrate opposite to the upper surface, and the conductive circuit is electrically connected to each of the light-emitting elements through the conductive material in the through hole.

2. The light board according to claim 1, characterized in that: The upper surface of the glass substrate is only provided with a plurality of the light emitting elements; The conductive circuit includes a driving wiring and a light-emitting wiring.

3. The light board according to claim 1, characterized in that: The glass substrate includes a plurality of residual glass strips, each of which extends along a first direction, and a plurality of residual glass strips are spliced ​​together along a second direction.

4. The light board according to claim 3, characterized in that: The plurality of light emitting elements include a plurality of rows of light emitting elements arranged along the first direction, and each row of light emitting elements includes a plurality of light emitting elements; The conductive circuit comprises a plurality of rows of conductive circuits extending along the first direction; A row of the light-emitting elements and a row of the conductive lines are arranged on each of the residual glass strips; a row of the light-emitting elements and a row of the conductive lines on the same residual glass strip are electrically connected via the conductive material in the through holes.

5. The light board according to claim 3, characterized in that: The plurality of light emitting elements include a plurality of rows of light emitting elements arranged along the first direction, and each row of light emitting elements includes a plurality of light emitting elements; The conductive circuit comprises a plurality of rows of conductive circuits extending along the first direction; A plurality of rows of light-emitting elements and a row of conductive lines are arranged on each of the residual glass strips; the plurality of rows of light-emitting elements and a row of conductive lines on the same residual glass strip are electrically connected via the conductive material in the through holes.

6. The light board according to claim 4 or 5, characterized in that: The plurality of light-emitting elements on each of the residual glass strips are divided into a plurality of light-emitting element groups, each of which includes at least one light-emitting element; Each row of the conductive circuits includes a plurality of sub-conductive circuits, and a group of the light-emitting element groups on the same residual glass is electrically connected to one of the sub-conductive circuits through the conductive material in the through hole.

7. The light board according to claim 1, characterized in that: Each of the light-emitting elements has a first pin and a second pin, the first pin and the second pin are respectively arranged corresponding to a through hole, and the conductive circuit is electrically connected to the first pin and the second pin of each of the light-emitting elements through the conductive material in the through hole.

8. The light board according to claim 1, characterized in that: A pad structure is provided at one end of each through hole close to the light emitting element, the pad structure is electrically connected to the conductive material in the through hole, and a tin layer is coated on the pad structure; The pins of the light emitting element are electrically connected to the conductive material in the through hole through a pad structure.

9. The light board according to claim 1, characterized in that: Each of the through holes comprises a first hole segment close to the upper surface, a second hole segment close to the lower surface, and a third hole segment located between the first hole segment and the second hole segment; Wherein, in a direction away from the third hole segment, the inner diameter of the first hole segment and the inner diameter of the second hole segment both gradually increase.

10. A light board, characterized in that: include: A glass substrate, the glass substrate comprising a first substrate and a second substrate stacked together, the first substrate having an upper surface and a lower surface opposite to each other, and the first substrate is provided with a plurality of through holes extending from the upper surface to the lower surface, wherein the through holes are filled with a conductive material; A plurality of light emitting elements are arranged on a surface of the first substrate facing away from the second substrate and are arranged corresponding to the through holes; A conductive circuit is arranged on a surface of the first substrate close to the second substrate and / or on a surface of the second substrate close to the first substrate, and the conductive circuit is electrically connected to each of the light-emitting elements through the conductive material in the through hole.

11. The light board according to claim 10, characterized in that: The surface of the first substrate facing away from the second substrate is only provided with a plurality of the light-emitting elements; The conductive circuit includes a driving wiring and a light-emitting wiring.

12. The light board according to claim 10, characterized in that: The first substrate and / or the second substrate comprises a plurality of residual glass strips, each of the residual glass strips extends along a first direction, and a plurality of the residual glass strips are spliced ​​together along a second direction.

13. The light board according to claim 10, characterized in that: The first substrate and the second substrate are connected to each other, and a sealed accommodating cavity is formed between the first substrate and the second substrate. The conductive circuit is located in the accommodating cavity, and the conductive circuit includes a first conductive circuit arranged on a surface of the first substrate close to the second substrate, and a second conductive circuit arranged on a surface of the second substrate close to the first substrate; Wherein, a protective layer is arranged between the first conductive circuit and the second conductive circuit.

14. The light board according to claim 10, characterized in that: The second substrate is of one-piece molding design.

15. A display device, characterized in that: The display device comprises the light board according to any one of claims 1 to 9; Alternatively, the display device comprises the light board according to any one of claims 10-14.

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