Low-voltage special-shaped conductor and production method thereof

Abstract

The invention provides a low-voltage special-shaped conductor and a production method thereof, and belongs to the technical field of wires and cables. According to the production method, the contact surface, used for twisting, of the special-shaped conductor formed through drawing is polished, so that the contact between the two conductive conductors in contact is tighter, and the conditions of resistance increase or point discharge and the like caused by a gap between the two conductive conductors are reduced. Moreover, the surface quality of the contact surface of the special-shaped conductor is continuously detected before the polishing process, and the working parameters of the polishing process are calculated based on the detected surface quality, so that the continuous treatment efficiency is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of electric wires and cables, and in particular relates to a low-voltage special-shaped conductor and a production method thereof. Background Art

[0002] In low-voltage power transmission and industrial applications, special-shaped conductors optimize space utilization and improve conductive efficiency by virtue of their cross-sectional design. However, in practical applications, the key performance of special-shaped conductors depends not only on their material properties and geometric morphology, but also on the surface quality of the conductor, especially the flatness and smoothness of the lateral contact surface. When two sections of special-shaped conductors are twisted together, if there is obvious surface roughness, protrusions or depressions on the contact surface, resulting in the two contact surfaces being unable to fit tightly, there will be a series of quality and use-related problems. For example, the contact resistance of two or more conductors increases, thereby increasing the overall internal resistance of the cable. Or the risk of partial discharge between conductors increases.

[0003] Therefore, the surface quality of the contact surface of special-shaped conductors is directly related to the electrical performance, thermal stability and long-term reliability of the conductors.

[0004] According to the relevant public technologies, the technical solution with the publication number CN115312251A proposes a composite multilayer cable using special-shaped conductors. The environmental performance of the cable is improved by designing a special shape of the special-shaped conductor and manufacturing it with environmentally friendly materials. The technical solution with the publication number WO2018107537A1 proposes a large-cross-sectional area submarine transmission cable using special-shaped conductors. The designed special-shaped conductor shape makes the cable have a good internal resistance and is suitable for the manufacture of cables with large cross-sections. The technical solution with the publication number KR1020140004030A proposes filling the gaps between the special-shaped conductors with a specific material so that the twisting of the special-shaped conductors is tighter and the strength is also higher.

[0005] The above technical solutions all propose several optimization technical solutions for improving the performance of cables using special-shaped conductors. However, for application conditions with higher requirements, the relevant technologies need to be further improved.

[0006] The foregoing discussion of the background art is intended only to facilitate an understanding of the present invention. This discussion does not acknowledge or admit that any of the material referred to is part of the common general knowledge. Summary of the invention

[0007] The purpose of the present invention is to provide a low-voltage special-shaped conductor and a production method thereof, which belongs to the technical field of wires and cables. The production method polishes the contact surface of the special-shaped conductor used for twisting after drawing, so that the contact between the two contacting conductors is tighter, so as to reduce the increase in resistance or the generation of tip discharge caused by the gap between the two. In addition, before the polishing process, it also includes continuous detection of the surface quality of the contact surface of the special-shaped conductor, and based on the detected surface quality, the working parameters of the polishing process are calculated, thereby improving the efficiency of the continuous processing.

[0008] The present invention adopts the following technical solution: a method for producing a low-voltage special-shaped conductor, the production method is applied to prepare a quadrilateral single-strand special-shaped conductor; the production method comprises the following steps:

[0009] S100: Drawing and forming the conductor material through wire drawing die preparation to obtain a formed conductor with a specified cross-sectional shape;

[0010] S200: cleaning the surface of the formed conductor;

[0011] S300: Continuously inspecting at least two lateral contact surfaces of the formed conductor by continuous surface inspection to continuously evaluate the flatness index of the formed conductor in a preset length;

[0012] S400: setting working parameters of the rapid polishing section based on the flatness index of the current formed conductor;

[0013] S500: quickly polishing the lateral contact surface of the corresponding shaped conductor;

[0014] S600: Check the surface quality of the lateral contact surface of the formed conductor after polishing to ensure that it meets the predetermined requirements.

[0015] Preferably, in step S300, the continuous surface detection adopts one or more of the following detection methods: visual detection, ultrasonic detection, and eddy current detection.

[0016] Preferably, in steps S400 and S500, the rapid polishing is performed by plasma polishing.

[0017] Preferably, the working parameters of the rapid polishing process include at least one of the following parameters: working voltage, working current, gas pressure, polishing speed, polishing temperature, and plasma frequency.

[0018] Preferably, the shaped conductor is controlled and guided by a guiding device, and the shaped conductor is moved along its length direction by clamping the non-contact surface of the shaped conductor, and the lateral contact surface of the shaped conductor is exposed to the processing space of the relevant processing device in steps S300, S400, and S500.

[0019] At the same time, a low-voltage special-shaped conductor is proposed, and the special-shaped conductor is prepared by adopting the production method.

[0020] Meanwhile, a low-voltage cable is proposed, wherein the low-voltage cable is prepared by twisting a plurality of low-voltage special-shaped conductors.

[0021] The beneficial effects achieved by the present invention are:

[0022] 1. This technical solution uses plasma polishing technology to improve the flatness and smoothness of the contact surface of special-shaped conductors, and reduce the contact gap and uneven resistance when the conductors are twisted. The flat contact surface can effectively reduce the contact resistance, reduce local heating and power transmission losses, and avoid the risk of local discharge caused by electric field concentration. In addition, the uniform contact surface can also enhance the mechanical stability of the conductors after twisting, avoid deformation or microcracks under high tension and high temperature conditions, and extend the service life of the conductors. This refined surface treatment greatly improves the electrical performance and reliability of the conductors in the power transmission system;

[0023] 2. This technical solution introduces a continuous surface detection process, and adjusts the working parameters of the polishing process in real time based on the detection of the contact surface of the special-shaped conductor, thereby improving the production efficiency of the special-shaped conductor;

[0024] 3. The polishing assembly of the present technical solution further improves the efficiency of plasma polishing by setting a polishing injection port for the air wall formed by a specific rapid airflow, thereby avoiding the waste of polishing materials caused by the main open injection port. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present invention can be further understood from the following description in conjunction with the accompanying drawings. The components in the figures are not necessarily drawn to scale, but the emphasis is placed on illustrating the principles of the embodiments. In different views, the same reference numerals designate corresponding parts.

[0026] Description of the accompanying drawings: 10-formed conductor; 200-production device; 201-fixed seat; 202-base; 203-roller; 210-detection module; 220-raw material supply source; 230-polishing assembly; 227-seal; 231-electrolyte input end; 232-electrolyte channel; 233-power input end; 234-core; 249-injection port; 250-outer sleeve; 251-gas input end; 255-core; 256-injection port Towards; 259-air gap; 280-motion mechanism; 520-guide rail assembly; 510-detection element; 530-data acquisition unit; 540-feedback interface; 550-temperature control and environmental adaptation unit; 700-computer system; 702-bus; 704-processor; 706-main memory; 708-read-only memory; 710-storage device; 712-display; 714-input device; 716-cursor control device; 718-network device;

[0027] Figure 1 A schematic diagram of the steps of a method for producing a low-voltage special-shaped conductor according to an embodiment of the present invention;

[0028] Figure 2 Schematic diagram of a production device used for the production method in an embodiment of the present invention;

[0029] Figure 3 It is a cross-sectional schematic diagram of the front side of the moving direction of the roller and the shaped conductor in an embodiment of the present invention;

[0030] Figure 4 It is a schematic exploded cross-sectional view of the polishing assembly according to an embodiment of the present invention;

[0031] Figure 5 It is a schematic diagram of the outer sleeve in section AA according to an embodiment of the present invention;

[0032] Figure 6 This is a schematic diagram of the architecture of the detection module according to an embodiment of the present invention;

[0033] Figure 7 Schematic diagram of the architecture of the control module in an embodiment of the present invention. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with its embodiments; it should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. For those skilled in the art, after reviewing the following detailed description, other systems, methods and / or features of the present embodiment will become apparent. It is intended that all such additional systems, methods, features and advantages are included in this specification. Included within the scope of the present invention and protected by the appended claims. Additional features of the disclosed embodiments are described in the following detailed description, and these features will be apparent from the following detailed description.

[0035] The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "left", "right" and the like indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation. The invention is constructed and operated in a specific orientation, so the terms describing the positional relationship in the drawings are only used for exemplary description and cannot be understood as a limitation of this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0036] Embodiment 1: For example, as shown in the attached Figure 1 As shown, a method for producing a low-voltage special-shaped conductor is proposed, and the production method is applied to prepare a quadrilateral single-strand special-shaped conductor; the production method comprises the following steps:

[0037] S100: Drawing and forming the conductor material through wire drawing die preparation to obtain a formed conductor with a specified cross-sectional shape;

[0038] S200: cleaning the surface of the formed conductor;

[0039] S300: Continuously inspecting at least two lateral contact surfaces of the formed conductor by continuous surface inspection to continuously evaluate the flatness index of the formed conductor in a preset length;

[0040] S400: setting working parameters of the rapid polishing section based on the flatness index of the current formed conductor;

[0041] S500: quickly polishing the lateral contact surface of the corresponding shaped conductor;

[0042] S600: Check the surface quality of the lateral contact surface of the formed conductor after polishing to ensure that it meets the predetermined requirements.

[0043] Preferably, in step S300, the continuous surface detection adopts one or more of the following detection methods: visual detection, ultrasonic detection, and eddy current detection.

[0044] Preferably, in steps S400 and S500, the rapid polishing is performed by plasma polishing.

[0045] Preferably, the working parameters of the rapid polishing process include at least one of the following parameters: working voltage, working current, gas pressure, polishing speed, polishing temperature, and plasma frequency.

[0046] Preferably, the shaped conductor is controlled and guided by a guiding device, and the shaped conductor is moved along its length direction by clamping the non-contact surface of the shaped conductor, and the lateral contact surface of the shaped conductor is exposed to the processing space of the relevant processing device in steps S300, S400, and S500.

[0047] At the same time, a low-voltage special-shaped conductor is proposed, and the special-shaped conductor is prepared by adopting the production method.

[0048] Meanwhile, a low-voltage cable is proposed, wherein the low-voltage cable is prepared by twisting a plurality of low-voltage special-shaped conductors.

[0049] Further, as attached Figure 2 and attached Figure 3 As shown, a production device 200 used for continuous inspection and polishing of a special-shaped conductor in an embodiment is exemplified. In this example, the shaped conductor 10 is a special-shaped conductor with a trapezoidal cross section after being formed by a drawing die. The cross-sectional shape of the shaped conductor 10 is only used as an exemplary description here, and is not intended to be a limitation of the present technical solution.

[0050] Furthermore, the production device 200 is used to simultaneously perform continuous surface inspection and plasma polishing on two or more lateral contact surfaces of the shaped conductor 10. The production device 200 can be connected to the drawing process, and when the shaped conductor 10 is formed by the drawing die, it is immediately connected to the production device 200. Alternatively, in some embodiments, the production device 200 can also be independently set as a separate processing thread, which is not limited here.

[0051] The production device 200 includes a fixed seat 201, a detection module 210, at least two polishing assemblies 230, a motion mechanism 280 for driving the polishing assemblies 230 to move, and a control module (not shown in the figure) for controlling the coordinated operation of the various modules and assemblies of the above production device 200. The polishing assembly 230 is fixedly connected to the motion mechanism 280 through a connecting mechanism, and realizes directional movement under the control of the motion mechanism 280, so as to implement independent processing of different positions on the surface of the formed conductor when necessary.

[0052] Exemplarily, the fixing seat 201 is used to assist the positioning of the shaped conductor 10 in the moving direction of the conductor 10, and at the same time, pull the shaped conductor 10 to move continuously in the moving direction. The fixing seat 201 and the motion mechanism 280 cooperate with each other, so that the polishing assembly 230 can continuously polish the shaped conductor 10 without moving; and when necessary, at least one polishing assembly 230 can be controlled to move separately to achieve independent polishing position processing. Preferably, the fixing seat 201 can include a base 202 and a roller 203. In addition, other fixing elements such as bolts, nuts, washers or clamps can be used to fix the shaped conductor 10 on the side.

[0053] As attached Figure 3 As shown, the roller 203 is a set of two rollers, which are respectively arranged on the upper and lower end surfaces of the shaped conductor 10, and apply a certain pressure to the upper and lower end surfaces of the shaped conductor 10, and at the same time pull the shaped conductor 10 to move toward the subsequent detection module 210 and the polishing assembly 230. Preferably, the material of each component in the fixing seat 201 is an insulating material, so as to reduce current leakage during the polishing process and ensure the safety and stability of the electrolysis process.

[0054] Further, as attached Figure 4 and attached Figure 5 , which is a cross-sectional exploded view of the polishing assembly 230. The polishing assembly 230 is configured to be connected to an electrolyte supply source and a supply end of a gas for injection. The polishing assembly 230 includes a core 234, which includes an electrolyte input end 231, a gas input end 251, and a power input end.

[0055] 233. The electrolyte input terminal 231 is connected to the electrolyte supply source to ensure that the electrolyte can be stably supplied to the mixing module 220. The gas input terminal 251 is connected to the gas supply source. Figure 4 The electrolyte supply source and the gas supply source are connected and are collectively represented as a raw material supply source 220. After receiving the gas, the polishing assembly 230 can adjust the flow rate and pressure of the gas to form a stable gas flow state. The power input terminal 233 is connected to a power supply to provide high-voltage power to support the electrolysis reaction of the electrolyte on the surface of the target object.

[0056] Furthermore, an electrolyte channel 232 is provided inside the polishing assembly 230, and the electrolyte flows from the electrolyte channel 232 to the injection port 249 at the front end and is ejected at a stable speed under the action of high pressure.

[0057] Illustratively, a plurality of fixing holes 228 may be provided at a plurality of positions of the polishing assembly 230 , which may be used to fix the polishing assembly 230 to the motion mechanism 280 when necessary.

[0058] On the other hand, a duckbill-shaped outer sleeve 250 is provided on the outside of the polishing assembly 230, a core 255 is provided in the middle of the outer sleeve 250, and a certain gap is provided between the outer sleeve 250 and the core 255 to form an air gap 259. The gas input from the gas input end 251 passes through the air gap 259 under a certain pressure, so that the gas pressure and flow rate of the gas are increased, and a high-speed jet airflow is formed, so that a stable gas wall is formed after being ejected from the outside of the outer sleeve 250, and the electrolyte jet flow ejected from the ejection port 249 is confined to the designated polishing area to prevent it from diffusing to the area that does not need to be polished. Preferably, the ejection port 249 is in the shape of a long strip, and the width w of the ejection port 249 is similar to the side height of the shaped conductor 10 as shown in the figure, so that the electrolyte substantially covers the side height h of the shaped conductor 10 when ejected.

[0059] Preferably, the maximum diameter of the injection port 249 is located at the end of the injection port 249. That is, the diameter of the injection port 249 gradually increases toward the tail end of the injection port 249, that is, in the longitudinal section parallel to the ejection direction 256, the profile of the inner side wall of the injection port 249 can be basically a slope.

[0060] In addition, the various components of the injection module are sealed by a seal 227, which may be an O-ring, an elastic ring or an insulating gasket to ensure air tightness and insulation between the various components.

[0061] In the device, the motion mechanism 280 is responsible for controlling the position and direction of the injection module to ensure that the injection port 249 can be accurately aligned with the target area. The injection port 249 preferably includes a horizontal motion module, a vertical motion module and a rotational motion module, and can move in multiple axial directions. The motion mechanism 280 includes relevant power components for driving, such as motors, gears, conveyor belts, etc., and control program software for controlling relevant power components, such as spatial position control software, error recording software, and communication software, so that each power component can operate in coordination and support high-precision positioning and dynamic adjustment. In actual applications, through the control of the motion mechanism 280, the polishing assembly 230 can flexibly adjust the injection direction and injection distance to adapt to formed conductors 10 of different shapes and sizes.

[0062] During the polishing process, the shaped conductor 10 is first fixed on the fixing seat 201 and grounded using a conductive element to ensure the integrity of the circuit. Subsequently, the supply of electrolyte and gas is adjusted by the control system, and the electrolyte is delivered to the injection port 249 through the electrolyte communication port 231, while the gas is delivered to the gas outlet 259 through the gas communication port 251 to form a protective gas wall. The high-voltage current acts on the electrolyte through the power input terminal 233, activating the electrolyte to perform an electrolytic reaction on the surface of the target object. At this time, the electrolyte reacts chemically with the metal surface, removes tiny protrusions and defects on the surface, and improves the flatness. The gas wall forms a stable protective barrier in the polishing area, reduces interference from the external environment, and prevents the electrolyte from diffusing to the non-polishing area. In addition, the morphology between the injection port and the gas outlet of the injection module is optimized and matched to ensure that the mutual interference between the jet and the gas wall is minimized, reduce turbulence, and improve the uniformity and stability of polishing.

[0063] The entire polishing process can be monitored and adjusted dynamically in real time through the control system, which can adjust key parameters such as the temperature and flow rate of the electrolyte, the pressure and flow rate of the gas, and the voltage and current of the power supply to adapt to target objects of different materials and shapes. In addition, the control system can also be combined with a continuous surface detection system to monitor the flatness index of the target surface in real time, and make dynamic adjustments based on the detection data to ensure that the polishing effect meets the expected standards.

[0064] Exemplarily, the detection module 210 is used to continuously detect the lateral contact surface or other target areas of the shaped conductor 10, thereby providing reliable reference data for the subsequent polishing process. The detection module 210 evaluates the flatness and surface smoothness of the lateral contact surface of the shaped conductor 10 through the real-time collected surface data, and transmits the relevant information to the control module, thereby adjusting the working parameters of the polishing assembly 230 to ensure that the polishing effect meets the expected standards.

[0065] Preferably, as attached Figure 6 As shown, the detection module 210 is composed of multiple components to implement the detection function, including:

[0066] The detection element 510 is used to directly obtain the morphological information of the surface of the shaped conductor 10. Optionally, the detection element can be one or more of the following sensors: laser displacement sensor, eddy current sensor, ultrasonic sensor, optical camera. The detection element can be flexibly replaced or used in combination according to different detection requirements and the material and shape characteristics of the shaped conductor. And by configuring evaluation algorithms such as image algorithm and light signal algorithm, the smoothness of the current detection surface can be analyzed.

[0067] The guide rail assembly 520 is used to support the detection element to move horizontally, vertically or rotationally to meet the needs of conductors with different cross-sectional shapes. Preferably, the guide rail assembly can include a horizontal guide rail, a vertical guide rail, a rotating base, etc. Preferably, the movement of the guide rail assembly is driven and controlled by a servo motor and an encoder, which can provide micron-level positioning accuracy to ensure the accuracy of detection.

[0068] The data acquisition unit 530 is used to receive the signal collected by the sensor of the detection head and convert it into digital data for analysis. The data acquisition unit includes:

[0069] Signal amplifier: amplifies the signal output by the sensor to ensure signal clarity and stability.

[0070] Analog-to-digital converter (ADC): Converts analog signals into digital signals for subsequent processing.

[0071] Data processor: Calculates surface flatness index and smoothness parameters in real time and transmits the results to the control system.

[0072] The feedback interface 540 is used to realize two-way communication between the detection module 210 and the control module. The detection module 210 transmits the detected surface data to the control module, and the control module dynamically adjusts the working parameters of the polishing assembly 230, such as the spray angle, polishing speed, electrolyte flow rate, etc. At the same time, the control system can also send instructions to the detection module through the feedback interface, such as adjusting the working mode or detection path of the detection head.

[0073] Temperature control and environmental adaptation unit 550: In order to improve the accuracy of detection, the detection module 210 is equipped with a temperature control and environmental adaptation unit 550 to reduce the interference of environmental factors on the detection results. Preferably, the temperature control and environmental adaptation unit 550 includes:

[0074] The temperature sensor is used to monitor the temperature of the detection environment and the conductor surface in real time, and adjust the operating temperature of the detection head through feedback.

[0075] The dust cover is used to protect the detection head from dust, metal chips and other pollutants to ensure the accuracy of the detection results.

[0076] The shockproof structure is used to reduce the interference of vibration on the detection process.

[0077] The working process of the production device 200 is as follows: when the formed conductor 10 is pulled into the detection module 210 through the fixing seat 201, the detection module starts to perform surface detection on its lateral contact surface or other target areas. The detection element is positioned to the surface of the formed conductor 10 through the guide rail assembly, and the corresponding sensor is activated according to the specific detection requirements. Taking the laser displacement sensor as an example, the laser transmitter emits a laser beam to the surface of the conductor, the beam is reflected on the surface of the conductor, and the reflected light is captured by the receiver. According to the offset of the optical path, the height value of each point on the conductor surface is calculated, and the height data is transmitted to the data acquisition unit, and the data processor calculates the flatness index and smoothness parameters of the conductor surface. Other types of sensors (such as eddy current sensors and ultrasonic sensors) are also based on similar physical detection principles and use non-contact methods to capture surface data, which will not be described here.

[0078] During the detection process, the detection module 210 transmits the surface data to the control module in real time, and the control module determines whether the quality of the conductor surface meets the polishing requirements. If the detection results show that a certain area has obvious surface defects or unevenness, the control system will send instructions to the motion mechanism 280 to adjust the working parameters or spray direction of the polishing assembly 230 to treat the area in a targeted manner.

[0079] Embodiment 2: This embodiment should be understood to include at least all the features of any of the above embodiments, and further improve on the basis thereof:

[0080] Furthermore, in a preferred embodiment, in order to improve the detection efficiency, the detection module 210 continuously monitors the flatness index Q of the two lateral contact surfaces of the formed conductor 10, and controls the moving speed v of the formed conductor 10 based on the Q value, so that when the flatness index Q fluctuates, the moving speed v of the formed conductor 10 is reduced to increase the processing time of the formed conductor 10 through the polishing component 230.

[0081] The calculation method of moving speed v is:

[0082]

[0083] In the above formula, Q is the flatness index, which represents the surface flatness index or quality fluctuation parameter of the formed conductor in a preset length obtained by the detection module. The preset length can be set by relevant technicians, for example, it can be 30cm, 50cm, 70cm, etc.

[0084] SQ min SQ is the minimum threshold of the flatness index. If the value is lower than this, it means that the surface quality of the current detection area meets the preset requirements. max It is the maximum threshold of the flatness index. When it is higher than this value, it indicates that the surface quality is unqualified.

[0085] The Q value is obtained by the following calculation formula:

[0086] Q=W1·R a +W2·D+W3·ΔQ;

[0087] In the above formula, R a is the arithmetic mean deviation of surface roughness, which characterizes the degree of surface roughness. It represents the average absolute value of each point on the surface profile to the center line within a specific sampling area. D is the number of surface defects per unit area. ΔQ is the flatness index fluctuation parameter, which represents the maximum change value of the detected flatness index within a specified length interval. W1, W2 and W3 correspond to R a , D and ΔQ, and preferably W1+W2+W3=1. W1, W2 and W3 can be specifically set by relevant technical personnel.

[0088] Among them, R a The calculation method is:

[0089]

[0090] In the above formula, N is the total number of sampling points within the sampling area; i is the surface height value of the i-th sampling point (i.e., the distance from the ideal surface, both positive and negative heights are absolute values); z avg It is the average height of all sampling points within the sampling area.

[0091] D is calculated as:

[0092] D = m / A;

[0093] In the above formula, m is the total number of surface defects detected within the sampling area A.

[0094] ΔQ is calculated by recording the highest quality parameter value Q within a specified length L. max and the lowest quality parameter value Q min The difference, that is:

[0095] ΔQ=Q max -Q min ;

[0096] When ΔQ is small, it indicates that the surface quality is relatively stable. Otherwise, the surface quality fluctuates greatly and the moving speed needs to be adjusted.

[0097] Preferably, when the detection module 210 detects that the surface quality of the formed conductor fluctuates greatly, the relevant working parameters of the polishing assembly 230 need to be adjusted synchronously to increase the polishing intensity and ensure that the surface quality is effectively repaired and improved under low speed conditions. The polishing effect can be further improved by adjusting working parameters such as working voltage, electrolyte flow, gas flow, and spray angle.

[0098] Embodiment 3: This embodiment should be understood to include at least all the features of any of the above embodiments, and further improve upon them;

[0099] For example, as shown in the attached Figure 7 As shown, an implementation of a computer system 700 used by the control module is described; the computer system 700 can be applied to implement the necessary functions of the control module.

[0100] Illustratively, computer system 700 includes a bus 702 or other communication mechanism for communicating information, one or more processors 704 coupled to bus 702 for processing information; processor 704 may be, for example, one or more general-purpose microprocessors;

[0101] The computer system 700 also includes a main memory 706, such as a random access memory (RAM), cache, and / or other dynamic storage device, coupled to the bus 702 for storing information and instructions to be executed by the processor 704; the main memory 706 may also be used to store temporary variables or other intermediate information during the execution of instructions to be executed by the processor 704; these instructions, when stored in a storage medium accessible to the processor 704, present the computer system 700 as a special-purpose machine customized to perform the operations specified in the instructions;

[0102] The computer system 700 may also include a read-only memory (ROM) 708 or other static storage device coupled to the bus 702 for storing static information and instructions for the processor 704; a storage device 710 such as a disk, an optical disk, or a USB drive (flash drive) will be coupled to the bus 702 for storing information and instructions;

[0103] And further, coupled to the bus 702 may also include a display 712 for displaying various information, data, media, etc., an input device 714 for allowing a user of the computer system 700 to control, manipulate, and / or interact with the computer system 700;

[0104] A preferred way to interact with the management system may be through a cursor control device 716, such as a computer mouse or similar control / navigation mechanism;

[0105] Furthermore, the computer system 700 may also include a network device 718 coupled to the bus 702; wherein the network device 718 may include, for example, a wired network card, a wireless network card, a switching chip, a router, a switch, and other components;

[0106] In general, the terms "engine", "component", "system", "database", etc., as used herein, may refer to logic embodied in hardware or firmware, or to a collection of software instructions, possibly with entry and exit points, written in a programming language such as Java, C, or C++; software components may be compiled and linked into executable programs, installed in a dynamic link library, or may be written in an interpreted programming language (e.g., BASIC, Perl, or Python); it should be understood that software components may be called from other components or from themselves, and / or may be called in response to detected events or interrupts;

[0107] Software components configured to execute on a computing device may be provided on a computer-readable medium, such as a compact disc, digital video disc, flash drive, diskette, or any other tangible medium, or as a digital download (and may be initially stored in a compressed or installable format that requires installation, decompression, or decryption prior to execution); such software code may be stored in part or in whole on a memory device of the executing computing device for execution by the computing device; software instructions may be embedded in firmware, such as an EPROM; it is also understood that hardware components may be composed of connected logic units (such as gates and flip-flops), and / or may be composed of programmable units (such as programmable gate arrays or processors);

[0108] Computer system 700 includes custom hardwired logic, one or more ASICs or FPGAs, firmware, and / or program logic that, in combination with the computer system, renders computer system 700 a special-purpose computing device;

[0109] According to one or more embodiments, the techniques herein may be performed by computer system 700 in response to processor 704 executing one or more sequences of one or more instructions contained in main memory 706; such instructions may be read into main memory 706 from another storage medium, such as storage device 710; execution of the sequences of instructions contained in main memory 706 causes processor 704 to perform the process steps described herein; in alternative embodiments, hard-wired circuitry may be used in place of or in combination with software instructions;

[0110] As used herein, the term "non-transitory media" and similar terms refer to any media that store data and / or instructions that cause a machine to operate in a specific manner; such non-transitory media may include non-volatile media and / or volatile media; non-volatile media include, for example, optical or magnetic disks, such as storage device 710; volatile media include dynamic memory, such as main memory 706;

[0111] Among them, common forms of non-transitory media include, for example, floppy disks, diskettes, hard disks, solid-state drives, magnetic tapes or any other magnetic data storage medium, CD-ROMs, any other optical data storage medium, any physical medium having a pattern of holes, RAM, PROM and EPROM, FLASH-EPROM, NVRAM, any other memory chip or cartridge, and network versions thereof;

[0112] Non-transient media are distinct from transmission media but may be used in conjunction with transmission media; transmission media participate in the transmission of information between non-transient media; for example, transmission media include coaxial cables, copper wires, and optical fibers, including the wires that make up bus 702; transmission media may also take the form of sound waves or light waves, such as radio waves and infrared data communications.

[0113] Although the present invention has been described above with reference to various embodiments, it should be understood that many changes and modifications may be made without departing from the scope of the present invention. That is, the methods, systems and devices discussed above are examples. Various configurations may appropriately omit, replace or add various processes or components. For example, in alternative configurations, the method may be performed in an order different from the order described, and / or various components may be added, omitted and / or combined. Moreover, the features described with respect to certain configurations may be combined in various other configurations, such as different aspects and elements of the configurations may be combined in a similar manner. In addition, the elements therein may be updated as the technology develops, i.e., many elements are examples and do not limit the scope of the present disclosure or claims.

[0114] Specific details are given in the specification to provide a thorough understanding of the exemplary configurations including implementations. However, the configurations may be practiced without these specific details. For example, well-known circuits, processes, algorithms, structures, and techniques have been shown without unnecessary details to avoid obscuring the configurations. This description provides only example configurations and does not limit the scope, applicability, or configurations of the claims. On the contrary, the foregoing description of the configurations will provide those skilled in the art with an enabling description for implementing the described techniques. Various changes may be made to the functions and arrangements of the elements without departing from the spirit or scope of the present disclosure.

[0115] In summary, it is intended that the above detailed description is considered to be illustrative rather than restrictive, and it should be understood that the above embodiments should be understood to be only used to illustrate the present invention and not to limit the scope of protection of the present invention. After reading the contents of the present invention, the technician can make various changes or modifications to the present invention, and these equivalent changes and modifications also fall within the scope defined by the claims of the present invention.

Claims

1. A method for producing a low-voltage special-shaped conductor, characterized in that: The production method is applied to prepare a quadrilateral single-strand special-shaped conductor; the production method comprises the following steps: S100: Drawing and forming the conductor material through wire drawing die preparation to obtain a formed conductor with a specified cross-sectional shape; S200: cleaning the surface of the formed conductor; S300: Continuously inspecting at least two lateral contact surfaces of the formed conductor by continuous surface inspection to continuously evaluate the flatness index of the formed conductor in a preset length; S400: setting working parameters of the rapid polishing section based on the flatness index of the current formed conductor; S500: Rapid polishing of the lateral contact surface of the formed conductor of segment A; S600: Check the surface quality of the lateral contact surface of the formed conductor after polishing to ensure that it meets the predetermined requirements.

2. The production method according to claim 1, characterized in that: In step S300, the continuous surface detection adopts one or more of the following detection methods: visual detection, ultrasonic detection, and eddy current detection.

3. The production method according to claim 2, characterized in that: In steps S400 and S500 , the rapid polishing is performed by plasma polishing.

4. The production method according to claim 3, characterized in that: The working parameters of the rapid polishing process include at least one of the following parameters: working voltage, working current, gas pressure, polishing speed, polishing temperature, and plasma frequency.

5. The production method according to claim 4, characterized in that: The shaped conductor to be processed includes being controlled and guided by a guiding device, and the shaped conductor is moved along the length direction by clamping the non-contact surface of the shaped conductor, and the lateral contact surface of the shaped conductor is exposed to the processing space of the relevant processing device in steps S300, S400, and S500.

6. A low voltage special-shaped conductor, characterized in that: The special-shaped conductor is prepared by the production method as claimed in claim 5.

7. A low voltage cable, characterized in that: The low-voltage cable is prepared by twisting a plurality of special-shaped conductors as described in claim 6.

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