Substrate processing apparatus and substrate processing method

Abstract

The invention discloses a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes a processing tank, an acquisition unit that acquires an actual volume, an ultrapure water supply unit, a chemical liquid supply unit, and a control unit. The control unit executes: a first process for setting the supply flow rate of the ultrapure water and the chemical solution to be supplied to the processing tank on the basis of supply data defining the supply flow rate of the ultrapure water and the chemical solution corresponding to the actual volume and the actual volume acquired by the acquisition unit; a second process in which the ultrapure water and the chemical solution are respectively supplied to the processing tank in a state in which the processing tank is filled with the ultrapure water in advance according to the set supply flow rate until the concentration of the mixed solution in the processing tank reaches a predetermined value; a third treatment in which the supply of the ultrapure water and the chemical solution is stopped after the concentration of the mixed solution reaches a predetermined value; and a fourth treatment for replacing the mixed solution in the treatment tank with ultrapure water after a predetermined time has elapsed since the supply of the ultrapure water and the chemical solution has stopped.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing device and a substrate processing method. Background Art

[0002] Patent document 1 discloses a substrate processing device that processes a substrate disposed in a processing tank by controlling a pure water supply unit that supplies pure water to the processing tank and a substrate processing liquid supply unit that supplies a substrate processing liquid to the processing tank. The substrate processing device performs the following processes: supplying a substrate processing liquid to a processing tank filled with pure water to replace the pure water with the substrate processing liquid, thereby diluting and modulating the substrate processing liquid; and determining the immersion time of the substrate in the substrate processing liquid based on the concentration of the substrate processing liquid during the dilution and modulation.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 8-010673 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] The present disclosure describes a substrate processing apparatus and a substrate processing method that can suppress variations in processing states of substrates while maintaining processing efficiency of substrates regardless of the number of substrates processed in a processing bath.

[0008] Solutions for solving problems

[0009] An example of a substrate processing device includes: a processing tank, which is configured to use a mixture of ultrapure water and at least one chemical liquid to process at least one substrate; an acquisition unit, which is configured to acquire the actual volume of the liquid in the processing tank, that is, the actual volume; an ultrapure water supply unit, which is configured to supply ultrapure water to the processing tank; a chemical liquid supply unit, which is configured to supply at least one chemical liquid to the processing tank; and a control unit. The control unit is configured to perform the following processes: a first process, setting the supply flow rate of ultrapure water and the supply flow rate of at least one chemical liquid supplied to the treatment tank based on supply data that specifies the supply flow rates of ultrapure water and at least one chemical liquid corresponding to the actual volume and the actual volume acquired by the acquisition unit; a second process, controlling the ultrapure water supply unit and the chemical liquid supply unit to supply ultrapure water and at least one chemical liquid to the treatment tank that is pre-filled with ultrapure water to a full capacity indicating that the treatment tank is full, respectively, according to the supply flow rates set in the first process, until the concentration of the mixed liquid in the treatment tank reaches a specified value; a third process, controlling the ultrapure water supply unit and the chemical liquid supply unit to stop the supply of ultrapure water and at least one chemical liquid after the concentration of the mixed liquid in the treatment tank reaches a specified value in the second process; and a fourth process, controlling the ultrapure water supply unit to supply ultrapure water to the treatment tank after a specified time has passed since the supply of ultrapure water and at least one chemical liquid was stopped in the third process to replace the mixed liquid in the treatment tank with ultrapure water.

[0010] Effects of the Invention

[0011] According to the substrate processing apparatus and substrate processing method of the present disclosure, it is possible to suppress variations in processing states of substrates while maintaining processing efficiency of the substrates regardless of the number of substrates processed in the processing bath. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a top view showing an example of a substrate processing system.

[0013] Figure 2 This is a schematic diagram showing an example of a substrate cleaning device.

[0014] Figure 3 This is a block diagram showing an example of the main parts of the substrate processing system.

[0015] Figure 4 This is a diagram showing an example of supply data defining the supply flow rates of ultrapure water and chemical solution according to the actual volume of the treatment tank.

[0016] Figure 5 This is a schematic diagram showing an example of the hardware configuration of the controller.

[0017] Figure 6 This is a flowchart for explaining an example of a substrate processing procedure.

[0018] Figure 7 (a) is a diagram showing an example of the state of the treatment tank during the mixed liquid supply period. Figure 7 (b) is a diagram showing an example of the state of the processing tank during immersion of the substrate. Figure 7 (c) is a diagram showing an example of the state of the treatment tank during the supply of ultrapure water. Figure 7 (d) is a graph showing an example of changes in the concentration of the mixed solution in the treatment tank according to the treatment time.

[0019] Figure 8 This is a graph showing an example of changes in the concentration of the mixed solution in the processing tank according to the processing time when there are 100 substrates and 3 substrates.

[0020] Fig. 9 (a) is a graph showing an example of changes in the etching rate of substrates with respect to the number of substrates processed when a mixed solution of a certain concentration is supplied to the processing tank at a certain flow rate for a certain period of time without considering the actual volume of the processing tank. Fig. 9 (b) is a graph showing an example of a change in the etching rate of the substrate with respect to the number of sheets processed when the supply flow rate of pure water and chemical solution is changed to a certain concentration according to the actual volume of the processing tank and the pure water and chemical solution are supplied to the processing tank for a certain period of time.

[0021] Fig.10 This is a schematic diagram showing another example of the substrate cleaning apparatus.

[0022] Fig.11 This is a schematic diagram showing another example of the substrate cleaning apparatus.

[0023] Fig.12 This is a schematic diagram showing another example of the substrate cleaning apparatus. DETAILED DESCRIPTION

[0024] In the following description, the same reference numerals are used for the same elements or elements having the same functions, and repeated descriptions are omitted. In addition, in this specification, when describing the top, bottom, right, and left of the figure, it is set to be based on the direction of the reference numerals in the figure.

[0025] First, refer to Figure 1 The structure of the substrate processing system 1 (substrate processing device) is described below. The substrate processing system 1 includes a carrier loading and unloading unit 2, a batch forming unit 3, a batch loading unit 4, a batch processing unit 5 (substrate processing device), and a controller Ctr (control unit, acquisition unit, liquid medicine flow rate regulating unit, ultrapure water flow rate regulating unit).

[0026] The carrier loading and unloading section 2 includes a stage 2a, a loading platform 2b, a conveying mechanism 2c, and a stocking platform 2d. The stage 2a is configured to be able to load a plurality of carriers 6. The stage 2b is configured to be able to load one carrier 6. The conveying mechanism 2c is located between the stage 2a and the loading platform 2b. The conveying mechanism 2c is configured to operate based on an operation signal from a controller Ctr, and to convey the carrier 6 between the stage 2a, the loading platform 2b, and the stocking platform 2d. The stocking platform 2d is configured to temporarily store the carrier 6.

[0027] The carrier 6 is configured to accommodate a plurality of (for example, 25) substrates W arranged vertically in a horizontal posture. In the present specification, the horizontal posture refers to the posture in which the main surface of the substrate W is in a horizontal direction. The substrate W may be in the shape of a circular plate, or in the shape of a polygon or other plate other than a circle. The substrate W may have a cutout portion formed by a portion being cut out. The cutout portion may be, for example, a notch (a U-shaped, V-shaped, etc. groove), or a straight portion extending in a straight line (the so-called oriented plane). The substrate W may be, for example, a semiconductor substrate (silicon wafer), a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, and various other substrates. The diameter of the substrate W may be, for example, about 200 mm to 450 mm.

[0028] Each carrier 6 includes a sensor SE1 (acquisition unit) configured to acquire the number of substrates W accommodated in the carrier 6. The sensor SE1 may be configured to detect the presence or absence of a substrate W supported by a support groove provided in the carrier 6, and count the number of substrates W in the carrier 6. The sensor SE1 is configured to send data on the acquired number of substrates W to the controller Ctr.

[0029] The batch forming unit 3 includes a transport mechanism 3 a configured to take out one or more substrates W from one or more carriers 6 to form one batch. A plurality of (eg, 50) substrates W constituting one batch are processed simultaneously in the batch processing unit 5 .

[0030] When the batch forming unit 3 takes out one or more substrates W from each of the plurality of carriers 6, each sensor SE1 acquires the number of substrates W taken out from the corresponding carrier 6, and transmits data of the number of substrates W to the controller Ctr. The controller Ctr will be described in detail later, and the controller Ctr calculates the total number of substrates W constituting one batch in the batch forming unit 3 based on the received data.

[0031] The transport mechanism 3a is configured to operate based on an operation signal from the controller Ctr to change the posture of the substrate W between a horizontal posture and a vertical posture during the transport of the substrate W. In this specification, the vertical posture refers to a posture in which the main surface of the substrate W is along the vertical direction.

[0032] The conveying mechanism 3a, for example, takes out one substrate W from the carrier 6 placed on the mounting table 2b, changes the posture of the substrate W to a vertical posture, and conveys the substrate W in the vertical posture to the batch mounting section 4. The conveying mechanism 3a repeats this to form one batch (a plurality of substrates W arranged in a vertical posture in front and behind) in the batch mounting section 4. On the other hand, the conveying mechanism 3a, for example, takes out one substrate W from the batch placed on the batch mounting section 4, changes the posture of the substrate W to a horizontal posture, and conveys the substrate W in the horizontal posture to the carrier 6 on the mounting table 2b. The conveying mechanism 3a repeats this to store all the substrates W constituting the batch in one or more carriers 6.

[0033] The batch placement unit 4 includes a placement table 4a for temporarily placing the batches transferred between the batch forming unit 3 and the batch processing unit 5. The placement table 4a may include a pre-processing batch placement table 4b configured to place the batches before being processed by the batch processing unit 5, and a post-processing batch placement table 4c configured to place the batches after being processed by the batch processing unit 5.

[0034] The batch processing unit 5 is configured to treat a plurality of substrates W arranged in a vertical orientation as one batch and perform processes such as etching, cleaning, and drying. The batch processing unit 5 includes a transport mechanism 7 , a drying processing device 8 , a cleaning processing device 9 , and a plurality of liquid processing devices 10 .

[0035] like Figure 1 As shown in the example, the transport mechanism 7 is configured to operate based on an operation signal from the controller Ctr, and to transport the batches between the batch loading unit 4, the drying processing device 8, the cleaning processing device 9, and the plurality of liquid processing devices 10. The transport mechanism 7 includes a rail 7a, a moving body 7b, and a holding body 7c. The rail 7a is configured to extend between the batch loading unit 4 and the batch processing unit 5. The moving body 7b is configured to be movable along the rail 7a. The holding body 7c is provided on the moving body 7b, and is configured to hold the batch (a plurality of substrates W arranged in a vertical posture in front and behind).

[0036] The drying processing device 8 is configured to operate based on an operation signal from the controller Ctr, and uses a drying processing gas (for example, isopropyl alcohol, etc.) to perform a drying process on the substrate W. The cleaning processing device 9 is configured to operate based on an operation signal from the controller Ctr, and uses a cleaning processing liquid and a drying gas to perform a cleaning process on the holder 7c.

[0037] The liquid processing apparatus 10 is configured to process a substrate W using a mixed liquid L obtained by mixing a chemical solution L1 and ultrapure water (DIW: deionized water) L2 (refer to Figure 2 ). The mixed liquid L can include, for example, an alkaline mixed liquid or an acidic mixed liquid.

[0038] The alkaline mixed liquid can include, for example, SC-1 solution (a mixed solution of ammonium hydroxide, hydrogen peroxide water, and ultrapure water), TMAH (a mixed solution of tetramethylammonium hydroxide and ultrapure water), NC-2 solution (choline (trimethyl-2-hydroxyethylammonium hydroxide aqueous solution) (Japanese: コリン(トリメチル-2-ヒドロキシエチルアンモニウムハイドロオキサイド水溶液)), hydrogen peroxide water, and ultrapure water), etc. In addition, when using SC-1 solution as the mixed liquid L, the concentration of ammonium hydroxide can be about 28 wt% - 30 wt%, and the concentration of hydrogen peroxide water can be about 30 wt% - 32 wt%.

[0039] The acidic mixed liquid can include, for example, SC-2 solution (a mixed solution of hydrochloric acid, hydrogen peroxide water, and ultrapure water), HF solution (a mixed solution of hydrofluoric acid and ultrapure water), DHF solution (dilute hydrofluoric acid) (a mixed solution of hydrofluoric acid and ultrapure water), etc. In addition, when using DHF solution as the mixed liquid L, the concentration of hydrofluoric acid can be about 50 wt%, and the mixing ratio of hydrofluoric acid to ultrapure water can be about 1:50 - 1:1000.

[0040] [Details of the liquid processing apparatus]

[0041] Here, with reference to Figure 2 , the details of the liquid processing apparatus 10 will be described. The liquid processing apparatus 10 includes a chemical solution supply unit 20, an ultrapure water supply unit 30, a mixing unit 40, and a processing unit 50.

[0042] The chemical solution supply unit 20 includes a liquid source 21, a gas source 22, a pressure regulating unit 23 (chemical solution flow rate regulating unit), a tank T (chemical solution storage unit), valves V1, V2, and a sensor SE2 (chemical solution flow rate regulating unit). The liquid source 21 is configured to store the chemical solution L1 that constitutes the mixed liquid L. The liquid source 21 is connected to the tank T via a pipe D1. A valve V1 is provided in the pipe D1.

[0043] The gas source 22 is configured to store an inert gas (e.g., nitrogen). The gas source 22 is connected to the tank T via a pipe D2. In the pipe D1, the pressure regulating unit 23 and the valve V2 are provided in sequence from the upstream side to the downstream side.

[0044] The pressure regulating unit 23 is configured to operate based on the operation signal from the controller Ctr, and to control the pressure of the inert gas supplied from the gas source 22 in a manner proportional to the electrical signal. That is, the pressure regulating unit 23 is configured to be able to adjust the pressure of the inert gas supplied into the tank T. The pressure regulating unit 23 may be, for example, an electropneumatic regulator configured to steplessly control the pressure of the inert gas supplied from the gas source 22 in a manner proportional to the electrical signal.

[0045] The tank T is configured to temporarily store the liquid medicine L1 supplied from the liquid source 21. The tank T is configured to discharge the liquid medicine L1 inside to the downstream side through the pipe D3 by the pressure of the inert gas supplied from the gas source 22. That is, the tank T is configured to discharge the liquid medicine L1 to the downstream side at a higher flow rate as the pressure of the inert gas supplied from the gas source 22 is higher, and to discharge the liquid medicine L1 to the downstream side at a lower flow rate as the pressure of the inert gas supplied from the gas source 22 is lower. The tank T is connected to the mixing unit 40 via the pipe D3. The pipe D3 is provided with a sensor SE2.

[0046] The valves V1 and V2 are each configured to be opened and closed based on an operation signal from a controller Ctr.

[0047] The sensor SE2 is configured to measure the flow rate of the medicinal liquid L1 flowing in the pipe D3. The sensor SE2 is configured to send data of the measured flow rate to the controller Ctr. The controller Ctr will be described in detail later. The controller Ctr is configured to control the pressure regulating unit 23 based on the received data to adjust the flow rate of the medicinal liquid L1 so that the flow rate of the medicinal liquid L1 measured by the sensor SE2 becomes a predetermined set flow rate.

[0048] The ultrapure water supply unit 30 includes a liquid source 31, a heating unit 32, a pressure regulator 33 (ultrapure water flow regulator), and a sensor SE3 (ultrapure water flow regulator). The liquid source 31 is configured to store ultrapure water L2 constituting the mixed liquid L. The liquid source 31 is connected to the mixing unit 40 via a pipe D4. The pressure regulator 33 and the sensor SE3 are sequentially provided in the pipe D4 from the upstream side to the downstream side.

[0049] The heating unit 32 is configured to operate based on an operation signal from the controller Ctr to heat the ultrapure water L2 flowing in the pipe D4. The heating unit 32 can also be configured to change the heating amount of the ultrapure water L2 according to the type of liquid medicine L1 to be mixed with the ultrapure water L2. For example, when SC-1 is generated as the mixed liquid L, the heating unit 32 can heat the ultrapure water L2 so that the processing temperature of the substrate W processed by the mixed liquid L becomes about 20°C to 70°C. When DHF is generated as the mixed liquid L, the heating unit 32 can heat the ultrapure water L2 so that the processing temperature of the substrate W processed by the mixed liquid L becomes about 20°C to 40°C.

[0050] The pressure regulating unit 33 is configured to operate based on the action signal from the controller Ctr, and to control the pressure of the ultrapure water L2 supplied from the liquid source 31 in a manner proportional to the electrical signal. That is, the pressure regulating unit 33 is configured to be able to adjust the pressure of the ultrapure water L2 supplied to the mixing unit 40. The pressure regulating unit 33 may be, for example, a constant pressure valve configured to set the pressure on the downstream side (secondary side pressure) to a predetermined set pressure regardless of the fluctuation of the pressure (primary side pressure) of the ultrapure water L2 supplied from the liquid source 31.

[0051] The sensor SE3 is configured to measure the flow rate of the ultrapure water L2 flowing in the pipe D4. The sensor SE3 is configured to send data of the measured flow rate to the controller Ctr. The controller Ctr will be described in detail later. The controller Ctr is configured to control the pressure regulating unit 33 based on the received data to adjust the flow rate of the ultrapure water L2 so that the flow rate of the ultrapure water L2 measured by the sensor SE3 becomes a predetermined set flow rate.

[0052] The mixing unit 40 is configured to mix the chemical solution L1 supplied through the pipe D3 and the ultrapure water L2 supplied through the pipe D4 and discharge the mixed solution L to the downstream side. The mixing unit 40 may be, for example, a mixing valve. The mixing unit 40 is connected to a nozzle N (described later) via a pipe D5.

[0053] The processing section 50 includes a processing tank 51 and a holding member 52. The processing tank 51 is configured to store the mixed liquid L supplied from the mixing section 40 via the pipe D5. The upper limit capacity of the liquid that can be stored in the processing tank 51, that is, the full capacity indicating that the processing tank 51 is full, is set according to the size of the processing tank 51. A plurality of nozzles N are arranged in the processing tank 51. Each nozzle N is connected to the pipe D5 and is configured to spray the mixed liquid L supplied through the pipe D5 into the processing tank 51.

[0054] The holding member 52 is configured to receive a batch from the conveying mechanism 7 and hold a plurality of substrates W constituting the batch in a vertical posture. The holding member 52 is connected to a driving mechanism not shown in the figure. The holding member 52 is configured to operate based on an operation signal from the controller Ctr and move up and down. The holding member 52 can, for example, move between a descending position in which the plurality of substrates W held are immersed in the mixed liquid L in the processing tank 51 and an ascending position in which the plurality of substrates W held are located above the processing tank 51. At the descending position, the plurality of substrates W held by the holding member 52 are processed by the mixed liquid L in the processing tank 51. On the other hand, at the ascending position, the plurality of substrates W held by the holding member 52 are transferred to and from the conveying mechanism 7.

[0055] The holding member 52 includes a back plate 52a and a plurality of arms 52b. The back plate 52a is in the shape of a flat plate extending in the up-down direction. The plurality of arms 52b are connected to the lower end of the back plate 52a and extend in a direction orthogonal to the main surface of the back plate 52a and in the horizontal direction. The plurality of arms 52b are arranged at a predetermined interval in the width direction of the back plate 52a.

[0056] A plurality of grooves (not shown) arranged in the extending direction of the arm 52b are provided at substantially equal intervals on the upper surface of the arm 52b. By placing the peripheral edge of the substrate W in a vertical posture in the grooves, the arm 52b holds the substrate W while maintaining the vertical posture. That is, the arm 52b can support the plurality of substrates W in a vertical posture while arranging the plurality of substrates W in the extending direction of the arm 52b.

[0057] [Controller details]

[0058] Next, refer to Figure 3 The controller Ctr is described in more detail. The controller Ctr has a reading unit M1, a storage unit M2, a processing unit M3, and an indication unit M4 as functional modules. Regarding these functional modules, the functions of the controller Ctr are divided into multiple modules just for convenience, which does not necessarily mean that the hardware constituting the controller Ctr is divided into such modules. Each functional module is not limited to being implemented by the execution of a program, and can also be implemented by a dedicated circuit (such as a logic circuit) or an integrated circuit (ASIC: application specific integrated circuit) that integrates the dedicated circuit.

[0059] The reading unit M1 is configured to read a program from a computer-readable recording medium RM. The recording medium RM records a program for causing each unit of the substrate processing system 1 to operate. The recording medium RM may be, for example, a semiconductor memory, an optical recording disk, a magnetic recording disk, or a magneto-optical recording disk. In this specification, each unit of the substrate processing system 1 may include valves V1, V2, pressure regulating units 23, 33, a heating unit 32, a holding member 52, and the like.

[0060] The storage unit M2 is configured to store various data. For example, the storage unit M2 may store a program read from the recording medium RM by the reading unit M1, setting parameters (so-called processing recipes) for operating each unit of the substrate processing system 1, and setting data input by an operator via an external input device (not shown).

[0061] The storage unit M2 may also receive data on the number of substrates W acquired by the sensor SE1, data on the flow rates of the chemical solution L1 and the ultrapure water L2 measured by the sensors SE2 and SE3, and store the data. Figure 4The supply data is the data obtained by defining the supply flow rates of the chemical solution L1 and the ultrapure water L2 according to the actual volume of the treatment tank 51 .

[0062] Here, refer to Figure 4 As described above, the full capacity of the liquid that can be stored in the processing tank 51 is set in the processing tank 51. Therefore, when the substrate W is arranged in the processing tank 51, the actual volume (actual volume) of the liquid stored in the processing tank 51 is reduced by an amount corresponding to the volume of the substrate W. For example, when the volume of each substrate W is about 5.5 ml (about 5.5 cm 3 ) and the full capacity of the processing tank 51 is 50 liters, if Figure 4 As shown in the example, when 10 substrates W are placed in the processing tank 51, the actual volume of the processing tank 51 becomes 49.5 liters. Similarly, when 100 substrates W are placed in the processing tank 51, the actual volume of the processing tank 51 becomes 44.5 liters.

[0063] The supply data maintains the actual volume of the processing tank 51 in correspondence with the supply flow rate of the chemical liquid L1 and the supply flow rate of the ultrapure water L2. Specifically, the actual volume of the processing tank 51 is kept in correspondence with the supply flow rate of the chemical liquid L1 and the supply flow rate of the ultrapure water L2 in such a way that the mixing ratio of the chemical liquid L1 and the ultrapure water L2 (the concentration of the mixed liquid L) is substantially the same in any actual volume. For example, the supply flow rate of the chemical liquid L1 and the supply flow rate of the ultrapure water L2 when the actual volume of the processing tank 51 is 44.5 liters (when the number of substrates W processed is 100) can be used as a reference, and the supply flow rate of the chemical liquid L1 and the supply flow rate of the ultrapure water L2 in other actual volumes can be calculated in a manner substantially the same as the mixing ratio at this time.

[0064] Regarding the supply flow rate of the chemical liquid L1 and the supply flow rate of the ultrapure water L2 when the number of substrates W to be processed is X, the parameter Q AX , Q BX , C X When they are respectively specified as follows:

[0065] Q AX : Supply flow rate of the chemical liquid L1 when the number of substrates W to be processed is X

[0066] Q BX : Supply flow rate of ultrapure water L2 when the number of substrates W to be processed is X

[0067] C X The actual volume of the processing tank 51 when the number of substrates W to be processed is X can be calculated based on the following equations 1 and 2.

[0068] Q AX=Q A100 ×C X / C 100 ···(1)

[0069] Q BX =Q AX ×Q B100 / Q A100 ···(2)

[0070] In addition, since the volumes of the substrates W are all substantially the same, the volume of one substrate W is measured in advance, and C is calculated by subtracting the total volume of the substrates W (the volume of each substrate W×the number of substrates W) from the full capacity of the processing tank 51. X .

[0071] exist Figure 4 In the example,

[0072] Q A100 :0.200L / min

[0073] Q B100 :60.0L / min

[0074] C 100 : 44.5 liters

[0075] C 10 : 49.5 liters,

[0076] Therefore, according to equations 1 and 2, equation Q A10 , Q B10 can be calculated as

[0077] Q A10 :0.222L / min

[0078] Q B10 : 66.7L / min.

[0079] also, Figure 4 The supply data illustrated in the example is data for every 10th substrate W to be processed, but the supply data may be data for every 1st substrate W to be processed.

[0080] return Figure 3 The processing unit M3 is configured to process various data. The processing unit M3 may be configured to generate an operation signal for operating each unit of the substrate processing system 1 based on various data stored in the storage unit M2, for example.

[0081] The processing unit M3 is configured to, when receiving data on the number of substrates W taken out from one or more carriers 6 by the batch forming unit 3 from the sensor SE1 of each carrier 6, sum up the numbers of substrates W to calculate the total number of substrates W. The total number of substrates W is the number of substrates W processed at one time in the processing tank 51 of the liquid processing apparatus 10 as one batch.

[0082] The processing unit M3 is configured to set the supply flow rate of the chemical solution L1 and the supply flow rate of the ultrapure water L2 according to the actual volume of the processing tank 51 based on the actual volume of the processing tank 51 and the supply data.

[0083] As an example, the processing unit M3 may use the calculated total number of substrates W as a key to search for Figure 4 The supply data in the form of a table as illustrated, in which the supply flow rate of the chemical liquid L1 and the supply flow rate of the ultrapure water L2 corresponding to the total number are determined and set. In this case, the supply data may be constructed by making correspondence between the number of substrates W processed, the actual volume of the processing tank 51 at that time, and the respective supply flow rates at that time. Moreover, the processing unit M3 may directly determine the supply flow rate of the chemical liquid L1 and the supply flow rate of the ultrapure water L2 without further calculating the actual volume of the processing tank 51 based on the calculated total number of substrates W. Since the number of substrates W processed and the actual volume of the processing tank 51 at that time are made correspondent in the supply data in this way, even when the respective supply flow rates are directly determined based on the total number of substrates W, it is deemed that the processing unit M3 sets the respective supply flow rates based on the actual volume of the processing tank 51 and the supply data.

[0084] As another example, the processing unit M3 may calculate the actual volume of the processing tank 51 by calculating the total volume of the substrates W based on the calculated total number of substrates W and subtracting the total volume of the substrates W from the full capacity of the processing tank 51. The processing unit M3 may also search for the actual volume of the processing tank 51 using the calculated actual volume of the processing tank 51 as a key item. Figure 4 The supply data in the form of a table as illustrated above determines the supply flow rate of the chemical solution L1 and the supply flow rate of the ultrapure water L2 corresponding to the actual volume, and sets these supply flow rates. In this case, the supply data may be constructed by corresponding the actual volume of the processing tank 51 to each supply flow rate at that time, and may not include the number of substrates W to be processed.

[0085] The processing unit M3 is configured to control the pressure regulating units 23 and 33 so as to supply the liquid medicine L1 and the ultrapure water L2 to the processing tank 51 via the mixing unit 40 according to the set supply flow rates. Specifically, the processing unit M3 is configured to control the pressure regulating unit 23 so that the flow rate of the liquid medicine L1 measured by the sensor SE2 becomes the set supply flow rate of the liquid medicine L1. Similarly, the processing unit M3 is configured to control the pressure regulating unit 33 so that the flow rate of the ultrapure water L2 measured by the sensor SE3 becomes the set supply flow rate of the ultrapure water L2.

[0086] In addition, the chemical liquid L1 and the ultrapure water L2 may be supplied to the processing tank 51 at a set flow rate after the number of substrates W constituting a batch is arranged in the processing tank 51 and the ultrapure water L2 is filled to the full capacity of the processing tank 51. At this time, the processing unit M3 may also use a concentration meter (not shown) to determine whether the concentration of the mixed liquid L obtained by mixing the chemical liquid L1 and the ultrapure water L2 has reached a predetermined value in the processing tank 51. The processing unit M3 may control the pressure regulating units 23 and 33 to stop the supply of the chemical liquid L1 and the ultrapure water L2 to the processing tank 51 after determining that the concentration of the mixed liquid L in the processing tank 51 has reached a predetermined value. The processing unit M3 may control the pressure regulating unit 33 to supply the ultrapure water L2 to the processing tank 51 after a predetermined time has passed since the supply of the chemical liquid L1 and the ultrapure water L2 to the processing tank 51 was stopped, so as to replace the mixed liquid L in the processing tank 51 with the ultrapure water L2.

[0087] The instruction unit M4 is configured to transmit an operation signal generated in the processing unit M3 to each unit of the substrate processing system 1 .

[0088] The hardware of the controller Ctr may be composed of, for example, one or more computers for control. Figure 5 As shown, the controller Ctr may include a circuit C1 as a hardware structure. The circuit C1 may be composed of circuit elements. The circuit C1 may include, for example, a processor C2, a memory C3, a storage device C4, a driver C5, and an input / output port C6.

[0089] The processor C2 may be configured to execute a program in cooperation with at least one of the memory C3 and the storage device C4, and to perform input and output of signals via the input / output port C6, thereby realizing the above-mentioned functional modules. The memory C3 and the storage device C4 may function as the storage unit M2. The driver C5 may be a circuit configured to drive each part of the substrate processing system 1 respectively. The input / output port C6 may be configured to relay the input and output of signals between the driver C5 and each part of the substrate processing system 1.

[0090] The substrate processing system 1 may have one controller Ctr or a controller group (control unit) composed of a plurality of controllers Ctr. When the substrate processing system 1 has a controller group, the carrier loading and unloading unit 2, the batch forming unit 3, the batch loading unit 4 and the batch processing unit 5 may be controlled by their respective controllers Ctr, or at least two of the carrier loading and unloading unit 2, the batch forming unit 3, the batch loading unit 4 and the batch processing unit 5 may be controlled by one controller Ctr. When the substrate processing system 1 has a controller group, the above-mentioned functional modules may be implemented by one controller Ctr or by a combination of two or more controllers Ctr. When the controller Ctr is composed of a plurality of computers (circuits C1), the above-mentioned functional modules may be implemented by one computer (circuit C1) or by a combination of two or more computers (circuits C1). Alternatively, the controller Ctr may have a plurality of processors C2. In this case, the above-mentioned functional modules may be implemented by one processor C2 or by a combination of two or more processors C2.

[0091] [Substrate processing method]

[0092] Next, refer to Figure 6 and Figure 7 A method of processing the substrate W using the mixed liquid L will be described.

[0093] First, the batch forming unit 3 takes out one or more substrates W from one or more carriers 6 and transports them to the pre-processing batch stage 4b, where a batch consisting of one or more substrates W is formed on the pre-processing batch stage 4b. At this time, the sensor SE1 of each carrier 6 sends data on the number of substrates W taken out from one or more carriers 6 by the batch forming unit 3 to the controller Ctr. The controller Ctr calculates the total number of substrates W constituting a batch ( Figure 6 Step S11).

[0094] Next, the controller Ctr calculates the total volume of the substrates W based on the total number of substrates W calculated in step S11, and subtracts the total volume of the substrates W from the full capacity of the processing tank 51, thereby calculating the actual volume ( Figure 6 Next, the controller Ctr sets the supply flow rate of the liquid medicine L1 and the supply flow rate of the ultrapure water L2 corresponding to the actual volume of the processing tank 51 based on the actual volume of the processing tank 51 and the supply data ( Figure 6 Step S13). In addition, when the supply flow rate of the chemical solution L1 and the supply flow rate of the ultrapure water L2 can be directly determined from the total number of substrates W calculated in step S11, step S12 may be omitted.

[0095] Next, the controller Ctr instructs the pressure regulator 33 to supply the ultrapure water L2 into the processing tank 51 until the processing tank 51 is filled to capacity ( Figure 6 In this state, the controller Ctr instructs the transport mechanism 7 to make the holding body 7c hold at least one substrate W and transport it to the liquid processing device 10. Next, the controller Ctr instructs the transport mechanism 7 to transfer at least one substrate W from the holding body 7c to the holding member 52 waiting above the processing tank 51. Next, the controller Ctr instructs the holding member 52 to lower the holding member 52 into the processing tank 51. As a result, the at least one substrate W held by the holding member 52 is immersed in the ultrapure water L2 ( Figure 6 In addition, the ultrapure water L2 overflowing from the treatment tank 51 may be received in an outer tank (overflow tank) not shown in the figure and provided outside the treatment tank 51.

[0096] Next, the controller Ctr instructs the pressure regulators 23 and 33 to supply the chemical solution L1 and the ultrapure water L2 to the treatment tank 51 at the supply flow rate set in step S13 ( Figure 6 Step S16 and Figure 7 (a)). At this time, since the treatment tank 51 is pre-filled with ultrapure water L2, when the mixed liquid L of the liquid L1 and the ultrapure water L2 is supplied to the treatment tank 51, Figure 7 As shown in (d) of FIG. 1 as the "mixed liquid supply period", the concentration of the mixed liquid L in the processing tank 51 increases at a certain speed. Here, since each supply flow rate is set according to the actual volume of the processing tank 51 in step S13, during the mixed liquid supply period, regardless of the number of substrates W arranged in the processing tank 51, the concentration of the mixed liquid L in the processing tank 51 increases at a substantially constant speed. In addition, at this time, the mixed liquid L overflowing from the processing tank 51 may also be received in an external tank not shown.

[0097] Next, when the controller Ctr determines that the concentration of the mixed liquid L in the treatment tank 51 has reached a predetermined value, the controller Ctr instructs the pressure regulating units 23 and 33 to stop the supply of the liquid medicine L1 and the ultrapure water L2 to the treatment tank 51. In addition, instead of making a determination based on the concentration of the mixed liquid L in the treatment tank 51, the supply of the liquid medicine L1 and the ultrapure water L2 to the treatment tank 51 may be stopped by determining whether a predetermined time has passed since the supply of the liquid medicine L1 and the ultrapure water L2 to the treatment tank 51 was started.

[0098] The controller Ctr maintains the supply stop state of the chemical liquid L1 and the ultrapure water L2 until a predetermined time has passed since the supply stop of the chemical liquid L1 and the ultrapure water L2 ( Figure 6Step S17 and Figure 7 (b)). That is, Figure 7 As exemplified as the “substrate immersion period” in (d), the substrate W in the processing tank 51 is maintained immersed in the mixed liquid L while the concentration of the mixed liquid L in the processing tank 51 is constant.

[0099] Next, the controller Ctr instructs the pressure regulator 33 to supply the ultrapure water L2 into the treatment tank 51 at a predetermined supply flow rate ( Figure 6 Step S18 and Figure 7 (c)). At this time, since the treatment tank 51 is filled with the mixed liquid L, when the ultrapure water L2 is supplied to the treatment tank 51, Figure 7 As exemplified as the "ultrapure water supply period (rinsing period)" in (d) above, the concentration of the mixed liquid L in the processing tank 51 decreases at a constant rate. That is, during this period, the substrate W in the processing tank 51 is rinsed with the ultrapure water L2.

[0100] Next, the controller Ctr instructs the holding member 52 to move the holding member 52 upward toward the processing tank 51. Thus, the substrate W is taken out from the processing tank 51 ( Figure 6 Step S19).

[0101] After that, the controller Ctr instructs the conveying mechanism 7 to deliver the substrate W from the holding member 52 waiting above the processing tank 51 to the holding body 7c. Next, the controller Ctr instructs the conveying mechanism 7 to deliver the substrate W from the holding body 7c to the processed batch mounting table 4c after the holding body 7c is transported to the processed batch mounting table 4c. Next, the controller Ctr instructs the batch forming unit 3 to store the substrate W on the processed batch mounting table 4c in the carrier 6. Through the above, the processing of the substrate W is completed.

[0102] [effect]

[0103] In addition, the fewer the number of substrates W processed in the processing tank 51, the smaller the volume ratio of the substrates W in the processing tank 51, and the larger the actual volume of the liquid in the processing tank 51. On the other hand, the more the number of substrates W processed in the processing tank 51, the larger the volume ratio of the substrates W in the processing tank 51, and the smaller the actual volume of the liquid in the processing tank 51. Therefore, in a state where the processing tank 51 is pre-filled with ultrapure water L2, when a mixed liquid L of a certain concentration is supplied to the processing tank 51 at a certain flow rate for a certain period of time without considering the actual volume, the fewer the number of substrates W processed in the processing tank 51, the larger the actual volume, and the easier it is for the mixed liquid L to be diluted by the ultrapure water L2 in the processing tank 51. In other words, the fewer the number of substrates W processed in the processing tank 51, the larger the amount of ultrapure water L2 pre-filled in the processing tank 51, and therefore, when supplying the mixed liquid L, as Figure 8 As shown by the solid line in , the concentration of the mixed liquid L is difficult to increase. Therefore, the fewer the number of substrates W processed in the processing tank 51, the slower the processing speed of the substrates W. On the other hand, in a state where the processing tank 51 is pre-filled with ultrapure water L2, when a mixed liquid L of a certain concentration is supplied to the processing tank 51 at a certain flow rate for a certain time without considering the actual volume, the more substrates W are processed in the processing tank 51, the smaller the actual volume, and the more difficult it is for the mixed liquid L to be diluted by the ultrapure water L2 in the processing tank 51. In other words, the more substrates W are processed in the processing tank 51, the smaller the amount of ultrapure water L2 pre-filled in the processing tank 51. Therefore, when the mixed liquid L is supplied, as shown in FIG. Figure 8 As shown by the dotted line in FIG. 5 , the concentration of the mixed solution L tends to increase. Therefore, the more substrates W are processed in the processing tank 51, the faster the processing speed of the substrates W is. In this way, the processing state (e.g., etching rate) of the substrates W may vary depending on the number of substrates W processed (see FIG. 5 ). Fig. 9 (a)). In order to avoid deviations in the processing state of the substrate W, for example, it is also considered to change the processing time of the substrate W (during the supply of the mixed solution, the immersion of the substrate, or the supply of ultrapure water). However, in this case, sometimes the processing time of the substrate W becomes longer in accordance with the number of substrates W processed, which may affect the processing efficiency of the substrate W.

[0104] However, according to the above example, supply data that specifies the supply flow rates of the chemical liquid L1 and the ultrapure water L2 corresponding to the actual volume of the processing tank 51 is prepared in advance, and the supply flow rate of the chemical liquid L1 and the supply flow rate of the ultrapure water L2 supplied to the processing tank 51 are set based on the actual volume and supply data obtained when processing the substrate W. Therefore, even when the processing time of the substrate W is set to a certain value, regardless of the number of substrates W processed in the processing tank 51, the concentration of the mixed liquid L in the processing tank 51 changes at the same rate. Therefore, regardless of the number of substrates processed in the processing tank, it is possible to maintain the processing efficiency of the substrates, such as Fig. 9 (b) illustrates the example of suppressing the variation in the processing state (etching rate) of the substrate.

[0105] According to the above example, the actual volume of the processing tank 51 is calculated by subtracting the total volume of the substrates W arranged in the processing tank 51 from the full volume of the processing tank 51. In this case, the actual volume can be easily obtained.

[0106] According to the above example, the total volume of the substrates W is calculated based on the number of substrates W processed simultaneously in the processing tank 51. Generally, the sizes of the substrates W processed in the processing tank 51 are substantially the same, so the actual volume can be more easily obtained by obtaining the volume of one substrate W in advance and counting the number of substrates W when the substrates W are processed.

[0107] According to the above example, the controller Ctr controls the pressure regulating unit 23 based on the measurement value of the sensor SE2 so that the chemical liquid L1 is supplied to the processing tank 51 at the supply flow rate set based on the actual volume of the processing tank 51. In addition, according to the above example, the controller Ctr controls the pressure regulating unit 33 based on the measurement value of the sensor SE3 so that the ultrapure water L2 is supplied to the processing tank 51 at the supply flow rate set based on the actual volume of the processing tank 51. In these cases, the chemical liquid L1 and the ultrapure water L2 can be more accurately delivered at the set supply flow rate.

[0108] According to the above example, the chemical liquid L1 and the ultrapure water L2 are mixed in the mixing unit 40 and supplied to the processing tank 51 as the mixed liquid L. In this case, since the mixed liquid L obtained by mixing the chemical liquid L1 and the ultrapure water L2 in advance is supplied to the processing tank 51, it is difficult to generate uneven concentration of the mixed liquid L in the processing tank 51. Therefore, the substrate W can be processed with higher accuracy.

[0109] [Modifications]

[0110] The disclosure in this specification should be considered to be illustrative in all aspects and not restrictive. Various omissions, substitutions, and changes may be made to the above examples without departing from the scope of the claims and the gist thereof.

[0111] (1) Figure 4 The supply data exemplified is a table of data obtained by correlating the number of substrates W to be processed, the actual volume of the processing tank 51, the supply flow rate of the chemical solution L1, and the supply flow rate of the ultrapure water L2. However, the supply data may also be an arithmetic expression for calculating the supply flow rate of the chemical solution L1 and the supply flow rate of the ultrapure water L2 as in equations 1 and 2.

[0112] (2) Fig.10 As shown in the example, the liquid medicine supply unit 20 may include a flow rate adjustment unit 24 (liquid medicine flow rate adjustment unit) instead of the pressure adjustment unit 23 and the sensor SE2. The flow rate adjustment unit 24 may be provided in the pipe D3. The flow rate adjustment unit 24 is configured to operate based on an operation signal from the controller Ctr and discharge the liquid medicine L1 in the tank T to the downstream side at a predetermined flow rate. Fig.10 As shown, the ultrapure water supply unit 30 may also include a flow regulator 34 (ultrapure water flow regulator) instead of the pressure regulator 33 and the sensor SE3. The flow regulator 34 may be provided in the pipe D4. The flow regulator 34 is configured to operate based on an operation signal from the controller Ctr to discharge the ultrapure water L2 in the liquid source 31 to the downstream side at a predetermined flow rate. The flow regulators 24 and 34 may be, for example, liquid flow controllers (LFC: Liquid Flow Controller).

[0113] (3) Fig.11 As shown, the liquid processing device 10 may also include a sensor SE4 (measurement unit). The sensor SE4 may be provided in the pipe D5. The sensor SE4 may be configured to measure the concentration of the mixed liquid L generated by the mixing unit 40 and before being supplied to the processing tank 51. The sensor SE4 may be configured to send data on the measured concentration of the mixed liquid L to the controller Ctr.

[0114] The controller Ctr may also control the pressure regulating units 23 and 33 based on the data received from the sensor SE4 so that the concentration of the mixed solution L measured by the sensor SE4 becomes the concentration of the mixed solution L obtained based on each supply flow rate set according to the actual volume of the treatment tank 51. In this case, feedback control is performed so that the concentration of the mixed solution L supplied to the treatment tank 51 becomes a predetermined concentration (based on the concentration of each set supply flow rate). Therefore, the chemical solution L1 and the ultrapure water L2 can be more accurately delivered at each set supply flow rate.

[0115] (4) Fig.12As shown, the liquid processing apparatus 10 may also include a stirring section 60. The stirring section 60 is configured to stir the mixed liquid L generated by the mixing section 40 and then supply it to the processing tank 51. The stirring section 60 may be, for example, a cyclone mixer that can stir while conveying the mixed liquid L. In this case, the mixed liquid L obtained by mixing the chemical liquid L1 and the ultrapure water L2 in advance and stirring is supplied to the processing tank 51, so that the concentration of the mixed liquid L in the processing tank 51 is less likely to be uneven. Therefore, the substrate W can be processed with higher precision.

[0116] [Other examples]

[0117] Example 1. An example of a substrate processing device comprises: a processing tank, which is configured to use a mixture of ultrapure water and at least one chemical liquid to process at least one substrate; an acquisition unit, which is configured to acquire the actual volume of the liquid in the processing tank, that is, the actual volume; an ultrapure water supply unit, which is configured to supply ultrapure water to the processing tank; a chemical liquid supply unit, which is configured to supply at least one chemical liquid to the processing tank; and a control unit. The control unit is configured to perform the following processes: a first process, setting the supply flow rate of ultrapure water and the supply flow rate of at least one chemical liquid supplied to the treatment tank based on supply data that specifies the supply flow rates of ultrapure water and at least one chemical liquid corresponding to the actual volume and the actual volume acquired by the acquisition unit; a second process, controlling the ultrapure water supply unit and the chemical liquid supply unit to supply ultrapure water and at least one chemical liquid to the treatment tank that is pre-filled with ultrapure water to a full capacity indicating that the treatment tank is full, respectively, according to the supply flow rates set in the first process, until the concentration of the mixed liquid in the treatment tank reaches a specified value; a third process, controlling the ultrapure water supply unit and the chemical liquid supply unit to stop the supply of ultrapure water and at least one chemical liquid after the concentration of the mixed liquid in the treatment tank reaches a specified value in the second process; and a fourth process, controlling the ultrapure water supply unit to supply ultrapure water to the treatment tank after a specified time has passed since the supply of ultrapure water and at least one chemical liquid was stopped in the third process to replace the mixed liquid in the treatment tank with ultrapure water.

[0118] In addition, the fewer the number of substrates processed in the processing tank, the smaller the volume ratio of the substrate in the processing tank, and the larger the actual volume of the liquid in the processing tank. On the other hand, the more the number of substrates processed in the processing tank, the larger the volume ratio of the substrate in the processing tank, and the smaller the actual volume of the liquid in the processing tank. Therefore, in the state where the processing tank is pre-filled with ultrapure water, without considering the actual volume, a mixed liquid of a certain concentration is supplied to the processing tank at a certain flow rate for a certain time, the fewer the number of substrates processed in the processing tank, the larger the actual volume, and the easier it is for the mixed liquid to be diluted by the ultrapure water in the processing tank. In this case, the concentration of the mixed liquid in the processing tank is difficult to rise. Therefore, the fewer the number of substrates processed in the processing tank, the slower the processing speed of the substrate. On the other hand, in the state where the processing tank is pre-filled with ultrapure water, without considering the actual volume, a mixed liquid of a certain concentration is supplied to the processing tank at a certain flow rate for a certain time, the more the number of substrates processed in the processing tank, the smaller the actual volume, and the more difficult it is for the mixed liquid to be diluted by the ultrapure water in the processing tank. In this case, the concentration of the mixed liquid in the processing tank is likely to increase. Therefore, the more substrates are processed in the processing tank, the faster the processing speed of the substrates. In this way, the processing state of the substrate may deviate according to the number of substrates processed. In order to avoid the deviation of the processing state of the substrate, for example, it is also considered to change the processing time of the substrate (the supply time of the mixed liquid to the processing tank, the immersion time of the substrate in the mixed liquid, or the discharge time of the mixed liquid from the processing tank). However, in this case, sometimes the processing time of the substrate becomes longer according to the number of substrates processed, which may affect the processing efficiency of the substrate.

[0119] However, according to the device of Example 1, supply data that specifies the supply flow rates of ultrapure water and at least one chemical liquid corresponding to the actual volume is prepared in advance, and the supply flow rate of ultrapure water and at least one chemical liquid supplied to the processing tank are set based on the actual volume and supply data acquired by the acquisition unit when processing the substrate. Therefore, even when the processing time of the substrate is set to a certain value, the concentration of the mixed liquid in the processing tank changes to the same extent regardless of the number of substrates processed in the processing tank. Therefore, regardless of the number of substrates processed in the processing tank, the deviation of the processing state of the substrate can be suppressed while maintaining the processing efficiency of the substrate.

[0120] Example 2 In the apparatus of Example 1, the acquisition unit may be configured to acquire, as the actual volume, a value obtained by subtracting a total volume of at least one substrate disposed in the processing tank from a full volume indicating that the processing tank is full. In this case, the actual volume can be easily obtained.

[0121] Example 3. In the apparatus of Example 2, the acquisition unit may be configured to calculate the total volume based on the number of substrates processed simultaneously in the processing tank among at least one substrate. Usually, the sizes of the substrates processed in the processing tank are substantially the same. Therefore, the actual volume can be more easily obtained by acquiring the volume of one substrate in advance and counting the number of substrates when the substrate is processed.

[0122] Example 4. In the apparatus of any one of Examples 1 to 3, the mixed liquid may be dilute hydrofluoric acid mixed with ultrapure water and hydrofluoric acid as at least one chemical liquid, and the processing tank may be configured to process at least one substrate using the mixed liquid at 20°C to 40°C.

[0123] Example 5. In the device of any one of Examples 1 to 3, the mixed liquid may be an SC-1 liquid formed by mixing ultrapure water with at least one of ammonium hydroxide and hydrogen peroxide solution as a chemical liquid, and the treatment tank is configured to treat at least one substrate using the mixed liquid at 20°C to 70°C.

[0124] Example 6. In the device of any one of Examples 1 to 5, the liquid medicine supply unit may include: a liquid medicine storage unit configured to store at least one liquid medicine; and a liquid medicine flow rate regulator configured to deliver at least one liquid medicine in the storage unit to the treatment tank at a set predetermined flow rate. In this case, the liquid medicine flow rate regulator can more accurately deliver the liquid medicine at the liquid medicine supply flow rate set in the first treatment.

[0125] Example 7. In the device of any one of Examples 1 to 6, the ultrapure water supply unit may include: an ultrapure water storage unit configured to store ultrapure water; and an ultrapure water flow rate regulator configured to deliver the ultrapure water in the storage unit to the treatment tank at a set prescribed flow rate. In this case, the ultrapure water flow rate regulator can deliver the ultrapure water more accurately at the supply flow rate of ultrapure water set in the first treatment.

[0126] Example 8. In the apparatus of any one of Examples 1 to 7, a mixing unit may be further provided, the mixing unit being configured to mix the ultrapure water supplied from the ultrapure water supply unit with at least one chemical liquid supplied from the chemical liquid supply unit, and supply the mixed liquid to the processing tank as a mixed liquid. In this case, the mixed liquid obtained by premixing the ultrapure water and the chemical liquid is supplied to the processing tank, so that the concentration of the mixed liquid in the processing tank is not easily uneven. Therefore, the substrate can be processed with higher precision.

[0127] Example 9. In the device of Example 8, it is also possible to further include a measuring unit configured to measure the concentration of the mixed solution generated by the mixing unit and supplied to the treatment tank, and the control unit is configured to further perform a fifth process, in which the ultrapure water supply unit and the liquid medicine supply unit are controlled so that the concentration of the mixed solution measured by the measuring unit becomes the concentration of the mixed solution obtained by mixing the ultrapure water and at least one liquid medicine according to the supply flow rate set in the first process. In this case, feedback control is performed so that the concentration of the mixed solution supplied to the treatment tank becomes a specified concentration. Therefore, the ultrapure water and the liquid medicine can be more accurately delivered at the supply flow rates of the ultrapure water and the liquid medicine set in the first process.

[0128] Example 10. In the apparatus of Example 8 or Example 9, a stirring unit may be further provided for stirring the mixed liquid generated by the mixing unit and supplying it to the processing tank. In this case, the mixed liquid obtained by mixing ultrapure water and the chemical solution in advance and stirring is supplied to the processing tank, so that the concentration of the mixed liquid in the processing tank is less likely to be uneven. Therefore, the substrate can be processed with higher precision.

[0129] Example 11. An example of a substrate processing method is a method of processing at least one substrate in a processing tank using a mixture of ultrapure water and at least one chemical solution. The method includes the following steps: a first step, obtaining the actual volume of the liquid in the treatment tank, i.e., the actual volume; a second step, filling the treatment tank with ultrapure water until the full capacity indicating that the treatment tank is full; a third step, after the second step, placing at least one substrate in the treatment tank; a fourth step, setting the supply flow rate of ultrapure water supplied to the treatment tank and the supply flow rate of at least one chemical liquid supplied to the treatment tank based on supply data that specifies the supply flow rate of ultrapure water and at least one chemical liquid corresponding to the actual volume and the actual volume obtained in the first step; a fifth step, supplying ultrapure water and at least one chemical liquid to the treatment tank respectively according to the supply flow rate set in the fourth step; a sixth step, stopping the supply of ultrapure water and at least one chemical liquid after the concentration of the mixed liquid in the treatment tank reaches a specified value in the fifth step; and a seventh step, supplying ultrapure water to the treatment tank after a specified time has passed since the supply of ultrapure water and at least one chemical liquid was stopped in the sixth step to replace the mixed liquid in the treatment tank with ultrapure water. In this case, the same effect as the device of Example 1 is obtained.

[0130] Example 12. In the method of Example 11, the first step may include: obtaining a value obtained by subtracting a total volume of at least one substrate disposed in the processing tank from a full volume indicating that the processing tank is full as the actual volume. In this case, the same effect as the device of Example 2 is obtained.

[0131] Example 13. In the method of Example 12, the first step may include: calculating the total volume based on the number of substrates processed simultaneously in the processing tank among at least one substrate. In this case, the same effects as those of the apparatus of Example 3 are obtained.

[0132] Example 14. In any of the methods of Examples 11 to 13, the mixed liquid may be diluted hydrofluoric acid obtained by mixing ultrapure water with hydrofluoric acid as at least one chemical liquid, and the mixed liquid in the treatment tank may be at 20°C to 40°C.

[0133] Example 15. In any of the methods of Examples 11 to 13, the mixed liquid may be an SC-1 liquid obtained by mixing ultrapure water with at least one of ammonium hydroxide and hydrogen peroxide solution as a chemical liquid, and the mixed liquid in the treatment tank may be at 20°C to 70°C.

[0134] Example 16. In any of the methods of Examples 11 to 15, the fifth step may include: supplying ultrapure water and at least one chemical solution to the mixing section according to the supply flow rate set in the fourth step, mixing them in the mixing section, and supplying them to the treatment tank as a mixed solution. In this case, the same effect as the device of Example 8 is obtained.

[0135] Example 17. In the method of Example 16, the following steps may be further included: in an eighth step, the concentration of the mixed solution generated by the mixing section is measured by the measuring section; and in a ninth step, the supply flow rate of the ultrapure water and the at least one liquid medicine to the mixing section is changed so that the concentration of the mixed solution measured by the measuring section becomes the concentration of the mixed solution obtained by mixing the ultrapure water and the at least one liquid medicine according to the supply flow rate set in the fourth step. In this case, the same effect as the device of Example 9 is obtained.

[0136] Example 18. In the method of Example 16 or Example 17, the fifth step may include: stirring the mixed liquid generated by the mixing unit by the stirring unit and then supplying it to the treatment tank. In this case, the same effects as those of the device of Example 10 are obtained.

[0137] Description of Reference Numerals

[0138] 1: substrate processing system (substrate processing device); 5: batch processing unit (substrate processing device); 10: liquid processing device; 20: chemical liquid supply unit; 23: pressure regulating unit (chemical liquid flow regulating unit); 24: flow regulating unit (chemical liquid flow regulating unit); 30: ultrapure water supply unit; 33: pressure regulating unit (ultrapure water flow regulating unit); 34: flow regulating unit (ultrapure water flow regulating unit); 40: mixing unit; 51: processing tank; 60: stirring unit; Ctr: controller (control unit; acquisition unit; chemical liquid flow regulating unit; ultrapure water flow regulating unit); L: mixed liquid; L1: chemical liquid; L2: ultrapure water; SE1: sensor (acquisition unit); SE2: sensor (chemical liquid flow regulating unit); SE3: sensor (ultrapure water flow regulating unit); SE4: sensor (measuring unit); T: tank (chemical liquid storage unit); W: substrate.

Claims

1. A substrate processing device, comprising: a processing tank configured to process at least one substrate using a mixture of ultrapure water and at least one chemical solution; an acquisition unit configured to acquire the actual volume of the liquid in the treatment tank, that is, the actual volume; an ultrapure water supply unit configured to supply the ultrapure water to the treatment tank; a liquid medicine supply unit configured to supply the at least one liquid medicine to the treatment tank; and Control Department, in, The control unit is configured to execute the following processing: A first process of setting a supply flow rate of the ultrapure water supplied to the treatment tank and a supply flow rate of the at least one chemical liquid supplied to the treatment tank based on supply data that specifies supply flow rates of the ultrapure water and the at least one chemical liquid corresponding to the actual volume and the actual volume acquired by the acquisition unit; A second process is to control the ultrapure water supply unit and the liquid medicine supply unit to supply the ultrapure water and the at least one liquid medicine to the treatment tank which is previously filled with the ultrapure water to a full capacity indicating that the treatment tank is full, respectively, according to the supply flow rate set in the first process, until the concentration of the mixed solution in the treatment tank reaches a predetermined value; a third process, controlling the ultrapure water supply unit and the liquid medicine supply unit to stop supplying the ultrapure water and the at least one liquid medicine after the concentration of the mixed solution in the treatment tank reaches a predetermined value in the second process; as well as In a fourth process, the ultrapure water supply unit is controlled to supply the ultrapure water to the treatment tank to replace the mixed solution in the treatment tank with the ultrapure water after a predetermined time has passed since the supply of the ultrapure water and the at least one chemical solution was stopped in the third process.

2. The substrate processing apparatus according to claim 1, wherein: The acquisition unit is configured to acquire, as the actual volume, a value obtained by subtracting a total volume of the at least one substrate disposed in the processing bath from a full volume indicating that the processing bath is full.

3. The substrate processing apparatus according to claim 2, wherein: The acquisition unit is configured to calculate the total volume based on the number of substrates that are processed simultaneously in the processing tank among the at least one substrate.

4. The substrate processing apparatus according to claim 1, wherein: The mixed liquid is dilute hydrofluoric acid obtained by mixing the ultrapure water with hydrofluoric acid as the at least one liquid medicine. The processing tank is configured to process the at least one substrate using the mixed liquid at a temperature of 20° C. to 40° C.

5. The substrate processing apparatus according to claim 1, wherein: The mixed liquid is a SC-1 liquid formed by mixing the ultrapure water with ammonium hydroxide and hydrogen peroxide water as the at least one liquid medicine. The processing tank is configured to process the at least one substrate using the mixed liquid at a temperature of 20° C. to 70° C.

6. The substrate processing apparatus according to claim 1, wherein: The liquid medicine supply unit comprises: a liquid medicine storage unit configured to store the at least one liquid medicine; and The chemical liquid flow rate adjustment unit is configured to deliver the at least one chemical liquid in the chemical liquid storage unit to the treatment tank at a set predetermined flow rate.

7. The substrate processing apparatus according to claim 1, wherein: The ultrapure water supply unit comprises: an ultrapure water storage unit configured to store the ultrapure water; and The ultrapure water flow rate adjustment unit is configured to send the ultrapure water in the ultrapure water storage unit to the treatment tank at a set predetermined flow rate.

8. The substrate processing apparatus according to any one of claims 1 to 7, wherein: The device further includes a mixing unit configured to mix the ultrapure water supplied from the ultrapure water supply unit and the at least one chemical solution supplied from the chemical solution supply unit, and supply the mixed solution to the treatment tank as the mixed solution.

9. The substrate processing apparatus according to claim 8, wherein: further comprising a measuring unit configured to measure the concentration of the mixed solution generated by the mixing unit and before being supplied to the treatment tank, The control unit is configured to also perform a fifth process, in which the ultrapure water supply unit and the drug solution supply unit are controlled so that the concentration of the mixed solution measured by the measuring unit becomes the concentration of the mixed solution obtained by mixing the ultrapure water and the at least one drug solution according to the supply flow rate set in the first process.

10. The substrate processing apparatus according to claim 8, wherein: The invention further includes a stirring section configured to stir the mixed liquid generated by the mixing section and then supply the mixed liquid to the treatment tank.

11. A substrate processing method, comprising processing at least one substrate in a processing tank using a mixture of ultrapure water and at least one chemical solution, the substrate processing method comprising the following steps: The first step is to obtain the actual volume of the liquid in the treatment tank, that is, the actual volume; The second step is to fill the treatment tank with the ultrapure water until the treatment tank is filled to a full capacity. A third step, after the second step, placing the at least one substrate in a processing tank; A fourth step of setting a supply flow rate of the ultrapure water and the at least one chemical liquid supplied to the treatment tank based on supply data that specifies supply flow rates of the ultrapure water and the at least one chemical liquid corresponding to the actual volume and the actual volume acquired in the first step; A fifth step of supplying the ultrapure water and the at least one chemical solution to the treatment tank according to the supply flow rate set in the fourth step; A sixth step, after the concentration of the mixed solution in the treatment tank reaches a predetermined value in the fifth step, stopping the supply of the ultrapure water and the at least one chemical solution; as well as In a seventh step, after a predetermined time has passed since the supply of the ultrapure water and the at least one chemical solution was stopped in the sixth step, the ultrapure water is supplied to the treatment tank to replace the mixed solution in the treatment tank with the ultrapure water.

12. The substrate processing method according to claim 11, wherein: The first step includes acquiring, as the actual volume, a value obtained by subtracting a total volume of the at least one substrate disposed in the processing bath from a full volume indicating that the processing bath is full.

13. The substrate processing method according to claim 12, wherein: The first step includes calculating the total volume based on the number of substrates among the at least one substrate that are processed simultaneously in the processing tank.

14. The substrate processing method according to claim 11, wherein: The mixed liquid is dilute hydrofluoric acid obtained by mixing the ultrapure water with hydrofluoric acid as the at least one liquid medicine. The mixed liquid in the treatment tank is at 20°C to 40°C.

15. The substrate processing method according to claim 11, wherein: The mixed liquid is a SC-1 liquid formed by mixing the ultrapure water with ammonium hydroxide and hydrogen peroxide water as the at least one liquid medicine. The mixed liquid in the treatment tank is at a temperature of 20°C to 70°C.

16. The substrate processing method according to any one of claims 11 to 15, wherein: The fifth step includes supplying the ultrapure water and the at least one chemical solution to a mixing unit at the supply flow rate set in the fourth step, mixing them in the mixing unit, and supplying the mixed solution to the treatment tank.

17. The substrate processing method according to claim 16, wherein: It also includes the following steps: In an eighth step, a measuring unit is used to measure the concentration of the mixed solution generated by the mixing unit; and The ninth step is to change the supply flow rate of the ultrapure water and the at least one chemical liquid to the mixing section so that the concentration of the mixed liquid measured by the measuring section becomes the concentration of the mixed liquid obtained by mixing the ultrapure water and the at least one chemical liquid according to the supply flow rate set in the fourth step.

18. The substrate processing method according to claim 16, wherein: The fifth step includes stirring the mixed liquid generated by the mixing unit by a stirring unit and supplying the mixed liquid to the treatment tank.

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