Combination structure of chipset

Abstract

The invention discloses a combined structure of a chipset, and relates to the technical field of chipset structures. Comprising a buckle frame, a long cylinder is fixedly connected to the inner side surface of the buckle frame, a flitch is arranged at the lower end of the long cylinder, a linkage plate is movably connected into the flitch, and a chip is arranged at the lower end of the flitch. By means of the arranged long-cylinder accessory structure, the attaching plate can be tightly attached to the surface of a chip through the elastic effect of the long-cylinder accessory structure in the using process, a certain buffering effect can be achieved, the accessory structure is compact in connection, the size of the chip set is reduced, meanwhile, a user can conveniently disassemble, assemble and overhaul the chip set, and the service life of the chip set is prolonged. Through the fitting structures of the flitch plate and the linkage plate, a user can adjust the linkage shape of the copper pipe and the copper wire according to the actual installation environment so as to ensure that the most stick heat dissipation effect can be achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of chipset structures, and in particular to a chipset combination structure. Background Art

[0002] As the instruction cycle of the chipset inside the electronic device increases and the power consumption increases, the heat generated during operation also increases accordingly. If the heat cannot be removed in a timely and efficient manner, the performance of the chipset operation will be affected, and even the chipset will be damaged and unable to operate. In order to keep the chipset operating at a normal temperature, a heat sink is usually attached to the surface of the chipset, and a clip is used to fix the heat sink and make it fit tightly to the chipset, thereby providing a heat transfer path with lower thermal resistance to achieve heat dissipation of the chipset.

[0003] The invention patent with announcement number CN102842545B discloses a heat dissipation component and its combined structure with a chipset, wherein the heat dissipation component includes a radiator, a buckling device and at least one elastic component. The radiator includes a bottom plate and a plurality of heat dissipation columns. The buckling device includes a rectangular frame, wherein first side plates are respectively extended below the opposite sides of the rectangular frame, and the lower edges of the opposite inner sides of the two first side plates are respectively provided with at least one buckle hook, and the rectangular frame includes at least one abutting top. The elastic component has a first part that abuts against the bottom plate of the radiator and a second part that abuts against the abutting top of the rectangular frame. With this, the heat dissipation component can be fixed to chipsets of various thicknesses with a single component.

[0004] The above-mentioned prior art parts have certain shortcomings in actual use. They use fixed-shaped heat dissipation columns to perform heat dissipation operations, which can only meet the heat dissipation needs under general circumstances. When encountering limited conditions such as the installation environment, they cannot make effective adjustments to adapt. Summary of the invention

[0005] The purpose of the present invention is to provide a chip set combination structure to solve the above technical problems.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A chip set assembly structure, comprising a buckle frame, the inner surface of the buckle frame is fixedly connected with a long tube, the lower end of the long tube is provided with a pasting plate, the inside of the pasting plate is movably connected with a linkage plate, and the lower end of the pasting plate is provided with a chip;

[0008] The surface of one end of the linkage plate is equidistantly fixedly connected with a linkage rod, the surface of the linkage rod is equidistantly fixedly connected with a sleeve rod, the surface of the sleeve rod is rotatably connected with a side joint head and a center joint head at the upper end, the surfaces of the side joint head and the center joint head are fixedly connected with a copper tube, and the side surface of the copper tube is fixedly connected with a copper wire.

[0009] As a further solution of the present invention: a cavity is provided in the middle of the surface of the buckle frame, a main side panel is symmetrically fixedly connected to the bottom surface of the buckle frame near both ends, a secondary side panel is fixedly connected to the middle of the two side surfaces of the buckle frame, and a sleeve is symmetrically fixedly installed on the surface of the cavity.

[0010] As a further solution of the present invention: one end surface of the main side plate is fixedly connected with a hook at the bottom end, one end surface of the secondary side plate is provided with a pressing groove at the bottom end, and the sleeve is fixedly connected with the long tube.

[0011] As a further solution of the present invention: a bolt cover is spirally connected to the top surface of the long tube, a guide block is fixedly connected to the bottom end of the interior of the long tube, a through groove is provided at the middle of the surface of the guide block, a guide groove is provided on the side surface of the guide block, a storage shell is fixedly connected to the bottom surface of the long tube, and a main rod and a long rod are provided inside the long tube.

[0012] As a further solution of the present invention: the surface of the main rod is provided with a sliding groove, the bottom end surface of the main rod is fixedly connected with a pressure plate, the bottom end surface of the pressure plate is symmetrically fixedly connected with a first elastic strip, the side surface of the first elastic strip is located at the bottom end and is fixedly connected with a first folding strip, the surface of the first folding strip is fixedly connected with a first rubber pad, the auxiliary rod is embedded in the sliding groove, the bottom end surface of the auxiliary rod is symmetrically fixedly connected with a support plate, the bottom end surface of the support plate is fixedly connected with a second elastic strip, the bottom end surface of the second elastic strip is fixedly connected with a second folding strip, and the surface of the second folding strip is fixedly connected with a second rubber pad.

[0013] As a further solution of the present invention: a connecting shell is symmetrically fixedly connected to the side edge of the top surface of the patch plate, the connecting shell is embedded and connected to the storage shell, the top surface of the patch plate is symmetrically provided with transverse grooves, the top surface of the patch plate is symmetrically fixedly connected to longitudinal rails, one end surface of the patch plate is fixedly connected to an anti-detachment sleeve, and the surface of the anti-detachment sleeve is rotatably connected to a bolt.

[0014] As a further solution of the present invention: a spring is fixedly connected to the inside of the connecting shell, a sealing cover is fixedly connected to the top surface of the spring, an anti-slip ring is fixedly connected to one end surface of the bolt, the anti-slip ring is slidably connected to the anti-slip sleeve, and a screw cap is fixedly connected to one end surface of the anti-slip ring.

[0015] As a further solution of the present invention: a thread groove is provided in the middle of the surface of the linkage plate, the thread groove is spirally connected to the bolt, and the surfaces of the side joints and the center joints are rotatably connected with an insertion rod, and the insertion rod is embedded and connected with the longitudinal rail.

[0016] As a further solution of the present invention: a substrate is provided on the bottom surface of the chip, and a contact portion is provided on the bottom surface of the substrate.

[0017] Beneficial effects of the present invention:

[0018] Through the setting of the long tube accessory structure, it can utilize its own elastic effect during use, which can not only allow the plate to be tightly attached to the surface of the chip, but also have a certain buffering effect. The accessory structure is compactly connected, which reduces the volume of the chipset and is convenient for users to disassemble and repair. Through the setting of the plate and linkage plate accessory structure, users can adjust the linkage shape of the copper tube and copper wire according to the actual installation environment to ensure that the best heat dissipation effect can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below in conjunction with the accompanying drawings.

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 It is a schematic diagram of the connection structure between the buckle frame accessory and the long tube accessory of the present invention;

[0022] Figure 3 It is a schematic diagram of the connection structure of the long tube accessory of the present invention;

[0023] Figure 4 It is a schematic diagram of the disassembly of the long tube accessory structure of the present invention;

[0024] Figure 5 It is a schematic diagram of the structure of the plate attachment of the present invention;

[0025] Figure 6 It is a schematic diagram of the connection structure of the linkage plate accessories of the present invention;

[0026] Figure 7 It is a schematic diagram of the disassembly of the copper tube fitting structure of the present invention.

[0027] In the figure: 1, buckle frame; 2, cavity; 3, main side plate; 4, auxiliary side plate; 5, sleeve; 6, long tube; 7, bolt cover; 8, guide block; 9, through groove; 10, guide groove; 11, storage shell; 12, main rod; 13, pressure plate; 14, first elastic strip; 15, first folding strip; 16, first rubber pad; 17, auxiliary rod; 18, support plate; 19, second elastic strip; 20, second folding strip; 2 1. Second rubber pad; 22. Paste plate; 23. Connecting shell; 24. Horizontal groove; 25. Longitudinal rail; 26. Anti-slip sleeve; 27. Bolt; 28. Anti-slip ring; 29. ​​Screw cap; 30. Linkage plate; 31. Wire groove; 32. Linkage rod; 33. Copper tube; 34. Copper wire; 35. Side joint; 36. Center joint; 37. Sleeve rod; 38. Insert rod; 39. Chip; 40. Base plate; 41. Contact part. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Example 1

[0030] See also Figure 1-Figure 7 As shown, the present invention is a chip set assembly structure, including a buckle frame 1, the inner surface of the buckle frame 1 is fixedly connected with a long tube 6, the lower end of the long tube 6 is provided with a plate 22, the inside of the plate 22 is movably connected with a linkage plate 30, and the lower end of the plate 22 is provided with a chip 39;

[0031] A linkage rod 32 is equidistantly fixedly connected to the surface of one end of the linkage plate 30, a sleeve rod 37 is equidistantly fixedly connected to the surface of the linkage rod 32, a side joint 35 and a center joint 36 are rotatably connected to the surface of the sleeve rod 37 at the upper end, a copper tube 33 is fixedly connected to the surface of the side joint 35 and the center joint 36, and a copper wire 34 is fixedly connected to the side surface of the copper tube 33;

[0032] A cavity 2 is provided in the middle of the surface of the buckle frame 1, a main side plate 3 is symmetrically fixedly connected to the bottom surface of the buckle frame 1 near both ends, and a secondary side plate 4 is fixedly connected to the middle of the two side surfaces of the buckle frame 1, and a sleeve 5 is symmetrically fixedly installed on the surface of the cavity 2;

[0033] One end surface of the main side plate 3 is fixedly connected with a hook at the bottom, and one end surface of the auxiliary side plate 4 is provided with a pressing groove at the bottom. The sleeve 5 is fixedly connected with the long tube 6. When the chipset is assembled, the hook of the main side plate 3 needs to be used to support the bottom from the edge of the contact portion 41, and then the pressing groove on the surface of the auxiliary side plate 4 and the inclined edge of the chip 39 are stacked to complete the positioning of the chip 39 from bottom to top.

[0034] The top surface of the long tube 6 is spirally connected with a bolt cover 7, the inside of the long tube 6 is fixedly connected with a guide block 8 at the bottom end, the surface of the guide block 8 is provided with a through groove 9 at the middle, the side surface of the guide block 8 is provided with a guide groove 10, the bottom surface of the long tube 6 is fixedly connected with a storage shell 11, and the inside of the long tube 6 is provided with a main rod 12 and a long rod;

[0035] The surface of the main rod 12 is provided with a slide groove, the bottom end surface of the main rod 12 is fixedly connected with a pressing plate 13, the bottom end surface of the pressing plate 13 is symmetrically fixedly connected with a first elastic strip 14, the side surface of the first elastic strip 14 is located at the bottom end and is fixedly connected with a first folding strip 15, the surface of the first folding strip 15 is fixedly connected with a first rubber pad 16, the auxiliary rod 17 is embedded in the slide groove, the bottom end surface of the auxiliary rod 17 is symmetrically fixedly connected with a supporting plate 18, the bottom end surface of the supporting plate 18 is fixedly connected with a second elastic strip 19, the bottom end surface of the second elastic strip 19 is fixedly connected with a second folding strip 20, and the surface of the second folding strip 20 is fixedly connected with a second rubber pad 21;

[0036] A connecting shell 23 is symmetrically fixedly connected to the side edge of the top surface of the pasting plate 22, and the connecting shell 23 is embedded and connected with the storage shell 11. The top surface of the pasting plate 22 is symmetrically provided with a transverse groove 24, and the top surface of the pasting plate 22 is symmetrically fixedly connected with a longitudinal rail 25. An anti-drop sleeve 26 is fixedly connected to one end surface of the pasting plate 22, and a bolt 27 is rotatably connected to the surface of the anti-drop sleeve 26.

[0037] A spring is fixedly connected inside the connecting shell 23, a cover is fixedly connected to the top surface of the spring, an anti-dropping ring 28 is fixedly connected to one end surface of the bolt 27, the anti-dropping ring 28 is slidably connected to the anti-dropping sleeve 26, and a screw cap 29 is fixedly connected to one end surface of the anti-dropping ring 28. In order to adapt to the thickness of the chipset to ensure that the sticker plate 22 can always be attached to the surface of the chip 39, during the assembly process, the secondary rod 17 and the main rod 12 are pushed deeply in turn, and the second folding strip 20 and the first folding strip 15 will be slowly and orderly unfolded until the second rubber The rubber pad 21 and the first rubber pad 16 can spread and spread until they are pressed against the cover surface. At the same time, the spring at the bottom will play an elastic support and cooperate with the first elastic strip 14 and the second elastic strip 19 for further buffering and shock absorption. When the two rods are flush with the inner surface of the long tube, the bolt cover 7 is screwed in to cap the top. When maintenance is needed later, it is only necessary to unscrew the bolt cover and directly pull the main rod 12 and the auxiliary rod 17. When the first rubber pad 16 and the second rubber pad 21 are retracted into the storage shell 11, the sticker plate 22 can be pulled out.

[0038] A wire groove 31 is provided in the middle of the surface of the linkage plate 30, and the wire groove 31 is spirally connected to the bolt 27. The surfaces of the side joints 35 and the center joints 36 are rotatably connected with the plug rods 38, and the plug rods 38 are embedded and connected with the longitudinal rails 25. In the actual installation and use process, the installation is often inconvenient due to the limited space. The user can press to make the side-bent copper wire 34 continue to bend, so that the height of the entire heat dissipation component can be effectively controlled. At the same time, the user can also control the movement of the linkage plate 30 by turning the screw cap 29. As the bolt 27 continues to rotate, the linkage plate 30 will Under the action of the wire groove 31, it slowly moves. During this process, the insertion rod 38 will cooperate with the longitudinal rail 25 to limit the deformation trajectory, and the sleeve rod 37 will move under the linkage influence of the linkage rod 32, which eventually causes the shape of the copper tube 33 and the copper wire 34 to change between a square and a flat rhombus in a top view. When it is close to a square structure, the heat conduction in all directions is more uniform and can better withstand external forces. When it is close to a flat rhombus, it has a larger specific surface area. Therefore, under the same volume, heat can diffuse more quickly from the high temperature area to the low temperature area, and it has higher thermal stability.

[0039] A substrate 40 is provided on the bottom surface of the chip, and a contact portion 41 is provided on the bottom surface of the substrate 40 .

[0040] Example 2

[0041] See also Figure 1-Figure 7As shown, the present invention is a chip set assembly structure, including a buckle frame 1, the inner surface of the buckle frame 1 is fixedly connected with a long tube 6, the lower end of the long tube 6 is provided with a plate 22, the inside of the plate 22 is movably connected with a linkage plate 30, and the lower end of the plate 22 is provided with a chip 39;

[0042] A linkage rod 32 is equidistantly fixedly connected to the surface of one end of the linkage plate 30, a sleeve rod 37 is equidistantly fixedly connected to the surface of the linkage rod 32, a side joint 35 and a center joint 36 are rotatably connected to the surface of the sleeve rod 37 at the upper end, a copper tube 33 is fixedly connected to the surface of the side joint 35 and the center joint 36, and a copper wire 34 is fixedly connected to the side surface of the copper tube 33;

[0043] A cavity 2 is provided in the middle of the surface of the buckle frame 1, a main side plate 3 is symmetrically fixedly connected to the bottom surface of the buckle frame 1 near both ends, and a secondary side plate 4 is fixedly connected to the middle of the two side surfaces of the buckle frame 1, and a sleeve 5 is symmetrically fixedly installed on the surface of the cavity 2;

[0044] One end surface of the main side plate 3 is fixedly connected with a hook at the bottom, and one end surface of the auxiliary side plate 4 is provided with a pressing groove at the bottom. The sleeve 5 is fixedly connected with the long tube 6. When the chipset is assembled, the hook of the main side plate 3 needs to be used to support the bottom from the edge of the contact portion 41, and then the pressing groove on the surface of the auxiliary side plate 4 and the inclined edge of the chip 39 are stacked to complete the positioning of the chip 39 from bottom to top.

[0045] The top surface of the long tube 6 is spirally connected with a bolt cover 7, the inside of the long tube 6 is fixedly connected with a guide block 8 at the bottom end, the surface of the guide block 8 is provided with a through groove 9 at the middle, the side surface of the guide block 8 is provided with a guide groove 10, the bottom surface of the long tube 6 is fixedly connected with a storage shell 11, and the inside of the long tube 6 is provided with a main rod 12 and a long rod;

[0046] The surface of the main rod 12 is provided with a slide groove, the bottom end surface of the main rod 12 is fixedly connected with a pressing plate 13, the bottom end surface of the pressing plate 13 is symmetrically fixedly connected with a first elastic strip 14, the side surface of the first elastic strip 14 is located at the bottom end and is fixedly connected with a first folding strip 15, the surface of the first folding strip 15 is fixedly connected with a first rubber pad 16, the auxiliary rod 17 is embedded in the slide groove, the bottom end surface of the auxiliary rod 17 is symmetrically fixedly connected with a supporting plate 18, the bottom end surface of the supporting plate 18 is fixedly connected with a second elastic strip 19, the bottom end surface of the second elastic strip 19 is fixedly connected with a second folding strip 20, and the surface of the second folding strip 20 is fixedly connected with a second rubber pad 21;

[0047] A connecting shell 23 is symmetrically fixedly connected to the side edge of the top surface of the patch plate 22, and the connecting shell 23 is embedded and connected to the storage shell 11. The top surface of the patch plate 22 is symmetrically provided with transverse grooves 24, and the top surface of the patch plate 22 is symmetrically fixedly connected to the longitudinal rail 25. An anti-drop sleeve 26 is fixedly connected to the surface of one end of the patch plate 22, and a bolt 27 is rotatably connected to the surface of the anti-drop sleeve 26.

[0048] Working principle of the present invention: When assembling the chipset, the hook of the main side plate 3 is used to support the bottom from the edge of the contact portion 41, and then the pressing groove on the surface of the secondary side plate 4 is used to stack with the inclined edge of the chip 39, and the positioning of the chip 39 is completed from bottom to top. In order to adapt to the thickness of the chipset to ensure that the sticker 22 can always be attached to the surface of the chip 39, during the assembly process, the secondary rod 17 and the main rod 12 are pushed deeply in turn, and the second folding strip 20 and the first folding strip 15 will have The second rubber pad 21 and the first rubber pad 16 are slowly unfolded in sequence until they can spread and spread out until they are pressed against the cover surface. At the same time, the spring at the bottom will play an elastic support and cooperate with the first elastic strip 14 and the second elastic strip 19 for further buffering and shock absorption. When the two rod bodies are flush with the inner surface of the long tube, the bolt cover 7 is screwed in to cap the top. When maintenance is needed later, it is only necessary to unscrew the bolt cover and directly pull the main rod 12 and the auxiliary rod 17 until the first rubber pad 16 and the second rubber pad 21 are retracted. Into the storage shell 11, the sticker plate 22 can be pulled out. In the actual installation and use process, the installation is often inconvenient due to space limitations. The user can press to make the side-bent copper wire 34 continue to bend, so that the height of the entire heat dissipation component is effectively controlled. At the same time, the user can also control the movement of the linkage plate 30 by turning the screw cap 29. As the bolt 27 continues to rotate, the linkage plate 30 will slowly move under the action of the wire groove 31. During this process, the insertion rod 38 will cooperate with the longitudinal rail 25 to limit the deformation trajectory, and the sleeve rod 37 will move under the linkage influence of the linkage rod 32, which eventually causes the shape of the copper tube 33 and the copper wire 34 to change between a square and a flat rhombus in a top-down perspective. When it is close to a square structure, the heat conduction in all directions is relatively uniform and can better withstand external forces. When it is close to a flat rhombus, it has a larger specific surface area. Therefore, under the same volume, heat can diffuse more quickly from the high temperature area to the low temperature area, and has higher thermal stability.

[0049] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A chipset assembly structure, comprising a buckle frame (1), characterized in that: The inner surface of the buckle frame (1) is fixedly connected to a long tube (6), the lower end of the long tube (6) is provided with a plate (22), the interior of the plate (22) is movably connected to a linkage plate (30), and the lower end of the plate (22) is provided with a chip (39); The surface of one end of the linkage plate (30) is equidistantly fixedly connected to a linkage rod (32), the surface of the linkage rod (32) is equidistantly fixedly connected to a sleeve rod (37), the surface of the sleeve rod (37) is rotatably connected to a side joint (35) and a center joint (36) at the upper end, the surfaces of the side joint (35) and the center joint (36) are fixedly connected to a copper tube (33), and the side surface of the copper tube (33) is fixedly connected to a copper wire (34).

2. The chipset combination structure according to claim 1, characterized in that: A cavity (2) is provided in the middle of the surface of the buckle frame (1), main side plates (3) are symmetrically fixedly connected to the bottom surface of the buckle frame (1) near both ends, secondary side plates (4) are fixedly connected to the middle of the two side surfaces of the buckle frame (1), and a sleeve (5) is symmetrically fixedly installed on the surface of the cavity (2).

3. The chipset combination structure according to claim 2, characterized in that: One end surface of the main side plate (3) is fixedly connected to a hook at the bottom end, one end surface of the secondary side plate (4) is provided with a pressing groove at the bottom end, and the sleeve (5) is fixedly connected to the long cylinder (6).

4. The chipset assembly structure according to claim 1, characterized in that: The top surface of the long tube (6) is spirally connected to a bolt cover (7), the interior of the long tube (6) is fixedly connected to a guide block (8) at the bottom end, the surface of the guide block (8) is provided with a through groove (9) at the middle, the side surface of the guide block (8) is provided with a guide groove (10), the bottom surface of the long tube (6) is fixedly connected to a storage shell (11), and the interior of the long tube (6) is provided with a main rod (12) and a long rod.

5. The chipset combination structure according to claim 4, characterized in that: The surface of the main rod (12) is provided with a sliding groove, the bottom surface of the main rod (12) is fixedly connected to a pressure plate (13), the bottom surface of the pressure plate (13) is symmetrically fixedly connected to a first elastic strip (14), the side surface of the first elastic strip (14) is fixedly connected to a first folding strip (15) at the bottom, the surface of the first folding strip (15) is fixedly connected to a first rubber pad (16), the auxiliary rod (17) is embedded in the sliding groove, the bottom surface of the auxiliary rod (17) is symmetrically fixedly connected to a support plate (18), the bottom surface of the support plate (18) is fixedly connected to a second elastic strip (19), the bottom surface of the second elastic strip (19) is fixedly connected to a second folding strip (20), and the surface of the second folding strip (20) is fixedly connected to a second rubber pad (21).

6. The combined structure of a chipset according to claim 5, characterized in that: A connecting shell (23) is symmetrically fixedly connected to the side edge of the top surface of the patch plate (22), and the connecting shell (23) is embedded and connected to the storage shell (11). The top surface of the patch plate (22) is symmetrically provided with transverse grooves (24). The top surface of the patch plate (22) is symmetrically fixedly connected to a longitudinal rail (25). An anti-drop sleeve (26) is fixedly connected to the surface of one end of the patch plate (22), and a bolt (27) is rotatably connected to the surface of the anti-drop sleeve (26).

7. The chipset combination structure according to claim 6, characterized in that: A spring is fixedly connected inside the connection shell (23), a sealing cover is fixedly connected to the top surface of the spring, an anti-slip ring (28) is fixedly connected to one end surface of the bolt (27), the anti-slip ring (28) is slidably connected to the anti-slip sleeve (26), and a screw cap (29) is fixedly connected to one end surface of the anti-slip ring (28).

8. The chipset combination structure according to claim 7, characterized in that: A thread groove (31) is provided at the middle of the surface of the linkage plate (30), and the thread groove (31) is spirally connected to the bolt (27). The surfaces of the side joints (35) and the center joints (36) are rotatably connected to the insertion rods (38), and the insertion rods (38) are embedded and connected to the longitudinal rails (25).

9. The chipset combination structure according to claim 1, characterized in that: A substrate (40) is provided on the bottom surface of the chip, and a contact portion (41) is provided on the bottom surface of the substrate (40).

Images