Photovoltaic module

Abstract

The invention relates to a photovoltaic module. The photovoltaic module comprises a diode and a heat dissipation device, the heat dissipation device is attached to one side of the cathode layer of the diode; a channel with a preset shape and an electric field layer are arranged in the heat dissipation device; a liquid medium with colloidal particles is arranged in the channel with the preset shape; the liquid medium is used for taking away heat generated by the diode during flowing; the electric field layer comprises a positive electrode layer and a negative electrode layer which are arranged in a staggered mode, and the positive electrode layer and the negative electrode layer are arranged on the two sides of the channel in the preset shape respectively; the positive electrode layer and the negative electrode layer are used for generating an electromagnetic field when being electrified; the electromagnetic field is used for providing driving force for the colloidal particles. The driving force generated by the electric field layer drives the colloidal particles in the liquid medium to move rapidly, thereby facilitating the improvement of the flowing speed of the liquid medium, accelerating the heat dissipation, and reducing the temperature of the diode.

Description

Technical Field

[0001] The present disclosure relates to the field of new energy technology, and in particular to a photovoltaic module. Background Art

[0002] As the voltage requirements of the diode become higher and higher (such as above 2000V), the diode will experience secondary avalanche. That is, the electric field near the NN+ junction becomes stronger due to the avalanche electrons, causing the diode to experience secondary avalanche near the NN+ junction. At this time, a large current passes through the diode instantly and generates a large amount of heat energy. The large amount of heat energy cannot be dissipated in a short time and will burn out the diode. Summary of the invention

[0003] The present disclosure provides a photovoltaic module to solve the deficiencies of the related art.

[0004] According to a first aspect of an embodiment of the present disclosure, a photovoltaic module is provided, comprising a diode and a heat sink; the heat sink is attached to a cathode layer side of the diode; a channel of a preset shape and an electric field layer are arranged in the heat sink; a liquid medium of colloidal particles is arranged in the channel of the preset shape; the liquid medium is used to take away the heat generated by the diode when flowing;

[0005] The electric field layer comprises staggered positive electrode layers and negative electrode layers, which are respectively arranged on both sides of the channel of the preset shape; the positive electrode layers and the negative electrode layers are used to generate an electromagnetic field when power is turned on; the electromagnetic field is used to provide driving force to the colloidal particles.

[0006] Optionally, the preset shape matches a heat map corresponding to the diode, and the heat map refers to an image formed by temperatures at different positions when the diode is working.

[0007] Optionally, the preset shape includes a bending area, and the positive electrode layer and the negative electrode layer of the electric field layer and the bending area are arranged opposite to each other in sequence.

[0008] Optionally, the preset shape includes a straight area, and the positive electrode layer and the negative electrode layer of the electric field layer and the straight area are arranged opposite to each other in sequence.

[0009] Optionally, the heat dissipation device further includes a positive pin and a negative pin; the positive pin is electrically connected to the positive electrode layer of the electric field layer; and the negative pin is electrically connected to the negative electrode layer of the electric field layer.

[0010] Optionally, the heat dissipation device comprises a thermistor, an upper substrate and a lower substrate; a first groove of a preset shape is formed on the upper substrate, a second groove of a preset shape is formed on the lower substrate, and the first groove and the second groove form the channel after the upper substrate and the lower substrate are aligned and bonded together;

[0011] The thermistor is attached to a designated side of the upper substrate and / or the lower substrate to detect the temperature of the liquid medium in the channel.

[0012] Optionally, the heat dissipation device further includes a voltage divider resistor and a switch device;

[0013] The first end of the voltage-dividing resistor is electrically connected to a power source, the second end of the voltage-dividing resistor is electrically connected to the first end of the thermistor, and the second end of the thermistor is grounded;

[0014] The first end of the switch device is electrically connected to a power source, the second end of the switch device is electrically connected to the positive electrode layer of the electric field layer, and the control end of the switch device is electrically connected to the first end of the thermistor.

[0015] Optionally, the photovoltaic module further includes a plurality of diode pins, a liquid inlet pin and a liquid outlet pin; the diode pin is used to be electrically connected to the diode, the liquid inlet pin is connected to the liquid inlet, and the liquid outlet pin is connected to the liquid outlet.

[0016] Optionally, a reflux channel is provided between the liquid inlet tube pin and the liquid outlet tube pin; an inlet cover is provided in the liquid inlet tube pin, and an outlet cover is provided in the liquid outlet tube pin;

[0017] The inlet cover is used to seal the liquid inlet pin in a first state, and to seal the reflux channel in a second state;

[0018] The outlet cover is used to seal the liquid outlet pin in a first state and to seal the reflux channel in a second state;

[0019] The first state refers to a state in which an external channel is not connected, and the second state refers to a state in which an external channel is connected.

[0020] Optionally, the diameter of the inlet cover body is larger than the inner diameter of the reflux channel; a circular groove is provided at the opening of the reflux channel; the inlet cover body seals the reflux channel when it is located in the groove in the second state; and the diameter of the outlet cover body is larger than the inner diameter of the reflux channel; a circular groove is provided at the opening of the reflux channel; the outlet cover body seals the reflux channel when it is located in the groove in the second state.

[0021] Optionally, the inlet cover body and / or the outlet cover body is further provided with a protrusion; the protrusion is used to be inserted into the reflux channel in the second state to seal the reflux channel.

[0022] Optionally, the photovoltaic module further comprises a base, wherein the base comprises a pin jack, a liquid inlet pin plug and a liquid outlet pin plug;

[0023] The pin socket is used to fix the diode pin and form an electrical connection;

[0024] The liquid inlet pin plug is used to be inserted into the liquid inlet pin to allow the liquid medium to flow into the heat dissipation device;

[0025] The liquid outlet pin plug is used to be inserted into the liquid outlet pin to allow the liquid medium to flow out of the heat dissipation device.

[0026] Optionally, the photovoltaic module further comprises a tank body storing a liquid medium, and the tank body is respectively connected to the liquid inlet pin plug and the liquid outlet pin plug on the base.

[0027] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0028] The photovoltaic module provided by the embodiment of the present disclosure includes a diode and a heat sink; the heat sink is attached to one side of the cathode layer of the diode; a channel and an electric field layer of a preset shape are arranged in the heat sink; a liquid medium of colloidal particles is arranged in the channel of the preset shape; the liquid medium is used to take away the heat generated by the diode when flowing; the electric field layer includes a staggered positive electrode layer and a negative electrode layer, and the positive electrode layer and the negative electrode layer are respectively arranged on both sides of the channel of the preset shape; the positive electrode layer and the negative electrode layer are used to generate an electromagnetic field when power is turned on; the electromagnetic field is used to provide a driving force to the colloidal particles. In this way, by arranging an electric field layer in the heat sink, the driving force generated by the electric field layer is used to drive the colloidal particles in the liquid medium to move quickly, which is conducive to increasing the flow speed of the liquid medium and accelerating the heat dissipation, thereby reducing the temperature of the diode, ensuring the reliable operation of the diode, and helping to extend the life of the diode.

[0029] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0031] Figure 1 is a schematic diagram of a photovoltaic module according to an exemplary embodiment.

[0032] Figure 2 is a schematic structural diagram of a diode according to an exemplary embodiment.

[0033] Figure 3 is a schematic structural diagram of another diode according to an exemplary embodiment.

[0034] Figure 4 is a schematic structural diagram of yet another diode according to an exemplary embodiment.

[0035] Figure 5 is a schematic structural diagram of yet another diode according to an exemplary embodiment.

[0036] Figure 6 is a schematic structural diagram of yet another diode according to an exemplary embodiment.

[0037] Figure 7 is a schematic structural diagram of yet another diode according to an exemplary embodiment.

[0038] Figure 8 is a schematic structural diagram of yet another diode according to an exemplary embodiment.

[0039] Fig. 9 is a schematic structural diagram of yet another diode according to an exemplary embodiment.

[0040] Fig.10 is a schematic structural diagram of yet another diode according to an exemplary embodiment.

[0041] Fig.11 is a schematic structural diagram of yet another diode according to an exemplary embodiment.

[0042] Fig.12 is a schematic diagram of a channel of a preset shape according to an exemplary embodiment.

[0043] Fig.13 It is a schematic diagram of the structure of a channel of a preset shape according to an exemplary embodiment.

[0044] Fig.14 is a schematic diagram of a channel of a preset shape according to an exemplary embodiment.

[0045] Fig.15 The figure is a schematic top view showing the arrangement positions of a positive electrode layer and a negative electrode layer according to an exemplary embodiment.

[0046] Fig.16 The figure is a cross-sectional schematic diagram showing the arrangement positions of a positive electrode layer and a negative electrode layer according to an exemplary embodiment.

[0047] Fig.17 The figure is a schematic top view showing the arrangement positions of a positive electrode layer and a negative electrode layer according to an exemplary embodiment.

[0048] Fig.18 The figure is a cross-sectional schematic diagram showing the arrangement positions of a positive electrode layer and a negative electrode layer according to an exemplary embodiment.

[0049] Fig.19 The figure is a cross-sectional schematic diagram showing a setting position of a thermistor according to an exemplary embodiment.

[0050] Fig. 20 is an equivalent circuit diagram of a positive electrode layer power supply according to an exemplary embodiment.

[0051] Fig.21 is a schematic diagram showing a heat dissipation device according to an exemplary embodiment.

[0052] Fig. 22 The figure is a pin diagram of a photovoltaic module according to an exemplary embodiment.

[0053] Fig.23 is a schematic diagram of an outlet cover according to an exemplary embodiment.

[0054] Fig.24 is a schematic diagram of another outlet cover according to an exemplary embodiment.

[0055] Fig.25 is a schematic diagram of yet another outlet cover according to an exemplary embodiment.

[0056] Fig.26 It is a schematic structural diagram of an outlet cover according to an exemplary embodiment. DETAILED DESCRIPTION

[0057] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described exemplarily below do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices consistent with some aspects of the present disclosure as detailed in the attached claims. It should be noted that the features in the following embodiments and implementations may be combined with each other without conflict.

[0058] In order to solve the above technical problems, the present disclosure provides a diode, such as Figure 1 As shown, it includes a diode 10 and a heat sink 20. The diode 10 and the heat sink are attached to each other via an adhesive layer 30, and the adhesive layer 30 has a heat conduction function, so that the heat generated by the diode 10 is conducted to the heat sink 20. The heat sink 20 dissipates the heat.

[0059] Figure 2The schematic diagram of the structure of a diode is shown in FIG. Figure 2 The diode 10 includes an anode layer 11, a substrate layer 12 and a cathode layer 13 arranged in sequence. The anode layer 11 and the cathode layer may have impurities with different doping concentrations to exhibit corresponding polarities. A buffer layer 14 is provided in the cathode layer 13 and is bonded to the substrate layer 12; the buffer layer 14 includes a plurality of buffer regions 15; the material in each buffer region 15 is the same as that in the anode layer 11, and the doping concentration of each buffer region 15 is less than the doping concentration of the anode layer and greater than the doping concentration of the substrate layer 12.

[0060] The diode 10 provided in this embodiment can establish a forward electric field between the anode layer 11 and the cathode layer 13 after applying a positive voltage and a negative voltage respectively. The forward electric field enables electrons to move freely from the cathode layer 13 to the anode layer 11, thereby forming a current from the positive electrode to the negative electrode, that is, the diode 10 is in a forward conduction state. When the diode is applied with a negative voltage and a positive voltage respectively, a reverse electric field can be established between the anode layer 11 and the cathode layer 13, see Figure 3 , the reverse electric field will prevent electrons from moving from the cathode layer 13 to the anode layer 11; thus, the voltage difference between the anode layer 11 and the cathode layer 13 needs to reach a preset voltage before the reverse electric field can be broken down, so that the diode is in a (recoverably) reverse conduction state.

[0061] Considering that the diode 10 is a high-voltage diode, during the reverse recovery process after the conduction process, due to the existence of the above-mentioned reverse electric field, especially the strong electric field formed between the cathode layer 13 and the substrate layer 12, the electrons will move from the anode layer 11 to the anode layer 11 to generate a secondary avalanche; during the secondary avalanche, the collision of electrons and holes will release a large amount of energy, making it impossible for the diode 10 to dissipate heat in time, thereby burning the diode. In this embodiment, by providing a buffer layer 14 between the anode layer 11 and the substrate layer 12, a large number of holes can be injected into the substrate layer 12 during the secondary avalanche, thereby weakening the strong electric field formed between the cathode layer 13 and the substrate layer 12, reducing the energy released by the collision of electrons and holes, and then reducing the temperature of the diode, ensuring that the diode works normally and reliably, which is conducive to extending the service life of the diode.

[0062] Considering that the diode 10 is usually used in an AC circuit, the current in the diode 10 may have a skin effect, that is, the current at the edge of the diode 10 is greater than the current in the center, or in other words, the number of electrons at the edge of the diode 10 is greater than the number of electrons in the center. For this reason, see Figure 4, in this embodiment, the thickness d of multiple buffer regions increases from the inside to the outside. That is to say, when the doping concentration of the buffer region is the same or similar (less than a preset threshold), the smaller the thickness of the buffer region, the fewer holes will be provided, that is, the closer the buffer region is to the center, the weaker the ability to relieve strong electric fields is, and the closer it is to the outside, the stronger the ability to relieve strong electric fields is, so that the center and outer regions of the diode generate less heat to avoid burning the diode. In one example, the thickness of multiple buffer regions can be set to 0.1 to 0.5 microns. For example, from the central area to the outer area, the thickness of the buffer region can be 0.1 micron, 0.2 micron, 0.3 micron, 0.4 micron and 0.5 micron, and the use of a stepped thickness can facilitate production and manufacturing. Moreover, in this example, the thickness of each buffer region can also be reduced by setting multiple buffer regions.

[0063] In one embodiment, considering that the holes provided by the buffer region increase from the inside to the outside, the area of ​​the buffer region can be adjusted in this embodiment, see Figure 5 , that is, the areas of the multiple buffer regions are gradually increased from the inside to the outside, so as to adjust the buffer regions to provide different numbers of holes, so as to weaken the strong electric field between the cathode layer 13 and the substrate layer 12. In one example, the area of ​​the buffer region can be 1 to 100 square microns, such as 10 square microns, 20 square microns, 30 square microns, 40 square microns, 50 square microns, 60 square microns, 70 square microns, 80 square microns, 90 square microns and 100 square microns, which can be selected according to the specific scenario, and the corresponding scheme falls into the protection scheme of the present disclosure.

[0064] In another embodiment, the voids provided by the buffer region increase when expanding from the inside to the outside. In the case where the thickness of the plurality of buffer regions increases from the inside to the outside and / or the area increases from the inside to the outside, see Figure 6 In this embodiment, the doping concentration of multiple buffer regions can be the same, so that it is convenient to form the buffer region in one process and improve the yield. In this embodiment, the doping concentration of the buffer region is 1e 13 ~1e 17 / cm 3 In one example, the concentrations in the buffer region are 1e 13 / cm 3 , 1e 14 / cm 3 , 1e 17 / cm 3 , can be selected according to the specific scenario, and the corresponding scheme falls into the protection scheme of this disclosure.

[0065] In another embodiment, the increase in the voids provided by the buffer region is considered when expanding from the inside to the outside. In the case where the thickness of the plurality of buffer regions increases from the inside to the outside and / or the area increases from the inside to the outside, see Figure 7 In this embodiment, the doping concentration of multiple buffer regions also increases from the inside to the outside (the darker the color, the higher the doping concentration). Multiple buffer regions can provide more and more holes from the inside to the outside to facilitate the rapid mitigation of strong electric fields. In this embodiment, the doping concentration of the buffer region is 1e 13 ~1e 17 / cm 3 In one example, the concentrations in the buffer region are 1e 13 / cm 3 , 1e 14 / cm 3 , 1e 17 / cm 3 , can be selected according to the specific scenario, and the corresponding scheme falls into the protection scheme of this disclosure.

[0066] It is understandable that, considering that the thickness, area and / or doping concentration of multiple buffer regions are different, multiple processes can be used to form the buffer region to ensure that the buffer region meets the requirements. It should be noted that the thickness, area and / or doping concentration of the buffer region can refer to the contents of the above embodiments, and the combined solution falls within the scope of protection of the present disclosure.

[0067] In another embodiment, considering that the voids provided by the buffer region increase when expanding from the inside to the outside, when the thickness of each buffer region is the same, see Figure 8 , the areas of multiple buffer regions increase from the inside to the outside, so that the buffer regions away from the center provide more holes to facilitate the rapid mitigation of strong electric fields. In one example, the area of ​​the buffer region can be 1 to 100 square microns, such as 10 square microns, 20 square microns, 30 square microns, 40 square microns, 50 square microns, 60 square microns, 70 square microns, 80 square microns, 90 square microns and 100 square microns, which can be selected according to the specific scenario, and the corresponding scheme falls into the protection scheme of the present disclosure. It is understandable that, considering that the thickness of multiple buffer regions is the same, multiple buffer regions can be formed by a one-time (mask) process, thereby improving the yield.

[0068] In another embodiment, when the thickness of the plurality of buffer regions is the same and the area increases from the inside to the outside, see Fig. 9 , the doping concentration of each buffer region in the multiple buffer regions is the same, so that the buffer regions can be formed in the same process, thereby improving productivity and yield. In this embodiment, the doping concentration of the buffer region is 1e 13 ~1e 17 / cm3 In one example, the concentrations in the buffer region are 1e 13 / cm 3 , 1e 14 / cm 3 , 1e 17 / cm 3 , can be selected according to the specific scenario, and the corresponding scheme falls into the protection scheme of this disclosure.

[0069] In another embodiment, when the thickness of the plurality of buffer regions is the same and the area increases from the inside to the outside, see Fig.10 The doping concentration of the multiple buffer regions increases from the inside to the outside, so that the buffer regions at different positions can provide different numbers of holes, which is conducive to weakening the strong electric field between the cathode layer 13 and the substrate layer 12. In this embodiment, the doping concentration of the buffer region is 1e 13 ~1e 17 / cm 3 In one example, the concentrations in the buffer region are 1e 13 / cm 3 , 1e 14 / cm 3 , 1e 17 / cm 3 , can be selected according to the specific scenario, and the corresponding scheme falls into the protection scheme of this disclosure.

[0070] In one embodiment, considering that the diode releases a large amount of heat during the reverse recovery process, an arc groove can be provided at the edge of the PN junction formed by the anode layer 11 and the substrate layer 12. Fig.11 In other words, since the arc-shaped groove 15 is provided at the PN junction formed by the anode layer 11 and the substrate layer 12, a protruding structure 16 is formed at the PN junction formed by the cathode layer 13 and the substrate layer 12. The protruding structure 16 can increase the surface area of ​​the PN junction, thereby facilitating and accelerating the release of heat and preventing the diode from being burned out.

[0071] In one embodiment, the heat sink 20 is attached to the cathode layer side of the diode. Fig.12 The heat dissipation device 20 is provided with Fig.12 The channel 21 of the preset shape is shown, and a liquid medium is arranged in the channel 21, and the liquid medium is used to take away the heat generated by the diode 10 when flowing. In this example, colloidal particles are arranged in the liquid medium, and the diameter of the colloidal particles is smaller than the inner diameter of the channel 21. The colloidal particles are accelerated when subjected to the electromagnetic force of the electromagnetic field.

[0072] See also Fig.13The heat dissipation device 20 includes an upper substrate 23 and a lower substrate 22. A first groove 231 of a preset shape is formed on the upper substrate 23, and a second groove 221 of a preset shape is formed on the lower substrate 22. The first groove 231 and the second groove 221 are formed as follows after the upper substrate 23 and the lower substrate 22 are aligned and bonded. Fig.14 The channel 21 shown. In one embodiment, the heat dissipation device 20 includes an electric field layer 130. The electric field layer 130 includes a staggered positive electrode layer 1301 and a negative electrode layer 1302. The positive electrode layer 1301 and the negative electrode layer 1302 are respectively arranged on both sides of the channel 21 of a preset shape, such as the positive electrode layer 1301 is arranged in the upper substrate 23, and the negative electrode layer 1302 is arranged in the lower substrate 22; the positive electrode layer 1301 and the negative electrode layer 1302 are staggered to generate an inclined electromagnetic field when power is turned on; the electromagnetic field is used to provide a driving force to the colloidal particles to accelerate the flow speed of the liquid medium.

[0073] In one embodiment, the preset shape can be matched with the heat map corresponding to the diode, wherein the heat map refers to an image formed by the temperatures at different positions when the diode is working. The heat map of the diode can be detected in advance. At this time, the higher the heat in the heat map (i.e., the higher the corresponding temperature), the greater the channel density in the preset shape; the lower the heat in the heat map, the smaller the channel density in the preset shape. In this way, in this embodiment, the channel density is adjusted according to the heat of the heat map of the diode, so that the heat generated by the diode can be absorbed as much as possible, thereby achieving the effect of reducing the diode temperature as quickly as possible.

[0074] In one embodiment, see Fig.15 The above-mentioned preset shape includes a bending area 150. The positive electrode layer 1301 and the negative electrode layer 1302 of the electric field layer 130 are arranged alternately about the bending area 150. It can be understood that Fig.15 The reference numeral 150 shows the removal of the positive electrode layer corresponding to the bending area 150, which is convenient for marking and understanding the scheme. Fig.16 The effect of the example is that the positive electrode layer 1301 and the negative electrode layer 1302 are only set in the bending zone 150, and the staggered pairs of positive and negative electrodes are energized in turn, thereby generating an electromagnetic field that forms a certain angle with the channel, and the electromagnetic field generates a forward component force for the colloidal particles; multiple pairs of positive and negative electrodes are energized in turn, which can form an electromagnetic field generated in sequence. At this time, the colloidal particles will be driven by each electromagnetic force in turn, which can ensure that the liquid medium is accelerated at the bend of the channel, thereby ensuring the flow rate of the liquid medium in the bend.

[0075] In one embodiment, see Fig.17 The above-mentioned preset shape includes a straight area 170. The positive electrode layer 1301 and the negative electrode layer 1302 of the electric field layer 130 are arranged alternately with respect to the straight area 170. It can be understood that Fig.17The reference numeral 170 shows the removal of the positive electrode layer corresponding to the straight area 170, which is convenient for marking and understanding the scheme. Fig.18 The effect of the example is that the positive electrode layer 1301 and the negative electrode layer 1302 are only set in the straight area 170, and the staggered pairs of positive and negative electrodes are energized in turn, thereby generating an electromagnetic field that forms a certain angle with the channel. The electromagnetic field generates a forward component force for the colloidal particles. By energizing multiple pairs of positive and negative electrodes in turn, an electromagnetic field generated in a time and space order can be formed. At this time, the colloidal particles will be driven by each electromagnetic force in turn, which can ensure that the liquid medium flows faster in the straight area of ​​the channel, thereby ensuring the flow rate of the liquid medium in the curve.

[0076] In one embodiment, the heat sink 20 further includes a positive pin and a negative pin. In one example, the positive pin is electrically connected to the positive electrode layer of the electric field layer; the negative pin is electrically connected to the negative electrode layer of the electric field layer. The positive pin is connected to the positive electrode of the power supply, and the negative pin is connected to the negative electrode of the power supply. In this way, when the heat sink 20 is powered on, an electromagnetic field can be generated to drive the colloidal particles to move.

[0077] In one embodiment, the heat dissipation device 20 further includes a thermistor. Fig.19 Thermistor Rt is attached to a designated side of the upper substrate 23 and / or the lower substrate 22 to detect the temperature of the liquid medium in the channel. Fig. 20 , the heat dissipation device 20 also includes a voltage-dividing resistor R1 and a switching device Q1. The first end of the voltage-dividing resistor R1 is electrically connected to the power supply VCC, the second end of the voltage-dividing resistor R1 is electrically connected to the first end of the thermistor Rt, and the second end of the thermistor Rt is grounded GND; the first end of the switching device Q1 is electrically connected to the power supply VCC, the second end of the switching device Q1 is electrically connected to the positive electrode layer 1301 of the electric field layer, and the control end of the switching device Q1 is electrically connected to the first end of the thermistor Rt. In this way, when the thermistor Rt detects an increase in temperature, its resistance value increases, thereby increasing the voltage division, increasing the amplification factor of the switching device Q1, that is, increasing the magnetic field strength of the electromagnetic field, which is beneficial to increasing the flow rate of the liquid medium. In addition, in this embodiment, the positive electrode layer always applies a forward voltage, which can ensure that the liquid medium flows in a preset direction.

[0078] In one embodiment, the heat dissipation device 20 includes a liquid inlet and a liquid outlet. Fig.21 , the inner diameter of the liquid inlet In is smaller than the inner diameter of the liquid outlet Out. Thus, in this embodiment, by adjusting the size of the inner diameters of the liquid inlet and the liquid outlet, the speed of liquid inflow and outflow can be adjusted, and the power generated by the liquid after being heated can ensure the flow speed of the liquid, thereby achieving the effect of efficient heat dissipation.

[0079] In one embodiment, the photovoltaic module further includes a plurality of diode pins, a liquid inlet pin and a liquid outlet pin. Fig. 22 , a plurality of diode pins 211 are used to be electrically connected to the diode, a liquid inlet pin 212 is connected to the liquid inlet, and a liquid outlet pin 213 is connected to the liquid outlet 214. The photovoltaic module also includes a base, which includes a plurality of sockets, and the plurality of diode pins 211, the liquid inlet pin 212 and the liquid outlet pin 213 can be respectively inserted into the corresponding sockets.

[0080] In one embodiment, a reflux channel is provided between the liquid inlet pin and the liquid outlet pin of the heat dissipation device 20, such as Fig. 22 As shown in the reflux channel 221 in the figure. The reflux channel 221 can make the liquid medium return from the outlet to the inlet, so as to achieve the effect of internal circulation heat dissipation.

[0081] In this embodiment, an inlet cover is provided in the liquid inlet pin 212, and an outlet cover is provided in the liquid outlet pin 213. In addition, an inlet cover is provided in the liquid inlet pin, and an outlet cover is provided in the liquid outlet pin; the inlet cover is used to seal the liquid inlet pin in a first state, and to seal the reflux channel in a second state; the outlet cover is used to seal the liquid outlet pin in a first state, and to seal the reflux channel in a second state; the first state refers to a state not connected to an external channel, and the second state refers to a state connected to an external channel.

[0082] Take the outlet cover as an example, see Fig.23 In the first state, the pin in the liquid outlet 214 is not inserted into the liquid outlet pin 213, that is, the outlet cover 231 seals the liquid outlet pin 213. At this time, the liquid medium flows from the channel into the return channel 221, and then flows into the liquid inlet pin 212, thereby completing a cycle. Since this cycle of the liquid medium is completed inside the heat sink 20, it is called an internal cycle.

[0083] See also Fig.24 In the second state, the pin in the liquid outlet 214 is inserted into the liquid outlet pin 213 and squeezes the outlet cover 231 to the opening of the reflux channel 221, that is, the outlet cover 231 seals the reflux channel 221, and the liquid medium flows from the channel into the liquid outlet pin 213, thereby flowing out of the heat sink 20. At the same time, the inlet cover can also seal the reflux channel 221, so that the external liquid medium enters the heat sink 20, thereby completing a cycle. Since the liquid medium flows out of the heat sink 20 and circulates between the tank storing the liquid medium and / or multiple heat sinks 20, it is called external circulation.

[0084] It is understandable that the functions of the inlet cover body and the outlet cover body are similar and will not be described in detail here.

[0085] In one embodiment, the diameter of the inlet cover is larger than the inner diameter of the return channel, and a circular groove is provided at the opening of the return channel; when the inlet cover is in the second state, it seals the return channel when it is located in the groove; and the diameter of the outlet cover is larger than the inner diameter of the return channel; a circular groove is provided at the opening of the return channel; when the outlet cover is in the second state, it seals the return channel. Fig.25 The left figure illustrates a scenario in which the return channel 221 is not sealed in the first state, and the right figure illustrates a scenario in which the outlet cover 231 is located in the circular groove 251 to seal the return channel 221 in the second state. Thus, the groove is added in this embodiment, so that the contact area between the cover and the groove is larger, and the effect of sealing the return channel is better.

[0086] In one embodiment, the inlet cover and / or the outlet cover is further provided with a protrusion; the protrusion is used to be inserted into the reflux channel in the second state to seal the reflux channel. Fig.26 In the second state, the protrusion 261 is located inside the reflux channel 221, further sealing the reflux channel and improving the sealing effect.

[0087] In one embodiment, the photovoltaic module further comprises a base. Fig. 22 The base includes a pin jack, a liquid inlet pin plug, and a liquid outlet pin plug. The pin jack is used to fix the diode pin and form an electrical connection; the liquid inlet pin plug is used to insert the liquid inlet pin to allow the liquid medium to flow into the heat sink 20; the liquid outlet pin plug is used to insert the liquid outlet pin to allow the liquid medium to flow out of the heat sink 20. In this way, in this embodiment, by arranging the liquid inlet pin plug and the liquid outlet pin plug on the base, the liquid medium of the heat sink 20 can flow out of the heat sink 20, thereby increasing the length of the channel through which the liquid medium flows and improving the heat dissipation efficiency.

[0088] In one embodiment, the photovoltaic module further includes a tank body storing liquid medium, and the tank body is connected to the liquid inlet pin plug and the liquid outlet pin plug on the base. In this way, the liquid medium in the heat sink 20 of this embodiment can flow into the tank body, so that the liquid medium with a lower temperature in the tank body enters the heat sink 20, thereby improving the heat dissipation efficiency.

[0089] In one embodiment, the photovoltaic module provided in the embodiment of the present disclosure may be a frequency converter, an inverter, a converter, a transformer, or other equipment.

[0090] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the disclosure disclosed herein. The present disclosure is intended to cover any variations, uses, or adaptations that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are to be considered exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0091] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A photovoltaic module, characterized in that: It comprises a diode and a heat sink; the heat sink is attached to one side of the cathode layer of the diode; a channel of a preset shape and an electric field layer are arranged in the heat sink; a liquid medium of colloidal particles is arranged in the channel of the preset shape; the liquid medium is used to take away the heat generated by the diode when flowing; The electric field layer comprises staggered positive electrode layers and negative electrode layers, which are respectively arranged on both sides of the channel of the preset shape; the positive electrode layers and the negative electrode layers are used to generate an electromagnetic field when power is turned on; the electromagnetic field is used to provide driving force to the colloidal particles.

2. The photovoltaic module according to claim 1, characterized in that: The preset shape matches a heat map corresponding to the diode, and the heat map refers to an image formed by temperatures at different positions when the diode is working.

3. The photovoltaic module according to claim 1, characterized in that: The preset shape includes a bending area, and the positive electrode layer and the negative electrode layer of the electric field layer and the bending area are arranged opposite to each other in sequence.

4. The photovoltaic module according to claim 1, characterized in that: The preset shape includes a straight area, and the positive electrode layer and the negative electrode layer of the electric field layer and the straight area are arranged opposite to each other in sequence.

5. The photovoltaic module according to claim 1, characterized in that: The heat dissipation device further comprises a positive electrode pin and a negative electrode pin; the positive electrode pin is electrically connected to the positive electrode layer of the electric field layer; the negative electrode pin is electrically connected to the negative electrode layer of the electric field layer.

6. The photovoltaic module according to claim 1, characterized in that: The heat dissipation device comprises a thermistor, an upper substrate and a lower substrate; a first groove of a preset shape is formed on the upper substrate, a second groove of a preset shape is formed on the lower substrate, and the first groove and the second groove form the channel after the upper substrate and the lower substrate are aligned and bonded; The thermistor is attached to a designated side of the upper substrate and / or the lower substrate to detect the temperature of the liquid medium in the channel.

7. The photovoltaic module according to claim 6, characterized in that: The heat dissipation device also includes a voltage dividing resistor and a switch device; The first end of the voltage-dividing resistor is electrically connected to a power source, the second end of the voltage-dividing resistor is electrically connected to the first end of the thermistor, and the second end of the thermistor is grounded; The first end of the switch device is electrically connected to a power source, the second end of the switch device is electrically connected to the positive electrode layer of the electric field layer, and the control end of the switch device is electrically connected to the first end of the thermistor.

8. The photovoltaic module according to claim 1, characterized in that: The photovoltaic module also includes a plurality of diode pins, a liquid inlet pin and a liquid outlet pin; the diode pin is used to be electrically connected to the diode, the liquid inlet pin is connected to the liquid inlet, and the liquid outlet pin is connected to the liquid outlet.

9. The photovoltaic module according to claim 8, characterized in that: A reflux channel is provided between the liquid inlet tube pin and the liquid outlet tube pin; an inlet cover is provided in the liquid inlet tube pin, and an outlet cover is provided in the liquid outlet tube pin; The inlet cover is used to seal the liquid inlet pin in a first state, and to seal the reflux channel in a second state; The outlet cover is used to seal the liquid outlet pin in a first state and to seal the reflux channel in a second state; The first state refers to a state in which an external channel is not connected, and the second state refers to a state in which an external channel is connected.

10. The photovoltaic module according to claim 9, characterized in that: The diameter of the inlet cover body is larger than the inner diameter of the reflux channel; a circular groove is provided at the opening of the reflux channel; the inlet cover body seals the reflux channel when it is located in the groove in the second state; and the diameter of the outlet cover body is larger than the inner diameter of the reflux channel; a circular groove is provided at the opening of the reflux channel; the outlet cover body seals the reflux channel when it is located in the groove in the second state.

11. The photovoltaic module according to claim 10, characterized in that: The inlet cover body and / or the outlet cover body are further provided with a protrusion; the protrusion is used to be inserted into the reflux channel in the second state to seal the reflux channel.

12. The photovoltaic module according to claim 8, characterized in that: Also included is a base, the base including a pin jack, a liquid inlet pin plug, and a liquid outlet pin plug; The pin socket is used to fix the diode pin and form an electrical connection; The liquid inlet pin plug is used to be inserted into the liquid inlet pin to allow the liquid medium to flow into the heat dissipation device; The liquid outlet pin plug is used to be inserted into the liquid outlet pin to allow the liquid medium to flow out of the heat dissipation device.

13. The photovoltaic module according to claim 12, characterized in that: It also includes a tank body storing a liquid medium, and the tank body is communicated with the liquid inlet pin plug and the liquid outlet pin plug on the base respectively.

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