Local rapid tinning process method for high-density multi-array inter-board connector pins

Abstract

A local rapid tin coating process method for pins of a high-density multi-array inter-board connector comprises the steps that a protection tool is designed, and the tool comprises a handle, an inter-board connector body protection module, a positioning module, a pin protection sleeve and a base; the inter-board connector body protection module, the positioning module and the base are provided with corresponding hole positions according to the arrangement positions of pins of the inter-board connector; the inter-board connector comprises a cleaning handle, an inter-board connector body protection module, a positioning module, a pin protection sleeve and a base. Processing pin protection sleeves according to the number and the length of the pins of the plate connector; the final assembly of the inter-board connector to be tinned is realized; and after it is confirmed that the temperature in the tin pot meets the requirement, the tool and the inter-board connector are vertically immersed into the gold-removing tin pot, tin liquid is required to submerge but not exceed the inter-board connector body protection module, the tool moves in the left-right direction after being put into the tin pot, and the protection tool is vertically taken out upwards after preset time.

Description

Technical Field

[0001] The invention relates to a local rapid tinning process for high-density multi-arrangement inter-board connector pins, which is applied to the local rapid tinning of high-density multi-arrangement inter-board connectors used in national defense and military electronic products. Background Art

[0002] Inter-board connectors are electrical connectors that interconnect printed circuit board assemblies and gradually transition to leadless chassis. With the increasing miniaturization and integration of defense and military electronic products, inter-board connectors are gradually replacing the original inter-board wiring harness soft connections.

[0003] High-density multi-array inter-board connectors have the particularity of their structure and usage, that is, the pins must be soldered on the printed circuit board and have a certain length of non-tin-plated parts to be plugged into the connectors on the adjacent boards.

[0004] The current method for tinning pins of high-density multi-array inter-board connectors is: ① prepare solder resist → ② manually apply solder resist to the parts of each pin that do not need tinning → ③ cure the solder resist → ④ manually tin the pins one by one with a soldering iron.

[0005] The traditional method of manually applying solder mask and then manually tinning the pins one by one with a soldering iron has certain effects in terms of process implementation and operational feasibility, but it is difficult to ensure the consistency and reliability of the product, and it also brings potential quality risks to the product. Therefore, a new tinning process method is urgently needed to achieve the tin amount, speed, consistency of tinning of each pin, and the stability and uniformity of the tinning quality. Summary of the invention

[0006] The technical problem solved by the present invention is to overcome the deficiencies of the prior art and provide a modular and detachable heat protection structure for a launch vehicle.

[0007] The technical solution of the present invention is: a method for local rapid tinning of high-density multi-arrangement board-to-board connector pins, comprising:

[0008] Design a protective tool, the tool comprising a handle, a board-to-board connector body protection module, a positioning module, a pin protection sleeve and a base, and corresponding holes are punched on the board-to-board connector body protection module, the positioning module and the base according to the arrangement position of the board-to-board connector pins;

[0009] Cleaning handle, inter-board connector body protection module, positioning module, pin protection sleeve and base;

[0010] Process the pin protection cover according to the number and length of the board connector pins;

[0011] Insert the processed pin protection sleeves into the holes on the base in turn and fix them, assemble the positioning module, the base and the pin protection sleeves into a combination, and insert screws on both sides of the combination;

[0012] Fix the panel connector body protection module on the screw rod and install the handle;

[0013] After confirming that the position and direction of the inter-board connector to be tinned are correct, place the inter-board connector to be tinned into the inter-board connector body protection module, and make each pin vertically penetrate the inner hole of each pin protection sleeve in the inter-board connector body protection module and the positioning module at the same time until it is installed in place;

[0014] Move the positioning module vertically toward the base to the top of the base to achieve the final assembly of the inter-board connector to be tinned;

[0015] After confirming that the temperature in the tin pot meets the requirements, vertically immerse the tooling together with the inter-board connector into the gold removal tin pot. The tin liquid is required to submerge but not exceed the inter-board connector body protection module. After the tooling is placed in the tin pot, move it in the left and right direction, and after a preset time, take out the protection tooling vertically upwards.

[0016] Preferably, the second tinning is performed in the same manner as the first tinning.

[0017] Preferably, the second tinning requires replacement of the tin pot.

[0018] Preferably, the tinning process takes 2-3 seconds and moves 5-7 cm in the left and right directions.

[0019] Preferably, the coating is cooled at room temperature for at least 20 seconds after two tinning operations.

[0020] Preferably, the inter-board connector body protection module is a rectangular structure, with a groove in the center that is consistent with the shape of the board connector body, holes corresponding to the pin positions of the board connector and positioning pin holes are provided at the bottom of the groove, and through holes for screws to pass through are provided on both sides of the groove.

[0021] Preferably, the shape of the groove ensures that when the board connector body is installed therein, all the parts of the board connector pins to be tinned are located outside the bottom surface of the groove.

[0022] Preferably, there is a gap between the pin protection sleeve and the pin of the board connector, and the gap ranges from 0.04mm to 0.05mm.

[0023] Preferably, there is a gap between the holes on the base and the holes on the positioning module and the pin protection cover, and the gap range is 0.05-0.1 mm.

[0024] Preferably, the board-to-board connector body protection module, positioning module, base, and pin protection sleeve are made of materials that can withstand high temperatures of at least 300 degrees.

[0025] The beneficial effects of the present invention compared with the prior art are:

[0026] The method of the present invention fully recognizes the particularities of the structure and usage of the inter-board connector, cleverly designs and manufactures special protective tooling for the non-tin-plated parts of the inter-board connector pins, thereby achieving the one-time protection of all non-tin-plated parts of the pins of an inter-board connector and the one-time tin-plating function of all non-protected parts of the pins of a single inter-board connector.

[0027] The method of the invention eliminates the problems of uneven manual solder resist coating, long curing time, and poor product consistency, poor reliability, and long time consumption caused by manual individual pin tinning process methods, and improves the quality stability and reliability of electronic products using high-density multi-array inter-board connectors in the national defense and military industries. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 Flow chart of the method of the present invention;

[0029] Figure 2 It is a schematic diagram of the tooling of the present invention;

[0030] Figure 3 This is a schematic diagram of the inter-board connector body protection module of the present invention;

[0031] Figure 4 It is a schematic diagram of the handle of the present invention;

[0032] Figure 5 This is a schematic diagram of a positioning module of the present invention;

[0033] Figure 6 It is a schematic diagram of the base of the present invention;

[0034] Figure 7 This is a schematic diagram of assembling a pin protection sleeve of the present invention;

[0035] Figure 8 It is a schematic diagram of the combination of the positioning module, the base and the pin protection sleeve;

[0036] Fig. 9 This is a schematic diagram of assembling the screw and nut;

[0037] Fig.10 To assemble the handle and inter-board connector body protection module;

[0038] Fig.11 A schematic diagram of the inter-board connector is shown;

[0039] Fig.12Schematic diagram of sliding the positioning module down to the bottom of the pin protection sleeve; DETAILED DESCRIPTION

[0040] The present invention is described in detail below with reference to the accompanying drawings and examples.

[0041] In view of the development trend of miniaturization and integration of aerospace electronic products, high-density multi-arrangement inter-board connectors have shown a trend of replacing existing inter-board wiring harness connections. When in use, the pins must be soldered on the printed circuit board and have a certain length of non-tin-plated parts to be plugged into the connectors on the adjacent boards.

[0042] According to the national military standard, the gold-plated device pins must be tinned and gold-removed before being welded on the printed circuit board. Therefore, the gold-plated pins of high-density multi-arrangement inter-board connectors must be tinned and gold-removed locally before being welded on the printed circuit board. However, since the number of pins of high-density multi-arrangement inter-board connectors is ≥80, the number of pin columns is ≥4, and the distance between adjacent pins is only 1.27mm, the local tinning of each pin is currently done manually, and the non-tinning parts (i.e., the parts that are connected to the docking connector) need to be coated with solder resist in advance for protection. This method is time-consuming and it is difficult to ensure the consistency of the tinning position, tin amount, and appearance of each pin of the same inter-board connector, which affects the subsequent welding quality.

[0043] The present invention provides a method for local rapid tinning of pins of high-density multi-arranged board-to-board connectors, such as Figure 1 As shown, the following steps are included:

[0044] (1) Design protective equipment, such as Figure 2 As shown, the tooling includes a handle, a board-to-board connector body protection module, a positioning module, a pin protection sleeve and a base, and corresponding holes are punched on the board-to-board connector body protection module, the positioning module and the base according to the arrangement position of the board-to-board connector pins;

[0045] like Figure 3 , 5 , 6, the board connector body protection module, the positioning module, and the base are provided with corresponding holes according to the arrangement position of the board connector pins; the number of the pin protection sleeves is consistent with the number of the board connector pins, and is installed in the corresponding holes on the base; the corresponding holes on the positioning module pass through the pin protection sleeves, and the positioning module is connected to the two sides of the base by screws, and the positioning module can move up and down along the screws; the board connector body protection module is fixedly installed on the screws and is used to place the main body of the board connector, and the pins of the board connector extend from the lower end of the board connector body protection module and enter the pin protection sleeves. The position of the board connector body protection module ensures that the upper end of the pin protection sleeve and the lower end of the board connector body protection module are the parts to be tinned for the board connector pins, and the handle ( Figure 4 ) is fixedly mounted on the board connector body protection module and is used as a lifting device during tinning.

[0046] The present invention provides a preferred embodiment in which the board-to-board connector body protection module, positioning module, base, and pin protection sleeve are all made of Teflon material, and the inner diameter of the pin protection sleeve is adapted to the inner diameter of the pin. There is a gap between the hole position on the base and the hole position on the positioning module and the pin protection sleeve, and the gap range is 0.05-0.1mm.

[0047] (2) Cleaning handle, board-to-board connector body protection module, positioning module, pin protection sleeve and base;

[0048] Check that the handle, board connector body protection module, positioning module, pin protection sleeve and base are intact and undamaged, then wipe them clean with a non-woven cloth dipped in a small amount of anhydrous ethanol. After the anhydrous ethanol has completely evaporated, proceed to step (3).

[0049] (3) Process the pin protection cover according to the number and length of the board connector pins; the cutting part must be vertical, without tilt, damage or contamination.

[0050] (4) Insert the processed pin protection sleeve into each hole on the base in turn and fix it (such as Figure 7 Assemble the positioning module, base and pin protection sleeve into a combination (as shown in Figure 8 As shown), the fixed mold block is required not to damage the pin protection sleeve, cover the pin protection sleeve, and insert screws (M4×25) on both sides of the assembly (as shown Fig. 9 shown);

[0051] (5) Fix the panel connector body protection module on the screw and install the handle;

[0052] Use the M4 nut to connect the board connector body protection module, handle, positioning module and base assembly into a whole. Fig.10 shown.

[0053] (6) Move the positioning module toward the board-to-board connector body protection module to ensure that the positioning module covers the top of each pin protection sleeve.

[0054] (7) After confirming that the position and direction of the inter-board connector to be tinned are correct, place the inter-board connector to be tinned into the inter-board connector body protection module, so that each pin is vertically inserted into the inner hole of each pin protection sleeve in the inter-board connector body protection module and the positioning module at the same time until it is installed in place. Fig.11 As shown;

[0055] (8) Move the positioning module vertically toward the base to the top of the base to achieve the final assembly of the inter-board connector to be tinned; Fig.12 shown.

[0056] After checking that the pins of the inter-board connector to be tinned correspond one by one to the holes on the inter-board connector body protection module, the module to be positioned is slowly and vertically moved toward the base and the tinned inter-board connector toward the inter-board connector body protection module until it cannot move. The device for local rapid tinning of high-density and multi-arrangement inter-board connector pins is completed.

[0057] (9) After confirming that the temperature in the tin pot meets the requirements, vertically immerse the tooling together with the board connector into the gold removal tin pot. The tin liquid is required to submerge but not exceed the board connector body protection module. After the tooling is placed in the tin pot, it moves in the left and right direction. After a preset time, the protection tooling is taken out vertically upward to complete the first tinning. The tinning process is 2-3 seconds and moves 5-7 cm in the left and right directions.

[0058] (10) Perform the second tinning according to step (9) above (Note: the tin pot needs to be replaced, and the de-goldened tin pot cannot be used for the second tinning).

[0059] (11) Remove the tinned connector and check the quality of the pin tinning. The tinning is complete.

[0060] The present invention abandons the traditional method of manually coating solder resist on the parts of each pin that do not need tinning, and then manually tinning the pins one by one, and invents a high-density multi-arrangement board connector pin local rapid tinning tooling composed of a handle, an inter-board connector body protection module, a positioning module, a base, a pin protection sleeve (made of Teflon, with an inner diameter adapted to the pin diameter) and a screw nut. By realizing the assembly of the device and the protection of the non-tinning parts within 2min to 3min, a foundation is laid for the subsequent one-time completion of the tinning of each pin tinning part. Taking the tinning of an inter-board connector with 80 pins as an example, after adopting the device, under the premise of 100% qualified tinning quality, the tinning time is shortened from about 15 minutes of manual tinning to 3 minutes, and the efficiency is improved by about 4 times.

[0061] The contents not described in detail in the specification of the present invention belong to the common knowledge of the professionals in this field.

Claims

1. A method for local rapid tinning of high-density multi-array board-to-board connector pins, characterized in that include: Design a protective tool, the tool comprising a handle, a board-to-board connector body protection module, a positioning module, a pin protection sleeve and a base, and corresponding holes are punched on the board-to-board connector body protection module, the positioning module and the base according to the arrangement position of the board-to-board connector pins; Cleaning handle, inter-board connector body protection module, positioning module, pin protection sleeve and base; Process the pin protection cover according to the number and length of the board connector pins; Insert the processed pin protection sleeves into the holes on the base in turn and fix them, assemble the positioning module, the base and the pin protection sleeves into a combination, and insert screws on both sides of the combination; Fix the panel connector body protection module on the screw rod and install the handle; After confirming that the position and direction of the inter-board connector to be tinned are correct, place the inter-board connector to be tinned into the inter-board connector body protection module, and make each pin vertically penetrate the inner hole of each pin protection sleeve in the inter-board connector body protection module and the positioning module at the same time until it is installed in place; Move the positioning module vertically toward the base to the top of the base to achieve the final assembly of the inter-board connector to be tinned; After confirming that the temperature in the tin pot meets the requirements, vertically immerse the tooling together with the inter-board connector into the gold removal tin pot. The tin liquid is required to submerge but not exceed the inter-board connector body protection module. After the tooling is placed in the tin pot, move it in the left and right direction, and after a preset time, take out the protection tooling vertically upwards.

2. The method according to claim 1, characterized in that: Carry out the second tinning in the same way as the first tinning.

3. The method according to claim 2, characterized in that: The second tinning process requires replacement of the tin pot.

4. The method according to claim 1, characterized in that: The tinning process takes 2-3 seconds to move 5-7cm in the left and right directions.

5. The method according to claim 1, characterized in that: After two tinning steps, cool to room temperature for at least 20 seconds.

6. The method according to claim 1, characterized in that: The board connector body protection module is a rectangular structure, with a groove in the center that is consistent with the shape of the board connector body, holes corresponding to the pin positions of the board connector and positioning pin holes are provided at the bottom of the groove, and through holes for screws to pass through are provided on both sides of the groove.

7. The method according to claim 6, characterized in that: The shape of the groove ensures that when the board connector body is installed therein, all the parts of the board connector pins to be tinned are located outside the bottom surface of the groove.

8. The method according to claim 1, characterized in that: There is a gap between the pin protection sleeve and the pin of the board connector, and the gap range is 0.04mm-0.05mm.

9. The method according to claim 1, characterized in that: There is a gap between the holes on the base and the holes on the positioning module and the pin protection cover, and the gap range is 0.05-0.1mm.

10. The method according to claim 1, characterized in that: The inter-board connector body protection module, positioning module, base, and pin protection sleeve are made of materials that can withstand high temperatures of at least 300 degrees.

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