A device for local rapid tinning of high-density multi-arrangement board-to-board connector pins

Abstract

A device for local rapid tinning of pins of a high-density multi-arrangement inter-board connector, wherein corresponding holes are punched on an inter-board connector body protection module, a positioning module, and a base according to the arrangement positions of the inter-board connector pins; the number of the pin protection sleeves is consistent with the number of board connector pins, and is installed in the corresponding holes on the base; the corresponding holes on the positioning module pass through the pin protection sleeves, and the positioning module is connected to both sides of the base by screws, and the positioning module can move up and down along the screws; the inter-board connector body protection module is fixedly installed on the screws and is used to place the main body of the board connector, and the pins of the board connector extend from the lower end of the inter-board connector body protection module and enter the pin protection sleeves, and the position of the board connector body protection module ensures that the upper end of the pin protection sleeve and the lower end of the inter-board connector body protection module are the parts of the inter-board connector pins to be tinned.

Description

Technical Field

[0001] The invention relates to a device for local rapid tinning of pins of high-density multi-arrangement inter-board connectors, which is applied to local rapid tinning of high-density multi-arrangement inter-board connectors used in national defense and military electronic products. Background Art

[0002] Inter-board connectors are electrical connectors that interconnect printed circuit board assemblies and gradually transition to leadless chassis. With the increasing miniaturization and integration of defense and military electronic products, inter-board connectors are gradually replacing the original inter-board wiring harness soft connections.

[0003] High-density multi-array inter-board connectors have the particularity of their structure and usage, that is, the pins must be soldered on the printed circuit board and have a certain length of non-tin-plated parts to be plugged into the connectors on the adjacent boards.

[0004] The current method for tinning pins of high-density multi-array inter-board connectors is: ① prepare solder resist → ② manually apply solder resist to the parts of each pin that do not need tinning → ③ cure the solder resist → ④ manually tin the pins one by one with a soldering iron.

[0005] The traditional method of manually coating solder mask and then manually tinning the pins one by one with a soldering iron has certain effects in terms of process method and operational feasibility, but it is difficult to ensure the consistency and reliability of the product, and it also brings potential quality risks to the product. Therefore, there is an urgent need for a device suitable for local rapid tinning of high-density multi-array inter-board connector pins, which can realize a rapid tinning process. Summary of the invention

[0006] The technical problem solved by the present invention is: to overcome the shortcomings of the prior art and provide a local rapid tinning device for pins of high-density multi-array inter-board connectors, through which the efficiency of local manual tinning of pins of high-density multi-array inter-board connectors can be doubled.

[0007] The main content of the invention is: a device for local rapid tinning of pins of high-density multi-arranged board-to-board connectors, comprising a handle, a board-to-board connector body protection module, a positioning module, a base, a pin protection sleeve, a base and a screw nut;

[0008] The board connector body protection module, the positioning module, and the base are provided with corresponding holes according to the arrangement position of the board connector pins; the number of the pin protection sleeves is consistent with the number of the board connector pins, and are installed in the corresponding holes on the base; the corresponding holes on the positioning module pass through the pin protection sleeves, and the positioning module is connected to both sides of the base by screws, and the positioning module can move up and down along the screws; the board connector body protection module is fixedly installed on the screws and is used to place the main body of the board connector, and the pins of the board connector extend from the lower end of the board connector body protection module and enter the pin protection sleeves. The position of the board connector body protection module ensures that the upper end of the pin protection sleeve and the lower end of the board connector body protection module are the parts of the board connector pins to be tinned, and the handle is fixedly mounted on the board connector body protection module, which is used as a hoisting device during tinning.

[0009] Preferably, there is a gap between the pin protection sleeve and the pin of the board connector, and the gap ranges from 0.04mm to 0.05mm.

[0010] Preferably, there is a gap between the holes on the base and the holes on the positioning module and the pin protection cover, and the gap range is 0.05-0.1 mm.

[0011] Preferably, the board-to-board connector body protection module, positioning module, base, and pin protection sleeve are made of materials that can withstand high temperatures of at least 300 degrees.

[0012] Preferably, the inter-board connector body protection module, positioning module, base, and pin protection sleeve are made of Teflon material.

[0013] Preferably, the positioning module moves to the upper part of the base and fits with the base during the tinning process.

[0014] Preferably, the inter-board connector body protection module is a rectangular structure, with a groove in the center that is consistent with the shape of the board connector body, holes corresponding to the pin positions of the board connector and positioning pin holes are provided at the bottom of the groove, and through holes for screws to pass through are provided on both sides of the groove.

[0015] Preferably, the shape of the groove ensures that when the board connector body is installed therein, all the parts of the board connector pins to be tinned are located outside the bottom surface of the groove.

[0016] The beneficial effects of the present invention compared with the prior art are:

[0017] The device of the present invention fully recognizes the particularity of the structure and use occasion of the inter-board connector, and cleverly designs and manufactures a special protective tool for the non-tin-plated parts of the pins of the inter-board connector, so as to realize the one-time protection of all the non-tin-plated parts of the pins of an inter-board connector and the one-time tin-plating function of all the non-protected parts of the pins of a single inter-board connector. The device of the present invention can improve the quality stability and reliability of electronic products with high-density multi-arrangement inter-board connectors. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the device of the present invention;

[0019] Figure 2 This is a schematic diagram of the inter-board connector body protection module of the present invention;

[0020] Figure 3 It is a schematic diagram of the handle of the present invention;

[0021] Figure 4 This is a schematic diagram of a positioning module of the present invention;

[0022] Figure 5 It is a schematic diagram of the base of the present invention. DETAILED DESCRIPTION

[0023] In view of the development trend of miniaturization and integration of aerospace electronic products, high-density multi-arrangement inter-board connectors have shown a trend of replacing existing inter-board wiring harness connections. When in use, the pins must be soldered on the printed circuit board and have a certain length of non-tin-plated parts to be plugged into the connectors on the adjacent boards.

[0024] Before the pins of the gold-plated device are welded on the printed circuit board, they must be tinned and gold-removed. Before the high-density multi-row board connector is welded on the printed circuit board, the local position of the gold-plated pins must be tinned and gold-removed. The number of pins of the high-density multi-row board connector is ≥80, the number of pin columns is ≥4, and the distance between adjacent pins is 1.27mm. The device provided by the present invention can be used for tinning the pins of the high-density multi-row board connector mentioned above. The tinning of the pins of the board connectors of other models can also be completed by appropriately modifying the device of the present invention under the guidance of the idea of ​​the present invention.

[0025] like Figure 1 As shown, the present invention provides a device for local rapid tinning of high-density multi-array board connector pins, such as Figure 2 , 4As shown in , 5, the board connector body protection module, the positioning module, and the base are provided with corresponding holes according to the arrangement position of the board connector pins; the number of the pin protection sleeves is consistent with the number of the board connector pins, and is installed in the corresponding holes on the base; the corresponding holes on the positioning module pass through the pin protection sleeves, and the positioning module is connected to the two sides of the base by screws, and the positioning module can move up and down along the screws; the board connector body protection module is fixedly installed on the screws and is used to place the main body of the board connector, and the pins of the board connector extend from the lower end of the board connector body protection module and enter the pin protection sleeves. The position of the board connector body protection module ensures that the upper end of the pin protection sleeve and the lower end of the board connector body protection module are the parts to be tinned for the board connector pins, and the handle ( Figure 3 ) is fixedly mounted on the board connector body protection module and is used as a lifting device during tinning.

[0026] The present invention provides a preferred embodiment in which the board-to-board connector body protection module, positioning module, base, and pin protection sleeve are all made of Teflon material, and the inner diameter of the pin protection sleeve is adapted to the inner diameter of the pin, and the gap between the two is δ0.15mm. There is a gap between the hole position on the base and the hole position on the positioning module and the pin protection sleeve, and the gap range is 0.05-0.1mm.

[0027] like Figure 2 As shown, the board connector body protection module is a rectangular parallelepiped structure, with a groove in the center that is consistent with the shape of the board connector body, holes corresponding to the pin positions of the board connector and positioning pin holes are provided at the bottom of the groove, and through holes for screws to pass through are provided on both sides of the groove. The shape of the groove ensures that when the board connector body is installed therein, the parts of the board connector pins to be tinned are all located outside the bottom surface of the groove.

[0028] During assembly, the lower end of the pin protection cover is glued and fixed to the corresponding hole of the base. Before tinning, check that the pins of the board connector to be tinned correspond to the holes on the board connector body protection module one by one, and then move the module to be positioned vertically and slowly toward the base and the board connector to the board connector body protection module until it cannot move. And ensure that all the pins to be tinned are located between the upper end of the pin protection cover and the lower end of the board connector body protection module.

[0029] Taking the tinning of 80-pin inter-board connectors as an example, after adopting the device, under the premise of 100% qualified tinning quality, the tinning time is shortened from about 15 minutes of original manual tinning to 3 minutes, and the efficiency is improved by about 4 times.

[0030] The contents not described in detail in the specification of the present invention belong to the common knowledge of those skilled in the art.

Claims

1. A device for local rapid tinning of high-density multi-array board connector pins, characterized in that: It includes a handle, an inter-board connector body protection module, a positioning module, a base, a pin protection sleeve, a base and a screw nut; The inter-board connector body protection module, positioning module, and base are provided with corresponding holes according to the arrangement position of the inter-board connector pins; The number of the pin protection sleeves is consistent with the number of pins of the board connector, and they are installed in the corresponding holes on the base; the corresponding holes on the positioning module pass through the pin protection sleeves, and the positioning module is connected to both sides of the base by screws, and the positioning module can move up and down along the screws; the board connector body protection module is fixedly installed on the screws and is used to place the main body of the board connector. The pins of the board connector extend from the lower end of the board connector body protection module and enter the pin protection sleeves. The position of the board connector body protection module ensures that the upper end of the pin protection sleeve and the lower end of the board connector body protection module are the parts of the board connector pins to be tinned, and the handle is fixedly mounted on the board connector body protection module, which is used as a hoisting device during tinning.

2. The device according to claim 1, characterized in that: There is a gap between the pin protection sleeve and the pin of the board connector, and the gap range is 0.04mm-0.05mm.

3. The device according to claim 1, characterized in that: There is a gap between the holes on the base and the holes on the positioning module and the pin protection cover, and the gap range is 0.05-0.1mm.

4. The device according to claim 1, characterized in that: The inter-board connector body protection module, positioning module, base, and pin protection sleeve are made of materials that can withstand high temperatures of at least 300 degrees.

5. The device according to claim 4, characterized in that: The inter-board connector body protection module, positioning module, base, and pin protection sleeve are made of Teflon.

6. The device according to claim 1, characterized in that: The positioning module moves to the upper part of the base and fits with the base during the tinning process.

7. The device according to claim 1, characterized in that: The board connector body protection module is a rectangular structure, with a groove in the center that is consistent with the shape of the board connector body, holes corresponding to the pin positions of the board connector and positioning pin holes are provided at the bottom of the groove, and through holes for screws to pass through are provided on both sides of the groove.

8. The device according to claim 7, characterized in that: The shape of the groove ensures that when the board connector body is installed therein, all the parts of the board connector pins to be tinned are located outside the bottom surface of the groove.

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