Electronic devices

Abstract

The present application discloses an electronic device, belonging to the technical field of electronic products. The electronic device comprises: a back panel; a camera appearance assembly, the camera appearance assembly is mounted on the outer side of the back panel; a speaker module, the speaker module is arranged on the side of the camera appearance assembly close to the back panel, the speaker module comprises a front cavity and a rear cavity, the front cavity is connected to the external space through a sound outlet channel; a mainboard bracket, the speaker module is arranged between the mainboard bracket and the camera appearance assembly; at least one resonant cavity, the resonant cavity is connected to the sound outlet channel; wherein the resonant cavity is formed in the camera appearance assembly, and / or, the resonant cavity is formed on the mainboard bracket.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic products, and specifically relates to an electronic device. Background Art

[0002] With the rapid development of mobile communication technology, terminal devices such as tablet computers and mobile phones have become indispensable electronic devices in people's daily lives. The audio playback quality of electronic devices has become an important indicator for measuring electronic devices. Speakers are a commonly used electro-acoustic conversion device, and speakers are installed in a large number of electronic products to play sound.

[0003] In recent years, electronic devices have been developed towards the characteristics of long standby time and thinness, and the space for installing consumer electronic audio devices in electronic products has also been compressed. Due to the installation position of the speaker module, the speaker's sound channel is lengthened, and the speaker's bandwidth is getting smaller and smaller, resulting in the lack of high-frequency details in the sound played by the speaker module and insufficient sound clarity. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide an electronic device that can solve the problem of missing high-frequency details in the sound played by the speaker module.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides an electronic device, including:

[0007] Back panel;

[0008] A camera appearance component, wherein the camera appearance component is mounted on the outer side of the back plate;

[0009] A speaker module, the speaker module is arranged on a side of the camera appearance component close to the back plate, the speaker module includes a front cavity and a rear cavity, and the front cavity is connected to the external space through a sound outlet channel;

[0010] A mainboard bracket, wherein the speaker module is arranged between the mainboard bracket and the camera appearance component;

[0011] At least one resonant cavity, the resonant cavity is connected to the sound outlet channel of the speaker module; wherein the resonant cavity is formed in the camera appearance component, and / or the resonant cavity is formed on the mainboard bracket.

[0012] In the embodiment of the present application, by setting at least one resonant cavity in the camera appearance component and / or on the mainboard bracket, the resonant cavity is connected to the sound outlet channel of the speaker module, so that the setting of the resonant cavity can be realized without occupying the volume of the rear cavity and increasing the thickness of the electronic device. By setting the resonant cavity, the frequency response of the speaker module in the range of 7.5-10KHz can be improved, so that the details of the mid-high frequency are improved, and the external sound quality of the speaker module is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A schematic diagram showing a cross-sectional structure of an electronic device according to an embodiment of the present invention;

[0014] Figure 2 A schematic diagram showing the structure of an electronic device according to an embodiment of the present invention;

[0015] Figure 3 A schematic diagram showing the structure of a resonant cavity according to an embodiment of the present invention;

[0016] Figure 4 A second schematic diagram showing a cross-sectional structure of an electronic device according to an embodiment of the present invention;

[0017] Figure 5 A third schematic diagram showing a cross-sectional structure of an electronic device according to an embodiment of the present invention;

[0018] Figure 6 An exploded schematic diagram showing an electronic device according to an embodiment of the present invention;

[0019] Figure 7 A schematic diagram showing a frequency response comparison curve according to an embodiment of the present invention.

[0020] Description of reference numerals:

[0021] 1-back panel; 100-second through hole; 2-camera appearance assembly; 21-camera protective cover; 210-cavity; 22-camera glass cover; 23-glass cover sealant; 24-protective cover sealant; 25-back panel sealant; 3-speaker module; 31-shell; 310-first through hole; 3a-upper shell; 3b-lower shell; 3b0-front cavity cover; 32-speaker unit; A-front cavity; B-rear cavity; 4-resonance cavity; C-first acoustic resistance element; 5-mainboard; 6-mainboard bracket; 7-screen; 8-frame; 81-frame; 82-middle plate; 9-micro gap; 10-sound outlet; D-second acoustic resistance element; E-screen sealant. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0023] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here. In addition, the "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally represents that the objects associated with each other are in an "or" relationship.

[0024] The control method provided in the embodiment of the present application is described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0025] Please refer to Figures 1 to 6 , an embodiment of the present invention provides an electronic device, including:

[0026] Back panel 1;

[0027] A camera appearance component 2, which is installed on the outer side of the back plate 1;

[0028] The speaker module 3 is arranged on a side of the camera appearance component 2 close to the back plate 1. The speaker module 3 includes a front cavity A and a rear cavity B. The front cavity A is connected to the external space through a sound outlet channel.

[0029] The mainboard bracket 6 and the speaker module 3 are arranged between the mainboard bracket 6 and the camera appearance component 2;

[0030] At least one resonant cavity 4 is connected to the sound output channel of the speaker module 3; wherein the resonant cavity 4 is formed in the camera appearance component 2, and / or the resonant cavity 4 is formed on the mainboard bracket 6.

[0031] For example, only two resonant cavities 4 are provided in the camera appearance component 2; for example, only two resonant cavities 4 are provided on the mainboard bracket 6; for example, one resonant cavity 4 is provided in the camera appearance component 2, and one resonant cavity 4 is provided on the mainboard bracket 6. Here, the number of resonant cavities 4 is only an example and is not limited thereto.

[0032] For example, Figure 1In the embodiment, the back plate 1 includes an inner side and an outer side, the mainboard bracket 6 is arranged on the inner side of the back plate 1, and the camera appearance component 2 is arranged on the outer side of the back plate 1. The camera appearance component 2 is provided with a concave cavity on the side facing the back plate 1, and the back plate 1 is formed with an opening at the position corresponding to the installation of the camera module, and part of the structure of the camera module and the speaker module 3 is penetrated by the opening and arranged in the concave cavity.

[0033] In the above embodiment, by setting at least one resonance cavity 4 in the camera appearance component 2 and / or on the mainboard bracket 6, the resonance cavity 4 is connected to the sound output channel of the speaker module 3, and the setting of the resonance cavity 4 can be achieved without occupying the volume of the rear cavity and without increasing the thickness of the electronic device. By setting the resonance cavity 4, the frequency response of the speaker module in the range of 7.5-10KHz can be improved, the details of the mid- and high-frequency are improved, and the external sound quality of the speaker module is improved.

[0034] In some embodiments, the camera appearance assembly 2 includes a camera protection cover 21;

[0035] At least one cavity 210 is formed on the camera protection cover 21 , and each cavity 210 is connected to the sound outlet channel to form a resonance cavity 4 .

[0036] For example, Figure 1 and Figure 6 As shown, the camera appearance component 2 includes a camera protective cover 21 and a camera glass cover 22. The camera glass cover 22 is fixedly connected to the camera protective cover 21 via a glass cover sealant 23. The camera protective cover 21 is fixedly connected to the outer side surface of the back panel 1 via a protective cover sealant 24. The back panel 1 is fixedly connected to the frame 81 in the frame 8 via a back panel sealant 25.

[0037] For example, Figure 4 In order to meet the demand for bandwidth expansion, two parallel resonant cavities 4 are set in the camera protection cover 21, and the sizes of the two resonant cavities 4 are different. One end of the resonant cavity 4 is closed, and the other end is connected to the front cavity A of the speaker module 3 and the sound outlet channel.

[0038] It should be noted that the number of resonant cavities 4 can be designed according to the stacking of the whole machine and the requirements for frequency response. Generally, the number of resonant cavities 4 is at least 1. Reasonable setting of the number of resonant cavities 4, the cross-sectional area S and length L0 of the channel of the resonant cavity 4, and the volume V0 of the resonant cavity 4 can achieve the required frequency response curve, wherein the channel shape of the resonant cavity 4 can be circular, square, elliptical and other shapes, and the inner wall is required to be smooth. The shape of the resonant cavity 4 can be spherical or a hexahedron such as a rectangular parallelepiped. In order to facilitate processing, the pipe cross-section of the resonant cavity 4 is selected as a quadrilateral such as a circle or a rectangle, and the resonant cavity 4 is selected as a hexahedron in the shape of a rectangular parallelepiped or a cube.

[0039] In this embodiment, the resonant cavity is disposed in the camera protective cover 21 and is assembled using the relevant structures of the camera protective cover 21. This structural design does not occupy the volume of the rear cavity B and does not increase the thickness of the electronic device.

[0040] In some embodiments, the speaker module 3 includes:

[0041] The shell 31 is surrounded by an inner cavity and a sound outlet channel, and the sound outlet channel is located on the inner side of the back plate 1;

[0042] The speaker unit 32 divides the inner cavity into a front cavity A and a rear cavity B;

[0043] Among them, a first through hole 310 is opened on the shell 31, and a second through hole 100 is opened on the back plate 1, and the second through hole 100 is directly opposite to the first through hole 310; the sound outlet channel is connected with the cavity 210 through the first through hole 310 and the second through hole 100, and the first through hole 310, the second through hole 100 and the cavity 210 form a resonance cavity 4.

[0044] like Figure 1 In the figure, the shell 31 includes an upper shell 3a and a lower shell 3b, which enclose an inner cavity and a sound outlet channel of a speaker unit 32; the upper shell 3a is integrally formed with the mainboard bracket 6, and the lower shell 3b is integrally formed with the front cavity cover plate 3b0, and the front cavity cover plate 3b0 is arranged on the inner side of the back plate 1, and a first through hole 310 is opened on the front cavity cover plate 3b0, and the first through hole 310 is directly opposite to the second through hole 100 opened on the back plate 1.

[0045] In some embodiments, Figure 1 In the embodiment, the opening size of the first through hole 310 is smaller than the opening size of the second through hole 100 .

[0046] In this embodiment, since the opening size of the first through hole 310 is smaller than the opening size of the second through hole 100 , the thickness of the front cavity cover plate 3 b 0 forms a narrow tube of the resonance cavity 4 .

[0047] It should be explained that the resonant cavity 4 in the present application is a Hertzholm resonant cavity.

[0048] like Figure 3 In the figure, the Herzholm resonant cavity consists of a narrow tube and a cavity. The length of the narrow tube is L0, the radius is a, the cross-sectional area is S, and the volume of the cavity is V. 0 The resonance conditions of the Herzholm cavity include:

[0049] Condition 1: a<wavelength λ, L0<wavelength λ,

[0050] Condition 2: S*L0< <V0;

[0051] Condition 3: The cavity wall of the resonant cavity is rigid and will not deform easily.

[0052] A single resonator can be considered as composed of several acoustic elements with different acoustic effects. The air in the open tube and near the tube mouth vibrates with the sound waves, which is an acoustic mass element. The pressure in the cavity changes with the expansion and contraction of the air, which is an acoustic compliance element. The air in the cavity vibrates with the sound waves to a certain extent and also has a certain acoustic mass. Therefore, the structure will produce a resonant frequency f:

[0053]

[0054] Among them, C is the propagation speed of sound in the medium, S is the cross-sectional area of ​​the narrow tube, L0 is the length of the narrow tube, and V0 is the volume of the cavity. The vibration and friction of air on the opening wall will cause sound energy loss due to the effects of viscous damping and heat conduction. Its acoustic effect is an acoustic resistance. When the frequency of the incident sound wave is close to the natural frequency of the resonator, the air column in the hole neck vibrates strongly. During the vibration process, the sound energy is consumed due to overcoming the friction resistance. On the contrary, when the frequency of the incident sound wave is far away from the natural frequency of the resonator, the resonator vibrates very weakly, so the sound absorption effect is very small. It can be seen that the sound absorption coefficient of the resonator varies with frequency, and the highest sound absorption coefficient appears at the resonant frequency. Using its characteristics to design multiple resonant cavities can improve its frequency response loudness in a certain frequency band and cause its loudness to attenuate in another frequency band.

[0055] In some embodiments, Figure 1 In the embodiment, the resonance cavity 4 is provided with a first acoustic resistance element C at the side wall close to the sound outlet channel.

[0056] For example, Figure 1 In the embodiment, a first acoustic resistance element C is sandwiched between the front cavity cover plate 3b0 in the lower shell 3b and the back plate 1 in the inner side wall of the resonant cavity 4. The first acoustic resistance element C is used to adjust the amplitude of the peak and trough formed by the coupling between the resonant cavity 4 and the front cavity A, and reduce the influence of the resonant frequency point on the frequency response.

[0057] In this embodiment, by adding an acoustic resistance element at the pipe opening of the resonance cavity 4, the attenuation of the sound in a specific frequency band can be effectively improved, thereby improving the bandwidth of the entire frequency response curve as a whole and improving the sound output effect.

[0058] In some embodiments, the first acoustic resistance element includes: a first foam layer, a damping net, and a second foam layer stacked in sequence.

[0059] In specific implementation, the first foam layer contacts the lower shell 3b, the second foam layer contacts the back plate 1, and a damping net is sandwiched between the first foam layer and the second foam layer. In this way, on the one hand, the sealing between the lower shell 3b and the back plate 1 can be ensured, and on the other hand, the amplitude of the peak and trough formed by the coupling of the resonant cavity 4 and the front cavity A can be adjusted through the damping net. Figure 1 In the structure shown, the resonant cavity 4 is a cavity surrounded by a front cavity cover plate 3b0, a sealing foam, a damping net, a back plate 1, a protective cover sealant 24 and a camera protective cover 21.

[0060] In other examples, the first acoustic resistance element C only includes a damping net, or the first acoustic resistance element C includes a layer of foam and a layer of damping net. It should be noted that the structural design of the first acoustic resistance element C is only an example, and other acoustic resistance materials can also be used instead, and it is not limited to this.

[0061] In some embodiments, the electronic device further comprises:

[0062] The main board 5 is fixedly connected to the main board bracket 6, and there is an installation gap between the main board bracket 6 and the main board 5;

[0063] At least one resonant cavity 4 is provided on the mainboard bracket 6, and the resonant cavity 4 is located in the installation gap.

[0064] In this embodiment, the resonant cavity 4 is arranged in a partial area of ​​the mainboard bracket 6. This structural design does not occupy the volume of the rear cavity B and does not increase the thickness of the electronic device.

[0065] In some embodiments, the speaker module 3 includes: an upper shell 3a and a lower shell 3b, the upper shell 3a and the lower shell 3b surround an inner cavity and a sound outlet channel of the speaker unit 32;

[0066] The upper shell 3a and the mainboard bracket 6 are integrally formed, and at least one resonant cavity 4 is provided on the upper shell 3a.

[0067] like Figure 5 In the figure, the upper shell 3a of the speaker module 3 is integrally formed with the mainboard bracket 6, and the resonance cavity 4 is arranged in the dotted line area in the installation gap between the mainboard bracket 6 and the mainboard 5.

[0068] In some embodiments, the electronic device further comprises:

[0069] The frame 8, the upper shell 3a and the lower shell 3b extend toward the frame 8 and are connected to the frame 8, so that the sound outlet channel is connected with the external space;

[0070] In the inner wall of the sound outlet channel, a second acoustic resistance element D is sandwiched between the upper shell 3 a and the frame 8 , and a second acoustic resistance element D is sandwiched between the lower shell 3 b and the frame 8 .

[0071] Optionally, the second acoustic resistance element D includes foam and mesh.

[0072] like Figure 1 and Figure 5 In the figure, the frame 8 includes a frame 81 and a middle plate 82, the frame 81 is arranged around the periphery of the middle plate 82, and a part of the structure of the mainboard bracket 6 forms an upper shell 3a, the upper shell 3a is fixedly connected to the lower shell 3b, and the sound outlet channel formed by the upper shell 3a and the lower shell 3b extends toward the frame 81; wherein, a second acoustic resistance element D is sandwiched between the upper shell 3a and the middle plate 82, and a second acoustic resistance element D is sandwiched between the lower shell 3b and the frame 81, and the second acoustic resistance element D is arranged at the port of the sound outlet channel, which can adjust the amplitude of the peaks and troughs of the sound and improve the sound playback effect.

[0073] In some embodiments, the electronic device further comprises:

[0074] Screen 7;

[0075] A frame 8, a micro gap 9 is formed at the connection between the frame 8 and the screen 7, and a sound outlet hole 10 is also opened on the frame 8;

[0076] The sound outlet channel is connected to the micro gap 9 and the sound outlet hole 10 respectively.

[0077] like Figure 1 and Figure 5 In the figure, the frame 8 includes a frame 81 and a middle plate 82 , the frame 81 is arranged around the periphery of the middle plate 82 , the screen 7 is fixedly connected to the middle plate 82 by a screen sealant E, and a micro gap 9 is provided between the frame 81 and the screen 7 .

[0078] For example, Figure 1 In the figure, the first part of the sound generated by the speaker module 3 is emitted from the sound outlet 10 located on the frame 81 through the front cavity channel, and the second part of the sound generated by the speaker module 3 is emitted through the micro gap 9 formed at the connection between the middle plate 82, the screen 7 and the frame 81.

[0079] The following is combined with Figure 7 , the effect of adding the resonance cavity 4 to the speaker module 3 on the bandwidth is explained.

[0080] Figure 7The comparative frequency response curve shown can clearly show that after adding the dual resonant cavity, the frequency response curve bandwidth of the speaker unit 32 is increased from 8500Hz to 10KHz, with the 1kHz frequency response floating down 6db as the horizontal line. At the same time, the 7.5K-10kHz high-frequency loudness is significantly improved. Although the 3kHz-7.5kHz frequency response is lower than the traditional solution, the loudness of this frequency band can be significantly increased through EQ. Compared with increasing the gain of the low frequency, the power consumption required is much smaller. It basically does not affect the overall audio power consumption. In this way, from the perspective of the external speaker effect, the details of the mid- and high-frequency can be significantly improved, thereby improving the overall external speaker effect.

[0081] like Figure 2 In the figure, it shows a schematic diagram of the setting position of the speaker unit 32 in the electronic device. When the speaker module 3 is stacked with the mainboard 5, the speaker module 3 is close to the rear camera module, and the magnetic interference to the rear camera and front camera modules is relatively serious. In order to optimize the magnetic interference, the Y-direction position of the speaker module 3 in the electronic device is increasingly farther from the top of the middle frame of the whole machine, resulting in an increase in the eccentric distance in the Y direction. This will cause the sound outlet channel of the speaker unit 32 to be lengthened, and the bandwidth of the speaker to be increasingly smaller, resulting in the lack of high-frequency details in the sound played by the speaker module 3. In the embodiment of the present application, a resonant cavity 4 is set in the camera protective cover 21 or the mainboard bracket 6. Under the premise of not occupying the volume of the rear cavity B and not increasing the thickness of the electronic device, the resonant cavity 4 can be set to improve the frequency response of the speaker module at 7.5-10KHz, so that the details of the mid-high frequencies are improved, and the external sound quality of the speaker module is improved.

[0082] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0083] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, a magnetic disk, or an optical disk), and includes a number of instructions for a terminal (which can be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to execute the methods described in each embodiment of the present application.

[0084] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electronic device, characterized in that: include: Back panel; A camera appearance component, wherein the camera appearance component is mounted on the outer side of the back plate; A speaker module, the speaker module is arranged on a side of the camera appearance component close to the back plate, the speaker module includes a front cavity and a rear cavity, and the front cavity is connected to the external space through a sound outlet channel; A mainboard bracket, wherein the speaker module is arranged between the mainboard bracket and the camera appearance component; At least one resonant cavity, the resonant cavity is connected to the sound outlet channel; wherein the resonant cavity is formed in the camera appearance component, and / or the resonant cavity is formed on the mainboard bracket.

2. The electronic device according to claim 1, characterized in that: The camera appearance component includes a camera protection cover; At least one cavity is provided on the camera protection cover, and each cavity is connected with the sound outlet channel to form a resonance cavity.

3. The electronic device according to claim 2, characterized in that: The speaker module comprises: A shell, wherein the shell is surrounded by an inner cavity and the sound outlet channel, and the sound outlet channel is located on the inner side of the back plate; a speaker unit, wherein the speaker unit divides the inner cavity into the front cavity and the rear cavity; Among them, the shell is provided with a first through hole, the back plate is provided with a second through hole, and the second through hole is directly opposite to the first through hole; the sound outlet channel is connected with the cavity through the first through hole and the second through hole, and the first through hole, the second through hole and the cavity form the resonant cavity.

4. The electronic device according to claim 3, characterized in that: An opening size of the first through hole is smaller than an opening size of the second through hole.

5. The electronic device according to claim 1 or 3, characterized in that: The resonance cavity is provided with a first acoustic resistance element at a side wall close to the sound outlet channel.

6. The electronic device according to claim 5, characterized in that: The first acoustic resistance element includes: a first foam layer, a damping net and a second foam layer stacked in sequence.

7. The electronic device according to claim 1 or 2, characterized in that: The electronic device further comprises: A mainboard, wherein the mainboard is fixedly connected to the mainboard bracket, and an installation gap is provided between the mainboard bracket and the mainboard; At least one resonant cavity is provided on the mainboard bracket, and the resonant cavity is located in the installation gap.

8. The electronic device according to claim 7, characterized in that: The speaker module comprises: an upper shell and a lower shell, wherein the upper shell and the lower shell surround an inner cavity of the speaker unit and the sound outlet channel; Wherein, the upper shell and the mainboard bracket are integrally formed, and at least one resonant cavity is provided on the upper shell.

9. The electronic device according to claim 8, characterized in that: The electronic device further comprises: A frame, wherein the upper shell and the lower shell extend toward the frame respectively and are connected to the frame to connect the sound outlet channel with the external space; In the inner side wall of the sound outlet channel, a second acoustic resistance element is sandwiched between the upper shell and the frame body, and a second acoustic resistance element is sandwiched between the lower shell and the frame body.

10. The electronic device according to claim 1, characterized in that: The electronic device further comprises: Screen; A frame, wherein a micro gap is formed at the connection between the frame and the screen, and a sound outlet hole is also provided on the frame; Wherein, the sound outlet channel is communicated with the micro gap and the sound outlet hole respectively.

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