Contact hole component and electronic device

Abstract

An embodiment of the present invention relates to a contact hole assembly and an electronic device. More specifically, a contact hole assembly is provided, comprising: a first metal layer for receiving an electrical signal; an insulating layer on the first metal layer; a second metal layer on the insulating layer, such that the insulating layer is located between the first metal layer and the second metal layer, and the second metal layer outputs the electrical signal; and a contact hole electrically connecting the first metal layer and the second metal layer, the contact hole comprising: a passage area penetrating the thickness of the insulating layer; a conductor in the passage area; and a recessed area in the conductor, in which a portion of the surface of the conductor is retracted in a direction away from the passage area.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Korean Patent Application No. 10-2023-0131384, filed on October 4, 2023, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Embodiments of the present invention relate to a contact hole assembly and an electronic device, and more particularly, to a contact hole assembly and an electronic device capable of enhancing impedance matching characteristics. Background Art

[0004] The electronic device is a device driven by receiving electric power from the outside, and may have various circuits and metal layers formed inside for driving.

[0005] Representative examples of electronic devices may be communication devices that transmit wireless signals or display devices that display images via display panels. Various types of display devices such as liquid crystal displays (LCDs), organic light emitting displays (OLEDs), etc. are being adopted according to the configuration of display panels.

[0006] The electronic device may include a contact hole for connecting a wire formed of metal. The contact hole may be formed to penetrate at least one insulating layer formed on a first metal layer to expose at least a portion of the first metal layer, and a second metal layer formed on the insulating layer may be electrically connected to the first metal layer via the contact hole.

[0007] In this case, as the electronic device becomes thinner, the gap between the first metal layer and the second metal layer decreases, and the capacitance between the first metal layer and the second metal layer increases. As a result, the impedance of the printed circuit board on which the first metal layer and the second metal layer are formed may decrease, making impedance matching difficult. Summary of the invention

[0008] Therefore, the inventors of the present invention have invented a contact hole assembly and an electronic device having enhanced impedance matching characteristics.

[0009] Embodiments of the present invention may provide a contact hole assembly and an electronic device which may improve low power consumption and impedance matching characteristics by forming a recess structure inside a contact hole.

[0010] Embodiments of the present invention may provide a contact hole assembly and an electronic device which may enhance signal transmission efficiency and impedance matching characteristics by removing a stub area of ​​a contact hole.

[0011] An embodiment of the present invention may provide a contact hole assembly, comprising: a first metal layer for receiving an electrical signal; an insulating layer on the first metal layer; a second metal layer on the insulating layer, such that the insulating layer is located between the first metal layer and the second metal layer, and the second metal layer outputs the electrical signal; and a contact hole electrically connecting the first metal layer and the second metal layer, the contact hole comprising: a passage area penetrating the thickness of the insulating layer; a conductor in the passage area; and a recessed area in the conductor, in which a portion of the surface of the conductor is retracted in a direction away from the passage area.

[0012] An embodiment of the present invention may provide a contact hole assembly, comprising: a first metal layer for receiving an electrical signal; an insulating layer on the first metal layer; a second metal layer on the insulating layer, such that the insulating layer is located between the first metal layer and the second metal layer, and the second metal layer outputs the electrical signal; and a contact hole passing through the insulating layer, the contact hole electrically connecting the first metal layer and the second metal layer, wherein the contact hole comprises a conductor connected to the first metal layer and the second metal layer and extending from the second metal layer to the first metal layer, and the contact hole extends from the second metal layer beyond the first metal layer.

[0013] An embodiment of the present invention may provide an electronic device, comprising: a first metal layer for receiving an electrical signal; a first insulating layer on the first metal layer; a second metal layer on the first insulating layer, such that the first insulating layer is located between the first metal layer and the second metal layer, and the second metal layer outputs the electrical signal; and a contact hole electrically connecting the first metal layer and the second metal layer, the contact hole comprising: a passage area penetrating the thickness of the first insulating layer; a conductor in the passage area; and a recessed area extending from the inner surface of the conductor toward the outer surface of the conductor, wherein the width of the portion of the conductor having the recessed area is smaller than the width of the portion of the conductor not having the recessed area.

[0014] An embodiment of the present invention may provide a contact hole assembly, comprising: a first metal layer that receives an electrical signal; an insulating layer formed on the first metal layer; a second metal layer formed on the insulating layer and outputs the electrical signal; and a contact hole that electrically connects the first metal layer and the second metal layer, wherein the contact hole comprises: a via region that penetrates the insulating layer; a conductor formed in the via region; and a recessed region, in which a portion of the surface of the conductor is removed.

[0015] An embodiment of the present invention may provide a contact hole assembly, comprising: a first metal layer that receives an electrical signal; an insulating layer formed on the first metal layer; a second metal layer formed on the insulating layer and outputs the electrical signal; and a contact hole that electrically connects the first metal layer and the second metal layer, wherein the contact hole comprises a shortcut region in which a conductor is formed that connects the first metal layer and the second metal layer by a shortest path, and wherein a terminal region that connects the first metal layer and the second metal layer by a detour path is removed.

[0016] An embodiment of the present invention may provide an electronic device having a contact hole assembly, the contact hole assembly comprising: a first metal layer into which an electrical signal is input; an insulating layer formed on the first metal layer; a second metal layer formed on the insulating layer and outputting the electrical signal; and a contact hole electrically connecting the first metal layer and the second metal layer, wherein the contact hole comprises: a passage area penetrating the insulating layer; a conductor formed in the passage area; and a recessed area in which a portion of the surface of the conductor is removed.

[0017] According to the embodiments of the present invention, a contact hole component and an electronic device having enhanced impedance matching characteristics can be provided.

[0018] A contact hole component and an electronic device can be provided which can improve low power consumption and impedance matching characteristics by forming a recessed structure inside a contact hole.

[0019] A contact hole assembly and an electronic device can be provided which can enhance signal transmission efficiency and impedance matching characteristics by removing a distal region of a contact hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and other objects, features and advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0021] Figure 1 is a view illustrating a display device as an example of an electronic device including a contact hole assembly;

[0022] Figure 2 is an exemplary graph obtained by measuring the impedance of a printed circuit board in the time domain;

[0023] Figure 3 is an exemplary cross-sectional view illustrating a contact hole assembly according to an embodiment of the present invention;

[0024] Figure 4 is an exemplary view illustrating a process of forming a contact hole component according to an embodiment;

[0025] Figure 5is an exemplary graph illustrating a change in impedance based on a recessed area ratio in a contact hole component according to an embodiment;

[0026] Figure 6 and 7 is an exemplary view illustrating a contact hole shape according to an embodiment;

[0027] Figure 8 is an exemplary cross-sectional view illustrating a signal transmission path in a contact hole assembly according to an embodiment;

[0028] Fig. 9 is an exemplary view illustrating a process of removing a tip region in a contact hole component according to an embodiment;

[0029] Fig.10 is an exemplary graph illustrating loss when a tip region is included and when the tip region is removed in a contact hole assembly according to an embodiment;

[0030] Fig.11 is an exemplary view illustrating a removal process of a tip region in a contact hole component according to another embodiment of the present invention. DETAILED DESCRIPTION

[0031] Hereinafter, some embodiments of the present invention will be described in detail with reference to the exemplary drawings. In the following description of examples or embodiments of the present invention, reference will be made to the drawings, which are shown by way of illustration of specific examples or embodiments that can be implemented, and in which the same reference numerals and symbols can be used to refer to the same or similar components, even if they are shown in different drawings from each other. In addition, in the following description of examples or embodiments of the present invention, when it is determined that the detailed description of the well-known functions and components involved in this article may make the subject matter in some embodiments of the present invention unclear, this detailed description will be omitted. Terms such as "including", "having", "including", "consisting of", "containing" used herein are generally intended to allow the addition of other components unless the term is used together with the term "only". As used herein, the singular form is intended to include the plural form unless the context clearly indicates otherwise.

[0032] Terms such as "first", "second", "A", "B", "(A)" or "(B)" may be used herein to describe elements of the present invention. Each of these terms is not used to limit the nature, order, sequence or quantity of the elements, but is only used to distinguish the corresponding elements from other elements.

[0033] When it is mentioned that a first element is “connected or joined”, “overlapped”, etc. with a second element, it should be interpreted that not only the first element and the second element may be “directly connected or joined” or “directly contacted or overlapped”, but also a third element may be “inserted” between the first element and the second element, or the first element and the second element may be “connected or joined”, “overlapped”, etc. with each other via a fourth element. Here, the second element may be included in at least one of the two or more elements that are “connected or joined”, “contacted or overlapped”, etc. with each other.

[0034] When time relative terms such as "after", "subsequently", "next", "before", etc. are used to describe a process or operation of an element or structure, or a process or step in an operation, process, or manufacturing method, these terms can be used to describe non-sequential or non-sequential processes or operations unless the terms "directly" or "immediately" are used together.

[0035] In addition, when referring to any size, relative dimension, etc., it should be considered that the numerical value or corresponding information (such as level, range, etc.) of the element or feature includes tolerance or error range caused by various factors (such as process factors, internal or external collision, noise, etc.), even if no relevant description is specified. In addition, the term "may" fully encompasses the full meaning of the term "can".

[0036] Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0037] Figure 1 is a view illustrating a display device as an example of an electronic device including a contact hole assembly.

[0038] Reference Figure 1 The display device 100 may include: a gate driving circuit 120 that provides a scan signal to the display panel 110; a data driving circuit 130 that provides a data voltage to the display panel 110; a timing controller 140 that controls the gate driving circuit 120 and the data driving circuit 130; and a power management circuit 150 that provides a driving voltage.

[0039] This article illustrates that the source driver integrated circuit SDIC constituting the data driver circuit 130 is implemented as a chip on film (COF) type among various types (such as TAB, COG or COF), and the gate driver integrated circuit GDIC constituting the gate driver circuit 120 is implemented as a gate in panel (GIP) type among various types (such as TAB, COG, COF or GIP).

[0040] When the gate driving circuit 120 is implemented as a GIP type, a plurality of gate driving integrated circuits GDIC included in the gate driving circuit 120 may be directly formed in the frame area of ​​the display panel 110. In this case, the gate driving integrated circuit GDIC may receive various signals (e.g., clock signals, gate high signals, gate low signals, etc.) required to generate scanning signals through gate driving related signal lines disposed in the frame area.

[0041] Similarly, each of the one or more source driver integrated circuits SDIC included in the data driver circuit 130 may be mounted on the source film SF, and one side of the source film SF may be electrically connected to the display panel 110. Lines for electrically connecting the source driver integrated circuit SDIC and the display panel 110 may be provided on the source film SF.

[0042] The display device 100 may include at least one source printed circuit board SPCB for making circuit connections between a plurality of source driving integrated circuits SDIC and other devices, and a control printed circuit board CPCB for mounting a control assembly and various electrical devices.

[0043] The other side of the source film SF on which the source driver integrated circuit SDIC is mounted may be connected to at least one source printed circuit board SPCB. In other words, one side of the source film SF on which the source driver integrated circuit SDIC is mounted may be electrically connected to the display panel 110, and the other side thereof may be electrically connected to the source printed circuit board SPCB.

[0044] The timing controller 140 and the power management circuit 150 may be mounted on the control printed circuit board CPCB. The timing controller 140 may control the operations of the data driving circuit 130 and the gate driving circuit 120. The power management circuit 150 may provide a driving voltage or current to the display panel 110, the data driving circuit 130, and the gate driving circuit 120, and control the provided voltage or current.

[0045] At least one source printed circuit board SPCB and control printed circuit board CPCB may be circuit-connected via at least one connection member. The connection member may include, for example, a flexible printed circuit (FPC) or a flexible flat cable FFC. At least one source printed circuit board SPCB and control printed circuit board CPCB may be integrated into a single printed circuit.

[0046] The power management circuit 150 transmits a driving voltage required for display driving or characteristic value sensing to the source printed circuit board SPCB via a flexible printed circuit (FPC) or a flexible flat cable FFC. The driving voltage transmitted to the source printed circuit board SPCB is provided to emit light or sense a specific sub-pixel (SP) in the display panel 110 via a source driver integrated circuit SDIC.

[0047] Each sub-pixel (SP) arranged in the display panel 110 in the display device 100 may include a light emitting element and a circuit element such as a driving transistor for driving the light emitting element such as an organic light emitting diode.

[0048] The type and number of circuit elements constituting each sub-pixel (SP) may vary depending on the functions to be provided and the design mechanism.

[0049] In this case, metal layers constituting various signal lines may be formed on the source printed circuit board or the control printed circuit board, and metal layers formed on different layers may be electrically connected via contact holes.

[0050] Recently, as electronic devices tend to become thinner, the thickness of printed circuit boards on which various signal lines are arranged is reduced. When the thickness of the printed circuit board is reduced, the gap between the signal lines is reduced, resulting in an increase in capacitance formed between the signal lines and a decrease in impedance.

[0051] Figure 2 is an exemplary graph obtained by measuring the impedance of a printed circuit board in the time domain.

[0052] Reference Figure 2 A printed circuit board on which various signal lines are formed can effectively transmit power only when the input impedance of a portion to which a signal is input and the output impedance of a portion to which the signal is output match. However, when impedance mismatch occurs at a specific location of the printed circuit board, power loss increases.

[0053] A contact hole formed in the printed circuit board connects an upper metal layer and a lower metal layer via a conductor, and when the thickness of the printed circuit board is reduced, impedance may be reduced due to increased capacitance.

[0054] When a pulse signal is applied to a printed circuit board using a time domain reflectometer (TDR), the impedance characteristics of the printed circuit board can be detected by observing the signal reflected from the printed circuit board. In this case, when the capacitance of the contact hole at a specific location increases, the impedance signal observed in the TDR decreases.

[0055] The contact hole assembly of the present invention may have a recess structure in a contact hole in a printed circuit board, wherein impedance is reduced, thereby reducing power consumption and enhancing impedance matching characteristics.

[0056] Figure 3 is an exemplary cross-sectional view illustrating a contact hole assembly according to an embodiment of the present invention.

[0057] Reference Figure 3 , the contact hole assembly according to the embodiment of the present invention can electrically connect the first metal layer 32 and the second metal layer 34 through the contact hole 10 .

[0058] To this end, the second insulating layer 24 may be formed on the first insulating material layer 22 such as a substrate, and the first metal layer 32 may be formed on the second insulating layer 24. The first metal layer 32 may be formed on the first insulating material layer 22.

[0059] In this case, the third insulating layer 26 may be formed on the second insulating layer 24 to cover the first metal layer 32, and the second metal layer 34 may be formed on the third insulating layer 26. The third insulating layer 26 covering the first metal layer 32 may be formed as a single layer, or may be formed as a plurality of stacked layers.

[0060] Thereafter, a via area 12 is formed by disposing a mask having a transmission portion corresponding to the contact hole region on the second metal layer 34 and etching the first insulating layer 22 , the second insulating layer 24 , the first metal layer 32 , the third insulating layer 26 , and the second metal layer 34 .

[0061] Here, by dry etching using a plasma etching gas in consideration of anisotropy, an etching process using a mask may be performed to form the via region 12. In this case, in order to uniformly form another contact hole 10 in another adjacent region while forming the contact hole 10, etching of the insulating layers 22, 24, 26 and the metal layers 32, 34 may be performed under an over-etching condition.

[0062] A contact hole 10 electrically connecting a portion of the first metal layer 32 with a portion of the second metal layer 34 may be formed by forming a conductor 14 such as copper on the inner surface of the via region 12. In one embodiment, the via region 12 and the conductor 14 extend from the third insulating layer 26 to the first insulating layer 22. Since the conductor 14 extends from the third insulating layer 26 to the first insulating layer 22, the recessed region 16 is surrounded by the first insulating layer 22, the second insulating layer 24, and the third insulating layer 26.

[0063] In this case, the inner surface of the conductor 14 constituting the contact hole 10 may include a recessed area 16 along the inner surface, in which a plurality of portions of the conductor 14 are partially removed. In the recessed area 16, a portion of the surface of the conductor 14 may be removed. That is, the recessed area 16 of the conductor 14 is an area where a portion of the surface of the conductor is retracted in a direction away from the via area 12. As a result, the width of the portion of the conductor 14 having the recessed area 16 is smaller than the width of the portion of the conductor 14 not having the recessed area 16. The conductor 14 also has an outer surface whose diameter is larger than the diameter of the inner surface of the conductor 14. In one embodiment, the diameter of the recessed area 16 is larger than the diameter of the inner surface of the conductor 14 and smaller than the diameter of the outer surface of the conductor 14.

[0064] Figure 4is an exemplary view illustrating a process of forming a contact hole component according to an embodiment.

[0065] Reference Figure 4 In the contact hole assembly according to the embodiment of the present invention, in a state where a conductor 14 electrically connecting the first metal layer 32 with the second metal layer 34 is formed in the through-channel region 12, a recess region 16 can be formed in the inner surface of the conductor 14 using a drill 40.

[0066] The diameter DD1 of the drill 40 for forming the recessed region 16 may be larger than the inner diameter D1 of the contact hole 10 formed by the conductor 14 and smaller than the outer diameter D2 of the contact hole 10 .

[0067] In this case, the area of ​​the recessed region 16 constituting the contact hole 10 may be changed according to the insertion position of the drill 40 in the inner surface of the conductor 14 .

[0068] The impedance of the contact hole 10 may vary depending on the ratio of the area occupied by the recessed region 16 to the inner surface area of ​​the conductor 14 .

[0069] Figure 5 is an exemplary graph illustrating a change in impedance based on a recess area ratio in a contact hole assembly according to an embodiment.

[0070] Reference Figure 5 In the contact hole assembly according to the embodiment of the present invention, as the area occupied by the recessed area 16 increases in the inner region of the via region 12, the capacitance formed by the conductor 14 decreases and the impedance increases. In other words, as the inner surface area of ​​the conductor 14 excluding the area occupied by the recessed area 16 decreases, the impedance of the contact hole 10 increases.

[0071] Therefore, by controlling the area of ​​the recessed region 16 formed in the inner surface of the conductor 14 of the contact hole 10, the impedance of the contact hole 10 can be increased and the impedance matching characteristic can be enhanced.

[0072] In this case, for efficient transmission of signals transmitted through contact hole 10, the inner surface area of ​​conductor 14 may occupy 40% or more and 60% or less of the inner surface area of ​​via region 12. In other words, recess region 16 may occupy 40% to 60% of the inner surface area of ​​via region 12.

[0073] In a state where the first metal layer 32 and the second metal layer 34 are electrically connected to each other through the contact hole 10 including the recessed region 16 , the current flowing through the first metal layer 32 flows to the second metal layer 34 along the contact hole 10 .

[0074] In this case, the recessed area 16 formed in the inner surface of the conductor 14 may have various shapes.

[0075] Figure 6 and 7 is an exemplary view illustrating a contact hole shape according to an embodiment.

[0076] Reference Figure 6 , the contact hole 10 according to the embodiment of the present invention may include a recessed region 16 having a sprral structure. As a result, the conductor 14 has the sprral structure recessed region 16.

[0077] The spiral recessed region 16 may be formed by rotating the drill 40 while moving upward from the lower portion of the contact hole 10. In this case, the width and area of ​​the recessed region 16 may be changed according to the surface shape of the drill 40.

[0078] In addition, refer to Figure 7 , the contact hole 10 according to the embodiment of the invention may include a recessed area 16 having a straight structure. As a result, the conductor 14 has a straight structure recessed area 16. That is, the recessed area 16 having a straight structure extends along the length of the inner surface of the conductor 14 from a first end of the conductor 14 to a second end of the conductor 14 opposite to the first end.

[0079] The straight recessed area 16 can be formed by moving the drill 40 upward at the lower portion of the contact hole 10 without rotating the drill 40. Even in this condition, the width and area of ​​the recessed area 16 can be changed according to the surface shape of the drill 40.

[0080] The shapes of the spiral structure or the straight structure disclosed herein are only examples of the recessed area 16, and the recessed area 16 of the contact hole 10 may have other various shapes such as a hatch structure according to the surface shape of the drill 40 and the moving direction and the rotating direction of the drill 40. The recessed area 16 may be formed along the moving direction or the rotating direction of the drill 40.

[0081] Figure 8 is an exemplary cross-sectional view illustrating a signal transmission path in a contact hole assembly according to an embodiment.

[0082] Reference Figure 8 , the contact hole assembly according to the embodiment of the present invention can electrically connect the first metal layer 32 with the second metal layer 34 via the contact hole 10 .

[0083] In this case, the contact hole 10 may include a shortcut area SC having a shortest path P1 from a portion where an electrical signal is input (e.g., the first metal layer 32) to a portion where the electrical signal is output (e.g., the second metal layer 34), and may also include a stub area ST having a detour path P2 from the first metal layer 32 where the signal is input to the second metal layer 34 to which the signal is output.

[0084] Due to the distal region of the contact hole 10, the transmission characteristics of the signal transmitted from the first metal layer 32 to the second metal layer 34 are degraded, and power consumption increases. The transmission characteristics may be degraded as the frequency of the signal transmitted from the first metal layer 32 to the second metal layer 34 increases.

[0085] Therefore, the contact hole assembly of the present invention can enhance the signal transmission characteristics by removing the tip region of the contact hole 10 .

[0086] Fig. 9 is an exemplary view illustrating a removal process of a tip region in a contact hole component according to an embodiment.

[0087] Reference Fig. 9 In the contact hole assembly according to the embodiment of the present invention, in a state where a conductor 14 electrically connecting the first metal layer 32 with the second metal layer 34 is formed in the through-hole region 12, a first drill having a first diameter can be used to form a recessed region 16 in the inner surface of the conductor 14.

[0088] The diameter of the first drill for forming the recessed region 16 may be larger than the inner diameter D1 of the contact hole 10 formed by the conductor 14 and smaller than the outer diameter D2 of the contact hole 10 .

[0089] In this case, the area of ​​the recessed region 16 constituting the contact hole 10 can be changed according to the insertion position of the first drill in the inner surface of the conductor 14. In addition, the impedance of the contact hole 10 can be changed according to the ratio of the area occupied by the recessed region 16 to the inner surface area of ​​the conductor 14.

[0090] In a state where the recessed region 16 is formed in the inner surface of the conductor 14 , the tip region ST of the contact hole 10 may be removed using the second drill 50 having the second diameter DD2 .

[0091] The diameter DD2 of the second drill 50 for removing the tip region ST may be equal to or greater than the outer diameter D2 of the contact hole 10. As a result, the diameter DD2 of the contact hole 10 extending past the first metal layer 32 is wider than the diameter of the contact hole 10 from the second metal layer 34 to the first metal layer 32.

[0092] In this case, in the process of removing the tip region ST using the second drill 50, the first metal layer 32 to which the signal is input or the second metal layer 34 to which the signal is output should not be damaged. In other words, the tip region ST removed using the second drill 50 should not invade the first metal layer 32 to which the signal is input or the second metal layer 34 to which the signal is output. As a structure in which the tip region ST is removed, the via region 12 and the conductor 14 extend from the second metal layer 34 to the first metal layer 32 without extending beyond the first metal layer 32, and the contact hole 10 extends from the second metal layer 34 beyond the first metal layer 32. That is, the via region 12 and the conductor 14 extend from the second metal layer 34 to the first metal layer 32 via the third insulating layer 26 without extending through the second insulating layer 24 and the first insulating layer 22. As a result, the recessed region 16 is surrounded by the third insulating layer 26 without being surrounded by the second insulating layer 24 and the first insulating layer 22.

[0093] As described above, when the tip region ST of the contact hole 10 is removed, a signal input to the first metal layer 32 is transmitted to the second metal layer 34 via the shortcut region SC including the first path P1, thereby reducing power consumption and enhancing transmission characteristics.

[0094] Fig.10 is an exemplary graph illustrating losses when a tip region is included and when the tip region is removed in a contact hole assembly according to an embodiment.

[0095] Reference Fig.10 , in the contact hole assembly according to the embodiment of the present invention, the tip region ST corresponding to the detour path between the first metal layer 32 to which the signal is input and the second metal layer 34 to which the signal is output may be removed.

[0096] In other words, the contact hole assembly according to the embodiment of the present invention may include only the shortcut region SC corresponding to the shortest path from the first metal layer 32 to which the signal is input to the second metal layer 34 to which the signal is output.

[0097] As described above, the input loss IS2 of the contact hole component including only the shortcut region SC is reduced compared to the input loss IS1 when the tip region ST is included, and this effect becomes more significant as the frequency of the input signal increases.

[0098] In addition, the reflection loss RS2 of the contact hole assembly including only the shortcut region SC is reduced compared to the reflection loss RS1 when including the tip region ST. However, the reduction in the reflection loss RS2 of the contact hole assembly including only the shortcut region SC increases within a specific frequency range.

[0099] As described above, the contact hole assembly of the present invention in which the tip region ST is removed can reduce power consumption and enhance transmission characteristics during a signal transmission process.

[0100] As described above, in the contact hole assembly of the present invention, in the contact hole 10 that electrically connects the first metal layer 32 with the second metal layer 34, the tip region ST may be removed in a state where the recess region 16 is formed. On the other hand, in the contact hole assembly of the present invention, the tip region ST may be removed in a state where the conductor 14 is formed in the via region 12 of the contact hole 10 that electrically connects the first metal layer 32 with the second metal layer 34 and in a state where the recess region 16 is not formed.

[0101] Fig.11 is an exemplary view illustrating a removal process of a tip region in a contact hole component according to another embodiment of the present invention.

[0102] Reference Fig.11 In the contact hole assembly according to the embodiment of the present invention, a conductor 14 electrically connecting the first metal layer 32 and the second metal layer 34 may be formed in the via region 12 .

[0103] In a state where the conductor 14 is formed in the via region 12 , the tip region ST of the contact hole 10 may be removed using the second drill 50 having the second diameter DD2 .

[0104] The diameter DD2 of the second drill 50 for removing the tip region ST may be equal to or greater than the outer diameter D2 of the contact hole 10 .

[0105] In this case, the first metal layer 32 to which the signal is input or the second metal layer 34 to which the signal is output should not be damaged in the process of removing the tip region ST using the second drill 50. In other words, the tip region ST removed using the second drill 50 should not invade the first metal layer 32 to which the signal is input or the second metal layer 34 to which the signal is output.

[0106] In short, the contact hole assembly of the present invention may selectively include a structure in which the recessed region 16 is formed and a structure in which the tip region ST is removed.

[0107] The above-mentioned embodiments of the present invention are briefly described as follows.

[0108] A contact hole assembly may include: a first metal layer for receiving an electrical signal; an insulating layer on the first metal layer; a second metal layer on the insulating layer, such that the insulating layer is located between the first metal layer and the second metal layer, and the second metal layer outputs the electrical signal; and a contact hole electrically connecting the first metal layer and the second metal layer, the contact hole including: a passage region penetrating the thickness of the insulating layer; a conductor in the passage region; and a recessed region in the conductor, in which a portion of the surface of the conductor is retracted in a direction away from the passage region.

[0109] The conductor may include an inner surface and an outer surface, the outer surface having a diameter greater than a diameter of the inner surface, the recessed area being disposed along the inner surface of the conductor.

[0110] The diameter of the recessed area may be larger than a diameter of an inner surface of the conductor and smaller than a diameter of an outer surface of the conductor.

[0111] The recessed region may have a spiral structure along the inner surface of the conductor or a straight structure along the inner surface of the conductor from a first end of the conductor to a second end of the conductor opposite to the first end.

[0112] The recessed area may occupy 40% to 60% of the inner surface area of ​​the passage area.

[0113] The via region and the conductor may extend from the second metal layer to the first metal layer without extending beyond the first metal layer, and the contact hole may extend from the second metal layer beyond the first metal layer.

[0114] A diameter of a contact hole extending beyond the first metal layer may be wider than a diameter of a contact hole from the second metal layer to the first metal layer.

[0115] A contact hole assembly may include: a first metal layer for receiving an electrical signal; an insulating layer on the first metal layer; a second metal layer on the insulating layer, such that the insulating layer is located between the first metal layer and the second metal layer, and the second metal layer outputs the electrical signal; and a contact hole passing through the insulating layer, the contact hole electrically connecting the first metal layer and the second metal layer.

[0116] The contact hole may include a conductor connected to the first metal layer and the second metal layer and extending from the second metal layer to the first metal layer, while the contact hole extends from the second metal layer beyond the first metal layer.

[0117] The contact hole may include: a via region passing through the entire thickness of the insulating layer, the conductor being in the via region; and a recessed region in the conductor, in which a portion of a surface of the conductor is retracted in a direction away from the via region.

[0118] A diameter of a contact hole extending beyond the first metal layer may be wider than a diameter of a contact hole from the second metal layer to the first metal layer.

[0119] An electronic device may include: a first metal layer that receives an electrical signal; a first insulating layer on the first metal layer; a second metal layer on the first insulating layer, such that the first insulating layer is located between the first metal layer and the second metal layer, and the second metal layer outputs the electrical signal; and a contact hole that electrically connects the first metal layer and the second metal layer, the contact hole including: a passage area that penetrates the thickness of the first insulating layer; a conductor in the passage area; and a recessed area extending from the inner surface of the conductor toward the outer surface of the conductor, wherein the width of the portion of the conductor having the recessed area is smaller than the width of the portion of the conductor not having the recessed area.

[0120] The electronic device may further include: a printed circuit board including the first metal layer, the first insulating layer, the second metal layer and the contact hole; and a display panel including a plurality of sub-pixels displaying an image, the display panel being connected to the printed circuit board.

[0121] The outer surface of the conductor may have a diameter greater than a diameter of an inner surface of the conductor, and the recessed area may be disposed along the inner surface of the conductor.

[0122] The diameter of the recessed area may be larger than a diameter of an inner surface of the conductor and smaller than a diameter of an outer surface of the conductor.

[0123] The recessed region may have a spiral structure along the inner surface of the conductor or a straight structure along the inner surface of the conductor from a first end of the conductor to a second end of the conductor opposite to the first end.

[0124] The electronic device may further include: a second insulating layer; and a third insulating layer on the second insulating layer, such that the second insulating layer is located between the first metal layer and the third insulating layer.

[0125] The via region and the conductor may extend through the first insulating layer to the second insulating layer.

[0126] The recessed region may be surrounded by the first insulating layer, the second insulating layer, and the third insulating layer.

[0127] The via region and the conductor may extend from the second metal layer to the first metal layer via the first insulating layer without extending through the second insulating layer and the third insulating layer.

[0128] The recessed region may be surrounded by the first insulating layer but not by the second insulating layer and the third insulating layer.

[0129] The above description is provided to enable a person of ordinary skill in the art to implement and use the technical concept of the present invention, and is provided in the context of a specific application and its requirements. Various modifications, additions and substitutions to the described embodiments will be apparent to a person of ordinary skill in the art without departing from the spirit and scope of the present invention, and the general principles defined herein may be applied to other embodiments and applications. The above description and accompanying drawings provide examples of the technical concept of the present invention for illustrative purposes only. That is, the disclosed embodiments are intended to illustrate the scope of the technical concept of the present invention.

Claims

1. A contact hole assembly, comprising: A first metal layer for receiving an electrical signal; an insulating layer on the first metal layer; a second metal layer on the insulating layer, such that the insulating layer is located between the first metal layer and the second metal layer, and the second metal layer outputs the electrical signal; as well as A contact hole electrically connecting the first metal layer and the second metal layer, The contact hole comprises: a via region penetrating the thickness of the insulating layer; a conductor in the via region; and A recessed region in the conductor wherein a portion of a surface of the conductor is recessed in a direction away from the via region. 2 . The contact hole assembly of claim 1 , wherein the conductor comprises an inner surface and an outer surface, the outer surface having a diameter greater than a diameter of the inner surface, and the recessed area is disposed along the inner surface of the conductor. 3 . The contact hole assembly of claim 2 , wherein a diameter of the recessed area is larger than a diameter of an inner surface of the conductor and smaller than a diameter of an outer surface of the conductor.

4. The contact hole assembly according to claim 1, wherein the recessed area has a spiral structure along the inner surface of the conductor or a straight structure along the inner surface of the conductor from a first end of the conductor to a second end of the conductor opposite to the first end. 5 . The contact hole assembly of claim 1 , wherein the recessed region occupies 40% to 60% of an inner surface area of ​​the via region.

6. The contact hole assembly of claim 1, wherein the via region and the conductor extend from the second metal layer to the first metal layer without extending beyond the first metal layer, and the contact hole extends from the second metal layer beyond the first metal layer. 7 . The contact hole assembly of claim 6 , wherein a diameter of a contact hole extending beyond the first metal layer is wider than a diameter of a contact hole from the second metal layer to the first metal layer.

8. A contact hole assembly, comprising: A first metal layer for receiving an electrical signal; an insulating layer on the first metal layer; a second metal layer on the insulating layer, such that the insulating layer is located between the first metal layer and the second metal layer, and the second metal layer outputs the electrical signal; as well as a contact hole passing through the insulating layer, the contact hole electrically connecting the first metal layer and the second metal layer, The contact hole includes a conductor connected to the first metal layer and the second metal layer and extending from the second metal layer to the first metal layer, and the contact hole extends from the second metal layer beyond the first metal layer.

9. The contact hole assembly according to claim 8, wherein the contact hole comprises: a via region extending through the entire thickness of the insulating layer, the conductor being in the via region; as well as A recessed region in the conductor wherein a portion of a surface of the conductor is recessed in a direction away from the via region.

10. The contact hole assembly of claim 8, wherein a diameter of a contact hole extending beyond the first metal layer is wider than a diameter of a contact hole from the second metal layer to the first metal layer.

11. An electronic device comprising: A first metal layer for receiving an electrical signal; a first insulating layer on the first metal layer; a second metal layer on the first insulating layer, such that the first insulating layer is located between the first metal layer and the second metal layer, and the second metal layer outputs the electrical signal; as well as A contact hole electrically connecting the first metal layer and the second metal layer, The contact hole comprises: a via region penetrating the thickness of the first insulating layer; a conductor in the via region; and a recessed area extending from the inner surface of the conductor toward the outer surface of the conductor, The width of the portion of the conductor having the recessed region is smaller than the width of the portion of the conductor not having the recessed region.

12. The electronic device according to claim 11, further comprising: A printed circuit board, the printed circuit board comprising the first metal layer, the first insulating layer, the second metal layer and the contact hole; as well as A display panel includes a plurality of sub-pixels for displaying an image, and the display panel is connected to the printed circuit board. 13 . The electronic device according to claim 11 , wherein a diameter of an outer surface of the conductor is greater than a diameter of an inner surface of the conductor, and the recessed area is disposed along the inner surface of the conductor.

14. The electronic device according to claim 13, wherein the diameter of the recessed area is larger than the diameter of the inner surface of the conductor and smaller than the diameter of the outer surface of the conductor. 15 . The electronic device of claim 11 , wherein the recessed area has a spiral structure along an inner surface of the conductor or a straight structure along the inner surface of the conductor from a first end of the conductor to a second end of the conductor opposite to the first end.

16. The electronic device according to claim 11, further comprising: a second insulating layer; as well as A third insulating layer is formed on the second insulating layer, so that the second insulating layer is located between the first metal layer and the third insulating layer. 17 . The electronic device of claim 16 , wherein the via region and the conductor extend through the first insulating layer to the second insulating layer. 18 . The electronic device according to claim 17 , wherein the recessed area is surrounded by the first insulating layer, the second insulating layer, and the third insulating layer.

19. The electronic device according to claim 16, wherein the via region and the conductor extend from the second metal layer to the first metal layer via the first insulating layer without extending through the second insulating layer and the third insulating layer. 20 . The electronic device according to claim 19 , wherein the recessed area is surrounded by the first insulating layer but is not surrounded by the second insulating layer and the third insulating layer.

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