A solder-proof double-sided window-opening ink-plugged PCB board and a manufacturing method thereof

By designing the welding-proof hole blocking process after the chemical nickel gold process and forming a nickel gold layer to protect the hole wall, the high-risk problem during the surface treatment of the chemical gold surface is solved, and the quality of the PCB board and the reliability of electrical performance testing is ensured.

CN119789314APending Publication Date: 2025-04-08HUANGSHI HUSHI ELECTRONICS CO LTD
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Patent Information

Application Number
CN202411734224.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-29
Publication Date
2025-04-08

AI Technical Summary

Technical Problem

In the prior art, when the double-sided window design is subjected to surface treatment of the chemical chemicals after half-blocking of the hole, there is a high risk that the Tibetan medicine will attack the copper wall of the chemicals and chemicals will jump plating, affecting the quality of the PCB board.

Method used

By designing a welding-proof hole blocking process after the chemical nickel-gold process, and only controlling the development parameters to develop, a nickel-gold layer is formed to protect the hole wall to prevent the ink hole blocking process from attacking the copper in the hole wall.

Benefits of technology

It effectively avoids the risk of Tibetan medicine attacking the copper and gold-plated plating on the hole wall, and ensures the reliability of the quality and electrical performance test of the PCB board.

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Abstract

The invention discloses a solder-proof two-sided window ink plugging hole PCB board and a manufacturing method thereof, which belongs to the technical field of PCB board manufacturing and processing, and the manufacturing method comprises the following steps: laminating, drilling, copper plating and outer layer pattern manufacturing processes are sequentially performed on the core board; performing the first solder-proof pre-treatment, then performing solder-proof printing by ink, and then placing negatives on both sides of the PCB board for solder-proof exposure, performing the first solder-proof development, and finally performing solder-proof long baking; performing gold-plating surface treatment; performing the second solder-proof pre-treatment, and then performing solder-proof plugging of the double-sided window hole wall on the PCB board by ink, after forming the plugging hole ink, performing the second solder-proof development, developing away the plugging hole ink, and finally performing solder-proof long baking and fishing molding process to form the final product. The solder-proof two-sided window ink plugging hole PCB board and the manufacturing method thereof provided by the present invention can avoid the high risk of Tibetan medicine attacking the hole wall copper and gold-plating jump plating, and ensure the quality of the PCB board.
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Description

Technical Field

[0001] The invention relates to a solder-proof double-sided window-opening ink-blocking hole PCB board and a manufacturing method thereof, belonging to the technical field of PCB board manufacturing and processing. Background Art

[0002] The purpose of PCB solder mask ink plugging holes is to prevent solder paste from penetrating the component surface and causing a short circuit when mounting components. Conventional designs only have two types: no window (full plugging) and single-sided window (half-blocking). This type of design effectively avoids the problem of solder paste penetrating and short circuiting, but because the solder mask does not have windows on both sides to expose the pads, some PCB resistance and capacitance testing requirements cannot be met. New ink plugging process designs and production methods have emerged in the prior art, which can not only meet the plugging requirements, but also increase the PCB measurement points with the double-sided window design, which is beneficial to PCB capacitance and resistance testing and post-mounting maintenance. PCB boards with no windows, single-sided windows, and double-sided windows are as follows Figure 1 As shown. The existing conventional process of double-sided window opening includes: pressing → drilling → copper plating → outer layer graphics → solder mask pre-treatment → solder mask plugging → solder mask printing → solder mask exposure → solder mask development → solder mask long baking → gold surface treatment → fishing molding → finished product. Although the above process can realize the double-sided window opening and plugging design, there is a high risk of hidden chemicals attacking the copper on the hole wall and gold skipping (no gold on the hole wall) after half-blocking the hole, which affects the quality of the PCB board. Summary of the invention

[0003] The technical problem to be solved by the present invention is to overcome the defects of the prior art and provide a solder-resistant double-sided window-opening ink-plugged PCB board and a manufacturing method thereof, which can avoid the high risk of Tibetan medicine attacking the copper on the hole wall and gold skipping plating, and ensure the quality of the PCB board.

[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0005] In a first aspect, the present invention provides a method for manufacturing a solder mask double-sided window-opening ink-plugged PCB board, comprising the following steps:

[0006] The core board is subjected to pressing, drilling, copper plating and outer layer patterning processes in sequence to obtain a PCB board;

[0007] The PCB board is first subjected to the first solder mask pre-treatment, and then solder mask printing is performed with ink, and then negative films are placed on both sides of the PCB board for solder mask exposure, and then the first solder mask development is performed to achieve solder mask pattern transfer, and finally the solder mask is long baked;

[0008] Perform gold surface treatment to form a nickel-gold layer on the double-sided window hole walls and welding rings on the PCB board;

[0009] The PCB board is first subjected to a second solder mask pre-treatment, and then the double-sided window hole walls on the PCB board are solder masked and blocked with ink. After the blocking ink is formed, a second solder mask development is performed to develop away part of the blocking ink to expose the gold surface in the PCB board hole, and finally a solder mask long baking and fishing molding process are performed to form the final product.

[0010] The first solder mask development uses four developing tanks, and strong wind drying is turned on during the development process.

[0011] The developing pressure of the first solder resist developing is 1.8±0.2 Kg / cm 2 .

[0012] The development line speed of the first solder resist development is 4±0.5m / min.

[0013] The second solder mask development uses two developing tanks, and strong wind drying is turned off during the development process.

[0014] The developing pressure of the second solder resist developing is 1.3±0.2 Kg / cm 2 .

[0015] The development line speed of the second solder resist development is 4.5±0.5m / min.

[0016] The depth of plugging ink development is 2~6mil.

[0017] The first solder resist development and the second solder resist development use Na2CO3 developing solution.

[0018] In a second aspect, the present invention provides a solder-resistant double-sided window-opening ink-plugging hole PCB board, which is manufactured by the solder-resistant double-sided window-opening ink-plugging hole PCB board manufacturing method.

[0019] The beneficial effects of the present invention: the present invention provides a solder-proof double-sided window ink plugging PCB board and a manufacturing method thereof, wherein the PCB board is first subjected to a second solder-proof pre-treatment, and then the double-sided window hole walls on the PCB board are solder-proof plugged with ink, and after the plugging ink is formed, a second solder-proof development is performed, and the solder-proof plugging process is designed after the chemical nickel-gold process, and after the solder-proof plugging, the development is only performed by controlling the development operation parameters, and the chemical nickel-gold can form a chemical nickel-gold layer to well protect the hole wall, thereby avoiding the attack of the hole wall copper by the hidden medicine in the ink plugging production process, and ensuring the quality of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural diagram of the PCB board with no window, single-sided window and double-sided window;

[0021] Figure 2 It is a schematic diagram of the structure of solder mask exposure in the manufacturing method of the present invention;

[0022] Figure 3 It is a schematic diagram of the structure after solder mask development in the manufacturing method of the present invention;

[0023] Figure 4 It is a schematic diagram of the structure after the surface treatment of gold in the preparation method of the present invention;

[0024] Figure 5 It is a schematic diagram of the structure after solder blocking in the manufacturing method of the present invention;

[0025] Figure 6 It is a schematic diagram of the structure after the second solder mask development in the manufacturing method of the present invention. DETAILED DESCRIPTION

[0026] The present invention will be further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention and are not intended to limit the protection scope of the present invention.

[0027] Example 1

[0028] The present invention provides a method for manufacturing a solder-resistant double-sided window-opening ink-plugged PCB board, comprising the following steps:

[0029] Step 1: The core board is pressed, drilled, copper plated and the outer layer pattern is made in sequence to obtain a PCB board. This step is consistent with the existing process. The conventional process solder mask plugging (printing hole oil) and solder mask printing (printing surface oil) are continuous operations, exposed, developed and baked at one time. However, the solder mask plugging (printing hole oil) and solder mask printing (printing surface oil) of the present invention are completed in two solder mask process operations, see steps 2 and 4 for details.

[0030] Step 2: First, pre-treat the PCB board with the first solder mask, then print the solder mask with ink, then place a film on both sides of the PCB board for solder mask exposure, and then perform the first solder mask development to achieve solder mask pattern transfer. The structure after solder mask development is as follows: Figure 3 As shown, the solder mask is baked for a long time. The main component of the ink is a photosensitive polymer. Under the irradiation of ultraviolet light, the ink undergoes a cross-linking reaction to form a polymer. Figure 2 As shown, there are translucent and opaque parts on the film. When exposed, the ink in the translucent area of ​​the film undergoes a cross-linking reaction to generate a polymer that is alkali-resistant, while the ink in the opaque area exists as a monomer that is not alkali-resistant and is developed away in the developing solution, ultimately achieving the transfer of the solder mask pattern.

[0031] Step 3, perform gold-plating surface treatment to form a nickel-gold layer on the double-sided window hole wall and solder ring of the PCB board. The solder-proof hole plugging process design in step 4 of the present invention is chemical nickel-gold. The advantage is that the nickel-gold layer can well protect the hole wall and avoid the hidden medicine in the ink plugging process from attacking the hole wall copper. The structure after gold-plating surface treatment is as follows: Figure 4shown.

[0032] Step 4: First, perform the second solder mask pre-treatment on the PCB board, and then use ink to mask the double-sided window hole walls on the PCB board. The structure after solder mask masking is as follows: Figure 5 After forming the plugging ink, the second solder resist development is performed to remove part of the plugging ink, so that the gold surface in the hole of the PCB board is exposed as a test point for subsequent electrical performance testing. The structure after the second solder resist development is as follows Figure 6 As shown, the solder mask is baked for a long time and then the molding process is performed to form the final product. Among them, the solder mask plugging hole (printing hole oil) does not have a solder mask exposure process. The priority is to only control the development operation parameters to achieve the solder mask double-sided window design and production.

[0033] The present invention designs the solder blocking hole process after the chemical nickel-gold process. After the solder blocking hole, the development is performed only by controlling the development parameters. The chemical nickel-gold can form a nickel-gold layer to protect the hole wall well, avoiding the attack of the hole wall copper by the hidden medicine in the ink plugging hole production process, thereby ensuring the quality of the PCB board.

[0034] Example 2

[0035] The present invention provides a method for manufacturing a solder-resistant double-sided window-opening ink-plugged PCB board, comprising the following steps:

[0036] Step 1: The core board is pressed, drilled, copper plated and the outer layer pattern is made in sequence to obtain a PCB board. This step is consistent with the existing process. The conventional process solder mask plugging (printing hole oil) and solder mask printing (printing surface oil) are continuous operations, exposed, developed and baked at one time. However, the solder mask plugging (printing hole oil) and solder mask printing (printing surface oil) of the present invention are completed in two solder mask process operations, see steps 2 and 4 for details.

[0037] Step 2: First, pre-treat the PCB board with the first solder mask, then print the solder mask with ink, then place a film on both sides of the PCB board for solder mask exposure, and then perform the first solder mask development to achieve solder mask pattern transfer. The structure after solder mask development is as follows: Figure 3 The first solder resist development uses four developing tanks, and strong wind is used to dry the first solder resist development. The development pressure is 1.8±0.2 Kg / cm 2 The first solder resist development line speed is 4±0.5m / min. The main component of the ink is a photosensitive polymer. Under the irradiation of ultraviolet light, the ink undergoes a cross-linking reaction to form a polymer. Figure 2As shown, there are light-transmitting and light-impermeable parts on the film. When exposed, the ink in the light-transmitting area of ​​the film undergoes a cross-linking reaction to generate a polymer that is alkali-resistant, while the ink in the light-impermeable area exists as a monomer that is not alkali-resistant and is developed away in the Na2CO3 developer solution, ultimately achieving the transfer of the solder mask pattern. Finally, the solder mask is baked for a long time.

[0038] Step 3, perform gold-plating surface treatment to form a nickel-gold layer on the double-sided window hole wall and solder ring of the PCB board. The solder-proof hole plugging process design in step 4 of the present invention is chemical nickel-gold. The advantage is that the nickel-gold layer can well protect the hole wall and avoid the hidden medicine in the ink plugging process from attacking the hole wall copper. The structure after gold-plating surface treatment is as follows: Figure 4 shown.

[0039] Step 4: First, perform the second solder mask pre-treatment on the PCB board, and then use ink to mask the double-sided window hole walls on the PCB board. The structure after solder mask masking is as follows: Figure 5 After forming the plugging ink, the second solder resist development is performed to remove the plugging ink. The depth of the plugging ink development is 2~6mil, so that the gold surface in the hole of the PCB board is exposed as a test point for subsequent electrical performance tests. The structure after the second solder resist development is as follows Figure 6 As shown, the solder mask is baked for a long time and then formed into a final product through the process of fishing. Among them, the solder mask exposure process is not designed for the solder mask plugging hole (printing hole oil). The priority is to achieve the design and production of solder mask openings on both sides by controlling the development operation parameters only. The second solder mask development uses two development tanks, and the strong wind is turned off during the development process. The development pressure of the second solder mask development is 1.3±0.2 Kg / cm 2 The development line speed of the second solder resist development is 4.5±0.5m / min.

[0040] Example 3

[0041] The present embodiment discloses a solder-resistant double-sided window-opening ink-plugged hole PCB board, which is manufactured by the solder-resistant double-sided window-opening ink-plugged hole PCB board manufacturing method in Embodiment 1 or Embodiment 2.

[0042] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for manufacturing a solder mask double-sided window-opening ink-plugged PCB board, characterized in that: The following steps are involved: The core board is subjected to pressing, drilling, copper plating and outer layer patterning processes in sequence to obtain a PCB board; The PCB board is first subjected to the first solder mask pre-treatment, and then solder mask printing is performed with ink, and then negative films are placed on both sides of the PCB board for solder mask exposure, and then the first solder mask development is performed to achieve solder mask pattern transfer, and finally the solder mask is long baked; Perform gold surface treatment to form a nickel-gold layer on the double-sided window hole walls and welding rings on the PCB board; The PCB board is first subjected to a second solder mask pre-treatment, and then the double-sided window hole walls on the PCB board are solder masked and blocked with ink. After the blocking ink is formed, a second solder mask development is performed to develop away part of the blocking ink to expose the gold surface in the PCB board hole, and finally a solder mask long baking and fishing molding process are performed to form the final product.

2. The method for manufacturing a solder-resistant double-sided window-opening ink-plugged PCB board according to claim 1, characterized in that: The first solder mask development uses four developing tanks, and strong wind drying is turned on during the development process.

3. The method for manufacturing a solder-resistant double-sided window-opening ink-plugged PCB board according to claim 1, characterized in that: The developing pressure of the first solder resist developing is 1.8±0.2 Kg / cm 2 .

4. The method for manufacturing a solder mask double-sided window-opening ink-plugged PCB board according to claim 1, characterized in that: The development line speed of the first solder resist development is 4±0.5m / min.

5. The method for manufacturing a solder mask double-sided window-opening ink-plugged PCB board according to claim 1, characterized in that: The second solder mask development uses two developing tanks, and strong wind drying is turned off during the development process.

6. The method for manufacturing a solder mask double-sided window-opening ink-plugged PCB board according to claim 1, characterized in that: The developing pressure of the second solder resist developing is 1.3±0.2 Kg / cm 2 .

7. The method for manufacturing a solder mask double-sided window-opening ink-plugged PCB board according to claim 1, characterized in that: The development line speed of the second solder resist development is 4.5±0.5m / min.

8. The method for manufacturing a solder mask double-sided window-opening ink-plugged PCB board according to claim 1, characterized in that: The depth of plugging ink development is 2~6mil.

9. The method for manufacturing a solder mask double-sided window-opening ink-plugged PCB board according to claim 1, characterized in that: The first solder resist development and the second solder resist development use Na2CO3 developing solution.

10. A solder-resistant double-sided window-opening ink-plugged PCB board, characterized in that: The PCB board is manufactured by the method for manufacturing a solder-resistant double-sided window-opening ink-plugging hole PCB board as described in any one of claims 1 to 9.