Batch packaging structure for sensors

Abstract

The utility model relates to the technical field of sensor packaging, in particular to a batch packaging structure and a batch packaging process for sensors, the batch packaging structure comprises a substrate and a packaging cover, the windowing position of the substrate is provided with a mounting area, the mounting area is divided into a plurality of packaging stations arranged in a rectangular array, and the packaging stations are arranged on the substrate. First positioning holes are formed in two opposite sides of the mounting area of the substrate; the surface, provided with the mounting area, of the substrate is connected with a packaging layer, the packaging layer comprises a plurality of packaging tube shells, and the packaging tube shells are in one-to-one correspondence with the packaging stations; the packaging cover comprises a cover plate area, the cover plate area is provided with a plurality of window covers arranged in a rectangular array, the window covers correspond to the packaging stations one to one, windows are formed in the window covers, waterproof films are attached to the windows, second positioning holes are formed in the positions, on the two opposite sides of the installation area, of the packaging cover, and the second positioning holes are opposite to the first positioning holes in position. According to the invention, the sensors can be packaged in batches, the production efficiency is improved, and the packaging cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of sensor packaging, and particularly relates to a batch packaging structure for sensors. Background Art

[0002] At present, the widely existing differential pressure air pressure sensors on the market mainly adopt the packaging form of single products. Its production process is relatively fixed and cumbersome. The specific steps include: First, it is necessary to carefully select a suitable substrate as the basis of the sensor; Subsequently, the chip mounting operation is carried out, that is, the core components are installed on the substrate; Immediately afterwards, the separation of single products is carried out to ensure that each sensor unit is independent and complete; After that, the unitary bottomless box-type cover is produced, which is crucial for the packaging of the sensor, and the material of the box-type cover is mostly steel, and sometimes the plastic-sealed tube shell is also used as an alternative solution; Next, the steel cover is glued to the sensor body by means of dispensing to ensure its sealing performance and stability; Finally, the semi-finished sensor is packaged with a specific colloid to complete the entire production process.

[0003] However, this packaging form is not without disadvantages. Among them, the most significant problem is that the production costs of the steel bottomless box-type cover and the steel cover are relatively high, which not only increases the overall manufacturing cost of the sensor, but also has a certain impact on its market competitiveness. At the same time, there are also deficiencies in production efficiency. The cumbersome production process and high material costs make it difficult to improve production efficiency. Therefore, this packaging form is more suitable for the packaging of single sensors, and there are obviously certain limitations for large-scale and high-efficiency production requirements. Summary of the Utility Model

[0004] In order to solve the technical problem that the existing packaging form is more suitable for the packaging of single sensors and there are obviously certain limitations for large-scale and high-efficiency production requirements, the utility model provides a batch packaging structure for sensors.

[0005] In order to achieve the above object, the technical solution adopted by a batch packaging structure for sensors in the utility model is as follows:

[0006] A batch packaging structure for sensors, comprising a substrate and a packaging cover. The substrate is a windowed substrate. An installation area is provided at the windowed position of the substrate. The installation area is divided into several packaging stations arranged in a rectangular array. The substrate is provided with first positioning holes on two opposite sides of the installation area. The packaging stations are used for installing sensor chips. One side of the substrate where the installation area is located is connected with a packaging layer. The packaging layer includes several packaging housings, and the packaging housings correspond to the packaging stations one by one. The packaging cover includes a cover plate area. The cover plate area is provided with several window covers arranged in a rectangular array. The window covers correspond to the packaging stations one by one. The window covers protrude. Windows are opened on the window covers, and waterproof membranes are pasted at the windows. The packaging cover is provided with second positioning holes on two opposite sides of the installation area. The second positioning holes are opposite to the first positioning holes in position. One side of the packaging cover far from the protruding direction of the window cover is bonded to the side of the substrate where the packaging stations are located.

[0007] Adopting the above structural scheme, the sensors can be batch packaged, the production efficiency can be improved, and the packaging cost can be reduced.

[0008] As a preferred implementation manner of a batch packaging structure for sensors, the material of the packaging housing is oxidation resin.

[0009] As a preferred implementation manner of a batch packaging structure for sensors, several cutting lines are drawn on the side of the packaging cover far from the substrate. The cutting lines pass through the horizontal gaps and vertical gaps between several window covers.

[0010] Adopting the above structural scheme, it is convenient for individual cutting.

[0011] As a preferred implementation manner of a batch packaging structure for sensors, several installation areas are provided.

[0012] Adopting the above structural scheme, the area of the substrate can be increased, the operation range for batch production can be flexibly adjusted, and the output can be increased.

[0013] As a preferred implementation manner of a batch packaging structure for sensors, the substrate and the packaging cover have the same shape and size.

[0014] As a preferred implementation manner of a batch packaging structure for sensors, the sensor chips are pasted on the packaging stations.

[0015] The beneficial effects of the present utility model include:

[0016] This application can batch package sensors, improve production efficiency, and reduce packaging cost. Description of the Drawings

[0017] To more clearly illustrate the technical solution of the present utility model, the following will briefly introduce the drawings required for the description. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0018] Figure 1 Schematic three-dimensional structure diagram of the substrate in Embodiment 1 of the present utility model;

[0019] Figure 2 Schematic three-dimensional structure diagram of the substrate with an encapsulation layer covered thereon in Embodiment 1 of the present utility model;

[0020] Figure 3 Schematic three-dimensional structure diagram of the encapsulation cover in Embodiment 1 of the present utility model;

[0021] Figure 4 Schematic three-dimensional structure diagram when the substrate and the encapsulation cover are bonded in Embodiment 1 of the present utility model;

[0022] Figure 5 Schematic three-dimensional structure diagram of the substrate in Embodiment 2 of the present utility model.

[0023] List of components and reference numerals:

[0024] 1. Substrate; 2. Encapsulation cover; 3. Installation area; 4. Sensor chip; 5. First positioning hole; 6. Encapsulation layer; 7. Cover plate area; 8. Window cover; 9. Waterproof film; 10. Second positioning hole; 11. Positioning pin. Specific embodiments

[0025] To make the objectives, features, and advantages of the present utility model more obvious and understandable, the following will clearly and completely describe the technical solutions in the present utility model with reference to the drawings in the specific embodiments. Obviously, the embodiments described below are only some embodiments of the present utility model, rather than all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of this application.

[0026] Embodiment 1:

[0027] Refer to Figures 1-4, this embodiment proposes a batch packaging structure for sensors, including a substrate 1 and a packaging cover 2. The substrate 1 is a windowed substrate 1. There is an installation area 3 on the substrate 1. The installation area 3 is divided into several packaging stations arranged in a rectangular array. The substrate 1 is provided with first positioning holes 5 on two opposite sides of the installation area 3. The packaging stations are used to install sensor chips 4, and the sensor chips 4 are pasted on the packaging stations. One side of the substrate 1 with the installation area 3 is connected with a packaging layer 6. The packaging layer 6 includes several packaging housings. The material of the packaging housings is oxidation resin, and the packaging housings correspond to the packaging stations one by one.

[0028] The material of the packaging cover 2 is the same as that of the packaging housings. The packaging cover 2 has the same shape, size and material as the substrate 1. The packaging cover 2 includes a cover plate area 7. There are several window covers 8 arranged in a rectangular array in the cover plate area 7. The window covers 8 correspond to the packaging stations one by one, and the array method is the same. The window covers 8 protrude. There are windows opened on the window covers 8, and waterproof membranes 9 are pasted at the windows. The packaging cover 2 is provided with second positioning holes 10 on two opposite sides of the installation area 3. The second positioning holes 10 are opposite to the first positioning holes 5 in position. One side of the packaging cover 2 far from the protruding direction of the window covers 8 is bonded to one side of the substrate 1 with the packaging stations. There are several cutting lines drawn on the side of the packaging cover 2 far from the substrate 1. The cutting lines pass through the horizontal gaps and vertical gaps between several window covers 8.

[0029] The working principle of this embodiment is as follows:

[0030] Apply glue on the packaging stations of the substrate 1 and place the sensor chips 4; cover the side of the substrate 1 with the installation area 3 with the packaging layer 6. The material of the packaging housings is oxidation resin, and then cure; after curing and forming, perform wire bonding process in each packaging housing; apply glue on the semi-finished sensor after wire bonding, align the packaging cover 2 with the substrate 1, make the window covers 8 correspond to the packaging stations one by one, make the second positioning holes 10 opposite to the first positioning holes 5 in position, insert positioning pins 11 into the first positioning holes 5 and the second positioning holes 10 to fix the substrate 1 and the packaging cover 2, bond the packaging cover 2 to the substrate 1, and cure; cut along the gaps between each window cover 8, and finally obtain single finished sensors.

[0031] Thus, it is possible to batch package sensors, improve production efficiency, reduce packaging costs, and prevent stress problems caused by different materials of the packaging housings and steel parts.

[0032] This embodiment can be used for batch packaging of pressure sensors. The sensor chip 4 of the pressure sensor is composed of two chips, SENSOR and ASIC.

[0033] Embodiment 2:

[0034] This embodiment provides a batch packaging structure for sensors. The difference from Embodiment 1 is that there are several installation areas 3. Refer to Figure 5 , the area of the substrate 1 is increased. For each installation area 3, the operation range for mass production can be flexibly adjusted, and the output can be increased.

[0035] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but rather will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A batch packaging structure for sensors, comprising a substrate (1) and a packaging cover (2), characterized in that: The substrate (1) is a windowed substrate (1), a mounting area (3) is provided at the window position of the substrate (1), the mounting area (3) is divided into a plurality of packaging stations arranged in a rectangular array, the substrate (1) is provided with first positioning holes (5) on two opposite sides of the mounting area (3), and the packaging stations are used to install sensor chips (4); a side of the substrate (1) provided with the mounting area (3) is connected to a packaging layer (6), the packaging layer (6) comprises a plurality of packaging tube shells, and the packaging tube shells correspond to the packaging stations one by one; The packaging cover (2) comprises a cover plate area (7), the cover plate area (7) is provided with a plurality of window covers (8) arranged in a rectangular array, the window covers (8) correspond to the packaging stations one by one, the window covers (8) are protrudingly arranged, a window is formed on the window cover (8), a waterproof film (9) is affixed to the window, the packaging cover (2) is provided with second positioning holes (10) on two opposite sides of the installation area (3), the second positioning holes (10) are opposite to the first positioning holes (5), and a side of the packaging cover (2) away from the protruding direction of the window covers (8) is bonded to a side of the substrate (1) provided with the packaging stations.

2. A batch packaging structure for sensors according to claim 1, characterized in that: The material of the package shell is oxidized resin.

3. A batch packaging structure for sensors according to claim 1, characterized in that: A plurality of cutting lines are drawn on the side of the packaging cover (2) away from the substrate (1), and the cutting lines pass through the transverse gaps and longitudinal gaps between the plurality of window covers (8).

4. A batch packaging structure for sensors according to claim 1, characterized in that: There are several installation areas (3).

5. The batch packaging structure for sensors according to claim 1, characterized in that: The substrate (1) and the packaging cover (2) have the same shape and size.

6. The batch packaging structure for sensors according to claim 1, characterized in that: The sensor chip (4) is pasted on the packaging station.

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