Optical device method and optical sensor

Abstract

The invention relates to the technical field of optical sensors, in particular to an optical device packaging method and an optical sensor.The optical device packaging method comprises the steps that a mounting hole penetrating through a circuit board up and down is machined in the circuit board; then a bottom film is pasted at the lower end of the circuit board, the bottom film can block the lower port of the mounting hole and provide a supporting effect, then an optical device is put into the mounting hole, the optical device is placed on the bottom film, light-transmitting glue wrapping the optical device is injected into the mounting hole, and after the light-transmitting glue is solidified into a glue block, the bottom film is torn off; the circuit layer electrically connected with the optical device and the circuit board is machined at the upper end and / or the lower end of the circuit board, the insulating layer is machined on the side, away from the circuit board, of the circuit layer, the optical device and the circuit board are vertically overlapped, and a cover body does not need to be arranged. Therefore, the total thickness of the optical sensor processed by the optical device packaging method is small.

Description

Technical Field

[0001] The present invention relates to the technical field of optical sensors, and in particular to an optical device packaging method and an optical sensor. Background Art

[0002] Optical sensors such as ambient light sensors, spectral light sensors, and proximity light sensors are widely used in consumer electronics, liquid supply automation, automotive electronics, and medical electronics. Optical sensors generally include a substrate and optical devices such as a projector and a light receiver packaged on the substrate. At present, the optical devices such as the projector and the light receiver are mostly installed on the upper end of the substrate, and then a packaged optical device with a light-transmitting port is set on the upper end of the substrate. The total height of the optical sensor processed by this packaging method is equal to the thickness of the substrate plus the height of the cover, and the total thickness of the optical sensor is relatively thick. Summary of the invention

[0003] The technical problem to be solved by the present invention is that the optical sensor produced by the existing packaging method is relatively thick.

[0004] In order to solve the above technical problems, the object of the present invention is to provide an optical device packaging method, comprising the following steps:

[0005] Processing mounting holes on the circuit board that penetrate the circuit board from top to bottom;

[0006] A bottom film is attached to the lower end of the circuit board to block the lower end of the mounting hole;

[0007] Injecting light-transmitting glue into the mounting hole, wherein the light-transmitting glue wraps the optical device and connects the optical device to the mounting hole;

[0008] Filling the mounting hole with light-transmitting glue that wraps the optical device;

[0009] After the light-transmitting adhesive is solidified into an adhesive block, the base film is removed;

[0010] Processing a circuit layer electrically connected to the optical device and the circuit board at the upper end and / or the lower end of the circuit board;

[0011] An insulating layer is processed on a side of the circuit layer facing away from the circuit board.

[0012] As a preferred embodiment, the circuit board includes a second circuit layer, a substrate and a third circuit layer arranged in sequence from bottom to top, and the substrate is provided with a first conductive structure for electrically connecting the second circuit layer and the third circuit layer; the circuit layer is provided with a second conductive structure electrically connected to the second circuit layer and / or the third circuit layer.

[0013] As a preferred solution, a first pad is provided on the top of the optical device; the circuit layer includes a first circuit layer; and “processing a circuit layer electrically connected to the optical device and the circuit board at the upper end and / or the lower end of the circuit board” includes:

[0014] A first conductive layer electrically connected to the circuit board is provided at the upper end of the circuit board;

[0015] Processing a first process hole connecting the first pad and the first conductive layer on the first conductive layer and the rubber block;

[0016] Processing a first inner hole conductive layer in the first process hole so that the first pad is electrically connected to the first conductive layer;

[0017] The first conductive layer is processed into the first circuit layer.

[0018] As a preferred solution, a first insulating layer is provided between the first circuit layer and the third circuit layer;

[0019] Before processing the first conductive layer into the first circuit layer, the method includes:

[0020] Processing a second process hole on the first conductive layer that passes through the first insulating layer and connects to the third circuit layer;

[0021] A second inner hole conductive layer is processed in the second process hole to make the third circuit layer electrically connected with the first conductive layer.

[0022] As a preferred solution, processing the first conductive layer into the first circuit layer comprises:

[0023] Covering the first circuit layer with a first insulating ink layer;

[0024] The first insulating ink layer above and below the light-transmitting opening of the optical device is removed.

[0025] As a preferred solution, the circuit layer further includes a fourth circuit layer, and “processing a circuit layer electrically connected to the optical device and the circuit board at the upper end and / or the lower end of the circuit board” further includes:

[0026] A second insulating layer and a fourth conductive layer are arranged in sequence from top to bottom at the lower end of the second circuit layer;

[0027] Processing a third process hole in the fourth conductive layer that passes through the second insulating layer and is connected to the second circuit layer;

[0028] Adding a third inner hole conductive layer in the third process hole to make the second circuit layer and the fourth conductive layer electrically conductive;

[0029] The fourth conductive layer is processed into the fourth circuit layer.

[0030] As a preferred solution, a second pad is provided at the lower end of the optical device, and before the optical device is placed in the mounting hole, a conductive adhesive layer is provided at the end of the second pad, the area of ​​the conductive adhesive layer is larger than the area of ​​the second pad, and the optical device is connected to the base film through the conductive adhesive layer;

[0031] The fourth conductive layer is further provided with a fourth process hole passing through the second insulating layer and communicating with the conductive adhesive layer, and a fourth inner hole conductive layer is provided in the fourth process hole.

[0032] As a preferred solution, the fourth circuit layer has a power connection area used as a conductive feeler, and after processing the fourth conductive layer into the fourth circuit layer, the process further includes:

[0033] Covering the lower end of the fourth circuit layer with a second insulating ink layer;

[0034] The second insulating ink layer above and below the power connection area is removed.

[0035] As a preferred solution, after “removing the second insulating ink layer above and below the power connection area”, the method further comprises:

[0036] An anti-corrosion conductive layer is processed on the outer side of the power connection area.

[0037] An optical sensor comprises a light projector and a light receiver, wherein at least one of the light projector and the light receiver is packaged using the optical device packaging method described above.

[0038] Compared with the prior art, the present invention has the following beneficial effects:

[0039] The optical device packaging method of the present invention first processes a mounting hole that passes through the circuit board from top to bottom on the circuit board; then a bottom film is attached to the lower end of the circuit board, the bottom film can block the lower end of the mounting hole and provide support, then the optical device is placed in the mounting hole, the optical device is placed on the bottom film, and the mounting hole is filled with light-transmitting glue that wraps the optical device, the light-transmitting glue can fix and protect the optical device, and enable the optical device to smoothly receive or emit light, after the light-transmitting glue solidifies into a glue block, the bottom film is torn off, and a circuit layer that is electrically connected to the optical device and the circuit board is processed at the upper end and / or lower end of the circuit board, and an insulating layer is processed on the side of the circuit layer away from the circuit board, the optical device and the circuit board overlap each other up and down, and there is no need to set a cover body, so the total thickness of the optical sensor processed by the optical device packaging method of the present invention is relatively thin. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1A schematic diagram of the process of the optical device packaging method of the present invention;

[0041] Figure 2 It is a schematic diagram of the structure of copper plating on the upper and lower ends of the substrate;

[0042] Figure 3 A schematic diagram of the structure for processing through holes on the copper plating layer and the substrate;

[0043] Figure 4 It is a schematic diagram of the structure of copper plating in a through hole;

[0044] Figure 5 A schematic diagram of the structure of processing the copper-plated layer into the second circuit layer and the third circuit layer;

[0045] Figure 6 This is a schematic diagram of the structure of the circuit board after the mounting holes are processed;

[0046] Figure 7 A schematic diagram of the structure of covering the bottom film at the lower end of the circuit board;

[0047] Figure 8 It is a schematic diagram of the structure of filling the light-transmitting glue in the mounting hole;

[0048] Fig. 9 A schematic diagram of a structure in which a first insulating layer, a first conductive layer, a second insulating layer, and a fourth conductive layer are arranged on a circuit board;

[0049] Fig.10 A schematic diagram of the structure for processing the first process hole, the second process hole, the third process hole and the fourth process hole;

[0050] Fig.11 A schematic diagram of the structure of copper plating on the first process hole, the second process hole, the third process hole and the fourth process hole;

[0051] Fig.12 A schematic diagram of the structure for processing a light hole;

[0052] Fig.13 A schematic diagram of the structure for processing the insulating layer;

[0053] Fig.14 A schematic diagram of the structure for processing the anti-corrosion conductive layer;

[0054] Fig.15 is a schematic structural diagram of an optical sensor of the present invention;

[0055] In the figure, 1, circuit board, 11, mounting hole, 12, second circuit layer, 13, substrate, 14, third circuit layer, 15, through hole, 16, copper plating layer, 2, base film, 3, optical device, 31, projector, 32, light receiver, 4, glue block, 5, circuit layer, 51, first circuit layer, 510, first conductive layer, 5101, light through hole, 52, fourth circuit layer, 521, power connection area, 520, fourth conductive layer, 6, insulating layer, 61, first insulating ink layer, 62, second insulating ink layer, 71, first process hole, 72, second process hole, 73, third process hole, 74, fourth process hole, 81, first insulating layer, 82, second insulating layer, 9, anti-corrosion conductive layer, 10, conductive glue. DETAILED DESCRIPTION

[0056] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0057] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "top", "bottom", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but such information should not be limited to these terms, which are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, the "first" information may also be referred to as the "second" information, and similarly, the "second" information may also be referred to as the "first" information.

[0058] like Figures 1 to 14 As shown, a preferred embodiment of the optical device packaging method of the present invention comprises the following steps:

[0059] A mounting hole 11 is processed on the circuit board 1, which passes through the circuit board 1 vertically. The mounting hole 11 can be processed by drilling or laser, and the size of the mounting hole 11 is larger than the outer contour of the optical device 3.

[0060] A bottom film 2 is attached to the lower end of the circuit board 1 to block the lower end of the mounting hole 11; the bottom film 2 is attached to the lower end of the entire circuit board 1 to support the optical device 3 to be placed in the mounting hole 11;

[0061] Insert the optical device 3 into the mounting hole 11, and place the optical device 3 on the base film 2;

[0062] Inject light-transmitting glue into the mounting hole 11, the light-transmitting glue wraps the optical device 3 and connects the optical device 3 to the hole wall of the mounting hole 11. In this embodiment, the light-transmitting glue fills the mounting hole 11. The light-transmitting glue plays a role in fixing and protecting the optical device 3, and can meet the light transmittance requirement of the optical device 3 for emitting or receiving light.

[0063] After the light-transmitting adhesive is solidified into an adhesive block 4, the bottom film 2 is removed to expose the substrate 13 and the bottom of the optical device 3;

[0064] A circuit layer 5 electrically connected to the optical device 3 and the circuit board 1 is processed at the upper end and / or the lower end of the circuit board 1;

[0065] An insulating layer 6 is processed on the side of the circuit layer 5 facing away from the circuit board 1 .

[0066] Since the optical device 3 and the circuit board 1 overlap vertically and no cover is required, the total thickness of the optical sensor processed by the optical device packaging method of the present invention is relatively thin.

[0067] The circuit board 1 includes a second circuit layer 12, a substrate 13 and a third circuit layer 14 arranged in sequence from bottom to top, and a first conductive structure for electrically connecting the second circuit layer 12 and the third circuit layer 14 is provided in the substrate 13; the circuit layer 5 is provided with a second conductive structure electrically connected to the second circuit layer 12 and / or the third circuit layer 14. Specifically, the processing method of the circuit board 1 is as follows: firstly, the substrate 13 is cut, and the substrate 13 is baked after the cutting is completed to eliminate the stress of the substrate 13, fix the size of the substrate 13, and prevent the deformation of the substrate 13; then, copper is plated at the upper and lower ends of the substrate 13, and then a through hole 15 is drilled on the copper-plated substrate 13 to pass through the substrate 13 and the copper-plated layer 16 from top to bottom. Mechanical drilling or laser drilling can be used for drilling, and then copper is plated in the through hole 15, and the copper material in the through hole 15 forms a first conductive structure, so that the electrical conduction position is connected. The copper-plated layer 16 at the upper and lower ends of the substrate 13 is finally processed into the third circuit layer 14 and the second circuit layer 12. When processing the third circuit layer 14 and the second circuit layer 12, a dry film is attached to the upper and lower ends of the substrate 13, and then a desired circuit pattern is formed on the dry film by exposure and development, and then the excess copper between the circuits is etched away, and finally the dry film is peeled off the substrate 13 to obtain the third circuit layer 14 and the second circuit layer 12.

[0068] In this embodiment, a first pad is provided on the top of the optical device 3. When the existing optical sensor is packaged, a wire needs to be welded on the first pad to connect the circuit board 1. In this embodiment, the circuit layer 5 includes a first circuit layer 51; “processing a circuit layer 5 electrically connected to the optical device 3 and the circuit board 1 at the upper end and / or the lower end of the circuit board 1” includes:

[0069] A first conductive layer 510 electrically connected to the circuit board 1 is disposed at the upper end of the circuit board 1;

[0070] A first process hole 71 connecting the first pad and the first conductive layer 510 is processed on the first conductive layer 510 and the rubber block 4;

[0071] A first inner hole conductive layer is processed in the first process hole 71 to make the first pad electrically connected to the first conductive layer 510;

[0072] The first conductive layer 510 is processed into the first circuit layer 51. When the first conductive layer 510 is processed into the first circuit layer 51, a light hole 5101 is processed that is opposite to the light emitting area or the light receiving area of ​​the optical device 3. Therefore, in this embodiment, there is no need to weld the wires for connecting the first pad and the circuit board 1, which is convenient for mass processing.

[0073] Wherein, a first insulating layer 81 is provided between the first circuit layer 51 and the third circuit layer 14;

[0074] Before processing the first conductive layer 510 into the first circuit layer 51, the following steps are included:

[0075] A second process hole 72 is processed on the first conductive layer 510 to pass through the first insulating layer 81 and connect to the third circuit layer 14;

[0076] The second inner hole conductive layer is processed in the second process hole 72 to make the third circuit layer 14 and the first conductive layer 510 electrically connected.

[0077] Specifically, the first conductive layer 510 is a first copper foil bonded to the upper end of the substrate 13 through a first prepreg, and the prepreg forms the first insulating layer 81 .

[0078] In this embodiment, the first conductive layer 510 is processed into the first circuit layer 51, which includes:

[0079] Covering the first circuit layer 51 with a first insulating ink layer 61;

[0080] The first insulating ink layer 61 which is vertically opposite to the light emitting area or the light receiving area of ​​the optical device 3 is removed.

[0081] The first ink layer serves to protect the first circuit layer 51. When the optical device 3 is set as a light projector 31 and a light receiver 32, the first ink layer that is opposite to the light-emitting port of the light projector 31 and the light-receiving port of the light receiver 32 is removed, so that the light projector 31 and the light receiver 32 can emit light or receive light smoothly through the light hole 5101. The first ink layer at the edge of the light hole 5101 also serves to shield interference light.

[0082] In this embodiment, the circuit layer 5 further includes a fourth circuit layer 52, and “processing a circuit layer 5 electrically connected to the optical device 3 and the circuit board 1 at the upper end and / or the lower end of the circuit board 1” further includes:

[0083] A second insulating layer 82 and a fourth conductive layer 520 are disposed at the lower end of the second circuit layer 12 in sequence from top to bottom;

[0084] A third process hole 73 is processed in the fourth conductive layer 520 to pass through the second insulating layer 82 and connect to the second circuit layer 12;

[0085] A third inner hole conductive layer is added in the third process hole 73 to make the second circuit layer 12 and the fourth conductive layer 520 electrically connected; the third inner hole conductive layer and the second inner hole conductive layer form a second conductive structure;

[0086] The fourth conductive layer 520 is processed into a fourth circuit layer 52 .

[0087] The fourth conductive layer 520 is a second copper foil bonded to the lower end of the circuit board 1 through a second prepreg.

[0088] In this embodiment, a second pad is provided at the lower end of the optical device 3. Before the optical device 3 is placed in the mounting hole 11, a conductive adhesive layer 10 is provided at the end of the second pad. The area of ​​the conductive adhesive layer 10 is larger than that of the second pad, thereby increasing the electrical connection area of ​​the optical device 3. The optical device 3 is connected to the base film 2 through the conductive adhesive layer 10. At this time, the peripheral side of the optical device 3 is spaced from the inner side wall of the mounting hole 11, and the conductive adhesive plays a role in connecting the optical device 3 to the middle of the mounting hole 11. The fourth conductive layer 520 is also provided with a fourth process hole 74 that passes through the second insulating layer 82 and is connected to the conductive adhesive layer 10. The fourth process hole 74 is provided with a third inner hole conductive layer. Among them, the first inner hole conductive layer, the second inner hole conductive layer, the third inner hole conductive layer and the fourth inner hole conductive layer are all copper-plated layers 16. The provision of the conductive adhesive layer 10 increases the electrical connection area of ​​the optical device 3, reduces the position accuracy requirements for the fourth process hole 74, and facilitates the subsequent processing of the fourth process hole 74.

[0089] In this embodiment, the fourth circuit layer 52 has a power connection area 521 used as a conductive antenna, and after the fourth conductive layer 520 is processed into the fourth circuit layer 52, the following further includes:

[0090] The lower end of the fourth circuit layer 52 is covered with a second insulating ink layer 62;

[0091] The second insulating ink layer 62 which is vertically opposite to the power connection area 521 is removed.

[0092] Furthermore, after “removing the second insulating ink layer 62 which is vertically opposite to the power connection area 521 ”, the following steps are included:

[0093] An anti-corrosion conductive layer 9 is processed on the outer side of the power connection area 521. The anti-corrosion conductive layer 9 can be a nickel-plated layer or a gold-plated layer or other plating layer with good anti-oxidation performance.

[0094] In other embodiments of the present invention, the optical device 3 may have all pads disposed on the top, and in this case, the fourth process hole 74 does not need to be processed.

[0095] An embodiment of an optical sensor, such as Fig.15 As shown, it includes a projector 31 and a light receiver 32, and at least one of the projector 31 and the light receiver 32 is packaged using the above-mentioned optical device packaging method. Specifically, the above-mentioned optical device packaging method can be used to firstly perform modular packaging on multiple projectors 31, and then the packaged projector module is cut into multiple projector packages; similarly, the above-mentioned optical device packaging method can also be used to perform modular packaging on multiple light receivers 32, and then the packaged light receiver module is cut into multiple light receiver packages, and finally the projector package and the light receiver package are assembled; in other embodiments of the present invention, a first mounting hole for mounting the projector 31 and a second mounting hole for mounting the light receiver 32 can be set on the circuit board 1, and the projector 31 and the light receiver 32 are packaged in the first mounting hole and the second mounting hole simultaneously using the above-mentioned optical device packaging method. Among them, the first mounting hole and the second mounting hole are regarded as a hole group, and multiple hole groups are arranged in an array on the circuit board 1, and multiple optical sensors are packaged at the same time, and finally the finished product after packaging is cut into multiple optical sensors.

[0096] In summary, the optical device packaging method of the present invention first processes a mounting hole 11 that passes through the circuit board 1 from top to bottom on the circuit board 1; then a base film 2 is attached to the lower end of the circuit board 1, the base film 2 can block the lower end of the mounting hole 11 and provide support, and then the optical device 3 is placed in the mounting hole 11, the optical device 3 is placed on the base film 2, and a light-transmitting glue that wraps the optical device 3 is injected into the mounting hole 11, the light-transmitting glue can fix and protect the optical device 3, and enable the optical device 3 to smoothly receive or emit light, after the light-transmitting glue solidifies into a glue block 4, the base film 2 is torn off, and a circuit layer 5 that is electrically connected to the optical device 3 and the circuit board 1 is processed at the upper and / or lower end of the circuit board 1, and an insulating layer 6 is processed on the side of the circuit layer 5 away from the circuit board 1, the optical device 3 overlaps with the circuit board 1 up and down, and there is no need to set a cover, so the total thickness of the optical sensor processed by the optical device packaging method of the present invention is relatively thin.

[0097] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. An optical device packaging method, characterized in that: The following steps are involved: A mounting hole (11) is processed on the circuit board (1) and passes through the circuit board (1) vertically; A bottom film (2) is attached to the lower end of the circuit board (1) to seal the lower end of the mounting hole (11); Inserting an optical device (3) into the mounting hole (11), and placing the optical device (3) on the base film (2); Injecting light-transmitting glue into the mounting hole (11), wherein the light-transmitting glue wraps the optical device (3) and connects the optical device (3) to the hole wall of the mounting hole (11); After the light-transmitting adhesive is solidified into an adhesive block (4), the base film (2) is removed; A circuit layer (5) electrically connected to the optical device (3) and the circuit board (1) is processed at the upper end and / or the lower end of the circuit board (1); An insulating layer (6) is processed on the side of the circuit layer (5) facing away from the circuit board (1).

2. The optical device packaging method according to claim 1, characterized in that: The circuit board (1) comprises a second circuit layer (12), a substrate (13) and a third circuit layer (14) arranged in sequence from bottom to top; the substrate (13) is provided with a first conductive structure for electrically connecting the second circuit layer (12) and the third circuit layer (14); and the circuit layer (5) is provided with a second conductive structure electrically connected to the second circuit layer (12) and / or the third circuit layer (14).

3. The optical device packaging method according to claim 2, characterized in that: The optical device (3) is provided with a first solder pad on the top; the circuit layer (5) includes a first circuit layer (51); "processing a circuit layer (5) electrically connected to the optical device (3) and the circuit board (1) at the upper end and / or the lower end of the circuit board (1)" includes: A first conductive layer (510) electrically connected to the circuit board (1) is provided at the upper end of the circuit board (1); Processing a first process hole (71) on the first conductive layer (510) and the rubber block (4) to connect the first pad and the first conductive layer (510); Processing a first inner hole conductive layer in the first process hole (71) so that the first pad is electrically connected to the first conductive layer (510); The first conductive layer (510) is processed into the first circuit layer (51).

4. The optical device packaging method according to claim 3, characterized in that: A first insulating layer (81) (6) is provided between the first circuit layer (51) and the third circuit layer (14); Before processing the first conductive layer (510) into the first circuit layer (51), the method comprises: Processing a second process hole (72) on the first conductive layer (510) that passes through the first insulating layer (81) (6) and is connected to the third circuit layer (14); A second inner hole conductive layer is processed in the second process hole (72) to make the third circuit layer (14) electrically connected to the first conductive layer (510).

5. The optical device packaging method according to claim 3, characterized in that: After processing the first conductive layer (510) into the first circuit layer (51), the method comprises: Covering the first circuit layer (51) with a first insulating ink layer (61); The first insulating ink layer (61) above and below the light-transmitting opening of the optical device (3) is removed.

6. The optical device packaging method according to claim 2, characterized in that: The circuit layer (5) further includes a fourth circuit layer (52), and “processing a circuit layer (5) electrically connected to the optical device (3) and the circuit board (1) at the upper end and / or the lower end of the circuit board (1)” further includes: A second insulating layer (82) and a fourth conductive layer (520) are arranged in sequence from top to bottom at the lower end of the second circuit layer (12); Processing a third process hole (73) in the fourth conductive layer (520) that passes through the second insulating layer (82) and is connected to the second circuit layer (12); Adding a third inner hole conductive layer in the third process hole (73) to make the second circuit layer (12) and the fourth conductive layer (520) electrically conductive; The fourth conductive layer (520) is processed into the fourth circuit layer (52).

7. The optical device packaging method according to claim 6, characterized in that: A second solder pad is provided at the lower end of the optical device (3); before the optical device (3) is placed in the mounting hole (11), a conductive adhesive layer (10) is provided at the end of the second solder pad, the area of ​​the conductive adhesive layer (10) being larger than the area of ​​the second solder pad, and the optical device (3) is connected to the base film (2) via the conductive adhesive layer (10); The fourth conductive layer (520) is further provided with a fourth process hole (74) passing through the second insulating layer (82) and communicating with the conductive adhesive layer (10), and a fourth inner hole conductive layer is provided in the fourth process hole (74).

8. The optical device packaging method according to claim 6, characterized in that: The fourth circuit layer (52) has a power connection area (521) used as a conductive antenna. After the fourth conductive layer (520) is processed into the fourth circuit layer (52), the method further includes: Covering the lower end of the fourth circuit layer (52) with a second insulating ink layer (62); The second insulating ink layer (62) above and below the power connection area (521) is removed.

9. The optical device packaging method according to claim 8, characterized in that: After “removing the second insulating ink layer (62) above and below the power connection area (521)”, the method includes: An anti-corrosion conductive layer (9) is processed on the outer side of the power connection area (521).

10. An optical sensor, characterized in that: It comprises a light projector (31) and a light receiver (32), and at least one of the light projector (31) and the light receiver (32) is packaged using the optical device packaging method according to any one of claims 1 to 9.

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