Display device and method of manufacturing same

Abstract

The invention relates to a display device and a method of manufacturing the same. The display device includes: a display panel; a shielding layer disposed at a lower end of the display panel, and including a plurality of alignment marks and a conductive member; and a printed circuit board, the printed circuit board is aligned on the shielding layer based on the plurality of alignment marks, and the printed circuit board is in contact with at least a part of the shielding layer. The conductive member electrically connects the printed circuit board and the shielding layer.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and all rights and benefits arising from Korean Patent Application No. 10-2023-0131915 filed in the Korean Intellectual Property Office on October 4, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates generally to display devices, and more particularly, to a display device and a method of manufacturing the display device. Background Art

[0004] As technology develops, a display device may include electronic components that perform various functions therein. The electronic components may be connected to a main printed circuit board of the display device. The electronic components may be connected to the main printed circuit board through a connector to be supplied with power or transmit / receive signals. Summary of the invention

[0005] Embodiments provide a display device and a method for manufacturing a display device (also referred to herein as a method for manufacturing a display device), wherein a printed circuit board is aligned on a shielding layer based on an alignment mark. In an embodiment, the display device may include an alignment mark capable of checking whether the printed circuit board has been successfully aligned. Therefore, during the manufacturing process of the display device, it can be checked whether the shielding layer and the printed circuit board are electrically connected to each other through the conductive member of the shielding layer.

[0006] In an embodiment of the present disclosure, a display device includes: a display panel; a shielding layer, which is arranged at the lower end of the display panel, the shielding layer including a plurality of alignment marks and a conductive member; and a printed circuit board, which is aligned on the shielding layer based on the plurality of alignment marks, the printed circuit board contacts at least a portion of the shielding layer, wherein the conductive member electrically connects the printed circuit board and the shielding layer to each other.

[0007] In an embodiment, the printed circuit board may overlap at least a portion of a contact region of the shielding layer. The plurality of alignment marks may be disposed in the contact region.

[0008] In an embodiment, at least one of the plurality of alignment marks may overlap the printed circuit board.

[0009] In an embodiment, the display device may further include a printed circuit board cover covering the printed circuit board. Corners of the printed circuit board and corners of the printed circuit board cover may be cut so that the plurality of alignment marks are exposed.

[0010] In an embodiment, the plurality of alignment marks may include: a first alignment mark disposed at one side of the shielding layer; and a second alignment mark disposed at an opposite side of the shielding layer and symmetrically disposed to the first alignment mark.

[0011] In an embodiment, a distance between an outer side of the first alignment mark and an outer side of the second alignment mark in a predetermined direction perpendicular to a direction in which the shielding layer and the printed circuit board are arranged may be smaller than a length of the printed circuit board in the predetermined direction.

[0012] In an embodiment, a distance between an outer side of the first alignment mark and an outer side of the second alignment mark in a predetermined direction in which the shielding layer and the printed circuit board are arranged may be smaller than a length of the printed circuit board in the predetermined direction.

[0013] In an embodiment, the shielding layer may include at least one of aluminum (Al) and copper (Cu).

[0014] In an embodiment, the plurality of alignment marks may be printed in the masking layer.

[0015] In an embodiment of the present disclosure, a method for manufacturing a display device includes: preparing a display panel including a bending area; disposing a shielding layer including a plurality of alignment marks at a lower end of the display panel; and bending the bending area and aligning a printed circuit board on the shielding layer based on the plurality of alignment marks, wherein the shielding layer includes a conductive member that electrically connects the printed circuit board and the shielding layer to each other.

[0016] In an embodiment, the printed circuit board may be arranged to overlap at least a portion of a contact region of the shielding layer. The plurality of alignment marks may be arranged in the contact region.

[0017] In an embodiment, at least one of the plurality of alignment marks may overlap the printed circuit board.

[0018] In an embodiment, the method may further include disposing a printed circuit board cover on the printed circuit board. Corners of the printed circuit board and corners of the printed circuit board cover may be cut so that the plurality of alignment marks are exposed.

[0019] In an embodiment, the plurality of alignment marks may include a first alignment mark disposed at one side of the shielding layer, and a second alignment mark disposed at an opposite side of the shielding layer and symmetrically disposed to the first alignment mark.

[0020] In an embodiment, a distance between an outer side of the first alignment mark and an outer side of the second alignment mark in a predetermined direction perpendicular to a direction in which the shielding layer and the printed circuit board are arranged may be smaller than a length of the printed circuit board in the predetermined direction.

[0021] In an embodiment, a distance between an outer side of the first alignment mark and an outer side of the second alignment mark in a predetermined direction in which the shielding layer and the printed circuit board are arranged may be smaller than a length of the printed circuit board in the predetermined direction.

[0022] In an embodiment, the shielding layer may include at least one of aluminum (Al) and copper (Cu).

[0023] In an embodiment, the plurality of alignment marks may be printed in the masking layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Embodiments, features and advantages will now be described more fully with reference to the accompanying drawings.

[0025] Figure 1 is a perspective view of an embodiment of a display device according to the present disclosure.

[0026] Figure 2 yes Figure 1 An exploded perspective view of the display device shown in FIG.

[0027] Figure 3 It is shown Figure 2 An exploded perspective view of an embodiment of a protective layer is shown in FIG.

[0028] Figure 4 It is shown Figure 2 A plan view of an embodiment of a masking layer and a printed circuit board before the bending area is bent is shown in FIG.

[0029] Figure 5 It is shown Figure 2 A plan view of an embodiment of a shielding layer and a printed circuit board after bending of the bending area shown in FIG.

[0030] Figure 6 It is shown Figure 5 is a plan view of a comparative example in which the printed circuit board shown in FIG. 1 is not successfully aligned on the masking layer.

[0031] Figure 7 is a flowchart illustrating an embodiment of a method for manufacturing a display device according to the present disclosure.

[0032] Figure 8 is a flowchart illustrating an embodiment of a method for manufacturing a display device according to the present disclosure.

[0033] Fig. 9 It is shown Figure 8 1 is a plan view of an embodiment of a shielding layer and a printed circuit board cover in operation S840 shown in FIG. DETAILED DESCRIPTION

[0034] Hereinafter, embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. In the following description, only the necessary parts for understanding the implementation according to the present disclosure are described, and the description of other parts is omitted to avoid unnecessarily blurring the subject matter of the present disclosure. In addition, the present disclosure is not limited to the embodiments described herein, but can be embodied in various different forms. On the contrary, the embodiments described herein are provided to thoroughly and completely describe the disclosed content and fully convey the idea of ​​the present disclosure to those of ordinary skill in the art.

[0035] Throughout the specification, when an element is referred to as "connected" or "coupled" to another element, the element may be directly connected or directly coupled to the other element, or indirectly connected or indirectly coupled to the other element, and one or more intermediate elements are between the element and the other element. The technical terms used herein are only used for the purpose of illustrating illustrative embodiments, and are not intended to limit embodiments. It will be understood that when a component "includes" an element, unless there is another description to the contrary, it should be understood that the component does not exclude another element, but may also include another element. It will be understood that, for the purpose of this disclosure, "at least one of X, Y and Z" can be interpreted as only X, only Y, only Z or any combination of two or more items in X, Y and Z (e.g., XYZ, XY, YZ, XZ). Similarly, for the purpose of this disclosure, "at least one selected from the group consisting of X, Y and Z" can be interpreted as only X, only Y, only Z or any combination of two or more items in X, Y and Z (e.g., XYZ, XY, YZ, XZ).

[0036] It will be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Therefore, without departing from the teachings of the present disclosure, the "first" element discussed below may also be referred to as the "second" element.

[0037] For ease of description, spatially relative terms such as "below" and "above" may be used herein to describe the relationship between one element and another element as shown in the drawings. It will be understood that, in addition to the orientations described herein and depicted in the drawings, the spatially relative terms and the configurations shown are also intended to cover different orientations of the device in use or operation. For example, if the device is flipped in the drawings, the elements or features described as "below" or "under" other elements or features will then be oriented as "above" the other elements or features. Therefore, the exemplary term "above" can cover both above and below. The device can be oriented in other ways (e.g., rotated 90 degrees or at other orientations), and the spatially relative terms used in this article should be interpreted accordingly. The illustrative embodiments can be embodied in different forms and should not be interpreted as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the embodiments to those skilled in the art.

[0038] In the accompanying drawings, dimensions may be exaggerated for clarity of illustration. It will be understood that when an element is referred to as being "between" two elements, the element may be the only element between the two elements, or one or more intervening elements may also be present. The same reference numerals refer to the same elements throughout.

[0039] In addition, embodiments of the present disclosure are described herein with reference to schematic diagrams of ideal embodiments (and intermediate structures) of the present disclosure, such that variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances can be expected. Therefore, embodiments of the present disclosure should not be limited to the predetermined shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing techniques. The regions shown in the drawings are schematic in nature, and the shapes of the regions shown in the drawings do not represent the actual shapes of the regions of the device and do not limit the scope of the present disclosure.

[0040] Figure 1 is a perspective view of an embodiment of a display device according to the present disclosure. Figure 2 yes Figure 1 An exploded perspective view of the display device shown in FIG.

[0041] exist Figure 1In the embodiment of the present disclosure, a portable terminal is shown as an example to which the display device in the embodiment of the present disclosure is applied. The portable terminal may include a tablet personal computer ("PC"), a smart phone, a personal digital assistant ("PDA"), a portable multimedia player ("PMP"), a game device, or a watch-type electronic device, etc. However, the present disclosure is not limited thereto. The present disclosure can be used not only for large electronic devices such as televisions and external billboards, but also for small and medium-sized electronic devices such as PCs (e.g., notebook computers), vehicle navigation units, and cameras. These devices are only provided as embodiments, otherwise the display device can be used in other electronic devices as long as the display device does not deviate from the concept of the present disclosure.

[0042] like Figure 1 As shown in , the display device 1000 may include a plurality of regions divided in a display surface. In an embodiment, for example, the display device 1000 may include a display region AR displaying an image IM and a non-display region BR adjacent to the display region AR.

[0043] Figure 1 An Internet search window in an embodiment of the image IM is shown. In the present disclosure, the display area AR may have, for example, a rectangular shape in a plan view. The non-display area BR may be provided to surround the display area AR.

[0044] refer to Figure 1 and Figure 2 , the display device 1000 may include a window member 100 , a display panel 200 , a protective layer 300 , a bracket 400 , and a back case 500 .

[0045] The window member 100 may be disposed on top of the display panel 200. Thus, the window member 100 may protect a display surface (e.g., a top surface in the third direction DR3) of the display panel 200. In addition, the window member 100 may be coupled to the display panel 200. In an embodiment, for example, the window member 100 may be coupled to the display panel 200 while covering the display surface of the display panel 200.

[0046] The window member 100 may include a display area 100 -AR allowing an image IM provided by the display panel 200 to be transmitted therethrough and a non-display area 100 -BR adjacent to the display area 100 -AR.

[0047] The window member 100 may include an optically transparent material. In an embodiment, for example, the window member 100 may include glass or plastic. In addition, the window member 100 may have a multilayer structure or a single-layer structure. In an embodiment, for example, the window member 100 may include a plurality of films coupled to each other by an adhesive, or may include a glass substrate and a plastic film coupled to each other by an adhesive.

[0048] The display panel 200 may include a substrate 210 , an encapsulation layer 220 , a plurality of pixels PX, a bending area BA, and a printed circuit board PCB.

[0049] The display panel 200 may have a display surface in which the image IM is displayed and a rear surface opposite to the display surface. The display surface may be defined as a top surface of the encapsulation layer 220, and the rear surface may be defined as a bottom surface of the substrate 210.

[0050] The display panel 200 may include a display area 200-AR and a non-display area 200-BR. The display area 200-AR may be an area in which an image IM is displayed, and corresponds to the display area 100-AR of the window member 100. The non-display area 200-BR may be adjacent to the display area 200-AR and correspond to the non-display area 100-BR of the window member 100. The display area 200-AR in which the image IM is displayed is parallel to a plane defined by the first direction DR1 and the second direction DR2, and the normal direction of the display area 200-AR is indicated by the third direction DR3. However, the directions indicated by the above directions are relative concepts and may be changed to other directions.

[0051] The substrate 210 may be a rigid substrate or film or a flexible substrate or film. In an embodiment, for example, the substrate 210 may be configured as a rigid substrate including glass (e.g., tempered glass), a flexible substrate (or film) including plastic or metal, or at least one insulating layer. The material and / or properties of the substrate 210 are not particularly limited.

[0052] The encapsulation layer 220 may be disposed on the substrate 210. When the encapsulation layer 220 is provided in the form of an encapsulation film, the encapsulation layer 220 may include an inorganic layer and / or an organic layer. The encapsulation layer 220 may protect the pixel PX from moisture and oxygen. In addition, the encapsulation layer 220 may protect the pixel PX from foreign matter such as dust particles.

[0053] The pixels PX arranged along the first direction DR1 among the plurality of pixels PX may form a pixel row, and the pixels PX arranged along the second direction DR2 among the plurality of pixels PX may form a pixel column. Each of the plurality of pixels PX may include a plurality of sub-pixels. In an embodiment, for example, each of the plurality of pixels PX may include a first sub-pixel emitting red light, a second sub-pixel emitting green light, and a third sub-pixel emitting blue light.

[0054] Each of the plurality of pixels PX may include a light emitting element and a pixel circuit for driving the light emitting element. In some embodiments, the light emitting element may be provided in various forms. In an embodiment, for example, the light emitting element may be an inorganic light emitting element including an inorganic material. In some embodiments, the light emitting element may be an organic light emitting diode ("OLED").

[0055] The bending area BA may be a portion at which the display panel 200 is folded. The bending area BA may be bent to a lower portion of the bending protection layer 300. In an embodiment, for example, since the bending area BA is bent in an opposite direction to the third direction DR3, the printed circuit board PCB may be disposed to overlap the protection layer 300.

[0056] The bending area BA may include a flexible printed circuit board ("FPCB"). Therefore, the bending area BA may electrically connect the display panel 200 and the printed circuit board PCB to each other. In an embodiment, for example, the display panel 200 and the printed circuit board PCB may exchange driving signals through the FPCB. The driving signal may be various signals (including driving voltage, gate signal, data signal, etc.) for driving the display device 1000.

[0057] The printed circuit board PCB may output a signal to the display panel 200 through the bending area BA, or receive a signal from the display panel 200 through the bending area BA. Since the bending area BA is bent, the printed circuit board PCB may be disposed on the bottom surface of the protective layer 300 in a state where the printed circuit board PCB is coupled to the protective layer 300. The printed circuit board PCB may include a connector for receiving a signal transmitted from the outside.

[0058] In some embodiments, the display device 1000 may further include a touch panel. The touch panel may be disposed between the window member 100 and the display panel 200. However, the present disclosure is not limited thereto. In some embodiments, the touch panel may be disposed inside the display panel 200. The touch panel may operate in a resistive, capacitive, or electromagnetic manner, and obtain coordinate information of a point at which a touch event occurs.

[0059] The protective layer 300 may be disposed on the rear surface of the display panel 200. The protective layer 300 may be disposed between the display panel 200 and the printed circuit board PCB in a state in which the protective layer 300 is coupled to the display panel 200 and the printed circuit board PCB.

[0060] The bracket 400 may support the display panel 200 and the protective layer 300. One surface of the bracket 400 may be attached to the protective layer 300, and a space where electronic components are to be disposed (eg, mounted) may be provided at the reverse surface of the bracket 400.

[0061] The back case 500 may accommodate the display panel 200 and the protective layer 300, and be coupled to the window member 100. The back case 500 may include plastic or metal. In an embodiment of the present disclosure, the back case 500 may be omitted.

[0062] Figure 3 It is shown Figure 2An exploded perspective view of an embodiment of a protective layer is shown in FIG.

[0063] refer to Figure 3 , the protective layer 300 may include a light blocking layer 310 , a heat dissipation layer 320 and a shielding layer 330 .

[0064] The light blocking layer 310 may block light incident on the display panel 200 (refer to Figure 2 In an embodiment, for example, a light blocking layer 310 may be disposed on the rear surface of the display panel 200 to block light incident into the display panel 200 in the third direction DR3 and / or in an opposite direction to the third direction DR3.

[0065] In some embodiments, the light blocking layer 310 may be adhered to the display panel 200. In embodiments, for example, the adhesive layer of the light blocking layer 310 may allow the light blocking layer 310 to be tightly adhered to the rear surface of the display panel 200. In some embodiments, the adhesive layer may include an optically clear adhesive ("OCA") or an optically clear resin ("OCR").

[0066] The surface of the light blocking layer 310 may have a predetermined pattern. In an embodiment, the surface of the light blocking layer 310 may be embossed with a predetermined pattern, and thus, for example, when the display panel 200 and the light blocking layer 310 are closely adhered to each other, the possibility that bubbles will appear between the display panel 200 and the light blocking layer 310 can be reduced.

[0067] The light blocking layer 310 may include a resin layer including polyethylene terephthalate ("PET") or the like, and a light blocking layer disposed on a rear surface of the resin layer. The light blocking layer may be a coating layer including a black tape or a light blocking material.

[0068] In some embodiments, the light blocking layer 310 may further include a buffer member. Therefore, the light blocking layer 310 may be dispersedly applied to the display panel 200 and the window member 100 (refer to Figure 2 In an embodiment, for example, the buffer member may absorb a portion of the impact applied to the display panel 200 and the window member 100, so that damage of the display panel 200 and the window member 100 may be prevented.

[0069] The buffer member may include or consist of a polymer resin material. In an embodiment, the buffer member may include or consist of polyurethane, polycarbonate, polypropylene or polyethylene. In addition, the buffer member may include or consist of a sponge, a urethane-based material or an acrylic-based material formed by foaming a rubber solution.

[0070] The heat dissipation layer 320 may be disposed on the rear surface of the light blocking layer 310. In an embodiment, for example, the heat dissipation layer 320 may be disposed between the light blocking layer 310 and the shielding layer 330.

[0071] The heat dissipation layer 320 may include a material having a relatively high thermal conductivity. Therefore, the heat generated in the display panel 200 may be effectively radiated. In an embodiment, for example, the heat dissipation layer 320 may absorb the heat generated in the display panel 200, thereby radiating the absorbed heat through a relatively high thermal conductivity.

[0072] The heat dissipation layer 320 may include graphite. Graphite may be a plate-like structure in which carbon atoms are connected to each other in a horizontal direction. Therefore, the heat dissipation layer 320 may have a higher thermal conductivity in a horizontal direction than in a vertical direction, and has an excellent heat dissipation effect.

[0073] The shielding layer 330 may be disposed on the rear surface of the heat dissipation layer 320. In an embodiment, for example, the front surface FS of the shielding layer 330 and the rear surface of the heat dissipation layer 320 may contact each other.

[0074] The back surface BS of the shielding layer 330 may be opposite to the front surface FS of the shielding layer 330. In an embodiment, for example, the back surface BS of the shielding layer 330 may be opposite to the front surface FS of the shielding layer 330 in the third direction DR3. The back surface BS of the shielding layer 330 may be opposite to the printed circuit board PCB (refer to Figure 2 In an embodiment, for example, one surface of the printed circuit board PCB may be in contact with the back surface BS of the shielding layer 330 .

[0075] The shielding layer 330 may include at least one metal among various metals including aluminum (Al), copper (Cu), silver (Ag), magnesium (Mg), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), titanium (Ti), or molybdenum (Mo), or an alloy including the at least one metal, and may be formed as a multilayer or a single layer including the corresponding material. In addition, the shielding layer 330 may include a conductive oxide such as indium tin oxide ("ITO"), indium zinc oxide ("IZO"), indium tin zinc oxide ("ITZO"), zinc oxide (ZnO), aluminum-doped zinc oxide ("AZO"), gallium-doped zinc oxide ("GZO"), zinc tin oxide ("ZTO"), gallium tin oxide ("GTO"), or fluorine-doped tin oxide ("FTO"), or at least one conductive material among conductive polymers such as poly (3,4-ethylenedioxythiophene) ("PEDOT") .

[0076] The shielding layer 330 can reduce the thickness of the display panel 200 and / or the printed circuit board PCB (refer to Figure 2 ). In an embodiment, the shielding layer 330 may absorb electromagnetic waves leaked from the display panel 200 and / or the printed circuit board PCB. The electromagnetic waves absorbed in the shielding layer 330 may be converted into electrical energy and magnetic energy, and the shielding layer 330 may weaken the intensity of electromagnetic waves formed in the display panel 200 and / or the printed circuit board PCB. Therefore, the shielding layer 330 prevents the electromagnetic waves formed in the display panel 200 and / or the printed circuit board PCB from leaking to the circuit included in the display device 1000, thereby improving the reliability of the display device 1000 when the display device 1000 is driven.

[0077] In addition, the shielding layer 330 may contact the ground surface of the printed circuit board PCB, thereby reducing the intensity of electromagnetic waves formed in the printed circuit board PCB. Figure 4 and Figure 5 Detailed description.

[0078] Figure 4 It is shown Figure 2 A plan view of an embodiment of a masking layer and a printed circuit board before the bending area is bent is shown in FIG. Figure 5 It is shown Figure 2 A plan view of an embodiment of a shielding layer and a printed circuit board after bending of the bending area shown in FIG. Figure 6 It is shown in Figure 5 is a plan view of a comparative example in which the printed circuit board shown in FIG. 1 is not successfully aligned on the masking layer.

[0079] refer to Figure 4 and Figure 5 , the printed circuit board PCB may include a ground area GA. In addition, the shielding layer 330 may include a contact area CA. In an embodiment, for example, the shielding layer 330 may include a contact area CA disposed at a lower end portion of the back surface BS of the shielding layer 330.

[0080] The printed circuit board PCB may include a front surface PCB_FS and a back surface PCB_BS of the printed circuit board PCB. In an embodiment, for example, the printed circuit board PCB may include a ground area GA and include a back surface PCB_BS of the printed circuit board PCB contacting the shielding layer 330 .

[0081] The rear surface PCB_BS of the printed circuit board PCB may be a ground surface. In an embodiment, for example, the printed circuit board PCB may be configured in multiple layers, and the rear surface PCB_BS of the printed circuit board PCB may be a ground surface disposed at the lowermost end.

[0082] The printed circuit board PCB may be disposed to overlap with the contact area CA of the shielding layer 330. In an embodiment, since the bending area BA is bent in the opposite direction of the third direction DR3, the printed circuit board PCB may be disposed to overlap with the back surface BS of the shielding layer 330 in a plan view. The contact area CA may be an area in contact with the back surface BS of the shielding layer 330.

[0083] The ground area GA may be disposed on the back surface PCB_BS of the printed circuit board PCB. In an embodiment, for example, the ground area GA may be disposed at one side of the back surface PCB_BS of the printed circuit board PCB.

[0084] The contact area CA may be covered by the printed circuit board PCB. In an embodiment, for example, the contact area CA may contact the back surface PCB_BS of the printed circuit board PCB and be covered by the printed circuit board PCB in a plan view.

[0085] In some embodiments, the contact area CA may correspond to the printed circuit board PCB. In an embodiment, for example, the shape and size of the contact area CA may correspond to the shape and size of the printed circuit board PCB. Figure 4 3 shows a case where the contact area CA has a rectangular shape, but the present disclosure is not limited thereto, and the contact area CA may have a shape corresponding to the shape of the printed circuit board PCB.

[0086] The shielding layer 330 may include a conductive member CM. The conductive member CM may be disposed in the contact area CA. In an embodiment, for example, the conductive member CM may be disposed in the first direction DR1 on the back surface BS of the shielding layer 330 .

[0087] The conductive member CM may include a first conductive member CM1, a second conductive member CM2, a third conductive member CM3, and a fourth conductive member CM4. In an embodiment, for example, the conductive member CM may include a first conductive member CM1, a second conductive member CM2, a third conductive member CM3, and a fourth conductive member CM4, each of which includes two or more conductive units. Figure 4 , it is shown that two conductive units included in each of the first conductive member CM1, the second conductive member CM2, the third conductive member CM3, and the fourth conductive member CM4 are provided. However, the present disclosure is not limited thereto.

[0088] The plurality of conductive members CM may each be in contact with the ground area GA. In an embodiment, for example, when the back surface PCB_BS of the printed circuit board PCB overlaps with the back surface BS of the shielding layer 330 due to bending of the bending area BA, the first conductive member CM1, the second conductive member CM2, the third conductive member CM3, and the fourth conductive member CM4 disposed on the back surface PCB_BS of the printed circuit board PCB may be in contact with the first ground area GA1, the second ground area GA2, the third ground area GA3, and the fourth ground area GA4, respectively.

[0089] The conductive member CM may transfer the electromagnetic waves absorbed in the shielding layer 330 to the printed circuit board PCB. In an embodiment, for example, the first conductive member CM1, the second conductive member CM2, the third conductive member CM3, and the fourth conductive member CM4 may contact the first ground area GA1, the second ground area GA2, the third ground area GA3, and the fourth ground area GA4, respectively, thereby transferring the electromagnetic waves absorbed by the shielding layer 330 to the back surface PCB_BS of the printed circuit board PCB.

[0090] In an embodiment of the present disclosure, the rear surface PCB_BS of the printed circuit board PCB can minimize or at least reduce the intensity of electromagnetic waves transmitted thereto. In an embodiment, for example, the rear surface PCB_BS of the printed circuit board PCB can receive electromagnetic waves transmitted from the shielding layer 330 through the grounding area GA in contact with the conductive member CM. The electromagnetic waves supplied to the rear surface PCB_BS of the printed circuit board PCB can be absorbed in the rear surface PCB_BS of the printed circuit board PCB, and the intensity of the electromagnetic waves can be reduced.

[0091] Each of the plurality of conductive members CM may be a conductive adhesive member. In an embodiment, for example, each of the plurality of conductive members CM may be an adhesive member in which conductive particles are mixed. Therefore, the conductive member CM is attached to the shielding layer 330 to electrically connect the shielding layer 330 and the printed circuit board PCB to each other. In an embodiment, for example, the conductive member CM may contact the grounding area GA of the printed circuit board PCB, thereby electrically connecting the shielding layer 330 and the printed circuit board PCB to each other.

[0092] In some embodiments, the conductive member CM may include a metal material such as gold (Au), nickel (Ni), copper (Cu) or silver (Ag), but the metal material of the conductive member CM is not limited thereto as long as the metal material electrically connects the shielding layer 330 and the printed circuit board PCB to each other.

[0093] The shielding layer 330 may include a plurality of alignment marks AM In an embodiment, for example, the shielding layer 330 may include a first alignment mark AM1, a second alignment mark AM2, a third alignment mark AM3, and a fourth alignment mark AM4.

[0094] A plurality of alignment marks AM may be disposed in the contact area CA. In an embodiment, for example, a first alignment mark AM1, a second alignment mark AM2, a third alignment mark AM3, and a fourth alignment mark AM4 may be disposed at corners of the contact area CA, respectively.

[0095] A plurality of alignment marks AM may be printed in the shielding layer 330. In an embodiment, for example, a first alignment mark AM1, a second alignment mark AM2, a third alignment mark AM3, and a fourth alignment mark AM4 may be printed at a plurality of corners of the contact area CA, respectively.

[0096] The plurality of alignment marks AM may each have a rectangular shape, but the present disclosure is not limited thereto. In an embodiment, the plurality of alignment marks AM may each have a circular shape, a triangular shape, a pentagonal shape, a rhombus shape, etc. In addition, the first alignment mark AM1, the second alignment mark AM2, the third alignment mark AM3, and the fourth alignment mark AM4 may have different shapes.

[0097] The first and fourth alignment marks AM1 and AM4 may be disposed symmetrically. In an embodiment, for example, the first and fourth alignment marks AM1 and AM4 may be disposed at one side and an opposite side of the shielding layer 330 , respectively, to be symmetrically disposed with respect to the second direction DR2 .

[0098] A distance D1 between an outer side (e.g., left side) of the first alignment mark AM1 and an outer side (e.g., right side) of the fourth alignment mark AM4 in a horizontal direction (e.g., first direction DR1) may be smaller than a length L1 of the printed circuit board PCB in a horizontal direction (e.g., first direction DR1). Therefore, both the first alignment mark AM1 and the fourth alignment mark AM4 may be covered by the printed circuit board PCB.

[0099] The first alignment mark AM1 may be disposed symmetrically with the second alignment mark AM2. In an embodiment, for example, both the first alignment mark AM1 and the second alignment mark AM2 are disposed at one side of the shielding layer 330 and may be disposed symmetrically with respect to the first direction DR1.

[0100] A distance D2 between an outer side (e.g., upper side) of the first alignment mark AM1 and an outer side (e.g., lower side) of the second alignment mark AM2 in a vertical direction (e.g., second direction DR2) may be smaller than a length L2 of the printed circuit board PCB in a vertical direction (e.g., second direction DR2). Therefore, both the first alignment mark AM1 and the second alignment mark AM2 may be covered by the printed circuit board PCB.

[0101] refer to Figures 4 to 6 , multiple alignment marks AM can be used to check whether the ground area GA of the printed circuit board PCB has been successfully aligned with respect to the conductive member CM. Therefore, the printed circuit board PCB can be aligned based on multiple alignment marks AM. In an embodiment, for example, the printed circuit board PCB can be aligned to cover the first alignment mark AM1, the second alignment mark AM2, the third alignment mark AM3 and the fourth alignment mark AM4. When the first alignment mark AM1, the second alignment mark AM2, the third alignment mark AM3 and the fourth alignment mark AM4 are all covered by the printed circuit board PCB, the first conductive member CM1, the second conductive member CM2, the third conductive member CM3 and the fourth conductive member CM4 can be successfully contacted with the first ground area GA1, the second ground area GA2, the third ground area GA3 and the fourth ground area GA4 respectively.

[0102] like Figure 6 As shown in , when a portion of the first alignment mark AM1 and a portion of the second alignment mark AM2 are not covered by the printed circuit board PCB, at least some of the plurality of conductive members CM may not contact the ground area GA. Therefore, at least a portion of the electromagnetic wave absorbed by the shielding layer 330 may not be transferred to the back surface PCB_BS of the printed circuit board PCB.

[0103] In an embodiment of the present disclosure, it is possible to check whether the conductive member CM has successfully contacted the grounding area GA through a plurality of alignment marks AM. In an embodiment, when the first alignment mark AM1, the second alignment mark AM2, the third alignment mark AM3, and the fourth alignment mark AM4 are all covered by the printed circuit board PCB and are not exposed to the outside, it is possible to visually check whether the first conductive member CM1, the second conductive member CM2, the third conductive member CM3, and the fourth conductive member CM4 have successfully contacted the first grounding area GA1, the second grounding area GA2, the third grounding area GA3, and the fourth grounding area GA4, respectively. Therefore, it is possible to check whether the conductive member CM has successfully contacted the grounding area GA1, the second grounding area GA2, the third grounding area GA3, and the fourth grounding area GA4 without driving the display device 1000 (reference Figure 1 ) or without performing any separate process, it is checked whether the electromagnetic waves absorbed in the shielding layer have been transferred to the back surface PCB_BS of the printed circuit board PCB, and the reliability of the manufacturing process of the display device 1000 can be improved.

[0104] However, the present disclosure is not limited to the alignment method. In an embodiment, for example, the printed circuit board PCB does not cover the alignment mark AM, but may be aligned to be accurately disposed (eg, mounted) in a frame defined by the alignment mark AM.

[0105] Figure 7 is a flowchart illustrating an embodiment of a method for manufacturing a display device according to the present disclosure.

[0106] refer to Figure 7 , the display device 1000 in the embodiment of the present disclosure (refer to Figure 1 ) may include operation S710 of preparing a display panel including a bending area, operation S720 of setting a shielding layer including a plurality of alignment marks at a lower end of the display panel, and operation S730 of bending the bending area and setting a printed circuit board to be aligned on the shielding layer based on the alignment marks.

[0107] refer to Figure 2 and Figure 7 In operation S710, a display panel 200 including a bending area BA may be prepared. The bending area BA may electrically connect the display panel 200 and the printed circuit board PCB to each other. Therefore, the bending area BA may include a connector through which the display panel 200 and the printed circuit board PCB are connected to each other.

[0108] refer to Figure 2 , Figure 4 and Figure 7 In operation S720, a shielding layer 330 including a plurality of alignment marks AM may be disposed at a lower end of the display panel 200. The shielding layer 330 may be disposed at a lower end of the display panel 200 to overlap with the display panel 200.

[0109] refer to Figure 4 , Figure 5 and Figure 7 In operation S730, the bending area BA may be bent, and the printed circuit board PCB may be aligned on the shielding layer 330 based on the alignment mark AM.

[0110] The bending area BA may include a flexible printed circuit board. The bending area BA may be bent in the opposite direction of the third direction DR3. Since the bending area BA is bent in the opposite direction of the third direction DR3, the printed circuit board PCB may be disposed to overlap with the shielding layer 330.

[0111] The printed circuit board PCB may be aligned based on a plurality of alignment marks AM. In an embodiment, for example, the printed circuit board PCB may be aligned based on whether the back surface PCB_BS of the printed circuit board PCB covers all of the first alignment mark AM1, the second alignment mark AM2, the third alignment mark AM3, and the fourth alignment mark AM4.

[0112] The ground area GA of the printed circuit board PCB may contact the conductive member CM. In an embodiment, for example, the first ground area GA1, the second ground area GA2, the third ground area GA3, and the fourth ground area GA4 of the successfully aligned printed circuit board PCB may contact the first conductive member CM1, the second conductive member CM2, the third conductive member CM3, and the fourth conductive member CM4 while corresponding to the first conductive member CM1, the second conductive member CM2, the third conductive member CM3, and the fourth conductive member CM4, respectively.

[0113] Figure 8 is a flowchart illustrating a method for manufacturing a display device according to the present disclosure. Fig. 9 It is shown Figure 8 1 is a plan view of an embodiment of a shielding layer and a printed circuit board cover in operation S840 shown in FIG.

[0114] refer to Figure 8 According to the display device 1000 (refer to Figure 1 ) may include an operation S810 of preparing a display panel including a bending area, an operation S820 of setting a shielding layer including a plurality of alignment marks at a lower end of the display panel, an operation S830 of bending the bending area and setting a printed circuit board to be aligned on the shielding layer based on the alignment mark, and an operation S840 of setting a printed circuit board cover on the printed circuit board.

[0115] Figure 8 Operations S810, S820, and S830 shown in FIG. Figure 7 Operations S710, S720, and S730 shown in FIG. 7 are identically described, and thus, repeated descriptions will be omitted hereinafter.

[0116] refer to Figures 8 to 9 , in operation S840, a printed circuit board cover CV may be disposed on the printed circuit board PCB.

[0117] The printed circuit board cover CV can cover the printed circuit board PCB (refer to Figure 4 ). In an embodiment, for example, a printed circuit board cover CV may be disposed on the contact area CA and cover the printed circuit board PCB.

[0118] The printed circuit board cover CV may have a shape substantially the same as that of the printed circuit board PCB. In an embodiment, for example, the printed circuit board cover CV may have a rectangular shape. However, the shape of the printed circuit board cover CV is not limited thereto as long as the printed circuit board cover CV can cover the printed circuit board PCB.

[0119] In this operation, the corners of the printed circuit board cover CV and the corners of the printed circuit board PCB may be cut. In an embodiment, the corners of the printed circuit board cover CV and the corners of the printed circuit board PCB may be cut so that the first alignment mark AM1, the second alignment mark AM2, the third alignment mark AM3, and the fourth alignment mark AM4 are exposed.

[0120] In an embodiment of the present disclosure, it is possible to check whether the printed circuit board PCB has been successfully aligned through the exposed alignment mark AM. In an embodiment, it is possible to check whether the printed circuit board PCB has been successfully aligned relative to the contact area CA in the transverse direction (e.g., the first direction DR1) based on whether the first alignment mark AM1 and the fourth alignment mark AM4 are symmetrically arranged relative to the second direction DR2. In addition, it is possible to check whether the printed circuit board PCB has been successfully aligned relative to the contact area CA in the longitudinal direction (e.g., the second direction DR2) based on whether the first alignment mark AM1 and the second alignment mark AM2 are symmetrically arranged relative to the first direction DR1. Therefore, it is possible to check whether the printed circuit board PCB has been successfully aligned, and the display device 1000 (reference) can be improved. Figure 1 )’s manufacturing process reliability.

[0121] According to the present disclosure, a display device and a method for manufacturing the display device may be provided, wherein a printed circuit board is aligned on a shielding layer using an alignment mark, thereby improving reliability of a manufacturing process.

[0122] Embodiments have been disclosed herein, and although predetermined terms are used, these terms are used and interpreted only in a general and descriptive sense and not for limiting purposes. In some cases, unless otherwise specifically noted, as will be apparent to one of ordinary skill in the art at the time of filing this application, features, characteristics, and / or elements associated with a particular embodiment may be used alone or in any combination with features, characteristics, and / or elements described in conjunction with other embodiments. Therefore, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the present disclosure as set forth in the appended claims.

Claims

1. A display device, wherein: The display device comprises: Display panel; A shielding layer is arranged at the lower end of the display panel, and the shielding layer includes: a plurality of alignment marks; and a conductive member; and a printed circuit board aligned on the shielding layer based on the plurality of alignment marks, the printed circuit board being in contact with at least a portion of the shielding layer, The conductive member electrically connects the printed circuit board and the shielding layer to each other.

2. The display device according to claim 1, wherein: The printed circuit board overlaps at least a portion of the contact area of ​​the shielding layer, and Wherein, the plurality of alignment marks are arranged in the contact area.

3. The display device according to claim 2, wherein: At least one of the plurality of alignment marks overlaps the printed circuit board.

4. The display device according to claim 2, wherein: The display device further includes a printed circuit board cover covering the printed circuit board, The corners of the printed circuit board and the printed circuit board cover are cut so that the plurality of alignment marks are exposed.

5. The display device according to claim 1, wherein: The plurality of alignment marks include a first alignment mark disposed at one side of the shielding layer, and a second alignment mark disposed at an opposite side of the shielding layer and symmetrically disposed to the first alignment mark.

6. The display device according to claim 5, wherein: A distance between an outer side of the first alignment mark and an outer side of the second alignment mark in a predetermined direction perpendicular to a direction in which the shielding layer and the printed circuit board are arranged is smaller than a length of the printed circuit board in the predetermined direction.

7. The display device according to claim 5, wherein: A distance between an outer side of the first alignment mark and an outer side of the second alignment mark in a predetermined direction in which the shielding layer and the printed circuit board are arranged is smaller than a length of the printed circuit board in the predetermined direction.

8. The display device according to claim 1, wherein: The shielding layer includes at least one of aluminum and copper.

9. The display device according to claim 1, wherein: The plurality of alignment marks are printed in the masking layer.

10. A method for manufacturing a display device, wherein: The method comprises: preparing a display panel including a curved region; disposing a shielding layer including a plurality of alignment marks at a lower end of the display panel; and bending the bending area and aligning the printed circuit board on the shielding layer based on the plurality of alignment marks, Wherein, the shielding layer further includes a conductive member electrically connecting the printed circuit board and the shielding layer to each other.

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