Display device

Abstract

A display device is provided, comprising: a display panel; a cover window covering one surface of the display panel; and a first adhesive member between the display panel and the cover window, wherein a surface inclination angle of the first adhesive member is at least about 15 degrees and at most about 40 degrees.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0131928 filed in the Korean Intellectual Property Office on October 4, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] One or more embodiments of the present disclosure relate to a display device and a method of manufacturing the display device, and, for example, to a display device in which the area of ​​a dead zone is reduced and a method of manufacturing the display device. Background Art

[0004] Recently, display devices have been utilized in various ways. In addition, display devices have become thinner and lighter, and thus, the scope of use of display devices has expanded. As the use of display devices has been diversified, one or more suitable methods have been studied to design the form of the display devices.

[0005] In a display device, a cover window for protecting a lower structure is positioned on a display panel, and the cover window is attached to the display panel using an optically transparent adhesive. The optically transparent adhesive is expected or required to have excellent or suitable moisture resistance, heat resistance and / or adhesion as well as basic or suitable optical properties.

[0006] The optically transparent adhesive may be applied in a liquid state and hardened, and thus an inclined portion may be formed (or provided) on the periphery of the display panel. Due to the inclined portion, the peripheral area of ​​the display panel may require a larger area.

[0007] The above information disclosed in this Background section is only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not constitute prior art. Summary of the invention

[0008] Aspects of one or more embodiments of the present disclosure include a display device including a bonding member having an improved tilt angle to reduce an area of ​​a dead zone and a method of manufacturing the display device.

[0009] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments of the disclosure.

[0010] According to one or more embodiments of the present disclosure, a display device includes a display panel, a cover window covering one surface of the display panel, and a first adhesive member between the display panel and the cover window, wherein a surface inclination angle of the first adhesive member is at least about 15 degrees and at most (e.g., less than) about 40 degrees.

[0011] In one or more embodiments, the first bonding member may include a hydrophobic material.

[0012] In one or more embodiments, the first bonding member may include butyl acrylate or perfluoroethyl acrylate.

[0013] In one or more embodiments, the butyl acrylate may be present in an amount (eg, range) from about 20 wt % to about 65 wt %.

[0014] In one or more embodiments, the content (eg, amount) of perfluoroethyl acrylate may be about 5 wt % to about 35 wt %.

[0015] In one or more embodiments, the first adhesive member may be in a display region and a peripheral region of the display panel, and the peripheral region may be around (eg, surround) the display region.

[0016] In one or more embodiments, the first adhesive member may include an inclined portion inclined with respect to the display panel in the peripheral region, and a width of the inclined portion of the first adhesive member may be about 1.19 times to about 3.73 times a thickness of the first adhesive member.

[0017] In one or more embodiments, the display device may further include a second adhesive member on the periphery of the first adhesive member.

[0018] In one or more embodiments, the second bonding member may include the same material as that of the first bonding member.

[0019] In one or more embodiments, the second bonding member may include a different material from the first bonding member.

[0020] In one or more embodiments, a surface inclination angle of the second bonding member may be greater than a surface inclination angle of the first bonding member.

[0021] In one or more embodiments, the first bonding member and the second bonding member may each include butyl acrylate or perfluoroethyl acrylate, wherein the content (eg, amount) of butyl acrylate in the second bonding member may be less than the content (eg, amount) of butyl acrylate in the first bonding member.

[0022] In one or more embodiments, the first bonding member and the second bonding member may each include butyl acrylate or perfluoroethyl acrylate, wherein the content (e.g., amount) of perfluoroethyl acrylate in the second bonding member may be greater than the content (e.g., amount) of perfluoroethyl acrylate in the first bonding member.

[0023] In one or more embodiments, the display device may further include a hydrophobic coating between the first bonding member and the second bonding member.

[0024] According to one or more embodiments of the present disclosure, a method for manufacturing a display device includes: preparing a display panel; arranging a first adhesive member in a display area and a peripheral area of ​​the display panel; and attaching a cover window to the display panel by arranging the cover window on the first adhesive member, wherein a surface inclination angle of the first adhesive member is at least about 15 degrees and at most about 40 degrees.

[0025] In one or more embodiments, the first bonding member may include butyl acrylate or perfluoroethyl acrylate.

[0026] In one or more embodiments, the butyl acrylate may be present in an amount (eg, range) from about 20 wt % to about 65 wt %.

[0027] In one or more embodiments, the content (eg, amount) of perfluoroethyl acrylate may be about 5 wt % to about 35 wt %.

[0028] In one or more embodiments, the method may further include coating a periphery of the first bonding member with a hydrophobic material.

[0029] In one or more embodiments, the method may further include coating a hydrophobic material between the first bonding member and the second bonding member. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other aspects, features and / or principles of certain embodiments of the present disclosure will become more apparent through the following description in conjunction with the accompanying drawings, in which:

[0031] Figure 1 is a schematic plan view of a display device according to one or more embodiments of the present disclosure;

[0032] Figure 2 According to one or more embodiments of the present disclosure, it may include Figure 1 A schematic plan view of a display panel in a display device;

[0033] Figure 3 is an equivalent circuit diagram of a pixel circuit configured to drive a pixel according to one or more embodiments;

[0034] Figure 4 According to one or more embodiments of the present disclosure, Figure 2 A schematic cross-sectional view of the display panel taken along line IV-IV';

[0035] Figure 5 According to one or more embodiments of the present disclosure, Figure 1 A schematic cross-sectional view of the display device taken along line V-V';

[0036] Figure 6 is a table for comparing detailed components of first bonding members according to Embodiments 1 to 3 and Comparative Example;

[0037] Figure 7 and Figure 8 Each is according to an embodiment of the present disclosure along Figure 1 A schematic cross-sectional view of the display device taken along line V-V', and Figure 5 Similar; and

[0038] Figures 9 to 14 is a schematic diagram of a method of manufacturing a display device according to one or more embodiments of the present disclosure. DETAILED DESCRIPTION

[0039] The present disclosure can be modified in many alternative forms, and therefore specific embodiments will be shown in the drawings and described in more detail. However, it should be understood that this is not intended to limit the present disclosure to the particular form disclosed, but is intended to cover all modifications, equivalents and substitutions falling within the spirit and scope of the present disclosure.

[0040] Reference will now be made in more detail to one or more embodiments, examples of which are shown in the accompanying drawings, wherein the same reference numerals always refer to the same elements, and a repeated description thereof may not be provided. Instead, these embodiments are provided as examples so that the disclosure will be thorough and complete, and will fully convey the aspects and features of the disclosure to those skilled in the art. Therefore, processes, elements, and techniques that are not necessary for a person of ordinary skill in the art to fully understand the aspects and features of the disclosure may not be described.

[0041] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Unless otherwise clearly stated in the present disclosure, expressions such as "at least one of...", "a plurality of", "one of..." and other prepositional phrases, when following an element of a list, should be understood to include disjunctions if written as conjunction lists, and vice versa. For example, the expressions "at least one of a, b or c", "a, b and / or c", "one selected from the group consisting of a, b and c", "at least one selected from a, b and c", "at least one from a, b and c", "one from a, b and c", "at least one from a to c" indicate only a, only b, only c, both a and b, both a and c, both b and c, all of a, b and c, or variations thereof.

[0042] Since the present description allows for one or more suitable changes and numerous embodiments, specific embodiments will be shown in the drawings and described in the written description. From the following detailed description of one or more embodiments in conjunction with the drawings, aspects and features of one or more embodiments and methods of implementing the same will become apparent. However, the present embodiment may have different forms and should not be construed as being limited to the description set forth herein.

[0043] One or more embodiments will be described in more detail with reference to the accompanying drawings. Elements that may be independently identical or correspond to each other are given the same reference numerals regardless of the figure numbers, and redundant descriptions thereof are omitted.

[0044] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the spirit and scope of the present disclosure, the first element, first component, first region, first layer or first part described below may be referred to as a second element, second component, second region, second layer or second part.

[0045] As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0046] It will be further understood that when used in this specification, the terms "comprising", "including", "including", "having", "having" specify the presence of stated features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups thereof.

[0047] It will be understood that when an element, such as a layer, film, region, or substrate, is referred to as being "on" or "connected to" another element, it can be directly on or directly connected to the other element, or there can be one or more intervening elements. For example, if layers, regions, or elements are referred to as being electrically connected to each other (e.g., when layers, regions, or elements are referred to as being electrically connected to each other), they can be directly electrically connected to each other and / or can be indirectly electrically connected to each other with intervening layers, regions, or elements therebetween. Furthermore, it will be understood that when an element is referred to as being "between" two elements, it can be the only element between the two elements, or there can also be one or more intervening elements.

[0048] For ease of explanation, spatially relative terms such as "below", "down", "beneath", "above", "on", etc. may be used herein to describe the relationship between one element or feature and another (some) element or feature as shown in the drawings. It will be understood that in addition to the orientation depicted in the drawings, the spatially relative terms are intended to include different orientations of the device in use or in operation. For example, if the device in the drawings is flipped, the elements described as being "below" or "below" or "below" other elements or features will then be oriented "above" the other elements or features. Therefore, the exemplary terms "below" and "below" can include both above and below orientations. The device can be oriented otherwise (e.g., rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0049] For convenience of explanation, the size of the elements in the drawings may be exaggerated or reduced. For example, since the size and thickness of the elements in the drawings are shown (eg, arbitrarily shown) for convenience of explanation, the present disclosure is not limited thereto.

[0050] When the embodiment can be implemented differently, a specific process order can be performed differently from the described order. For example, two processes described successively can be performed substantially at the same time, or in the reverse order of the described order.

[0051] As used herein, the expression "A and / or B" means A, B, or A and B.

[0052] The x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be orthogonal to each other (e.g., vertical), or can represent different directions that are not orthogonal to each other (e.g., not vertical).

[0053] Figure 1 is a schematic plan view of a display device 1 according to one or more embodiments of the present disclosure.

[0054] refer to Figure 1 , the display device 1 may include a display area DA and a peripheral area PA outside the display area DA. A plurality of pixels PX may be arranged in the display area DA, and the display area DA may provide a specific image by light emitted from the plurality of pixels PX. The pixel PX may be defined as an emission area where a light-emitting element driven by a pixel circuit emits light. Each pixel PX may emit, for example, red light, green light, or blue light. In one or more embodiments, each pixel PX may emit red light, green light, blue light, or white light. An image may be provided by light emitted from each of the plurality of light-emitting elements through the pixel PX.

[0055] The peripheral area PA may be an area where no image is provided. The peripheral area PA may be outside the display area DA and may be completely or partially around the display area DA (e.g., completely or partially surrounding the display area DA). A driver for providing an electrical signal or power to the display area DA may be arranged in the peripheral area PA. A pad portion, which is an area that can be electrically connected to an electronic component or a printed circuit board, may be arranged in the peripheral area PA.

[0056] In the following, it is assumed that the display device 1 includes an organic light emitting diode (OLED) as a light emitting element, but the display device 1 according to the present disclosure is not limited thereto. In one or more embodiments, the display device 1 may be a light emitting display including an inorganic light emitting diode, i.e., an inorganic light emitting display. The inorganic light emitting diode may include a PN junction diode containing an inorganic semiconductor-based material. When voltage is applied to the PN junction diode in a forward direction, holes and electrons are injected, and light of a specific color may be emitted by converting the energy generated by the recombination of holes and electrons into light energy. The above-mentioned inorganic light emitting diode may have a width of several microns to hundreds of microns, and in one or more embodiments, the inorganic light emitting diode may be referred to as a micro LED. In one or more embodiments, the display device 1 may be a quantum dot light emitting display.

[0057] like Figure 1 As shown in , the display device 1 may have a quadrilateral shape in a plan view, but the present disclosure is not limited thereto. The display device 1 may have one or more suitable shapes in a plan view, for example, a polygonal shape such as a triangular shape, a circular shape, an elliptical shape, or an atypical shape. As an example, for example Figure 1 As shown in , the display device 1 may have a quadrilateral shape having a short side in a first direction (e.g., the x direction or the -x direction) and a long side in a second direction (e.g., the y direction or the -y direction). As another example, the display device 1 may have a side in the first direction and a side in the second direction having the same length. As another example, the display device 1 may have a long side in the first direction and a short side in the second direction. In one or more embodiments, the display device 1 may have rounded corners.

[0058] Figure 2 According to one or more embodiments of the present disclosure, it may include Figure 1 Schematic plan view of a display panel 10 in a display device 1 of FIG.

[0059] refer to Figure 2 , one or more suitable elements constituting the display panel 10 may be arranged on the substrate 100. The pixels PX may be arranged in the display area DA. The display area DA may be covered by an encapsulation member and protected from external air or moisture.

[0060] Pixel circuits configured to drive the pixels PX may each be electrically connected to an external circuit disposed in the peripheral area PA. The first scan driving circuit SDRV1, the second scan driving circuit SDRV2, the terminal portion PAD, the driving voltage supply line 11, and the common voltage supply line 13 may be disposed in the peripheral area PA.

[0061] The first scan drive circuit SDRV1 may be configured to apply a scan signal to each of the pixel circuits configured to drive the pixel PX through the scan line SL. The first scan drive circuit SDRV1 may be configured to apply an emission control signal to each pixel circuit through the emission control line EL. The second scan drive circuit SDRV2 may be opposite to the first scan drive circuit SDRV1 relative to the display area DA, and may be substantially parallel to the first scan drive circuit SDRV1. Some of the pixel circuits of the pixels PX of the display area DA may be electrically connected to the first scan drive circuit SDRV1, and the other pixel circuits may be electrically connected to the second scan drive circuit SDRV2.

[0062] The terminal portion PAD may be disposed at one side of the substrate 100. The terminal portion PAD may not be covered by the insulating layer but may be exposed and connected to the display circuit board 15. The display driver 17 may be disposed on the display circuit board 15.

[0063] The display driver 17 may generate control signals transmitted to the first and second scan driving circuits SDRV1 and SDRV2 , and may generate data signals, and the generated data signals may be transmitted to pixel circuits of pixels PX through fan-out lines FW and data lines DL connected to the fan-out lines FW.

[0064] The display driver 17 may supply a driving voltage ELVDD (eg, see Figure 3 ), and a common voltage ELVSS may be supplied to the common voltage supply line 13 (eg, see Figure 3 ). The driving voltage ELVDD may be applied to the pixel circuit of the pixel PX through the driving voltage line PL connected to the driving voltage supply line 11, and the common voltage ELVSS may be supplied to the common voltage supply line 13 and applied to the opposite electrode of the display element of the pixel PX.

[0065] The driving voltage supply line 11 may extend in the x direction under the display area DA. The common voltage supply line 13 may have a ring shape with one side thereof opened, and thus may be around the display area DA (eg, may partially surround the display area DA).

[0066] Figure 3is an equivalent circuit diagram of a pixel circuit PC configured to drive a pixel PX according to one or more embodiments of the present disclosure.

[0067] refer to Figure 3 , the pixel circuit PC can be connected to the organic light emitting diode OLED to realize the light emission of the pixel PX. The pixel circuit PC includes a driving transistor T1, a switching transistor T2 and a storage capacitor Cst. The switching transistor T2 can be connected to the scan line SL and the data line DL, and can be configured to transmit the data signal Dm input through the data line DL to the driving transistor T1 according to the scan signal Sn input through the scan line SL.

[0068] The storage capacitor Cst may be connected to the switching transistor T2 and the driving voltage line PL, and may store a voltage corresponding to a difference between a voltage received from the switching transistor T2 and a driving voltage ELVDD supplied to the driving voltage line PL.

[0069] The driving transistor T1 may be connected to the driving voltage line PL and the storage capacitor Cst and may be configured to control a driving current flowing from the driving voltage line PL into the organic light emitting diode OLED to correspond to a voltage stored in the storage capacitor Cst. The organic light emitting diode OLED may emit light with a specific brightness according to the driving current.

[0070] although Figure 3 A case where the pixel circuit PC includes two transistors and one storage capacitor is shown, but the present disclosure is not limited thereto.

[0071] Figure 4 is a schematic cross-sectional view of a display panel 10 according to one or more embodiments of the present disclosure. More specifically, Figure 4 According to one or more embodiments of the present disclosure Figure 2 1 corresponds to a cross-sectional view of the display panel 10 taken along line IV-IV', and only the display panel 10 is shown. Figure 4 The stacking structure of the display panel 10 is briefly described.

[0072] refer to Figure 4 , the display panel 10 may include a substrate 100 , a buffer layer 111 , a pixel circuit layer PCL, a display element layer DEL, and an encapsulation layer 300 .

[0073] The substrate 100 may include glass, or may include a polymer resin such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, and / or cellulose acetate propionate. The substrate 100 including the polymer resin may be flexible, rollable, and / or bendable. The substrate 100 may have a multilayer structure including a base layer and a barrier layer, the base layer including the above-mentioned polymer resin.

[0074] The buffer layer 111 may include an inorganic insulating material such as silicon nitride, silicon oxynitride, and / or silicon oxide, and may have a single-layer structure or a multi-layer structure including the above-mentioned inorganic insulating material.

[0075] The pixel circuit layer PCL may be disposed on the buffer layer 111. The pixel circuit layer PCL may include a transistor TFT included in the pixel circuit and an inorganic insulating layer IIL disposed below and / or above the elements of the transistor TFT, a first planarization layer 115, and a second planarization layer 116. The inorganic insulating layer IIL may include a first gate insulating layer 112, a second gate insulating layer 113, and an interlayer insulating layer 114.

[0076] The transistor TFT may include a semiconductor layer A, and the semiconductor layer A may include polycrystalline silicon. In one or more embodiments, the semiconductor layer A may include amorphous silicon, an oxide semiconductor and / or an organic semiconductor. The semiconductor layer A may include a channel region and a drain region and a source region respectively arranged on both sides (e.g., opposite sides) of the channel region. The gate electrode G may overlap the channel region.

[0077] The gate electrode G may include a low resistance metal material. The gate electrode G may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), and / or the like, and may have a multilayer structure or a single layer structure including the above materials.

[0078] The first gate insulating layer 112 between the semiconductor layer A and the gate electrode G may include silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO x ) inorganic insulating material. Zinc oxide (ZnO x ) can be zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ).

[0079] The second gate insulating layer 113 may cover the gate electrode G. Similar to the first gate insulating layer 112, the second gate insulating layer 113 may include silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO x ) inorganic insulating material. Zinc oxide (ZnO x ) can be zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ).

[0080] The upper electrode CE2 of the storage capacitor Cst may be arranged on the second gate insulating layer 113. The upper electrode CE2 may overlap with the gate electrode G arranged below the upper electrode CE2. In this regard, the gate electrode G and the upper electrode CE2 overlapping each other with the second gate insulating layer 113 therebetween may constitute a storage capacitor Cst of the pixel circuit. For example, the gate electrode G may serve as the lower electrode CE1 of the storage capacitor Cst. As described above, the storage capacitor Cst and the transistor TFT may overlap with each other. In one or more embodiments, the storage capacitor Cst may not overlap with the transistor TFT.

[0081] The upper electrode CE2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may have a single-layer structure or a multi-layer structure including the above materials.

[0082] The interlayer insulating layer 114 may cover the upper electrode CE2. The interlayer insulating layer 114 may include silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) and / or zinc oxide (ZnO x ) inorganic insulating material. Zinc oxide (ZnO x) can be zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ). The interlayer insulating layer 114 may have a single layer structure or a multilayer structure including the above-mentioned inorganic insulating material.

[0083] The drain electrode D and the source electrode S may each be on the interlayer insulating layer 114. The drain electrode D and the source electrode S may each include a highly conductive material. The drain electrode D and the source electrode S may each include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti) and / or the like, and may have a multilayer structure or a single layer structure including the above materials. In one or more embodiments, the drain electrode D and the source electrode S may each have a multilayer structure of titanium (Ti) / aluminum (Al) / titanium (Ti).

[0084] The first planarization layer 115 may cover the drain electrode D and the source electrode S. The first planarization layer 115 may include an organic insulating layer. The first planarization layer 115 may include an organic insulating material, such as a general commercial polymer such as polymethyl methacrylate (PMMA) and / or polystyrene (PS), a polymer derivative having a phenol-based group, an acrylic acid-based polymer, an imide-based polymer, an aromatic ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, and / or any suitable blend thereof.

[0085] The connection electrode CML may be arranged on the first planarization layer 115. In this regard, the connection electrode CML may be connected to the drain electrode D or the source electrode S through a contact hole in the first planarization layer 115. The connection electrode CML may include a highly conductive material. The connection electrode CML may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), and / or the like, and may have a multilayer structure or a single layer structure including the above materials. In one or more embodiments, the connection electrode CML may have a multilayer structure of titanium (Ti) / aluminum (Al) / titanium (Ti).

[0086] The second planarization layer 116 may cover the connection electrode CML. The second planarization layer 116 may include an organic insulating layer. The second planarization layer 116 may include an organic insulating material, such as a general commercial polymer such as polymethyl methacrylate (PMMA) and / or polystyrene (PS), a polymer derivative having a phenol-based group, an acrylic acid-based polymer, an imide-based polymer, an aromatic ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, and / or any suitable blend thereof.

[0087] The display element layer DEL may be disposed on the pixel circuit layer PCL. The display element layer DEL may include a display element DE. The display element DE may be an organic light emitting diode (OLED). The pixel electrode 211 of the display element DE may be electrically connected to the connection electrode CML through a contact hole in the second planarization layer 116.

[0088] The pixel electrode 211 may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), indium gallium oxide (IGO) and / or aluminum zinc oxide (AZO). In one or more embodiments, the pixel electrode 211 may include a reflective layer containing silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr) and / or any suitable compound thereof. In one or more embodiments, the pixel electrode 211 may also include a conductive oxide including ITO, IZO, ZnO or In on / under the above-mentioned reflective layer. 2 O 3 layer.

[0089] A pixel defining layer 118 including an opening 118OP exposing a central portion of the pixel electrode 211 may be disposed on the pixel electrode 211. The pixel defining layer 118 may include an organic insulating material and / or an inorganic insulating material. The opening 118OP may define an emission region (hereinafter referred to as an emission region EA) of light emitted from the display element DE. For example, the width of the opening 118OP may correspond to the width of the emission region EA of the display element DE.

[0090] The spacer 119 may be disposed on the pixel defining layer 118. In the method of manufacturing the display device, the spacer 119 may be used to prevent or reduce damage to the substrate 100. The mask sheet may be used to manufacture the display panel 10. In this regard, the following defects may be prevented or reduced: the mask sheet enters the opening 118OP of the pixel defining layer 118 or is in close contact with the pixel defining layer 118, and thus if a deposition material is deposited on the substrate 100 (for example, when the deposition material is deposited on the substrate 100), a portion of the substrate 100 is damaged or destroyed by the mask sheet.

[0091] The spacer 119 may include an organic insulating material such as polyimide. In one or more embodiments, the spacer 119 may include an inorganic insulating material such as silicon nitride or silicon oxide, or may include an organic insulating material and an inorganic insulating material.

[0092] In one or more embodiments, the spacer 119 may include a different material from the pixel defining layer 118. In one or more embodiments, the spacer 119 may include the same material as the pixel defining layer 118, and in this case, the pixel defining layer 118 and the spacer 119 may be formed together in a mask process using a half-tone mask and / or the like.

[0093] The intermediate layer 212 may be disposed on the pixel defining layer 118. The intermediate layer 212 may include an emission layer 212b disposed in the opening 118OP of the pixel defining layer 118. The emission layer 212b may include a high molecular weight organic material or a low molecular weight organic material that emits light of a specific color.

[0094] The first functional layer 212a and the second functional layer 212c may be arranged under the emission layer 212b and on the emission layer 212b, respectively. The first functional layer 212a may include, for example, a hole transport layer (HTL), or include an HTL and a hole injection layer (HIL). The second functional layer 212c is an element arranged on the emission layer 212b and may be optional. The second functional layer 212c may include an electron transport layer (ETL) and / or an electron injection layer (EIL). The first functional layer 212a and / or the second functional layer 212c may be a common layer that completely covers the substrate 100, such as the relative electrode 213 described in more detail below.

[0095] The relative electrode 213 may include a conductive material having a relatively low work function. For example, the relative electrode 213 may include a (semi) transparent layer containing silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca) and / or alloys thereof. In one or more embodiments, the relative electrode 213 may also include a (semi) transparent layer such as ITO, IZO, ZnO or In on the (semi) transparent layer including the above materials. 2 O 3 layer.

[0096] In one or more embodiments, a capping layer may be further disposed on the opposite electrode 213. The capping layer may include lithium fluoride (LiF), an inorganic material, and / or an organic material.

[0097] The encapsulation layer 300 may be disposed on the opposite electrode 213. The encapsulation layer 300 may be disposed on the display element layer DEL and may cover the display element layer DEL. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer, and as an example, Figure 4 An encapsulation layer 300 including a first inorganic encapsulation layer 310 , an organic encapsulation layer 320 , and a second inorganic encapsulation layer 330 sequentially stacked on one another is shown.

[0098] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include one or more inorganic materials selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride (e.g., selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride). The organic encapsulation layer 320 may include a polymer-based material. Examples of polymer-based materials may include acrylic-based resins, epoxy-based resins, polyimides, and polyethylene. In one or more embodiments, the organic encapsulation layer 320 may include acrylates. The organic encapsulation layer 320 may be formed by curing a monomer or coating with a polymer. The organic encapsulation layer 320 may be transparent.

[0099] In one or more embodiments, the touch electrode layer may be arranged on the encapsulation layer 300, and the optical functional layer may be arranged on the touch electrode layer. The touch electrode layer may obtain coordinate information according to an external input (e.g., a touch event). The optical functional layer may reduce the reflectivity of light (e.g., external light) incident on the outside of the display device 1 and / or may improve the color purity of light emitted from the display device 1. In one or more embodiments, the optical functional layer may include a phase retarder and / or a polarizer. The phase retarder may be a film type or type or a liquid crystal coating type or type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be a film type or type or a liquid crystal coating type or type. The film type or type may include an elongated synthetic resin film, and the liquid crystal coating type or type may include liquid crystals arranged in a specific arrangement. The phase retarder and the polarizer may also include a protective film.

[0100] In one or more embodiments, the optical functional layer may include a black matrix and a color filter. The color filter may be arranged by considering the color of the light emitted from each of the pixels PX of the display device 1. Each of the color filters may include a red, green or blue pigment or dye. In one or more embodiments, in addition to the above-mentioned pigments or dyes, each of the color filters may also include quantum dots. In one or more embodiments, some of the color filters may not include (e.g., may exclude) the above-mentioned pigments or dyes, and may include scattering particles such as titanium oxide.

[0101] In one or more embodiments, the optical functional layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer respectively arranged on different layers. The first reflected light and the second reflected light respectively reflected by the first reflective layer and the second reflective layer may destructively interfere with each other, thereby reducing the reflectivity of the external light.

[0102] The adhesive member may be arranged between the touch electrode layer and the optical functional layer. As the adhesive member, any suitable adhesive layer generally available and / or generally utilized in the art may be used without limitation. The adhesive member may be a pressure sensitive adhesive (PSA).

[0103] Figure 5 is a schematic cross-sectional view of a display device 1 according to one or more embodiments of the present disclosure. More specifically, Figure 5 According to one or more embodiments of the present disclosure Figure 1 It corresponds to a cross-sectional view of the display device 1 taken along line V-V'. Figure 6 is a table for comparing detailed components of the first bonding members according to Embodiments 1 to 3 and Comparative Example.

[0104] refer to Figure 5 The display device 1 may include the above-mentioned display panel 10 and a cover window CW covering the display panel 10 .

[0105] The cover window CW may be disposed on one surface of the display panel 10 to protect the display panel 10. In one or more embodiments, the cover window CW may include sapphire, glass, or plastic. For example, the cover window CW may be ultra-thin glass or colorless polyimide.

[0106] The cover window CW may completely cover the display panel 10 in a plan view to overlap the display area DA and the peripheral area PA of the display panel 10 .

[0107] Adhesive member 500 (see Figure 7 ) may be arranged between the display panel 10 and the cover window CW. In one or more embodiments, the adhesive member 500 may include a first adhesive member 510. The first adhesive member 510 may be an adhesive material capable of attaching the cover window CW to the display panel 10. In one or more embodiments, the first adhesive member 510 may be an optically clear resin (OCR). In one or more embodiments, the first adhesive member 510 may include a hydrophobic material.

[0108] The display area DA and the peripheral area PA of the display panel 10 may be coated with the first adhesive member 510. More specifically, the first adhesive member 510 in a liquid state may be spread on the display panel 10 and hardened. In this regard, since the first adhesive member 510 is applied in a liquid state, the first adhesive member 510 may be tilted at a contact angle on the periphery of the display panel 10 (e.g., in the peripheral area PA). In one or more embodiments, after the first adhesive member 510 is applied to have a contact angle, the first adhesive member 510 may be hardened. Therefore, the first adhesive member 510 may be tilted at an inclination angle relative to the display panel 10 after hardening. For example, as the first adhesive member 510 hardens, the contact angle of the first adhesive member 510 in a liquid state relative to the lower layer of the first adhesive member 510 may become the inclination angle of the first adhesive member 510. For example, the contact angle of the first adhesive member 510 may have a value substantially the same as the inclination angle of the first adhesive member 510. In this regard, the contact angle and inclination angle of the first adhesive member 510 may be defined as angles relative to the layer below the first adhesive member 510. For example, the contact angle and the tilt angle of the first adhesive member 510 may refer to an angle at which the first adhesive member 510 is tilted relative to the display panel 10 (eg, an optical functional layer or a coating that may be disposed on the optical functional layer). In one or more embodiments, the coating may include an acrylic polymer material.

[0109] Because the first adhesive member 510 has such an inclination angle, the width of the peripheral area PA can be limited. For example, in the case where the first adhesive member 510 is applied with a thickness of 100 μm, if the inclination angle of the first adhesive member 510 is 45 degrees (for example, when the inclination angle of the first adhesive member 510 is 45 degrees), the width w1 of the inclined portion of the first adhesive member 510 may be 100 μm. In one or more embodiments, in the case where the first adhesive member 510 is applied with a thickness of 100 μm, if the inclination angle of the first adhesive member 510 is 10 degrees (for example, when the inclination angle of the first adhesive member 510 is 10 degrees), the width w1 of the inclined portion of the first adhesive member 510 may be about 568 μm.

[0110] For example, as described above, if the inclination angle of the first bonding member 510 is large (for example, when the inclination angle of the first bonding member 510 is large), the width w1 of the inclined portion of the first bonding member 510 may be small, and thus, the width of the peripheral area PA under the first bonding member 510 may be small. The peripheral area PA is a non-display area, and as the width of the peripheral area PA decreases, the dead zone may decrease, and the ratio of the area displaying an image in the display device 1 may be maximized or increased.

[0111] In one or more embodiments, the surface inclination angle θ1 of the first bonding member 510 may be at least about 15 degrees but at most about 40 degrees. In this regard, the surface inclination angle θ1 of the first bonding member 510 may be defined as an inclination angle relative to the surface of the layer below the first bonding member 510. For example, the surface inclination angle θ1 of the first bonding member 510 may refer to the first bonding member 510 relative to the display panel 10 (e.g., the encapsulation layer 300 (e.g., reference numeral 300). Figure 4 ) on the optical functional layer or the coating on the optical functional layer).

[0112] refer to Figure 6 , the bonding member according to the comparative example may include hydroxybutyl acrylate (4-HBA), ethylhexyl acrylate (2-EHA), tetrahydrofurfuryl acrylate (THF-A), and diethylene glycol mono-2-ethylhexyl acrylate (EHDG-AT).

[0113] According to one or more embodiments, based on the total wt% of the bonding member, the bonding member according to the comparative example may include at least 3wt% but less than 9wt% of hydroxybutyl acrylate (4-HBA), at least 45wt% but less than 55wt% of ethylhexyl acrylate (2-EHA), at least 10wt% but less than 20wt% of tetrahydrofurfuryl acrylate (THF-A), and at least 5wt% but less than 15wt% of diethylene glycol mono-2-ethylhexyl acrylate (EHDG-AT). It will be understood that in addition to such monomers, the bonding member may include oligomers, photoinitiators and / or the like.

[0114] The surface inclination angle of the bonding member according to the comparative example may be at least about 0 degrees but at most about 5 degrees.

[0115] According to one or more embodiments, the first adhesive member 510 may include hydroxybutyl acrylate (4-HBA), ethylhexyl acrylate (2-EHA), diethylene glycol mono-2-ethylhexyl acrylate (EHDG-AT), butyl acrylate (BA), and perfluoroethyl acrylate (PFA).

[0116] exist Figure 6In the embodiment 1 of the present invention, the first bonding member 510 may include at least about 1wt% but at most about 2wt% of hydroxybutyl acrylate (4-HBA), at least about 5wt% but at most about 10wt% of ethylhexyl acrylate (2-EHA), at least about 1wt% but at most about 2wt% of diethylene glycol mono-2-ethylhexyl acrylate (EHDG-AT), at least about 45wt% but at most about 65wt% of butyl acrylate (BA), and at least about 5wt% but at most about 15wt% of perfluoroethyl acrylate (PFA), based on the total wt% of the first bonding member 510. It will be understood that in addition to such monomers, the first bonding member 510 of embodiment 1 may include oligomers, photoinitiators, and / or the like.

[0117] The surface inclination angle θ1 of the first bonding member 510 according to Embodiment 1 may be at least about 15 degrees and at most about 20 degrees.

[0118] exist Figure 6 In the embodiment 2, the first bonding member 510 may include at least about 1wt% but at most about 2wt% of hydroxybutyl acrylate (4-HBA), at least about 5wt% but at most about 10wt% of ethylhexyl acrylate (2-EHA), at least about 1wt% but at most about 2wt% of diethylene glycol mono-2-ethylhexyl acrylate (EHDG-AT), at least about 30wt% but at most about 40wt% of butyl acrylate (BA), and at least about 15wt% but at most about 25wt% of perfluoroethyl acrylate (PFA), based on the total wt% of the first bonding member 510. It will be understood that in addition to such monomers, the first bonding member 510 of embodiment 2 may include oligomers, photoinitiators and / or the like.

[0119] The surface inclination angle θ1 of the first bonding member 510 according to Embodiment 2 may be at least about 20 degrees and at most about 30 degrees.

[0120] exist Figure 6 In the embodiment 3, the first bonding member 510 may include at least about 1wt% but at most about 2wt% of hydroxybutyl acrylate (4-HBA), at least about 5wt% but at most about 10wt% of ethylhexyl acrylate (2-EHA), at least about 1wt% but at most about 2wt% of diethylene glycol mono-2-ethylhexyl acrylate (EHDG-AT), at least about 20wt% but at most about 30wt% of butyl acrylate (BA), and at least about 25wt% but at most about 35wt% of perfluoroethyl acrylate (PFA), based on the total wt% of the first bonding member 510. It will be understood that in addition to such monomers, the first bonding member 510 of embodiment 3 may include oligomers, photoinitiators and / or the like.

[0121] The surface inclination angle θ1 of the first bonding member 510 according to Embodiment 3 may be at least about 30 degrees and at most about 40 degrees.

[0122] The first bonding member 510 according to one or more embodiments may have a surface inclination angle θ1 of at least about 15 degrees and at most about 40 degrees. This can be achieved by reducing the content (e.g., amount) of monomers with high surface energy and increasing the content (e.g., amount) of monomers with relatively low surface energy. More specifically, the surface energy of hydroxybutyl acrylate (4-HBA) may be 35mN / m, the surface energy of ethylhexyl acrylate (2-EHA) may be 26mN / m, the surface energy of tetrahydrofurfuryl acrylate (THF-A) may be 38.3mN / m, the surface energy of butyl acrylate (BA) may be 19.89mN / m, and the surface energy of perfluoroethyl acrylate (PFA) may be 15.43mN / m. The content (e.g., amount) of hydroxybutyl acrylate (4-HBA), ethylhexyl acrylate (2-EHA), and tetrahydrofurfuryl acrylate (THF-A) having high surface energy (e.g., having surface energy greater than 20 mN / m) may be reduced, and the content (e.g., amount) of butyl acrylate (BA) and perfluoroethyl acrylate (PFA) having relatively low surface energy (e.g., having surface energy less than 20 mN / m) may be increased, so that the first bonding member 510 may have a relatively high surface inclination angle θ1. In one or more embodiments, as Figure 6 As shown in Embodiments 1 to 3 of the present invention, for example, a higher tilt angle can be obtained by relatively reducing the content (eg, amount) of butyl acrylate (BA) and relatively increasing the content (eg, amount) of perfluoroethyl acrylate (PFA).

[0123] Therefore, in one or more embodiments, the width w1 of the inclined portion of the first adhesive member 510 may be about 1.19 times to about 3.73 times the thickness t1 of the first adhesive member 510. More specifically, when the first adhesive member 510 is spread on the display panel 10, the first adhesive member 510 may have an inclined portion having a slope on the periphery of the display panel 10 (for example, in the peripheral area PA). For example, the width w1 of the inclined portion of the first adhesive member 510 may correspond to a value obtained by multiplying the thickness t1 of the first adhesive member 510 by the cotangent of the surface inclination angle θ1 of the first adhesive member 510. If expressed in a formula, it can be expressed as w1=t1*cot(θ1).

[0124] Therefore, if the surface inclination angle θ1 of the first bonding member 510 is at least about 15 degrees and at most about 40 degrees (for example, when the surface inclination angle θ1 of the first bonding member 510 is at least about 15 degrees and at most about 40 degrees), the width w1 of the inclined portion of the first bonding member 510 can be greater than about 1.19 times the thickness t1 of the first bonding member 510, but not greater than about 3.73 times the thickness t1 of the first bonding member 510.

[0125] Figure 7 and Figure 8 is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure, and Figure 5 The display device according to the present embodiment is similar to the above-described display device 1 , and therefore, the differences are mainly described.

[0126] refer to Figure 7 , the adhesive member 500 may be disposed between the display panel 10 and the cover window CW. In one or more embodiments, the adhesive member 500 may include a first adhesive member 510 and a second adhesive member 520 .

[0127] In one or more embodiments, the first bonding member 510 may be Figure 5 For example, the first bonding member 510 may be a bonding member having a component according to one of Embodiments 1 to 3 described in more detail above.

[0128] The second adhesive member 520 may be disposed on the first adhesive member 510. The second adhesive member 520 may be an adhesive material capable of attaching the cover window CW to the display panel 10. In one or more embodiments, the second adhesive member 520 may be an optically clear resin (OCR).

[0129] The second adhesive member 520 may be arranged on the periphery of the first adhesive member 510. Therefore, in the peripheral area PA, the second adhesive member 520 may be arranged on the first adhesive member 510 to overlap with the first adhesive member 510. In one or more embodiments, the second adhesive member 520 may be supplementarily arranged on the inclined portion of the first adhesive member 510. Since the second adhesive member 520 may be applied in a liquid state, the second adhesive member 520 may be inclined at a surface contact angle on the periphery of the first adhesive member 510. In one or more embodiments, after the second adhesive member 520 is applied to have a contact angle, the second adhesive member 520 may be hardened. Therefore, the second adhesive member 520 may be inclined at a surface inclination angle θ2 relative to the first adhesive member 510 after hardening. For example, as the second adhesive member 520 hardens, the surface contact angle of the second adhesive member 520 in a liquid state relative to the lower layer of the second adhesive member 520 may become the surface inclination angle θ2 of the second adhesive member 520. In other words, the surface contact angle of the second adhesive member 520 may have substantially the same value as the surface inclination angle θ2 of the second adhesive member 520. In this regard, the surface contact angle and the surface inclination angle θ2 of the second bonding member 520 may be defined as an angle inclined relative to the surface of the layer below the second bonding member 520. For example, the surface contact angle and the surface inclination angle θ2 of the second bonding member 520 may refer to an angle at which the second bonding member 520 is inclined relative to the surface of the first bonding member 510.

[0130] By arranging the second bonding member 520 as described above, the total tilt angle (θ1+θ2) of the bonding member 500 can be increased, and the width w1 of the tilted portion of the bonding member 500 can be reduced. This can reduce the width of the peripheral area PA, thereby reducing the dead zone and maximizing or increasing the ratio of the area displaying an image in the display device 1.

[0131] In one or more embodiments, the second bonding member 520 may include the same material as the first bonding member 510. For example, the first bonding member 510 may be a bonding member having a component according to one of the above-mentioned embodiments 1 to 3, and the second bonding member 520 may also be a bonding member having the same component and content (e.g., amount) as the first bonding member 510. Therefore, the surface inclination angle θ1 of the first bonding member 510 may be at least about 15 degrees and at most about 40 degrees, and the surface inclination angle θ2 of the second bonding member 520 may also be at least about 15 degrees but at most about 40 degrees. In one or more embodiments, the total inclination angle (θ1+θ2) of the bonding member 500 may be at least about 30 degrees but at most about 80 degrees.

[0132] In one or more embodiments, the second bonding member 520 may be different from the first bonding member 510. For example, the content (e.g., amount) of the components of the second bonding member 520 may be different from the content (e.g., amount) of the components of the first bonding member 510. For example, the first bonding member 510 may be a bonding member having a component according to one of the above-mentioned embodiments 1 to 3, and the second bonding member 520 may be a bonding member having a component according to another of the above-mentioned embodiments 1 to 3. For example, the first bonding member 510 may be a bonding member having a component according to embodiment 1, and the second bonding member 520 may be a bonding member having a component according to embodiment 2. In one or more embodiments, the first bonding member 510 may be a bonding member having a component according to embodiment 2, and the second bonding member 520 may be a bonding member having a component according to embodiment 1.

[0133] In one or more embodiments, the first bonding member 510 may be a general bonding member having a composition according to the above comparative example, and the second bonding member 520 may be a bonding member having a composition according to one of Embodiments 1 to 3 described above.

[0134] In one or more embodiments, the surface inclination angle θ2 of the second bonding member 520 may be greater than the surface inclination angle θ1 of the first bonding member 510. For example, the surface inclination angle θ1 of the first bonding member 510 may be at least about 15 degrees but at most about 20 degrees, and the surface inclination angle θ2 of the second bonding member 520 may be at least about 20 degrees but at most about 30 degrees. To this end, it will be understood that, for example, the first bonding member 510 may be a bonding member having a component according to Embodiment 1, and the second bonding member 520 may be a bonding member having a component according to Embodiment 2. In one or more embodiments, the content (e.g., amount) of butyl acrylate (BA) in the second bonding member 520 may be less than the content (e.g., amount) of butyl acrylate (BA) in the first bonding member 510. In one or more embodiments, the content (e.g., amount) of perfluoroethyl acrylate (PFA) in the second bonding member 520 may be greater than the content (e.g., amount) of perfluoroethyl acrylate (PFA) in the first bonding member 510.

[0135] refer to Figure 8, the adhesive member 500 may further include a coating layer 530 disposed between the first adhesive member 510 and the second adhesive member 520. More specifically, the coating layer 530 may be disposed on the periphery (e.g., the inclined portion) of the first adhesive member 510. Therefore, the coating layer 530 may overlap the first adhesive member 510 and the second adhesive member 520 in the peripheral area PA. In one or more embodiments, because the coating layer 530 is disposed on the inclined portion of the first adhesive member 510, the coating layer 530 may be inclined relative to the display panel 10.

[0136] In one or more embodiments, the coating 530 may include a hydrophobic material. For example, the coating 530 may include at least one of polysiloxane, fluoroalkyl silane, nanocomposite fluorine-containing polymer, trifluoromethyl methacrylate, and trimethylsilyl methacrylate. Since the coating 530 includes the hydrophobic material, the surface inclination angle θ2 of the second bonding member 520 spread on the coating 530 may increase.

[0137] In one or more embodiments, the first bonding member 510 and the second bonding member 520 may be bonding members having a component according to the above comparative example. In one or more embodiments, similar to the above embodiment, the first bonding member 510 and the second bonding member 520 may include materials different from each other, and for example, the first bonding member 510 may be a bonding member having a component according to the comparative example, and the second bonding member 520 may be a bonding member having a component according to one of the above embodiments 1 to 3. In one or more embodiments, the first bonding member 510 may be a bonding member having a component according to one of the above embodiments 1 to 3, and the second bonding member 520 may be a bonding member having a component according to another of the above embodiments 1 to 3.

[0138] These components may be configured such that the surface inclination angle θ2 of the second bonding member 520 is greater than the surface inclination angle θ1 of the first bonding member 510. For example, the content (e.g., amount) of butyl acrylate (BA) in the second bonding member 520 may be less than the content (e.g., amount) of butyl acrylate (BA) in the first bonding member 510. In one or more embodiments, the content (e.g., amount) of perfluoroethyl acrylate (PFA) in the second bonding member 520 may be greater than the content (e.g., amount) of perfluoroethyl acrylate (PFA) in the first bonding member 510.

[0139] Figures 9 to 14 is a schematic diagram of a method for manufacturing a display device according to one or more embodiments of the present disclosure. Figures 9 to 14 The method of manufacturing a display device may be a method for manufacturing the above-mentioned display device 1. However, the present disclosure is not limited thereto.

[0140] refer to Fig. 9 , the ejection part 600 may discharge droplets in one direction from above the display panel 10 to the display panel 10. For example, the ejection part 600 may coat the display area DA and the peripheral area PA of the display panel 10 with the first adhesive member 510 in a droplet state. The first adhesive member 510 is in a droplet state, and thus, as Fig. 9 As shown in , the display panel 10 may have a slope on the periphery (eg, in the peripheral area PA).

[0141] Next, refer to Fig.10 , the first bonding member 510 in a droplet state can be hardened by a hardening portion 700 adjacent to the ejection portion 600. In one or more embodiments, the hardening portion 700 can harden the droplet by radiating light through a light emitting member. The light emitting member may include an LED module. The light emitting member may radiate ultraviolet rays or infrared rays. The wavelength of light radiated by the light emitting member may be selected according to the type or kind of the droplet or the type or kind of the photoinitiator. Hereinafter, for convenience, the case where the light emitting member hardens the droplet by radiating ultraviolet rays will be mainly described, and the present disclosure is not limited thereto.

[0142] refer to Fig.11 , the cover window CW may be attached to the display panel 10. In this regard, the first adhesive member 510 may be attached to the display panel 10 through the cover window CW, and the first adhesive member 510 may be an adhesive member having the components according to the above-described embodiments 1 to 3. Therefore, since the surface inclination angle of the first adhesive member 510 is large, the dead zone may be reduced.

[0143] In one or more embodiments, after the cover window CW is attached to the display panel 10 , the first adhesive member 510 may be hardened again.

[0144] refer to Fig.12 , before attaching the cover window CW to the display panel 10, the second adhesive member 520 may be spread again on the periphery of the first adhesive member 510 by the spraying part 600. The second adhesive member 520 has been described above, and therefore, a redundant description of the second adhesive member 520 may not be provided. The second adhesive member 520 may be applied in a droplet state and then hardened by the hardening part 700.

[0145] In one or more embodiments, it will be understood that after the second adhesive member 520 is hardened, the cover window CW may be attached to the display panel 10. In one or more embodiments, after the cover window CW is attached to the display panel 10, the first adhesive member 510 and the second adhesive member 520 may be hardened again.

[0146] refer to Fig.13 , after applying and hardening the first bonding member 510, a coating 530 can be formed. In one or more embodiments, the coating 530 is a hydrophobic coating, and in a liquid state where the hydrophobic material is mixed with a solvent, the coating 530 can be applied to the first bonding member 510. In this regard, the liquid hydrophobic material can be spread on the periphery of the first bonding member 510, for example, mainly spread on the inclined portion of the first bonding member 510. In one or more embodiments, the liquid hydrophobic material can be applied by a sprayer or a dispenser. As the applied liquid hydrophobic material hardens, the solvent can be evaporated and removed, and only the hydrophobic material can be retained on the first bonding member 510 to form (or set) the coating 530.

[0147] Next, refer to Fig.14 ,and Fig.12 , the second adhesive member 520 may be spread on the coating layer 530 and hardened. In one or more embodiments, it will be understood that after the second adhesive member 520 is hardened, the cover window CW may be attached to the display panel 10. In one or more embodiments, after the cover window CW is attached to the display panel 10, the first adhesive member 510, the second adhesive member 520, and the coating layer 530 may be hardened again.

[0148] According to aspects of one or more of the above embodiments, a display device having a steep edge may be implemented by a bonding member having an improved tilt angle.

[0149] Therefore, the width of the peripheral region can be reduced, and the area of ​​the dead zone can be reduced.

[0150] The effects of one or more embodiments are not limited thereto, and other unmentioned effects will be apparent to those of ordinary skill in the art from the following claims and their equivalents.

[0151] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and / or this specification, and should not be interpreted in an idealized or overly formalized meaning, unless explicitly defined as such herein.

[0152] As used herein, the terms "substantially," "about," and similar terms are used as approximate terms rather than as terms of degree, and are intended to account for the inherent deviations of measured or calculated values ​​that one of ordinary skill in the art will recognize. In view of the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), "substantially" as used herein includes the value and means within an acceptable deviation range of a particular value determined by one of ordinary skill in the art. For example, "substantially" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the value.

[0153] In addition, any numerical range described herein is intended to include all sub-ranges of the same numerical precision contained within the described range. For example, the range of "1.0 to 10.0" is intended to include all sub-ranges between the described minimum value 1.0 and the described maximum value 10.0 (and including 1.0 and 10.0), that is, having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as, for example, 2.4 to 7.6. Any maximum numerical limit described herein is intended to include all lower numerical limits contained therein, and any minimum numerical limit described in this specification is intended to include all higher numerical limits contained therein. Therefore, the applicant reserves the right to modify this specification, including the claims, to explicitly state any sub-ranges contained within the range explicitly described herein.

[0154] In addition, when describing embodiments of the present disclosure, the use of “may” means “one or more embodiments of the present disclosure”.

[0155] According to the light-emitting device, electronic device or any other related device or component of the embodiment of the present disclosure described herein, any suitable hardware, firmware (e.g., application specific integrated circuit), software or a combination of software, firmware and hardware can be implemented. For example, the various components of the device can be formed on an integrated circuit (IC) chip or on a separate IC chip. In addition, the various components of the device can be implemented on a flexible printed circuit film, a tape carrier package (TCP), a printed circuit board (PCB), or formed on a substrate. In addition, the various components of the device can be processes or threads that execute computer program instructions and interact with other system components for performing various functions described herein, running on one or more processors in one or more computing devices. The computer program instructions are stored in a memory, which can be implemented in a computing device using a standard memory device (such as, for example, a random access memory (RAM)). The computer program instructions can also be stored in other non-temporary computer-readable media (such as, for example, a CD-ROM, a flash drive, etc.). In addition, those skilled in the art should recognize that, without departing from the scope of the embodiments of the present disclosure, the functions of various computing devices can be combined or integrated into a single computing device, or the functions of a specific computing device can be distributed across one or more other computing devices.

[0156] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered to be applicable to other similar features or aspects in other embodiments. Although embodiments of the present disclosure have been described, it should be understood that the present disclosure should not be limited to these embodiments, and within the spirit and scope of the present disclosure as defined by the attached claims and their equivalents, one or more suitable changes and modifications may be made by one of ordinary skill in the art.

Claims

1. A display device, comprising: Display panel; a cover window covering a surface of the display panel; as well as a first adhesive member between the display panel and the cover window, Wherein, the surface inclination angle of the first bonding member is at least 15 degrees and at most 40 degrees.

2. The display device according to claim 1, wherein: The first bonding member includes a hydrophobic material.

3. The display device according to claim 2, wherein: The first bonding member includes butyl acrylate or perfluoroethyl acrylate.

4. The display device according to claim 3, wherein: The first bonding member includes the butyl acrylate, and the amount of the butyl acrylate is 20 wt % to 65 wt % based on the total wt % of the first bonding member, Wherein, the first bonding member includes the perfluoroethyl acrylate, and an amount of the perfluoroethyl acrylate is 5 wt % to 35 wt % based on the total wt % of the first bonding member.

5. The display device according to claim 1, wherein: The first adhesive member is in a display area and a peripheral area of ​​the display panel, the peripheral area is around the display area, The first adhesive member includes an inclined portion inclined relative to the display panel in the peripheral region, and a width of the inclined portion of the first adhesive member is 1.19 to 3.73 times a thickness of the first adhesive member. The display device according to claim 1 , further comprising a second adhesive member on a periphery of the first adhesive member.

7. The display device according to claim 6, wherein: the second bonding member comprises a different material than the first bonding member, Wherein, a surface inclination angle of the second bonding member is greater than a surface inclination angle of the first bonding member.

8. The display device according to claim 7, wherein: The first bonding member and the second bonding member each include butyl acrylate, Wherein, the amount of the butyl acrylate in the second bonding member is less than the amount of the butyl acrylate in the first bonding member.

9. The display device according to claim 7, wherein: The first bonding member and the second bonding member each include perfluoroethyl acrylate, The amount of the perfluoroethyl acrylate in the second bonding member is greater than the amount of the perfluoroethyl acrylate in the first bonding member. 10 . The display device of claim 6 , further comprising a hydrophobic coating between the first adhesive member and the second adhesive member.

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