Display device and display panel

Abstract

The invention discloses a display device and a display panel. The display device includes: a substrate including an opening, a display area surrounding the opening, and a non-display area between the opening and the display area; a plurality of light emitting diodes arranged in the display area; an encapsulation layer covering the plurality of light emitting diodes, the encapsulation layer including a first inorganic encapsulation layer, an organic encapsulation layer on the first inorganic encapsulation layer, and a second inorganic encapsulation layer on the organic encapsulation layer; a planarization layer over the encapsulation layer in the non-display area; an input sensing layer including an insulating layer and a plurality of touch electrodes, in which a portion of the insulating layer of the input sensing layer overlaps the planarization layer in the non-display area; and a camera under the substrate, in which a portion of the planarization layer overlaps a portion of the organic encapsulation layer in the non-display area, and in which the camera overlaps the opening in a plan view.

Description

[0001] This application is a divisional application of a patent application with an application date of August 29, 2019, application number “201910807904.8”, and invention name “Display device and display panel”. Technical Field

[0002] One or more embodiments relate to a display device including a groove. Background Art

[0003] Recently, the uses of display devices have been diversified. In addition, as display devices have become thinner and lighter, their scope of use has gradually expanded.

[0004] As the area occupied by the display area of ​​the display device increases, the functions that can be combined or associated with the display device increase. An opening is provided in the display area of ​​the display device as a way to increase various functions while increasing the display area. Summary of the invention

[0005] According to one or more embodiments, a display device includes: a substrate including an opening and a display area surrounding the opening; a plurality of grooves formed on the substrate and located between the opening and the display area; a display element layer located on the substrate and including a plurality of display elements in the display area; a thin film encapsulation layer disposed on the display element layer, the thin film encapsulation layer including a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked in sequence; a planarization layer disposed above the plurality of grooves and including an organic insulating material, wherein the planarization layer is disposed above the second inorganic encapsulation layer, and the organic encapsulation layer is disposed below the second inorganic encapsulation layer.

[0006] The display element layer may include at least one organic material layer, and the at least one organic material layer may be disconnected by the groove.

[0007] The at least one organic material layer may include at least one of a hole transport layer, a hole injection layer, an electron injection layer, and an electron transport layer.

[0008] The display element layer may include: pixel electrodes corresponding to the plurality of display elements, respectively; an emission layer disposed on the pixel electrodes; and a counter electrode covering the display area, the counter electrode being disconnected by the groove.

[0009] The substrate may include a base layer and an inorganic insulating layer, the base layer may include a polymer resin, and each of the plurality of grooves may include: a hole formed in the inorganic insulating layer; and a hole or a recess formed in the base layer.

[0010] The display device may further include: a first barrier layer disposed under the planarization layer; and a second barrier layer disposed on the planarization layer.

[0011] The planarization layer may be disposed between the opening and the display area, and the first barrier layer and the second barrier layer may contact each other around a first edge of the planarization layer, the first edge of the planarization layer being adjacent to the display area.

[0012] The first barrier layer may be in direct contact with the second inorganic encapsulation layer.

[0013] The second edge of the planarization layer may be located on the same vertical line as the edge of the substrate, wherein the second edge of the planarization layer faces the opening, and the edge of the substrate defines the opening.

[0014] The display device may further include: an input sensing layer including a conductive layer and an insulating layer, the insulating layers being respectively disposed on and below the conductive layer, wherein the first barrier layer and the second barrier layer may be respectively formed integrally with one of the insulating layers of the input sensing layer.

[0015] According to one or more embodiments, a display device includes: a substrate including an opening and a display area adjacent to the opening, the substrate including a plurality of grooves formed between the opening and the display area; a display element layer disposed on the substrate and including a plurality of display elements in the display area, the display element layer including at least one organic material layer, wherein at least one organic material layer is disconnected by a plurality of grooves; a thin film encapsulation layer disposed on the display element layer, the thin film encapsulation layer including at least one inorganic encapsulation layer and an organic encapsulation layer; and a planarization layer including an organic insulating material, wherein the planarization layer is disposed between the opening and the display area.

[0016] The substrate may include: a first base layer including a polymer resin; a first inorganic insulating layer disposed on the first base layer; a second base layer disposed on the first inorganic insulating layer and including a polymer resin; and a second inorganic insulating layer disposed on the second base layer, wherein each of the plurality of grooves may include a first hole formed in the second inorganic insulating layer and a second hole or recess formed in the second base layer.

[0017] The side surface of the second inorganic insulating layer may include a tip further protruding toward the center of the groove than the side surface of the second base layer, wherein the side surface of the second inorganic insulating layer defines the first hole and the side surface of the second base layer defines the second hole or recess.

[0018] The at least one inorganic encapsulating layer may include a first inorganic encapsulating layer disposed between the organic encapsulating layer and the planarization layer.

[0019] A portion of the planarization layer may overlap a portion of the organic encapsulation layer.

[0020] The at least one inorganic encapsulation layer may further include a second inorganic encapsulation layer disposed between the display element layer and the organic encapsulation layer, wherein the second inorganic encapsulation layer continuously covers an inner surface of the groove.

[0021] The display device may further include a first inorganic barrier layer disposed on the planarization layer.

[0022] The display device may further include a second inorganic barrier layer disposed under the planarization layer, wherein the second inorganic barrier layer may contact the first inorganic barrier layer around a first edge of the planarization layer, the first edge being adjacent to the display area.

[0023] The display device may further include an input sensing layer, the input sensing layer including a conductive layer and an insulating layer, the insulating layers being respectively disposed on and below the conductive layer, wherein each of the first inorganic barrier layer and the second inorganic barrier layer is integrally formed with one of the insulating layers of the input sensing layer.

[0024] According to one or more embodiments, a display device includes: a substrate including an opening and a display area in which a plurality of pixels are arranged, the opening being formed between the plurality of pixels; a display element layer including a plurality of display elements corresponding to the plurality of pixels, respectively, the display element layer including at least one organic material layer; a thin film encapsulation layer disposed on the display element layer; and a plurality of grooves formed in the substrate and located between the opening and the display area, and disconnecting at least one organic material layer.

[0025] A plurality of grooves may be formed in the polymer resin layer and the inorganic insulating layer, and each of the plurality of grooves may include: a first hole formed in the inorganic insulating layer; and a second hole or recess formed in the polymer resin layer.

[0026] The substrate may have a multi-layer structure including a polymer resin layer and an inorganic insulating layer.

[0027] The side surface of the inorganic insulating layer may include a tip protruding further toward the center of the groove than the side surface of the polymer resin layer, wherein the side surface of the inorganic insulating layer defines the first hole and the side surface of the polymer resin layer defines the second hole or recess.

[0028] The display device may further include a planarization layer disposed between the opening and the display area.

[0029] The planarization layer may include an organic insulating material, and the thin film encapsulation layer may include: an organic encapsulation layer; and a first inorganic encapsulation layer disposed between the organic encapsulation layer and the planarization layer.

[0030] The thin film encapsulation layer may further include a second inorganic encapsulation layer, and the first and second inorganic encapsulation layers may contact each other between the opening and the display region, and a contact region of the first and second inorganic encapsulation layers may overlap the planarization layer.

[0031] The display device may further include: a first inorganic barrier layer disposed under the planarization layer; and a second inorganic barrier layer disposed on the planarization layer.

[0032] The first inorganic barrier layer and the second inorganic barrier layer may contact each other around a first edge of the planarization layer, the first edge of the planarization layer being adjacent to the display area.

[0033] The display device may further include: an input sensing layer including a conductive layer and an insulating layer, the insulating layers being respectively arranged on and under the conductive layer, wherein each of the first inorganic barrier layer and the second inorganic barrier layer may be integrally formed with one of the insulating layers of the input sensing layer.

[0034] A planarization layer may be disposed between the opening and the display area.

[0035] According to one or more embodiments, a display panel includes: a substrate including an opening area and a display area surrounding the opening area; a display element layer disposed in the display area and including a plurality of display elements; a thin film encapsulation layer covering the display element layer and including an organic encapsulation layer and an inorganic encapsulation layer; a first groove and a second groove, both located between the opening area and the display area, each of the first groove and the second groove having an undercut structure; a planarization layer disposed between the opening area and the display area and including an organic insulating material; and an input sensing layer disposed in the display area and disposed above the thin film encapsulation layer, wherein the planarization layer is disposed above the inorganic encapsulation layer and the organic encapsulation layer is disposed below the inorganic encapsulation layer

[0036] The substrate may include a first base layer, a first inorganic layer, a second base layer and a second inorganic layer stacked sequentially, and a bottom surface of each of the first groove and the second groove corresponds to a bottom surface of the second base layer, or corresponds to a virtual surface located between a top surface and a bottom surface of the second base layer.

[0037] The thin film encapsulation layer may include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer that are sequentially stacked.

[0038] The first inorganic encapsulation layer may cover an inner surface of each of the first and second grooves.

[0039] The second inorganic encapsulating layer may directly contact the first inorganic encapsulating layer in a region between the opening region and the display region.

[0040] A portion of the planarization layer may overlap the organic encapsulation layer.

[0041] The substrate may include a first opening corresponding to the opening region, and the organic encapsulation layer may include a hole overlapping the first opening.

[0042] An end portion of the planarization layer adjacent to the first opening may be located on the same vertical line as an end portion of the substrate, or spaced apart from the end portion of the substrate by a predetermined interval.

[0043] The barrier layer may be disposed on the planarization layer and include an inorganic material.

[0044] The input sensing layer may include a plurality of layers. The blocking layer may include the same material as a material of at least one layer among the plurality of layers included in the input sensing layer.

[0045] An additional planarization layer may be provided on the barrier layer.

[0046] The input sensing layer may include an organic material. The planarization layer may include the same material as the organic material of the input sensing layer.

[0047] A lower barrier layer may be disposed between the planarization layer and the thin film encapsulation layer.

[0048] The input sensing layer may include an inorganic material. The lower barrier layer may include the same material as the inorganic material of the input sensing layer.

[0049] The lower barrier layer may be in direct contact with the inorganic encapsulation layer.

[0050] According to one or more embodiments, a display panel includes: a substrate including an opening; a display element layer disposed in a display area of ​​the substrate, the display area at least partially surrounding the opening; a thin film encapsulation layer disposed on the display element layer and including an organic encapsulation layer and an inorganic encapsulation layer; a first groove and a second groove located in the groove area of ​​the substrate, wherein the groove area is located between the opening and the display area; and a planarization layer disposed in the groove area and above the organic encapsulation layer, and the inorganic encapsulation layer is placed between the planarization layer and the organic encapsulation layer.

[0051] The planarization layer may include an organic material.

[0052] Each of the first groove and the second groove may be formed in the substrate and have an undercut structure.

[0053] The substrate may include a first base layer, a first inorganic layer, a second base layer, and a second inorganic layer, which are sequentially stacked.

[0054] The second inorganic layer may include first holes corresponding to each of the first groove and the second groove, respectively. The second base layer may include second holes or recesses corresponding to the first holes, respectively.

[0055] A side surface of each first hole in the second inorganic layer may protrude further toward a center of the first hole than a side surface of the second hole or the recess in the second base layer.

[0056] The first groove may surround the opening. The second groove may surround the opening and be located between the opening and the first groove.

[0057] The thin film encapsulation layer may include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked sequentially. The first inorganic encapsulation layer may cover an inner surface of each of the first groove and the second groove.

[0058] A portion of the planarization layer may overlap the organic encapsulation layer.

[0059] A portion of the second inorganic encapsulating layer may be in direct contact with the first inorganic encapsulating layer.

[0060] The planarization layer or the organic encapsulation layer may at least partially fill the second groove.

[0061] A barrier layer may be disposed on the planarization layer.

[0062] The barrier layer may be in direct contact with the inorganic encapsulation layer around the opening.

[0063] The barrier layer may include at least one of a metal layer and an inorganic insulating layer.

[0064] An additional planarization layer may be provided on the barrier layer.

[0065] The input sensing layer may be disposed in the display area and include a first sensing electrode and a second sensing electrode.

[0066] The input sensing layer may include an organic insulating layer covering the first sensing electrode and the second sensing electrode. The planarization layer may include the same material as that of the organic insulating layer.

[0067] A lower barrier layer may be disposed between the planarization layer and the thin film encapsulation layer.

[0068] The lower barrier layer may be in direct contact with the inorganic encapsulation layer.

[0069] The lower barrier layer may include at least one of a metal layer and an inorganic insulating layer.

[0070] The lower barrier layer may cover at least the second groove.

[0071] The third groove may be disposed between the opening and the second groove.

[0072] The lower barrier layer may cover the second groove and the third groove.

[0073] The input sensing layer may be disposed on the display element layer and include an inorganic material.

[0074] The lower barrier layer may include the same material as the inorganic material of the input sensing layer.

[0075] According to one or more embodiments, a display panel includes: a substrate including an opening; a display element layer disposed in a display area of ​​the substrate; a thin film encapsulation layer disposed on the display element layer and including a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer; an input sensing layer disposed on the display element layer; a plurality of grooves located in a groove area of ​​the substrate, the groove area being between the opening and the display area; and a barrier layer covering at least one of the plurality of grooves and including an inorganic material.

[0076] A planarization layer may be disposed in the recessed region.

[0077] The planarization layer may be disposed on the second inorganic encapsulation layer. The organic encapsulation layer may be disposed under the second inorganic encapsulation layer.

[0078] The input sensing layer may include a plurality of layers, and at least one of the barrier layer and the planarization layer may include the same material as that of at least one of the plurality of layers of the input sensing layer.

[0079] Each of the plurality of grooves may have an undercut structure.

[0080] The substrate may include a first base layer, a first inorganic layer, a second base layer, and a second inorganic layer, which are sequentially stacked.

[0081] The second inorganic layer may include a plurality of first holes respectively corresponding to each of the plurality of grooves.

[0082] The second base layer may include a plurality of second holes or recesses, each of which corresponds to a plurality of first holes. The side surface of the second inorganic layer in each first hole may protrude further toward the center of the first hole than the side surface of the second base layer in each second hole or recess.

[0083] The plurality of grooves may include: a first groove adjacent to the display area; and a second groove closer to the opening than the first groove, wherein the organic encapsulation layer covers the first groove and at least partially fills the first groove.

[0084] An organic material may be located inside the second groove, wherein the organic material includes a material that is the same as that of the organic encapsulation layer.

[0085] The second groove is covered by the barrier layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0086] Figure 1 is a perspective view of a display device according to an embodiment.

[0087] FIG. 2A to FIG. 2C is a cross-sectional view of a display device according to an embodiment.

[0088] Figure 3 is a plan view of a display panel according to an embodiment.

[0089] Figure 4 It is the equivalent circuit diagram of a pixel of the display panel.

[0090] Figure 5 is a plan view of a portion of a display panel according to an embodiment.

[0091] Figure 6 is a plan view of a portion of a display panel according to an embodiment.

[0092] Figure 7 is along Figure 6 A cross-sectional view taken along line VII-VII'.

[0093] Figure 8 yes Figure 7 An enlarged cross-sectional view of an organic light-emitting diode.

[0094] Figures 9 to 14 is a cross-sectional view illustrating a process of manufacturing a display panel according to an embodiment.

[0095] Fig.15 is a cross-sectional view illustrating a process of manufacturing a display panel according to an embodiment.

[0096] Fig.16 is a plan view of a display panel according to an embodiment.

[0097] Fig.17 is a plan view of an input sensing layer according to an embodiment.

[0098] Fig.18A and Fig.18B 2 are plan views respectively illustrating a first conductive layer and a second conductive layer of an input sensing layer according to an embodiment.

[0099] Fig.18C is a cross-sectional view of an input sensing layer according to an embodiment.

[0100] Fig.19A and Fig.19B 2 are plan views respectively illustrating a first conductive layer and a second conductive layer of an input sensing layer according to an embodiment.

[0101] Fig.19C is a cross-sectional view of an input sensing layer according to an embodiment.

[0102] Fig. 20A and Fig. 20B 2 are plan views respectively illustrating a first conductive layer and a second conductive layer of an input sensing layer according to an embodiment.

[0103] Fig. 20C is a cross-sectional view of an input sensing layer according to an embodiment.

[0104] Fig.21 is a cross-sectional view of a display panel according to an embodiment.

[0105] Fig. 22 is a cross-sectional view of a display panel according to an embodiment.

[0106] Fig.23 is a cross-sectional view of a display panel according to an embodiment.

[0107] Fig.24 is a cross-sectional view of a display panel according to an embodiment.

[0108] Fig.25 is a cross-sectional view of an opening area and a first non-display area in a process of manufacturing a display panel according to an embodiment.

[0109] Fig.26 yes Fig.25 A cross-sectional view of a variant embodiment of FIG.

[0110] Fig. 27 is a cross-sectional view of an opening area and a first non-display area in a process of manufacturing a display panel according to an embodiment.

[0111] Fig.28 yes Fig. 27 Enlarged view of section XXVIII.

[0112] Fig.29 is a cross-sectional view of an opening area and a first non-display area in a process of manufacturing a display panel according to an embodiment.

[0113] Fig.30 yes Fig.29 An enlarged view of portion XXX.

[0114] Fig.31 is a cross-sectional view of an opening area and a first non-display area in a process of manufacturing a display panel according to an embodiment.

[0115] Fig.32 is a plan view of a lower barrier layer in a display panel according to an embodiment.

[0116] Fig.33 is a plan view of a lower barrier layer in a display panel according to an embodiment.

[0117] Fig.34is a plan view of a lower barrier layer in a display panel according to an embodiment.

[0118] Fig.35 is a cross-sectional view of a first non-display area of ​​a display panel according to an embodiment.

[0119] Fig.36 yes Fig.35 Enlarged view of portion XXXVI of FIG.

[0120] Fig.37 is a plan view of a portion of a display panel according to an embodiment.

[0121] Fig.38 is along Fig.37 A cross-sectional view taken along line XXXVIII-XXXVIII'.

[0122] Fig.39 is a cross-sectional view of a display panel according to an embodiment.

[0123] Fig.40 is an enlarged cross-sectional view of a structure of a lower barrier layer in a second groove of a display device according to an embodiment.

[0124] Fig.41 is a cross-sectional view of a display panel according to an embodiment.

[0125] Fig.42 is a cross-sectional view of a display panel according to an embodiment.

[0126] Fig.43 is a cross-sectional view of a display panel according to an embodiment.

[0127] Fig.44 is a cross-sectional view of an opening area and a first non-display area of ​​a display panel according to an embodiment.

[0128] Fig.45 is a cross-sectional view of an opening area and a first non-display area of ​​a display panel according to an embodiment.

[0129] Fig.46A and Fig.46B yes Fig.45 An enlarged view of the third groove.

[0130] Fig.47 is a cross-sectional view of an opening area and a first non-display area of ​​a display panel according to an embodiment.

[0131] Fig.48 is a cross-sectional view of an opening area and a first non-display area of ​​a display panel according to an embodiment.

[0132] Fig.49A is a cross-sectional view of a display panel according to an embodiment.

[0133] Fig.49B is a cross-sectional view of a display panel according to an embodiment.

[0134] Fig.50 yes Fig.49A and Fig.49B An enlarged view of portion "A".

[0135] Fig.51 is a plan view of a display panel according to an embodiment.

[0136] Fig.52 yes Fig.51 An enlarged plan view of the opening area.

[0137] Fig.53 is a plan view of a display panel according to an embodiment.

[0138] Fig.54 yes Fig.53 An enlarged plan view of the opening area. DETAILED DESCRIPTION

[0139] As the disclosure allows for various changes and numerous embodiments, the exemplary embodiments will be illustrated in the drawings and described in detail in the written description. However, the present disclosure may be implemented in many different forms and should not be construed as limited to the exemplary embodiments set forth herein.

[0140] Hereinafter, the disclosure will be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the disclosure are shown. When describing with reference to the accompanying drawings, the same reference numerals in the drawings may represent the same or corresponding elements, and their repeated description will be omitted.

[0141] It will be understood that when a layer, a region, or a component is referred to as being “formed on” another layer, region, or component, the layer, region, or component may be directly or indirectly formed on the other layer, region, or component.

[0142] It will be understood that when a layer, region or component is referred to as being “connected to” another layer, region or component, it may be “directly connected to” the other layer, region or component or may be “indirectly connected to” the layer, region or component with other layers, regions or components interposed therebetween.

[0143] Throughout the disclosure, the expression "at least one of a, b, and c" means only a, only b, only c, a and b, a and c, b and c, all of a, b, and c, or variations thereof.

[0144] Figure 1 is a perspective view of a display device 1 according to the embodiment.

[0145] Reference Figure 1 According to an embodiment, the display device 1 includes a first area OA, a second area DA, and a third area NDA. The second area DA is a display area DA that emits light, and the third area NDA is a non-display area NDA that does not emit light. Hereinafter, for the convenience of description, the second area DA will be described as the display area DA, and the third area NDA will be described as the non-display area NDA. The non-display area NDA is adjacent to the display area DA. The display device 1 displays an image using light emitted from a plurality of pixels arranged in the display area DA of the display device 1.

[0146] According to an embodiment, the first area OA of the display device 1 is at least partially surrounded by the display area DA. Figure 1 It is shown that the first area OA is completely surrounded by the display area DA. The non-display area NDA includes: a first non-display area NDA1 located between the first area OA and the display area DA; and a second non-display area NDA2 surrounding the display area DA. The first non-display area NDA1 may completely surround the first area OA, the display area DA may completely surround the first non-display area NDA1, and the second non-display area NDA2 may completely surround the display area DA.

[0147] Although an organic light emitting display device is exemplarily described below as the display device 1 according to the embodiment, the embodiment is not limited thereto. In other embodiments, the display device may be, for example, an inorganic light emitting display or a quantum dot light emitting display.

[0148] FIG. 2A to FIG. 2C is a cross-sectional view of the display device 1 according to the embodiment, and corresponds to the Figure 1 A cross-sectional view of the display device 1 taken along line II-II'.

[0149] Reference Figure 2A According to an embodiment, the display device 1 includes a display panel 10 and an assembly 20 located in a first area OA of the display panel 10 .

[0150] According to an embodiment, the display panel 10 includes: a substrate 100; a display element layer 200 including a display element and disposed on the substrate 100; a thin film encapsulation layer 300 covering the display element layer 200; and an input sensing layer 400 located on the thin film encapsulation layer 300 and sensing a touch input. In addition, various other elements such as an anti-reflection member (including a polarizer, a retarder, a color filter, and a black matrix) or a transparent window may be disposed on the input sensing layer 400.

[0151] According to an embodiment, the substrate 100 includes a polymer resin. The polymer resin substrate 100 is more flexible than a glass substrate. The polymer resin may be a transparent polymer resin. In addition to the polymer resin, the substrate 100 may further include a SiNx and / or SiO x The single inorganic layer or multiple inorganic layers serve as a barrier layer to prevent the penetration of external foreign matter.

[0152] According to an embodiment, the display element layer 200 includes a display element disposed in the display area DA. For example, the display element includes an organic light emitting diode. In addition, the display element layer 200 includes a thin film transistor, a storage capacitor, and wiring connected to the display element.

[0153] According to an embodiment, the thin film encapsulation layer 300 prevents external moisture or pollutants from penetrating into the display element layer 200 by covering the display element layer 200. The thin film encapsulation layer 300 includes at least one inorganic encapsulation layer and at least one organic encapsulation layer.

[0154] According to an embodiment, the thin film encapsulation layer 300 covers the display element in the display area DA and extends into the non-display area NDA. In this regard, Figure 2A It is shown that the thin film encapsulation layer 300 extends into the first non-display area NDA1.

[0155] According to an embodiment, the input sensing layer 400 is disposed in the display area DA. The input sensing layer 400 may obtain external input such as coordinate information corresponding to a touch event. The input sensing layer 400 includes sensing electrodes or touch electrodes and traces connected to the sensing electrodes or touch electrodes.

[0156] According to an embodiment, the process of forming the input sensing layer 400 may be continuously performed after the process of forming the planarization layer 610 described below or may be continuously performed after the process of forming the thin film encapsulation layer 300. Therefore, there is no need to provide an adhesive member between the input sensing layer 400 and the thin film encapsulation layer 300 or between the input sensing layer 400 and the planarization layer 610.

[0157] According to an embodiment, a planarization layer 610 is disposed in the first non-display area NDA1. The planarization layer 610 includes an organic insulating material. The planarization layer 610 may include a photoresist (such as a negative photoresist or a positive photoresist), or include the same material as that of the organic encapsulation layer of the thin film encapsulation layer 300, or include the same material as that of one insulating layer of the input sensing layer 400 described below, or include various other types of organic insulating materials.

[0158] According to an embodiment, Figure 2AAs shown in , the display panel 10 includes an opening 10H that passes through or penetrates from the top surface of the display panel 10 to the bottom surface of the display panel 10. The opening 10H may correspond to the first area OA. The substrate 100, the display element layer 200, the thin film encapsulation layer 300, the input sensing layer 400, and the planarization layer 610 respectively include a first opening 100H, a second opening 200H, a third opening 300H, a fourth opening 400H, and a fifth opening 610H corresponding to the first area OA. The first opening 100H passes through or penetrates from the top surface of the substrate 100 to the bottom surface of the substrate 100, the second opening 200H passes through or penetrates from the lowermost layer of the display element layer 200 to the uppermost layer of the display element layer 200, and the third opening 300H passes through or penetrates the thin film encapsulation layer 300. The fourth opening 400H passes through or penetrates from the lowermost layer of the input sensing layer 400 to the uppermost layer of the input sensing layer 400, and the fifth opening 610H passes through or penetrates from the top surface of the planarization layer 610 to the bottom surface of the planarization layer 610. The first area OA may be understood as an opening area OA in which at least one opening (such as the first opening 100H, the second opening 200H, the third opening 300H, the fourth opening 400H, the fifth opening 610H or the opening 10H) is located. Hereinafter, for ease of description, the first area OA is described as the opening area OA.

[0159] According to an embodiment, the opening area OA is a location where the component 20 is disposed. Figure 2A As shown in , the component 20 is located below the display panel 10. Optionally, as Figure 2B As shown in , the component 20 may be disposed inside the opening 10H such that the component 20 overlaps a side surface of the opening 10H of the display panel 10 .

[0160] According to an embodiment, the component 20 includes an electronic component. For example, the component 20 may be an electronic component that utilizes light or sound. The electronic component may detect or generate light or sound. For example, the electronic component is a sensor such as an infrared sensor that generates and receives infrared light, a camera that receives light and captures an image, a sensor that outputs and senses light or sound to measure distance or recognize fingerprints, a small lamp that outputs light, a microphone, or a speaker that outputs sound. The electronic component utilizing light may use light of various bands, such as visible light, infrared light, or ultraviolet light. In an embodiment, the opening area OA may be a transmission area through which light or sound output from or received by the component 20 may propagate or pass.

[0161] In an embodiment, when the display panel 10 is a part of a smart watch or a car dashboard, the component 20 may be a member including a clock hand or an instrument hand indicating predetermined information (such as vehicle speed, etc.). Figure 2A or Figure 2BThe display panel 10 is shown to be disposed at a position corresponding to the opening 10H of the display panel 10 , and may include elements related to the function of the display panel 10 or elements such as accessories that improve the appearance of the display panel 10 .

[0162] According to an embodiment, Figure 2A and Figure 2B As shown in FIG. 1 , the substrate 100 includes a first opening 100H corresponding to the opening area OA. In other embodiments, as shown in FIG. Figure 2C As shown in , the substrate 100 does not include the first opening 100H. As shown by the dotted line, the component 20 may be disposed under the display panel 10, or as shown by the solid line, the component 20 may be disposed inside the opening 10H of the display panel 10. The component 20 disposed under the display panel 10 may be an electronic component that utilizes light. In this case, the light transmittance of the opening area OA of the display panel 10 is at least about 50%, at least about 70%, at least about 75%, at least about 80%, at least about 85%, or at least about 90%.

[0163] According to the embodiment, as shown in FIG. FIG. 2A to FIG. 2C As described, the substrate 100 may include or may not include the first opening 100H. When the substrate 100 includes the first opening 100H, the substrate 100 may be used variously without departing from the limitations on the type and position of the component 20. Hereinafter, for convenience of description, although the display panel 10 including the substrate 100 including the first opening 100H is described, the features described below may be incorporated into the display panel 10. Figure 2C In the display panel 10 shown in FIG.

[0164] Figure 3 is a plan view of a display panel 10 according to an embodiment, Figure 4 is an equivalent circuit diagram of one pixel P of the display panel 10 .

[0165] Reference Figure 3 According to an embodiment, the display panel 10 includes a display area DA, a first non-display area NDA1, and a second non-display area NDA2. Figure 3 There is shown a substrate 100 of the display panel 10. For example, the substrate 100 includes an opening area OA, a display area DA, and first and second non-display areas NDA1 and NDA2.

[0166] According to an embodiment, the display panel 10 includes a plurality of pixels P arranged in a display area DA. Each pixel P includes an organic light emitting diode OLED. Each pixel P may emit, for example, red light, green light, blue light, or white light through the organic light emitting diode OLED.

[0167] Reference Figure 4According to an embodiment, each pixel P includes a pixel circuit PC and an organic light emitting diode OLED as a display element connected to the pixel circuit PC. The pixel circuit PC includes a first thin film transistor T1, a second thin film transistor T2, and a storage capacitor Cst.

[0168] According to an embodiment, the second thin film transistor T2 is a switching thin film transistor. The second thin film transistor T2 is connected to the scan line SL and the data line DL, and transmits a data voltage received from the data line DL to the first thin film transistor T1 according to a switching voltage received from the scan line SL. The storage capacitor Cst is connected to the second thin film transistor T2 and the driving voltage line PL, and stores a voltage corresponding to a difference between a voltage received from the second thin film transistor T2 and a first power supply voltage ELVDD received through the driving voltage line PL.

[0169] According to an embodiment, the first thin film transistor T1 is a driving thin film transistor. The first thin film transistor T1 is connected to the driving voltage line PL and the storage capacitor Cst, and controls the driving current flowing from the driving voltage line PL through the organic light emitting diode OLED based on the voltage stored in the storage capacitor Cst. The organic light emitting diode OLED emits light with a predetermined brightness using the driving current. The counter electrode (such as a cathode) of the organic light emitting diode OLED receives the second power supply voltage ELVSS.

[0170] According to the embodiment, although Figure 4 The pixel circuit PC including two thin film transistors and one storage capacitor is shown, but the embodiments of the present disclosure are not limited thereto. The number of thin film transistors and storage capacitors may vary according to the design of the pixel circuit PC.

[0171] Refer again Figure 3 According to an embodiment, the first non-display area NDA1 surrounds the opening area OA. The first non-display area NDA1 is an area in which a display element such as an organic light emitting diode OLED is not disposed. A signal line that transmits a signal to the pixels P around the opening area OA may extend through the first non-display area NDA1, or a groove described below may be formed in the first non-display area NDA1. A scan driver 1100 that provides a scan signal to each pixel P, a data driver 1200 that provides a data signal to each pixel P, and a main power wiring that provides a first power voltage ELVDD and a second power voltage ELVSS are disposed in the second non-display area NDA2. Optionally, the data driver 1200 may be disposed on a flexible printed circuit board (FPCB), and the flexible printed circuit board (FPCB) is connected to a pad (also referred to as a "pad" or "pad") disposed on one side of the display panel 10.

[0172] Figure 5is a plan view of a portion of the display panel 10 according to the embodiment, and illustrates signal lines located in the first non-display area NDA1.

[0173] Reference Figure 5 According to an embodiment, the pixels P are disposed in the display area DA around the opening area OA. The first non-display area NDA1 is located between the opening area OA and the display area DA.

[0174] According to an embodiment, the pixels P are spaced apart from each other and from the opening area OA. In a plan view, the pixels P are vertically spaced apart from each other and from the opening area OA, and are horizontally spaced apart from each other and from the opening area OA.

[0175] According to an embodiment, a signal line that transmits a signal to the pixel P and is adjacent to the opening area OA bypasses the opening area OA. Some of the data lines DL extending through the display area DA extend in the y direction to transmit the data signal to the pixel P disposed around the opening area OA, and detour along the edge of the opening area OA in the first non-display area NDA1. Some of the scan lines SL extending through the display area DA extend in the x direction to transmit the scan signal to the pixel P disposed around the opening area OA, and detour along the edge of the opening area OA in the first non-display area NDA1.

[0176] Figure 6 is a plan view of a portion of the display panel 10 according to an embodiment, and illustrates a groove located in the first non-display area NDA1.

[0177] According to an embodiment, at least one groove is formed between the opening area OA and the display area DA. In this regard, Figure 6 It is shown that the first, second and third grooves G1, G2 and G3 are formed between the opening area OA and the display area DA. However, the embodiment is not limited thereto, and in other embodiments, more than 3 grooves or less than 3 grooves may be formed in the first non-display area NDA1.

[0178] According to an embodiment, the first groove G1, the second groove G2, and the third groove G3 are concentric circles having a ring shape completely surrounding the opening area OA in the first non-display area NDA1. The diameter of each of the first groove G1, the second groove G2, and the third groove G3 is greater than the diameter of the opening area OA, and the first groove G1, the second groove G2, and the third groove G3 are spaced apart from each other by a predetermined interval.

[0179] According to an embodiment, the widths of at least two of the first groove G1, the second groove G2, and the third groove G3 are different from each other. In this regard, Figure 6It is shown that the width of the third groove G3 is greater than the width of the first groove G1 and the width of the second groove G2. However, the embodiment is not limited thereto, and in other embodiments, the widths of at least two of the first groove G1, the second groove G2, and the third groove G3 may be the same. The width between the protruding tips of at least two of the first groove G1, the second groove G2, and the third groove G3 is the same. The protruding tips of each of the first groove G1, the second groove G2, and the third groove G3 will be described below.

[0180] Reference Figure 5 and Figure 6 According to an embodiment, the first groove G1, the second groove G2, and the third groove G3 are closer to the opening area OA than the signal line bypassing the opening area OA.

[0181] Figure 7 is a cross-sectional view of a display panel 10 according to an embodiment, and corresponds to a cross-sectional view along Figure 6 The section taken along line VII-VII' is Figure 8 yes Figure 7 An enlarged cross-sectional view of an organic light-emitting diode OLED. Figure 7 An opening area OA, a first non-display area NDA1, and a display area DA are shown. Figure 7 It is shown that the substrate 100 includes a first opening 100H of the opening area OA. Hereinafter, the opening area OA may refer to the opening 10H of the display panel 10 or the first opening 100H of the substrate 100.

[0182] First, describe Figure 7 The display area DA.

[0183] According to an embodiment, the substrate 100 includes a polymer resin. The substrate 100 includes a base layer including the polymer resin and an inorganic layer. For example, the substrate 100 includes a first base layer 101, a first inorganic layer 102, a second base layer 103, and a second inorganic layer 104.

[0184] According to an embodiment, each of the first base layer 101 and the second base layer 103 includes a polymer resin. For example, each of the first base layer 101 and the second base layer 103 includes a polymer resin such as polyethersulfone (PES), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyacrylate, polyimide (PI), polycarbonate (PC), or cellulose acetate propionate (CAP). The polymer resin is transparent.

[0185] According to an embodiment, each of the first inorganic layer 102 and the second inorganic layer 104 is a barrier layer that prevents penetration of external foreign matter, and may include a SiN xor SiO x A single layer or multiple layers of inorganic materials.

[0186] According to an embodiment, the display element layer 200 disposed on the substrate 100 includes a display element, a pixel circuit each connected to a corresponding display element, a buffer layer 201, a gate insulating layer 203, a first interlayer insulating layer 205, a second interlayer insulating layer 207, an organic insulating layer 209, and a pixel electrode 221. According to an embodiment, a buffer layer 201 that prevents impurities from penetrating into the semiconductor layer Act of the thin film transistor TFT is disposed on the substrate 100. The buffer layer 201 includes an inorganic insulating material such as silicon nitride or silicon oxide. The buffer layer 201 may be a single layer or multiple layers including the inorganic insulating material. In an embodiment, the second inorganic layer 104 of the substrate 100 is a partial layer or sublayer of the multilayer buffer layer 201.

[0187] According to an embodiment, a pixel circuit PC (see FIG. 1 ) includes a thin film transistor TFT and a storage capacitor Cst. Figure 4 ) is disposed above the buffer layer 201. The thin film transistor TFT includes a semiconductor layer Act, a gate electrode GE, a source electrode SE and a drain electrode DE. Figure 7 The thin film transistor TFT shown in FIG. Figure 4 In this embodiment, although Figure 7 A top gate type thin film transistor is shown in which the gate electrode GE is provided above the semiconductor layer Act with the gate insulating layer 203 interposed therebetween, but according to other embodiments, the thin film transistor TFT is a bottom gate type thin film transistor.

[0188] According to an embodiment, the semiconductor layer Act includes polycrystalline silicon. Alternatively, in other embodiments, the semiconductor layer Act may include an inorganic semiconductor (such as amorphous silicon or an oxide semiconductor) or an organic semiconductor. The gate electrode GE includes a low-resistance metal. The gate electrode GE includes a conductive material (such as Mo, Al, Cu or Ti), and may be a single layer or a multilayer (multi-structure) including the above materials.

[0189] According to an embodiment, the gate insulating layer 203 is disposed between the semiconductor layer Act and the gate electrode GE. The gate insulating layer 203 includes an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, or hafnium oxide. The gate insulating layer 203 may be a single layer or multiple layers including the above materials.

[0190] According to an embodiment, the source electrode SE and the drain electrode DE both include a conductive material. The source electrode SE and the drain electrode DE include a conductive material such as Mo, Al, Cu or Ti or a mixture thereof. The source electrode SE and the drain electrode DE may be a single layer or a multilayer including the above materials. In an embodiment, the source electrode SE and the drain electrode DE include a multilayer including Ti / Al / Ti.

[0191] According to an embodiment, the storage capacitor Cst includes a lower electrode CE1 and an upper electrode CE2 stacked on each other, and a first interlayer insulating layer 205 is interposed between the lower electrode CE1 and the upper electrode CE2. The storage capacitor Cst is stacked with the thin film transistor TFT. In this regard, Figure 7 It is shown that the gate electrode GE of the thin film transistor TFT is used as the lower electrode CE1 of the storage capacitor Cst. However, in other embodiments, the storage capacitor Cst is not overlapped with the thin film transistor TFT. The storage capacitor Cst is covered by the second interlayer insulating layer 207.

[0192] According to an embodiment, the first interlayer insulating layer 205 and the second interlayer insulating layer 207 include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, or hafnium oxide. The first interlayer insulating layer 205 and the second interlayer insulating layer 207 may each be a single layer or multiple layers including the above materials.

[0193] According to an embodiment, the pixel circuit PC including the thin film transistor TFT and the storage capacitor Cst is covered by the organic insulating layer 209. The organic insulating layer 209 is a planarized insulating layer. The organic insulating layer includes an organic insulating material, which includes: a general polymer, such as an imide polymer, polymethyl methacrylate (PMMA) or polystyrene (PS); or a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, a vinyl alcohol polymer or a blend thereof. In an embodiment, the organic insulating layer 209 includes polyimide.

[0194] According to an embodiment, the organic light emitting diode OLED is disposed on the organic insulating layer 209. The pixel electrode 221 of the organic light emitting diode OLED is disposed on the organic insulating layer 209 and is connected to the pixel circuit PC through a contact hole in the organic insulating layer 209.

[0195] According to an embodiment, the pixel electrode 221 includes a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3), indium gallium oxide (IGO) or aluminum zinc oxide (AZO). In other embodiments, the pixel electrode 221 includes a reflective layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or a mixture thereof. In other embodiments, the pixel electrode 221 also includes a reflective layer including ITO, IZO, ZnO or In on or under the reflective layer. 2 O 3 layer.

[0196] According to an embodiment, the pixel defining layer 211 includes an opening exposing the top surface of the pixel electrode 221, and covers the edge of the pixel electrode 221. The pixel defining layer 211 includes an organic insulating material. However, in other embodiments, the pixel defining layer 211 may include an inorganic insulating material or may include an organic insulating material and an inorganic insulating material.

[0197] According to an embodiment, the intermediate layer 222 including the emission layer 222b is disposed on the pixel electrode 221 and the pixel defining layer 211. The emission layer 222b includes a polymer or a low-molecular organic material that emits light of a predetermined color. Figure 8 As shown in FIG. 1 , the intermediate layer 222 includes a first functional layer 222a located below the emission layer 222b and a second functional layer 222c located above the emission layer 222b.

[0198] According to an embodiment, the first functional layer 222a may be a single layer or include multiple layers. For example, when the first functional layer 222a includes a polymer material, the first functional layer 222a is a hole transport layer (HTL) having a single layer structure and includes poly-(3,4)-ethylene-dioxythiophene (PEDOT) or polyaniline (PANI). When the first functional layer 222a includes a low molecular organic material, the first functional layer 222a includes a hole injection layer (HIL) and the HTL.

[0199] According to an embodiment, the second functional layer 222c is optional. For example, when the first functional layer 222a and the emission layer 222b include a polymer material, the second functional layer 222c is provided to improve the characteristics of the organic light emitting diode OLED. The second functional layer 222c may be a single layer or include multiple layers. The second functional layer 222c includes an electron transport layer (ETL) or an electron injection layer (EIL).

[0200] According to an embodiment, some layers (such as functional layers) among the multiple layers constituting the intermediate layer 222 are disposed not only in the display area DA but also in the first non-display area NDA1, and are separated by the first groove G1, the second groove G2, and the third groove G3 described below in the first non-display area NDA1.

[0201] According to an embodiment, the counter electrode 223 is arranged to face the pixel electrode 221, and the intermediate layer 222 is placed between the counter electrode 223 and the pixel electrode 221. The counter electrode 223 includes a conductive material with a low work function. For example, the counter electrode 223 includes a (semi) transparent layer, and the (semi) transparent layer includes Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca or an alloy thereof. However, in other embodiments, the counter electrode 223 also includes a (semi) transparent layer including ITO, IZO or In 2 O 3 layer.

[0202] According to an embodiment, the organic light emitting diode OLED is covered by a thin film encapsulation layer 300. The thin film encapsulation layer 300 includes at least one organic encapsulation layer and at least one inorganic encapsulation layer. Figure 7 The thin film encapsulation layer 300 is shown to include first and second inorganic encapsulation layers 310 and 330 and an organic encapsulation layer 320 between the first and second inorganic encapsulation layers 310 and 330. However, in other embodiments, the number and stacking order of the organic and inorganic encapsulation layers may be changed.

[0203] According to an embodiment, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 include one or more inorganic insulating materials such as aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride or silicon oxynitride, and can be formed by chemical vapor deposition (CVD) etc. The organic encapsulation layer 320 includes a polymer material. The polymer material includes an acrylic resin, an epoxy resin, a polyimide or a polyethylene.

[0204] According to an embodiment, the input sensing layer 400 is disposed on the thin film encapsulation layer 300. The input sensing layer 400 obtains coordinate information corresponding to an external input (such as a touch event). Since the input sensing layer 400 is configured to be formed directly above the substrate 100 including the thin film encapsulation layer 300 and is therefore in contact with the thin film encapsulation layer 300, additional components such as an adhesive layer that bonds the input sensing layer 400 to the thin film encapsulation layer 300 may be omitted. The input sensing layer 400 includes sensing electrodes or touch electrodes and traces connected to the sensing electrodes or touch electrodes. The input sensing layer 400 includes a first conductive layer 410 and a second conductive layer 420 and a first insulating layer 401, a second insulating layer 403, and a third insulating layer 405. At least one of the first conductive layer 410 and the second conductive layer 420 includes a sensing electrode. In this regard, reference is made below Figures 17 to 20C The specific structure of the input sensing layer 400 is described below.

[0205] Next, describe Figure 7 The first non-display area NDA1 is shown in FIG.

[0206] Reference Figure 7 According to the embodiment, the first non-display area NDA1 includes: a first sub non-display area SNDA1 relatively far from the opening area OA; and a second sub non-display area SNDA2 relatively close to the opening area OA.

[0207] According to an embodiment, the first sub non-display area SNDA1 is an area through which the signal line extends. Figure 7 The data line DL in the reference Figure 5 The data lines DL described as bypassing the opening area OA correspond to the first sub non-display area SNDA1 being a wiring area through which the signal lines extend. The data lines DL are alternately arranged on different layers with an insulating layer therebetween, or are arranged on the same insulating layer. When adjacent data lines DL are respectively arranged on and under an insulating layer (such as the second interlayer insulating layer 207) located therebetween, the gap or spacing between adjacent data lines DL can be reduced, and the width of the first non-display area NDA1 can be reduced. Although Figure 7 The data line DL extending through the first sub non-display area SNDA1 is shown, but referring to Figure 5 The scan line SL described as bypassing the opening area OA also extends through the first sub non-display area SNDA1.

[0208] According to an embodiment, the second sub non-display area SNDA2 is a groove area in which grooves are formed. The first groove G1, the second groove G2, and the third groove G3 are formed in the second sub non-display area SNDA2. Each of the first groove G1, the second groove G2, and the third groove G3 has an undercut structure. The first groove G1, the second groove G2, and the third groove G3 are formed by a plurality of layers including an inorganic layer and an organic layer. For example, the first groove G1, the second groove G2, and the third groove G3 are formed by removing a portion of the substrate 100 including the plurality of layers.

[0209] According to an embodiment, the first groove G1, the second groove G2, and the third groove G3 are formed by etching the second base layer 103 and the second inorganic layer 104 located on the second base layer 103. In this regard, Figure 7 It is shown that the first groove G1, the second groove G2 and the third groove G3 are formed by removing a portion of the second base layer 103 and the second inorganic layer 104. Figure 7 The buffer layer 201 , the gate insulating layer 203 , the first interlayer insulating layer 205 , and the second interlayer insulating layer 207 over the second inorganic layer 104 are also removed and constitute a portion of each of the first groove G1 , the second groove G2 , and the third groove G3 .

[0210] According to an embodiment, each of the first groove G1, the second groove G2, and the third groove G3 has an undercut structure. In detail, the width of the portion of the first groove G1, the second groove G2, and the third groove G3 that at least partially penetrates the second base layer 103 is greater than the width of the portion of the first groove G1, the second groove G2, and the third groove G3 that penetrates the inorganic insulating layer such as the second inorganic layer 104 or the buffer layer 201. Parts of the intermediate layer 222 and the counter electrode 223 are separated by the undercut structure of the first groove G1, the second groove G2, and the third groove G3.

[0211] According to an embodiment, the first inorganic encapsulation layer 310 of the thin film encapsulation layer 300 covers the inner surfaces of the first groove G1, the second groove G2, and the third groove G3. The organic encapsulation layer 320 covers the first groove G1 and at least partially fills a portion of the first groove G1. The organic encapsulation layer 320 is formed by coating a monomer over the substrate 100 and hardening the monomer. In order to control the flow of the monomer and ensure the thickness of the monomer, a partition wall 500 is provided between the first groove G1 and the second groove G2. The partition wall 500 has a stacked structure including a first sub-wall portion 510 and a second sub-wall portion 520, each of which includes an organic insulating layer. The edge 320E of the organic encapsulation layer 320 is spaced apart from the edge 100E of the opening area OA or the substrate 100 by a predetermined interval. The second inorganic encapsulation layer 330 is provided on the organic encapsulation layer 320 and covers the inner surfaces of the second groove G2 and the third groove G3. The second inorganic encapsulating layer 330 directly contacts the first inorganic encapsulating layer 310 in the second groove G2 and the third groove G3 .

[0212] According to an embodiment, the planarization layer 610 is disposed in the second sub non-display area SNDA2 and covers at least one groove. The planarization layer 610 covers the second groove G2 and the third groove G3 and at least partially fills at least one of the second groove G2 and the third groove G3. Figure 7 As shown in FIG. 1 , the planarization layer 610 at least partially fills the inner space of the second groove G2 above the second inorganic encapsulation layer 330. The planarization layer 610 increases the flatness of the display panel 10 around the opening area OA by covering at least the area of ​​the second sub non-display area SNDA2 not covered by the organic encapsulation layer 320.

[0213] According to an embodiment, the planarization layer 610 includes an organic insulating material. The planarization layer 610 is spatially separated from the organic encapsulation layer 320 by the second inorganic encapsulation layer 330. For example, when the planarization layer 610 is disposed on the second inorganic encapsulation layer 330 and the organic encapsulation layer 320 is disposed under the second inorganic encapsulation layer 330, the organic encapsulation layer 320 and the planarization layer 610 are spatially separated from each other. The organic encapsulation layer 320 is not in direct contact with the planarization layer 610. The planarization layer 610 has a thickness of, for example, at least about 5 μm.

[0214] According to an embodiment, a portion of the planarization layer 610 overlaps the organic encapsulation layer 320. A first edge 610E1 of the planarization layer 610 extends over the organic encapsulation layer 320 and overlaps the organic encapsulation layer 320. A second edge 610E2 of the planarization layer 610 is spaced apart from the opening area OA or the edge 100E of the substrate 100 by a predetermined interval. Therefore, the second edge 620E2 of the barrier layer 620 to be described below is in direct contact with the second inorganic encapsulation layer 330 in an area adjacent to the opening 10H. The planarization layer 610 may prevent the occurrence of cracks, floating, and peeling in the insulating layer and the metal layer or the conductive layer in the first non-display area NDA1 during the process of manufacturing the display panel 10, or minimize the occurrence of cracks, floating, and peeling in the insulating layer and the metal layer or the conductive layer in the first non-display area NDA1 during the process of manufacturing the display panel 10. The planarization layer 610 is covered by the barrier layer 620.

[0215] According to an embodiment, the barrier layer 620 is disposed in the first non-display area NDA1 and covers the planarization layer 610. The barrier layer 620 covers the top surface and the side surface of the planarization layer 610. Figure 7 , the first edge 620E1 of the barrier layer 620 is located on the same vertical line as the first edge 610E1 of the planarization layer 610. However, in other embodiments, the first edge 620E1 of the barrier layer 620 extends over the edge of the planarization layer 610 above the top surface of the second inorganic encapsulation layer 330 and contacts the second inorganic encapsulation layer 330. The second edge 620E2 of the barrier layer 620 is located on the same vertical line as the edge 100E of the substrate 100.

[0216] According to an embodiment, the blocking layer 620 includes an inorganic material, such as an inorganic insulating material or a metal. In an embodiment, the blocking layer 620 includes the same material as the inorganic insulating layer or the metal layer included in the input sensing layer 400. For example, the blocking layer 620 includes a first sub-blocking layer 621, a second sub-blocking layer 622, a third sub-blocking layer 623, and a fourth sub-blocking layer 624. The first sub-blocking layer 621 and the third sub-blocking layer 623 may include the same material as the first insulating layer 401 and the second insulating layer 403 of the input sensing layer 400, respectively. In this case, Figure 7 Differently, the first sub-blocking layer 621 and the third sub-blocking layer 623 are connected to the first insulating layer 401 and the second insulating layer 403 of the input sensing layer 400 as a whole. The second sub-blocking layer 622 and the fourth sub-blocking layer 624 respectively include the same materials as the first conductive layer 410 and the second conductive layer 420 of the input sensing layer 400, but are not connected to the first conductive layer 410 and the second conductive layer 420, but are spaced apart from each other. Figure 7 The barrier layer 620 is shown to include a first sub-barrier layer 621, a second sub-barrier layer 622, a third sub-barrier layer 623, and a fourth sub-barrier layer 624, but the embodiments of the present disclosure are not limited thereto. The barrier layer 620 may be a single layer or have two or three layers. For example, the barrier layer 620 includes at least one of the first sub-barrier layer 621, the second sub-barrier layer 622, the third sub-barrier layer 623, and the fourth sub-barrier layer 624.

[0217] Figures 9 to 14 is a cross-sectional view illustrating an opening area OA and a first non-display area NDA1 in a process of manufacturing the display panel 10 according to an embodiment. Fig. 9 is formed in Figure 7 A cross-sectional view of the first groove G1 to the third groove G3 in the display panel 10, Fig.10 is a cross-sectional view showing first to third grooves G1 to G3 formed according to another embodiment, Fig.11 It is shown in Fig. 9 A cross-sectional view of an intermediate layer to a thin film encapsulation layer formed above the display panel 10, Fig.12 and Fig.13 It is shown in Fig.11 A cross-sectional view of a planarization layer 610 and a barrier layer 620 formed after the process, Fig.14 is a cross-sectional view illustrating a process of manufacturing the display panel 10 according to another embodiment, and is a cross-sectional view of a state after a cutting process or a scribing process according to another embodiment. Fig.15 is a cross-sectional view illustrating a process of manufacturing the display panel 10 according to an embodiment. Fig.16 is a plan view of a display panel 10 according to an embodiment.

[0218] Reference Fig. 9 According to an embodiment, the first groove G1, the second groove G2, and the third groove G3 are formed by removing a portion of the multilayer film. The multilayer film includes at least one of the partial layers of the substrate 100. The multilayer film has a stacked structure including a layer including an organic insulating material such as a polymer resin and a layer including an inorganic insulating material disposed on the organic insulating material. For example, the second base layer 103 including a polymer resin and an inorganic insulating layer (such as a second inorganic layer 104 or a buffer layer 201) located on the second base layer 103 correspond to the multilayer film. Although in Fig. 9 The second inorganic layer 104 and the buffer layer 201 are represented by separate names, respectively, but the second inorganic layer 104 may be a part (or sublayer) of the buffer layer 201 having multiple layers, or the buffer layer 201 may be a part (or sublayer) of the second inorganic layer 104 having multiple layers.

[0219] According to an embodiment, the first groove G1, the second groove G2, and the third groove G3 are formed by removing a portion of the second base layer 103 and a portion of the inorganic insulating layer. Fig. 9 It is shown that a portion of the second base layer 103 and the second inorganic layer 104 are removed by an etching process. The buffer layer 201, the gate insulating layer 203, and a portion of the first interlayer insulating layer 205 and the second interlayer insulating layer 207 are removed by an etching process. The etching process for removing a portion of the second base layer 103 and the etching process for removing the inorganic insulating layer on the second base layer 103 are performed separately. The partition wall 500 is disposed between the first groove G1 and the second groove G2, and includes a first sub-wall portion 510 including the same material as the organic insulating layer 209 and a second sub-wall portion 520 including the same material as the pixel defining layer 211.

[0220] According to an embodiment, the width W1 of the portion of the first groove G1 that at least partially penetrates the second base layer 103 is greater than the width W2 of the portion of the first groove G1 that penetrates the buffer layer 201 and the second inorganic layer 104. Therefore, the first groove G1 has an undercut structure. The side surfaces of the buffer layer 201 and the second inorganic layer 104 further protrude toward the center of the first groove G1 compared to the side surfaces of the second base layer 103. The portions of the buffer layer 201 and the second inorganic layer 104 that further protrude toward the center of the first groove G1 in a direction parallel to the top surface of the substrate 100 correspond to a pair of protruding tips PT. The protruding tip PT of each of the first groove G1, the second groove G2, and the third groove G3 protrudes by about 0.7 μm to about 1.5 μm toward the center of each of the first groove G1, the second groove G2, and the third groove G3.

[0221] According to an embodiment, like the first groove G1, the second groove G2 and the third groove G3 have an undercut structure. The width W1' of the portion of the second groove G2 penetrating into the second base layer 103 is greater than the width W2' of the portion of the second groove G2 penetrating the buffer layer 201 and the second inorganic layer 104, and the width W1" of the portion of the third groove G3 penetrating into the second base layer 103 is greater than the width W2" of the portion of the third groove G3 penetrating the buffer layer 201 and the second inorganic layer 104. Similarly, the side surfaces of the buffer layer 201 and the second inorganic layer 104 of the second groove G2 and the third groove G3 further protrude toward the center of the second groove G2 and the third groove G3 compared to the side surfaces of the second base layer 103. A pair of protruding tips PT of the buffer layer 201 and the second inorganic layer 104 protruding toward the center of each of the first groove G1, the second groove G2 and the third groove G3 form an undercut structure.

[0222] According to an embodiment, the widths of at least two of the first groove G1, the second groove G2, and the third groove G3 are different from each other. The width of the groove refers to the width between a pair of protruding tips of the groove. For example, the width W2 between the protruding tips PT of the first groove G1 is smaller than the width W2' between the protruding tips PT of the second groove G2. The width W2' between the protruding tips PT of the second groove G2 is smaller than the width W2" between the protruding tips PT of the third groove G3. However, the embodiment is not limited thereto, and the widths between the protruding tips PT of at least two of the first groove G1, the second groove G2, and the third groove G3 may be the same in other embodiments. In other embodiments, the width of the groove away from the opening area OA is smaller than the width of the groove close to the opening area OA. In other embodiments, the widths of the first groove G1, the second groove G2, the third groove G3, and other grooves may be selected differently. For example, the width of the groove may alternate between wide and narrow.

[0223] According to an embodiment, Fig. 9 It is shown that the first groove G1, the second groove G2, and the third groove G3 include a hole penetrating an inorganic insulating layer such as the buffer layer 201 and the second inorganic layer 104 and a recess formed in the second base layer 103. The depths h1, h2, and h3 of the recesses respectively formed in the second base layer 103 are less than the thickness t of the second base layer 103. The bottom surfaces of the first groove G1, the second groove G2, and the third groove G3 correspond to a dummy surface between the top surface and the bottom surface of the second base layer 103.

[0224] In other embodiments, Fig.10As shown in FIG. 1 , each of the first groove G1, the second groove G2, and the third groove G3 includes a hole penetrating an inorganic insulating layer such as the buffer layer 201 and the second inorganic layer 104 and a hole penetrating the second base layer 103. The depths h1', h2', and h3' of the holes respectively formed in the second base layer 103 are substantially equal to the thickness t of the second base layer 103. Therefore, the bottom surfaces of the first groove G1, the second groove G2, and the third groove G3 correspond to the bottom surface of the second base layer 103. The depths h1, h2, and h3 of the recesses or the depths h1', h2', and h3' of the holes are at least about 2 μm.

[0225] In the following, for the convenience of description, the main description is Fig. 9 The structure in which the bottom surfaces of the first groove G1, the second groove G2 and the third groove G3 are located between the top surface and the bottom surface of the second base layer 103 is shown in FIG. 1 , however, the second base layer 103 may have a reference to the embodiment described below and the embodiment derived therefrom. Fig.10 The structure of the description.

[0226] Reference Fig.11 According to an embodiment, an intermediate layer 222 and a counter electrode 223 are formed over a substrate 100 including a first groove G1, a second groove G2, and a third groove G3. The intermediate layer 222 and the counter electrode 223 may be formed by thermal deposition or the like. Portions of the intermediate layer 222 (such as a first functional layer 222a and a second functional layer 222c) and the counter electrode 223 may be formed as one body in the display area DA and the first non-display area NDA1 (e.g., in the second groove G2). The first functional layer 222a and the second functional layer 222c are separated by the undercut structure of the first groove G1, the second groove G2, and the third groove G3 in the first non-display area NDA1. Similarly, the counter electrode 223 is also separated by the first groove G1, the second groove G2, and the third groove G3 in the first non-display area NDA1.

[0227] According to the embodiment, unlike the intermediate layer 222 and the counter electrode 223, the first inorganic encapsulation layer 310 of the thin film encapsulation layer 300 has good step coverage, so the first inorganic encapsulation layer 310 can be continuously formed without being separated. Fig.11 As shown in FIG. 1 , the first inorganic encapsulation layer 310 completely covers the inner surfaces of the first groove G1, the second groove G2, and the third groove G3. The side and bottom surfaces of the buffer layer 201 and the second inorganic layer 104 constituting the grooves G1, G2, and G3 and the side and bottom surfaces of the second base layer 103 are covered by the first inorganic encapsulation layer 310. The first inorganic encapsulation layer 310 covers the separated first functional layer 222a and the second functional layer 222c and the counter electrode 223 positioned on the bottom surfaces of the first groove G1, the second groove G2, and the third groove G3.

[0228] According to an embodiment, the layer including an organic material on the substrate 100 may serve as a transmission path for foreign matter such as moisture or oxygen. Since the first functional layer 222a and the second functional layer 222c including an organic material are separated by the first groove G1, the second groove G2, and the third groove G3, the propagation of moisture in the lateral (x) direction can be prevented, and the damage of the organic light emitting diode can be prevented.

[0229] According to an embodiment, the first groove G1 is covered by the organic encapsulation layer 320, and the organic encapsulation layer 320 is filled. During the process of manufacturing the organic encapsulation layer 320, the flow of the monomer is controlled by the partition wall 500 between the first groove G1 and the second groove G2. Because the flow of the monomer has been blocked by the partition wall 500, the organic encapsulation layer 320 formed when the monomer is hardened does not extend beyond the partition wall 500. The thickness of the organic encapsulation layer 320 is controlled by the partition wall 500, and the second groove G2 and the third groove G3 are not covered by the organic encapsulation layer 320.

[0230] As described above, according to the embodiment, the inner surfaces of the second groove G2 and the third groove G3 are covered by the first inorganic encapsulation layer 310. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 contact each other in the second groove G2 and the third groove G3. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 are formed not only in the display area DA and the first non-display area NDA1, but also in the opening area OA.

[0231] Reference Fig.12 According to an embodiment, a pre-planarization layer 610P is formed on the thin film encapsulation layer 300. The pre-planarization layer 610P includes an organic material (such as a negative photoresist or a positive photoresist) or a polymer material. The pre-planarization layer 610P covers an area of ​​the first non-display area NDA1 where the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 contact each other, and a portion of the pre-planarization layer 610P overlaps the organic encapsulation layer 320 with the second inorganic encapsulation layer 330 interposed therebetween.

[0232] Reference Fig.13 The planarization layer 610 is formed by patterning the pre-planarization layer 610P. For example, the planarization layer 610 is formed by removing a portion of the pre-planarization layer 610P corresponding to the opening area OA. The planarization layer 610 covers the second groove G2 and the third groove G3. Fig.13 As shown in FIG. 1 , the planarization layer 610 fills a portion of the third groove G3 and the second groove G2. According to the process of patterning the pre-planarization layer 610P, the position of the second edge 610E2 of the planarization layer 610 can be Fig.13 The position shown in changes in the left-right direction.

[0233] Afterwards, according to an embodiment, a barrier layer 620 is formed on the planarization layer 610. The barrier layer 620 is an inorganic layer and includes an inorganic insulating layer or a metal layer. Figure 7 As described, the blocking layer 620 includes at least one layer provided for the input sensing layer 400 .

[0234] According to an embodiment, the barrier layer 620 covers the top surface and the side surface of the planarization layer 610. The barrier layer 620 covers the top surface of the second inorganic encapsulation layer 330 located in the opening area OA and in a portion of the first non-display area NDA1. The barrier layer 620 is in direct contact with the top surface and the side surface of the planarization layer 610, and is in direct contact with the top surface of the second inorganic encapsulation layer 330.

[0235] Next, according to an embodiment, when a laser cutting process or a scribing process is performed along the first line SCL1 corresponding to the opening area OA, as shown in FIG. Fig.14 As shown in FIG. 1 , a first opening 100H is formed in the substrate 100. If a crack is formed in the inorganic insulating layer during a process of cutting or scribing the substrate 100, the crack may extend along the substrate 100. Fig.14 However, due to the undercut structure of the third groove G3, the crack does not further propagate toward the display area DA.

[0236] According to an embodiment, when Fig.13 When the first line SCL1 is subjected to a cutting or scribing process, Fig.14 As shown in FIG. 1 , the third groove G3 has an eave structure with a protruding tip in the left and right directions in the cross-sectional view. Fig.13 When the second line SCL2 overlapped with the third groove G3 shown in FIG. 1 is subjected to a cutting process or a scribing process, as shown in FIG. Fig.15 As shown, the third groove G3 has only a right protruding tip.

[0237] According to an embodiment, although a laser cutting process or a scribing process has been described as a method of forming the first opening 100H in the substrate 100 according to an embodiment, in other embodiments, other methods such as mechanical polishing may be used.

[0238] According to the embodiment, referring to Figures 7 to 15 The structure described surrounds the opening 10H (ie, the opening area OA). Fig.16 As shown in FIG. 1 , the planarization layer 610 between the opening area OA and the display area DA is a ring-shaped area surrounding the opening area OA in a plan view. The organic encapsulation layer 320 covers a portion of the first non-display area NDA1 and the display area DA, and an edge 320E of the organic encapsulation layer 320 is spaced apart from the opening area OA by a predetermined interval and overlaps the planarization layer 610.

[0239] Fig.17 is a plan view of an input sensing layer 400 according to an embodiment.

[0240] Reference Fig.17 According to an embodiment, the input sensing layer 400 includes first sensing electrodes SP1 and second sensing electrodes SP2 disposed in the display area DA. The first sensing electrodes SP1 are spaced apart in the x direction, and the second sensing electrodes SP2 are spaced apart in the y direction crossing the x direction. The first sensing electrodes SP1 and the second sensing electrodes SP2 are perpendicularly crossed.

[0241] According to an embodiment, the first sensing electrodes SP1 and the second sensing electrodes SP2 are arranged so that their corners are adjacent to each other. The first sensing electrodes SP1 are electrically connected to each other through the first connection electrodes CP1, and the second sensing electrodes SP2 are electrically connected to each other through the second connection electrodes CP2.

[0242] Fig.18A and Fig.18B 4 are plan views respectively showing a first conductive layer 410 and a second conductive layer 420 of an input sensing layer 400 according to an embodiment, Fig.18C is a cross-sectional view of the input sensing layer 400 according to an embodiment, and corresponds to the Fig.17 A cross section taken along line XVII-XVII'.

[0243] Reference Fig.18A and Fig.18B According to an embodiment, the first sensing electrode SP1 and the second sensing electrode SP2 are located in the same layer. Fig.18A As shown in FIG. 4 , the first connection electrode CP1 is included, and the second conductive layer 420 is as shown in FIG. Fig.18B As shown in FIG. 1 , a first sensing electrode SP1 , a second sensing electrode SP2 , and a second connection electrode CP2 are included.

[0244] According to an embodiment, the second sensing electrodes SP2 are connected to each other through the second connection electrodes CP2 located in the same layer. The first sensing electrodes SP1 are spaced apart in the x-direction and connected by the first connection electrodes CP1 located in different layers.

[0245] Reference Fig.18CAccording to an embodiment, the second insulating layer 403 is disposed between the first conductive layer 410 and the second conductive layer 420. The first sensing electrode SP1 located in the second conductive layer 420 is connected to the first connection electrode CP1 located in the first conductive layer 410 through the contact hole CNT in the second insulating layer 403. The second conductive layer 420 is covered by the third insulating layer 405. The first insulating layer 401 is disposed under the first conductive layer 410. The first insulating layer 401 and the second insulating layer 403 are inorganic insulating layers including an inorganic material such as silicon nitride, and the third insulating layer 405 is an organic insulating layer. Although Fig.18C The first insulating layer 401 is shown disposed between the thin film encapsulation layer 300 and the first conductive layer 410, but in other embodiments, the first insulating layer 401 may be omitted and the first conductive layer 410 may be disposed directly on the thin film encapsulation layer 300. In other embodiments, the first insulating layer 401 and the second insulating layer 403 are organic insulating layers.

[0246] Fig.19A and Fig.19B 4 are plan views respectively showing a first conductive layer 410 and a second conductive layer 420 of an input sensing layer 400 according to an embodiment, Fig.19C is based on Fig.19A and Fig.19B 4 is a cross-sectional view of the input sensing layer 400 of the embodiment of FIG. Fig.17 A cross section taken along line XVII-XVII'.

[0247] Reference Fig.19A and Fig.19B According to the embodiment, the first conductive layer 410 includes the first sensing electrode SP1 and the first connection electrode CP1 connected to the first sensing electrode SP1, and the second conductive layer 420 includes the second sensing electrode SP2 and the second connection electrode CP2 connected to the second sensing electrode SP2. The first conductive layer 410 also includes the second auxiliary sensing electrodes S-SP2 each connected to the second sensing electrode SP2, and the second conductive layer 420 also includes the first auxiliary sensing electrode S-SP1 connected to the first sensing electrode SP1.

[0248] Reference Fig.19A According to an embodiment, each of the first sensing electrodes SP1 includes a plurality of holes H. The holes H overlap the emission region PE of the pixel P. In addition, the second sensing electrode SP2, the first auxiliary sensing electrode S-SP1, and the second auxiliary sensing electrode S-SP2 also include a plurality of holes, each hole being as shown in FIG. Fig.19A The emission area PE corresponding to the pixel P is shown in the enlarged view.

[0249] Reference Fig.19CAccording to an embodiment, the first auxiliary sensing electrode S-SP1 is connected to the first sensing electrode SP1 through the contact hole CNT in the second insulating layer 403. With this structure, the resistance of the first sensing electrode SP1 can be reduced. Similarly, the second sensing electrode SP2 is connected to the second auxiliary sensing electrode S-SP2 through the contact hole CNT in the second insulating layer 403. The first insulating layer 401 and the second insulating layer 403 are inorganic insulating layers, and the first conductive layer 410 and the second conductive layer 420 can each be a single layer or a multilayer including a metal such as aluminum or titanium. The third insulating layer 405 includes an organic insulating material.

[0250] Fig. 20A and Fig. 20B are plan views respectively showing a first conductive layer 410 and a second conductive layer 420 of an input sensing layer 400 according to other embodiments, Fig. 20C is based on Fig. 20A and Fig. 20B 4 is a cross-sectional view of the input sensing layer 400 of the embodiment of FIG. Fig.17 A cross section taken along line XVII-XVII'.

[0251] Reference Fig. 20A and Fig. 20B According to the embodiment, the first conductive layer 410 includes the first sensing electrode SP1 and the first connection electrode CP1 connected to the first sensing electrode SP1, and the second conductive layer 420 includes the second sensing electrode SP2 and the second connection electrode CP2 connected to the second sensing electrode SP2.

[0252] Reference Fig. 20C According to an embodiment, the second insulating layer 403' is disposed between the first conductive layer 410 and the second conductive layer 420. The second insulating layer 403' does not include a separate contact hole. The first sensing electrode SP1 and the second sensing electrode SP2 are electrically insulated from each other, and the second insulating layer 403' is located therebetween. The second conductive layer 420 is covered by the third insulating layer 405'. The second insulating layer 403' is an organic insulating layer. In other embodiments, the second insulating layer 403' may be an organic insulating layer or an inorganic insulating layer, or may include both an organic insulating layer and an inorganic insulating layer.

[0253] Fig.21 is a cross-sectional view of a display panel 10 according to another embodiment, and corresponds to a cross-sectional view along Figure 6 A cross section taken along line VII-VII'. Fig.21 The display panel 10 and the reference Figure 7 The display panel 10 described is different in that four or more grooves are formed in the first non-display area NDA1. Fig.21It is shown that one fourth groove G4 is located between the second groove G2 and the third groove G3, but the embodiment is not limited thereto, and one or more fourth grooves G4 may be located between the second groove G2 and the third groove G3. For example, the stacking structure on the fourth groove G4 may be the same as the stacking structure on the second groove G2.

[0254] According to the embodiment, referring to Fig.21 The number of grooves and their structures described can be incorporated not only in the above-mentioned embodiments but also in the embodiments described below and embodiments derived therefrom.

[0255] Fig. 22 is a cross-sectional view of a display panel 10 according to another embodiment, and corresponds to a cross-sectional view along Figure 6 The cross section is taken along line VII-VII'. Figure 7 The display panel 10 described shows a structure in which the second edge 610E2 of the planarization layer 610 is spaced apart from the opening area OA (such as the edge 100E of the substrate 100) by a predetermined interval, but the position of the second edge 610E2 of the planarization layer 610 is as shown in FIG. Fig. 22 The changes shown in .

[0256] Reference Fig. 22 According to an embodiment, the second edge 610E2 of the planarization layer 610 and the edge 100E of the substrate 100 are located on the same vertical line. In other words, the side surface of the planarization layer 610 and the edge 100E are located on the same vertical line.

[0257] According to an embodiment, when reference is omitted Figures 9 to 15 When describing the process of patterning the pre-planarization layer 610P, as shown in FIG. Fig. 22 As shown in FIG. 6 , the side surface of the planarization layer 610 is exposed to the opening 10H without being covered by the barrier layer 620 .

[0258] According to the embodiment, since the side surface of the planarization layer 610 is exposed to the opening 10H, moisture introduced through the planarization layer 610 as an organic insulating layer may propagate toward the display area DA in the lateral (x) direction. However, since the second inorganic encapsulation layer 330 is disposed between the planarization layer 610 and the organic encapsulation layer 320, moisture may be prevented from propagating beyond the second inorganic encapsulation layer 330 toward the display area DA.

[0259] Reference Fig. 22 The described structure of the planarization layer 610 may be incorporated not only in the above-described embodiment but also in the embodiment described below and embodiments derived therefrom.

[0260] Fig.23 is a cross-sectional view of a display panel 10 according to another embodiment, and corresponds to a cross-sectional view along Figure 6A cross section taken along line VII-VII'.

[0261] Reference Fig.23 According to an embodiment, a partition wall 500A is further provided between the first groove G1 and the display area DA. Hereinafter, for ease of description, the partition wall 500 between the first groove G1 and the second groove G2 is referred to as the first partition wall 500, and the partition wall 500A between the first groove G1 and the display area DA is referred to as the second partition wall 500A.

[0262] According to an embodiment, the second partition wall 500A includes an organic insulating material. For example, the second partition wall 500A includes the same material as the pixel defining layer 211. In an embodiment, the second partition wall 500A overlaps a signal line (such as a data line DL) bypassing the opening area OA.

[0263] According to an embodiment, in the process of manufacturing the organic encapsulation layer 320, the flow of the monomer is blocked by the second partition wall 500A. In this case, the edge of the organic encapsulation layer 320 is adjacent to the inner surface of the second partition wall 500A, and the organic encapsulation layer 320 does not cover the first groove G1, the second groove G2, and the third groove G. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 contact each other in the first groove G1, the second groove G2, and the third groove G.

[0264] According to the embodiment, referring to Fig.23 The described structure of the planarization layer 610 may be incorporated not only in the above-described embodiment but also in the embodiment described below and embodiments derived therefrom.

[0265] Fig.24 is a cross-sectional view of a display panel 10 according to another embodiment, and corresponds to a cross-sectional view along Figure 6 A cross section taken along line VII-VII'. Fig.24 The opening area OA, the first non-display area NDA1 around the opening area OA, and the display area DA are shown. The substrate 100 includes a first opening 100H corresponding to the opening area OA. Hereinafter, the opening area OA may refer to the opening 10H of the display panel 10 or the first opening 100H of the substrate 100. Fig.24 The structure and reference of the display area DA Figure 7 The structures described are the same, so the first non-display area NDA1 is mainly described below.

[0266] According to the embodiment, referring to Fig.24 The first non-display area NDA1 includes: a first sub-non-display area SNDA1 relatively far from the opening area OA; and a second sub-non-display area SNDA2 relatively close to the opening area OA.

[0267] According to an embodiment, the first sub non-display area SNDA1 is an area through which the signal line extends. Fig.24 The data line DL is referenced Figure 5 The data line DL bypassing the opening area OA described above corresponds to the data line DL bypassing the opening area OA. Fig.24 As shown in , the data lines DL are alternately arranged with an insulating layer therebetween. However, the embodiment is not limited thereto, and in other embodiments, the data lines DL are arranged on the same insulating layer. When adjacent / neighboring data lines DL are respectively arranged on and under an insulating layer (such as the second interlayer insulating layer 207) interposed therebetween, the gap between the adjacent data lines DL can be reduced, and the width of the first non-display area NDA1 can be reduced. In addition, similar to Fig.24 The data line DL in the first sub non-display area SNDA1 is referred to Figure 5 The scan line SL described as bypassing the opening area OA may also extend through the first sub non-display area SNDA1 .

[0268] According to an embodiment, the second sub non-display area SNDA2 is an area in which grooves are arranged. The first groove G1, the second groove G2, and the third groove G3 are formed in the second sub non-display area SNDA2. Each of the first groove G1, the second groove G2, and the third groove G3 has an undercut structure. The first groove G1, the second groove G2, and the third groove G3 are formed as a multilayer structure including an inorganic layer and an organic layer. For example, the first groove G1, the second groove G2, and the third groove G3 are formed by removing a portion of the substrate 100 including a plurality of layers.

[0269] According to an embodiment, the first groove G1, the second groove G2, and the third groove G3 are formed by etching the second base layer 103 of the substrate 100 and the second inorganic layer 104 located on the second base layer 103. In this regard, Fig.24 It is shown that the first groove G1, the second groove G2, and the third groove G3 are formed by removing a portion of the second base layer 103 and a portion of the second inorganic layer 104. In an embodiment, the buffer layer 201, the gate insulating layer 203, the first interlayer insulating layer 205, and the second interlayer insulating layer 207 on the second inorganic layer 104 are removed to form a portion of the first groove G1, the second groove G2, and the third groove G3.

[0270] According to an embodiment, each of the first groove G1, the second groove G2, and the third groove G3 has an undercut structure. Each of the first groove G1, the second groove G2, and the third groove G3 has an undercut structure as follows: the width of the portion at least partially penetrating the second base layer 103 is greater than the width of the portion penetrating the inorganic insulating layer such as the second inorganic layer 104 or the buffer layer 201. The intermediate layer 222 (such as the first functional layer 222a and the second functional layer 222c) and the portion of the counter electrode 223 are separated by the undercut structure of the first groove G1, the second groove G2, and the third groove G3.

[0271] According to an embodiment, the first inorganic encapsulation layer 310 of the thin film encapsulation layer 300 covers the inner surfaces of the first groove G1, the second groove G2, and the third groove G3. The organic encapsulation layer 320 covers the first groove G1 on the first inorganic encapsulation layer 310 and fills the first groove G1 on the first inorganic encapsulation layer 310. The organic encapsulation layer 320 is formed by coating a monomer over the substrate 100 and then hardening the monomer. In order to control the flow of the monomer and ensure the thickness of the monomer, a partition wall 500 is provided between the first groove G1 and the second groove G2. The partition wall 500 includes an organic insulating material and, for example, has a stacked structure including a first sub-wall portion 510 and a second sub-wall portion 520.

[0272] According to an embodiment, the edge 320E of the organic encapsulation layer 320 is spaced apart from the opening area OA or the edge 100E of the substrate 100 by a predetermined interval. In an embodiment, during the process of forming the organic encapsulation layer 320, the material of the organic encapsulation layer 320 exists in the second groove G2. In this regard, Fig.24 It is shown that the organic material part 320M exists in the second groove G2.

[0273] According to an embodiment, the second inorganic encapsulating layer 330 is disposed on the organic encapsulating layer 320 and covers inner surfaces of the second and third grooves G2 and G3. The second inorganic encapsulating layer 330 directly contacts the first inorganic encapsulating layer 310 in the second and third grooves G2 and G3.

[0274] According to an embodiment, the planarization layer 610 is disposed on portions of the second inorganic encapsulation layer 330 corresponding to the second groove G2 and the third groove G. The lower barrier layer 700 is disposed under the planarization layer 610 .

[0275] According to an embodiment, the planarization layer 610 is disposed in the second sub non-display area SNDA2 and covers at least one groove. The planarization layer 610 covers the second groove G2 and the third groove G3 and at least partially fills at least one of the second groove G2 and the third groove G3. Fig.24As shown in FIG. 1 , the inner space of the second groove G2 and the third groove G3 above the second inorganic encapsulation layer 330 is filled with a planarization layer 610. The planarization layer 610 increases the flatness of the display panel 10 around the opening area OA by covering the area of ​​the second sub non-display area SNDA2 that is not covered by the organic encapsulation layer 320. Therefore, when an element is formed on the display panel 10, poor bonding, separation, or floating of an element such as an anti-reflection member or a window on the display panel 10 can be prevented.

[0276] According to an embodiment, the planarization layer 610 includes an organic insulating material. The planarization layer 610 includes a negative photoresist or a positive photoresist. In other embodiments, the planarization layer 610 includes a Fig.18C , Fig.19C and Fig. 20C The material of the third insulating layer 405 is the same material as described.

[0277] According to an embodiment, a planarization layer 610 is disposed on the thin film encapsulation layer 300. The planarization layer 610 is spatially separated from the organic encapsulation layer 320 by the second inorganic encapsulation layer 330. For example, when the planarization layer 610 is disposed on the second inorganic encapsulation layer 330 and the organic encapsulation layer 320 is disposed under the second inorganic encapsulation layer 330, the organic encapsulation layer 320 is spatially separated from the planarization layer 610. The organic encapsulation layer 320 does not directly contact the planarization layer 610. The planarization layer 610 has a thickness of at least about 5 μm.

[0278] According to an embodiment, a portion of the planarization layer 610 overlaps the organic encapsulation layer 320. A first edge 610E1 of the planarization layer 610 extends over the organic encapsulation layer 320 and overlaps the organic encapsulation layer 320. A second edge 610E2 of the planarization layer 610 faces the opening area OA. The second edge 610E2 and the edge 100E of the substrate 100 are located on the same vertical line.

[0279] According to an embodiment, the lower barrier layer 700 covers at least one groove. In this regard, Fig.24 The lower barrier layer 700 is shown to cover the second groove G2. When cracks occur in the inorganic layer (such as the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330) formed around the second groove G2 or the inorganic layer becomes separated during the process of manufacturing the display panel 10, moisture may penetrate the cracks or the separated portions. In order to prevent the penetration of moisture, the lower barrier layer 700 covers the area (such as the second groove and its vicinity) where cracks may occur on the second inorganic encapsulation layer 330.

[0280] According to an embodiment, the lower barrier layer 700 includes an inorganic material. For example, the lower barrier layer 700 includes an inorganic insulating layer or a metal layer, and may be a single layer or include multiple layers. Fig.24 As shown in FIG. 1 , the lower barrier layer 700 includes a plurality of sublayers including a first lower layer 701, a second lower layer 702, a third lower layer 703, and a fourth lower layer 704. The lower barrier layer 700 may include the FIG. 18A to FIG. 20C At least one layer is included in the described input sensing layer 400.

[0281] For example, according to an embodiment, the first lower layer 701, the second lower layer 702, the third lower layer 703, and the fourth lower layer 704 respectively include the same materials as the first insulating layer 401, the first conductive layer 410, the second insulating layer 403, and the second conductive layer 420. The first lower layer 701 and the third lower layer 703 are inorganic insulating layers including an inorganic insulating material such as silicon nitride, and the second lower layer 702 and the fourth lower layer 704 are metal layers including Al, Ti, etc. In an embodiment, the second lower layer 702 and the fourth lower layer 704 have a multilayer of Ti / Al / Ti.

[0282] According to an embodiment, when the lower barrier layer 700 includes the same material as that of the inorganic material layer of the input sensing layer 400, the lower barrier layer 700 is formed during the same process as that of forming the inorganic material layer of the input sensing layer 400. Similarly, the planarization layer 610 includes the same material as that of the organic material layer of the input sensing layer 400, and may be formed during the same process as that of forming the organic material layer of the input sensing layer 400.

[0283] According to the embodiment, although Fig.24 The edge of the lower barrier layer 700 is shown to be spaced apart from the input sensing layer 400 by a predetermined interval, and the edge of the planarization layer 610 is spaced apart from the input sensing layer 400 by another predetermined interval, but the embodiments of the present disclosure are not limited thereto. The first lower layer 701 and the third lower layer 703 of the lower barrier layer 700 may be connected to the first insulating layer 401 and the second insulating layer 403 of the input sensing layer 400 as a whole, respectively. Fig.24 As shown in FIG. 4 , the second lower layer 702 and the fourth lower layer 704 of the lower barrier layer 700 are spaced apart from the first conductive layer 410 and the second conductive layer 420 of the input sensing layer 400 . The planarization layer 610 may be connected to the third insulating layer 405 of the input sensing layer 400 as a whole.

[0284] According to the embodiment, although Fig.24 It is shown that the lower barrier layer 700 includes four layers, but the embodiment is not limited thereto, and the lower barrier layer 700 may be a single layer or may include two layers, three layers, five layers, or more layers in other embodiments.

[0285] Fig.25 , Fig.26 , Fig. 27 , Fig.29 and Fig.311 is a cross-sectional view of the opening area OA and the first non-display area NDA1 according to a process of manufacturing the display panel 10 in the embodiment. Fig.28 yes Fig. 27 An enlarged view of section XXVIII, Fig.30 yes Fig.29 An enlarged view of portion XXX. Fig.25 is a cross-sectional view of the first to third grooves G1 to G3 in which the display panel 10 is formed, Fig.26 is a cross-sectional view of first to third grooves G1 to G3 in which a display panel 10 is formed according to another embodiment, Fig. 27 It is among Fig.25 A cross-sectional view of a display panel 10 having an intermediate layer 222 formed thereon to a lower barrier layer 700, Fig.29 is a cross-sectional view in which a planarization layer 610 is formed, Fig.31 It is a cross-sectional view of the state after the cutting process or the scribing process.

[0286] Reference Fig.25 According to an embodiment, the first groove G1, the second groove G2, and the third groove G3 are formed by removing a portion of the multilayer film. The multilayer film includes at least one layer of a substrate 100. The multilayer film has a stacked structure including a layer including an organic insulating material (such as a polymer resin) and a layer including an inorganic insulating material disposed on the layer. For example, the multilayer film includes: a second base layer 103 including a polymer resin; and an inorganic insulating layer (such as a second inorganic layer 104 or a buffer layer 201) located on the second base layer 103. Although the second inorganic layer 104 and the buffer layer 201 (such as Fig.25 The second inorganic layer 104 and the inorganic insulating layer between the thin film transistor TFT in the multilayer structure are represented by different names, but according to the embodiment, the second inorganic layer 104 can be considered as a sublayer of the buffer layer 201 having a multilayer structure, or the buffer layer 201 can be considered as a sublayer of the second inorganic layer 104 having a multilayer structure.

[0287] According to an embodiment, the first groove G1 , the second groove G2 , and the third groove G3 are formed by removing a portion of the second base layer 103 and a portion of the inorganic insulating layer on the second base layer 103 . Fig.25It is shown that a portion of the second base layer 103 and the second inorganic layer 104 are removed by an etching process. The buffer layer 201, the gate insulating layer 203, and a portion of the first interlayer insulating layer 205 and the second interlayer insulating layer 207 are also removed by the etching process. The etching process for removing a portion of the second base layer 103 and the etching process for removing the inorganic insulating layer on the second base layer 103 are performed separately. The partition wall 500 is disposed between the first groove G1 and the second groove G2, and includes a first sub-wall portion 510 and a second sub-wall portion 520, the first sub-wall portion 510 includes the same material as the material of the organic insulating layer 209, and the second sub-wall portion 520 includes the same material as the material of the pixel defining layer 211.

[0288] According to an embodiment, the width W1 of the portion of the first groove G1 that at least partially penetrates the second base layer 103 is greater than the width W2 of the portion of the first groove G1 that penetrates the buffer layer 201 and the second inorganic layer 104. Therefore, the first groove G1 has an undercut structure. The side surfaces of the buffer layer 201 and the second inorganic layer 104 further protrude toward the center of the first groove G1 compared to the side surfaces of the second base layer 103. The portions of the buffer layer 201 and the second inorganic layer 104 that further protrude toward the center of the first groove G1 in a direction parallel to the top surface of the substrate 100 correspond to a pair of protruding tips PT.

[0289] According to an embodiment, like the first groove G1, the second groove G2 and the third groove G3 have an undercut / eaves structure. The width W1' of the portion of the second groove G2 that at least partially penetrates the second base layer 103 is greater than the width W2' of the portion of the second groove G2 that penetrates the buffer layer 201 and the second inorganic layer 104, and the width W1" of the portion of the third groove G3 that at least partially penetrates the second base layer 103 is greater than the width W2" of the portion of the third groove G3 that penetrates the buffer layer 201 and the second inorganic layer 104. Similarly, the side surfaces of the buffer layer 201 and the second inorganic layer 104 that define the second groove G2 and the third groove G3 further protrude toward the center of the second groove G2 and the third groove G3 compared to the side surfaces of the second base layer 103, and form their protruding tips PT. The protruding tips PT of the buffer layer 201 and the second inorganic layer 104 protrude by approximately 0.7μm to approximately 1.5μm toward the center of each of the first groove G1, the second groove G2, and the third groove G3.

[0290] According to an embodiment, Fig.25It is shown that each of the first groove G1, the second groove G2, and the third groove G3 includes a portion penetrating the inorganic insulating layer (such as a portion formed in the buffer layer 201 and the second inorganic layer 104) and a recess formed in the second base layer 103. The depth h1, h2, and h3 of each recess formed in the second base layer 103 is less than the thickness t of the second base layer 103. The bottom surfaces of the first groove G1, the second groove G2, and the third groove G3 form a dummy surface between the top surface and the bottom surface of the second base layer 103.

[0291] In other embodiments, Fig.26 As shown in FIG. 1 , each of the first groove G1, the second groove G2, and the third groove G3 includes a portion penetrating the inorganic insulating layer (such as a hole formed in the buffer layer 201 and the second inorganic layer 104) and a portion penetrating the second base layer 103. The depth h1', h2', and h3' of each hole formed in the second base layer 103 is substantially equal to the thickness t of the second base layer 103, so the bottom surface of the first groove G1, the second groove G2, and the third groove G3 is coplanar with the bottom surface of the second base layer 103. The depths h1, h2, and h3 of the recesses or the depths h1', h2', and h3' of the holes are at least about 2 μm.

[0292] In the following, for the convenience of description, the main description is Fig.25 In the structure in which the bottom surfaces of the first groove G1, the second groove G2 and the third groove G3 form a virtual surface between the top surface and the bottom surface of the second base layer 103, it will be understood that the second base layer 103 may have a reference to the embodiment described below and the embodiment derived therefrom. Fig.26 The structure of the description.

[0293] Reference Fig. 27 According to an embodiment, an intermediate layer 222 and an opposing electrode 223 are formed over the substrate 100 and the first, second, and third grooves G1, G2, and G3. The intermediate layer 222 and the opposing electrode 223 may be formed by thermal deposition or the like.

[0294] According to an embodiment, a portion of the intermediate layer 222 (such as the first functional layer 222a and the second functional layer 222c) and a portion of the counter electrode 223 may be formed as one body in the display area DA and the first non-display area NDA1, respectively. Fig.28 As shown in FIG. 1 , the first functional layer 222a and the second functional layer 222c are separated by the undercut structure of the second groove G2 in the first non-display area NDA1. The first functional layer 222a and the second functional layer 222c are separated, and the counter electrode 223 is also separated by a pair of protruding tips PT defining the undercut structure of the second groove G2. Fig. 27Due to the undercut structure of the first groove G1 and the second groove G2 shown in FIG. 8 , the first functional layer 222 a and / or the second functional layer 222 c and the counter electrode 223 are separated.

[0295] The layer including organic materials above the substrate 100 may serve as a transmission path for foreign substances such as moisture or oxygen. Since the first functional layer 222a and the second functional layer 222c including organic materials are separated by the first groove G1, the second groove G2, and the third groove G3, the propagation of moisture in the lateral (x) direction may be prevented, and damage to the organic light emitting diode may be prevented.

[0296] According to the embodiment, unlike the intermediate layer 222 and the counter electrode 223, the first inorganic encapsulation layer 310 of the thin film encapsulation layer 300 has better step coverage than the first functional layer 222a or the second functional layer 222c and the counter electrode 223, so the first inorganic encapsulation layer 310 can be continuously formed. The first inorganic encapsulation layer 310 completely and continuously covers the inner surfaces of the first groove G1, the second groove G2, and the third groove G3.

[0297] According to an embodiment, an organic encapsulation layer 320 is formed on the first inorganic encapsulation layer 310. The first groove G1 is covered by the organic encapsulation layer 320, and the inner space of the first groove G1 located above the first inorganic encapsulation layer 310 is at least partially filled with the organic encapsulation layer 320. During the process of manufacturing the organic encapsulation layer 320, the flow of the monomer is controlled by the partition wall 500 between the first groove G1 and the second groove G2. The organic encapsulation layer 320 is formed when the monomer is hardened, and the flow of the monomer is blocked by the partition wall 500, so the monomer does not flow beyond the partition wall 500.

[0298] In an embodiment, Fig. 27 and Fig.28 As shown in , during the process of manufacturing the organic encapsulation layer 320, a portion of the organic material portion 320M is disposed in the second groove G2. For example, during the process of coating the monomer, a portion of the monomer may fall into the second groove G2 and be hardened to form the organic material portion 320M. In another embodiment, a process of hardening the monomer and a process of ashing are performed. In this case, the organic material portion 320M that is not removed by the ashing process remains in the second groove G2. The organic material portion 320M remains under the protruding tip PT structure of the second groove G2. The organic material portion 320M includes the same material as the material of the organic encapsulation layer 320. The organic material portion 320M is separated from the organic encapsulation layer 320.

[0299] According to an embodiment, the second inorganic encapsulation layer 330 is formed on the organic encapsulation layer 320. In the first groove G1, the first inorganic encapsulation layer 310 does not directly contact the second inorganic encapsulation layer 330 due to the organic encapsulation layer 320. On the contrary, in the second groove G2 and the third groove G3, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 contact each other. Fig. 27 As shown in FIG. 1 , the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 are formed not only in the first non-display area NDA1 but also in the opening area OA.

[0300] Next, according to an embodiment, a lower barrier layer 700 is formed on the second inorganic encapsulation layer 330. The lower barrier layer 700 covers a portion of the first non-display area NDA1 (such as the second groove G2). Fig.28 As shown in , the lower barrier layer 700 includes a plurality of layers including a first lower layer 701, a second lower layer 702, a third lower layer 703, and a fourth lower layer 704. The depth h2 of the second groove G2 in the vertical (z) direction (i.e., a direction perpendicular to the top surface of the substrate 100) under the protruding tip PT is greater than the sum of the thicknesses of the first functional layer 222a, the second functional layer 222c, the counter electrode 223, the first inorganic encapsulation layer 310, the second inorganic encapsulation layer 330, and the lower barrier layer 700.

[0301] According to an embodiment, the first lower layer 701, the second lower layer 702, the third lower layer 703, and the fourth lower layer 704 are sequentially formed on the second inorganic encapsulation layer 330. Since the inner space of the second groove G2 under the protruding tip PT is at least partially filled with the organic material part 320M, the layer of the lower barrier layer 700 is continuously formed around the protruding tip PT without being disconnected.

[0302] Reference Fig.29 According to an embodiment, a planarization layer 610 is formed on the lower barrier layer 700. The planarization layer 610 includes FIG. 18A to FIG. 20C The planarization layer 610 may include the same material as the organic material of at least one layer included in the described input sensing layer 400. Alternatively, the planarization layer 610 may include a negative photoresist or a positive photoresist, or include the same material as the organic encapsulation layer 320 of the thin film encapsulation layer 300.

[0303] Reference Fig.30 According to an embodiment, the planarization layer 610 at least partially fills the second groove G2. For example, the planarization layer 610 at least partially fills the inner space of the second groove G2 above the lower barrier layer 700.

[0304] Next, according to an embodiment, when a laser cutting process or a scribing process is performed along the first line SCL1 corresponding to the opening area OA, as shown in FIG. Fig.31As shown in , the opening 10H of the display panel 10 is formed. The first opening 100H is formed in the substrate 100 by a cutting process or a scribing process. When a crack is formed in the inorganic insulating layer during the process of cutting the substrate 100 or scribing the substrate 100, the crack may propagate in the lateral (x) direction, but the crack stops near the protruding tip PT of the third groove G3 or the second groove G2. Therefore, the crack does not propagate toward the display area DA.

[0305] Although the laser cutting process or the scribing process has been described as a method of forming the first opening 100H in the substrate 100 in the above-described embodiments, in other embodiments, various other methods such as mechanical polishing may be used.

[0306] Fig.32 is a plan view of the lower barrier layer 700 in the display panel 10 according to the embodiment. Fig.32 In the figure, for the convenience of description, the first groove G1 is omitted.

[0307] Reference Fig.32 According to an embodiment, the lower barrier layer 700 has a ring shape surrounding the opening area OA. The lower barrier layer 700 covers the second groove G2 and has a width greater than that of the second groove G2.

[0308] According to an embodiment, Fig.32 The planar structure of the first non-display area NDA1 shown in FIG. Figures 24 to 31 That is, refer to Figures 24 to 31 The structure described surrounds the opening 10H (ie, Fig.32 For example, the opening area OA shown in FIG. Fig.32 As shown in FIG. 1 , the lower barrier layer 700 between the opening area OA and the display area DA has a ring shape surrounding the opening area OA in a plan view. Figures 24 to 31 The depicted planarization layer 610 also has an annular shape surrounding the opening area OA in a plan view. In addition, the partition wall 500 has an annular shape surrounding the opening area OA in a plan view.

[0309] Fig.33 FIG. 1 is a plan view of the lower barrier layer 700 in the display panel 10 according to the embodiment. Fig.32 Again, for ease of description, Fig.33 The first groove G1 is omitted.

[0310] Reference Fig.33According to an embodiment, the lower barrier layer 700 has a ring shape surrounding the opening area OA in a plan view and covers a partial area of ​​the second groove G2. For example, the width of the lower barrier layer 700 is smaller than the width of the second groove G2. The lower barrier layer 700 covers one side of the second groove G2, such as as shown in FIG. Fig.28 One of the pair of protruding tips PT extending into the second groove G2 as described (such as Fig.31 The right protruding tip PT shown in FIG.

[0311] According to the embodiment, although Fig.32 and Fig.33 It is shown that the lower barrier layer 700 has a closed curved shape in a plan view, but the embodiments of the present disclosure are not limited thereto. In other embodiments, the lower barrier layer 700 has an open curved shape in a plan view.

[0312] Fig.34 FIG. 1 is a plan view of the lower barrier layer 700 in the display panel 10 according to the embodiment. Fig.32 Again, for ease of description, Fig.34 The first groove G1 is omitted.

[0313] Reference Fig.34 According to an embodiment, the lower barrier layer 700 has an open curved shape in the first non-display area NDA1. The first end portion 710 and the second end portion 720 of the lower barrier layer 700 are spaced apart from each other. In addition, Fig.34 The lower barrier layer 700 has a structure including Fig.24 The stacked structure of multiple layers is described.

[0314] According to an embodiment, at least one layer of the lower barrier layer 700 includes a conductive material. For example, the second lower layer 702 or the fourth lower layer 704 in the lower barrier layer 700 may be used as a wiring. For example, a predetermined signal transmitted to the first end 710 may be received from the second end 720 by means of a conductive material layer. When a portion of the lower barrier layer 700 is broken, a signal cannot be received from the second end 720. As described above, the lower barrier layer 700 may be used to determine the occurrence of cracks that may occur during the process of manufacturing the display panel 10 or after manufacturing the display panel 10.

[0315] According to an embodiment, a portion of the lower barrier layer 700 (such as a portion between the first end portion 710 and the second end portion 720) has a Fig.34 The first portion of the lower barrier layer 700 extends along the edge of the second groove G2 to surround a portion of the second groove G2, and the second portion of the lower barrier layer 700 extends over the second groove G2 toward the center of the opening area OA by a predetermined interval. The first portion and the second portion are repeatedly arranged and have a square wave shape in a plan view.

[0316] Although the above embodiments have been described as having the lower barrier layer 700 located in the first non-display area NDA1 to cover the second groove G2, embodiments of the present disclosure are not limited thereto. In other embodiments, the lower barrier layer 700 covers the second groove G2 and the third groove G3.

[0317] Fig.35 is a cross-sectional view of a first non-display area NDA1 of a display panel 10 according to another embodiment, Fig.36 yes Fig.35 Enlarged view of portion XXXVI of FIG.

[0318] Reference Fig.35 According to an embodiment, since the lower barrier layer 700 covers the second groove G2 and the third groove G3 in the first non-display area NDA1, and other structures and characteristics except this structure are the same as those described above, the differences are mainly described below.

[0319] According to the embodiment, referring to Fig.35 The first non-display area NDA1, the second groove G2 and the third groove G3 are covered by the lower barrier layer 700. An edge 700E of the lower barrier layer 700 and the edge 100E of the substrate 100 are located on the same vertical line. The stacking structure of the lower barrier layer 700 on the second groove G2 is similar to that of the reference Fig.28 and Fig.30 The stacking structure of the lower barrier layer 700 is described to be the same.

[0320] According to an embodiment, the first inorganic encapsulation layer 310 , the second inorganic encapsulation layer 330 and the lower barrier layer 700 are sequentially formed on the third groove G3 . The second inorganic encapsulation layer 330 directly contacts the top surface of the first inorganic encapsulation layer 310 , and the lower barrier layer 700 directly contacts the top surface of the second inorganic encapsulation layer 330 .

[0321] Reference Fig.36 According to an embodiment, the depth h3 of the portion of the third groove G3 penetrating into the second base layer 103 is greater than the sum of the thicknesses of the first functional layer 222a, the second functional layer 222c, the counter electrode 223, the first inorganic encapsulation layer 310, the second inorganic encapsulation layer 330, and the lower barrier layer 700 in the vertical (z) direction (a direction perpendicular to the top surface of the substrate 100). The first and second inorganic encapsulation layers 310 and 330 and the first and third lower layers 701 and 703 may be formed by CVD or the like, and the second and fourth lower layers 702 and 704 may be formed by a process such as sputtering.

[0322] According to the embodiment, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 and the first lower layer 701 and the third lower layer 703 completely cover the inner surface of the third groove G3. On the contrary, according to the process conditions, the step coverage of the second lower layer 702 and the fourth lower layer 704 is worse than that of the inorganic insulating layer. In this case, Fig.36 As shown in FIG, the second lower layer 702 and the fourth lower layer 704 are discontinuous or very thin around the protrusion tip PT.

[0323] Fig.37 is a plan view of a portion of a display panel 10 according to another embodiment, Fig.38 is along Fig.37 The first groove G1, the second groove G2 and the third groove G3 surrounding the opening area OA are located at Fig.37 In the first non-display area NDA1, and because its specific configuration is the same as described above and the structure of the display area DA is the same, the differences are mainly described below.

[0324] Reference Fig.37 and Fig.38 According to an embodiment, at least one outer groove is provided in the second non-display area NDA2. In this regard, Fig.37 and Fig.38 The first outer groove OG1 and the second outer groove OG2 are shown. The first outer groove OG1 and the second outer groove OG2 in the second non-display area NDA2 at least partially surround the display area DA.

[0325] Reference Fig.38 In the second non-display area NDA2, according to an embodiment, the insulating layer including an organic material formed on the substrate 100 includes a valley hole VY. For example, the organic insulating layer 209 and the pixel defining layer 211 include a first valley hole 209VH and a second valley hole 211VH, respectively. In an embodiment, the insulating layer including an inorganic material located below the organic insulating layer 209 also includes a valley hole VY. Fig.38 As described above, the organic material may serve as a moisture transmission path, and since the display panel 10 has a valley structure including the first valley hole 209VH and the second valley hole 211VH, moisture penetrating in the (x) direction parallel to the top surface of the substrate 100 cannot move toward the display area DA.

[0326] According to an embodiment, the partition wall 1500 is disposed in the second non-display area NDA2 and is located in the inner side of the first outer groove OG1, that is, closer to the display area DA than the first outer groove OG1. The partition wall 1500 surrounds the display area DA. The organic encapsulation layer 320 does not extend toward the first outer groove OG1 and the second outer groove OG2 due to the partition wall 1500. Optionally, after the process of forming the organic encapsulation layer 320, the organic material part 1320M remains in the first outer groove OG1, but the organic material part 1320M of the first outer groove OG1 is separated from the edge of the organic encapsulation layer 320, and the partition wall 1500 is located between them.

[0327] According to an embodiment, each of the first and second inorganic encapsulation layers 310 and 330 extends to the outer edge 100OE of the substrate 100 and covers the second non-display area NDA2. The first and second inorganic encapsulation layers 310 and 330 contact each other in the first and second outer grooves OG1 and OG2.

[0328] According to an embodiment, the barrier layer 1700 is disposed on the second inorganic encapsulation layer 330. The barrier layer 1700 is formed during the same process as that of forming the above-described lower barrier layer 700, and has the same stack structure.

[0329] According to an embodiment, the barrier layer 1700 covers at least one outer groove (such as the first outer groove OG1), and since the stacking structure around the first outer groove OG1 is similar to the reference Fig.28 The stacked structures described are substantially the same, so repeated descriptions are omitted. In other embodiments, since the barrier layer 1700 may cover both the first outer groove OG1 and the second outer groove OG2, the edge of the barrier layer 1700 and the outer edge 100OE of the substrate 100 are located on the same vertical line.

[0330] Fig.39 is a cross-sectional view of a display panel 10 according to another embodiment, and corresponds to a cross-sectional view along Figure 6 The cross section is taken along line VII-VII'. Figure 7 In the display panel 10 described above, the planarization layer 610 is directly disposed on the thin film encapsulation layer 300 in the first non-display area NDA1. Figure 7 The planarization layer 610 is in direct contact with the top surface of the second inorganic encapsulation layer 330 in the first non-display area NDA1. Fig.39 In the display panel 10 , the lower barrier layer 700 is further disposed between the thin film encapsulation layer 300 and the planarization layer 610 , so the thin film encapsulation layer 300 is not in direct contact with the planarization layer 610 .

[0331] According to an embodiment, the lower barrier layer 700 includes an inorganic material. For example, the lower barrier layer 700 includes an inorganic insulating layer or a metal layer. In an embodiment, the lower barrier layer 700 includes some of the layers included in the input sensing layer 400 .

[0332] Reference Fig.39 According to an embodiment, the lower barrier layer 700 includes a plurality of layers including a first lower layer 701, a second lower layer 702, a third lower layer 703, and a fourth lower layer 704. The lower barrier layer 700 includes a first lower layer 701, a second lower layer 702, a third lower layer 703, and a fourth lower layer 704. FIG. 18A to FIG. 20C At least one layer included in the input sensing layer 400 described above. For example, the first lower layer 701 and the third lower layer 703 include the same materials as the first insulating layer 401 and the second insulating layer 403 of the input sensing layer 400, respectively. The first insulating layer 401 and the second insulating layer 403 include the same materials as those of the first insulating layer 401 and the second insulating layer 403 as described above. Fig.18C or Fig.19C The second lower layer 702 and the fourth lower layer 704 include the same materials as the first conductive layer 410 and the second conductive layer 420 of the input sensing layer 400, respectively. The planarization layer 610 on the lower barrier layer 700 includes the same material as the third insulating layer 405 of the input sensing layer 400. The third insulating layer 405 includes Fig.18C or Fig.19C The lower barrier layer 700 and the planarization layer 610 are formed during the same process as the process of forming the input sensing layer 400 .

[0333] According to the embodiment, although Fig.39 The planarization layer 610 and the lower barrier layer 700 are shown to have their ends spaced apart from the input sensing layer 400 by a predetermined interval, but the embodiments of the present disclosure are not limited thereto. In other embodiments, the first lower layer 701 and the third lower layer 703 of the lower barrier layer 700 are connected to the first insulating layer 401 and the second insulating layer 403 of the input sensing layer 400 as a whole. Fig.39 As shown in FIG. 6 , the second lower layer 702 and the fourth lower layer 704 of the lower barrier layer 700 are respectively separated from the first conductive layer 410 and the second conductive layer 420 of the input sensing layer 400 . The planarization layer 610 is connected to the third insulating layer 405 of the input sensing layer 400 as a whole.

[0334] According to embodiments, the multi-layer structure of the lower barrier layer 700 may be incorporated into the embodiments described below and embodiments derived therefrom. Fig.39 The lower barrier layer 700 includes four layers, but the embodiment is not limited thereto, and the lower barrier layer 700 may include one layer, two layers, three layers, or five layers or more in other embodiments. In other embodiments, when the lower barrier layer 700 includes three layers, the lower barrier layer 700 may include the same Fig. 20CThe planarization layer 610 on the lower barrier layer 700 includes the same material as the first conductive layer 410, the second insulating layer 403' and the second conductive layer 420 of the input sensing layer 400 described above. Fig. 20C The material of the third insulating layer 405' is the same material.

[0335] Fig.40 is an enlarged cross-sectional view of the structure of the lower barrier layer 700 in the second groove G2 of the display device 1 according to an embodiment, and corresponds to Fig.39 For ease of description, Fig.40 A case where the lower barrier layer 700 includes a first lower layer 701 , a second lower layer 702 , a third lower layer 703 , and a fourth lower layer 704 is shown.

[0336] Reference Fig.40 According to an embodiment, the depth of the portion of the second groove G2 penetrating into the second base layer 103 may be greater than the sum of the thicknesses of the first functional layer 222a, the second functional layer 222c, the counter electrode 223, the first inorganic encapsulation layer 310, the second inorganic encapsulation layer 330 and the lower barrier layer 700 in the vertical (z) direction (i.e., the direction perpendicular to the top surface of the substrate 100).

[0337] According to an embodiment, the lower barrier layer 700 has a stacked structure including an inorganic insulating layer and a metal layer. For example, the first lower layer 701 and the third lower layer 703 are inorganic insulating layers including silicon nitride, and the second lower layer 702 and the fourth lower layer 704 are metal layers including Al and Ti. In an embodiment, the second lower layer 702 and the fourth lower layer 704 have a multilayer structure including Ti / Al / Ti. The second inorganic encapsulation layer 330 and the first inorganic encapsulation layer 310 are disposed under the lower barrier layer 700.

[0338] According to an embodiment, the first and second inorganic encapsulating layers 310 and 330 and the first and third lower layers 701 and 703 may be formed by a process such as CVD, and the second and fourth lower layers 702 and 704 may be formed by a process such as sputtering.

[0339] Reference Fig.40 According to the embodiment, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 and the first lower layer 701 and the third lower layer 703 completely and continuously cover the inner surface of the second groove G2. On the contrary, according to the process conditions, the step coverage of the second lower layer 702 and the fourth lower layer 704 is worse than that of the inorganic insulating layer. In this case, Fig.40 As shown in FIG. 1 , the second lower layer 702 and the fourth lower layer 704 may be thin or discontinuous around the protruding tip PT of the second groove G2 .

[0340] According to the embodiment, although Fig.40 The specific structure of the lower barrier layer 700 is shown with reference to the second groove G2, but the embodiments of the present disclosure are not limited thereto. The structure of the lower barrier layer 700 in the third groove G3 may be similar to Fig.40 The structure shown in . Fig.40 The structures shown in the Fig.39 The embodiments described herein may be incorporated by reference Figure 41 to Figure 43 The embodiments described and those derived therefrom.

[0341] Figure 41 to Figure 43 is a cross-sectional view of a display panel 10 according to another embodiment, and corresponds to a cross-sectional view along Figure 6 A cross section taken along line VII-VII'.

[0342] like Fig.41 As shown in , according to an embodiment, the display panel 10 further includes at least one fourth groove G4 in the first non-display area NDA1 , and the lower barrier layer 700 directly contacts the second inorganic encapsulation layer 330 in the second groove G2 , the third groove G3 , and the fourth groove G4 .

[0343] like Fig.42 As shown in , according to an embodiment, the display panel 10 includes a planarization layer 610 having a side surface located on the same vertical line as the edge 100E of the substrate 100. In this case, moisture or the like may be introduced through the planarization layer 610, but since moisture propagating in a lateral direction through the planarization layer 610 is blocked by the multilayer structure including the lower barrier layer 700 and the second inorganic encapsulation layer 330, the moisture does not penetrate into the organic encapsulation layer 320. Therefore, damage to the display area DA due to moisture or the like can be prevented.

[0344] like Fig.43 As shown in , according to an embodiment, the display panel 10 further includes a second partition wall 500A, and the lower barrier layer 700 directly contacts the second inorganic encapsulation layer 330 in the first groove G1 , the second groove G2 , and the third groove G3 .

[0345] Although Figure 39 to Figure 43 A structure in which the top surface of the planarization layer 610 is covered by the barrier layer 620 is shown, but the barrier layer 620 may be omitted in other embodiments.

[0346] Although Figure 39 to Figure 43A structure in which the lower barrier layer 700 is disposed in the second sub non-display area SNDA2 is shown, but in other embodiments, the lower barrier layer 700 extends into the first sub non-display area SNDA1 and the display area DA in embodiments. For example, as described above, when the lower barrier layer 700 includes the first lower layer 701 and / or the third lower layer 703 as an inorganic insulating layer, these layers may extend into the first sub non-display area SNDA1 and the display area DA.

[0347] Fig.44 is a cross-sectional view of the opening area OA and the first non-display area SNDA1 of the display panel 10 according to other embodiments. Fig.44 A portion of the first non-display area NDA1 such as the second sub non-display area SNDA2 is shown, but for convenience of description, Fig.44 The display panel 10 further includes a first sub non-display area SNDA1 and a display area DA, and its structure is similar to that of the reference Figure 7 The structure described is the same.

[0348] Reference Fig.44 According to an embodiment, a plurality of grooves (such as a first groove G1, a second groove G2, and a third groove G3) are formed in the second sub non-display area SNDA2. A partition wall is provided between adjacent grooves. In this regard, Fig.44 A first partition wall 500 between the first groove G1 and the second groove G2 and a partition wall 500B (hereinafter referred to as a third partition wall 500B) between the second groove G2 and the third groove G3 are shown.

[0349] According to an embodiment, the first partition wall 500 and the third partition wall 500B include a first sub-wall portion 510 and a first sub-wall portion 510B, respectively, and include a second sub-wall portion 520 and a second sub-wall portion 520B, respectively. Each of the first sub-wall portion 510 and the first sub-wall portion 510B covers a stacking body ST, and the stacking body ST includes a patterned inorganic insulating layer (such as a gate insulating layer 203, a first interlayer insulating layer 205, and a second interlayer insulating layer 207) located under the first sub-wall portion 510 and the first sub-wall portion 510B. More specifically, the side surface of the stacking body ST is covered by the first sub-wall portion 510 and the first sub-wall portion 510B, and each of the first sub-wall portion 510 and the first sub-wall portion 510B contacts the top surface of the buffer layer 201 under the stacking body ST. The first sub-wall portion 510 and the first sub-wall portion 510B may be made of the same material as the organic insulating layer 209'. As Fig.44 As shown in FIG. 2 , the organic insulating layer 209 ′ covers the top surface and side surfaces of the stacked body ST and contacts the top surface of the buffer layer 201 .

[0350] According to an embodiment, some layers in the intermediate layer 222 (such as the first functional layer 222a and the second functional layer 222c) and the counter electrode 223 are separated by the first groove G1, the second groove G2 and the third groove G3 as described above, and the inner surfaces of the first groove G1, the second groove G2 and the third groove G3 are covered by the first inorganic encapsulation layer 310 as described above.

[0351] According to an embodiment, the organic encapsulation layer 320 covers the first groove G1, the second groove G2, and the third groove G3. For example, a first portion (hereinafter, may be referred to as an organic material layer) 320A of the organic encapsulation layer 320 covers the first groove G1 and the second groove G2. A second portion 320B of the organic encapsulation layer 320 covers the third groove G3. The organic material layer 320A covering the first groove G1 and the second groove G2 extends to the display area DA and the first sub-non-display area SNDA1, and covers the display area DA and the first sub-non-display area SNDA1. The second portion 320B of the organic encapsulation layer 320 relieves stress and can prevent floating or peeling of layers in relevant areas (such as layers including inorganic materials).

[0352] According to an embodiment, the organic encapsulation layer 320 is divided in the second sub non-display area SNDA2. For example, the first portion 320A and the second portion 320B of the organic encapsulation layer 320 are spaced apart from each other, and the third partition wall 500B is located therebetween, and the space between the first portion 320A and the second portion 320B spaced apart from each other can be regarded as a hole 320H of the organic encapsulation layer 320. Fig.44 As shown in FIG. 3 , the hole 320H is located between the second groove G2 and the third groove G3 . The second inorganic encapsulating layer 330 on the organic encapsulating layer 320 is in direct contact with the first inorganic encapsulating layer 310 through the hole 320H.

[0353] According to an embodiment, the planarization layer 610 is disposed on the second inorganic encapsulation layer 330 and covers at least one of the plurality of grooves. Fig.44 As shown in FIG. 6 , the planarization layer 610 overlaps a portion of the third groove G3 and the first and second grooves G1 and G2 , and covers a portion of the third groove G3 and the first and second grooves G1 and G2 .

[0354] According to an embodiment, the planarization layer 610 includes a hole 610-h. The hole 610-h in the planarization layer 610 overlaps the third groove G3. The hole 610-h in the planarization layer 610 has a width smaller than the width W2" of the third groove G3. However, the embodiment is not limited thereto, and in other embodiments, the hole 610-h of the planarization layer 610 may have a width equal to the width W2" of the third groove G3, or may have a width larger than the width W2" of the third groove G3. The hole 610-h of the planarization layer 610 is closer to the opening area OA than the hole 320H of the organic encapsulation layer 320. However, the embodiment is not limited thereto, and in other embodiments, the hole 610-h of the planarization layer 610 may be farther from the opening area OA than the hole 320H of the organic encapsulation layer 320. Although Fig.44 The hole 610 - h of the planarization layer 610 is shown to be spaced apart from the hole 320H of the organic encapsulation layer 320 by a predetermined interval, but the embodiments of the present disclosure are not limited thereto. In other embodiments, the hole 610 - h of the planarization layer 610 at least partially overlaps the hole 320H of the organic encapsulation layer 320 .

[0355] According to an embodiment, the barrier layer 620 is disposed on the planarization layer 610 and directly contacts the second inorganic encapsulation layer 330 through the hole 610-h in the planarization layer 610. The barrier layer 620 includes an inorganic material and may have a single-layer structure or a multi-layer structure, and its description is similar to that of reference numerals. Figure 7 The additional planarization layer 630 is further disposed on the barrier layer 620. The additional planarization layer 630 includes an organic material. For example, when the barrier layer 620 includes an inorganic insulating layer or a metal layer (such as Figure 7 When the additional planarization layer 630 includes at least one of the first insulating layer 401, the first conductive layer 410, the second insulating layer 402, and the second conductive layer 420 in the input sensing layer 400, the additional planarization layer 630 includes the same material as the third insulating layer 405 of the input sensing layer 400. In this case, the additional planarization layer 630 is connected as a whole with the third insulating layer 405 of the input sensing layer 400. That is, the additional planarization layer 630 is the third insulating layer 405 of the input sensing layer 400.

[0356] According to an embodiment, Fig.44 The structure shown in FIG. 6 surrounds the opening 10H (i.e., the opening area OA). For example, the planarization layer 610 has an annular shape surrounding the opening area OA in a plan view. In addition, the second portion 320B of the organic encapsulation layer 320 covering the third groove G3 has an annular shape surrounding the opening area OA in a plan view. Similarly, the hole 320H in the organic encapsulation layer 320 and the hole 610-h in the planarization layer 610 have an annular shape surrounding the opening area OA in a plan view.

[0357] According to an embodiment, the hole 320H in the organic encapsulation layer 320 is a region where the organic encapsulation layer 320 is not disposed over the substrate 100. Figures 7 to 43 In the described embodiment, the area between the edge 100E of the substrate 100 and the edge 320E of the organic encapsulation layer 320 can be regarded as a reference. Fig.44 Likewise, the hole 610-h in the planarization layer 610 is an area where the planarization layer 610 is not disposed over the substrate 100. Figures 7 to 43 (Apart from Fig. 22 , Fig.24 , Fig.31 , Fig.35 and Fig.42 In the cross-sectional view described in FIG. 1 , the area between the edge 100E of the substrate 100 and the second edge 610E2 of the planarization layer 610 can be considered as a hole 610 - h in the planarization layer 610 .

[0358] According to an embodiment, Fig.44 1 corresponds to a cross section of the display panel 10 in which a cutting process or a scribing process has been performed along the first line SCL1. However, the embodiments of the present disclosure are not limited thereto. In other embodiments, Fig.44 As shown in FIG. 1 , during the process of manufacturing the display panel 10, the area extending from the first line SCL1 to the n-th line SCLn is the cutting area CA. That is, the cutting process or the scribing process is performed along one of the first line SCL1 to the n-th line SCLn, and the cross-sectional structure corresponding thereto corresponds to the structure of the display panel 10 according to the embodiment.

[0359] Fig.45 is a cross-sectional view of the opening area OA and the first non-display area NDA1 of the display panel 10 according to other embodiments, Fig.46A and Fig.46B yes Fig.45 An enlarged view of the third groove G3.

[0360] According to an embodiment, Fig.45 The display panel 10 and the reference Fig.44 The display panel 10 described above is different in that the second portion 320B of the organic encapsulation layer 320 is above the third groove G3. Fig.45 As shown in FIG. 1 , the second portion 320B of the organic encapsulation layer 320 is disposed above the third groove G3 and covers a portion of the third groove G3. The second portion 320B of the organic encapsulation layer 320 is disposed above the protruding tip PT (such as Fig.45For example, the second portion 320B of the organic encapsulation layer 320 includes a first-second portion 320B1 disposed in the upper portion of the third groove G3 and a second-second portion 320B2 disposed inside the third groove G3 and under the protruding tip PT of the third groove G3.

[0361] Reference Fig.46A According to an embodiment, the second-second portion 320B2 is located inside the third groove G3 and covers the intermediate layer 222 (ie, the first functional layer 222a and the second functional layer 222c) and the counter electrode 223 disposed on the bottom surface of the third groove G3. However, in other embodiments, referring to Fig.46B , the second-second portion 320B2 is disposed inside the third groove G3 and is located under the pair of protruding tips PT. The thickness of the portion of the second-second portion 320B2 at the central portion of the third groove G3 is very thin or does not exist.

[0362] According to an embodiment, Fig.45 corresponds to a cross section of the display panel 10 on which a cutting process or a scribing process has been performed along the first line SCL1. Fig.45 , an area extending from the first line SCL1 to the n-th line SCLn is a cutting area CA during a process of manufacturing the display panel 10. Therefore, a cross-sectional structure on which a cutting process or a scribing process has been performed along one of the first to n-th lines SCL1 to SCLn corresponds to the structure of the display panel 10 according to the embodiment.

[0363] Fig.47 is a cross-sectional view of the opening area OA and the first non-display area NDA1 of the display panel 10 according to other embodiments.

[0364] Reference Fig.47 According to the embodiment, the organic encapsulation layer 320 above the first groove G1, the second groove G2 and the third groove G3 is similar to the reference Figures 45 to 46B The organic encapsulation layer 320 is the same as described above. Fig.44 and Fig.45 The display panel 10, Fig.47 The planarization layer 610 of the display panel 10 does not include the hole 610-h. For example, Fig.47 The planarization layer 610 completely covers the second sub non-display area SNDA2. The barrier layer 620 does not directly contact the second inorganic encapsulation layer 330.

[0365] According to an embodiment, Fig.47Corresponds to a cross section of the display panel 10 on which a cutting process or a scribing process has been performed along the first line SCL1. In other embodiments, a cross-sectional structure on which a cutting process or a scribing process has been performed along one of the first to n-th lines SCL1 to SCLn in the cutting area CA also corresponds to a structure of the display panel 10 according to an embodiment.

[0366] Fig.48 is a cross-sectional view of the opening area OA and the first non-display area NDA1 of the display panel 10 according to other embodiments.

[0367] Reference Fig.48 According to an embodiment, a plurality of third grooves G3' are formed between the opening area OA and the second groove G2. The width of each third groove G3' is substantially equal to or smaller than the width of the first groove G1 or the second groove G2.

[0368] According to an embodiment, the planarization layer 610 is disposed over the second groove G2 and the third groove G3 ′, and the inner spaces of the second groove G2 and the third groove G3 ′ over the second inorganic encapsulation layer 330 are filled with the planarization layer 610 . Fig.48 The arrangement of the plurality of third grooves G3' shown in FIG. Figure 7 to Figure 47 The embodiments described and those derived therefrom.

[0369] According to an embodiment, Fig.48 The cross-sectional structure corresponds to the cross-sectional structure of the display panel 10 on which the cutting process or the scribing process has been performed along the first line SCL1. In other embodiments, the cutting process or the scribing process may be performed along one of the first to n-th lines SCL1 to SCLn in the cutting area CA, and the cross-sectional structure corresponding thereto corresponds to the structure of the display panel 10 according to the embodiment.

[0370] The embodiments of the present disclosure are not limited to Fig.48 In other embodiments, more than Fig.48 The third groove G3' is shown in the figure. In addition, Fig.48 The structure of the plurality of third grooves G3' described in the reference Figures 7 to 48 The embodiments described and those derived therefrom.

[0371] According to an embodiment, since the organic material layer (such as at least one of the organic encapsulation layer 320, the planarization layer 610, and the additional planarization layer 630) is disposed on Fig.44 , Fig.45 , Fig.47 and Fig.48In the cutting area CA shown in FIG. 1 , stress can be relieved and the floating phenomenon of the inorganic layer can be prevented or minimized, unlike the case where the above-mentioned organic material layer is not provided.

[0372] According to an embodiment, Fig.44 , Fig.45 , Fig.47 and Fig.48 The first partition wall 500 and the third partition wall 500B shown in FIG. 5 may be incorporated into the reference Figures 7 to 43 In the embodiment of the display panel 10 described above, Fig.44 , Fig.45 , Fig.47 and Fig.48 The additional planarization layer 630 shown in FIG. 6 may be incorporated into the reference Figures 7 to 43 The embodiments described and those derived therefrom.

[0373] Fig.49A and Fig.49B are cross-sectional views of a display panel 10 according to an embodiment, respectively, Fig.50 yes Fig.49A and Fig.49B An enlarged cross-sectional view of portion "A" of FIG.

[0374] Reference Fig.49A According to an embodiment, the display panel 10 includes an opening 10H corresponding to the opening area OA. The opening 10H of the display panel 10 corresponds to a hole or a through hole penetrating the display panel 10. The pixel circuit PC and the display element layer 200 are arranged in the display area DA, the pixel circuit PC is arranged above the substrate 100, and the display element layer 200 including the organic light emitting diode OLED is connected to the pixel circuit PC. Figure 7 As described, the organic light emitting diode OLED includes a pixel electrode 221 , an intermediate layer 222 , and a counter electrode 223 which are sequentially stacked.

[0375] According to an embodiment, the substrate 100 has a multilayer structure. For example, the substrate 100 includes a first base layer 101, a first inorganic layer 102, a second base layer 103, and a second inorganic layer 104 stacked in sequence. The polymer resin included in the first base layer 101 and the second base layer 103 and the inorganic insulating material included in the first inorganic layer 102 and the second inorganic layer 104 are the same as those described above.

[0376] According to an embodiment, the pixel circuit PC is disposed above the substrate 100 and includes a thin film transistor TFT and a storage capacitor Cst. The display element layer 200 includes a display element disposed in a plurality of pixels P. The display element layer 200 includes a pixel electrode 221, an intermediate layer 222 on the pixel electrode 221, and a counter electrode 223, each of which is disposed in each of the plurality of pixels P. Each display element emits one of red light, green light, and blue light. The display element layer 200 is covered by a thin film encapsulation layer 300. Due to the specific characteristics of the elements disposed in the display area DA and the reference Figure 7 The specific characteristics of the described elements are the same, so their repeated description is omitted.

[0377] Reference Fig.49A According to an embodiment, the first non-display area NDA1 includes a first sub non-display area SNDA1 and a second sub non-display area SNDA2, the first sub non-display area SNDA1 is adjacent to the display area DA, and the second sub non-display area SNDA2 is adjacent to the opening area OA or the opening 10H. The first sub non-display area SNDA1 includes an area such as a bypass area, a signal line (such as a reference Figure 5 The data line DL or the scan line SL described above extends through the area. The width of the first sub non-display area SNDA1 may be smaller than, equal to, or larger than the width of the second sub non-display area SNDA2.

[0378] like Fig.49A As shown in , according to an embodiment, the data lines DL are alternately arranged with an insulating layer between them. When adjacent data lines DL are arranged above and below an insulating layer (such as the second interlayer insulating layer 207) between them, the gap (spacing) between the adjacent data lines DL can be reduced, and thus the width of the first non-display area NDA1 can be reduced. In another embodiment, the data lines DL are arranged on the same insulating layer (such as the second interlayer insulating layer 207).

[0379] According to an embodiment, the second sub non-display area SNDA2 is a groove area in which a groove is formed. Fig.49A Five grooves formed in the second sub non-display area SNDA2 are shown, but the embodiment is not limited thereto and the number of grooves may vary.

[0380] According to an embodiment, each groove G (see Fig.50 ) is formed in a plurality of layers, the plurality of layers including a first layer and a second layer including different materials, respectively. For example, the first layer includes a polymer resin layer, and the second layer includes an inorganic insulating layer. In an embodiment, Fig.49A It is shown that the groove G is formed in a sub-layer disposed in the substrate 100 , such as the second base layer 103 and the second inorganic layer 104 of the substrate 100 .

[0381] According to the embodiment, the specific structure of the groove G is the same as that of the above reference Fig. 9 or Fig.10 The specific structure described is the same. For example, as referenced Fig. 9 As described and Fig.50 As shown in , the depth h of the groove G is less than the thickness t of the second base layer 103, and the groove G includes a hole H2 formed in the second inorganic layer 104 and a recess R1 formed in the second base layer 103. In another embodiment, as shown in FIG. Fig.10 As described, the depth h of the groove G is substantially the same as the thickness t of the second base layer 103 , and the groove G includes a hole formed in the second inorganic layer 104 and a hole formed in the second base layer 103 .

[0382] like Fig.50 As shown in , according to an embodiment, the side surface of the second inorganic layer 104 defining the hole H2 further protrudes toward the center of the groove G than the side surface of the second base layer 103 defining the recess R1 or the hole. The side portion of the second inorganic layer 104 protruding toward the center of the groove G constitutes a pair of protruding tips PT. In addition to the second inorganic layer 104, the buffer layer 201 is patterned to constitute a pair of protruding tips PT. The groove G has an undercut profile in which the width W1 of the recess R1 or the hole of the second base layer 103 is greater than the width W2 of the hole H2 of the second inorganic layer 104. The length of each protruding tip in the pair of protruding tips PT is Less than 2.0 μm. In an embodiment, the length The range is about 1.0 μm to about 1.8 μm.

[0383] According to an embodiment, the groove G is formed before forming at least one organic material layer (such as the intermediate layer 222) of the organic light emitting diode OLED. Fig.50 The first functional layer 222a or the second functional layer 222c shown in FIG. 1 is disconnected by the groove G in the first non-display area NDA1. Likewise, the counter electrode 223 is disconnected by the groove G. A capping layer 230 including LiF is disposed on the counter electrode 223. Like the first functional layer 222a, the second functional layer 222c, and the counter electrode 223, the capping layer 230 includes a common layer formed over the entire surface of the substrate 100 and disconnected by the groove G. In another embodiment, the capping layer 230 is omitted.

[0384] According to an embodiment, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 cover the organic light emitting diode OLED and extend into the first non-display area NDA1. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may be formed by CVD or the like and have improved step coverage compared to the first functional layer 222a, the second functional layer 222c and the counter electrode 223. For example, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 are sequentially formed to have a relatively uniform thickness or minimize thickness deviation compared to the first functional layer 222a, the second functional layer 222c and the counter electrode 223. Therefore, each of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may be continuously formed without being disconnected by the groove G. The first inorganic encapsulation layer 310 covers the inner surface of the groove G. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 have different thicknesses. For example, the first inorganic encapsulation layer 310 has a thickness of about 1 μm, and the second inorganic encapsulation layer 330 has a thickness of about 0.7 μm. That is, the thickness of the first inorganic encapsulation layer 310 is greater than the thickness of the second inorganic encapsulation layer 330. Alternatively, the thickness of the first inorganic encapsulation layer 310 and the thickness of the second inorganic encapsulation layer 330 may be the same, or the thickness of the first inorganic encapsulation layer 310 may be less than the thickness of the second inorganic encapsulation layer 330.

[0385] According to an embodiment, the organic encapsulation layer 320 covers the display area DA, and the edge 320E is located on one side of the partition wall 500. The organic encapsulation layer 320 includes a polymer formed by coating a monomer and hardening the monomer. The monomer flow can be controlled by the partition wall 500, and the thickness of the organic encapsulation layer 320 can be controlled by the partition wall 500. Optionally, the organic encapsulation layer 320 can be formed by coating a polymer. The edge 320E of the organic encapsulation layer 320 is spaced apart from the opening 10H. Since the area where the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 are in direct contact with each other is located between the opening 10H and the organic encapsulation layer 320, moisture can be prevented from penetrating into the display area DA through the opening 10H through the organic encapsulation layer 320.

[0386] According to an embodiment, an organic material layer 320A is disposed in a portion of the first non-display area NDA1 adjacent to the opening 10H. The organic material layer 320A is spaced apart from the organic encapsulation layer 320 by a predetermined distance. The organic material layer 320A is formed during a process of forming the organic encapsulation layer 320, and includes the same material as the material of the organic encapsulation layer 320. When the organic encapsulation layer 320 is formed by hardening the monomer, similar to controlling the flow of the monomer by using the partition wall 500, the material constituting the organic material layer 320A can be controlled by using the partition wall 500C (hereinafter, referred to as the fourth partition wall 500C), and the edge 320AE of the organic material layer 320A is located on one side of the fourth partition wall 500C. As described above, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 are in contact with each other in the first non-display area NDA1. When the contact area of ​​the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 is equal to or greater than a specific value, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 or an adjacent layer (such as a planarization layer 610) may float due to the stress on the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330. On the contrary, in an embodiment, when the organic material layer 320A is provided, the contact area of ​​the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may be slightly reduced, so the floating problem may be prevented or minimized. When the organic material layer 320A is spaced apart from the organic encapsulation layer 320, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 contact each other between the edge 320E of the organic encapsulation layer 320 and the edge 320AE of the organic material layer 320A.

[0387] According to an embodiment, the planarization layer 610 is disposed in the first non-display area NDA1. The planarization layer 610 is disposed in an area adjacent to the opening area OA. For example, the planarization layer 610 is disposed only in the first non-display area NDA1. The planarization layer 610 includes an organic insulating layer. The planarization layer 610 includes a polymer material. For example, the planarization layer 610 may include a silicone resin, an acrylic resin, an epoxy resin, polyimide or polyethylene, etc. The polymer material is transparent. In an embodiment, the planarization layer 610 includes a material different from that of the organic encapsulation layer 320. For example, one of the organic encapsulation layer 320 and the planarization layer 610 includes a silicone resin, and the other includes an acrylic resin. In another embodiment, the organic encapsulation layer 320 and the planarization layer 610 include the same material.

[0388] According to an embodiment, the planarization layer 610 covers at least one groove G formed in the first non-display area NDA1. The planarization layer 610 increases the flatness of the display panel 10 around the opening area OA by covering the area of ​​the first non-display area NDA1 that is not covered by the organic encapsulation layer 320. Therefore, the input sensing layer 400 (see FIG. 1 ) disposed on the thin film encapsulation layer 300 can be prevented from being Figure 2A ). A portion of the planarization layer 610 overlaps a portion of the organic encapsulation layer 320. A first edge 610E1 of the planarization layer 610 adjacent to the display area DA is located above the organic encapsulation layer 320, and a second edge 610E2 opposite to the first edge 610E1 is located on the same vertical line as an edge 100E of the substrate 100 defining the opening 10H of the display panel 10 or the first opening 100H of the substrate 100.

[0389] According to an embodiment, Fig.49A The area from the first line SCL1 to the nth line SCLn in the display panel 10 includes an area on which a cutting process or a scribing process of a process for manufacturing the display panel 10 is performed. For example, the area from the first line SCL1 to the nth line SCLn includes a cutting area CA through which a laser may pass. The cutting process or the scribing process may be performed along one of the first line SCL1 to the nth line SCLn, and the corresponding cross-sectional structure corresponds to the structure of the display device 1 according to the embodiment. In this regard, Fig.49A 1 shows a cross-sectional structure of the display panel 10 on which a cutting process or a scribing process has been performed along the first line SCL1, Fig.49B A cross-sectional structure of the display panel 10 on which a cutting process or a scribing process has been performed along an n-th line SCLn is shown.

[0390] According to an embodiment, barrier layers 605 and 620' are respectively disposed under and over planarization layer 610. Hereinafter, for ease of description, the barrier layer under planarization layer 610 is referred to as first barrier layer 605, and the barrier layer over planarization layer 610 is referred to as second barrier layer 620'.

[0391] According to an embodiment, the planarization layer 610 is formed in the first non-display area NDA1 by an exposure process and a development process, etc. When external foreign matter (such as moisture) propagates in a lateral direction parallel to the xy plane of the display panel 10 during some processes (such as a cleaning process) of forming the planarization layer 610, the organic light emitting diode OLED of the display area DA may be damaged. On the contrary, according to an embodiment, since the first barrier layer 605 and the second barrier layer 620', which are inorganic insulating layers, are respectively arranged under and on the planarization layer 610, moisture penetration or floating of adjacent layers may be prevented during or after the process of forming the planarization layer 610. The first barrier layer 605 and the second barrier layer 620' are in direct contact with the planarization layer 610. According to an embodiment, the first barrier layer 605 and the second barrier layer 620' may contact each other around the first edge 610E1 of the planarization layer 610, and the first edge 610E1 of the planarization layer 610 is adjacent to the display area DA.

[0392] According to an embodiment, each of the first barrier layer 605 and the second barrier layer 620′ includes an inorganic insulating material such as silicon oxide (SiO x ), silicon nitride (SiN x ) or silicon oxynitride (SiON), and may have a single-layer structure or a multi-layer structure. The first barrier layer 605 and the second barrier layer 620' may include the same material or different materials.

[0393] According to an embodiment, the first barrier layer 605 is in direct contact with the thin film encapsulation layer 300 (such as the second inorganic encapsulation layer 330) disposed thereunder. The first barrier layer 605 may include the same material as that of the second inorganic encapsulation layer 330, or may include a material different from that of the second inorganic encapsulation layer 330. Even if the first barrier layer 605 and the second inorganic encapsulation layer 330 include the same material such as silicon nitride, a specific composition ratio (such as a content ratio of silicon and nitrogen) may be different, and the interface between the first barrier layer 605 and the second inorganic encapsulation layer 330 may be visually identified on a cross-sectional image. The thickness of the first barrier layer 605 is less than that of the second inorganic encapsulation layer 330. Alternatively, the thickness of the first barrier layer 605 may be the same as that of the second inorganic encapsulation layer 330, or the thickness of the first barrier layer 605 may be greater than that of the second inorganic encapsulation layer 330.

[0394] According to an embodiment, the thickness of the second barrier layer 620 ′ is greater than the thickness of the first barrier layer 605 . Alternatively, the thickness of the second barrier layer 620 ′ may be less than or equal to the thickness of the first barrier layer 605 .

[0395] According to an embodiment, an additional barrier layer (hereinafter, referred to as a third barrier layer) 625 is disposed on the second barrier layer 620', and an additional planarization layer 630 is disposed on the third barrier layer 625. The third barrier layer 625 includes an inorganic insulating material. The additional planarization layer 630 includes an organic insulating material.

[0396] According to an embodiment, the first barrier layer 605, the second barrier layer 620', the third barrier layer 625, and the additional planarization layer 630 are formed over the entire surface of the substrate 100. For example, each of the first barrier layer 605, the second barrier layer 620', the third barrier layer 625, and the additional planarization layer 630 is integrally formed with the insulating layer included in the input sensing layer 400.

[0397] For example, according to an embodiment, the input sensing layer 400 includes a first insulating layer 401, a first conductive layer 410, a second insulating layer 403, a second conductive layer 420, and a third insulating layer 405. The first insulating layer 401 includes a first sub-insulating layer 401a and a second sub-insulating layer 401b. The first barrier layer 605 is formed integrally with the first sub-insulating layer 401a, the second barrier layer 620' is formed integrally with the second sub-insulating layer 401b, the third barrier layer 625 is formed integrally with the second insulating layer 403, and the additional planarization layer 630 is formed integrally with the third insulating layer 405. In other words, the insulating layers included in the input sensing layer 400 are respectively disposed on and below the planarization layer 610.

[0398] According to an embodiment, a scribing process or a cutting process is performed after forming the input sensing layer 400. Therefore, the fourth opening 400H of the input sensing layer 400 is formed simultaneously with the opening 10H of the display panel 10, and has a shape and size substantially the same as those of the opening 10H. Like the second edge 610E2 of the planarization layer 610, each of the edge 605E of the first barrier layer 605, the edge 620'E of the second barrier layer 620', the edge 625E of the third barrier layer 625, and the edge 630E of the additional planarization layer 630 adjacent to the opening area OA or the opening 10H of the display panel 10 is located on the same vertical line as the edge 100E of the substrate 100 defining the first opening 100H of the substrate 100.

[0399] Fig.51 is a plan view of a display panel 10 ′ according to another embodiment, Fig.52 yes Fig.51 An enlarged plan view of the opening area OA.

[0400] Reference Fig.51 and Fig.52According to an embodiment, the opening area OA of the display panel 10' is partially surrounded by the display area DA. The pixels P are horizontally spaced around the opening area OA. The scan line SL transmitting the scan signal to the pixels P on the left side of the opening area OA and the pixels P on the right side of the opening area OA bypasses the opening area OA in the first non-display area NDA1.

[0401] According to an embodiment, the opening area OA is surrounded by the first groove G1, the second groove G2, and the third groove G3, and at least one outer groove is provided in the second non-display area NDA2. In this regard, Fig.52 It is shown that the first outer groove OG1 and the second outer groove OG2 are disposed in the second non-display area NDA2.

[0402] According to an embodiment, at least one of the grooves surrounding the opening area OA is connected to the outer groove. Fig.52 As shown in FIG. 1 , one of the grooves surrounding the opening area OA, such as the first groove G1, is connected to the first outer groove OG1 disposed in the second non-display area NDA2. However, in other embodiments, the grooves surrounding the opening area OA are spaced apart from each other without being connected to the outer groove.

[0403] According to the embodiment, since the structure of the first non-display area NDA1 is similar to that of the reference Figures 7 to 49B The structures of the described embodiment and the embodiments derived therefrom are the same, so their repeated descriptions are omitted.

[0404] Fig.53 is a plan view of a display panel 10" according to another embodiment, Fig.54 yes Fig.53 An enlarged plan view of the opening area OA.

[0405] Reference Fig.53 and Fig.54 According to an embodiment, the opening area OA of the display panel 10 ″ is partially surrounded by the display area DA. The pixels P are vertically spaced around the opening area OA. The data line DL transmitting the data signal to the pixel P above the opening area OA and the pixel P below the opening area OA bypasses the opening area OA in the first non-display area NDA1.

[0406] According to an embodiment, the opening area OA is surrounded by the first groove G1, the second groove G2, and the third groove G3, and at least one outer groove is located in the second non-display area NDA2. In this regard, Fig.54 It is shown that the first outer groove OG1 and the second outer groove OG2 are disposed in the second non-display area NDA2.

[0407] According to an embodiment, at least one of the grooves surrounding the opening area OA is connected to the outer groove. Fig.54As shown in FIG. 1 , one of the grooves surrounding the opening area OA, such as the first groove G1, is connected to the first outer groove OG1 disposed in the second non-display area NDA2. However, in other embodiments, the grooves surrounding the opening area OA are spaced apart from each other without being connected to the outer groove.

[0408] According to the embodiment, since the structure of the first non-display area NDA1 is similar to that of the reference Figures 7 to 49B The structures of the described embodiment and the embodiments derived therefrom are the same, so their repeated descriptions are omitted.

[0409] The display device according to the embodiment can prevent the penetration of moisture or the like (penetration toward the display element) by providing a groove in the non-display area, and can prevent or minimize the floating of the layer or the occurrence of cracks around the groove by providing an insulating layer (such as a portion of an organic encapsulation layer, a planarization layer, and / or a lower barrier layer) in the groove. Therefore, damage to the display element due to moisture or the like penetrating through the crack can be prevented.

[0410] Although the disclosed embodiments have been described with reference to the exemplary embodiments shown in the drawings, these are provided by way of example only and it will be understood by those skilled in the art that various changes in form and details and their equivalents may be made therein without departing from the spirit and scope of the disclosed embodiments as defined by the claims.

Claims

1. A display device, comprising: A substrate comprising an opening, a display area surrounding the opening, and a non-display area between the opening and the display area; A plurality of light emitting diodes are arranged in the display area; an encapsulation layer covering the plurality of light-emitting diodes, the encapsulation layer comprising a first inorganic encapsulation layer, an organic encapsulation layer on the first inorganic encapsulation layer, and a second inorganic encapsulation layer on the organic encapsulation layer; a planarization layer, located above the encapsulation layer in the non-display area; an input sensing layer, comprising an insulating layer and a plurality of touch electrodes, wherein a portion of the insulating layer of the input sensing layer overlaps the planarization layer in the non-display area; and a camera, beneath the substrate, wherein a portion of the planarization layer overlaps a portion of the organic encapsulation layer in the non-display area, and Wherein, the camera overlaps with the opening in a plan view.

2. The display device according to claim 1, further comprising: A partition wall is disposed in the non-display area. A portion of the second inorganic encapsulation layer is in direct contact with a portion of the first inorganic encapsulation layer on the partition wall.

3. The display device according to claim 1, further comprising: a plurality of grooves arranged in the non-display area to be spaced apart from each other, each of the plurality of grooves surrounding the opening, wherein at least one of the plurality of grooves comprises: a pair of tips with a gap, each tip protruding toward each other; and a recess below the pair of tips, the recess overlapping the gap between the pair of tips, wherein the width of the gap between the pair of tips is smaller than the width of the upper portion of the recess, wherein the first inorganic encapsulation layer covers the bottom surfaces of the pair of tips and the inner surface of the recess, and The second inorganic encapsulating layer is in direct contact with the first inorganic encapsulating layer below the pair of pointed tips.

4. The display device according to claim 3, wherein: The plurality of grooves include a first groove having a width different from a width of the second groove and a second groove between the first groove and the opening.

5. A display device, comprising: A substrate comprising an opening, a display area surrounding the opening, and a non-display area between the opening and the display area; A plurality of light emitting diodes are arranged in the display area; an encapsulation layer covering the plurality of light-emitting diodes, the encapsulation layer comprising a first inorganic encapsulation layer, an organic encapsulation layer on the first inorganic encapsulation layer, and a second inorganic encapsulation layer on the organic encapsulation layer; a planarization layer, disposed on the encapsulation layer in the non-display area; an input sensing layer, comprising an insulating layer and a plurality of touch electrodes, wherein a portion of the insulating layer of the input sensing layer overlaps the planarization layer in the non-display area; and A camera, in said opening, wherein a portion of the planarization layer overlaps a portion of the organic encapsulation layer in the non-display area, Wherein, the camera overlaps with the opening in a side view.

6. The display device according to claim 5, further comprising: A partition wall is disposed in the non-display area. A portion of the second inorganic encapsulation layer is in direct contact with a portion of the first inorganic encapsulation layer on the partition wall.

7. The display device according to claim 5, further comprising: a plurality of grooves arranged in the non-display area to be spaced apart from each other, each of the plurality of grooves surrounding the opening, wherein at least one of the plurality of grooves comprises: a pair of tips with a gap, each tip protruding toward each other; and a recess below the pair of tips, the recess overlapping the gap between the pair of tips, wherein the width of the gap between the pair of tips is smaller than the width of the upper portion of the recess, and wherein the first inorganic encapsulation layer covers the bottom surfaces of the pair of tips and the inner surface of the recess, and The second inorganic encapsulating layer is in direct contact with the first inorganic encapsulating layer below the pair of pointed tips.

8. The display device according to claim 7, wherein: The plurality of grooves include a first groove having a width different from a width of the second groove and a second groove between the first groove and the opening.

9. A display device, comprising: A substrate comprising an opening, a display area surrounding the opening, and a non-display area between the opening and the display area; A plurality of light emitting diodes are arranged in the display area; an encapsulation layer covering the plurality of light-emitting diodes, the encapsulation layer comprising a first inorganic layer, a first organic layer on the first inorganic layer, and a second inorganic layer on the first organic layer; a second organic layer located above the encapsulation layer in the non-display area; an input sensing layer, comprising an insulating layer and a plurality of touch electrodes, wherein a portion of the insulating layer of the input sensing layer overlaps the second organic layer in the non-display area; and a camera, beneath the substrate, wherein a portion of the second organic layer overlaps a portion of the first organic layer in the non-display area, and Wherein, the camera overlaps with the opening in a plan view.

10. The display device according to claim 9, further comprising: A partition wall is disposed in the non-display area. A portion of the second inorganic layer of the encapsulation layer is in direct contact with a portion of the first inorganic layer of the encapsulation layer on the partition wall.

11. The display device according to claim 9, further comprising: A plurality of pointed tips are arranged to be spaced apart from each other in the non-display area, each of the plurality of pointed tips surrounding the opening.

12. A display device, comprising: A substrate comprising an opening, a display area surrounding the opening, and a non-display area between the opening and the display area; A plurality of light emitting diodes are arranged in the display area; an encapsulation layer covering the plurality of light-emitting diodes, the encapsulation layer comprising a first inorganic layer, a first organic layer on the first inorganic layer, and a second inorganic layer on the first organic layer; a second organic layer located above the encapsulation layer in the non-display area; A partition wall is arranged in the non-display area; a plurality of pointed tips arranged to be spaced apart from each other in the non-display area, each of the plurality of pointed tips surrounding the opening; an input sensing layer, comprising an insulating layer and a plurality of touch electrodes, wherein a portion of the insulating layer of the input sensing layer overlaps the second organic layer in the non-display area; and a camera, beneath the substrate, wherein at least one of the plurality of tips is adjacent to the partition wall, wherein a portion of the second organic layer overlaps a portion of the first organic layer in the non-display area, and Wherein, the camera overlaps with the opening in a plan view.

13. A display device, comprising: A substrate comprising an opening, a display area surrounding the opening, and a non-display area between the opening and the display area; A plurality of light emitting diodes are arranged in the display area; an encapsulation layer covering the plurality of light-emitting diodes, the encapsulation layer comprising a first inorganic layer, a first organic layer on the first inorganic layer, and a second inorganic layer on the first organic layer, a second organic layer located above the encapsulation layer in the non-display area; A partition wall is arranged in the non-display area; a plurality of pointed tips arranged to be spaced apart from each other in the non-display area, each of the plurality of pointed tips surrounding the opening; An input sensing layer, comprising an insulating layer and a plurality of touch electrodes on the packaging layer; as well as a camera, beneath the substrate, wherein at least one of the plurality of tips is adjacent to the partition wall, wherein a portion of the second organic layer overlaps a portion of the first organic layer in the non-display area, and Wherein, the camera overlaps with the opening in a plan view.

14. A display panel, comprising: A substrate comprising an opening, a display area surrounding the opening, and a non-display area between the opening and the display area; A plurality of light emitting diodes are arranged in the display area; an encapsulation layer covering the plurality of light-emitting diodes, the encapsulation layer comprising a first inorganic layer, a first organic layer on the first inorganic layer, and a second inorganic layer on the first organic layer; a second organic layer located above the encapsulation layer in the non-display area; A partition wall is arranged in the non-display area; a plurality of pointed tips arranged to be spaced apart from each other in the non-display area, each of the plurality of pointed tips surrounding the opening; as well as an input sensing layer, comprising an insulating layer and a plurality of touch electrodes, wherein a portion of the insulating layer of the input sensing layer overlaps the second organic layer in the non-display area, wherein at least one of the plurality of tips is adjacent to the partition wall, Wherein, a portion of the second organic layer overlaps a portion of the first organic layer in the non-display area.

15. A display panel, comprising: A substrate comprising an opening, a display area surrounding the opening, and a non-display area between the opening and the display area; A plurality of light emitting diodes are arranged in the display area; an encapsulation layer covering the plurality of light-emitting diodes, the encapsulation layer comprising a first inorganic layer, a first organic layer on the first inorganic layer, and a second inorganic layer on the first organic layer; a second organic layer located above the encapsulation layer in the non-display area; A partition wall is arranged in the non-display area; a plurality of pointed tips arranged to be spaced apart from each other in the non-display area, each of the plurality of pointed tips surrounding the opening; as well as an input sensing layer, comprising an insulating layer and a plurality of touch electrodes on the packaging layer, wherein at least one of the plurality of tips is adjacent to the partition wall, Wherein, a portion of the second organic layer overlaps a portion of the first organic layer in the non-display area.

16. A display panel, comprising: A substrate comprising an opening, a display area surrounding the opening, and a non-display area between the opening and the display area; A plurality of light emitting diodes are arranged in the display area; an encapsulation layer covering the plurality of light-emitting diodes, the encapsulation layer comprising a first inorganic layer, a first organic layer on the first inorganic layer, and a second inorganic layer on the first organic layer; a second organic layer located above the encapsulation layer in the non-display area; A partition wall is arranged in the non-display area; a plurality of pointed tips arranged to be spaced apart from each other in the non-display area, each of the plurality of pointed tips surrounding the opening; as well as an input sensing layer, comprising an insulating layer and a plurality of touch electrodes on the encapsulation layer, wherein at least one of the plurality of tips is disposed between the display area and the partition wall, Wherein, a portion of the second organic layer overlaps a portion of the first organic layer in the non-display area.

17. A display device, comprising: A substrate comprising an opening, a display area surrounding the opening, and a non-display area between the opening and the display area; A plurality of light emitting diodes are arranged in the display area; an encapsulation layer covering the plurality of light-emitting diodes, the encapsulation layer comprising a first inorganic layer, a first organic layer on the first inorganic layer, and a second inorganic layer on the first organic layer; a second organic layer located above the encapsulation layer in the non-display area; A partition wall is arranged in the non-display area; a plurality of pointed tips arranged to be spaced apart from each other in the non-display area, each of the plurality of pointed tips surrounding the opening; An input sensing layer, comprising an insulating layer and a plurality of touch electrodes on the packaging layer; as well as a camera, beneath the substrate, wherein at least one of the plurality of tips is disposed between the display area and the partition wall, Wherein, a portion of the second organic layer overlaps a portion of the first organic layer in the non-display area.

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