Atomizing core, atomizer and electronic atomizing device

Abstract

The invention relates to the technical field of atomizers, in particular to an atomizing core, an atomizer and an electronic atomizing device. The atomizing core provided by the invention comprises a base body, an electrode and a heating element, and the base body comprises an atomizing surface and a liquid absorbing surface opposite to the atomizing surface; the base body is provided with a liquid guide area and a non-liquid guide area adjacent to the liquid guide area; the liquid guide area is provided with a plurality of through holes penetrating through the atomization face and the liquid suction face. The electrode is arranged on the atomizing surface and is positioned in the non-liquid guide area of the base body; and the heating element is arranged in the liquid guide area of the base body and is electrically connected with the electrode. Contact between the electrode and an atomizing medium can be reduced as much as possible, the electrochemical corrosion risk is reduced, the resistance stability of the atomizing core is improved, and the wet burning life of the atomizing core is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of atomizers, and in particular to an atomizer core, an atomizer and an electronic atomization device. Background Art

[0002] In new electronic atomization components, thin-film heating films are often used to replace traditional thick films. The advantages of thin-film heating films are good material consistency, thin film thickness, and they will not fill the micropores on the heating surface of the porous substrate, which will not affect the transmission speed of the e-liquid and can achieve higher atomization efficiency. Since thin-film heating film materials are usually made of high-temperature resistant and antioxidant materials, their resistivity is relatively high, so it is necessary to prepare an electrode layer at the pin to reduce the resistance heating at the pin and reduce the contact resistance between the ejector pin and the heating film. In existing electronic atomization components, the atomization core is Figure 1 As shown, a heating film is covered on a porous substrate, an electrode layer is covered on the surface of the heating film layer, and part of the electrode layer is in contact with the e-liquid. The operating temperature of the electronic atomization component can reach about 300°C, so the temperature of the pin electrode layer close to the heating area can also reach 150-200°C. Since this area is also in contact with the atomization medium, in some highly corrosive e-liquids (such as mango ice), high-temperature electrochemical corrosion will occur in the electrode layer in this area after long-term operation. The increase in the area of ​​the heating area will cause a rapid increase in the resistance value of the electronic atomization component, affecting the resistance stability and increasing the risk of atomization core failure. Summary of the invention

[0003] The purpose of the present invention is to overcome the defect in the prior art that the electrode layer of the atomization component is prone to high-temperature electrochemical corrosion, which leads to a rapid increase in the resistance value of the electronic atomization component and affects the resistance stability, and further provide an atomization core, an atomizer and an electronic atomization device.

[0004] In order to achieve the above object, the present invention adopts the following technical scheme:

[0005] The present invention provides an atomizer core, the atomizer core comprising:

[0006] A substrate, the substrate comprising an atomizing surface and a liquid absorbing surface opposite to the atomizing surface; the substrate is provided with a liquid conducting area and a non-liquid conducting area adjacent to the liquid conducting area; wherein the liquid conducting area has a plurality of through holes penetrating the atomizing surface and the liquid absorbing surface;

[0007] An electrode, disposed on the atomizing surface and located in a non-liquid-conducting area of ​​the substrate;

[0008] The heating element is arranged in the liquid conducting area of ​​the substrate and is electrically connected to the electrode.

[0009] The through holes in the liquid-conducting area can allow liquid to pass through; the non-liquid-conducting area does not have a through hole for liquid to pass to the atomizing surface, and cannot guide liquid to the atomizing surface.

[0010] Preferably, in the vertical direction of the substrate, the electrode and the heating element are connected by a connecting surface; in the longitudinal direction of the substrate, there is a gap between the edge position of the liquid conducting area and the connecting surface; and in the transverse direction of the substrate, the edge position of the liquid conducting area extends beyond the position of the heating element.

[0011] Preferably, the electrode is bonded to the substrate; and, on a side of the electrode away from the substrate, the heating element is bonded to an upper surface of the electrode.

[0012] Preferably, the electrode is bonded to the substrate; and, on a side of the electrode away from the substrate, the heating element is bonded to an upper surface and an outer contour surface of the electrode respectively.

[0013] Preferably, the distance between the edge of the liquid-conducting area and the connecting surface in the longitudinal direction of the substrate is 0.05-0.3 mm.

[0014] Preferably, the heating element area between the connecting surfaces is an ohmic heating area.

[0015] Preferably, the through holes in the liquid-conducting area are array through holes.

[0016] Preferably, the electrode comprises a first electrode layer and a second electrode layer; the first electrode layer is arranged on the atomizing surface and located in the non-liquid-conducting area of ​​the substrate, and the second electrode layer is arranged on a surface of the first electrode layer away from the substrate.

[0017] Preferably, the material of the first electrode layer includes at least one of stainless steel, Cr, and Ti;

[0018] The material of the second electrode layer includes at least one of Al, Ag, and Cu.

[0019] Preferably, the thickness of the first electrode layer is 10-200 nm; the thickness of the second electrode layer is 0.5-3 um.

[0020] Preferably, the heating element is selected from a heating film.

[0021] Preferably, the heating film is selected from a stainless steel heating film.

[0022] Preferably, the thickness of the heating element is 800-2000 nm.

[0023] Preferably, the surface of the heating element on one side away from the substrate further includes a corrosion-resistant metal protective layer;

[0024] The thickness of the corrosion-resistant metal protective layer is 200-600nm.

[0025] Preferably, the material of the corrosion-resistant metal protective layer is selected from at least one of Ta and Pt;

[0026] Preferably, the porosity of the matrix is ​​20-50%.

[0027] The present invention provides a method for preparing the above-mentioned atomizer core, comprising the following steps:

[0028] The electrode and the heating element are sequentially deposited on the substrate by physical vapor deposition.

[0029] Preferably, the method for preparing the atomizer core further comprises the step of physically vapor depositing a corrosion-resistant metal protective layer on the surface of the heating element on the side away from the substrate.

[0030] The present invention provides an atomizer, comprising:

[0031] A liquid storage chamber, the liquid storage chamber is used to store liquid atomization medium;

[0032] An atomizer core, wherein the atomizer core is used to atomize the liquid atomization medium; the atomizer core is the atomizer core described above or the atomizer core prepared by the preparation method described above.

[0033] The present invention also provides an electronic atomization device, comprising a power supply component and the atomizer as described above, wherein the power supply component provides power for the atomization component.

[0034] Beneficial effects of the present invention:

[0035] The atomizing core provided by the present invention includes a substrate, an electrode and a heating element, wherein the substrate includes an atomizing surface and a liquid absorbing surface opposite to the atomizing surface; the substrate is provided with a liquid conducting area and a non-liquid conducting area adjacent to the liquid conducting area; wherein the liquid conducting area has a plurality of through holes penetrating the atomizing surface and the liquid absorbing surface; the electrode is arranged on the atomizing surface and located in the non-liquid conducting area of ​​the substrate; the heating element is arranged in the liquid conducting area of ​​the substrate and is electrically connected to the electrode. Through the above arrangement, the boundary between the electrode and the heating element of the present invention is a non-liquid conducting area, which minimizes the contact between the electrode and the atomizing medium, reduces the risk of electrochemical corrosion, and thereby reduces the rate of increase of the resistance value, improves the resistance stability of the atomizing core, and increases its wet burning life. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 A schematic diagram of the structure of the atomizer core in an existing electronic atomizer assembly;

[0038] Figure 2 A schematic diagram of the longitudinal structure of an atomizer core in a certain embodiment provided by the present invention;

[0039] Figure 3 A schematic diagram of the three-dimensional structure of the atomizer core according to Example 1 of the present invention;

[0040] Figure 4 A schematic diagram of the longitudinal structure of the atomizer core of Example 1 of the present invention;

[0041] Figure 5 A schematic diagram of the longitudinal structure of the atomizer core of Comparative Example 2 of the present invention;

[0042] Figure 6 A line graph showing the total resistance increase ratio of the wet burning test of the electronic cigarette assembled with the atomizer core according to Example 1 of the present invention;

[0043] Figure 7 A line graph showing the increase ratio of the total resistance of the wet burning test of the electronic cigarette assembled with the atomizer core of Comparative Example 1 of the present invention;

[0044] Figure 8 A line graph showing the total resistance increase ratio of the wet burning test of the electronic cigarette assembled with the atomizer core of Comparative Example 2 of the present invention;

[0045] Description of reference numerals:

[0046] 100 - substrate; 110 - atomizing surface; 120 - liquid absorbing surface; 130 - liquid conducting area; 140 - non-liquid conducting area; 131 - through hole; 200 - electrode; 300 - heating element; 210 - connecting surface; 211 - interval; 220 - upper surface; 230 - outer contour surface. DETAILED DESCRIPTION

[0047] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0049] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0051] In the existing electronic atomization components, the electrode layer is used to contact the thin film heating film to reduce the contact resistance between the pin and the heating film. Figure 1 As shown, a heating film is covered on a porous substrate, an electrode layer is covered on the surface of the heating film layer, and part of the electrode layer is in contact with the e-liquid. The operating temperature of the electronic atomization component can reach about 300°C, so the temperature of the pin electrode layer close to the heating area can also reach 150-200°C. Since this area is also in contact with the atomization medium, in some highly corrosive e-liquids (such as mango ice), high-temperature electrochemical corrosion will occur in the electrode layer in this area after long-term operation. The increase in the area of ​​the heating area will cause a rapid increase in the resistance value of the electronic atomization component, affecting the resistance stability and increasing the risk of atomization core failure.

[0052] In order to solve the above problems, the inventor provides an atomizer core, which includes: a substrate 100, the substrate 100 includes an atomizing surface 110 and a liquid absorbing surface 120 opposite to the atomizing surface 110; the substrate 100 is provided with a liquid conducting area 130 and a non-liquid conducting area 140 adjacent to the liquid conducting area 130; wherein the liquid conducting area 130 has a plurality of through holes 131 penetrating the atomizing surface 110 and the liquid absorbing surface 120; an electrode 200, which is arranged on the atomizing surface 110 and located in the non-liquid conducting area 140 of the substrate 100; a heating element 300, which is arranged in the liquid conducting area 130 of the substrate 100 and is electrically connected to the electrode 200. The through holes 131 of the liquid conducting area 130 can allow liquid to pass through; and the non-liquid conducting area 140 does not have a through hole 131 for liquid to pass to the atomizing surface 110. The inventors have found that by setting the electrode 200 in the non-liquid-conducting area 140 of the atomizing surface 110 of the substrate 100, the boundary between the electrode 200 and the heating element 300 is a non-liquid-conducting area, which can reduce the direct contact between the electrode 200 and the atomizing medium as much as possible, reduce the risk of electrochemical corrosion, and thus reduce the rate of increase of the resistance value, improve the resistance stability of the atomizing core, and increase its wet burning life. At the same time, setting the electrode 200 in the non-liquid-conducting area 140 can help form a dense electrode 200 during the preparation process, so that the current density passing through the electrode 200 is reduced, reducing the risk of electrochemical corrosion and increasing the life of the atomizing core.

[0053] like Figure 3-Figure 4 As shown, in some optional embodiments, in the vertical direction of the substrate 100, the electrode 200 and the heating element 300 are connected by the connecting surface 210; in the longitudinal direction of the substrate 100, there is a gap 211 between the edge of the liquid guide area 130 and the connecting surface 210; and in the transverse direction of the substrate 100, the edge of the liquid guide area 130 extends to the position of the heating element 300. Figure 3As shown, the vertical direction of the substrate 100 is the direction from the liquid absorption surface 120 of the substrate 100 to the atomization surface 110 of the substrate 100; the longitudinal direction of the substrate 100 is the direction formed by the connection of the two electrodes 200 of the substrate 100, which is also the direction of the current; the transverse direction of the substrate 100 is the direction on the atomization surface 110 that is perpendicular to the longitudinal direction of the substrate 100. The inventor found that by setting a gap 211 between the edge position of the liquid guide area 130 and the connecting surface 210, so that the connecting surface 210 of the electrode 200 and the heating element 300 is away from the liquid guide area 130, it can further ensure that the electrode 200 is away from the through hole 131 in the liquid guide area 130, and cannot contact the atomization medium in the through hole 131 (oil guide hole), so as to avoid the electrode 200 at the connecting surface 210 from forming electrochemical corrosion in the atomization medium, thereby improving the resistance stability of the atomization core and improving its wet burning life. At the same time, the defects of the heating element 300 at the boundary of the lower electrode 200 are reduced in this structure, and corrosion from the hole can be effectively avoided, further increasing the life of the atomization core. In the lateral direction of the substrate 100, the edge position of the liquid guide area 130 extends to the position of the heating element 300, which can ensure that a sufficient amount of atomization medium aerosol is generated on the atomization surface.

[0054] like Figure 4 As shown, in some optional embodiments, the electrode 200 is attached to the substrate 100; and, on the side of the electrode 200 away from the substrate 100, the heating element 300 is attached to the upper surface 220 of the electrode 200. Figure 2 As shown, in some other optional embodiments, the electrode 200 is connected to the substrate 100; and, on the side of the electrode 200 away from the substrate 100, the heating element 300 is respectively in contact with the upper surface 220 and the outer contour surface 230 of the electrode 200. The inventors found that through the above structure, especially the heating element 300 is in contact with the upper surface 220 of the electrode 200, the electrode 200 can be located at the bottom of the heating element 300, and the boundary of the electrode 200 at the connection surface 210 is completely covered by the heating element, so that it cannot contact with the gas atomization medium after atomization, avoiding electrochemical corrosion of the boundary of the electrode 200 at the connection surface 210, improving the resistance stability of the atomization core, and improving its wet burning life. When the heating element 300 is respectively fitted with the upper surface 220 and the outer contour surface 230 of the electrode 200, the heating element 300 fully wraps the electrode 200, which can protect the entire electrode 200 from contacting the atomized gas atomization medium, thereby protecting the electrode 200 to the greatest extent and improving the overall service life of the atomizer core.

[0055] In some optional embodiments, the distance between the edge position of the liquid-conducting area 130 and the connection surface 210 in the longitudinal direction of the substrate 100 is 0.05-0.3 mm. For example, the distance of the interval 211 can be 0.05 μm, 0.06 μm, 0.07 μm, 0.08 μm, 0.09 μm, 0.1 μm, 0.12 μm, 0.13 μm, 0.14 μm, 0.15 μm, 0.16 μm, 0.17 μm, 0.18 μm, 0.19 μm, 0.2 μm, 0.21 μm, 0.22 μm, 0.23 μm, 0.24 μm, 0.25 μm, 0.26 μm, 0.27 μm, 0.28 μm, 0.29 μm, or 0.3 μm.

[0056] In some optional embodiments, the heating element 300 area between the connection surfaces 210 is an ohmic heating area; the resistance of the heating element 300 covering the electrode 200 is much lower than the resistance of the heating element 300 covering the liquid guide area 130, and the resistance heating area is mainly concentrated in the liquid guide area 130. Therefore, this solution improves the overall life of the heating element while basically not changing the heat flow distribution and heating area of ​​the heating element itself.

[0057] In some optional embodiments, the through holes 131 of the liquid guiding area 130 are array through holes, and the arrangement of the array holes can satisfy the transmission of the atomized medium from the liquid absorption surface 120 to the atomization surface 110 to the greatest extent. In some optional embodiments, the through holes 131 of the liquid guiding area 130 also have other arrangement modes, such as a dispersed arrangement.

[0058] In some optional embodiments, the number of electrodes 200 is two, the structures and materials of the two electrodes 200 are the same, each electrode 200 includes a first electrode layer and a second electrode layer; the atomized surface 110 is located in the non-liquid-conducting area 140 of the substrate 100, and the second electrode layer is arranged on the surface of the first electrode layer away from the substrate 100. The material of the first electrode layer includes at least one of stainless steel, Cr, and Ti; the material of the second electrode layer includes at least one of Al, Ag, and Cu. The first electrode layer is formed at the bottom of the second electrode layer to increase the bonding force between the electrode layer and the substrate.

[0059] In some optional embodiments, the thickness of the first electrode layer is 10-200 nm; the thickness of the second electrode layer is 0.5-3 μm. For example, the thickness of the first electrode layer can be selected to be 10nm, 15nm, 25nm, 35nm, 45nm, 50nm, 60nm, 70nm, 80nm, 90nm, 100nm, 110nm, 120nm, 130nm, 140nm, 150nm, 160nm, 170nm, 180nm, 190nm, 200nm; the thickness of the second electrode layer can be selected to be 0.5μm, 0.7μm, 0.9μm, 1μm, 1.2μm, 1.3μm, 1.4μm, 1.5μm, 1.6μm, 1.7μm, 1.8μm, 1.9μm, 2μm, 2.1μm, 2.3μm, 2.4μm, 2.5μm, 2.6μm, 2.7μm, 2.8μm, 2.9μm, 3um.

[0060] In some optional embodiments, the heating element 300 is selected from a heating film, and the heating film is selected from a stainless steel heating film. The present invention does not specifically limit the composition of the stainless steel. For example, it can be selected that, by mass fraction, the stainless steel composition includes: Fe: 60-71%, Cr: 16.0-20.0%, Ni: 10.0-16.0%, Mo: 2.0-4.0%, and the rest are inevitable elements such as C and S in stainless steel.

[0061] In some optional embodiments, the thickness of the heating element 300 is 800-2000nm. For example, the thickness of the heating element 300 can be 800nm, 850nm, 900nm, 950nm, 1000nm, 1050nm, 1100nm, 1150nm, 1200nm, 1250nm, 1300nm, 1350nm, 1400nm, 1450nm, 1500nm, 1550nm, 1600nm, 1650nm, 1700nm, 1750nm, 1800nm, 1850nm, 1900nm, 1950nm, 2000nm.

[0062] In some optional embodiments, the surface of the heating element 300 away from the substrate 100 also includes a corrosion-resistant metal protective layer; the corrosion-resistant metal protective layer can effectively improve the high-temperature oxidation resistance of the surface of the heating element 300, making the atomizing core as a whole resistant to dry burning, and at the same time can significantly avoid the high-temperature electrochemical corrosion of the atomizing medium on the heating element 300, and also indirectly protect the electrode 200 below the heating element 300, avoiding the high-temperature electrochemical corrosion of the electrode 200 and the rapid increase in resistance, thereby improving the high-temperature wet burning resistance and extending the life. Preferably, the material of the corrosion-resistant metal protective layer is selected from at least one of Ta and Pt; preferably, Ta and Pt with stable chemical properties can further play a good protective role. Preferably, the thickness of the corrosion-resistant metal protective layer is 200-600nm. For example, the thickness of the corrosion-resistant metal protective layer can be selected from 200nm, 250nm, 300nm, 350nm, 400nm, 450nm, 500nm, 550nm, 600nm.

[0063] In some optional embodiments, the porosity of the substrate 100 is 20-50%. For example, the porosity of the substrate 100 can be 20%, 23%, 25%, 28%, 30%, 32%, 35%, 38%, 40%, 42%, 45%, 48%, 50%. Optionally, the substrate of the present invention is an insulating substrate.

[0064] In some optional embodiments, the preparation method of the atomizer core includes the following steps: depositing the electrode 200 and the heating element 300 in sequence on the substrate 100 by physical vapor deposition. For example, it can be selected that the physical vapor deposition can be a magnetron sputtering technology, a cathode arc deposition technology, such as a DC magnetron sputtering technology; the prior art generally adopts a thick film printing and sintering silver paste method to prepare the electrode of the electronic atomization component, but the thick film printing process requires air sintering, which is not highly compatible with the thin film type heating film process; the present application adopts a physical vapor deposition method to avoid sintering in the air, and the formed electrode 200 has a high bonding strength and few defects between its bonding surfaces, which can further ensure that the electrode 200 does not contact the atomization medium, further reduce the risk of electrochemical corrosion, improve the resistance stability of the atomizer core, and improve its wet burning life. At the same time, the formed electrode 200 can be more dense, and the defects of the heating element 300 at the boundary of the electrode 200 will be further reduced, which can effectively reduce the risk of electrochemical corrosion and further increase the life of the atomizer core.

[0065] In some optional embodiments, the method for preparing the atomizer core further includes the step of physically vapor depositing a corrosion-resistant metal protective layer on the heating element 300 .

[0066] In some optional embodiments, the above-mentioned atomizing core is applied in an atomizer, and the atomizer comprises: a liquid storage chamber and the above-mentioned atomizing core, wherein the liquid storage chamber is used to store liquid atomizing medium; and the atomizing core is used to atomize the liquid atomizing medium.

[0067] In some optional embodiments, the above-mentioned atomizer is applied to an electronic atomization device, which includes a power supply component and the above-mentioned atomizer, and the power supply component provides power for the atomization component.

[0068] Example 1

[0069] like Figure 4 As shown, this embodiment provides an atomizer core: the atomizer core includes a substrate 100, an electrode 200 and a heating element 300; the substrate 100 includes an atomizing surface 110 and a liquid absorbing surface 120 opposite to the atomizing surface 110; the substrate 100 is provided with a liquid conducting area 130 and a non-liquid conducting area 140 adjacent to the liquid conducting area 130; the liquid conducting area 130 has a plurality of through holes 131 penetrating the atomizing surface 110 and the liquid absorbing surface 120, and the through holes are array through holes; the porosity of the substrate 100 is 20%; the electrode 200 is arranged on the atomizing surface 110 and located in the non-liquid conducting area 140 of the substrate; the heating element 300 is a heating film, which is arranged in the liquid conducting area 130 of the substrate 100 30 and is electrically connected to the electrode 200; in the vertical direction of the substrate 100, the electrode 200 and the heating film are connected by the connecting surface 210; in the longitudinal direction of the substrate, there is a gap 211 between the edge position of the liquid-conducting area 130 and the connecting surface 210, and the distance of the gap 211 is 0.2mm; and, in the transverse direction of the substrate 100, the edge position of the liquid-conducting area 130 extends to the position of the heating film; the electrode 200 is connected to the substrate 100; and, on the side of the electrode 200 away from the substrate 100, the heating film is in contact with the upper surface 220 of the electrode 200; the heating film area between the connecting surface 210 is an ohmic heating area. The electrode 200 includes a first electrode layer and a second electrode layer; the first electrode layer is arranged on the atomizing surface 110 and located in the non-liquid-conducting area 140 of the substrate, and the second electrode layer is arranged on the side surface of the first electrode layer away from the substrate 100; the side surface of the heating film away from the substrate 100 also includes a corrosion-resistant metal protective layer.

[0070] This embodiment provides a method for preparing the above-mentioned atomizer core, comprising the following steps:

[0071] On the non-liquid-conducting area at a distance of 0.2 mm on both sides of the liquid-conducting area of ​​the substrate, a layer of 316 stainless steel with a thickness of 50 nm and a layer of Ag with a thickness of 2 μm are deposited by magnetron sputtering in sequence through mask shielding to form electrodes;

[0072] On the above substrate and electrode parts, a heating film of 316 stainless steel is formed by magnetron sputtering deposition. By mass fraction, the heating film of 316 stainless steel contains: Fe: 70%, Cr: 16.5%, Ni: 10.5%, Mo: 2.5%, and the rest are inevitable elements such as C and S in stainless steel. The thickness of the heating film is 1300nm. A tantalum film protective layer is formed on the surface of the heating film away from the substrate by magnetron sputtering deposition. The thickness of the tantalum film protective layer is 300nm.

[0073] Comparative Example 1

[0074] This comparative example provides an atomizing core, which includes a substrate, an electrode and a heating element; the substrate includes an atomizing surface and a liquid absorbing surface opposite to the atomizing surface; the substrate is provided with a plurality of micropores; the micropores are through holes that penetrate the atomizing surface and the liquid absorbing surface; the porosity of the substrate is 20%; the heating element is a heating film, which is arranged on the atomizing surface of the substrate and connected to the substrate; the electrode is arranged on the heating film, and the substrate below the electrode and the substrate below the heating film are provided with through holes; the electrode includes a first electrode layer and a second electrode layer; the second electrode layer is arranged on the side surface of the first electrode layer away from the substrate; the side surface of the heating element away from the substrate also includes a corrosion-resistant metal protective layer. A protective film is also included above part of the electrode and above the corrosion-resistant metal protective layer of the heating film.

[0075] This comparative example provides a method for preparing the above-mentioned atomizer core, comprising the following steps:

[0076] On the substrate, a heating film of 316 stainless steel is formed by magnetron sputtering deposition. By mass fraction, the heating film of 316 stainless steel contains: Fe: 70%, Cr: 16.5%, Ni: 10.5%, Mo: 2.5%, and the rest are inevitable elements such as C and S in stainless steel. The thickness of the heating film is 1300nm. A tantalum film protective layer is formed on the surface of the heating film away from the substrate by magnetron sputtering deposition. The thickness of the tantalum film protective layer is 300nm.

[0077] On the substrate and the heating film with a tantalum film protective layer deposited on both sides, a 50nm thick 316 stainless steel layer and a 2um thick Ag layer are deposited by magnetron sputtering in sequence through mask shielding to form electrodes; the electrodes are connected to the heating film. A 100nm thick Al2O3 protective film is deposited on the electrode and the surface of the tantalum film.

[0078] Comparative Example 2

[0079] like Figure 5As shown, this comparative example provides an atomizer core: the atomizer core includes a substrate 100, an electrode 200 and a heating element 300; the substrate 100 includes an atomizing surface 110 and a liquid absorbing surface 120 opposite to the atomizing surface 110; the substrate is provided with a plurality of through holes 131 penetrating the atomizing surface and the liquid absorbing surface, and the through holes are arranged in an array; the porosity of the substrate is 20%; the electrode 200 is arranged on the atomizing surface 110 of the substrate 100, and there are through holes on the substrate 100 below the electrode 200 The heating element 300 is a heating film, which is arranged on the atomized surface 110 of the substrate 100 and is electrically connected to the electrode 200. In the vertical direction of the substrate 100, the electrode 200 and the heating film are connected by the connecting surface 210. The electrode 200 is connected to the substrate 100. Moreover, on the side of the electrode 200 away from the substrate 100, the heating film is in contact with the upper surface 220 of the electrode 200. The heating film area between the connecting surfaces 210 is an ohmic heating area. The electrode 200 includes a first electrode layer and a second electrode layer. The first electrode layer is arranged on the atomized surface 110 and located on the substrate 100, and the second electrode layer is arranged on the side of the first electrode layer away from the substrate 100. The side of the heating film away from the substrate 100 also includes a corrosion-resistant metal protective layer.

[0080] This comparative example provides a method for preparing the above-mentioned atomizer core, comprising the following steps:

[0081] On both sides of the substrate provided with a plurality of micropores, a 316 stainless steel layer with a thickness of 50 nm and an Ag layer with a thickness of 2 μm are sequentially deposited by magnetron sputtering through a mask plate to form electrodes;

[0082] On the above substrate and electrode parts, a heating film of 316 stainless steel is formed by magnetron sputtering deposition. By mass fraction, the heating film of 316 stainless steel contains: Fe: 70%, Cr: 16.5%, Ni: 10.5%, Mo: 2.5%, and the rest are inevitable elements such as C and S in stainless steel. The thickness of the heating film is 1300nm. A tantalum film protective layer is formed on the surface of the heating film away from the substrate by magnetron sputtering deposition. The thickness of the tantalum film protective layer is 300nm.

[0083] Test Case

[0084] The present invention assembles the atomization cores of Example 1, Comparative Example 1 and Comparative Example 2 into an electronic cigarette atomizer, processes the electronic cigarette, and performs dry burning and wet burning tests. Dry burning test: 7.5W constant power is turned on, dry burning in the air for 3s and stopping for 8s as one puff, and the resistance change after dry burning for 10 puffs is tested; wet burning test: using 40mg of strawberry watermelon ice fruit flavored e-liquid produced by Shenzhen Yupeng Technology Co., Ltd., at 7.5W constant power, puff for 3s and stop for 15s as one puff, and testing the total resistance increase ratio after 1500 puffs, that is, the ratio of the resistance difference to the original resistance value.

[0085] The dry burning test results show that the resistance change of the electronic cigarette assembled with the atomizer cores of Example 1, Comparative Example 1 and Comparative Example 2 after 10 puffs of dry burning is less than 20%. Figure 6-Figure 8 As shown, Figure 6 The total resistance increase ratio of Example 1 when puffing 1500 times is only 10.6%, which shows that Example 1 can significantly improve the wet burning life. Figure 7 During the test of comparative example 1, the resistance increase of the heating element was relatively high before 600 puffs (mainly due to a certain electrochemical corrosion of the electrode (pin) Ag). After 600 puffs, the resistance increase tended to be slow, indicating that the high-temperature electrochemical corrosion rate of the heating film was relatively slow. When 1200 puffs were drawn, the total resistance increase ratio had reached 21%. Figure 8 The resistance of the electronic cigarette assembled in Comparative Example 2 increased slightly and uniformly during the test. When the electronic cigarette was puffed for 1,500 times, the total resistance increased by 21.5%, exceeding the standard of resistance change of less than 20%.

[0086] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. An atomizer core, characterized in that: The atomizer core comprises: A substrate (100), the substrate (100) comprising an atomizing surface (110) and a liquid absorbing surface (120) opposite to the atomizing surface (110); the substrate (100) is provided with a liquid conducting area (130) and a non-liquid conducting area (140) adjacent to the liquid conducting area (130); wherein the liquid conducting area (130) has a plurality of through holes (131) penetrating the atomizing surface (110) and the liquid absorbing surface (120); An electrode (200) is disposed on the atomizing surface (110) and is located in a non-liquid-conducting area (140) of the substrate (100); A heating element (300) is disposed in the liquid conducting area (130) of the substrate (100) and is electrically connected to the electrode (200).

2. The atomizer core according to claim 1, characterized in that: In the vertical direction of the substrate (100), the electrode (200) and the heating element (300) are connected by a connection surface (210); in the longitudinal direction of the substrate (100), there is a gap (211) between the edge position of the liquid-conducting area (130) and the connection surface (210); and in the transverse direction of the substrate (100), the edge position of the liquid-conducting area (130) extends beyond the position of the heating element (300).

3. The atomizer core according to claim 1 or 2, characterized in that: The electrode (200) is bonded and connected to the substrate (100); and, on a side of the electrode (200) away from the substrate (100), the heating element (300) is bonded to an upper surface (220) of the electrode (200).

4. The atomizer core according to claim 1 or 2, characterized in that: The electrode (200) is bonded and connected to the substrate (100); and, on a side of the electrode (200) away from the substrate (100), the heating element (300) is bonded to an upper surface (220) and an outer contour surface (230) of the electrode (200), respectively.

5. The atomizer core according to claim 2, characterized in that: The distance between the edge position of the liquid-conducting area (130) and the spacing (211) between the edge position and the connecting surface (210) in the longitudinal direction of the base (100) is 0.05-0.3 mm.

6. The atomizer core according to claim 2, characterized in that: The heating element (300) region between the connection surfaces (210) is an ohmic heating region.

7. The atomizer core according to any one of claims 1 to 6, characterized in that: The through holes (131) of the liquid conducting area (130) are array through holes.

8. The atomizer core according to any one of claims 1 to 7, characterized in that: The electrode (200) comprises a first electrode layer and a second electrode layer; the first electrode layer is arranged on the atomizing surface (110) and located in the non-liquid-conducting area (140) of the substrate (100), and the second electrode layer is arranged on a side surface of the first electrode layer away from the substrate (100).

9. The atomizer core according to claim 8, characterized in that: The material of the first electrode layer includes at least one of stainless steel, Cr, and Ti; The material of the second electrode layer includes at least one of Al, Ag, and Cu.

10. The atomizer core according to claim 8 or 9, characterized in that: The thickness of the first electrode layer is 10-200 nm; the thickness of the second electrode layer is 0.5-3 um.

11. The atomizer core according to any one of claims 1 to 10, characterized in that: The heating element (300) is selected from a heating film.

12. The atomizer core according to claim 11, characterized in that: The heating film is selected from stainless steel heating film.

13. The atomizer core according to any one of claims 1 to 12, characterized in that: The thickness of the heating element (300) is 800-2000 nm.

14. The atomizer core according to any one of claims 1 to 13, characterized in that: The surface of the heating element (300) on one side away from the substrate (100) also includes a corrosion-resistant metal protective layer; The thickness of the corrosion-resistant metal protective layer is 200-600nm.

15. The atomizer core according to claim 14, characterized in that: The material of the corrosion-resistant metal protective layer is selected from at least one of Ta and Pt.

16. The atomizer core according to any one of claims 1 to 15, characterized in that: The porosity of the substrate (100) is 20-50%.

17. A method for preparing the atomizer core according to any one of claims 1 to 16, characterized in that: The steps include: The electrode (200) and the heating element (300) are sequentially deposited on the substrate (100) by physical vapor deposition.

18. A method for preparing the atomizer core according to claim 17, characterized in that: The method also includes the step of physically vapor depositing a corrosion-resistant metal protective layer on the surface of the heating element (300) on the side away from the substrate (100).

19. An atomizer, characterized in that: include: A liquid storage chamber, the liquid storage chamber is used to store liquid atomization medium; An atomizer core, wherein the atomizer core is used to atomize the liquid atomization medium; the atomizer core is the atomizer core according to any one of claims 1 to 16 or the atomizer core prepared by the preparation method according to claim 17 or 18.

20. An electronic atomization device, characterized in that: It comprises a power supply component and the atomizer as claimed in claim 19, wherein the power supply component provides power for the atomization component.

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