Cutting fluid filtering equipment for photovoltaic silicon wafer cutting

Abstract

The invention belongs to the technical field of silicon wafer cutting fluid filtering, and particularly relates to photovoltaic silicon wafer cutting fluid filtering equipment which comprises a supporting frame, a cooling box, a workbench, a pipe type cooling mechanism, a scorpion type liquid conveying mechanism, a partition type liquid filtering mechanism and an elastic type bearing mechanism, the cooling box is arranged on the inner wall of the supporting frame in a penetrating mode, and the upper end of the cooling box is open; the multiple sets of workbenches are arranged on the upper wall of the cooling box, the pipe type cooling mechanism is arranged on the bottom wall of the cooling box, the scorpion type liquid conveying mechanism is arranged at the end, away from the cooling box, of the pipe type cooling mechanism, the partition type liquid filtering mechanism is arranged on the scorpion type liquid conveying mechanism, and the elastic type bearing mechanism is arranged on the side, close to the scorpion type liquid conveying mechanism, of the supporting frame. According to the cutting fluid filtering equipment for photovoltaic silicon wafer cutting, impurities in the cutting fluid can be filtered out under the condition that the contact force between the cutting fluid and the filter screen is reduced, the temperature loss of the cooled cutting fluid can be reduced, and the cooling effect of the cutting fluid on a silicon wafer machining area is guaranteed.

Description

Technical Field

[0001] The invention belongs to the technical field of silicon wafer cutting fluid filtration, and specifically refers to a cutting fluid filtration device for photovoltaic silicon wafer cutting. Background Art

[0002] The main material of solar panels is silicon wafers. During the silicon wafer cutting process, a large amount of metal particles, especially magnetic materials such as iron filings, are often mixed into the cutting fluid. These impurities not only affect the cleanliness and quality of the cutting fluid, but also have an adverse effect on the quality of silicon wafer cutting.

[0003] The existing cutting fluid filtration equipment has the following problems: When the existing cutting fluid filtering equipment filters the cutting fluid in the processing area, the contact force between the cutting fluid and the filter is relatively large due to the continuous extraction of the circulating pump, which causes the filtered impurities to pass through the filter and enter the filtered cutting fluid under the continuous pressure of the fluid cutting fluid, thereby reducing the filtering effect of the cutting fluid. In addition, after the traditional cutting fluid filtering equipment cools the cutting fluid, the contact area between the cutting fluid and the external environment is relatively large, resulting in a large loss of internal temperature of the cooled cutting fluid, thereby increasing the output energy consumption of the cooling equipment. Therefore, it cannot meet the existing use requirements of the cutting fluid filtering equipment. Summary of the invention

[0004] In view of the above situation, in order to overcome the defects of the prior art, the present solution provides a cutting fluid filtration equipment for photovoltaic silicon wafer cutting, which can filter out impurities in the cutting fluid while reducing the contact force between the cutting fluid and the filter, and can reduce the temperature loss of the cutting fluid after cooling, thereby ensuring the cooling effect of the cutting fluid on the silicon wafer processing area.

[0005] The technical scheme adopted by this scheme is as follows: A cutting fluid filtering device for photovoltaic silicon wafer cutting proposed in this scheme includes a support frame, a cooling box, a workbench, a tubular cooling mechanism, a scorpion-shaped infusion mechanism, a partition-type filtrate mechanism and a spring-type supporting mechanism, wherein the cooling box is arranged through the inner wall of the support frame, the cooling box is arranged with an upper opening, a plurality of groups of the workbench are arranged on the upper wall of the cooling box, the tubular cooling mechanism is arranged on the bottom wall of the cooling box, the scorpion-shaped infusion mechanism is arranged at one end of the tubular cooling mechanism away from the cooling box, the partition-type filtrate mechanism is arranged on the scorpion-shaped infusion mechanism, the spring-type supporting mechanism The structure is arranged on a side of the support frame close to the scorpion-shaped infusion mechanism, the tube-shaped cooling mechanism includes a liquid extraction mechanism and a cooling mechanism, the liquid extraction mechanism is arranged on the bottom wall of the cooling box, the cooling mechanism is arranged at the end of the liquid extraction mechanism away from the cooling box, the scorpion-shaped infusion mechanism includes a drag reduction mechanism and a liquid buffering mechanism, the drag reduction mechanism is arranged on the side of the liquid extraction mechanism away from the cooling box, the liquid buffering mechanism is arranged on the side of the drag reduction mechanism close to the cooling box, the partition-type filtrate mechanism includes a filtering mechanism and an adsorption mechanism, the filtering mechanism is arranged on the inner wall of the liquid buffering mechanism, and the adsorption mechanism is arranged on the upper wall of the liquid buffering mechanism.

[0006] As a further preferred embodiment of the present invention, the liquid pumping mechanism includes a circulation pump, a discharge pipe and a bottom thick pipe. Multiple groups of the circulation pumps are arranged on the bottom wall of the cooling box. The circulation pump discharge end is arranged through the inside of the cooling box. The discharge pipe is arranged at the discharge end of the circulation pump. The bottom thick pipe is connected to the side of the discharge pipe away from the circulation pump. The cooling mechanism includes a cooling seat and a thermoelectric cooling plate group. The cooling seat is arranged on the upper wall of the bottom thick pipe. The thermoelectric cooling plate group is arranged through the cooling seat and the inner wall of the bottom thick pipe. The cooling end of the thermoelectric cooling plate group is arranged inside the bottom thick pipe.

[0007] When in use, cutting fluid for cutting silicon wafers is added into the cooling box, and the circulating pump draws the cutting fluid inside the cooling box through the liquid extraction end. The cutting fluid inside the cooling box enters into the bottom thick tube through the discharge pipe, and the thermoelectric cooling plate group cools the cutting fluid entering into the bottom thick tube through the cooling end, so as to facilitate cooling of the cutting process of the silicon wafer.

[0008] Preferably, the drag reduction mechanism includes a small-diameter centrifugally cast composite pipe and a threaded joint. The small-diameter centrifugally cast composite pipe is connected to the side of the bottom thick pipe away from the drain pipe, and the threaded joint is connected to the side of the small-diameter centrifugally cast composite pipe away from the bottom thick pipe; the liquid slowing mechanism includes a top thick pipe, a rotating handle and a cooling nozzle. The top thick pipe is connected to the end of the threaded joint away from the small-diameter centrifugally cast composite pipe, the top thick pipe is threadedly connected to the threaded joint, the rotating handle is symmetrically arranged on both sides of the top thick pipe, the cooling nozzle is connected to the side of the top thick pipe away from the threaded joint, and the cooling nozzle is arranged above the workbench.

[0009] When in use, after the cutting fluid enters from the inside of the large-diameter bottom thick tube into the inside of the small-diameter centrifugal casting composite tube, its flow rate will increase, and under the action of centrifugal force, the impurity particles in the cutting fluid will move toward the outer bend side of the small-diameter centrifugal casting composite tube. Under the flow of cutting fluid, the impurity particles move along the inner wall of the outer bend of the small-diameter centrifugal casting composite tube, thereby achieving the effect of aggregating the impurity particles in the cutting fluid.

[0010] Specifically, the filtering mechanism includes a snap-fit ​​box, a filter mesh plate and an intercepting plate. The snap-fit ​​box is symmetrically arranged on both sides of the bottom thick tube, the snap-fit ​​box is connected to the bottom thick tube, the filter mesh plate is arranged between the inner walls of the snap-fit ​​box, and the intercepting plate is arranged on the upper wall of the filter mesh plate away from the threaded joint; the adsorption mechanism includes an adsorption seat, an adsorption electromagnet and an observation glass layer. The adsorption seat is arranged on the upper wall of one end of the bottom thick tube close to the cooling nozzle, the adsorption electromagnet is arranged between the adsorption seat and the inner wall of the top thick tube, and the observation glass layer is arranged on the inner wall of one end of the top thick tube away from the adsorption electromagnet.

[0011] During use, after the cutting fluid that has undergone centrifugal motion ends its movement trajectory inside the small-diameter centrifugal casting composite pipe, the cutting fluid enters the top thick pipe through the threaded joint, and the impurities gathered on the inner wall of the outer bend of the small-diameter centrifugal casting composite pipe enter the top thick pipe above the filter screen plate under the action of inertia. When the cutting fluid enters the top thick pipe with a large diameter from the small-diameter centrifugal casting composite pipe with a small diameter, its flow rate will decrease, thereby being able to buffer the impactful cutting fluid, reduce the contact force between the cutting fluid and the filter screen plate, prevent impurities from leaking out under the impact of the cutting fluid, and improve the filtering efficiency of the filter screen plate on impurities in the cutting fluid. The cutting fluid that enters the upper half of the top thick pipe is filtered by the filter screen plate and then discharged.

[0012] Among them, the elastic supporting mechanism includes a connecting shaft, a connecting plate, a return spring, a hinge plate, a supporting frame and a limit plate. Multiple groups of hinge plates are arranged at one end of the supporting frame close to the top thick tube. The connecting shaft is rotatably arranged at the end of the hinge plate away from the supporting frame. The connecting plates are symmetrically arranged on both sides of the connecting shaft. The return spring is arranged between the connecting plate and the hinge plate on the outside of the connecting shaft. The supporting frame is arranged on the outside of the connecting shaft. The end of the supporting frame away from the connecting shaft is sleeved on the outside of the top thick tube, and the limit plate is arranged on one side of the top thick tube close to the cooling nozzle.

[0013] During use, when it is necessary to clean the impurities adsorbed by the filter screen inside the top thick tube, turn the rotating handle, which drives the top thick tube to rotate between the support frame and the threaded joint, and the top thick tube is screwed out from the outside of the threaded joint, and the end of the top thick tube away from the threaded joint slides along the inner wall of the support frame, and the opening of the connection between the top thick tube and the threaded joint is exposed. By utilizing the deformation of the reset spring, the top thick tube is pulled obliquely downward by rotating the handle, and the opening of the top thick tube faces downward to pour out the impurities filtered by the filter screen. Subsequently, the reset spring resets and drives the top thick tube to change to a horizontal state through the support frame, pushing the top thick tube, and the top thick tube slides along the support frame close to the threaded joint. The top thick tube is rotated and screwed into the outside of the threaded joint.

[0014] Preferably, a controller is provided on the side wall of the support frame.

[0015] Furthermore, the controller is electrically connected to the circulation pump, the thermoelectric cooling sheet group and the adsorption electromagnet respectively.

[0016] The beneficial effects achieved by adopting the above structure are as follows: Compared with the prior art, the present invention adopts a method of controlling the flow rate of the cutting fluid. By setting up a tube-type cooling mechanism, a scorpion-type infusion mechanism, a partition-type filtration mechanism and an elastic support mechanism, under the coordinated use of the pumping mechanism, the cooling mechanism, the drag reduction mechanism, the liquid slowing mechanism, the filtering mechanism and the adsorption mechanism, when the cutting fluid enters the small-diameter centrifugal casting composite pipe from the bottom thick pipe, the flow rate of the cutting fluid is accelerated, the centrifugal force of impurities in the cutting fluid is increased, and the impurities can be relatively gathered on the outer bend inner wall of the small-diameter centrifugal casting composite pipe. Under the inertial movement of impurities in the cutting fluid, the cutting fluid containing impurities flows into the top thick tube above the filter screen through the small-diameter centrifugal casting composite tube, thereby achieving the filtering effect of the cutting fluid under the condition of reducing the impact of the cutting fluid on the filter screen. In addition, by storing the cooled cutting fluid through the bottom thick tube, the small-diameter centrifugal casting composite tube and the top thick tube, the contact area between the cutting fluid and the outside world can be reduced, thereby reducing the temperature loss of the cutting fluid after cooling, reducing the output energy consumption of the thermoelectric cooling plate group, and ensuring the cooling efficiency of the silicon wafer cutting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of this scheme; Figure 2 This is the main stereogram of the scheme; Figure 3 This is a bottom-up stereogram of the scheme; Figure 4 This is a schematic diagram of the structure of the filtering mechanism of this scheme; Figure 5 This is the main view of this scheme; Figure 6This is the left view of this scheme; Figure 7 This is the right view of this scheme; Figure 8 This is a top view of the scheme; Fig. 9 for Figure 8 AA section view of the part; Fig.10 for Figure 3 Part I shows a magnified structural view.

[0018] Among them, 1. support frame, 2. cooling box, 3. workbench, 4. tube-type cooling mechanism, 5. pumping mechanism, 6. circulating pump, 7. drain pipe, 8. bottom thick pipe, 9. cooling mechanism, 10. cooling seat, 11. thermoelectric refrigeration plate group, 12. scorpion-shaped infusion mechanism, 13. drag reduction mechanism, 14. small-diameter centrifugal casting composite pipe, 15. threaded joint, 16. slow liquid mechanism, 17. top thick pipe, 18. turning handle, 19. cooling nozzle, 20. partition filtrate mechanism, 21. filtration mechanism, 22. locking box, 23. filter screen, 24. interception plate, 25. adsorption mechanism, 26. adsorption seat, 27. adsorption electromagnet, 28. observation glass layer, 29. elastic supporting mechanism, 30. connecting shaft, 31. connecting plate, 32. reset spring, 33. hinged plate, 34. supporting frame, 35. controller, 36. limit plate.

[0019] The accompanying drawings are used to provide further understanding of the present scheme and constitute a part of the specification. Together with the embodiments of the present scheme, they are used to explain the present scheme and do not constitute a limitation on the present scheme. DETAILED DESCRIPTION

[0020] The technical scheme in the embodiments of the present scheme will be clearly and completely described below in conjunction with the drawings in the embodiments of the present scheme. Obviously, the described embodiments are only part of the embodiments of the present scheme, not all of the embodiments; based on the embodiments in the present scheme, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present scheme.

[0021] In the description of this scheme, it should be understood that terms such as "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this scheme and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this scheme.

[0022] like Figure 1-Figure 10As shown, the present invention proposes a cutting fluid filtering device for photovoltaic silicon wafer cutting, comprising a support frame 1, a cooling box 2, a workbench 3, a tubular cooling mechanism 4, a scorpion-shaped infusion mechanism 12, a partition-type filtrate mechanism 20 and a spring-type supporting mechanism 29, wherein the cooling box 2 is arranged through the inner wall of the support frame 1, the cooling box 2 is arranged with an upper opening, a plurality of groups of the workbench 3 are arranged on the upper wall of the cooling box 2, the tubular cooling mechanism 4 is arranged on the bottom wall of the cooling box 2, the scorpion-shaped infusion mechanism 12 is arranged at one end of the tubular cooling mechanism 4 away from the cooling box 2, the partition-type filtrate mechanism 20 is arranged on the scorpion-shaped infusion mechanism 12, and the spring-type supporting mechanism 29 is arranged on the support frame 1 near the scorpion-shaped On one side of the infusion mechanism 12, the tubular cooling mechanism 4 includes a pumping mechanism 5 and a cooling mechanism 9, the pumping mechanism 5 is arranged on the bottom wall of the cooling box 2, and the cooling mechanism 9 is arranged at the end of the pumping mechanism 5 away from the cooling box 2, the scorpion-shaped infusion mechanism 12 includes a drag reduction mechanism 13 and a liquid buffering mechanism 16, the drag reduction mechanism 13 is arranged on the side of the pumping mechanism 5 away from the cooling box 2, and the liquid buffering mechanism 16 is arranged on the side of the drag reduction mechanism 13 close to the cooling box 2, the partition-type filtrate mechanism 20 includes a filtering mechanism 21 and an adsorption mechanism 25, the filtering mechanism 21 is arranged on the inner wall of the liquid buffering mechanism 16, and the adsorption mechanism 25 is arranged on the upper wall of the liquid buffering mechanism 16.

[0023] The liquid extraction mechanism 5 includes a circulation pump 6, a discharge pipe 7 and a bottom thick pipe 8. Multiple groups of the circulation pumps 6 are arranged on the bottom wall of the cooling box 2. The liquid extraction end of the circulation pump 6 is penetrated inside the cooling box 2. The discharge pipe 7 is arranged at the discharge end of the circulation pump 6. The bottom thick pipe 8 is connected to the side of the discharge pipe 7 away from the circulation pump 6. The cooling mechanism 9 includes a cooling seat 10 and a thermoelectric cooling plate group 11. The cooling seat 10 is arranged on the upper wall of the bottom thick pipe 8. The thermoelectric cooling plate group 11 is penetrated between the cooling seat 10 and the inner wall of the bottom thick pipe 8. The cooling end of the thermoelectric cooling plate group 11 is arranged inside the bottom thick pipe 8.

[0024] The drag reduction mechanism 13 includes a small-diameter centrifugally cast composite pipe 14 and a threaded joint 15. The small-diameter centrifugally cast composite pipe 14 is connected to the side of the bottom thick pipe 8 away from the discharge pipe 7, and the threaded joint 15 is connected to the side of the small-diameter centrifugally cast composite pipe 14 away from the bottom thick pipe 8; the liquid slowing mechanism 16 includes a top thick pipe 17, a rotating handle 18 and a cooling nozzle 19. The top thick pipe 17 is connected to one end of the threaded joint 15 away from the small-diameter centrifugally cast composite pipe 14, the top thick pipe 17 is threadedly connected to the threaded joint 15, the rotating handle 18 is symmetrically arranged on both sides of the top thick pipe 17, the cooling nozzle 19 is connected to the side of the top thick pipe 17 away from the threaded joint 15, and the cooling nozzle 19 is arranged above the workbench 3.

[0025] The filtering mechanism 21 includes a snap-fit ​​box 22, a filter screen plate 23 and an intercepting plate 24. The snap-fit ​​box 22 is symmetrically arranged on both sides of the bottom thick tube 8, the snap-fit ​​box 22 is connected to the bottom thick tube 8, the filter screen plate 23 is arranged between the inner walls of the snap-fit ​​box 22, and the intercepting plate 24 is arranged on the upper wall of the filter screen plate 23 away from the threaded joint 15; the adsorption mechanism 25 includes an adsorption seat 26, an adsorption electromagnet 27 and an observation glass layer 28. The adsorption seat 26 is arranged on the upper wall of one end of the bottom thick tube 8 close to the cooling nozzle 19, the adsorption electromagnet 27 is penetrated between the adsorption seat 26 and the inner wall of the top thick tube 17, and the observation glass layer 28 is arranged on the inner wall of one end of the top thick tube 17 away from the adsorption electromagnet 27.

[0026] The elastic supporting mechanism 29 includes a connecting shaft 30, a connecting plate 31, a return spring 32, a hinged plate 33, a supporting bracket 34 and a limit plate 36. A plurality of hinged plates 33 are arranged at one end of the support frame 1 close to the top thick tube 17. The connecting shaft 30 is rotatably arranged at the end of the hinged plate 33 away from the support frame 1. The connecting plates 31 are symmetrically arranged on both sides of the connecting shaft 30. The return spring 32 is arranged between the connecting plate 31 and the hinged plate 33 on the outside of the connecting shaft 30. The supporting bracket 34 is arranged on the outside of the connecting shaft 30. The end of the supporting bracket 34 away from the connecting shaft 30 is sleeved on the outside of the top thick tube 17. The limit plate 36 is arranged on one side of the top thick tube 17 close to the cooling nozzle 19.

[0027] Preferably, a controller 35 is provided on the side wall of the support frame 1 .

[0028] The controller 35 is electrically connected to the circulation pump 6 , the thermoelectric cooling sheet group 11 and the adsorption electromagnet 27 respectively.

[0029] When in use, cutting fluid for cutting silicon wafers is added into the cooling box 2, and the photovoltaic silicon wafer cutting machine is placed on the upper wall of the workbench 3. When the photovoltaic silicon wafer is cut, the controller 35 controls the circulation pump 6 to start, and the circulation pump 6 extracts the cutting fluid in the cooling box 2 through the liquid extraction end, and the cutting fluid in the cooling box 2 enters the bottom thick tube 8 through the discharge pipe 7. The controller 35 controls the thermoelectric cooling sheet group 11 to start, and the thermoelectric cooling sheet group 11 cools the cutting fluid entering the bottom thick tube 8 through the cooling end. The cooled cutting fluid is convenient for cooling the cutting process of the silicon wafer, thereby ensuring the cutting quality of the photovoltaic silicon wafer. After the cutting fluid enters the small-diameter centrifugal casting composite pipe 14 from the bottom thick pipe 8 with a large diameter, its flow rate will increase. Under the action of centrifugal force, the impurity particles contained in the cutting fluid will move toward the outer curved side of the small-diameter centrifugal casting composite pipe 14. Under the flow of the cutting fluid, the impurity particles move along the inner wall of the outer curved side of the small-diameter centrifugal casting composite pipe 14, thereby achieving the effect of aggregating the impurity particles in the cutting fluid. After the cutting fluid undergoes centrifugal motion and the motion track inside the small-diameter centrifugally cast composite pipe 14 ends, the cutting fluid enters the top thick pipe 17 through the threaded joint 15, so that most of the cutting fluid inside the cooling box 2 enters the bottom thick pipe 8, the small-diameter centrifugally cast composite pipe 14 and the top thick pipe 17, thereby reducing the contact area between the cooled cutting fluid and the external environment and reducing the probability of the cutting fluid temperature loss. The impurities gathered on the inner wall of the outer bend of the small-diameter centrifugal casting composite tube 14 enter the top thick tube 17 above the filter screen plate 23 under the action of inertia. When the cutting fluid enters the top thick tube 17 with a large diameter from the small-diameter centrifugal casting composite tube 14 with a small diameter, its flow rate will decrease, which can buffer the impact-filled cutting fluid, reduce the contact force between the cutting fluid and the filter screen plate 23, and prevent the impurities filtered by the upper wall of the filter screen plate 23 from leaking out under the continuous impact of the cutting fluid and entering the silicon wafer processing area, thereby improving the filtering efficiency of the filter screen plate 23 for impurities in the cutting fluid; The controller 35 controls the adsorption electromagnet 27 to start, and the adsorption electromagnet 27 is energized to generate magnetism. The impurities inside the top thick tube 17 are adsorbed by the adsorption electromagnet 27 and reach the upper wall of the filter screen plate 23 at one end away from the threaded joint 15, so as to avoid the connection between the top thick tube 17 and the threaded joint 15 from being blocked. The cutting fluid in the upper half of the top thick tube 17 is filtered by the filter screen plate 23 and then sprayed to the processing area of ​​the photovoltaic silicon wafer through the cooling nozzle 19 together with the cutting fluid in the lower part of the top thick tube 17, so as to cool down the cutting processing operation of the photovoltaic silicon wafer. The distribution of impurities filtered by the upper wall of the filter screen plate 23 is observed by observing the glass layer 28. When the impurities filtered by the filter screen plate 23 enter the top thick tube 17 at one end of the observation glass layer 28 close to the threaded joint 15, it is necessary to clean the impurities adsorbed by the filter screen plate 23 inside the top thick tube 17. The rotating handle 18 is manually turned, and the rotating handle 18 drives the top thick tube 17 to rotate between the support bracket 34 and the threaded joint 15. The top thick tube 17 is unscrewed from the outside of the threaded joint 15, and the end of the top thick tube 17 away from the threaded joint 15 slides along the inner wall of the support bracket 34. , the communication opening between the top thick tube 17 and the threaded joint 15 is exposed, and the deformation of the reset spring 32 is utilized to pull the top thick tube 17 obliquely downward by rotating the handle 18, with the opening of the top thick tube 17 facing downward, to pour out the impurities filtered by the filter screen 23, and then the reset spring 32 is reset to drive the top thick tube 17 to change to a horizontal state through the support bracket 34, pushing the top thick tube 17, and the top thick tube 17 slides along the support bracket 34 close to the threaded joint 15, and the top thick tube 17 is rotated, and the top thick tube 17 is screwed into the outside of the threaded joint 15; the above operation can be repeated the next time it is used.

[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0031] The above is a description of the present solution and its implementation methods, which is not restrictive. The drawings show only one implementation method of the present solution, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creative design without departing from the creative purpose of the present solution, they should all fall within the protection scope of the present solution.

Claims

1. A cutting fluid filtering device for photovoltaic silicon wafer cutting, comprising a support frame (1), a cooling box (2) and a workbench (3), characterized in that: It also includes a tubular cooling mechanism (4), a scorpion-shaped infusion mechanism (12), a partition-type filtration mechanism (20) and an elastic supporting mechanism (29); The cooling box (2) is arranged through the inner wall of the support frame (1), the cooling box (2) is arranged with an upper end opening, a plurality of groups of the workbenches (3) are arranged on the upper wall of the cooling box (2), the tubular cooling mechanism (4) is arranged on the bottom wall of the cooling box (2), the scorpion-shaped infusion mechanism (12) is arranged at one end of the tubular cooling mechanism (4) away from the cooling box (2), the partition-type filtrate mechanism (20) is arranged on the scorpion-shaped infusion mechanism (12), and the elastic supporting mechanism (29) is arranged on a side of the support frame (1) close to the scorpion-shaped infusion mechanism (12); The tubular cooling mechanism (4) comprises a liquid pumping mechanism (5) and a cooling mechanism (9); The liquid pumping mechanism (5) is arranged on the bottom wall of the cooling box (2), and the cooling mechanism (9) is arranged at an end of the liquid pumping mechanism (5) away from the cooling box (2); The scorpion-shaped infusion mechanism (12) comprises a drag reduction mechanism (13) and a liquid buffering mechanism (16); The drag reduction mechanism (13) is arranged on a side of the liquid pumping mechanism (5) away from the cooling box (2), and the liquid buffering mechanism (16) is arranged on a side of the drag reduction mechanism (13) close to the cooling box (2); The partition-type filtrate mechanism (20) comprises a filtration mechanism (21) and an adsorption mechanism (25); The filtering mechanism (21) is arranged on the inner wall of the slow liquid mechanism (16), and the adsorption mechanism (25) is arranged on the upper wall of the slow liquid mechanism (16).

2. The cutting fluid filtering device for photovoltaic silicon wafer cutting according to claim 1, characterized in that: The liquid pumping mechanism (5) comprises a circulation pump (6), a liquid discharge pipe (7) and a bottom thick pipe (8); a plurality of the circulation pumps (6) are arranged on the bottom wall of the cooling box (2); the liquid pumping end of the circulation pump (6) is arranged through the interior of the cooling box (2); the liquid discharge pipe (7) is arranged at the liquid discharge end of the circulation pump (6); and the bottom thick pipe (8) is arranged on a side of the liquid discharge pipe (7) away from the circulation pump (6).

3. The cutting fluid filtering device for photovoltaic silicon wafer cutting according to claim 2, characterized in that: The cooling mechanism (9) comprises a cooling seat (10) and a thermoelectric cooling sheet group (11); the cooling seat (10) is arranged on the upper wall of the bottom thick tube (8); the thermoelectric cooling sheet group (11) is arranged to penetrate between the cooling seat (10) and the inner wall of the bottom thick tube (8); and the cooling end of the thermoelectric cooling sheet group (11) is arranged inside the bottom thick tube (8).

4. The cutting fluid filtering device for photovoltaic silicon wafer cutting according to claim 3, characterized in that: The drag reduction mechanism (13) comprises a small-diameter centrifugally cast composite pipe (14) and a threaded joint (15); the small-diameter centrifugally cast composite pipe (14) is connected to a side of the bottom thick pipe (8) away from the drainage pipe (7); and the threaded joint (15) is connected to a side of the small-diameter centrifugally cast composite pipe (14) away from the bottom thick pipe (8).

5. The cutting fluid filtering device for photovoltaic silicon wafer cutting according to claim 4, characterized in that: The liquid slowing mechanism (16) comprises a top thick tube (17), a rotating handle (18) and a cooling nozzle (19); the top thick tube (17) is connected to an end of the threaded joint (15) away from the small-diameter centrifugal casting composite tube (14); the top thick tube (17) is threadedly connected to the threaded joint (15); the rotating handle (18) is symmetrically arranged on both sides of the top thick tube (17); the cooling nozzle (19) is connected to a side of the top thick tube (17) away from the threaded joint (15); and the cooling nozzle (19) is arranged above the workbench (3).

6. The cutting fluid filtering equipment for photovoltaic silicon wafer cutting according to claim 5, characterized in that: The filtering mechanism (21) comprises a snap-fit ​​box (22), a filter screen plate (23) and an intercepting plate (24); the snap-fit ​​box (22) is symmetrically arranged on both sides of the bottom thick tube (8); the snap-fit ​​box (22) is connected to the bottom thick tube (8); the filter screen plate (23) is arranged between the inner walls of the snap-fit ​​box (22); and the intercepting plate (24) is arranged on the upper wall of one end of the filter screen plate (23) away from the threaded joint (15).

7. The cutting fluid filtering device for photovoltaic silicon wafer cutting according to claim 6, characterized in that: The adsorption mechanism (25) comprises an adsorption seat (26), an adsorption electromagnet (27) and an observation glass layer (28); the adsorption seat (26) is arranged on the upper wall of one end of the bottom thick tube (8) close to the cooling nozzle (19); the adsorption electromagnet (27) is arranged between the adsorption seat (26) and the inner wall of the top thick tube (17); and the observation glass layer (28) is arranged on the inner wall of one end of the top thick tube (17) away from the adsorption electromagnet (27).

8. The cutting fluid filtering device for photovoltaic silicon wafer cutting according to claim 7, characterized in that: The elastic support mechanism (29) comprises a connecting shaft (30), a connecting plate (31), a return spring (32), a hinged plate (33), a support frame (34) and a limit plate (36). A plurality of sets of hinged plates (33) are arranged at one end of the support frame (1) close to the top thick tube (17). The connecting shaft (30) is rotatably arranged at one end of the hinged plate (33) away from the support frame (1). The connecting plates (31) are symmetrically arranged on both sides of the connecting shaft (30). The return spring (32) is arranged between the connecting plate (31) and the hinged plate (33) on the outside of the connecting shaft (30). The support frame (34) is arranged on the outside of the connecting shaft (30). One end of the support frame (34) away from the connecting shaft (30) is sleeved on the outside of the top thick tube (17). The limit plate (36) is arranged on one side of the top thick tube (17) close to the cooling nozzle (19).

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