Chip bottom filling adhesive and preparation device thereof

Abstract

The invention discloses a chip bottom filling adhesive and a preparation device thereof, and relates to the technical field of filling adhesives, the chip bottom filling adhesive is mainly prepared from the following raw materials by weight: 15-50% of epoxy resin, 1-20% of a flexibilizer, and 0.1-1% of a dispersant. The epoxy resin and the curing agent are main bonding components and determine the strength and the heat resistance of the glue, the toughening agent and the dispersing agent are used for improving the toughness and the uniformity of the glue, and the defoaming agent and the coupling agent are beneficial for reducing bubbles and improving the compatibility with other materials. The pigment and the filler are used for adjusting the color and the volume of the glue, and the diluent is used for adjusting the viscosity of the glue.

Description

Technical Field

[0001] The invention relates to the technical field related to chips and mixed preparation, and in particular to a chip bottom filling glue and a preparation device thereof. Background Art

[0002] As the development of electronic products tends to be miniaturized, thin and light, and high-performance, IC packaging also tends to be miniaturized and highly integrated. By using bottom filling, the stress on the chip can be dispersed, the impact of the solder ball on the impact and bending of external forces can be reduced, the welding part can be prevented from breaking, and the reliability of the entire product can be improved. Therefore, bottom filling has become a necessary process to improve the reliability of electronic products. Bottom filling glue technology is becoming more and more important. Bottom filling glue simply means bottom filling. The conventional definition is a chemical glue with the main component of epoxy resin to fill the bottom of the BGA package mode chip. By using the heated curing form, the gap at the bottom of the BGA is filled with a large area, generally covering more than 80%, so as to achieve the purpose of reinforcement and enhance the drop resistance between the BGA package mode chip and PCBA. There are also some unconventional uses of bottom filling glue, which is to use some instant glue or room temperature curing glue to fill the four sides or some corners of the BGA package mode chip to achieve the purpose of reinforcement.

[0003] The chip bottom filling glue preparation device currently used needs to extrude and package the glue through other equipment after mixing and stirring the glue liquid. Multiple operations also require the assistance of mobile equipment, which is troublesome and cumbersome. In addition, since the size of the discharge port is fixed, but the viscosity of the manufactured glue liquid is different, during discharge, the glue liquid with lower viscosity is prone to splashing and polluting the working environment, while the glue liquid with too thick viscosity will have the problem of slow discharge and blockage of the discharge port. At the same time, it cannot be adapted to different packaging containers, which is inconvenient to use. Summary of the invention

[0004] In order to solve the defects in the prior art, the present invention provides a chip bottom filling glue and a preparation device thereof.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: The present invention discloses a chip bottom filling glue, which is mainly prepared from the following raw materials in parts by weight: Epoxy resin: 15-50%; ‌Toughening agent‌: 1~20%; Dispersant: 0.1~1%; Defoaming agent: 0.01~1%; ‌Coupling agent‌: 0.8~10%; Pigment: 0.1-0.5%; Filler: 40-70%; Curing agent: 3-30%; ‌Diluent‌: 1~20%; The chip bottom filling glue is made by mixing the above raw materials.

[0006] The ratio of these ingredients determines the physical and chemical properties of the bottom filler, including curing shrinkage, reliability, and fluidity. Epoxy resin and curing agent are the main bonding ingredients, which determine the strength and heat resistance of the glue. Tougheners and dispersants are used to improve the toughness and uniformity of the glue. Defoamers and coupling agents help reduce bubbles and improve compatibility with other materials. Pigments and fillers are used to adjust the color and volume of the glue. Diluents are used to adjust the viscosity of the glue for easy construction. The present invention discloses a chip bottom filling glue and a preparation device thereof, comprising a mixed glue liquid barrel with a bearing seat fixed on the top, the bottom opening of the mixed glue liquid barrel extending downward to form a glue liquid outlet end, and a main glue liquid inlet pipe is rotatably installed on the top of the mixed glue liquid barrel, a plurality of side glue liquid inlet pipes are installed on the outer surface of the main glue liquid inlet pipe, a glue liquid storage cylinder is fixedly installed in the bearing seat, and a glue pump is fixed at the bottom of the glue liquid storage cylinder, the glue liquid inlet pipe of the glue pump penetrates the outer wall of the glue liquid storage cylinder and extends below the liquid level inside the glue liquid storage cylinder, and the glue liquid outlet of the glue pump is connected to the top of the main glue liquid inlet pipe; The stirring and mixing mechanism is arranged inside the mixed glue barrel and is configured to drive the side glue inlet pipe to rotate and stir, and includes a mounting support plate fixedly mounted on the outer surface of the side glue inlet pipe, and the mounting support plate is fitted and rotated on the inner wall of the mixed glue barrel, and a driving motor is fixed on the top of the mixed glue barrel, and a transmission gear is fixed on the output shaft of the driving motor and the outer surface of the main glue inlet pipe, and the two transmission gears are meshed with each other; The glue pushing mechanism is arranged inside the mixed glue liquid barrel and is configured to automatically push the glue to discharge the glue liquid.

[0007] The discharge amount adjustment mechanism is arranged at the glue outlet of the mixed glue barrel and is configured to adjust the discharge size of the outlet; Support columns are provided on both sides of the mixed glue barrel. The mixed glue barrel is rotatably installed between the two support columns. A rotating motor is fixed to the side of one of the supporting columns. The mixed glue barrel is fixedly connected to the output shaft of the rotating motor.

[0008] The above scheme is adopted, by setting a driving motor, a transmission gear and an installation support plate, and utilizing the meshing transmission between the two transmission gears, the driving motor drives one of the transmission gears to rotate, thereby driving the other transmission gear to drive the main glue inlet pipe to rotate, and the rotation of the main glue inlet pipe drives the installation support plate and the side glue inlet pipe to rotate synchronously, and the glue in the mixed glue barrel can be stirred and mixed while the side glue inlet pipe rotates, so that the glue is fully mixed together; by setting a rotating motor, the rotating motor can be used to adjust the rotation angle of the mixed glue barrel, and it can be turned upside down during the mixing process to improve the mixing effect. At the same time, the mixing glue barrel can be turned upside down to adjust the position of the glue pushing weight, which is convenient for the glue inlet and the glue pushing weight to use its own weight to discharge the glue.

[0009] In the above solution, it should be noted that the driving motor and the rotating motor are both electrically connected to the external controller via an external power supply.

[0010] As a preferred technical solution of the present invention, a plurality of scraper plates are fixed to the bottom of the mounting support plate, and the outer surfaces of the scraper plates are in contact with the inner wall of the mixed glue barrel.

[0011] By adopting the above scheme, a scraper is provided to scrape off the glue adhering to the inner wall of the mixed glue barrel to ensure that the glue at the edge can also be fully mixed, avoid the problem of insufficient mixing of the edge glue, and improve the mixing effect.

[0012] As a preferred technical solution of the present invention, the glue pushing mechanism includes a glue pushing weight block that is slidably arranged in the mixed glue barrel, and the glue pushing weight block is slidably arranged on the side glue inlet pipe and the surface of the scraper plate, the bottom of the glue pushing weight block is provided with a slot for use in conjunction with the scraper plate, and the bottom of the glue pushing weight block is fixed with a protruding extrusion block for use in conjunction with the glue outlet end of the bottom of the mixed glue barrel.

[0013] By adopting the above scheme, by setting a glue pushing weight block, the glue pushing weight block can automatically squeeze and discharge the glue liquid downward during the process of discharging the glue liquid, so as to avoid the glue liquid remaining in the mixed glue liquid barrel, so that the glue liquid can be discharged more thoroughly and the discharge efficiency can be improved at the same time. As a preferred technical solution of the present invention, a compression drive spring is fixed to the bottom of the mounting support plate, and the other end of the compression drive spring is fixedly mounted on the rubber pushing weight block.

[0014] By adopting the above scheme, a compression driving spring is set up, and the elasticity of the compression driving spring itself can be used to apply a certain downward force to the rubber pushing weight block, so as to ensure that the rubber pushing weight block can automatically move downward back to its original position, thereby preventing the rubber pushing weight block from getting stuck. At the same time, it can reduce the weight of the rubber pushing weight block itself and ensure the completion of the rubber pushing and discharging work.

[0015] As a preferred technical solution of the present invention, the output adjustment mechanism includes a mounting shell fixed on the surface of the glue outlet end at the bottom of the mixed glue barrel, the mounting shell is provided with discharge ports at the upper and lower ends of the glue outlet end facing the mixed glue barrel, and a rotating plate is rotatably installed in the mounting shell, and a plurality of fitting adjustment blocks are provided in the mounting shell, and a limit block and a guide rod are fixedly installed on the upper and lower surfaces of the adjustment block, respectively, the limit block is slidably set in a polygonal slide groove opened on the rotating plate, and the guide rod is slidably set in a strip slideway opened on the mounting shell.

[0016] By adopting the above scheme, by setting up an installation shell, a rotating plate, an adjustment block, a limit block and a guide rod, the rotating plate rotates while the limit block slides in the polygonal slide groove, and the sliding of the limit block drives the adjustment block to move. At the same time, the strip slide limits the adjustment block through the guide rod, so that multiple adjustment blocks fit together and move to form a polygonal opening. At the same time, the size of the polygonal opening can be adjusted with the movement between the multiple adjustment blocks, so that the size of the discharge port can be adjusted to meet different needs, meet the adaptation of various containers, and improve the scope of application.

[0017] As a preferred technical solution of the present invention, a sliding rod is fixed on the rotating plate, a movement channel for the sliding rod to move is opened on the mounting shell, an electric push rod is fixed to the bottom of the mixed glue barrel, a sliding cross frame is fixed to the output end of the electric push rod, and the sliding rod is slidably arranged in the sliding cross frame.

[0018] By adopting the above scheme, an electric push rod, a sliding cross frame and a sliding rod are set up, and the electric push rod is used to push the sliding cross frame to move, and at the same time, the sliding rod is driven to move in the sliding cross frame. Then, the movement of the sliding rod drives the rotating plate to move, causing the rotating plate to rotate, thereby realizing the adjustment of the angle of the rotating plate, and further realizing the adjustment of the size of the discharge port.

[0019] In the above solution, it should be noted that the electric push rod is electrically connected to the external controller via an external power supply.

[0020] As a preferred technical solution of the present invention, a vacuum debubble machine is fixed to the side of one of the supporting columns, and the air inlet pipe of the vacuum debubble machine is connected to the glue outlet end of the mixed glue barrel.

[0021] By adopting the above scheme, a vacuum degassing machine is set up to extract the gas inside the mixed glue barrel. The internal bubbles begin to expand and move to the surface due to the external pressure difference, and finally burst and release on the surface of the glue liquid, thereby achieving the purpose of eliminating bubbles.

[0022] In the above solution, it should be noted that the vacuum degassing machine is electrically connected to the external controller via an external power supply.

[0023] As a preferred technical solution of the present invention, a temperature regulating plate is installed outside the mixed glue barrel.

[0024] By adopting the above scheme, the temperature of the mixed glue barrel can be controlled by setting a temperature regulating plate to meet various usage requirements.

[0025] In the above solution, it should be noted that the temperature regulating plate is electrically connected to the external controller via an external power supply.

[0026] The beneficial effects of the present invention are: 1. The chip bottom filling glue and its preparation device are provided with a mixed glue barrel, a glue storage barrel, a main glue inlet pipe, a side glue inlet pipe and a glue pump. The glue in the glue storage barrel is extracted by the glue pump, so that the glue enters the main glue inlet pipe and then enters the inner wall of the mixed glue barrel through each side glue inlet pipe, so that the newly added glue can be dispersed to different positions in the mixed glue barrel to avoid accumulation in the same position, so that the newly added glue can be quickly mixed, thereby improving the overall mixing efficiency of the glue.

[0027] 2. By setting a driving motor, a transmission gear and an installation support plate, and utilizing the meshing transmission between the two transmission gears, the driving motor drives one of the transmission gears to rotate, thereby driving the other transmission gear to drive the main glue inlet pipe to rotate. The rotation of the main glue inlet pipe drives the installation support plate and the side glue inlet pipe to rotate synchronously. While the side glue inlet pipe rotates, it can stir and mix the glue inside the mixed glue barrel so that the glue is fully mixed together.

[0028] 3. This chip bottom filling glue and its preparation device, by setting a glue pushing weight block, utilizes the weight of the glue pushing weight block itself, can automatically squeeze and discharge the glue liquid downward during the process of discharging the glue liquid, avoids the glue liquid from remaining in the mixed glue liquid barrel, makes the glue liquid discharge more thorough, and improves the discharge efficiency at the same time.

[0029] 4. This type of chip bottom filling glue and its preparation device, by setting a compression driving spring, can use the elasticity of the compression driving spring itself to exert a certain downward force on the glue pushing weight block, so as to ensure that the glue pushing weight block can automatically move downward back to its original position, and prevent the glue pushing weight block from getting stuck. At the same time, it can reduce the weight of the glue pushing weight block itself and ensure the completion of the glue pushing liquid and glue discharge work.

[0030] 5. This chip bottom filling glue and its preparation device are provided with an installation shell, a rotating plate, an adjustment block, a limit block and a guide rod. When the rotating plate rotates, the limit block slides in the polygonal slide groove, and the sliding of the limit block drives the adjustment block to move. At the same time, the strip slide limits the adjustment block through the guide rod, so that multiple adjustment blocks fit together and move to form a polygonal opening. At the same time, the size of the polygonal opening can be adjusted with the movement between the multiple adjustment blocks, so that the size of the discharge port can be adjusted to meet different needs, meet the adaptation of various containers, and improve the scope of application.

[0031] 6. This chip bottom filling glue and its preparation device are provided with an electric push rod, a sliding cross frame and a sliding rod. The electric push rod is used to push the sliding cross frame to move, and at the same time, the sliding rod is driven to move in the sliding cross frame. Then, the sliding rod moves while driving the rotating plate to rotate, thereby adjusting the angle of the rotating plate and further adjusting the size of the discharge port.

[0032] 7. This chip bottom filling glue and its preparation device are provided with a vacuum degassing machine, and the gas inside the mixed glue liquid barrel is extracted by the vacuum degassing machine. The internal bubbles begin to expand and move to the surface due to the external pressure difference, and finally burst and release on the surface of the material glue liquid, thereby achieving the purpose of eliminating bubbles. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 It is a schematic structural diagram of a chip bottom filling glue and a preparation device thereof according to the present invention; Figure 2 It is a schematic cross-sectional structure diagram of a chip bottom filling glue and a mixed glue liquid barrel of a preparation device thereof according to the present invention; Figure 3 It is a schematic structural diagram of a chip bottom filling glue and a stirring and mixing mechanism of a preparation device thereof according to the present invention; Figure 4 It is a schematic structural diagram of a chip bottom filling glue and a transmission gear of a preparation device thereof according to the present invention; Figure 5 It is a structural schematic diagram of a chip bottom filling glue and a glue pushing mechanism of a preparation device thereof according to the present invention; Figure 6 It is a schematic structural diagram of a chip bottom filling glue and a protruding extrusion block of a preparation device thereof according to the present invention; Figure 7 It is a schematic structural diagram of a chip bottom filling glue and a vacuum degassing machine for preparing the same according to the present invention; Figure 8It is a structural schematic diagram of a chip bottom filling glue and an output adjustment mechanism of a preparation device thereof according to the present invention; Fig. 9 It is a schematic structural diagram of another angle of a chip bottom filling glue and an output adjustment mechanism of a preparation device thereof of the present invention; Fig.10 It is a schematic diagram of the exploded structure of a chip bottom filling glue and an output adjustment mechanism of a preparation device thereof according to the present invention; Fig.11 It is a schematic diagram of the exploded structure of a chip bottom filling glue and an output adjustment mechanism of a preparation device thereof according to the present invention from another angle; Fig.12 The invention discloses a schematic cross-sectional structure of a chip bottom filling adhesive and a mounting shell of a preparation device thereof.

[0034] In the figure: 1. Mixing glue barrel; 2. Bearing seat; 3. Glue storage cylinder; 4. Glue pump; 5. Main glue inlet pipe; 6. Side glue inlet pipe; 7. Support column; 8. Stirring and mixing mechanism; 801. Mounting support plate; 802. Glue scraper; 803. Driving motor; 804. Transmission gear; 9. Glue pushing mechanism; 901. Glue pushing weight; 902. Compression driving spring; 903. Protruding extrusion block; 10. Output adjustment mechanism; 1001. Mounting shell; 1002. Rotating plate; 1003. Adjustment block; 1004. Limiting block; 1005. Guide rod; 1006. Sliding rod; 1007. Electric push rod; 1008. Sliding crossbeam; 11. Vacuum defoaming machine; 12. Temperature control plate; 13. Rotating motor. DETAILED DESCRIPTION

[0035] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0036] Example A chip bottom filling glue is mainly prepared from the following raw materials in parts by weight: Epoxy resin: 15-50%; ‌Toughening agent‌: 1~20%; Dispersant: 0.1~1%; Defoaming agent: 0.01~1%; ‌Coupling agent‌: 0.8~10%; Pigment: 0.1-0.5%; Filler: 40-70%; Curing agent: 3-30%; ‌Diluent‌: 1~20%; The chip bottom filling glue is made by mixing the above raw materials.

[0037] like Figure 1-Figure 4 As shown, a device for preparing chip bottom filling glue of the present invention comprises a mixed glue barrel 1 with a bearing seat 2 fixed on the top, the bottom opening of the mixed glue barrel 1 extends downward to form a glue outlet, and a main glue inlet pipe 4 is rotatably installed on the top of the mixed glue barrel 1, and a plurality of side glue inlet pipes 5 are installed on the outer surface of the main glue inlet pipe 4, a glue storage cylinder 3 is fixedly installed in the bearing seat 2, and a glue pump 4 is fixed at the bottom of the glue storage cylinder 3, the glue inlet pipe of the glue pump 4 penetrates the outer wall of the glue storage cylinder 3 and extends below the liquid level inside the glue storage cylinder 3, and the glue outlet of the glue pump 4 is connected to the top of the main glue inlet pipe 4; By arranging a mixed glue liquid barrel 1, a glue liquid storage barrel 3, a main glue liquid inlet pipe 4, a side glue liquid inlet pipe 5 and a glue pump 4, the glue liquid in the glue liquid storage barrel 3 is extracted by the glue pump 4, so that the glue enters the main glue liquid inlet pipe 4 and then enters the inner wall of the mixed glue liquid barrel 1 through each side glue liquid inlet pipe 5, so that the newly added glue can be dispersed to different positions in the mixed glue liquid barrel 1 to avoid accumulation in the same position, so that the newly added glue can be quickly mixed, thereby improving the overall mixing efficiency of the glue liquid.

[0038] like Figure 2-Figure 4 As shown, the stirring and mixing mechanism 8 is arranged inside the mixed glue barrel 1, and is equipped to drive the side glue inlet pipe 5 to rotate and stir, including a mounting support plate 801 fixedly mounted on the outer surface of the side glue inlet pipe 5, and the mounting support plate 801 is rotated in close contact with the inner wall of the mixed glue barrel 1, and a driving motor 803 is fixed on the top of the mixed glue barrel 1, and a transmission gear 804 is fixed on the output shaft of the driving motor 803 and the outer surface of the main glue inlet pipe 4, and the two transmission gears 804 are meshed with each other; By setting a driving motor 803, a transmission gear 804 and an installation support plate 801, and utilizing the meshing transmission between the two transmission gears 804, the driving motor 803 drives one of the transmission gears 804 to rotate, thereby driving the other transmission gear 804 to drive the main glue inlet pipe 4 to rotate. The rotation of the main glue inlet pipe 4 drives the installation support plate 801 and the side glue inlet pipe 5 to rotate synchronously. While the side glue inlet pipe 5 rotates, it can stir and mix the glue inside the mixed glue barrel 1, so that the glue is fully mixed together.

[0039] Among them, Figure 2-Figure 4 As shown, a plurality of scrapers 802 are fixed to the bottom of the mounting support plate 801, and the outer surface of the scraper 802 is in contact with the inner wall of the mixed glue barrel 1; by setting the scraper 802, the scraper 802 can be used to scrape off the glue adhering to the inner wall of the mixed glue barrel 1 to ensure that the glue at the edge can also be fully mixed, avoid the problem of insufficient mixing of the glue at the edge, and improve the mixing effect.

[0040] like Figure 2 , Figure 5 and Figure 6 As shown, the glue pushing mechanism 9 is arranged inside the mixed glue barrel 1 and is equipped for automatically pushing glue to discharge glue, wherein the glue pushing mechanism 9 includes a glue pushing weight 901 which is slidably arranged inside the mixed glue barrel 1, and the glue pushing weight 901 is slidably arranged on the surface of the side glue inlet pipe 5 and the scraper 802, and a card slot which is used in conjunction with the scraper 802 is arranged at the bottom of the glue pushing weight 901, and a protruding extrusion block 903 which is used in conjunction with the glue outlet end at the bottom of the mixed glue barrel 1 is fixed at the bottom of the glue pushing weight 901; By setting the glue pushing weight 901 and utilizing its own weight, the glue liquid can be automatically squeezed downward to discharge the glue liquid during the glue liquid discharge process, thereby preventing the glue liquid from remaining inside the mixed glue liquid barrel 1, making the glue liquid discharge more thorough and improving the discharge efficiency.

[0041] Among them, Figure 5 As shown, a compression drive spring 902 is fixed to the bottom of the mounting support plate 801, and the other end of the compression drive spring 902 is fixedly mounted on the rubber pushing weight block 901; by setting the compression drive spring 902, the elasticity of the compression drive spring 902 itself can be utilized to exert a certain downward force on the rubber pushing weight block 901, so as to ensure that the rubber pushing weight block 901 can automatically move downward back to its original position, and prevent the rubber pushing weight block 901 from getting stuck. At the same time, it can reduce the weight of the rubber pushing weight block 901 itself, and ensure the completion of the work of pushing and discharging the rubber liquid.

[0042] The amount adjustment mechanism 10 is arranged at the glue outlet of the mixed glue barrel 1 and is equipped to adjust the outlet discharge size; wherein, the amount adjustment mechanism 10 includes a mounting shell 1001 fixed on the surface of the glue outlet end at the bottom of the mixed glue barrel 1, the mounting shell 1001 is provided with discharge ports above and below the glue outlet end facing the mixed glue barrel 1, and a rotating plate 1002 is rotatably installed in the mounting shell 1001, and a plurality of fitting adjustment blocks 1003 are arranged in the mounting shell 1001, and a limit block 1004 and a guide rod 1005 are fixedly installed on the upper and lower surfaces of the adjustment block 1003, respectively, the limit block 1004 is slidably arranged in a polygonal slide groove provided on the rotating plate 1002, and the guide rod 1005 is slidably arranged in a strip slideway provided on the mounting shell 1001; By setting up the installation shell 1001, the rotating plate 1002, the adjustment block 1003, the limit block 1004 and the guide rod 1005, the rotating plate 1002 rotates while the limit block 1004 slides in the polygonal slide groove, and the sliding of the limit block 1004 drives the adjustment block 1003 to move. At the same time, the strip slide limits the adjustment block 1003 through the guide rod 1005, so that the multiple adjustment blocks 1003 fit together and move to form a polygonal opening. At the same time, the size of the polygonal opening can be adjusted with the movement between the multiple adjustment blocks 1003, so that the size of the discharge port can be adjusted to meet different needs, meet the adaptation of various containers, and improve the scope of application.

[0043] Among them, Figure 7-Figure 12 As shown, a slide bar 106 is fixed on the rotating plate 1002, a movement channel for the slide bar 106 to move is opened on the mounting housing 1001, an electric push rod 107 is fixed at the bottom of the mixed glue barrel 1, a sliding cross frame 108 is fixed at the output end of the electric push rod 107, and the slide bar 106 is slidably arranged in the sliding cross frame 108; By setting an electric push rod 107, a sliding cross frame 108 and a slide bar 106, the electric push rod 107 is used to push the sliding cross frame 108 to move, and at the same time, the slide bar 106 is driven to move in the sliding cross frame 108, and then the movement of the slide bar 106 drives the rotating plate 1002 to move, so that the rotating plate 1002 rotates, thereby realizing the adjustment of the angle of the rotating plate 1002, and further realizing the adjustment of the size of the discharge port.

[0044] like Figure 1 As shown, supporting columns 7 are provided on both sides of the mixed glue barrel 1, and the mixed glue barrel 1 is rotatably installed between the two supporting columns 7. A rotating motor 13 is fixed to the side of one of the supporting columns 7, and the mixed glue barrel 1 is fixedly connected to the output shaft of the rotating motor 13; by providing the rotating motor 13, the rotating motor 13 can be used to adjust the rotation angle of the mixed glue barrel 1, and the mixing effect can be improved by flipping the mixed glue barrel 1 up and down during the mixing process. At the same time, the position of the glue pushing weight can be adjusted by flipping the mixed glue barrel 1 up and down, which is convenient for the glue feeding and the glue pushing weight to use its own weight to discharge the glue.

[0045] Among them, Figure 7 As shown, a vacuum debubble machine 11 is fixed to the side of one of the supporting columns 7, and the air inlet pipe of the vacuum debubble machine 11 is connected to the glue outlet end of the mixed glue barrel 1; by setting up the vacuum debubble machine 11, the vacuum debubble machine 11 is used to extract the internal gas of the mixed glue barrel 1, and the internal bubbles begin to expand and move to the surface due to the effect of the external pressure difference, and finally burst and release on the surface of the material glue, thereby achieving the purpose of eliminating bubbles.

[0046] Among them, Figure 1As shown, a temperature regulating plate 12 is installed outside the mixed glue liquid barrel 1. By setting the temperature regulating plate 12, the temperature of the mixed glue liquid barrel 1 can be controlled to meet various usage requirements.

[0047] The present invention discloses a chip bottom filling glue, and the chip bottom filling glue is made by the above-mentioned preparation device.

[0048] How it works When working: Glue feeding: by controlling to start the rotating motor 13, the rotating motor 13 drives the mixed glue barrel 1 to rotate, so that the mixed glue barrel 1 turns upside down, and then the rotating motor 13 is turned off, and after adding glue into the glue storage barrel 3, the glue pump 4 is turned on to drive the glue pump 4 to extract the glue inside the glue storage barrel 3, so that the glue enters the main glue inlet pipe 4, and then enters the inner wall of the mixed glue barrel 1 through each side glue inlet pipe 5, so that the glue is dispersed to different positions in the mixed glue barrel 1; The temperature of the mixed glue barrel 1 is controlled by the temperature regulating plate 12; Mixing: Turn on the driving motor 803, which drives one of the transmission gears 804 to rotate, thereby driving the other transmission gear 804 to drive the main glue inlet pipe 4 to rotate. The rotation of the main glue inlet pipe 4 drives the mounting support plate 801 and the side glue inlet pipe 5 to rotate synchronously. When the side glue inlet pipe 5 rotates, it can stir and mix the glue in the mixed glue barrel 1, so that the glue is fully mixed together; Defoaming: After the mixing is completed, the rotating motor 13 is controlled to be turned on, and the rotating motor 13 drives the mixed glue barrel 1 to rotate, so that the mixed glue barrel 1 is turned upside down, and then the rotating motor 13 is turned off, and the air defoaming machine is turned on. The vacuum defoaming machine 11 is used to extract the gas inside the mixed glue barrel 1. The bubbles inside begin to expand and move to the surface due to the external pressure difference, and finally burst and release on the surface of the material glue liquid, so as to eliminate the bubbles; Glue removal: Control to open the electric push rod 107, the electric push rod 107 pushes the sliding frame 108 to move, and drives the slide bar 106 to move in the sliding frame 108, and then the slide bar 106 moves while driving the rotating plate 1002 to rotate, and the rotating plate 1002 rotates while causing the limit block 1004 to slide in the polygonal slide groove, and the limit block 1004 slides and drives the adjustment block 1003 to move, and at the same time, the strip slide limits the adjustment block 1003 through the guide rod 1005, so that multiple adjustment blocks 1003 fit together and move to form a polygonal opening, and at the same time, the size of the polygonal opening can be adjusted with the movement between the multiple adjustment blocks 1003; Glue pushing: The glue pushing weight 901 can automatically squeeze and discharge the glue downwards during the glue discharging process by utilizing its own weight, thereby preventing the glue from remaining inside the mixed glue barrel 1 and completing the glue discharging work.

[0049] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein. Any modification, replacement, and improvement made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A chip bottom filling glue, characterized in that: It is mainly prepared from the following raw materials in parts by weight: Epoxy resin: 15-50%; ‌Toughening agent‌: 1~20%; Dispersant: 0.1~1%; Defoaming agent: 0.01~1%; ‌Coupling agent‌: 0.8~10%; Pigment: 0.1-0.5%; Filler: 40-70%; Curing agent: 3-30%; ‌Diluent‌: 1~20%; The chip bottom filling glue is made by mixing the above raw materials.

2. A device for preparing chip bottom filling glue, applied to the chip bottom filling glue according to claim 1, characterized in that: It comprises a mixed glue liquid barrel (1) with a bearing seat (2) fixed on the top, the bottom opening of the mixed glue liquid barrel (1) extends downward to form a glue liquid outlet, and a main glue liquid inlet pipe (4) is rotatably mounted on the top of the mixed glue liquid barrel (1), and a plurality of side glue liquid inlet pipes (5) are mounted on the outer surface of the main glue liquid inlet pipe (4), a glue liquid storage cylinder (3) is fixedly mounted inside the bearing seat (2), and a glue pump (4) is fixed at the bottom of the glue liquid storage cylinder (3), the glue liquid inlet pipe of the glue pump (4) penetrates the outer wall of the glue liquid storage cylinder (3) and extends below the liquid level inside the glue liquid storage cylinder (3), and the glue liquid outlet of the glue pump (4) is connected to the top of the main glue liquid inlet pipe (4); A stirring and mixing mechanism (8) is disposed inside the mixed glue liquid barrel (1) and is configured to drive the side glue liquid inlet pipe (5) to rotate and stir; A glue pushing mechanism (9) is arranged inside the mixed glue liquid barrel (1) and is configured to automatically push the glue to discharge the glue liquid; An output adjustment mechanism (10) is arranged at the glue outlet of the mixed glue barrel (1) and is configured to adjust the outlet discharge size; Support columns (7) are provided on both sides of the mixed glue barrel (1). The mixed glue barrel (1) is rotatably mounted between the two support columns (7). A rotating motor (13) is fixed to the side of one of the support columns (7). The mixed glue barrel (1) is fixedly connected to the output shaft of the rotating motor (13).

3. The device for preparing chip bottom filling glue according to claim 2, characterized in that: The stirring and mixing mechanism (8) comprises a mounting support plate (801) fixedly mounted on the outer surface of the side glue liquid inlet pipe (5), and the mounting support plate (801) is rotatably fitted on the inner wall of the mixed glue liquid barrel (1), a driving motor (803) is fixed on the top of the mixed glue liquid barrel (1), a transmission gear (804) is fixed on the output shaft of the driving motor (803) and the outer surface of the main glue liquid inlet pipe (4), and the two transmission gears (804) are meshed with each other, and a plurality of scraping plates (802) are fixed on the bottom of the mounting support plate (801), and the outer surfaces of the scraping plates (802) are fitted on the inner wall of the mixed glue liquid barrel (1).

4. The device for preparing chip bottom filling glue according to claim 3, characterized in that: The glue pushing mechanism (9) comprises a glue pushing weight (901) which is slidably arranged in the mixed glue barrel (1), and the glue pushing weight (901) is slidably arranged on the surface of the side glue inlet pipe (5) and the glue scraper (802), a slot for use in conjunction with the glue scraper (802) is provided at the bottom of the glue pushing weight (901), and a protruding extrusion block (903) for use in conjunction with the glue outlet end at the bottom of the mixed glue barrel (1) is fixed at the bottom of the glue pushing weight (901).

5. The device for preparing chip bottom filling glue according to claim 4, characterized in that: A compression drive spring (902) is fixed to the bottom of the mounting support plate (801), and the other end of the compression drive spring (902) is fixedly mounted on the rubber pushing weight block (901).

6. The device for preparing chip bottom filling glue according to claim 2, characterized in that: The output adjustment mechanism (10) comprises a mounting shell (1001) fixed on the surface of the glue outlet end at the bottom of the mixed glue barrel (1); the mounting shell (1001) is provided with discharge ports at the upper and lower ends of the glue outlet end facing the mixed glue barrel (1); a rotating plate (1002) is rotatably mounted in the mounting shell (1001); a plurality of matching adjustment blocks (1003) are arranged in the mounting shell (1001); a limit block (1004) and a guide rod (1005) are fixedly mounted on the upper and lower surfaces of the adjustment block (1003), respectively; the limit block (1004) is slidably arranged in a polygonal slide groove provided on the rotating plate (1002); and the guide rod (1005) is slidably arranged in a strip slideway provided on the mounting shell (1001).

7. The device for preparing chip bottom filling glue according to claim 6, characterized in that: A sliding rod (106) is fixed on the rotating plate (1002), a movement channel for the sliding rod (106) to move is provided on the mounting housing (1001), an electric push rod (107) is fixed to the bottom of the mixed glue barrel (1), a sliding cross frame (108) is fixed to the output end of the electric push rod (107), and the sliding rod (106) is slidably arranged in the sliding cross frame (108).

8. The device for preparing chip bottom filling glue according to claim 2, characterized in that: A vacuum debubble machine (11) is fixed to the side of one of the supporting columns (7), and an air inlet pipe of the vacuum debubble machine (11) is connected to the glue liquid outlet end of the mixed glue liquid barrel (1).

9. The device for preparing chip bottom filling glue according to claim 2, characterized in that: A temperature regulating plate (12) is installed outside the mixed glue barrel (1).

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