Method for detecting consumption state of atomizing substrate and atomizing equipment

Abstract

According to the embodiment of the invention, the invention provides a method for detecting the consumption state of an atomization substrate and atomization equipment. The method includes monitoring an electrical resistance of a heating element for heating the aerosolized substrate during a first aerosolizing action on the aerosolized substrate; determining, based on the monitoring, a cumulative amount over time of a difference between the monitored resistance and a reference resistance indicative of a resistance of the heating element that varies over time in the event of sufficient aerosolized substrate; and detecting a depletion state of the atomization substrate during the first atomization action based on the cumulant. Therefore, the accuracy of detection of the consumption state of the atomized matrix can be improved.

Description

Technical Field

[0001] Example embodiments of the present disclosure generally relate to the field of atomization devices, and more particularly to a method and atomization device for detecting a consumption state of an atomization substrate. Background Art

[0002] In recent years, the consumer group of atomization devices such as electronic atomization devices has gradually increased in the market. With the development of the market and the changes in user needs, this trend is expected to continue to grow. In the atomization device, a heating element is used to heat the atomization matrix to atomize it. If the atomization matrix has been exhausted and the heating element is still heating, the atomization device will have a dry burning problem. Summary of the invention

[0003] Embodiments of the present disclosure provide a method for detecting a consumption state of an atomization substrate and an atomization device.

[0004] In a first aspect of the present disclosure, a method for detecting a consumption state of an atomized substrate is provided. The method comprises: during a first atomization action of the atomized substrate, monitoring the resistance of a heating element for heating the atomized substrate; based on the monitoring, determining the cumulative amount of the difference between the monitored resistance and a reference resistance over time, the reference resistance indicating the resistance of the heating element that changes over time when the atomized substrate is sufficient; and based on the cumulative amount, detecting the consumption state of the atomized substrate during the first atomization action.

[0005] In some embodiments of the first aspect, determining the cumulative amount includes: determining a characteristic time point based on a change trend of the monitored resistance, where the change trend changes at the characteristic time point; and cumulatively determining the difference between the monitored resistance and the reference resistance according to a sampling time interval starting from the characteristic time point.

[0006] In some embodiments of the first aspect, the stage before the characteristic time point corresponds to a temperature rise stage of the atomized substrate, and the stage after the characteristic time point corresponds to a thermal equilibrium stage of the atomized substrate.

[0007] In some embodiments of the first aspect, detecting the consumption status of the atomized substrate during the first atomization action includes: in response to the cumulative amount exceeding a first threshold, determining that the atomized substrate is in an insufficient state during the first atomization action, and the method also includes at least one of the following: presenting an alarm message of insufficient atomized substrate, or causing the heating element to stop heating the atomized substrate.

[0008] In some embodiments of the first aspect, the method further includes: monitoring the resistance of the heating element during a second atomization action prior to the first atomization action; determining a resistance difference between the resistance monitored during the second atomization action and a reference resistance, and wherein determining that the atomized substrate is in an insufficient state during the first atomization action includes: determining that the atomized substrate is in an insufficient state during the first atomization action in response to the resistance difference exceeding a second threshold and the cumulative amount exceeding a first threshold.

[0009] In some embodiments of the first aspect, the method further includes: in response to the resistance difference exceeding a second threshold, performing at least one of the following: stopping the heating element from heating the atomized substrate, or presenting warning information about the consumption status of the atomized substrate.

[0010] In some embodiments of the first aspect, the method further includes: if it is detected that the atomized substrate is in a sufficient state during the first atomization action, replacing the reference resistor with the resistance monitored over time during the first atomization action for use during a third atomization action after the first atomization action.

[0011] In a second aspect of the present disclosure, an atomization device is provided, comprising: a heating element configured to heat an atomization substrate; and a processor configured to: monitor the resistance of the heating element during a first atomization action of the atomization substrate; determine, based on the monitoring, an accumulated amount of a difference between the monitored resistance and a reference resistance over time, the reference resistance indicating the resistance of the heating element that changes over time when the atomization substrate is sufficient; and detect a consumption state of the atomization substrate during the first atomization action based on the accumulated amount.

[0012] In a third aspect of the present disclosure, an atomization device is provided, comprising: a resistance monitoring module, configured to monitor the resistance of a heating element for heating an atomization substrate during a first atomization action of the atomization substrate; a cumulative amount determination module, configured to determine, based on the monitoring, the cumulative amount of the difference between the monitored resistance and a reference resistance over time, the reference resistance indicating the resistance of the heating element that changes over time when the atomization substrate is sufficient; and a consumption status detection module, configured to detect the consumption status of the atomization substrate during the first atomization action based on the cumulative amount.

[0013] It will be understood from the following description that according to an embodiment of the present disclosure, a method for detecting the consumption state of an atomized substrate is provided for an atomizing device. When the atomized substrate is during the first atomizing action, by monitoring the resistance of the heating element for heating the atomized substrate, the accumulated amount of the difference between the detected resistance and the reference resistance over time is determined, and then the consumption state of the atomized substrate during the first atomizing action can be detected. In this way, the accuracy of the detection of the consumption state of the atomized substrate can be improved. Other benefits will be described below in conjunction with the corresponding embodiments.

[0014] It should be understood that the contents described in this content section are not intended to limit the key features or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements, wherein:

[0016] Figure 1 A schematic diagram showing an example of an atomization device according to an embodiment of the present disclosure;

[0017] Figure 2 A flow chart showing a method for detecting a state of consumption of an atomized substrate according to some embodiments of the present disclosure is shown;

[0018] Figure 3 A schematic diagram showing a curve of monitoring resistance and reference resistance changing over time according to some embodiments of the present disclosure;

[0019] Figure 4 A schematic diagram showing the change in resistance of a heating element during normal heating of an atomizing device according to some embodiments of the present disclosure;

[0020] Figure 5 A schematic diagram showing determining characteristic time points according to some embodiments of the present disclosure is shown;

[0021] Figure 6 A flow chart showing a process of detecting a consumption state of an aerosolized substrate according to some embodiments of the present disclosure is shown;

[0022] Figure 7 A schematic diagram showing the difference between a real-time resistance and a reference resistance according to some embodiments of the present disclosure;

[0023] Figure 8 A schematic diagram showing accumulation and resistance difference according to some embodiments of the present disclosure; and

[0024] Fig. 9 A block diagram of an atomizing device capable of implementing various embodiments of the present disclosure is shown. DETAILED DESCRIPTION

[0025] Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided to provide a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are only for exemplary purposes and are not intended to limit the scope of protection of the present disclosure.

[0026] In the description of the embodiments of the present disclosure, the term "including" and similar terms should be understood as open inclusion, that is, "including but not limited to". The term "based on" should be understood as "based at least in part on". The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment". The term "some embodiments" should be understood as "at least some embodiments". Other explicit and implicit definitions may be included below. The terms "first", "second", etc. may refer to different or the same objects. Other explicit and implicit definitions may be included below.

[0027] At present, dry burning of the atomizer of the electronic atomization device means that during use, the heating element in the atomizer does not have enough atomization matrix to heat, causing the atomization matrix inside the atomizer to begin to burn or dry out. When the electronic atomization device is detecting the consumption status of the atomization matrix, since the heating element (such as the heating wire) is not completely covered by the atomization matrix, the heating element does not have enough atomization matrix to convert into an aerosol. In this case, when the electronic atomization device cannot accurately detect the consumption status of the atomization matrix, it will produce a burnt smell of the atomization matrix and even cause damage to the heating element.

[0028] The atomizer of traditional electronic atomization equipment generally uses temperature detection technology to detect the consumption status of the atomization matrix. The consumption status of the atomization matrix is ​​detected mainly through the following three methods to prevent the occurrence of dry burning. The first is to calculate the temperature of the heating element by monitoring the value of the temperature coefficient of resistance (TCR), and then prevent dry burning by temperature control. The second is to identify whether it is a dry burning phenomenon by monitoring the rate of temperature rise. The third is to identify the occurrence of dry burning by monitoring the sudden change of the temperature of the heating wire.

[0029] Because the impedance of the heating element of the electronic atomization device is small, and there is a certain deviation in the consistency of the heating element during the production process. For example, the resistance of the heating element is within 1Ω, and the consistency deviation is about ±10%. If the atomizer is installed in the electronic atomization device, its electrode contact will produce contact impedance, which will affect the overall heating impedance. However, in order to prevent dry burning by temperature control, the consistency of the resistance temperature coefficient of the heating element is required to be high, and the contact resistance has a great impact on the overall heating resistance. As a result, the electronic atomization device cannot accurately measure the consumption state of the atomized matrix.

[0030] In addition, the specific heat capacity of the atomized matrix itself will affect the temperature rise curve and the thermal equilibrium temperature. In the process of using the electronic atomization device, the atomizer angle and the flow rate of the atomized matrix will affect the balance of the heating element. However, the prevention of dry burning by monitoring the heating rate is greatly affected by the specific heat capacity of the atomized matrix itself, and is only suitable for the cold start of the atomizer, not suitable for continuous suction. In addition, the prevention of dry burning by monitoring the temperature mutation requires multiple learning of the thermal equilibrium temperature, and the identification cycle is long. If the atomized matrix in the atomizer is insufficient during the learning process, the learning value loses its meaning. In this way, the consumption state of the atomized matrix cannot be accurately detected. The above describes the problem of inaccurate measurement results of the consumption state of the atomized matrix in the electronic atomization device. It should be understood that similar problems exist in the detection of the consumption state of the atomized matrix in other types of atomization devices.

[0031] To this end, an embodiment of the present disclosure provides a scheme for detecting the consumption state of an atomizing substrate in an atomizing device. In the atomizing device, during the first atomizing action of the atomizing substrate, the resistance of a heating element used to heat the atomizing substrate is monitored. Thus, the accumulated amount of the difference between the monitored resistance and the reference resistance over time is determined, and then the consumption state of the atomizing substrate during the first atomizing action is detected. In this way, the atomizing device can accurately monitor the consumption state of the atomizing substrate to prevent the atomizing substrate from being burned due to dry burning of the heating element. It can even prevent the heating element from being damaged due to dry burning. In this way, the reliability of the atomizing device is improved, and the user experience is enhanced.

[0032] Some example embodiments of the present disclosure will be described below with reference to the accompanying drawings. Please note that in some descriptions of the embodiments, certain specific values ​​may be involved in order to better help readers understand. These values ​​are exemplary and may vary according to specific application scenarios, and do not limit the scope of the present disclosure in any way.

[0033] Figure 1 Schematic diagram showing an example of an atomization device 100 according to an embodiment of the present disclosure. Figure 1 As shown, an atomization device 100 such as an electronic atomization device includes a processor 110 and a heating element 120, and the processor 110 is coupled to the heating element 120 to obtain the resistance of the heating element 120 for detecting the consumption state of the atomization matrix. The heating element 120 is used to heat the atomization matrix during the atomization action. For example, the atomization matrix may include an oily atomization matrix or a liquid atomization matrix, etc. The heating element 120 may include a heating wire, a heating film, a heating circuit, etc., and the embodiments of the present disclosure are not limited to this.

[0034] In some embodiments, the atomizing device 100 further includes a power source, an atomizer containing an atomizing matrix and a heating element 120, and a mouthpiece. The mouthpiece can be integrally formed with other parts of the atomizing device 100 (e.g., a housing), or can be formed separately and mounted to other parts of the atomizing device 100 in a detachable manner. A power source (e.g., a battery) is used to power the atomizing device 100. When the user presses the start button or inhales, the atomizing device 100 heats the atomizing matrix in the atomizer and converts it into an aerosol, which the user inhales through the mouthpiece.

[0035] The processor 110 may be any type of electronic device with computing capabilities. The processor 110 may be, for example, a microprocessor (MPU), a system on a chip (SOC), a processor (CPU), a microcontroller (MCU), and the like. In an embodiment of the present disclosure, the processor 110 may execute a method for detecting a consumption state of an atomized substrate. The processor 110 may determine the consumption state of the atomized substrate in the heating element 120 to prevent the occurrence of a dry burning phenomenon of the atomizer, thereby avoiding the burning of the atomized substrate caused by the dry burning of the atomizer, and the damage of the heating element 120.

[0036] It should be understood that the structures and functions of the various parts in the ambient atomization device 100 are described for exemplary purposes only, and do not imply any limitation on the scope of the present disclosure.

[0037] Some example embodiments of the present disclosure will be described in detail below with reference to examples of the accompanying drawings.

[0038] Figure 2 1 is a flow chart showing a method 200 for detecting a consumption state of an atomized substrate according to some embodiments of the present disclosure. The method 200 may be implemented at the processor 110. Figure 2 Method 200 is described.

[0039] At block 210, during a first atomization of the atomized substrate, the processor 110 monitors the resistance of the heating element 120. The heating element 120 is used to heat the atomized substrate to form an aerosol that can be inhaled by a user as described above. For example, the resistance can be represented by a curve, also referred to as a real-time curve. As an example, Figure 3 The real-time curve of the monitored resistance is shown. Figure 3 As shown, the real-time curve 320 is a curve formed by the change of resistance over time.

[0040] In some embodiments, the first atomization action may be any atomization action of the atomization substrate during the use of the atomization device 100. For example, in the case where the atomization device 100 is an electronic atomization device, the atomization substrate may be an oily atomization substrate in the electronic atomization device, and the atomization action may be a suction action of the oily atomization substrate. In this example, the first atomization action may be understood as any suction action of the user taking a puff of the electronic atomization device described above.

[0041] The resistance of the heating element 120 may be obtained in any suitable manner. For example, the resistance may be detected by a circuit including the heating element 120. Embodiments of the present disclosure are not limited in this regard.

[0042] At block 220, the processor 110 determines the cumulative amount of the difference between the monitored resistance and the reference resistance over time based on the monitoring of block 210. The reference resistance indicates the resistance of the heating element 120 that changes over time when the atomization substrate is sufficient. For example, the reference resistance may be the resistance of the heating element 120 that changes over time during the first atomization action when the atomization device 100 is initially started. For another example, the reference resistance may be the resistance that changes over time that is monitored or collected during the previous normal atomization action, as will be described below.

[0043] Figure 3 A curve of reference resistance changing over time, i.e., reference curve 310, is shown. The processor 110 saves the resistance of the heating element 120 changing over time monitored during the first atomization action when the atomization device 100 is in the atomization action as a real-time curve 320. The reference curve 310 is used to compare with the real-time curve 320. Specifically, the cumulative amount is the integral of the difference between the real-time curve 320 and the reference curve 310 at each time point. In this way, by calculating the integral of the difference between the real-time curve 320 and the reference curve 310, it is identified whether the heating element 120 is in a dry burning state, that is, the atomization substrate is in an insufficient state during the first atomization action. In some embodiments, the cumulative amount can be the integral of the difference between the real-time curve 320 and the reference curve 310 when the first atomization action begins.

[0044] In some embodiments, the calculation of the cumulative amount may occur after a characteristic time point, which is a time point at which the change trend of the resistance changes. Specifically, the processor 110 may determine the characteristic time based on the monitored change trend of the resistance. For example, the characteristic time point may be referred to as an inflection point. In some embodiments, the stage before the characteristic time point corresponds to the temperature rise stage 410 of the atomized substrate, and the stage after the characteristic time point 420 corresponds to the thermal equilibrium stage 430 of the atomized substrate. Specifically, refer to Figure 4An example of describing a characteristic time point. The change trend of the resistance monitored by the processor 110 (also referred to as an impedance change curve) is divided into three stages. The three stages are, in order, a heating stage 410, an inflection point stage 420, and a thermal equilibrium stage 430. The change trend of the resistance monitored by the processor 110 is divided into three stages by identifying the inflection point.

[0045] The above detailed description of the process of determining the characteristic time point according to the monitored resistance change trend continues. After the heating of the heating element 120 is started, the temperature rises rapidly and tends to equilibrium after reaching a certain temperature. The intermediate process of the heating element 120 from the heating stage 410 to the equilibrium stage 430 is defined as the characteristic time point 420 of the resistance change trend curve. For example, referring to Figure 5 , the processor 110 can calculate the slope of the five adjacent sampling points of the resistance change trend curve 510, take the average value, and obtain the first-order derivative. The processor 110 then calculates the second-order derivative 520 based on the first-order derivative. The processor 110 continuously tracks the result of the second-order derivative 520. When the second-order derivative 520 of three consecutive points approaches 0, it is determined that this is a characteristic time point 540, that is, an inflection point, referring to Figure 5 The curve 530 is shown. The characteristic time point 540 of the curve can be identified by detecting the second-order derivative 520 of the curve. It can be understood that the value of the second-order derivative 520 is the largest when the heating element 120 starts heating, and the second-order derivative 520 gradually decreases during continuous heating, and finally approaches 0. At this time, it is considered that the characteristic time point 540 of the curve 510 of the change trend of the resistance has appeared.

[0046] In other words, after the atomization action is started, when the resistance change trend of the heating element 120 is in the temperature rise stage 410, the temperature of the heating element 120 rises rapidly, the initial temperature rise speed is the fastest, and then gradually slows down, the slope of the resistance change trend curve 510 is positive, and the second-order derivative 520 is negative. When the resistance change trend is at the characteristic time point 540, the temperature change of the heating element 120 slows down, the slope of the resistance change trend curve 510 is positive, and the second-order derivative 520 changes from negative to 0 or positive, and fluctuates around 0. If the resistance change trend is in the thermal equilibrium stage 430, the energy provided by the heating element 120 through heating and the heat dissipation are balanced, the temperature changes very slowly, and there is a weak upward trend, and the slope of the resistance change trend curve 510 and the second-order derivative 520 are both close to 0.

[0047] In some embodiments, the atomization action of the atomization device 100 can be divided into a normal process, an intermediate process, and a dry burning process. Specifically, when the atomization device 100 is in a normal process, the atomization substrate is sufficient, the oil is sufficient, and the atomization substrate dissipates heat quickly after the atomization action is started. A characteristic time point appears around 300ms, and the thermal equilibrium is quickly reached at the normal atomization temperature without a burnt smell. For example, the normal process can be the first atomization action.

[0048] When the atomizing device 100 is in the middle process, the atomizing matrix is ​​sufficient and then exhausted. In the first half of the atomizing matrix consumption, the atomizing matrix is ​​sufficient, and the characteristic time point is close to the normal process. However, the heating element 120 enters thermal equilibrium late, or fails to reach thermal equilibrium, and there is a curve tail phenomenon and a slight burning smell. At this time, it is best to identify that the heating element 120 is dry burning.

[0049] When the atomizer 100 is in the process of dry burning, there is only a small amount of atomizing matrix on the liquid guide cotton of the atomizer 100. After the heating element 120 is started, the temperature rises rapidly, the characteristic time point is delayed than normal, the characteristic time point and the thermal equilibrium temperature are higher, and thermal equilibrium can be achieved after the characteristic time point appears, but the temperature rise speed is faster than the normal atomization action, the temperature is high at equilibrium, and the burning smell is serious. Even if dry burning is identified, the heating core will be damaged.

[0050] In some embodiments, the processor 110 cumulatively determines the difference between the monitored resistance and the reference resistance according to the sampling time interval from the characteristic time point. For example, after the characteristic time point of the real-time curve 320 is identified, the difference between the real-time curve 320 and the reference curve 310 is accumulated over time to obtain a cumulative amount (shown as ΔS in the figure). Specifically, after the characteristic time point occurs, the arithmetic difference (shown as ΔR in the figure) between the real-time curve 320 and the reference curve 310 at each sampling time point is calculated, the sampling time interval is ΔT, and the result of adding each arithmetic difference is obtained. That is, ΔS = ΔR × ΔT at each sampling time point, and then the ΔS at each sampling time point is accumulated to obtain the cumulative amount.

[0051] Continue to refer Figure 2 In block 230, the processor 110 detects a consumption state of the atomized substrate during the first atomization action based on the cumulative amount. In some embodiments, if the cumulative amount exceeds a first threshold, the processor 110 may determine that the atomized substrate is in an insufficient state during the first atomization action. For example, the insufficient state of the atomized substrate may be an exhausted state.

[0052] Exemplarily, the curve of the change trend of the resistance obtained by atomization in a state where the atomization substrate is sufficient is a non-dry-burning curve, which is used as a reference curve 310 for identifying the consumption state of the atomization substrate. The processor 110 saves the values ​​of the reference curve 310 in an array. When the atomization device 100 atomizes again, the characteristic time point of the real-time curve 320 is first detected. After the characteristic time point appears, the cumulative amount is continuously calculated. When the cumulative amount over a period of time exceeds the first threshold value (preset fixed threshold value (ΔS_MAX)), it is determined that the atomization substrate is in an insufficient state during the first atomization action, that is, there is a risk of the dry-burning phenomenon described above.

[0053] In this way, it is possible to avoid misidentification of the processor 110 due to the translation of the real-time curve 320 (also referred to as a heating curve) caused by different startup temperatures of the atomization device 100. The processor 110 does not need to perform multiple learning, that is, it does not need to monitor the resistance of the heating element 120 multiple times, thereby avoiding inaccurate learning values ​​caused by too little atomized substrate, thereby simplifying the algorithm logic.

[0054] In some embodiments, if it is determined that the atomized substrate is in an insufficient state during the first atomization action, the processor 110 can present an alarm message that the atomized substrate is insufficient. The processor 110 can also stop the heating element 120 from heating the atomized substrate. In this way, the heating element 120 can be prevented from burning dry, or even from damaging the heating element 120. For example, the alarm message can be connected to an alarm device such as a sound alarm or a flashing light alarm by the processor 110 to achieve. When the processor 110 triggers the condition that the atomized substrate described above is in an insufficient state during the first atomization action, the alarm device sends a sound or flashing signal to attract the user's attention.

[0055] Figure 6 FIG. 6 is a flow chart showing a process 600 for detecting a state of atomized substrate consumption according to some embodiments of the present disclosure. In some embodiments, the process 600 may be performed as follows: Figure 1 The process 600 is executed at the processor 110110 shown. It should be understood that the process 600 may also include additional blocks not shown and / or may omit one (or some) of the blocks shown, and the scope of the present disclosure is not limited in this respect.

[0056] In block 610, the heating element 120 is heated and activated. For example, in the electronic atomization device described above, when the user takes a puff, the processor 110 and the heating element 120 are awakened, and the heating element 120 starts to heat up.

[0057] At block 620 , the processor 110 determines whether it is the first boot. If it is determined to be the first boot, the process 600 proceeds to block 630 .

[0058] At block 630, the processor 110 records the initial startup data over time as a reference curve 310. Then, the process 600 proceeds to block 691, where the processor 110 determines whether to stop the atomization action. If it is determined that the atomization is stopped, the process 600 proceeds to block 690, where the heating element 120 stops heating. If it is determined that the atomization is not stopped, the process 600 proceeds to block 620 again.

[0059] If it is determined at block 620 that it is not the first start, the process 600 proceeds to block 640. At block 640, the processor 110 determines whether an inflection point occurs, that is, the characteristic time point described above occurs. If it is determined that no inflection point occurs, the process 600 proceeds to block 650, and the processor 110 performs inflection point identification. Then, the process 600 proceeds to block 691, and the processor 110 determines whether to stop the atomization action. If it is determined that the atomization stops, the process 600 proceeds to block 690, and the heating element 120 stops heating.

[0060] If it is determined at block 640 that an inflection point has occurred, the process 600 proceeds to block 660, where the processor 110 determines whether the cumulative amount ΔS exceeds the first threshold ΔS_MAX. If it is determined that the cumulative amount does not exceed the first threshold, the process 600 proceeds to block 670, where the cumulative amount is calculated. Thereafter, the process 600 proceeds to block 691, where the processor 110 determines whether to stop the atomization action. If it is determined that the atomization has stopped, the process 600 proceeds to block 690, where the heating element 120 stops heating. If it is determined that the atomization has not stopped, the process 600 proceeds back to block 640.

[0061] If it is determined that the cumulative amount exceeds the first threshold, the process 600 proceeds to block 680, and the processor 110 issues an alarm. Subsequently, the process 600 proceeds to block 690, and the heating element 120 stops heating. The process 600 proceeds to block 611, and the atomizing device 100 exits the action.

[0062] In some embodiments, during a second atomization action period (also referred to as a previous atomization action period) before the first atomization action period, the processor 110 monitors the resistance of the heating element 120. The processor 110 determines the resistance difference between the resistance monitored during the second atomization action and the reference resistance. Figure 7, the processor 110 saves the resistance after the thermal equilibrium stage 430 of the normal curve when the atomization device 100 is initially started as a reference. The reference curve 310 is formed over time. The difference between the real-time resistance during the second atomization action and the reference resistance in the thermal equilibrium stage 430 is ΔR. In this way, the dry burning phenomenon of the atomization device 100 is identified by means of resistance difference. When the curve 730 during the second atomization action is upturned, that is, when the resistance difference exceeds the second threshold ΔR_MAX, the heating element 120 stops heating and prompts the user to prevent the high temperature from continuing to damage the atomization device 100.

[0063] In some embodiments, reference Figure 8 , the processor 110 determines that the atomized matrix is ​​in an insufficient state during the first atomization action in response to the resistance difference exceeding the second threshold and the cumulative amount exceeding the first threshold. According to whether the cumulative amount described above exceeds the first threshold, and in conjunction with determining whether the resistance difference exceeds the second threshold, it is determined whether the atomized matrix is ​​insufficient. Further, after the atomization action is started, the real-time curve 320 of the first atomization action of the atomization device 100 rises to the characteristic time point of the second atomization action and does not quickly enter the thermal equilibrium stage 430, but still shows a rapid upward trend, forming a large angle with the curve 730 of the second atomization action, and an obvious dry burning curve feature appears. When the atomization device 100 performs the first atomization action, if the cumulative amount exceeds the first threshold ΔS_MAX, combined with the resistance difference described above exceeding the second threshold ΔR_MAX, the processor 110 can accurately determine that the atomization device 100 is dry burning, that is, the atomized matrix is ​​insufficient, and thus take necessary measures to stop the heating element 120 from heating. By identifying the resistance change of the heating element 120, the processor 110 can effectively improve the accuracy of the processor 110 in identifying the exhaustion of the atomized matrix. It can also avoid misidentification caused by the threshold value of a single detection resistor difference, thereby improving the reliability of anti-dry burning detection.

[0064] In some embodiments, the processor 110 may cause the heating element 120 to stop heating the atomized substrate in response to the resistance difference exceeding the second threshold. The processor 110 may also present an early warning message that the atomized substrate is insufficient. In this way, the heating element 120 may be prevented from burning dry or even damaging the heating element 120. For example, the early warning message may be provided by connecting the processor 110 to an early warning device such as an audible early warning device or a flashing light early warning device.

[0065] In some embodiments, if it is detected that the atomization matrix is ​​in a sufficient state during the first atomization action, the reference resistor is replaced by the resistance monitored over time during the first atomization action for use during a third atomization action after the first atomization action (also referred to as the subsequent atomization action).

[0066] In some embodiments, the mesh core of the heating element 120 is locally high in temperature due to uneven supply of atomized substrate or poor conduction of atomized substrate. If the local high temperature of the heating element 120 is caused by insufficient atomized substrate, the cumulative amount of the third atomization action will exceed the first threshold. If the local high temperature of the heating element 120 caused by poor conduction of the atomized substrate, the cumulative amount of the third atomization action generally does not exceed the first threshold, but the second half of the curve 730 of the atomization action may still be warped. Further, if the processor 110 determines that the tail of the second half of the curve 730, that is, the resistance difference exceeds the second threshold, the heating element 120 stops heating and prompts the user to prevent the heating element 120 from continuing to damage the mesh core at high temperature. If the cumulative amount of the third atomization action exceeds the first threshold, the processor 110 determines that the atomized substrate of the atomization device 100 is insufficient. In this way, it can be effectively distinguished whether it is a dry burning caused by poor conduction of the atomized substrate or a dry burning caused by insufficient atomized substrate, and corresponding protective measures are taken. In an embodiment of the present disclosure, dry burning caused by multiple reasons can be identified without adding additional elements.

[0067] Fig. 9 A block diagram of an atomization device 900 capable of implementing multiple embodiments of the present disclosure is shown. Each module / component in the atomization device 900 may be implemented by hardware, software, firmware, or any combination thereof.

[0068] As shown, the atomizing device 900 includes a resistance monitoring module 910, which is configured to monitor the resistance of the heating element 120 for heating the atomizing substrate during the first atomizing action of the atomizing substrate. The atomizing device 900 also includes a cumulative amount determination module 920, which is configured to determine the cumulative amount of the difference between the monitored resistance and the reference resistance over time based on the monitoring, and the reference resistance indicates the resistance of the heating element 120 that changes over time when the atomizing substrate is sufficient. The atomizing device 900 also includes a consumption state detection module 930, which is configured to detect the consumption state of the atomizing substrate during the first atomizing action based on the cumulative amount.

[0069] In some embodiments, the cumulative amount determination module 920 is configured to determine a characteristic time point based on a changing trend of the monitored resistance, at which the changing trend changes; and from the characteristic time point, cumulatively determine the difference between the monitored resistance and the reference resistance according to a sampling time interval.

[0070] In some embodiments, the stage before the characteristic time point corresponds to a temperature rise stage of the atomized substrate, and the stage after the characteristic time point corresponds to a thermal equilibrium stage of the atomized substrate.

[0071] In some embodiments, the consumption state detection module 930 is configured to detect the consumption state of the atomized substrate during the first atomization action, and is configured to determine that the atomized substrate is in an insufficient state during the first atomization action in response to the cumulative amount exceeding the first threshold. The atomization device 900 also includes at least one of the following: an alarm module configured to present an alarm message of insufficient atomized substrate; or a stop module configured to stop the heating element from heating the atomized substrate.

[0072] In some embodiments, the resistance monitoring module 910 is configured to monitor the resistance of the heating element during a second atomization action prior to the first atomization action; determine the resistance difference between the resistance monitored during the second atomization action and the reference resistance, and the consumption status detection module 930 is configured to determine that the atomized substrate is in an insufficient state during the first atomization action in response to the resistance difference exceeding a second threshold and the cumulative amount exceeding a first threshold.

[0073] In some embodiments, the atomization device 900 further includes at least one of the following: a heating stop module configured to cause the heating element 120 to stop heating the atomization substrate in response to the resistance difference exceeding a second threshold, or an alarm module configured to present warning information about the consumption status of the atomization substrate.

[0074] In some embodiments, the atomization device 900 also includes a reference resistance replacement module, which is configured to replace the reference resistance with the resistance monitored over time during the first atomization action for use during a third atomization action after the first atomization action if it is detected that the atomization matrix is ​​in a sufficient state during the first atomization action.

[0075] The above descriptions of various implementations of the present disclosure are exemplary, non-exhaustive, and not limited to the disclosed implementations. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described implementations. The selection of terms used herein is intended to best explain the principles of the implementations, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the various implementations disclosed herein.

Claims

1. A method for detecting the consumption state of an atomized substrate, comprising: During a first atomization action of an atomized substrate, monitoring the resistance of a heating element for heating the atomized substrate; Based on the monitoring, determining an accumulated amount over time of a difference between the monitored resistance and a reference resistance indicative of a resistance of the heating element as a function of time when the atomized substrate is sufficient; as well as Based on the accumulated amount, a consumption state of the atomized substrate during the first atomization action is detected.

2. The method of claim 1 , wherein determining the cumulative amount comprises: Determining a characteristic time point according to a variation trend of the monitored resistance, wherein the variation trend changes at the characteristic time point; as well as Starting from the characteristic time point, the difference between the monitored resistance and the reference resistance is cumulatively determined according to sampling time intervals.

3. The method according to claim 1, wherein the stage before the characteristic time point corresponds to a temperature rise stage of the atomized substrate, and the stage after the characteristic time point corresponds to a thermal equilibrium stage of the atomized substrate.

4. The method according to claim 1, wherein detecting the consumption state of the atomized substrate during the first atomization action comprises: In response to the accumulated amount exceeding a first threshold, determining that the atomized substrate is in an insufficient state during the first atomization action, and The method further comprises at least one of the following: Presenting an alarm message indicating that the atomized substrate is insufficient, or The heating element is caused to stop heating the atomized substrate.

5. The method according to claim 4, further comprising: monitoring the resistance of the heating element during a second atomization action preceding the first atomization action; determining a resistance difference between the resistance monitored during the second atomization event and the reference resistance, and Wherein determining that the atomized substrate is in an insufficient state during the first atomization action comprises: In response to the resistance difference exceeding a second threshold and the cumulative amount exceeding the first threshold, it is determined that the atomized substrate is in an insufficient state during the first atomization action.

6. The method according to claim 5, further comprising: In response to the resistance difference exceeding the second threshold, performing at least one of the following: causing the heating element to stop heating the atomized substrate, or Presenting early warning information about the consumption status of the atomized substrate.

7. The method according to claim 1, further comprising: If it is detected that the atomization substrate is in a sufficient state during the first atomization action, the reference resistor is replaced by the resistance monitored over time during the first atomization action for use during a third atomization action after the first atomization action.

8. An atomization device comprising: a heating element configured to heat the atomized substrate; as well as The processor is configured as: monitoring the resistance of the heating element during a first atomization event of the atomized substrate; Based on the monitoring, determining an accumulated amount over time of a difference between the monitored resistance and a reference resistance indicative of a resistance of the heating element as a function of time when the atomized substrate is sufficient; as well as Based on the accumulated amount, a consumption state of the atomized substrate during the first atomization action is detected.

9. An atomizing device, comprising: a resistance monitoring module configured to monitor the resistance of a heating element for heating the atomized substrate during a first atomization action of the atomized substrate; a cumulative amount determination module configured to determine, based on the monitoring, a cumulative amount over time of a difference between the monitored resistance and a reference resistance indicating a resistance of the heating element that varies over time when the atomized substrate is sufficient; as well as The consumption status detection module is configured to detect the consumption status of the atomization substrate during the first atomization action based on the accumulated amount.

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