Adjustable multi-specification electronic chip power-on performance detection equipment

Abstract

The invention relates to the technical field of electronic chip performance detection, and provides adjustable multi-specification electronic chip power-on performance detection equipment which comprises a base, a conveying belt and a fixing frame are installed on the base, a visual recognition camera is installed at the top of the fixing frame, an alignment mechanism is arranged on the fixing frame, and the alignment mechanism is arranged on the conveying belt. A transfer mechanism and a detection table are arranged at the end, close to the fixing frame, of the conveying belt on the base, the transfer mechanism is located between the conveying belt and the detection table, an adjusting mechanism is arranged in the detection table, and a probe is installed on the adjusting mechanism; according to the invention, the electromagnet I in the mounting block corresponding to the test point is electrified, the magnetic block in the square groove II moves towards the electromagnet I, so that the probe on the magnetic block is driven to move towards the outside of the square groove II and is in contact with the electronic chip for electrification, and the moving distances of the plurality of sliding blocks I are the same, so that the equidistant adjustment is realized; therefore, the probe in the mounting block corresponds to the test point in the electronic chip.

Description

Technical Field

[0001] The invention relates to the technical field of electronic chip performance detection, in particular to an adjustable multi-specification electronic chip power-on performance detection device. Background Art

[0002] With the rapid development of smart devices, the Internet of Things, and artificial intelligence, the market demand for high-quality, high-performance electronic chips continues to increase. In order to ensure the quality and reliability of electronic chips, the demand for electronic chip performance testing equipment has also increased.

[0003] The probe layout of existing performance testing equipment for electronic chips is usually fixed, which makes it impossible to flexibly adjust the testing equipment according to the testing requirements of chips of different specifications. Therefore, when the testing equipment tests electronic chips of different sizes and pin arrangements, it is necessary to frequently replace the equipment, which increases the complexity of the testing process.

[0004] Patent CN119125848A discloses a performance testing device for electronic chips and a method of use, which relates to the field of chip testing technology, including a base, a fixing frame, a lifting plate and a probe adjustment module. The top of the outer wall of the base is symmetrically fixedly connected with a fixing frame, and a lifting plate is installed on the side of the fixing frame. The lifting plate is installed with a probe adjustment module, and the probe adjustment module is used to automatically detect the performance of electronic chips of different sizes; the probe adjustment module includes: a controller, an installation card, a circuit board, an electromagnet, a probe and a reset spring. The present invention realizes the automatic adjustment function of the probe during the performance testing of electronic chips by installing a probe adjustment module, thereby improving the speed and efficiency of the overall testing process, and improving the versatility and scope of application of the testing equipment.

[0005] Although the above patent realizes the adjustment of the probe to adapt to the specifications of the electronic chip, the spacing between the test points of the chip pins of different specifications is different. It is difficult for this invention to change the spacing between the probes. When the probes are attracted by electromagnets, adjacent probes are easily attracted, resulting in insufficient contact between the probes and the electronic chip. At the same time, the transmission process of the electronic chip is relatively complicated.

[0006] Therefore, the present invention provides an adjustable multi-specification electronic chip power-on performance detection device. Summary of the invention

[0007] The present invention provides an adjustable multi-specification electronic chip power-on performance detection device to solve the problems existing in the background technology.

[0008] The technical solution of the present invention is as follows:

[0009] An adjustable multi-specification electronic chip power-on performance testing device comprises: a base, a conveyor belt and a fixing frame are installed on the base, a visual recognition camera is installed on the top of the fixing frame, an alignment mechanism is arranged on the fixing frame, a transfer mechanism and a testing platform are arranged on the base at one end of the conveyor belt close to the fixing frame, and the transfer mechanism is located between the conveyor belt and the testing platform, an adjustment mechanism is arranged in the testing platform, and a probe is installed on the adjustment mechanism, and a collection mechanism is arranged on the base;

[0010] The adjustment mechanism comprises a square groove 1 provided in the detection table, a plurality of rows of mounting blocks are arranged in the square groove 1, a square groove 2 is provided in the mounting block, and a magnetic block is slidably connected through the square groove 2, the probe is fixedly installed on the magnetic block, and the probe head leads to the opening of the square groove 2, an electromagnet 1 and an electromagnet 2 are installed on both sides of the magnetic block in the square groove 2, a spring 1 is installed between the electromagnet 1 and the magnetic block, and a spring 2 is installed between the electromagnet 2 and the magnetic block;

[0011] The adjusting mechanism also includes a square slot three opened on four sides of the square slot one at the bottom of the detection platform, two distance adjusting mechanisms are arranged in the upper and lower parts of the square slot three, the distance adjusting mechanism includes a threaded rod rotatably connected to one of the square slots three, a motor one driving the threaded rod to rotate is installed in the square slot three, a plurality of sliders one are slidably connected in two opposite square slots three, the threaded rod passes through a slider one in the square slot three, only two ends of the threaded rod are provided with threads and the rotation directions are opposite, and two sliders one at both ends of the threaded rod are threadedly connected to the threaded rod, the distance adjusting mechanism also includes a scissor-type bracket, and the scissor-type bracket is connected to the plurality of sliders one;

[0012] The two threaded rods in the two distance adjustment mechanisms are vertically staggered;

[0013] A slide bar 1 is fixedly connected between the sliders 1 located in the two opposite square grooves 3, and the two slide bars 1 in the two distance adjustment mechanisms are vertically staggered, the mounting block is located at the intersection of the two slide bars 1, and the mounting block is slidably connected to the two slide bars 1.

[0014] Preferably, gear 1 is fixedly connected to the driving shaft of the conveyor belt, gear 2 is installed on the base, and gear 2 is an incomplete gear. Gear 1 is meshingly connected with gear 2, and motor 2 for driving gear 2 to rotate is installed on the base.

[0015] Preferably, the alignment mechanism includes two automatic telescopic rods 1 installed on a fixed frame, the two automatic telescopic rods 1 are respectively located on both sides of the conveyor belt, the output end of the automatic telescopic rod 1 is fixedly connected with a sleeve 1, the sleeve 1 is slidably connected with a slide rod 2, the slide rod 2 passes through one end of the sleeve 1, and the passed end is fixedly connected with a push plate 1, a spring 3 is installed between the push plate 1 and the sleeve 1 on the outside of the slide rod 2, and the push plate 1 is located above the conveyor belt.

[0016] Preferably, the alignment mechanism also includes four fixed platforms fixedly connected to the fixed frame, the fixed platforms are located on both sides of the automatic telescopic rod one, and the automatic telescopic rod two is installed on the fixed platforms, the output end of the automatic telescopic rod two is fixedly connected to the sleeve two, and the sleeve two is slidably connected with a sliding rod three, the sliding rod three passes through one end of the sleeve two, and the passed end is fixedly connected to a slider two, a spring four is installed between the slider two and the sleeve two on the outside of the sliding rod three, the slider two is located above the conveyor belt, and a telescopic block is fixedly connected to the side of the slider two away from the conveyor belt, a fixed rod is fixedly connected between the telescopic ends of the two telescopic blocks on both sides of the conveyor belt, and a push plate two is fixedly connected to the fixed rod.

[0017] Preferably, a slide groove 1 and a slide groove 2 are provided on one side of the fixed platform close to the conveyor belt, the slide groove 1 is located above the slide groove 2, and the fixed rod is slidably connected in the slide groove 1, the slider 2 is slidably connected in the slide groove 2, the slide groove 1 includes a horizontal groove and an arc groove, the horizontal groove and the arc groove are connected, and the arc groove is away from the slide groove 2.

[0018] Preferably, the transfer mechanism includes a lifting rod fixedly connected to the base, the telescopic end of the lifting rod is fixedly connected to a connecting block, the connecting block is rotatably connected to a rotating plate, the connecting block is equipped with a motor three for driving the rotating plate to rotate, and a vacuum suction cup is installed at the end of the rotating plate away from the lifting rod.

[0019] Preferably, the collecting mechanism comprises an electric slide rail installed on a base, and a collecting box 1 and a collecting box 2 are installed on the electric slide rail, and the collecting box 1 and the collecting box 2 are both located on one side of the transfer mechanism.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. The present invention energizes electromagnet 1 in the mounting block corresponding to the test point, so that the magnetic block in square slot 2 moves toward electromagnet 1, thereby driving the probe on the magnetic block to move toward the outside of square slot 2, so that the probe corresponding to the test point continues to move outside the mounting block and contacts the electronic chip for energization.

[0022] 2. The present invention realizes equidistant adjustment by making the moving distances of multiple sliders the same, and then drives the mounting block at the intersection of two sliders to move equidistantly on the slider on another distance adjustment mechanism through the slider. Because the test points of the electronic chip are evenly distributed, the probes in the mounting block correspond to the test points in the electronic chip. After adjusting the lateral probes, longitudinal adjustment is performed. The adjustment process is the same as the lateral adjustment steps. Through lateral and longitudinal adjustments, the probes are made to completely correspond to the test points in the electronic chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a perspective view of the apparatus of the present invention;

[0024] Figure 2 It is a three-dimensional diagram of the internal structure of the detection platform of the present invention;

[0025] Figure 3 It is a three-dimensional diagram of the three inner structures of the square groove of the present invention;

[0026] Figure 4 The present invention Figure 3 A partial enlarged view of middle C;

[0027] Figure 5 is a cross-sectional view of the mounting block of the present invention;

[0028] Figure 6 The present invention Figure 1 A partial enlarged view of middle A;

[0029] Figure 7 The present invention Figure 1 A partial enlarged view of B in the middle;

[0030] Figure 8 is a three-dimensional diagram of the alignment mechanism of the present invention;

[0031] Fig. 9 It is a three-dimensional diagram of the transfer mechanism of the present invention.

[0032] In the figure:

[0033] 1. Base; 2. Conveyor belt; 21. Gear 1; 22. Gear 2; 23. Motor 2; 3. Fixed frame; 4. Visual recognition camera; 5. Alignment mechanism; 51. Automatic telescopic rod 1; 52. Sleeve 1; 53. Slide 2; 54. Push plate 1; 55. Spring 3; 56. Fixed table; 57. Automatic telescopic rod 2; 58. Sleeve 2; 59. Slide 3; 510. Slide 2; 511. Spring 4; 512. Telescopic block; 513. Fixed rod; 514. Push plate 2; 515. Slide 1; 5151. Horizontal slot; 5152. Arc slot; 516. Slide 2; 6. Transfer mechanism; 6 1. Lifting rod; 62. Connecting block; 63. Rotating plate; 64. Motor three; 65. Vacuum suction cup; 7. Testing table; 8. Adjusting mechanism; 81. Square slot one; 82. Mounting block; 83. Square slot two; 84. Magnetic block; 85. Electromagnet one; 86. Electromagnet two; 87. Spring one; 88. Spring two; 89. Square slot three; 810. Distance adjustment mechanism; 8101. Threaded rod; 8102. Motor one; 8103. Sliding block one; 8104. Scissor bracket; 8105. Sliding rod one; 9. Probe; 10. Collecting mechanism; 101. Electric slide rail; 102. Collecting box one; 103. Collecting box two. DETAILED DESCRIPTION

[0034] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0035] Example:

[0036] like Figure 1As shown, the present invention provides an adjustable multi-specification electronic chip power-on performance detection device, including: a base 1, a conveyor belt 2 and a fixing frame 3 are installed on the base 1, the electronic chips are placed on the conveyor belt 2 at a certain interval, and are transmitted from one end of the conveyor belt 2 to the other end, a visual recognition camera 4 is installed on the top of the fixing frame 3, and an alignment mechanism 5 is arranged on the fixing frame 3. When the electronic chip moves to the bottom of the visual recognition camera 4, the alignment mechanism 5 aligns the electronic chip to ensure that the electronic chip is at the center of the visual recognition camera 4, and the visual recognition camera 4 then identifies the electronic chip and identifies the test point on the electronic chip. The base 1 is provided with a transfer mechanism 6 and a detection mechanism at one end of the conveyor belt 2 close to the fixing frame 3. The test table 7 is provided with a transfer mechanism 6, and the transfer mechanism 6 is located between the conveyor belt 2 and the test table 7. Since the alignment mechanism 5 aligns the electronic chip directly below the visual recognition camera 4, there is no need to realign the electronic chip when it is transferred to the test table 7 through the transfer mechanism 6. An adjustment mechanism 8 is provided in the test table 7, and a probe 9 is installed on the adjustment mechanism 8. The visual recognition camera 4 transmits the test point information of the electronic chip to the adjustment mechanism 8, and the probe 9 is adjusted by the adjustment mechanism 8 so that the arrangement of the probe 9 conforms to the test point of the electronic chip, so as to perform power-on performance detection. A collection mechanism 10 is provided on the base 1. After the detection is completed, the electronic chip is transferred to the collection mechanism 10 for collection through the transfer mechanism 6.

[0037] like Figure 2-Figure 5 As shown, the adjustment mechanism 8 includes a square groove 81 opened in the detection table 7, a plurality of rows of mounting blocks 82 are arranged in the square groove 81, a square groove 83 is opened in the mounting block 82, and a magnetic block 84 is slidably connected through the square groove 83, the probe 9 is fixedly installed on the magnetic block 84, and the head of the probe 9 leads to the opening of the square groove 83, an electromagnet 85 and an electromagnet 86 are installed on both sides of the magnetic block 84 in the square groove 83, a spring 87 is installed between the electromagnet 85 and the magnetic block 84, and a spring 88 is installed between the electromagnet 86 and the magnetic block 84;

[0038] The adjusting mechanism 8 also includes a square slot three 89 opened on four sides of the square slot one 81 at the bottom of the detection table 7. Two distance adjusting mechanisms 810 are arranged in the upper and lower parts of the square slot three 89. The distance adjusting mechanism 810 includes a threaded rod 8101 rotatably connected to one of the square slot three 89. A motor one 8102 for driving the threaded rod 8101 to rotate is installed in the square slot three 89. Multiple sliders one 8103 are slidably connected in two opposite square slots three 89. The threaded rod 8101 passes through the slider one 8103 in one of the square slot three 89. The threaded rod 8101 is provided with threads at only two ends and the rotation directions are opposite. The two sliders one 8103 at both ends of the threaded rod 8101 are threadedly connected to the threaded rod 8101. The distance adjusting mechanism 810 also includes a scissor-type bracket 8104, and the scissor-type bracket 8104 is connected to the multiple sliders one 8103.

[0039] The two threaded rods 8101 in the two distance adjustment mechanisms 810 are vertically staggered;

[0040] A slide bar 8105 is fixedly connected between the sliders 8103 located in the two opposite square grooves 89, and the two slide bars 8105 in the two distance adjustment mechanisms 810 are vertically staggered, the mounting block 82 is located at the intersection of the two slide bars 8105, and the mounting block 82 is slidably connected to the two slide bars 8105.

[0041] When the transfer mechanism 6 moves the electronic chip to the top of the test table 7, since the distances between the test points of electronic chips of different specifications may be different, the adjustment mechanism 8 first adjusts the distance between the probes 9 according to the distance between the test points of the electronic chip. The adjustment process is as follows:

[0042] First, start the motor 8102 in one of the distance adjustment mechanisms 810 to drive the threaded rod 8101 to rotate. Since the threaded rod 8101 is threadedly connected to the two sliders 8103 at both ends, and the sliders 8103 are slidably connected in the square groove 3 89, the rotation of the threaded rod 8101 drives the sliders 8103 at both ends to rotate. Since the rotation directions of the threads at both ends of the threaded rod 8101 are opposite, the movement directions of the sliders 8103 at both ends are opposite. When the sliders 8103 at both ends move, the scissor-type brackets 8104 on the sliders 8103 bring The other sliders 8103 are driven to move, and at the same time, the scissor-type bracket 8104 keeps the distance between the two sliders 8103 the same, so that the sliders 8103 at both ends drive multiple sliders 8103 to achieve equidistant movement, and then the mounting block 82 at the intersection of the two sliders 8105 is driven by the slider 8105 to move equidistantly on the slider 8105 on another distance adjustment mechanism 810, because the test points of the electronic chip are evenly distributed, so that the probes 9 in the mounting block 82 are initially horizontally corresponding to the test points in the electronic chip.

[0043] After adjusting the transverse probe 9, longitudinal adjustment is performed. The adjustment process is the same as the transverse adjustment steps. Through transverse and longitudinal adjustments, the probe 9 is made to completely correspond to the test point in the electronic chip.

[0044] The electronic chip has special contacts for power supply and special contacts for signal transmission. The distribution of test points may be different for electronic chips of different specifications. Therefore, the position of the probe 9 in the mounting block 82 is adjusted according to the distribution of the test points of the electronic chip so that the probe 9 is consistent with the distribution of the test points. The adjustment process is as follows:

[0045] The electromagnet 1 85 in the mounting block 82 corresponding to the test point is energized to make the magnetic block 84 in the square groove 83 move toward the electromagnet 1 85, thereby driving the probe 9 on the magnetic block 84 to move toward the outside of the square groove 83, so that the probe 9 corresponding to the test point continues to move to the outside of the mounting block 82, and then the electromagnet 2 86 in other mounting blocks 82 is energized to make the other probes 9 move into the mounting block 82, and the probes 9 protruding outside the mounting block 82 correspond to the electronic chip, so that the corresponding probes 9 contact the electronic chip, and then the electronic chip is energized for detection; at the same time, it is prevented that other probes 9 contact the electronic chip, resulting in inaccurate test results; at the same time, by making the electromagnet 1 85 and the electromagnet 2 86 move different probes 9 in opposite directions, it is prevented that the electromagnet 2 86 in the adjacent mounting block 82 attracts the magnet on the probe 9 corresponding to the test point, so that the distance that the probe 9 protrudes outside the mounting block 82 is more accurate, and inaccurate test results caused by uneven contact between the probe 9 and the electronic chip are avoided.

[0046] It should be noted that since a spring 87 is installed between the electromagnet 1 85 and the magnetic block 84, and a spring 88 is installed between the electromagnet 2 86 and the magnetic block 84, the electromagnet 1 85 and the electromagnet 2 86 are powered off after each detection is completed, and the magnet and the probe 9 are reset by the elastic force of the spring 1 87 and the spring 2 88.

[0047] like Figure 6 As shown, a gear 1 21 is fixedly connected to the driving shaft of the conveyor belt 2, a gear 2 22 is installed on the base 1, and the gear 2 22 is an incomplete gear. The gear 1 21 is meshed and connected with the gear 2 22, and a motor 23 is installed on the base 1 to drive the gear 2 22 to rotate.

[0048] The motor 23 drives the gear 22 to rotate, thereby driving the gear 1 21 meshing with the gear 22 to rotate, and then driving the conveyor belt 2 to run. Since the gear 22 is an incomplete gear, the gear 1 21 is rotated for a certain angle and then stops, thereby causing the conveyor belt 2 to stop after transmitting a certain distance, and the conveyor belt 2 stops after transporting the electronic chip to the bottom of the visual recognition camera 4, so that the visual recognition camera 4 can stably identify the test point.

[0049] like Figure 7 , Figure 8 As shown, the alignment mechanism 5 includes two automatic telescopic rods 51 installed on the fixed frame 3, and the two automatic telescopic rods 51 are respectively located on both sides of the conveyor belt 2. The output end of the automatic telescopic rod 51 is fixedly connected with a sleeve 52, and a slide rod 53 is slidably connected inside the sleeve 52. The slide rod 53 passes through one end of the sleeve 52, and the passed end is fixedly connected with a push plate 54. A spring 55 is installed between the push plate 54 and the sleeve 52 on the outside of the slide rod 53, and the push plate 54 is located above the conveyor belt 2.

[0050] The alignment mechanism 5 also includes four fixed platforms 56 fixedly connected to the fixed frame 3, the fixed platforms 56 are located on both sides of the automatic telescopic rod 1 51, and an automatic telescopic rod 2 57 is installed on the fixed platforms 56. The output end of the automatic telescopic rod 2 57 is fixedly connected to a sleeve 2 58, and a sliding rod 3 59 is slidably connected in the sleeve 2 58. The sliding rod 3 59 passes through one end of the sleeve 2 58, and a slider 2 510 is fixedly connected to the passed end. A spring 4 511 is installed between the slider 2 510 and the sleeve 2 58 on the outside of the sliding rod 3 59. The slider 2 510 is located above the conveyor belt 2, and a telescopic block 512 is fixedly connected to the side of the slider 2 510 away from the conveyor belt 2. A fixed rod 513 is fixedly connected between the telescopic ends of the two telescopic blocks 512 on both sides of the conveyor belt 2, and a push plate 2 514 is fixedly connected to the fixed rod 513.

[0051] A slide groove 1 515 and a slide groove 2 516 are provided on one side of the fixed platform 56 close to the conveyor belt 2, the slide groove 1 515 is located above the slide groove 2 516, and the fixed rod 513 is slidably connected in the slide groove 1 515, the slider 2 510 is slidably connected in the slide groove 2 516, the slide groove 1 515 includes a horizontal groove 5151 and an arc groove 5152, the horizontal groove 5151 and the arc groove 5152 are connected, and the arc groove 5152 is away from the slide groove 2 516.

[0052] When the electronic chip moves to the bottom of the visual recognition camera 4, according to the area of ​​the electronic chip recognized by the visual recognition camera 4, the automatic telescopic rods 1 51 on both sides of the conveyor belt 2 are started, and the push plate 1 54 is pushed to move a certain distance toward the electronic chip through the sleeve 1 52 and the slide bar 2 53, so that the distance between the push plates 1 54 on both sides is smaller than the distance between the two sides of the electronic chip. Since a spring 3 55 is installed between the sleeve 1 52 and the push plate 1 54, the push plates 1 54 on both sides are blocked by the electronic chip and the spring 3 55 is compressed, and the slide bar 2 53 slides into the sleeve 1 52, so that the push plates 1 54 on both sides are fully in contact with the electronic chip, so that the two sides of the electronic chip are aligned;

[0053] At the same time, the automatic telescopic rod 2 57 is started, and the sliding block 2 510 is pushed to move a certain distance through the sleeve 2 58 and the sliding rod 3 59, so that the sliding blocks 2 510 on the other two sides of the electronic chip drive the fixed rod 513 to push the upper plate 2 514 toward the electronic chip through the telescopic block 512, so that the fixed rod 513 slides from the arc groove 5152 into the horizontal groove 5151, and the telescopic block 512 is compressed at the same time; the distance moved by the two sliding blocks 510 is less than the distance between the other two sides of the electronic chip, and due to the distance between the sleeve 2 58 and the sliding block 2 510 A spring four 511 is installed in the middle, so the push plates two 514 on both sides are blocked by the electronic chip and compress the spring three 55, and the sliding rod three 59 slides into the sleeve two 58, so that the push plates two 514 on both sides can fully contact the electronic chip, and the other two sides of the electronic chip are aligned; by sliding the fixing rod 513 from the arc groove 5152 into the horizontal groove 5151, the push plate two 514 is moved from a high place to a low place, and then the electronic chip is aligned to avoid the push plate two 514 hindering the transmission of the electronic chip on the conveyor belt 2.

[0054] The electronic chip is aligned on the conveyor belt 2 through the alignment mechanism 5 so that it can be aligned at the center directly below the visual recognition camera 4. There is no need for realignment when transferring through the transfer mechanism 6, and the visual recognition camera 4 can recognize it more accurately.

[0055] like Fig. 9 As shown, the transfer mechanism 6 includes a lifting rod 61 fixedly connected to the base 1, the telescopic end of the lifting rod 61 is fixedly connected to a connecting block 62, a rotating plate 63 is rotatably connected to the connecting block 62, a motor 64 for driving the rotating plate 63 to rotate is installed on the connecting block 62, and a vacuum suction cup 65 is installed on the end of the rotating plate 63 away from the lifting rod 61.

[0056] Start motor three 64 to drive the rotating plate 63 to rotate to the bottom of the visual recognition camera 4, then start the lifting rod 61 to move the vacuum suction cup 65 downward, and start the vacuum suction cup 65 to absorb the electronic chip, then move the vacuum suction cup 65 upward and rotate 180°, rotate the electronic chip to the center just above the detection table 7, then move the electronic chip downward, energize the electronic chip and the probe 9 and perform testing.

[0057] like Figure 1 As shown, the collecting mechanism 10 includes an electric slide rail 101 installed on the base 1 , and a collecting box 102 and a collecting box 2 103 are installed on the electric slide rail 101 . The collecting box 102 and the collecting box 2 103 are both located on one side of the transfer mechanism 6 .

[0058] After the inspection is completed, the electronic chip is rotated 90° to the collection mechanism 10. If the electronic chip is qualified, the electronic chip is lowered into the collection box 1 102 through the vacuum suction cup 65. If the electronic chip is unqualified, the electric slide rail 101 is started, the collection box 2 103 is moved to the bottom of the electronic chip, and the electronic chip is lowered into the collection box 2 103 through the vacuum suction cup 65.

[0059] Working principle:

[0060] When the equipment is in operation, the electronic chips are placed on the conveyor belt 2 at a certain interval and conveyed from one end of the conveyor belt 2 to the other end. When the electronic chip moves to the bottom of the visual recognition camera 4, the alignment mechanism 5 aligns the electronic chip to ensure that the electronic chip is at the center of the visual recognition camera 4. The visual recognition camera 4 then identifies the electronic chip and identifies the test points on the electronic chip. Since the alignment mechanism 5 aligns the electronic chip directly below the visual recognition camera 4, there is no need to realign the electronic chip when the electronic chip is transferred to the test table 7 through the transfer mechanism 6. The visual recognition camera 4 transmits the test point information of the electronic chip to the adjustment mechanism 8, and the probe 9 is adjusted by the adjustment mechanism 8 so that the arrangement of the probe 9 conforms to the test point of the electronic chip, thereby performing power-on performance testing. After the test is completed, the electronic chip is transferred to the collection mechanism 10 for collection through the transfer mechanism 6.

[0061] The embodiments of the present invention are provided for the purpose of illustration and description. Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. An adjustable multi-specification electronic chip power-on performance detection device, comprising: A base (1), characterized in that: a conveyor belt (2) and a fixed frame (3) are installed on the base (1), a visual recognition camera (4) is installed on the top of the fixed frame (3), an alignment mechanism (5) is provided on the fixed frame (3), a transfer mechanism (6) and a detection table (7) are provided on the base (1) at one end of the conveyor belt (2) close to the fixed frame (3), and the transfer mechanism (6) is located between the conveyor belt (2) and the detection table (7), an adjustment mechanism (8) is provided in the detection table (7), and a probe (9) is installed on the adjustment mechanism (8), and a collection mechanism (10) is provided on the base (1); The adjusting mechanism (8) comprises a square groove (81) provided in the detection platform (7), a plurality of rows of mounting blocks (82) are arranged in the square groove (81), a square groove (83) is provided in the mounting block (82), a magnetic block (84) is slidably connected to the square groove (83), the probe (9) is fixedly mounted on the magnetic block (84), and the head of the probe (9) is connected to the opening of the square groove (83), an electromagnet (85) and an electromagnet (86) are installed on both sides of the magnetic block (84) in the square groove (83), a spring (87) is installed between the electromagnet (85) and the magnetic block (84), and a spring (88) is installed between the electromagnet (86) and the magnetic block (84); The adjusting mechanism (8) further comprises a square slot three (89) provided on four sides of the square slot one (81) at the bottom of the detection platform (7), two distance adjusting mechanisms (810) being arranged in the upper and lower parts of the square slot three (89), the distance adjusting mechanism (810) comprising a threaded rod (8101) rotatably connected to one of the square slots three (89), a motor one (8102) for driving the threaded rod (8101) to rotate being installed in the square slot three (89), and two opposite square slots three (89) being slidably connected to each other. A plurality of sliders (8103), the threaded rod (8101) passing through a slider (8103) in a square groove (89), the threaded rod (8101) having threads at only two ends thereof and having opposite rotation directions, and the two sliders (8103) at the two ends of the threaded rod (8101) being threadedly connected to the threaded rod (8101), the distance adjustment mechanism (810) further comprising a scissor-type bracket (8104), and the scissor-type bracket (8104) being connected to the plurality of sliders (8103); The two threaded rods (8101) in the two distance adjustment mechanisms (810) are vertically staggered; A slide bar 1 (8105) is fixedly connected between the sliders 1 (8103) located in the two opposite square grooves 3 (89), and the two slide bars 1 (8105) in the two distance adjustment mechanisms (810) are vertically staggered and distributed, the mounting block (82) is located at the intersection of the two slide bars 1 (8105), and the mounting block (82) is slidably connected to the two slide bars 1 (8105).

2. The adjustable multi-specification electronic chip power-on performance detection device according to claim 1, characterized in that: A gear 1 (21) is fixedly connected to the driving shaft of the conveyor belt (2), a gear 2 (22) is mounted on the base (1), and the gear 2 (22) is an incomplete gear. The gear 1 (21) is meshedly connected with the gear 2 (22), and a motor 2 (23) is mounted on the base (1) for driving the gear 2 (22) to rotate.

3. The adjustable multi-specification electronic chip power-on performance detection device according to claim 1, characterized in that: The alignment mechanism (5) comprises two automatic telescopic rods (51) mounted on a fixed frame (3), the two automatic telescopic rods (51) being respectively located on both sides of the conveyor belt (2), the output end of the automatic telescopic rod (51) being fixedly connected to a sleeve (52), a sliding rod (53) being slidably connected inside the sleeve (52), the sliding rod (53) passing through one end of the sleeve (52), and a push plate (54) being fixedly connected to the passing end, a spring (5) being installed between the push plate (54) and the sleeve (52) on the outside of the sliding rod (53), the push plate (54) being located above the conveyor belt (2).

4. The adjustable multi-specification electronic chip power-on performance detection device as claimed in claim 3, characterized in that: The alignment mechanism (5) further comprises four fixed platforms (56) fixedly connected to the fixed frame (3), the fixed platforms (56) being located on both sides of the automatic telescopic rod (51), the automatic telescopic rod (57) being mounted on the fixed platforms (56), the output end of the automatic telescopic rod (57) being fixedly connected to the sleeve (58), the sleeve (58) being slidably connected to the sliding rod (59), the sliding rod (59) passing through one end of the sleeve (58), and the other end passing through being fixedly connected to the sliding block Two (510), a spring four (511) is installed between the slider two (510) and the sleeve two (58) on the outside of the slide rod three (59), the slider two (510) is located above the conveyor belt (2), and a telescopic block (512) is fixedly connected to the side of the slider two (510) away from the conveyor belt (2), and a fixed rod (513) is fixedly connected between the telescopic ends of the two telescopic blocks (512) on both sides of the conveyor belt (2), and a push plate two (514) is fixedly connected to the fixed rod (513).

5. The adjustable multi-specification electronic chip power-on performance detection device as claimed in claim 4, characterized in that: The fixed platform (56) is provided with a slide groove 1 (515) and a slide groove 2 (516) on one side close to the conveyor belt (2); the slide groove 1 (515) is located above the slide groove 2 (516); the fixed rod (513) is slidably connected in the slide groove 1 (515); the slider 2 (510) is slidably connected in the slide groove 2 (516); the slide groove 1 (515) includes a horizontal groove (5151) and an arc groove (5152); the horizontal groove (5151) and the arc groove (5152) are connected and the arc groove (5152) is away from the slide groove 2 (516).

6. The adjustable multi-specification electronic chip power-on performance detection device according to claim 1, characterized in that: The transfer mechanism (6) comprises a lifting rod (61) fixedly connected to the base (1); the telescopic end of the lifting rod (61) is fixedly connected to a connecting block (62); a rotating plate (63) is rotatably connected to the connecting block (62); a motor (64) for driving the rotating plate (63) to rotate is installed on the connecting block (62); and a vacuum suction cup (65) is installed at one end of the rotating plate (63) away from the lifting rod (61).

7. The adjustable multi-specification electronic chip power-on performance testing device according to claim 6, characterized in that: The collecting mechanism (10) comprises an electric slide rail (101) mounted on a base (1), a collecting box 1 (102) and a collecting box 2 (103) being mounted on the electric slide rail (101), and the collecting box 1 (102) and the collecting box 2 (103) are both located on one side of the transfer mechanism (6).

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