Upward-pressing adsorption laser machining table

Abstract

The invention relates to an upper pressure adsorption laser processing table which comprises a DD motor, a suction cup base and a vacuum suction cup, the suction cup base is installed on the DD motor, and the vacuum suction cup is installed on the suction cup base; an upper pressing plate is arranged over the vacuum suction cup, quartz is installed in a center groove of the upper pressing plate, and a product is placed on the vacuum suction cup under the quartz. A plurality of pressing blocks are evenly distributed on the portion, on the outer side of the upper pressing plate, of the suction cup base in the circumferential direction, adjusting lead screws are installed in the pressing blocks in the vertical direction, and the adjusting lead screws can move up and down in the pressing blocks and make contact with the upper pressing plate below the adjusting lead screws. According to the invention, the chip is adsorbed on the carrying table, then the quartz is supported and pressed on the chip, and laser penetrates through the quartz for processing, so that the chip is ensured to be fixed in the processing process.

Description

Technical Field

[0001] The present invention relates to the technical field related to laser processing, and in particular to an upper pressure adsorption laser processing table. Background Art

[0002] During the laser processing of the chip, the chip needs to be placed on a processing platform such as a vacuum suction cup.

[0003] After searching, it was found that the existing Chinese patent announcement number is CN218123362U, which discloses a laser device for chip processing, belonging to the field of chip technology, including a bottom plate, a controller is arranged on the top of the bottom plate, and a flip structure is arranged on the top of the bottom plate, the bottom of the telescopic push rod is fixedly connected to the adjustment frame, the bottom end of the movable frame is fixedly connected to the top of the telescopic push rod, the motor is arranged on the top of the movable frame, and the inner wall of the connecting rod is fixedly connected to the outer wall of the bevel gear set. The laser device for chip processing, through the setting of the flip structure, facilitates the user to process both sides of the chip when the user needs to ensure the processing effect of the chip, thereby saving the time spent by the user on the chip processing, improving the efficiency of the user on the chip processing, and at the same time ensuring the quality of the user's chip processing, preventing the chip from falling and affecting the subsequent chip processing effect, thereby increasing the efficiency and quality of the user's chip production.

[0004] In summary, the problems existing in the prior art are: the conventional method is generally direct laser processing, during which the chip that is peeled off first will move and affect the processing of adjacent chips, resulting in a decrease in the overall yield.

[0005] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a top-pressure adsorption laser processing table to make it more valuable for industrial use. Summary of the invention

[0006] In order to solve any of the above technical problems, the purpose of the present invention is to provide an upper pressure adsorption laser processing table.

[0007] To achieve the above object, the present invention adopts the following technical solution:

[0008] The upper pressure adsorption laser processing table includes a DD motor, a suction cup base and a vacuum suction cup, wherein the suction cup base is installed on the DD motor, and the vacuum suction cup is installed on the suction cup base;

[0009] An upper pressing plate is arranged directly above the vacuum suction cup, quartz is installed in the central groove of the upper pressing plate, and the product is placed on the vacuum suction cup directly below the quartz;

[0010] A plurality of pressing blocks are evenly distributed along the circumferential direction on the suction cup base outside the upper pressing plate, and an adjusting screw rod is installed in the pressing block along the vertical direction. The adjusting screw rod can move up and down in the pressing block and contact the upper pressing plate below;

[0011] The pressing block includes a vertical end and a horizontal end. The vertical end of the pressing block is installed on the suction cup base along the vertical direction, and the horizontal end of the pressing block is installed on the inner side of the top of the vertical end of the pressing block along the horizontal direction. A threaded sleeve is installed in the horizontal end of the pressing block along the vertical direction, and the adjusting screw is screwed into the internal thread of the threaded sleeve along the vertical direction.

[0012] As a further improvement of the present invention, the threaded sleeve is screwed into the internal thread of the horizontal end of the pressing block.

[0013] As a further improvement of the present invention, at least one sealing ring is installed between the vacuum suction cup and the suction cup base.

[0014] As a further improvement of the present invention, a dial gauge is installed at the bottom of the suction cup base directly below at least one pressing block through a dial gauge fixing block, and the ejector pin at the top of the dial gauge contacts the bottom of the upper pressing plate above.

[0015] As a further improvement of the present invention, the vacuum suction cup is a ceramic suction cup.

[0016] As a further improvement of the present invention, quartz glue is glued in the central groove of the upper pressing plate.

[0017] By means of the above scheme, the present invention has at least the following advantages:

[0018] The present invention adsorbs the chip on a carrier, and then mounts a quartz plate to press the chip, and the laser is processed through the quartz, thereby ensuring that the chip is fixed during the processing.

[0019] The invention has a simple structure, can visualize the pressure amount of the product, is convenient for adjusting the test, and can compare the processing effects under different pressure conditions.

[0020] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0022] Figure 1It is a structural schematic diagram of an upper pressure adsorption laser processing table of the present invention;

[0023] Figure 2 yes Figure 1 Schematic diagram of the internal structure;

[0024] Figure 3 yes Figure 2 Schematic diagram of the partial enlarged structure of the middle pressure block, adjusting screw and threaded sleeve.

[0025] The meanings of the various reference numerals in the figures are as follows.

[0026] 1. DD motor; 2. Suction cup base; 3. Vacuum suction cup; 4. Product; 5. Sealing ring; 6. Quartz; 7. Upper pressure plate; 8. Micrometer; 9. Micrometer fixing block; 10. Pressure block; 11. Adjustment screw; 12. Threaded sleeve. DETAILED DESCRIPTION

[0027] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0028] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, rather than all the embodiments. The components of the embodiment of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiment of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0029] like Figure 1 to Figure 3 As shown, a top pressure adsorption laser processing table includes a DD motor 1, a suction cup base 2 and a vacuum suction cup 3, wherein the vacuum suction cup 3 is a ceramic suction cup. The suction cup base 2 is mounted on the DD motor 1, and the vacuum suction cup 3 is mounted on the suction cup base 2. At least one sealing ring 5 is installed between the vacuum suction cup 3 and the suction cup base 2.

[0030] An upper pressing plate 7 is arranged directly above the vacuum suction cup 3 , and a quartz 6 is installed in the central groove of the upper pressing plate 7 . The quartz 6 is glued in the central groove of the upper pressing plate 7 . The product 4 is placed on the vacuum suction cup 3 directly below the quartz 6 .

[0031] A plurality of pressing blocks 10 are evenly distributed along the circumferential direction on the suction cup base 2 outside the upper pressing plate 7. An adjusting screw rod 11 is installed in the pressing block 10 along the vertical direction. The adjusting screw rod 11 can move up and down in the pressing block 10 and contact the upper pressing plate 7 below.

[0032] The pressing block 10 includes a pressing block vertical end and a pressing block horizontal end. The pressing block vertical end is installed on the suction cup base 2 along the vertical direction, and the pressing block horizontal end is installed on the top inner side of the pressing block vertical end along the horizontal direction. A threaded sleeve 12 is installed in the pressing block horizontal end along the vertical direction, and the adjusting screw 11 is screwed into the internal thread of the threaded sleeve 12 along the vertical direction. The threaded sleeve 12 is screwed into the internal thread of the horizontal end of the pressing block.

[0033] A dial gauge 8 is installed at the bottom of the suction cup base 2 directly below at least one pressing block 10 through a dial gauge fixing block 9, and the ejector pin at the top of the dial gauge 8 contacts the bottom of the upper pressing plate 7 above.

[0034] The positional relationship and connection relationship between the components of the present invention are as follows:

[0035] The suction cup base 2 is installed on the DD motor 1 by screws, and a sealing ring 5 is placed in the center groove above the suction cup base 2. The vacuum suction cup 3 is positioned on the suction cup base 2 by the sealing ring 5. The product 4 is placed on the vacuum suction cup 3, and the quartz 6 is glued to the center groove of the upper pressure plate 7 with glue, and the whole is placed above the product 4, and the quartz surface presses the product 4. The micrometer fixing block 9 is installed on the back of the flange of the suction cup base 2 by screws, and the ejector pin of the micrometer 8 passes through the flange hole of the suction cup base 2 and is clamped and fixed by the micrometer fixing block 9. The threaded sleeve 12 is screwed into the threaded hole of the pressure block 10, and the adjusting screw 11 is screwed into the internal thread of the threaded sleeve 12, and then the whole is installed on the front of the flange of the suction cup base 2 by screws.

[0036] Working principle and working process of the present invention:

[0037] First, place the product 4 on top of the vacuum suction cup 3, turn on the vacuum to fix the product 4 by suction. The quartz 6 is glued to the central groove of the upper pressure plate 7 and placed as a whole on the product 4, with the quartz surface pressing the product 4. Loosen the clamping screws of the micrometer fixing block 9, adjust the overall height of the micrometer 8, ensure that the ejector pin of the micrometer 8 is pressed on the back of the flange of the suction cup base 2, and set all three micrometers 8 to zero. Three adjustable pressing blocks 10 are installed on the front of the flange of the suction cup base 2, ensure that the adjusting screw 11 is directly above the ejector pin of the micrometer 8, and the ball head of the adjusting screw 11 is screwed into the V-groove of the flange of the suction cup base 2; the three adjusting screws 11 in the circumferential direction are screwed down to press the upper pressure plate 7, and finally press the product 4, and the amount of downward pressure is observed through the readings of the three micrometers 8.

[0038] The present invention adsorbs the chip on the carrier, and then mounts quartz on the chip, and the laser passes through the quartz for processing, ensuring that the chip is fixed during the processing. The structure is simple, the pressure on the product can be visualized, and the adjustment test is convenient, and the processing effect under different pressure conditions can be compared.

[0039] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0040] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. An upper pressure adsorption laser processing table, comprising a DD motor (1), a suction cup base (2) and a vacuum suction cup (3), wherein the suction cup base (2) is mounted on the DD motor (1), and the vacuum suction cup (3) is mounted on the suction cup base (2); characterized in that: An upper pressing plate (7) is arranged directly above the vacuum suction cup (3), a quartz (6) is installed in the central groove of the upper pressing plate (7), and the product (4) is placed on the vacuum suction cup (3) directly below the quartz (6); A plurality of pressing blocks (10) are evenly distributed along the circumferential direction on the suction cup base (2) outside the upper pressing plate (7), and an adjusting screw rod (11) is installed in the pressing block (10) along the vertical direction. The adjusting screw rod (11) can move up and down in the pressing block (10) and contact the upper pressing plate (7) below; The pressing block (10) comprises a pressing block vertical end and a pressing block horizontal end, wherein the pressing block vertical end is mounted on the suction cup base (2) along the vertical direction, and the pressing block horizontal end is mounted on the inner side of the top of the pressing block vertical end along the horizontal direction, and a threaded sleeve (12) is mounted inside the pressing block horizontal end along the vertical direction, and the adjusting screw rod (11) is screwed into the internal thread of the threaded sleeve (12) along the vertical direction.

2. The upper pressure adsorption laser processing table according to claim 1, characterized in that: The threaded sleeve (12) is screwed into the internal thread of the horizontal end of the pressing block.

3. The upper pressure adsorption laser processing table according to claim 1, characterized in that: At least one sealing ring (5) is installed between the vacuum suction cup (3) and the suction cup base (2).

4. The upper pressure adsorption laser processing table according to claim 1, characterized in that: A micrometer (8) is installed at the bottom of the suction cup base (2) directly below at least one of the pressing blocks (10) via a micrometer fixing block (9), and the ejector pin at the top of the micrometer (8) contacts the bottom of the upper pressing plate (7) above.

5. The upper pressure adsorption laser processing table according to claim 1, characterized in that: The vacuum suction cup (3) is a ceramic suction cup.

6. The upper pressure adsorption laser processing table according to claim 1, characterized in that: The quartz (6) is glued into the central groove of the upper pressing plate (7).

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