Cutting device for semiconductor wafers

Abstract

The present invention relates to a cutting device for semiconductor wafers, comprising a frame, a suction cup, a cutting assembly, and a cooling assembly, wherein the suction cup is mounted on the frame; the cutting assembly comprises a bracket, a horizontal plate, a lifting plate, and a cutter, wherein the bracket is slidably mounted on the frame, the horizontal plate is slidably mounted on the bracket, the lifting plate is slidably mounted on the horizontal plate, and the cutter is rotatably connected to the lifting plate; the cooling assembly comprises a blade cover and a protective cover, wherein the blade cover is mounted on one side of the lifting plate, the blade cover is provided with a first blade groove, a first air groove, and a plurality of first through holes, wherein the first blade groove is used to accommodate a cutting edge of the cutter, the first air groove is provided in the blade cover, one end of the first through hole is connected to the first air groove, and the other end is connected to the first blade groove; the protective cover is detachably connected to the blade cover, the protective cover is provided with a second blade groove, a second air groove, and a plurality of second through holes, wherein the second blade groove is used to accommodate a cutting edge of the cutter, the second air groove is provided in the protective cover, one end of the second through hole is connected to the second air groove, and the other end is connected to the second blade groove. The cutting device is convenient to use and facilitates heat dissipation of the cutter.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer processing and manufacturing, and in particular to a cutting device for semiconductor wafers. Background Art

[0002] Semiconductor wafers (such as gallium arsenide) manufactured in semiconductor wafer fabrication plants are typically 8-inch or 12-inch in size. However, the back-end processing equipment at packaging plants performing semiconductor back-end processing can only process semiconductor wafers sized 4 inches or smaller. Therefore, after completing the production of a single wafer, semiconductor wafer fabrication plants must cut the entire wafer into several small wafers, and then cut the small wafers into several wafers. Currently, this is typically done using a cutting blade. However, during the cutting process, repeated friction between the blade and the semiconductor wafer generates heat, causing the blade temperature to rise, shortening the blade's lifespan.

[0003] For example, patent publication CN118559896B discloses a shock-absorbing dual-refrigerant circulation cooling wafer cutting device, comprising a main body, an air pump, and a water pump. A protective cover is provided on one side of the main body, a blade is provided inside the protective cover, and a drive motor is provided between the protective cover and the blade. The main body controls the horizontal displacement of the protective cover, and the lower end surface of the protective cover is higher than the lower end surface of the blade. A carrier is provided below the main body to secure the wafer. The gap between the protective cover and the blade is filled with coolant, which is mainly located on both sides of the blade. The coolant is provided to limit deflection of the blade during rotation. By filling the outer side of the blade with coolant, when the blade vibrates or deflects, the coolant flow generates additional torque on the blade, thereby increasing resistance and reducing the blade's deflection angle. However, the coolant cooling method is prone to leaking, thereby contaminating the wafer. Summary of the Invention

[0004] Based on this, it is necessary to provide a cutting device for semiconductor wafers that is convenient for heat dissipation in order to address the above problems.

[0005] 18. The cutting device of claim 17, wherein the cutting device is configured to be detachably mounted on the cutting plate and the cutting plate is mounted on a bottom surface of the cutting plate. The cutting device is configured to be detachably mounted on the cutting plate and the cutting plate is mounted on a bottom surface of the cutting plate. The cutting device is configured to be detachably mounted on the cutting plate and the cutting plate is mounted on a bottom surface of the cutting plate.

[0006] In one embodiment, the cooling assembly further includes an air inlet pipe and an air exhaust pipe, one end of the air inlet pipe is connected to the first air groove, and the other end is connected to the inflation mechanism; one end of the air exhaust pipe is connected to the first air groove, and the other end is connected to the air exhaust mechanism.

[0007] In one embodiment, the second gas groove is connected to the first gas groove.

[0008] In one embodiment, a snap-fit portion is provided at one end of the blade cover, and the snap-fit portion is provided corresponding to one end of the first air groove; a snap-fit groove is provided at one end of the guard cover to accommodate the snap-fit portion, and the snap-fit groove is connected to the second air groove.

[0009] In one embodiment, the cooling assembly further comprises a support block, one end of the support block is mounted on one side of the shield, and the other end of the support block is detachably connected to one side of the knife cover.

[0010] In one embodiment, the cooling assembly further includes a baffle and a protrusion, wherein the baffle is accommodated in the first air groove, and the baffle is used to close or open the first through hole; one end of the protrusion is installed on the baffle, and the other end is passed through the knife cover, and the protrusion is used to drive the baffle to slide.

[0011] In one embodiment, the cutting assembly further includes a lifting power element, which is mounted on the horizontal plate and is used to drive the lifting plate to slide; the cutting assembly further includes a cutting power element, a driving wheel, a driven wheel and a synchronous belt, the cutting power element is mounted on the lifting plate, the driving wheel is mounted on the output end of the cutting power element, the driven wheel is mounted on the cutter shaft, one end of the synchronous belt is connected to the driving wheel, and the other end is connected to the driven wheel.

[0012] In one embodiment, a sharpening assembly is further included, which includes a base plate, a slider, a sharpening wheel and a sliding power element. There are two base plates, two sliders, two sharpening wheels and two sliding power elements, and they correspond one to one. The two base plates are respectively installed on both sides of the lifting plate, the slider is slid on the base plate, the sharpening wheel is installed on the slider, and the sliding power element is used to drive the slider to slide. The two sharpening wheels correspond to both sides of the cutter.

[0013] In one embodiment, the grinding wheel includes a vitrified bond, a resin bond, and an abrasive, and the abrasive is silicon carbide or corundum.

[0014] In one embodiment, the suction cup is a microporous ceramic suction cup.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The cutting device for semiconductor wafers of the present invention accommodates the blade of the cutter through the first blade groove and the second blade groove, and blows air toward the blade of the cutter through the first through hole and the second through hole respectively, thereby accelerating the cooling of the cutter; the cutting device for semiconductor wafers is easy to use and facilitates the heat dissipation of the cutter. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the structure of a semiconductor wafer cutting device according to an embodiment of the present invention;

[0018] Figure 2 for Figure 1 A schematic structural diagram of a semiconductor wafer cutting device is shown, wherein the frame and control components are not shown;

[0019] Figure 3 for Figure 2 A schematic structural diagram of a cutting assembly and a sharpening assembly in a cutting device for semiconductor wafers is shown;

[0020] Figure 4 for Figure 3 A schematic diagram of the structure of a cutting blade and a cooling assembly in a cutting device for semiconductor wafers is shown;

[0021] Figure 5 for Figure 4 A schematic structural diagram of a cooling assembly in a semiconductor wafer cutting device is shown, wherein a shield and a support block are not shown;

[0022] Figure 6 for Figure 5 Enlarged view of the middle circle A;

[0023] Figure 7 for Figure 4 A schematic diagram of the structure of the shield and support block in the cooling assembly shown;

[0024] Figure 8 for Figure 7 Enlarged view of the middle circle B;

[0025] Figure 9 for Figure 1 A schematic diagram of a cutting device for semiconductor wafers is shown.

[0026] The meanings of the numbers in the accompanying drawings are:

[0027] 100. Cutting device for semiconductor wafers;

[0028] 10. Frame; 11. Base; 12. Cover; 13. Top seat; 20. Suction cup; 30. Cutting assembly; 31. Bracket; 32. Horizontal plate; 33. Lifting plate; 34. Cutter; 35. Lifting power element; 36. Cutting power element; 37. Driving pulley; 38. Driven pulley; 39. Synchronous belt;

[0029] 40. Cooling assembly; 41. Blade cover; 411. First blade groove; 412. First air groove; 413. First through hole; 414. Clamping portion; 42. Protective cover; 421. Second blade groove; 422. Second air groove; 423. Second through hole; 424. Clamping slot; 43. Support block; 44. Air inlet pipe; 45. Air exhaust pipe; 46. Baffle; 47. Bump; 50. Sharpening assembly; 51. Base plate; 52. Slider; 53. Sharpening wheel; 54. Sliding power element; 60. Control assembly; 61. Display screen. DETAILED DESCRIPTION

[0030] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0031] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0033] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0034] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0035] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0036] Please refer to Figures 1 to 9 , an embodiment of the invention is a cutting device 100 for semiconductor wafers, comprising a frame 10, a suction cup 20, a cutting assembly 30 and a cooling assembly 40, wherein the suction cup 20 is mounted on the frame 10; the cutting assembly 30 comprises a bracket 31, a horizontal plate 32, a lifting plate 33 and a cutter 34, wherein the bracket 31 is slidably mounted on the frame 10, the horizontal plate 32 is slidably mounted on the bracket 31, the lifting plate 33 is slidably mounted on the horizontal plate 32, and the cutter 34 is rotatably connected to the lifting plate 33; the cooling assembly 40 comprises a knife cover 41 and a guard 42, wherein the knife cover 41 is mounted on one side of the lifting plate 33, and the knife cover 41 is provided with a first knife groove 411, a first air groove 412 and a second air groove 413. 12 and a plurality of first through holes 413. The first knife groove 411 is used to accommodate the blade portion of the cutter 34. The first air groove 412 is provided in the knife cover 41. One end of the first through hole 413 is connected to the first air groove 412, and the other end is connected to the first knife groove 411. The protective cover 42 is detachably connected to the knife cover 41. The protective cover 42 is provided with a second knife groove 421, a second air groove 422, and a plurality of second through holes 423. The second knife groove 421 is used to accommodate the blade portion of the cutter 34. The second air groove 422 is provided in the protective cover 42. One end of the second through hole 423 is connected to the second air groove 422, and the other end is connected to the second knife groove 421. The cutting device 100 for semiconductor wafers accommodates the blade portion of the cutter 34 through the first knife groove 411 and the second knife groove 421, and blows air toward the blade portion of the cutter 34 through the first through hole 413 and the second through hole 423, respectively, to accelerate the cooling of the cutter 34.

[0037] like Figure 1 As shown, in this embodiment, the frame 10 includes a base 11, a cover plate 12 and a top seat 13, the cover plate 12 is covered on the base 11, and the top seat 13 is installed on the base 11; the suction cup 20 is installed on the frame 10, optionally, the suction cup 20 is installed on the base 11; further, the suction cup 20 is a microporous ceramic suction cup, which uses the vacuum adsorption principle to fix the semiconductor wafer to be processed. The microporous ceramic suction cup has the characteristics of high flatness and parallelism, high strength, good air permeability, and uniform adsorption force.

[0038] like Figure 2 and Figure 3 As shown, the cutting assembly 30 includes a bracket 31, a transverse plate 32, a lifting plate 33 and a cutter 34. The bracket 31 is slidably mounted on the frame 10, the transverse plate 32 is slidably mounted on the bracket 31, the lifting plate 33 is slidably mounted on the transverse plate 32, and the cutter 34 is rotatably connected to the lifting plate 33. Optionally, the cutting assembly 30 also includes a Y-axis power element (not shown) and an X-axis power element (not shown). The Y-axis power element is used to drive the bracket 31 to slide on the base 11, and the X-axis power element is used to drive the transverse plate 32 to slide on the bracket 31. This is a prior art. Furthermore, the cutting assembly 30 also includes a lifting power element 35, which is mounted on the transverse plate 32 and is used to drive the lifting plate 33 to slide.

[0039] In one embodiment, the cutting assembly 30 also includes a cutting power element 36, a driving wheel 37, a driven wheel 38 and a synchronous belt 39. The cutting power element 36 is installed on the lifting plate 33, the driving wheel 37 is installed on the output end of the cutting power element 36, and the driven wheel 38 is installed on the blade shaft of the cutter 34. One end of the synchronous belt 39 is connected to the driving wheel 37, and the other end is connected to the driven wheel 38; the driving wheel 37 is driven to rotate by the cutting power element 36, and the driven wheel 38 is driven to rotate by the synchronous belt 39, thereby driving the cutter 34 to rotate to achieve cutting.

[0040] like Figures 3 to 8 As shown, the cooling assembly 40 includes a blade cover 41 and a protective cover 42. The blade cover 41 is mounted on one side of the lifting plate 33. The blade cover 41 is provided with a first blade groove 411, a first air groove 412, and a plurality of first through holes 413. The first blade groove 411 is used to accommodate the blade portion of the cutting knife 34. The first air groove 412 is provided in the blade cover 41. One end of the first through hole 413 is connected to the first air groove 412, and the other end is connected to the first blade groove 411. Optionally, the blade cover 41 is arc-shaped, and the first blade groove 411 and the first air groove 412 are both arc-shaped corresponding to the blade cover 41. The first through holes 413 are evenly distributed along the inner circumference of the blade cover 41. In one embodiment, a clamping portion 414 is provided at one end of the blade cover 41, and the clamping portion 414 is provided corresponding to one end of the first air groove 412.

[0041] like Figure 4 、 Figure 7 and Figure 8As shown, the shield 42 is detachably connected to the knife cover 41. The shield 42 is provided with a second knife groove 421, a second air groove 422, and a plurality of second through holes 423. The second knife groove 421 is used to accommodate the blade portion of the cutting knife 34. The second air groove 422 is provided in the shield 42. One end of the second through hole 423 is connected to the second air groove 422, and the other end is connected to the second knife groove 421. Optionally, the shield 42 is arc-shaped, and the second knife groove 421 and the second air groove 422 are both arc-shaped corresponding to the shield 42. The second through holes 423 are evenly distributed along the inner circumference of the shield 42. Furthermore, the second air groove 422 is connected to the first air groove 412. One end of the shield 42 is magnetically attracted to one end of the knife cover 41. In other embodiments, one end of the shield 42 is snap-fitted to one end of the knife cover 41. In one embodiment, a slot 424 is provided at one end of the shield 42 to accommodate the snap-fit portion 414 . The slot 424 is connected to the second air groove 422 . The snap-fit portion 414 is inserted into the slot 424 for positioning and improving airtightness.

[0042] like Figure 4 As shown, the cooling assembly 40 further includes a support block 43, one end of which is mounted on one side of the shield 42 and the other end of which is detachably connected to one side of the blade cover 41, thereby improving the connection reliability between the shield 42 and the blade cover 41. Optionally, one side of the support block 43 is magnetically attracted to one side of the blade cover 41. In other embodiments, one side of the support block 43 is snap-fitted to one side of the blade cover 41.

[0043] like Figure 5 As shown, the cooling assembly 40 also includes an air inlet pipe 44 and an air exhaust pipe 45. One end of the air inlet pipe 44 is connected to the first air groove 412, and the other end is connected to the inflation mechanism. Air is supplied to the first air groove 412 through the air inlet pipe 44, and the gas is blown toward the cutter 34 through the first through hole 413. At the same time, the gas flows into the second air groove 422 through the first air groove 412, and then blows toward the cutter 34 through the second through hole 423 to accelerate the heat dissipation of the cutter 34; one end of the air exhaust pipe 45 is connected to the first air groove 412, and the other end is connected to the exhaust mechanism. Air is exhausted through the air exhaust pipe 45, and the waste chips generated by cutting enter the first air groove 412 through the first through hole 413 and are then discharged through the air exhaust pipe 45.

[0044] Please check again Figure 4 The cooling assembly 40 also includes a baffle 46 and a protrusion 47. The baffle 46 is accommodated in the first air groove 412, and the baffle 46 is used to close or open the first through hole 413; one end of the protrusion 47 is installed on the baffle 46, and the other end is passed through the knife cover 41, and the protrusion 47 is used to drive the baffle 46 to slide; optionally, the protrusion 47 is two pieces; when cutting, if waste chips do not want to enter the first air groove 412, the first through hole 413 is closed by the baffle 46 to prevent waste chips from entering the first air groove 412.

[0045] like Figure 3 As shown, the cutting device 100 for semiconductor wafers also includes a sharpening assembly 50, which includes a base plate 51, a slider 52, a sharpening wheel 53, and a sliding power element 54. There are two base plates 51, two sliders 52, two sharpening wheels 53, and two sliding power elements 54, and they correspond to each other. The two base plates 51 are respectively mounted on both sides of the lifting plate 33, the slider 52 is slidably mounted on the base plate 51, the sharpening wheel 53 is mounted on the slider 52, and the sliding power element 54 is used to drive the slider 52 to slide. The two sharpening wheels 53 correspond to both sides of the cutter 34. The sliding power element 54 drives the sharpening wheel 53 close to one side of the cutter 34, and the two sharpening wheels 53 cooperate to achieve sharpening. Optionally, the sharpening wheel 53 includes a ceramic bond, a resin bond, and an abrasive. The abrasive is silicon carbide or corundum, which has high sharpness and good finishing effect.

[0046] like Figure 1 As shown, the cutting device 100 for semiconductor wafers also includes a control component 60, which includes a display screen 61 and a controller (not shown). The display screen 61 is installed on the top seat 13, and the display screen 61 and each power element are electrically connected to the controller to achieve automatic control. This is the existing technology; optionally, the display screen 61 is a touch screen.

[0047] During cutting, the semiconductor wafer to be processed is placed on the suction cup 20, and the shield 42 is separated from the blade cover 41. The bracket 31 is slidably mounted on the base 11, and the cross plate 32 is slidably mounted on the bracket 31 to adjust its position. The lifting power element 35 drives the lifting plate 33 to descend toward the semiconductor wafer, and the cutting power element 36 then drives the cutter 34 to rotate, completing the cutting process. When waste chips are not required to enter the first air groove 412, the baffle 46 closes the first air hole. When waste chips need to be collected, the baffle 46 opens the first air hole, the air inlet pipe 44 is closed, and the exhaust pipe 45 draws air, allowing waste chips to enter the first air groove 412 through the first air hole and then be discharged through the exhaust pipe 45. Furthermore, when the cutter 34 needs to be cooled while cutting, the exhaust pipe 45 is closed, the first through hole 413 is opened, and the air inlet pipe 44 supplies air to the first air groove 412, which then blows air toward the cutter 34 through the first through hole 413. After the cutting is completed, the protective cover 42 covers the blade of the cutter 34, one end of the protective cover 42 is magnetically attracted to the bottom end of the knife cover 41, and one side of the support block 43 is magnetically attracted to one side of the knife cover 41. At this time, the clamping portion 414 is inserted into the clamping slot 424. Then, the exhaust pipe 45 is closed, the first through hole 413 is opened, and the air inlet pipe 44 supplies air to the first air groove 412. The air is blown toward the cutter 34 through the first through hole 413. At the same time, the air enters the second air groove 422 through the first air groove 412, and then blows toward the cutter 34 through the second through hole 423 to accelerate the cooling of the cutter 34. Moreover, the cutter 34 is covered by the knife cover 41 and the protective cover 42 to prevent accidental injury to the user and improve safety.

[0048] The cutting device 100 for semiconductor wafers of the present invention accommodates the blade of the cutter 34 through the first blade groove 411 and the second blade groove 421, and blows air toward the blade of the cutter 34 through the first through hole 413 and the second through hole 423, thereby accelerating the cooling of the cutter 34; the cutting device 100 for semiconductor wafers is easy to use and facilitates heat dissipation of the cutter 34.

[0049] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A cutting device for semiconductor wafers, characterized in that: The cam is mounted on a vertical cam, and the cam is mounted on a vertical cam, and the cam is mounted on a vertical cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, and the cam is mounted on a horizontal cam, 2. The semiconductor wafer cutting device according to claim 1, wherein: The cooling assembly also includes an air intake pipe and an air extraction pipe, one end of the air intake pipe is connected to the first air tank, and the other end is connected to the inflation mechanism; one end of the air extraction pipe is connected to the first air tank, and the other end is connected to the air extraction mechanism.

3. The semiconductor wafer cutting device according to claim 1, wherein: The second gas groove is connected to the first gas groove.

4. The semiconductor wafer cutting device according to claim 1, wherein: A clamping portion is provided at one end of the blade cover, and the clamping portion is provided corresponding to one end of the first air groove; a clamping slot is provided at one end of the shield to accommodate the clamping portion, and the clamping slot is connected to the second air groove.

5. The semiconductor wafer cutting device according to claim 1, wherein: The cooling assembly further comprises a support block, one end of which is mounted on one side of the shield, and the other end of which is detachably connected to one side of the knife cover.

6. The semiconductor wafer cutting device according to claim 1, wherein: The cooling assembly also includes a baffle and a protrusion. The baffle is accommodated in the first air groove and is used to close or open the first through hole. One end of the protrusion is installed on the baffle, and the other end is passed through the knife cover. The protrusion is used to drive the baffle to slide.

7. The semiconductor wafer cutting device according to claim 1, wherein: The cutting assembly also includes a lifting power element, which is installed on the horizontal plate and is used to drive the lifting plate to slide; the cutting assembly also includes a cutting power element, a driving wheel, a driven wheel and a synchronous belt, the cutting power element is installed on the lifting plate, the driving wheel is installed on the output end of the cutting power element, the driven wheel is installed on the cutter shaft of the cutter, one end of the synchronous belt is connected to the driving wheel, and the other end is connected to the driven wheel.

8. The semiconductor wafer cutting device according to claim 1, wherein: It also includes a sharpening assembly, which includes a base plate, a slider, a sharpening wheel and a sliding power element. There are two base plates, two sliders, two sharpening wheels and two sliding power elements, and they correspond one to one. The two base plates are respectively installed on both sides of the lifting plate, the slider is slid on the base plate, the sharpening wheel is installed on the slider, and the sliding power element is used to drive the slider to slide. The two sharpening wheels correspond to both sides of the cutter.

9. The semiconductor wafer cutting device according to claim 8, wherein: The grinding wheel comprises a ceramic bond, a resin bond and an abrasive, and the abrasive is silicon carbide or corundum.

10. The semiconductor wafer cutting device according to claim 1, wherein: The suction cup is a microporous ceramic suction cup.

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