High-precision chip arrangement equipment capable of preventing chips from being broken

Abstract

The invention discloses high-precision chip arrangement equipment capable of preventing chips from being broken. The high-precision chip arrangement equipment comprises a rack; the carrying disc conveying line comprises a stripping frame and an equidistant pushing mechanism; the first chip supply module comprises a first chip feeding mechanism and a first swaying tray mechanism; the second chip supply module is arranged on the other side, opposite to the first chip supply module, of the carrying disc conveying line; the chip transfer mechanical arm is used for placing the chips in the first chip supply module and the second chip supply module in the empty carrying disc at the transfer positioning groove; the carrying disc feeding module comprises a first carrying disc feeding mechanism and a first carrying disc transferring mechanical arm; and the carrying disc receiving module is arranged at the other end, opposite to the carrying disc feeding module, of the carrying disc conveying line. Compared with the prior art, the problems that the ultrathin fragile chips are easy to damage and the arrangement efficiency is low in the process of arranging the ultrathin fragile chips on the carrying disc are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip arrangement, and in particular to a high-precision chip arrangement device that prevents chips from being broken. Background Art

[0002] During chip production and transportation, the chips need to be arranged on a carrier according to production requirements to facilitate subsequent material collection and processing by a robot.

[0003] It is difficult to arrange ultra-thin and fragile chips, and the chips are prone to breakage during the arrangement process, which not only causes material cost losses and a large number of unqualified chips on the carrier, but also leads to low efficiency and yield rate in subsequent processing. Summary of the invention

[0004] The purpose of the present invention is to provide a high-precision chip arrangement device that prevents chips from breaking, so as to solve the problem that ultra-thin and fragile chips are easily broken and have low arrangement efficiency during arrangement on a carrier.

[0005] In order to achieve the above object, the present invention adopts the following technical solution: a high-precision chip arrangement device for preventing chip breakage, comprising:

[0006] frame;

[0007] A tray conveyor line, comprising a stripper rack and an equidistant pushing mechanism, wherein the stripper rack comprises a feed positioning groove, a transfer positioning groove and a receiving positioning groove which are equidistantly arranged along a straight line, and the equidistant pushing mechanism comprises a conveying shaft, a first mounting seat and a first adsorption unit, wherein the first mounting seat is fixedly mounted on a slider of the conveying shaft, and the first mounting seat is provided with two first adsorption units arranged in parallel, wherein the spacing between the two first adsorption units is equal to the spacing between the feed positioning groove and the transfer positioning groove, and the first adsorption unit comprises a first lifting cylinder, a first support plate and a first suction cup, wherein the first support plate is fixedly mounted on a piston of the first lifting cylinder, and the first suction cup is penetrated through the first support plate;

[0008] A first chip supply module, comprising a first chip feeding mechanism and a first shaking plate mechanism, wherein the first chip feeding mechanism is used to feed the chips to the first shaking plate mechanism, and the first shaking plate mechanism is used to oscillate and arrange the chips into the positioning pits of the arrangement plate;

[0009] A second chip supply module is disposed on the other side of the tray conveying line opposite to the first chip supply module;

[0010] A chip transfer robot arm is used to place the chips in the first chip supply module and the second chip supply module into the empty carrier at the transfer positioning groove;

[0011] A tray loading module, comprising a first tray loading mechanism and a first tray transfer mechanical arm, wherein the first tray loading mechanism is used to store empty trays, and the first tray transfer mechanical arm is used to transport the empty trays to the feed positioning slot;

[0012] The tray receiving module is arranged at the other end of the tray conveying line opposite to the tray loading module.

[0013] As a further description of the above technical solution:

[0014] A hood is provided on the frame.

[0015] As a further description of the above technical solution:

[0016] A secondary positioning unit is arranged on the stripping frame. The secondary positioning unit comprises a first linear slide rail and a first positioning plate. The first positioning plate is slidably connected to the first linear slide rail.

[0017] As a further description of the above technical solution:

[0018] The first rocking plate mechanism also includes an oscillation seat, an oscillation platform, a screw driver, an inclination control rod, a vibration plate and a rocking plate clip. The oscillation platform is rotatably mounted on the oscillation seat. An oscillation motor is arranged under the oscillation platform. A cam is connected to the output shaft of the oscillation motor. The inclination control rod is fixedly mounted on the lifting block of the screw driver. The inclination control rod is provided with a roller. The roller is slidably connected to the oscillation platform. The vibration plate is mounted on the oscillation platform. The arrangement plate is fixedly mounted on the vibration plate. Two rocking plate clips are symmetrically arranged at both ends of the arrangement plate.

[0019] As a further description of the above technical solution:

[0020] The first chip feeding mechanism includes a first feeding seat, a first feeding platform, a first feeding track and a first feeding hopper. The first feeding platform is slidably connected to the first feeding seat. The first feeding platform is provided with a first feeding track. One end of the first feeding track extends above the arrangement disk. The first feeding hopper is provided above the first feeding track.

[0021] As a further description of the above technical solution:

[0022] The first feeding platform is also provided with an extension cylinder, and the output end of the extension cylinder is connected to the tray.

[0023] As a further description of the above technical solution:

[0024] An adsorption plate is arranged on the chip transfer robot arm, and a plurality of adsorption columns arranged in an array are arranged on the adsorption plate, and adsorption holes are arranged at the bottom of the adsorption columns.

[0025] As a further description of the above technical solution:

[0026] The first tray loading mechanism includes a loading rack, a loading transfer shaft, a tray loading platform and a tray clip. The tray loading platform is slidably connected to the loading rack. The loading transfer shaft is used to drive the tray loading platform to slide. Two parallel tray clips are arranged on the tray loading platform.

[0027] As a further description of the above technical solution:

[0028] The first tray transfer robot includes a first Y-axis mover and a first Z-axis mover.

[0029] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0030] 1. The present invention is suitable for a variety of ultra-thin and fragile chips, and the chips can be arranged in a carrier according to production requirements. The operation is simple, the chip breakage is prevented, the arrangement accuracy is high, the degree of automation is high, the arrangement efficiency is high, the labor cost is saved, and the production efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 A schematic diagram of the structure of a high-precision chip arrangement device that prevents chips from breaking. Figure 1 .

[0033] Figure 2 A schematic diagram of the structure of a high-precision chip arrangement device that prevents chips from breaking. Figure 2 .

[0034] Figure 3 A schematic diagram of the structure of a tray conveyor line in a high-precision chip arrangement device that prevents chip breakage Figure 1 .

[0035] Figure 4 A schematic diagram of the structure of a tray conveyor line in a high-precision chip arrangement device that prevents chip breakage Figure 1 .

[0036] Figure 5 A schematic diagram of the structure of a tray conveyor line in a high-precision chip arrangement device that prevents chip breakage Figure 3 .

[0037] Figure 6The present invention is a schematic structural diagram of a first chip feeding mechanism in a high-precision chip arrangement device for preventing chip breakage.

[0038] Figure 7 A schematic diagram of the structure of the first rocking plate mechanism in a high-precision chip arrangement device to prevent chip breakage Figure 1 .

[0039] Figure 8 A schematic diagram of the structure of the first rocking plate mechanism in a high-precision chip arrangement device to prevent chip breakage Figure 2 .

[0040] Fig. 9 A schematic diagram of the structure of the first rocking plate mechanism in a high-precision chip arrangement device to prevent chip breakage Figure 3 .

[0041] Fig.10 A schematic diagram of the structure of a chip transfer robot arm in a high-precision chip arrangement device for preventing chip breakage.

[0042] Fig.11 The present invention is a schematic structural diagram of a first tray loading mechanism in a high-precision chip arrangement device for preventing chip breakage.

[0043] Fig.12 The present invention is a schematic diagram of the structure of a first carrier transfer mechanical arm in a high-precision chip arrangement device for preventing chip breakage.

[0044] Legend:

[0045] 1. Frame; 11. Hood;

[0046] 2. Stripping rack; 21. Feeding positioning slot; 22. Transfer positioning slot; 23. Receiving positioning slot; 24. Secondary positioning unit; 241. First linear guide rail; 242. First positioning plate;

[0047] 3. Equidistant push mechanism; 31. Transmission shaft; 32. First mounting seat; 33. First lifting cylinder; 34. First support plate; 35. First suction cup;

[0048] 4. First chip feeding mechanism; 41. First feeding seat; 42. First feeding platform; 43. First feeding track; 44. First feeding hopper;

[0049] 5. First rocking plate mechanism; 51. Arrangement plate; 52. Oscillation seat; 53. Oscillation platform; 531. Oscillation motor; 532. Cam; 54. Screw driver; 55. Tilt control lever; 551. Roller; 56. Vibration plate; 57. Rocking plate clip;

[0050] 6. Chip transfer robot; 61. Adsorption plate; 611. Adsorption column;

[0051] 7. Carrier loading module; 71. First carrier loading mechanism; 711. Loading rack; 712. Loading and transferring shaft; 713. Carrier loading platform; 714. Carrier clip; 72. First carrier transfer robot; 721. First Y-axis mover; 722. First Z-axis mover;

[0052] 8. Carrier tray receiving module; 9. Carrier tray. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0054] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0055] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0056] In the description of the embodiments of the present invention, it should be noted that the terms "upper", "inner", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are directions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0057] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] Example 1

[0059] See also Figure 1-12The present invention provides a technical solution: a high-precision chip arrangement device for preventing chip breakage, comprising:

[0060] Rack 1;

[0061] The tray conveyor line includes a stripper frame 2 and an equidistant pushing mechanism 3. The stripper frame 2 includes a feed positioning groove 21, a transfer positioning groove 22 and a receiving positioning groove 23 which are equidistantly arranged along a straight line. The equidistant pushing mechanism 3 includes a conveying shaft 31, a first mounting seat 32 and a first adsorption unit. The first mounting seat 32 is fixedly mounted on a slider of the conveying shaft 31. The first mounting seat 32 is provided with two first adsorption units arranged in parallel. The spacing between the two first adsorption units is equal to the spacing between the feed positioning groove 21 and the transfer positioning groove 22. The first adsorption unit includes a first lifting cylinder 33, a first support plate 34 and a first suction cup 35. The first support plate 34 is fixedly mounted on the piston of the first lifting cylinder 33. The first suction cup 35 is penetrated by the first support plate 34.

[0062] A first chip supply module, comprising a first chip feeding mechanism 4 and a first shaking plate mechanism 5, wherein the first chip feeding mechanism 4 is used to feed the chips to the first shaking plate mechanism 5, and the first shaking plate mechanism 5 is used to oscillate and arrange the chips into the positioning pits of the arrangement plate 51;

[0063] A second chip supply module is disposed on the other side of the tray conveying line opposite to the first chip supply module;

[0064] A chip transfer robot 6 is used to place the chips in the first chip supply module and the second chip supply module into the empty carrier 9 at the transfer positioning groove 22;

[0065] The tray loading module 7 includes a first tray loading mechanism 71 and a first tray transfer mechanical arm 72. The first tray loading mechanism 71 is used to store empty trays 9. The first tray transfer mechanical arm 72 is used to transport the empty trays 9 to the feed positioning slot 21.

[0066] The tray receiving module 8 is disposed at the other end of the tray conveying line opposite to the tray loading module 7 .

[0067] The tray conveyor line realizes the equidistant lifting and lowering transfer of the tray 9 between the workstations, improves the transfer efficiency of the tray 9, and improves the chip arrangement efficiency. The empty tray 9 is first placed in the feed positioning slot 21 of the stripper rack 2 in the tray conveyor line, and then the two first adsorption units in the equidistant pushing mechanism 3 simultaneously adsorb the empty tray 9 at the feed positioning slot 21 and the tray 9 filled with chips at the transfer positioning slot 22, and then the first lifting cylinder 33 of the first adsorption unit lifts the first support plate 34, and the first mounting seat 32 drives the two first adsorption units to move synchronously through the transmission shaft 31, and after moving to the empty tray 9 aligning with the transfer positioning slot 22 and the tray 9 filled with chips aligning with the receiving positioning slot 23, the first support plates 34 of the two first adsorption units descend and put the two trays 9 in, and the equidistant pushing mechanism 3 is reset, so that chips can be loaded into the empty tray 9 at the transfer positioning slot 22, and the receiving of the tray 9 filled with chips can be realized.

[0068] The number of the first suction cups 35 on the first supporting plate 34 is determined according to the size of the carrier plate. As shown in the figure, four first suction cups 35 are arranged on one first supporting plate 34 .

[0069] The structure and working principle of the tray receiving module 8 are the same as those of the tray loading module 7, except that the tray receiving module 8 is used to receive the tray 9 filled with chips. The tray 9 filled with chips is loaded into the receiving tray clip from the receiving positioning slot 23 of the tray conveyor line. When the full clip in the tray receiving module 8 is removed, the mechanism will send a beep message to let the operator take away the full clip, and put an empty clip while taking away the full clip, so that the material receiving can be achieved without stopping the machine, thereby improving production efficiency.

[0070] A cover 11 is provided on the frame 1 to effectively prevent dust from contaminating the chips.

[0071] The stripping rack 2 is provided with a secondary positioning unit 24, which includes a first linear slide 241 and a first positioning plate 242, and the first positioning plate 242 is slidably connected to the first linear slide 241. A side wall of the transfer positioning groove 22 uses a movable first positioning plate 242 as a side wall, so that after the empty carrier 9 is placed in the transfer positioning groove 22, the first positioning plate 242 clamps and positions the carrier 9 under the drive of the first linear slide 241, and can accurately and repeatedly position the carrier 9 in a fixed position, so that the chips can be accurately arranged in the position cavity corresponding to the carrier 9.

[0072] The first rocking plate mechanism 5 also includes an oscillation seat 52, an oscillation platform 53, a screw driver 54, an inclination control rod 55, a vibration plate 56 and a rocking plate clip 57. The oscillation platform 53 is rotatably mounted on the oscillation seat 52. An oscillation motor 531 is arranged below the oscillation platform 53. A cam 532 is connected to the output shaft of the oscillation motor 531. The inclination control rod 55 is fixedly mounted on the lifting block of the screw driver 54. The inclination control rod 55 is provided with a roller 551. The roller 551 is slidably connected to the oscillation platform 53. The vibration plate 56 is mounted on the oscillation platform 53. The arrangement plate 51 is fixedly mounted on the vibration plate 56. Two rocking plate clips 57 are symmetrically arranged at both ends of the arrangement plate 51.

[0073] The positioning pits of the arrangement plate 51 correspond to the hole positions of the carrier plate 9 one by one, and the size of the rocker clip 57 is determined according to the corresponding size of the arrangement plate 51 and the number of chips to be arranged.

[0074] When the first shaking plate mechanism 5 is working, the chips are dumped into the arrangement plate 51. The oscillation motor 531 drives the cam 532 to rotate, and the screw driver 54 drives the tilt control rod 55 to move up and down, so that the oscillation platform 53 is constantly oscillating and the angle changes, so that the arrangement plate 51 performs high-speed and gentle oscillation motion on the oscillation platform 53. During the oscillation motion, the chips automatically enter the corresponding pits on the arrangement plate 51. Each pit on the arrangement plate 51 is made to accommodate only one chip, so that the chips are quickly arranged in all the pits in the arrangement plate 51.

[0075] When all the pits of the arrangement plate 51 are filled with chips, the oscillation platform 53 is tilted at a certain angle through the tilt control rod 55, so that the excess chips fall into the shaking plate clip 57, and then the oscillation platform 53 is laid flat, and finally the chip transfer robot 6 absorbs the chips.

[0076] The first chip feeding mechanism 4 includes a first feeding seat 41, a first feeding platform 42, a first feeding rail 43 and a first feeding hopper 44. The first feeding platform 42 is slidably connected to the first feeding seat 41. The first feeding platform 42 is provided with a first feeding rail 43. One end of the first feeding rail 43 extends to above the arrangement disk 51. The first feeding hopper 44 is provided above the first feeding rail 43.

[0077] Since the chips are constantly being arranged and consumed, when the control mechanism confirms that chips need to be added, the first feeding platform 42 in the first chip feeding mechanism 4, driven by the synchronous belt driving mechanism shown in the figure, slides on the first feeding seat 41 toward the arranging disk 51, so that the bottom discharge port of the first feeding track 43 is located above the arranging disk 51 and contacts the arranging disk 51, so that the chip slides into the shaking disk under the action of the first shaking disk mechanism 5, and returns after adding appropriate chips.

[0078] The chip transfer robot 6 is provided with an adsorption plate 61, on which are provided a plurality of adsorption columns 611 arranged in an array, and adsorption holes are provided at the bottom of the adsorption columns 611. The adsorption plate 61 is connected to an air pipe, which is connected to a vacuum pumping device, and the adsorption holes of the adsorption columns 61 are connected to the cavity of the adsorption plate 61.

[0079] When the chips in the arrangement plate 51 need to be adsorbed, the adsorption plate 61 is evacuated through the air pipe, and a plurality of adsorption columns 611 simultaneously adsorb all the chips.

[0080] The chip transfer robot 6 is a three-axis transfer robot. The adsorption plate 61 realizes X / Y / Z movement through a three-axis manipulator to place the adsorbed chip in the corresponding hole cavity of the empty plate 9.

[0081] The first tray loading mechanism 71 includes a loading frame 711, a loading and transferring shaft 712, a tray loading platform 713 and a tray clip 714. The tray loading platform 713 is slidably connected to the loading frame 711. The loading and transferring shaft 712 is used to drive the tray loading platform 713 to slide. Two parallel tray clips 714 are arranged on the tray loading platform 713.

[0082] When loading the tray 9, the tray 9 is manually placed in the tray clip 714, and the tray clip 714 is placed in the corresponding position on the tray loading platform 713. The loading and transferring shaft 712 switches different tray clips 714 and moves them under the first tray transfer robot arm 72.

[0083] After the first tray transfer robot 72 obtains the material information, the program is used to make the first tray transfer robot 72 move in the Y-axis and Z-axis, and move the empty tray 9 to the feeding station on the tray conveyor line through suction by the suction cup.

[0084] When the robot arm has sucked the tray 9 in the tray clip 714, the loading and transferring shaft 712 moves the empty clip out and moves another full tray clip 714 in at the same time.

[0085] After the empty magazine is removed, the mechanism will send out a beeping signal, allowing people to manually remove the empty magazine and add a full magazine at the same time. This ensures that material loading does not stop and improves production efficiency.

[0086] The first carrier transfer mechanical arm 72 includes a first Y-axis mover 721 and a first Z-axis mover 722. The mechanical arm can transfer the carrier 9 by sucking the empty carrier 9 through the suction cup to realize Y-axis and Z-axis movement.

[0087] Working principle: This mechanism is suitable for a variety of ultra-thin and fragile chips, and can arrange the chips on the carrier according to production requirements. It is simple to operate and prevents chips from breaking. It has high arrangement accuracy, high degree of automation, high arrangement efficiency, saves labor costs, and improves production efficiency.

[0088] The device has two sets of chip arranging and feeding mechanisms, namely the first chip supply module and the second chip supply module, which are respectively installed on the left and right sides of the transfer station in the carrier conveyor line. When the chip transfer robot 6 arranges the chips in the tray 51 in the transfer of the left chip supply module, the right arrangement tray 51 is arranging; when arranging the chips in the tray 51 in the transfer of the right chip supply module, the left arrangement tray 51 is arranging. In this way, efficient operation without stopping is achieved, and the production efficiency is doubled.

[0089] Example 2

[0090] This embodiment further provides the following improved technical solution based on the above embodiment: an extension cylinder 45 is further provided on the first feeding platform 42 , and the output end of the extension cylinder 45 is connected to a tray 451 .

[0091] Under normal conditions, in order to prevent the chips on the first feeding track 43 from leaking, the cylinder 45 is extended to drive the tray 451 to move below the discharge port at the bottom of the first feeding track 43, and the tray 451 receives the chips. When the arrangement plate 51 is feeding, the tray 451 is controlled to retract.

[0092] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A high-precision chip arrangement device for preventing chip breakage, characterized in that: include: frame; A tray conveyor line, comprising a stripper rack and an equidistant pushing mechanism, wherein the stripper rack comprises a feed positioning groove, a transfer positioning groove and a receiving positioning groove equidistantly arranged along a straight line, and the equidistant pushing mechanism comprises a conveying shaft, a first mounting seat and a first adsorption unit, wherein the first mounting seat is fixedly mounted on a slider of the conveying shaft, and the first mounting seat is provided with two first adsorption units arranged in parallel, and the spacing between the two first adsorption units is equal to the spacing between the feed positioning groove and the transfer positioning groove, and the first adsorption unit comprises a first lifting cylinder, a first support plate and a first suction cup, wherein the first support plate is fixedly mounted on a piston of the first lifting cylinder, and the first suction cup is penetrated through the first support plate; A first chip supply module, comprising a first chip feeding mechanism and a first shaking plate mechanism, wherein the first chip feeding mechanism is used to feed chips to the first shaking plate mechanism, and the first shaking plate mechanism is used to oscillate and arrange the chips into the positioning pits of the arrangement plate; A second chip supply module, which is disposed on the other side of the tray conveying line opposite to the first chip supply module; A chip transfer robot arm is used to place the chips in the first chip supply module and the second chip supply module into the empty carrier at the transfer positioning groove; A tray loading module, comprising a first tray loading mechanism and a first tray transfer mechanical arm, wherein the first tray loading mechanism is used to store empty trays, and the first tray transfer mechanical arm is used to transport the empty trays to the feed positioning slot; The tray receiving module is arranged at the other end of the tray conveying line opposite to the tray loading module.

2. The high-precision chip arrangement device for preventing chip breakage according to claim 1, characterized in that: A cover is arranged on the frame.

3. The high-precision chip arrangement device for preventing chip breakage according to claim 1, characterized in that: The stripping frame is provided with a secondary positioning unit, and the secondary positioning unit comprises a first linear slide rail and a first positioning plate, and the first positioning plate is slidably connected to the first linear slide rail.

4. The high-precision chip arrangement device for preventing chip breakage according to claim 1, characterized in that: The first rocking plate mechanism also includes an oscillation seat, an oscillation platform, a screw drive, an inclination control rod, a vibration plate and a rocking plate clip. The oscillation platform is rotatably mounted on the oscillation seat. An oscillation motor is arranged under the oscillation platform. A cam is connected to the output shaft of the oscillation motor. The inclination control rod is fixedly mounted on the lifting block of the screw drive. The inclination control rod is provided with a roller, and the roller is slidably connected to the oscillation platform. The vibration plate is mounted on the oscillation platform. The arrangement plate is fixedly mounted on the vibration plate. Two rocking plate clips are symmetrically arranged at both ends of the arrangement plate.

5. The high-precision chip arrangement device for preventing chip breakage according to claim 1, characterized in that: The first chip feeding mechanism includes a first feeding seat, a first feeding platform, a first feeding track and a first feeding hopper. The first feeding platform is slidably connected to the first feeding seat. The first feeding track is arranged on the first feeding platform. One end of the first feeding track extends above the arrangement disk. The first feeding hopper is arranged above the first feeding track.

6. The high-precision chip arrangement device for preventing chip breakage according to claim 5, characterized in that: The first feeding platform is also provided with an extension cylinder, and the output end of the extension cylinder is connected to the tray.

7. The high-precision chip arrangement device for preventing chip breakage according to claim 1, characterized in that: The chip transfer robot arm is provided with an adsorption plate, and a plurality of adsorption columns arranged in an array are provided on the adsorption plate, and adsorption holes are provided at the bottom of the adsorption columns.

8. The high-precision chip arrangement device for preventing chip breakage according to claim 1, characterized in that: The first tray loading mechanism includes a loading rack, a loading and transferring shaft, a tray loading platform and a tray clip. The tray loading platform is slidably connected to the loading rack. The loading and transferring shaft is used to drive the tray loading platform to slide. Two parallel tray clips are arranged on the tray loading platform.

9. The high-precision chip arrangement device for preventing chip breakage according to claim 1, characterized in that: The first carrier transfer robot includes a first Y-axis mover and a first Z-axis mover.

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