Hot-melt pressure-sensitive adhesive for packaging bag and preparation method of hot-melt pressure-sensitive adhesive

By preparing a specific proportion of hot melt pressure-sensitive adhesive, the existing hot melt pressure-sensitive adhesive has solved the problem of small peeling force and poor high temperature resistance in high temperature environments, and has achieved high bonding strength and good high temperature resistance, and can withstand greater expansion pressure.

CN119799226APending Publication Date: 2025-04-11SHANGHAI YONGGUAN ADHESIVE PROD CORP LTD
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Patent Information

Application Number
CN202411960008.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-30
Publication Date
2025-04-11

AI Technical Summary

Technical Problem

When used at 60-80℃, the existing hot melt pressure-sensitive adhesive has a small peeling force and poor high temperature resistance, and cannot withstand expansion pressures of more than 20 kg.

Method used

By preparing a hot melt pressure-sensitive adhesive prepared by polymerization of plasticizer, APAO, tackifying resin, sarso wax and antioxidant, the specific ratio is 5 to 10 parts of plasticizer, 25 to 45 parts of APAO, 40 to 60 parts of tackifying resin, 3 to 8 parts of sarso wax, and 0.2 to 0.6 parts of antioxidant.

Benefits of technology

The hot melt pressure sensitive adhesive has high bonding strength and good high temperature resistance, can withstand greater expansion pressure in high temperature environments, and has low odor and low VOC.

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Abstract

The invention discloses a hot-melt pressure-sensitive adhesive for a packaging bag and a preparation method of the hot-melt pressure-sensitive adhesive. The hot-melt pressure-sensitive adhesive is prepared from the following components in parts by weight through a polymerization reaction: 5-10 parts of a plasticizer; 25 to 45 parts of APAO; 40 to 60 parts of tackifying resin; 3 to 8 parts of sasol wax; the hot-melt pressure-sensitive adhesive provided by the invention has the characteristics of high bonding strength and good high temperature resistance.
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Description

Technical Field

[0001] The invention relates to a hot melt pressure-sensitive adhesive for packaging bags and a preparation method thereof, belonging to the field of hot melt adhesives. Background Art

[0002] In the related technology, the outer packaging of the product needs to be coated with environmentally friendly hot-melt pressure-sensitive adhesive to serve as a seal. The packaging bag needs to be used at 60-80°C, and the sealing part needs to withstand an expansion pressure of more than 20 kilograms. In addition, environmentally friendly materials are required to be coated with environmentally friendly hot-melt pressure-sensitive adhesive. The above-mentioned traditional hot-melt pressure-sensitive adhesive has a small peeling force and poor high temperature resistance, and cannot withstand an expansion pressure of more than 20 kilograms. Summary of the invention

[0003] The object of the present invention is to provide a hot melt pressure sensitive adhesive for packaging bags and a preparation method thereof, so that the hot melt pressure sensitive adhesive has the characteristics of high bonding strength and good high temperature resistance.

[0004] To achieve the above object, the present invention adopts the following technical solution:

[0005] A hot melt pressure-sensitive adhesive for packaging bags, the hot melt pressure-sensitive adhesive is prepared by polymerization reaction of the following components in parts by weight:

[0006] Plasticizer: 5-10 parts;

[0007] APAO: 25-45 parts;

[0008] Tackifying resin: 40-60 parts;

[0009] Sasol wax: 3-8 parts;

[0010] Antioxidant: 0.2-0.6 parts.

[0011] As a further improved technical solution of the present invention, the plasticizer is cyclohexane oil.

[0012] As a further improved technical solution of the present invention, the APAO is composed of a compound of high ethylene and a homopolymer.

[0013] As a further improved technical solution of the present invention, the mass mixing ratio of high ethylene to homopolymer is 5:4.

[0014] As a further improved technical solution of the present invention, the tackifying resin is C9 petroleum resin.

[0015] As a further improved technical solution of the present invention, the antioxidant is a hindered phenol antioxidant.

[0016] To achieve the above object, the present invention also adopts the following technical solution: a method for preparing a hot melt pressure-sensitive adhesive for packaging bags, comprising the following steps:

[0017] Step 1: Add plasticizer, sasol wax and antioxidant in parts by weight into the experimental device; introduce nitrogen to remove air from the device while stirring, add tackifying resin, and react at 60-70°C for 3 hours;

[0018] Step 2: Add APAO, control the temperature at 70-80°C, and react for 2 hours;

[0019] Step 3: Vacuum and hydraulically discharge the material, and cool it down to obtain the finished product.

[0020] As a further improved technical solution of the present invention, in step one, the temperature is controlled at 65°C, and in step two, the temperature is controlled at 74°C.

[0021] Compared with the prior art, the beneficial effect of the present invention is that by adding APAO, the hot melt pressure-sensitive adhesive has high bonding strength, good high temperature resistance, low odor and low VOC, which is beneficial for the PE packaging bag to withstand greater expansion pressure when the loaded object is in a high temperature environment. DETAILED DESCRIPTION

[0022] The following is a detailed description of exemplary embodiments of the present invention. If there are several embodiments, the features of these embodiments can be combined with each other without conflict. The contents described in the following exemplary embodiments do not represent all embodiments consistent with the present invention; instead, they are only examples of devices, products and / or methods consistent with some aspects of the present invention as recorded in the claims of the present invention.

[0023] The terms used in the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the scope of protection of the present invention. The singular forms "a", "said" or "the" used in the specification and claims of the present invention are also intended to include plural forms, unless the context clearly indicates other meanings.

[0024] It should be understood that the words used in the specification and claims of the present invention, such as "first", "second" and similar words, do not indicate any order, quantity or importance, but are only used to distinguish the names of features. Similarly, words such as "one" or "an" do not indicate a quantitative limitation, but indicate the existence of at least one. Unless otherwise specified, words such as "front", "rear", "upper", "lower" and similar words appearing in the present invention are only for the convenience of explanation and are not limited to a specific position or a spatial orientation. Words such as "include" or "comprise" are an open-ended expression, meaning that the elements appearing before "include" or "comprise" include the elements appearing after "include" or "comprise" and their equivalents, which does not exclude that the elements appearing before "include" or "comprise" may also include other elements. If "several" appears in the present invention, it means two or more.

[0025] The present invention discloses a hot melt pressure-sensitive adhesive for packaging bags, wherein the hot melt pressure-sensitive adhesive is prepared by polymerization of the following components in parts by weight:

[0026] Plasticizer: 5-10 parts;

[0027] APAO: 25-45 parts;

[0028] Tackifying resin: 40-60 parts;

[0029] Sasol wax: 3-8 parts;

[0030] Antioxidant: 0.2-0.6 parts.

[0031] The hot-melt pressure-sensitive adhesive prepared in this way has the characteristics of high bonding strength, good high temperature resistance, low odor and low VOC (volatile organic compounds), which is beneficial for PE (polyethylene) packaging bags to withstand greater expansion pressure when the loaded objects are in a high temperature environment.

[0032] In some embodiments, the plasticizer is cyclohexane oil, and the model of the cyclohexane oil is Karamay 4010.

[0033] In some embodiments, the APAO is composed of a high ethylene and homopolymer compound, and the mass mixing ratio of the high ethylene and homopolymer is 5:4, or 1:1, or 4:5. Since the high ethylene and homopolymer are mixed in a specific ratio as APAO, when the loaded object is in a high temperature environment, it withstands greater expansion pressure.

[0034] In some embodiments, the tackifying resin is a carbon nine petroleum resin.

[0035] In some embodiments, the antioxidant is a hindered phenolic antioxidant.

[0036] The present invention also relates to a method for preparing a hot melt pressure sensitive adhesive for a packaging bag, comprising the following steps:

[0037] Step 1: Add plasticizer, sasol wax and antioxidant in parts by weight into the experimental device; introduce nitrogen to remove air from the device while stirring, add tackifying resin, and react at 60-70°C for 3 hours;

[0038] Step 2: Add APAO, control the temperature at 70-80°C, and react for 2 hours;

[0039] Step 3: Vacuum and hydraulically discharge the material, and cool it down to obtain the finished product.

[0040] Embodiment 1

[0041] Add 9.4 parts by weight of plasticizer, 8 parts by weight of Sasol wax, and 0.6 parts by weight of antioxidant to the experimental device. Under stirring, introduce nitrogen to remove the air in the device, add 40 parts by weight of tackifying resin, and react at about 65°C for 3 hours; add 42 parts by weight of APAO, the mass mixing ratio of high ethylene to homopolymer is 5:4, control the temperature at 74°C, and react for 2 hours. Vacuum hydraulic discharge, cool down to obtain the finished product.

[0042] Embodiment 2

[0043] 8.6 parts by weight of plasticizer, 5 parts by weight of Sasol wax, and 0.4 parts by weight of antioxidant were added to the experimental device. Under stirring, nitrogen was introduced to remove the air in the device, 60 parts by weight of tackifying resin was added, and the reaction was carried out at about 65°C for 3 hours; 26 parts by weight of APAO was added, and the mass mixing ratio of high ethylene to homopolymer was 5:4, the temperature was controlled at 74°C, and the reaction was carried out for 2 hours. The material was discharged by vacuum hydraulic pressure, and the finished product was obtained by cooling.

[0044] Embodiment 3

[0045] 8.6 parts by weight of plasticizer, 5 parts by weight of Sasol wax, and 0.4 parts by weight of antioxidant were added to the experimental device. Under stirring, nitrogen was introduced to remove the air in the device, 50 parts by weight of tackifying resin was added, and the reaction was carried out at about 65°C for 3 hours; 36 parts by weight of APAO was added, and the mass mixing ratio of high ethylene to homopolymer was 5:4, and the temperature was controlled at 74°C for 2 hours. The material was discharged by vacuum hydraulic pressure, and the finished product was obtained by cooling.

[0046] Embodiment 4

[0047] Add 5 parts by weight of plasticizer, 3.6 parts by weight of Sasol wax, and 0.4 parts by weight of antioxidant to the experimental device. Under stirring, introduce nitrogen to remove the air in the device, add 51 parts by weight of tackifying resin, and react at about 65°C for 3 hours; add 40 parts by weight of APAO, the mass mixing ratio of high ethylene to homopolymer is 4:3, control the temperature at 74°C, and react for 2 hours. Vacuum hydraulic discharge, cool down to obtain the finished product.

[0048] Embodiment 5

[0049] 8.4 parts by weight of plasticizer, 5 parts by weight of Sasol wax, and 0.4 parts by weight of antioxidant were added to the experimental device. Under stirring, nitrogen was introduced to remove the air in the device, 50 parts by weight of tackifying resin was added, and the reaction was carried out at about 65°C for 3 hours; 36 parts by weight of APAO was added, and the mass mixing ratio of high ethylene to homopolymer was 4:3, and the temperature was controlled at 74°C for 2 hours. The material was discharged by vacuum hydraulic pressure, and the finished product was obtained by cooling.

[0050] Embodiment 6

[0051] 8.6 parts by weight of plasticizer, 8 parts by weight of Sasol wax, and 0.4 parts by weight of antioxidant were added to the experimental device. Under stirring, nitrogen was introduced to remove the air in the device, 43 parts by weight of tackifying resin was added, and the reaction was carried out at about 65°C for 3 hours; 40 parts by weight of APAO was added, and the mass mixing ratio of high ethylene to homopolymer was 4:3, and the temperature was controlled at 74°C for 2 hours. The material was discharged by vacuum hydraulic pressure, and the finished product was obtained by cooling.

[0052] Comparative Example 1

[0053] 15.6 parts by weight of plasticizer and 0.4 parts by weight of antioxidant were added to the experimental device. Under stirring, nitrogen was introduced to remove the air in the device, 54 parts by weight of tackifying resin was added, and the reaction was carried out at about 65°C for 3 hours; 30 parts by weight of APAO was added, and the mass mixing ratio of high ethylene and homopolymer was 1:1, and the temperature was controlled at 74°C, and the reaction was carried out for 2 hours. The material was discharged by vacuum hydraulic pressure, and the temperature was cooled to obtain the finished product. No sasol wax was added in this comparative example.

[0054] Comparative Example 2

[0055] 8.6 parts by weight of plasticizer, 5 parts by weight of Sasol wax, and 0.4 parts by weight of antioxidant were added to the experimental device. Under stirring, nitrogen was introduced to remove the air in the device, 50 parts by weight of tackifying resin was added, and the reaction was carried out at about 65°C for 3 hours; 36 parts by weight of APAO was added, and the mass mixing ratio of high ethylene to homopolymer was 1:1, and the temperature was controlled at 74°C, and the reaction was carried out for 2 hours. The material was discharged by vacuum hydraulic pressure, and the temperature was cooled to obtain the finished product.

[0056] Comparative Example 3

[0057] 8.4 parts by weight of plasticizer, 5 parts by weight of Sasol wax, and 0.6 parts by weight of antioxidant were added to the experimental device. Under stirring, nitrogen was introduced to remove the air in the device, 43 parts by weight of tackifying resin was added, and the reaction was carried out at about 65°C for 3 hours; 40 parts by weight of APAO was added, and the mass mixing ratio of high ethylene to homopolymer was 4:5, and the temperature was controlled at 74°C for 2 hours. The material was discharged by vacuum hydraulic pressure, and the finished product was obtained by cooling.

[0058] The hot melt pressure sensitive adhesives prepared in Example 1 6 and Comparative Example 1 3 were subjected to high temperature resistance test and peeling force test. The glue was melted by coating equipment and then coated (100g / ㎡) on a PE packaging bag, and then pressurized and compounded by rollers to prepare test samples. After the samples were placed at a set temperature of 60°C and 80°C for 60 minutes, the corresponding peeling force test was performed.

[0059] Table 1 Detection performance of different embodiments Table 1

[0060]

[0061] The above implementation modes are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. The understanding of the present invention should be based on the technical personnel in the relevant technical field. Although the present invention has been described in detail in this specification with reference to the above implementation modes, the ordinary technical personnel in the field should understand that the technical personnel in the relevant technical field can still modify or replace the present invention with equivalents, and all technical solutions and improvements thereof that do not depart from the spirit and scope of the present invention should be covered within the scope of the claims of the present invention.

Claims

1. A hot melt pressure-sensitive adhesive for packaging bags, characterized in that: The hot melt pressure sensitive adhesive is prepared by polymerization of the following components in parts by weight: Plasticizer: 5-10 parts; APAO: 25-45 parts; Tackifying resin: 40-60 parts; Sasol wax: 3-8 parts; Antioxidant: 0.2-0.6 parts.

2. The hot melt pressure sensitive adhesive for packaging bags according to claim 1, characterized in that: The plasticizer is naphthenic oil.

3. The hot melt pressure sensitive adhesive for packaging bags according to claim 1, characterized in that: The APAO is composed of a compound of high ethylene and a homopolymer.

4. The hot melt pressure sensitive adhesive for packaging bags according to claim 3, characterized in that: The mass mixing ratio of high ethylene to homopolymer is 5:

4.

5. The hot melt pressure sensitive adhesive for packaging bags according to claim 1, characterized in that: The tackifying resin is C9 petroleum resin.

6. The hot melt pressure sensitive adhesive for packaging bags according to claim 1, characterized in that: The antioxidant is a hindered phenol antioxidant.

7. A method for preparing a hot melt pressure sensitive adhesive for packaging bags, characterized in that: The steps include: Step 1: Add plasticizer, sasol wax and antioxidant in parts by weight into the experimental device; introduce nitrogen to remove air from the device while stirring, add tackifying resin, and react at 60-70°C for 3 hours; Step 2: Add APAO, control the temperature at 70-80°C, and react for 2 hours; Step 3: Vacuum and hydraulically discharge the material, and cool it down to obtain the finished product.

8. The method for preparing a hot melt pressure sensitive adhesive for packaging bags according to claim 7, characterized in that: Step 1: control the temperature at 65°C; step 2: control the temperature at 74°C.