Epoxy molding compound and preparation method and application thereof

Abstract

The invention relates to the technical field of epoxy molding compounds, and discloses an epoxy molding compound and a preparation method and application thereof. The epoxy molding compound contains epoxy resin, phenolic resin, a curing accelerator, a filler, a release agent, an ion trapping agent, a flexibilizer, a coupling agent, a tackifier and a coloring agent. Wherein the ion capturing agent is selected from at least one of silicate, hydrated oxide and heteropoly acid; the coupling agent is a sulfydryl-free coupling agent. According to the epoxy molding compound, the content of each component is controlled within a proper range, the non-sulfydryl coupling agent is adopted, and the specific ion capturing agent is added, so that the epoxy molding compound has relatively high copper / silver bonding force, the content of free ions is relatively low, and the reliability is relatively high in the application process of semiconductors.

Description

Technical Field

[0001] The invention relates to the technical field of epoxy molding materials, and in particular to an epoxy molding material and a preparation method and application thereof. Background Art

[0002] Epoxy molding compounds are widely used in the semiconductor packaging industry due to their low shrinkage, excellent electrical insulation properties, chemical resistance, easy processing, low cost and convenient large-scale production, and occupy 97% of the entire microelectronic packaging material market.

[0003] With the development of the times, the use environment requirements of semiconductor devices are getting higher and higher, and the requirements for the electrical performance of the devices are also getting higher and higher. The S element in epoxy molding compound mainly comes from the resin, coupling agent, ion capture agent and flame retardant of epoxy molding compound. Under long-term high temperature and high humidity test, the S element will corrode the copper wire, which will cause the electrical performance of the semiconductor device to fail, so the demand for sulfur-free epoxy molding compound came into being. On the other hand, in order to reduce the contact resistance of semiconductor chips and improve the performance of semiconductor devices, the semiconductor chip frame has evolved from bare copper material to copper-plated silver material. As the application environment becomes more and more complex, the chip is required to be able to operate for a long time in an environment with power on and high temperature and high humidity, and the requirements for the electrical performance of the epoxy molding compound covering the chip are also getting higher and higher. However, there are more free ions in the traditional sulfur-free epoxy molding compound system, which will cause the chip to fail electrically under the condition of long-term high temperature and high humidity power on. Summary of the invention

[0004] The purpose of the present invention is to overcome the problem that a conventional sulfur-free epoxy molding compound system in the prior art has a large amount of free ions, which may cause electrical failure of a chip and low reliability under conditions of long-term high temperature and high humidity power supply. An epoxy molding compound and a preparation method and application thereof are provided. The epoxy molding compound controls the content of each component within an appropriate range, adopts a mercapto-free coupling agent, and adds a specific ion capture agent, so that the epoxy molding compound not only has a higher copper / silver adhesion, but also has a lower free ion content, and has higher reliability in the application process of semiconductors.

[0005] In order to achieve the above object, the present invention provides an epoxy molding compound on one hand, which contains epoxy resin, phenolic resin, curing accelerator, filler, release agent, ion capture agent, toughening agent, coupling agent, tackifier and colorant;

[0006] Taking the total amount of the epoxy resin, the phenolic resin, the curing accelerator, the filler, the release agent, the ion capture agent, the toughening agent, the coupling agent, the tackifier and the colorant as 100 wt%, the epoxy resin is 3-15 wt%, the phenolic resin is 2-10 wt%, the curing accelerator is 0.05-2.0 wt%, the filler is 70-90 wt%, the release agent is 0.1-1.2 wt%, the ion capture agent is 0.1-1.5 wt%, the toughening agent is 0.2-1.4 wt%, the coupling agent is 0.3-1.5 wt%, the tackifier is 0.3-2.3%, and the colorant is 0-2 wt%;

[0007] Wherein, the ion capture agent is selected from at least one of silicate, hydrated oxide and heteropoly acid; and the coupling agent is a thiol-free coupling agent.

[0008] Preferably, the curing accelerator contains an organic phosphorus compound A and optionally at least one of a tertiary amine compound, an organic phosphorus compound B and an imidazole compound, wherein the organic phosphorus compound A and the organic phosphorus compound B are different.

[0009] Preferably, the organophosphorus compound A is prepared by complexing tetraphenylphosphine bromide with 2,3-dihydroxynaphthalene.

[0010] Preferably, the tertiary amine compound is at least one selected from 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)undec-7-ene and triethylaminebenzyldimethylamine.

[0011] Preferably, the organic phosphorus compound B is at least one selected from triphenylphosphine, triethylphosphine, trimethylphosphine, tributylphosphine and tri(p-tolyl)phosphine.

[0012] Preferably, the imidazole compound is selected from at least one of 2-methylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-heptadecylimidazole and 3-amino-1,2,4-triazole.

[0013] Preferably, based on 100 wt % of the total amount of the curing accelerator, the organic phosphorus compound A is 5-100 wt %.

[0014] Preferably, the filler is selected from at least one of alumina, titanium dioxide, silicon nitride and silicon dioxide.

[0015] Preferably, the median diameter D50 of the filler is 5-80 μm.

[0016] Preferably, the release agent is selected from at least one of polyethylene wax, carnauba wax, synthetic wax and mineral wax.

[0017] And / or, the toughening agent is selected from at least one of methyl methacrylate-butadiene-styrene terpolymer, acrylonitrile-butadiene-styrene copolymer, chlorinated polyethylene and ethylene-vinyl acetate copolymer.

[0018] Preferably, the viscosity enhancer is selected from at least one of nitrogen-containing phenolic acid, silicates and polyvinyl alcohol.

[0019] And / or, the colorant is selected from at least one of titanium dioxide, zinc oxide and carbon black.

[0020] Preferably, the coupling agent is selected from at least one of γ-glycidyloxypropyltrimethoxysilane, γ-glycidyl ether trimethoxysilane, γ-aminopropyl triethoxysilane, γ-aminopropyl trimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and N-phenyl-3-aminopropyltrimethoxysiloxane.

[0021] Preferably, the epoxy resin is selected from at least one of o-cresol epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, biphenyl epoxy resin, alicyclic epoxy resin, aliphatic glycidyl ether epoxy resin and heterocyclic epoxy resin.

[0022] And / or, the phenolic resin is selected from at least one of phenol linear phenolic resin and its derivatives, condensation products of p-xylene and phenol, condensation products of p-xylene and naphthol, copolymers of dicyclopentadiene and phenol, cresol linear phenolic resin and its derivatives and monohydroxy or dihydroxy naphthol phenolic resin and its derivatives.

[0023] The second aspect of the present invention provides a method for preparing an epoxy molding compound, which comprises: mixing the epoxy resin, phenolic resin, curing accelerator, filler, release agent, ion capture agent, toughening agent, coupling agent, tackifier and colorant mentioned above, melt-kneading, and crushing and molding after cooling.

[0024] Preferably, the melt mixing conditions include: temperature of 60-120° C. and time of 5-20 min.

[0025] A third aspect of the present invention provides an application of the epoxy molding compound described above and the epoxy molding compound prepared by the method described above as a semiconductor packaging material.

[0026] Compared with the prior art, the present invention has at least the following beneficial effects:

[0027] (1) The epoxy molding compound of the present invention controls the content of each component within an appropriate range, adopts a mercapto-free coupling agent, and adds an appropriate amount of a specific ion capture agent, so that the epoxy molding compound not only has a higher copper / silver adhesion, but also has a lower free ion content, and still has higher electrical properties under long-term high temperature and high humidity conditions, and has higher reliability in the application process of semiconductors.

[0028] Preferably, each component contained in the epoxy molding compound does not contain sulfur element, which can further improve the electrical properties of the epoxy molding compound and further improve the reliability of the epoxy molding compound.

[0029] (2) The method described in the present invention prepares epoxy molding compound by mixing and kneading various raw materials, adding and adjusting the type of ion capture agent, and controlling the ratio between the raw material components. The obtained epoxy molding compound has higher copper / silver adhesion, better electrical properties under high temperature and high humidity conditions, and higher reliability in the application process of semiconductors. DETAILED DESCRIPTION

[0030] The specific embodiments of the present invention are described in detail below. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0031] The endpoints and any values ​​of the ranges disclosed in this article are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of each range, the endpoint values ​​of each range and the individual point values, and the individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed in this article.

[0032] The inventor of the present invention has found through research that there are many free ions in the traditional sulfur-free epoxy molding compound system, which will cause the electrical failure of the chip under the condition of long-term high temperature and high humidity power supply, affecting the reliability of the epoxy molding compound. By adding a specific content and a specific type of ion capture agent and a mercapto-free coupling agent to the epoxy molding compound, the free ion content can be effectively reduced and the electrical properties of the epoxy molding compound can be improved. Based on this, the present invention provides an epoxy molding compound, which contains epoxy resin, phenolic resin, curing accelerator, filler, release agent, ion capture agent, toughening agent, coupling agent, tackifier and colorant.

[0033] In the present invention, the content of each component of epoxy resin, phenolic resin, curing accelerator, filler, release agent, ion trapping agent, toughening agent, coupling agent, tackifier and colorant is limited to a specific range, which not only enables the epoxy molding compound to have a higher copper / silver bonding force, but also because the specific ion trapping agent is added, the free ion content is low, the epoxy molding compound still has a higher electrical performance under the condition of long-term high temperature and high humidity power supply, and the reliability is higher in the application process of semiconductors. Preferably, in order to be sulfur-free in the epoxy molding compound, the epoxy resin, phenolic resin, curing accelerator, filler, release agent, ion trapping agent, toughening agent, coupling agent, tackifier and colorant in the present invention are all raw materials that do not contain sulfur elements.

[0034] In some embodiments, based on the total amount of the epoxy resin, the phenolic resin, the curing accelerator, the filler, the release agent, the ion capture agent, the toughening agent, the coupling agent, the tackifier and the colorant as 100 weight%, the epoxy resin is 3-15 weight%, the phenolic resin is 2-10 weight%, the curing accelerator is 0.05-2.0 weight%, the filler is 70-90 weight%, the release agent is 0.1-1.2 weight%, the ion capture agent is 0.1-1.5 weight%, the toughening agent is 0.2-1.4 weight%, the coupling agent is 0.3-1.5 weight%, the tackifier is 0.3-2.3%, and the colorant is 0-2 weight%.

[0035] In the present invention, the ion capture agent is selected from at least one of anion capture agents, cation capture agents and zwitterion capture agents. In some preferred embodiments, in order to reduce the content of free ions in the epoxy molding compound, the ion capture agent is selected from at least one of silicates, hydrated oxides and heteropoly acids.

[0036] In the present invention, the curing accelerator contains an organic phosphorus compound A and optionally at least one of a tertiary amine compound, an organic phosphorus compound B and an imidazole compound, wherein the organic phosphorus compound A and the organic phosphorus compound B are different.

[0037] In a preferred embodiment, the organophosphorus compound A is prepared by complexing tetraphenylphosphine bromide with 2,3-dihydroxynaphthalene; the organophosphorus compound A is a compound as shown in formula (1). The organophosphorus compound A prepared by this method can significantly improve the copper adhesion of epoxy molding compound. The structural formula of formula (1) is:

[0038] in, For the ligand, The central ion.

[0039] In one embodiment, the preparation method of the organophosphorus compound A comprises: in the presence of an alkaline solution and an organic solvent, tetraphenylphosphine bromide and 2,3-dihydroxynaphthalene undergo a complex reaction. Wherein, the alkaline solution can be a conventional choice in the art, and its function is to provide an alkaline reaction environment, and its amount is not specifically limited, as long as the reaction can proceed normally. In some embodiments, the alkaline solution can be a solution of sodium hydroxide, potassium hydroxide, calcium hydroxide or sodium carbonate. Wherein, the organic solvent is a variety of solvents well known to those skilled in the art, and its amount is not specifically limited. In some embodiments, the organic solvent can be an organic solvent such as methanol, toluene, dichloromethane or methyltetrahydrofuran. In a preferred embodiment, the molar ratio of the amount of tetraphenylphosphine bromide to the amount of 2,3-dihydroxynaphthalene can be 1:2-10, for example, it can be 1:1, 1:2, 1:4, 1:5, 1:7, 1:8, 1:9, 1:10. In a preferred embodiment, the conditions of the complex reaction include: the reaction temperature is 5-20°C, for example, it can be 5°C, 8°C, 10°C, 13°C, 16°C or 20°C; the reaction time is 1-4h, for example, it can be 1h, 1.5h, 2h, 3h or 4h.

[0040] In some preferred embodiments, the organophosphorus compound B is at least one selected from triphenylphosphine, triethylphosphine, trimethylphosphine, tributylphosphine and tri(p-tolyl)phosphine.

[0041] In some preferred embodiments, the tertiary amine compound is at least one selected from 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)undec-7-ene and triethylaminebenzyldimethylamine.

[0042] In some preferred embodiments, the imidazole compound is selected from at least one of 2-methylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-heptadecylimidazole and 3-amino-1,2,4-triazole.

[0043] In some preferred embodiments, based on 100 wt % of the total amount of the curing accelerator, the organic phosphorus compound A is 5-100 wt %.

[0044] In the present invention, the filler may be a conventional choice in the art. In some embodiments, the filler may be selected from at least one of aluminum oxide, titanium dioxide, silicon nitride and silicon dioxide. In a preferred embodiment, the median diameter D50 of the filler may be 5-80 μm.

[0045] In the present invention, the release agent may be a conventional choice in the art. In some embodiments, the release agent may be selected from at least one of polyethylene wax, carnauba wax, synthetic wax and mineral wax.

[0046] In the present invention, the toughening agent can be a conventional choice in the art. In some embodiments, the toughening agent can be selected from at least one of methyl methacrylate-butadiene-styrene terpolymer, acrylonitrile-butadiene-styrene copolymer, chlorinated polyethylene and ethylene-vinyl acetate copolymer.

[0047] In the present invention, the epoxy molding compound contains a specific tackifier, which can significantly improve the silver adhesion. In some preferred embodiments, the tackifier is selected from at least one of nitrogen-containing phenolic aldehydes, silicates and polyvinyl alcohol.

[0048] In the present invention, the colorant may be a conventional choice in the art. In some embodiments, the colorant may be selected from at least one of titanium dioxide, zinc oxide and carbon black.

[0049] In order to avoid using sulfur-containing raw materials, the coupling agent of the present invention is preferably a thiol-free coupling agent. In some embodiments, the coupling agent can be selected from at least one of γ-glycidyloxypropyltrimethoxysilane, γ-glycidyl ether trimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and N-phenyl-3-aminopropyltrimethoxysiloxane.

[0050] In the present invention, the epoxy resin can be a conventional choice in the art. In some embodiments, the epoxy resin can be selected from at least one of o-cresol epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, biphenyl epoxy resin, alicyclic epoxy resin, aliphatic glycidyl ether epoxy resin and heterocyclic epoxy resin.

[0051] In the present invention, the phenolic resin can be a conventional choice in the art. In some embodiments, the phenolic resin can be selected from at least one of phenol linear phenolic resin and derivatives thereof, a condensate of p-xylene and phenol, a condensate of p-xylene and naphthol, a copolymer of dicyclopentadiene and phenol, a cresol linear phenolic resin and derivatives thereof, a monohydroxy naphthol phenolic resin and derivatives thereof, and a dihydroxy naphthol phenolic resin and derivatives thereof.

[0052] The second aspect of the present invention provides a method for preparing an epoxy molding compound, which comprises: mixing the epoxy resin, phenolic resin, curing accelerator, filler, release agent, ion capture agent, toughening agent, coupling agent, tackifier and colorant mentioned above in a specific proportion, melt-kneading, and crushing and molding after cooling.

[0053] In some embodiments, the melt mixing conditions include: the temperature can be 60-120°C, and the time can be 5-20 minutes.

[0054] In the present invention, the equipment used for melt mixing can be a conventional choice in the art, for example, it can be a twin-roll mill, a single-screw extruder, a twin-screw extruder, a kneader or a stirrer.

[0055] A third aspect of the present invention provides an application of the epoxy molding compound described above and the epoxy molding compound prepared by the method described above as a semiconductor packaging material.

[0056] The following examples further illustrate the epoxy molding compound and its preparation method and application of the present invention. The examples are implemented based on the technical solution of the present invention, and provide detailed implementation methods and specific operation processes, but the protection scope of the present invention is not limited to the following examples.

[0057] The experimental methods in the following examples, unless otherwise specified, are all conventional methods in the art. The experimental materials used in the following examples, unless otherwise specified, are all commercially available.

[0058] A1 epoxy resin: biphenyl phenol epoxy resin, manufacturer: Nippon Kayaku Co. Ltd., brand: NC3000;

[0059] B1 Phenolic resin: biphenyl type aralkylphenolic resin (copolymer of dicyclopentadiene and phenol), manufacturer: (Meiwa Plastic Industries, Ltd., brand: MEH-7851ss;

[0060] C1 curing accelerator: an organic phosphorus compound, the chemical formula of which is shown in formula (1),

[0061]

[0062] C2 curing accelerator: 3-amino-1,2,4-triazole, manufacturer: Sigma-Aldrich Co. Ltd.;

[0063] D filler: silica, manufacturer: Jiangsu Lianrui, d50 is 22μm;

[0064] E release agent: Brazilian palm wax, manufacturer: Shanghai Yiba Chemical Raw Materials Co., Ltd., brand: t3;

[0065] F toughening agent: methyl methacrylate-butadiene-styrene terpolymer, manufacturer: Shenzhen Yingshun Plastic Raw Materials Co., Ltd., brand: MBS;

[0066] G1 coupling agent: γ-glycidyloxypropyltrimethoxysilane, manufacturer: Dow Corning, brand: Z-6040;

[0067] G2 coupling agent: N-phenyl-3-aminopropyl trimethoxysiloxane, manufacturer: Dow Corning, brand: Y-9669;

[0068] G3 coupling agent: 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, manufacturer: Nanjing Nengde Chemical Co., Ltd., brand: KH566;

[0069] H Colorant: Carbon black, Manufacturer: Hengdeli Chemical Co., Ltd.

[0070] I Thickener: Nitrogen-containing phenolic acid, manufacturer: Nippon Kayaku Co. Ltd., brand: N8705

[0071] J ion scavenger: IXE-100 (hydrated oxide), manufacturer: Japan Kyowa.

[0072] Examples 1-11 and comparative examples 1-11 are used to illustrate the preparation process of epoxy molding compound.

[0073] The raw material components of Examples 1-11 and Comparative Examples 1-11 were proportioned according to Table 1 and Table 2, respectively, and implemented according to the following method:

[0074] (1) Weighing each raw material component, then mixing each raw material composition, and melt-kneading the mixed material on an open mixer with a main roll at a temperature of 80° C. and an auxiliary roll at a temperature of 100° C. for 10 minutes;

[0075] (2) Cooling and crushing the molten mixed material obtained in step (1), and preforming it into a cake material to obtain an epoxy molding compound.

[0076] Table 1 Raw material ratio of Examples 1-11

[0077]

[0078]

[0079] Table 2 Raw material ratios of comparative examples 1-8

[0080]

[0081]

[0082] Comparative Example 9

[0083] The raw material ratio and preparation method of Example 1 were followed, except that the coupling agent was replaced with 0.75 g of 3-mercaptopropyltrimethoxysilane.

[0084] Comparative Example 10

[0085] The raw material ratio and preparation method of Example 1 were followed, except that the ion capture agent was replaced with 1.25 g of antimony pentoxide.

[0086] Comparative Example 11

[0087] The raw material ratio and preparation method of Example 1 were followed, except that the ion capture agent was replaced with 1.25 g of zirconium phosphate.

[0088] Test Case

[0089] Ion content:

[0090] The prepared epoxy molding compound is ground into particles, heated on a heating table at 175°C, and then put into deionized water while being constantly turned (fried). Extraction is performed under boiling conditions for 24 hours to obtain an extract, which is introduced into an atomic absorption spectrometer, flame atomized, and tested for absorbance, which is proportional to the ion content.

[0091] The ion content of the epoxy molding compounds prepared in Examples 1-11 and Comparative Examples 1-11 was tested, and the results are shown in Table 3.

[0092] Table 3

[0093]

[0094]

[0095] It can be seen from the test results of Examples 1-11 and Comparative Examples 1-11 that the epoxy molding compound prepared using the mercapto-free coupling agent is sulfur-free. At the same time, IXE-100 is added to the system as an ion capture agent, and the ratio between the raw material components is controlled, so that the prepared epoxy molding compound has higher copper / silver adhesion and lower ion content, and has higher reliability in the application process of semiconductors.

[0096] The preferred embodiments of the present invention are described in detail above, but the present invention is not limited thereto. Within the technical concept of the present invention, the technical solution of the present invention can be subjected to a variety of simple modifications, including the combination of various technical features in any other suitable manner, and these simple modifications and combinations should also be regarded as the contents disclosed by the present invention and belong to the protection scope of the present invention.

Claims

1. An epoxy molding compound, characterized in that: The epoxy molding compound contains epoxy resin, phenolic resin, curing accelerator, filler, mold release agent, ion capture agent, toughening agent, coupling agent, tackifier and colorant; Taking the total amount of the epoxy resin, the phenolic resin, the curing accelerator, the filler, the release agent, the ion capture agent, the toughening agent, the coupling agent, the tackifier and the colorant as 100 wt%, the epoxy resin is 3-15 wt%, the phenolic resin is 2-10 wt%, the curing accelerator is 0.05-2.0 wt%, the filler is 70-90 wt%, the release agent is 0.1-1.2 wt%, the ion capture agent is 0.1-1.5 wt%, the toughening agent is 0.2-1.4 wt%, the coupling agent is 0.3-1.5 wt%, the tackifier is 0.3-2.3%, and the colorant is 0-2 wt%; Wherein, the ion capture agent is selected from at least one of silicate, hydrated oxide and heteropoly acid; and the coupling agent is a thiol-free coupling agent.

2. The epoxy molding compound according to claim 1, characterized in that: The curing accelerator contains at least one of an organic phosphorus compound A, an organic phosphorus compound B and an imidazole compound and an optional tertiary amine compound, wherein the organic phosphorus compound A and the organic phosphorus compound B are different; Preferably, the organophosphorus compound A is prepared by complexing tetraphenylphosphine bromide with 2,3-dihydroxynaphthalene; Preferably, the tertiary amine compound is at least one selected from 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)undec-7-ene and triethylaminebenzyldimethylamine; Preferably, the organophosphorus compound B is at least one selected from triphenylphosphine, triethylphosphine, trimethylphosphine, tributylphosphine and tri(p-tolyl)phosphine; Preferably, the imidazole compound is selected from at least one of 2-methylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-heptadecylimidazole and 3-amino-1,2,4-triazole.

3. The epoxy molding compound according to claim 2, characterized in that: Based on the total amount of the curing accelerator being 100 wt %, the organic phosphorus compound A is 5-100 wt %.

4. The epoxy molding compound according to any one of claims 1 to 3, characterized in that: The filler is selected from at least one of alumina, titanium dioxide, silicon nitride and silicon dioxide; Preferably, the median diameter D50 of the filler is 5-80 μm.

5. The epoxy molding compound according to any one of claims 1 to 4, characterized in that: The release agent is selected from at least one of polyethylene wax, carnauba wax, synthetic wax and mineral wax; And / or, the toughening agent is selected from at least one of methyl methacrylate-butadiene-styrene terpolymer, acrylonitrile-butadiene-styrene copolymer, chlorinated polyethylene and ethylene-vinyl acetate copolymer.

6. The epoxy molding compound according to any one of claims 1 to 5, characterized in that: The tackifier is selected from at least one of nitrogen-containing phenolic acid, silicates and polyvinyl alcohol; And / or, the colorant is selected from at least one of titanium dioxide, zinc oxide and carbon black.

7. The epoxy molding compound according to any one of claims 1 to 6, characterized in that: ； Preferably, the coupling agent is selected from at least one of γ-glycidyloxypropyltrimethoxysilane, γ-glycidyl ether trimethoxysilane, γ-aminopropyl triethoxysilane, γ-aminopropyl trimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and N-phenyl-3-aminopropyltrimethoxysiloxane.

8. The epoxy molding compound according to any one of claims 1 to 7, characterized in that: The epoxy resin is selected from at least one of o-cresol epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, biphenyl epoxy resin, alicyclic epoxy resin, aliphatic glycidyl ether epoxy resin and heterocyclic epoxy resin; And / or, the phenolic resin is selected from at least one of phenol linear phenolic resin and its derivatives, condensation products of p-xylene and phenol, condensation products of p-xylene and naphthol, copolymers of dicyclopentadiene and phenol, cresol linear phenolic resin and its derivatives and monohydroxy or dihydroxy naphthol phenolic resin and its derivatives.

9. A method for preparing an epoxy molding compound, characterized in that: The method comprises: mixing the epoxy resin, phenolic resin, curing accelerator, filler, release agent, ion capture agent, toughening agent, coupling agent, tackifier and colorant according to any one of claims 1 to 8, melting and kneading, and crushing and molding after cooling; Preferably, the melt mixing conditions include: temperature of 60-120° C. and time of 5-20 min.

10. Use of the epoxy molding compound according to any one of claims 1 to 8 and the epoxy molding compound prepared by the method according to claim 9 as a semiconductor packaging material.

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