A SMD anti-sulfuration plant lamp and its preparation method

Abstract

The present invention relates to the technical field of LED plant lights, solves the problems of poor anti-sulfuration ability and uneven coating in the prior art, and provides an SMD anti-sulfuration plant light and a preparation method thereof. The plant light includes: a plurality of LED lamp beads, wherein the LED lamp beads include a bracket and a light-emitting chip, and the light-emitting wavelengths of the light-emitting chips of different LED lamp beads are the same or different; a first coating is provided on the surface of the LED lamp beads by vacuum coating, the first coating has a first preset thickness, and the material of the first coating is one or a combination of alumina, silica, or silicon nitride, a functional area is provided on the bracket, a second coating is provided on the functional area by vacuum coating, the second coating has a second preset thickness, and a third coating is further provided on the surface of the first coating. By adopting the vacuum coating technology and coating materials, the present invention provides more reliable protection for the SMD plant light, and improves the stability and service life of the product.

Description

Technical Field

[0001] The present invention relates to the technical field of LED plant lights, and particularly to an SMD sulfur-resistant plant light and a preparation method thereof. Background Art

[0002] A plant light is an artificial light source specifically used to simulate sunlight and provide the light required for plant growth. Plant lights have important applications in agricultural production, especially in fields such as greenhouse cultivation, vertical farming, and indoor plant cultivation. Different from ordinary lighting fixtures, plant lights not only need to provide a certain light intensity but also need to provide a specific spectral range according to the growth requirements of different plants. Common plant lights adopt LED technology and have become the mainstream choice for modern plant lighting due to their high energy efficiency, long lifespan, and adjustable spectrum.

[0003] The core component of an LED plant light is the LED lamp bead, which consists of a bracket and a light-emitting chip. The light-emitting chip is the light source part of the lamp bead. To improve the performance and lifespan of the plant light, the protection measures on the surface of the LED lamp bead are crucial. Especially in harsh environments such as humidity and warmth, the sulfur-resistant performance of the LED lamp bead is a key factor affecting its reliability and stability. Sulfuration is a chemical reaction that usually occurs when the metal part of the LED lamp bead contacts sulfides in the environment, resulting in the formation of a sulfide film on the metal surface, thus affecting the performance of the LED lamp bead, especially the light decay and the stability of light output. In the application of plant lights, since the light source is often exposed to environments of high temperature, high humidity, and sulfide gas, sulfur resistance has become an important technical challenge in the design of LED plant lights.

[0004] To improve the sulfur-resistant ability of LED lamp beads, various protection measures have been taken in the prior art. For example, special encapsulation materials (such as AB glue, epoxy resin, etc.) are used to seal the LED lamp beads, or a protective coating is applied on the surface of the LED lamp beads, such as polyurethane, silicone, etc. However, most of these protection measures can only provide limited sulfur-resistant protection. Especially during long-term use, the coating or encapsulation material on the surface of the lamp beads is prone to aging or deterioration, resulting in a decline in the sulfur-resistant effect. Currently, most of the LED plant lights on the market use simple encapsulation glue or coating for protection, but the stability and protection effect of these protective coatings have certain limitations. Especially in high-humidity, high-temperature, and sulfur-rich environments, the existing coatings are often difficult to effectively prevent the occurrence of sulfuration reactions, leading to an accelerated light decay of the LED lamp beads and a shortened lifespan.

[0005] Although the existing coatings (such as encapsulation glue, polyurethane coating, etc.) can provide certain sulfur-resistant protection, in environments with high temperature, high humidity, and a relatively high concentration of sulfide gas, the protection effect is difficult to last, and the coating is prone to aging or corrosion, resulting in a decline in the sulfur-resistant ability. Summary of the Invention

[0006] In view of this, an embodiment of the present invention provides an SMD anti-sulfuration plant lamp and a preparation method thereof, aiming to solve the problem of limited protection effect of the anti-sulfuration scheme of plant lamps in the prior art.

[0007] In a first aspect, an embodiment of the present invention provides an SMD anti-sulfuration plant lamp, including:

[0008] A plurality of LED lamp beads, wherein the LED lamp beads include a bracket and a light-emitting chip, the light-emitting chip is mounted on the bracket, and the light-emitting wavelengths of the light-emitting chips of different LED lamp beads are the same or different;

[0009] A first coating is provided on the surface of the LED lamp bead by vacuum coating, the first coating has a first preset thickness, the material of the first coating is one or a combination of aluminum oxide, silicon oxide, or silicon nitride, a functional area is provided on the bracket, and a second coating is provided on the functional area by vacuum coating, the second coating has a second preset thickness, a third coating is further provided on the surface of the first coating, the third coating has a third preset thickness, the materials of the first coating and the second coating are the same, the first preset thickness is greater than the third preset thickness, and the second preset thickness is greater than the first preset thickness.

[0010] Preferably, the light-emitting wavelength of the light-emitting chip belongs to a preset wavelength range, and the preset wavelength range includes one or a combination of a first wavelength range of 360 - 410 nm, a second wavelength range of 410 - 500 nm, a third wavelength range of 500 - 600 nm, a fourth wavelength range of 600 - 700 nm, and a fifth wavelength range of 700 - 1000 nm.

[0011] Preferably, the materials of the first coating and the second coating are silicon dioxide, and the material of the third coating is AF glue.

[0012] Preferably, the LED lamp bead includes a phosphor, and the phosphor is a fluoride.

[0013] Preferably, the first preset thickness is 100 nm, the second preset thickness is 300 nm, and the third preset thickness is 30 nm.

[0014] In a second aspect, an embodiment of the present invention further provides a preparation method of an SMD anti-sulfuration plant lamp for preparing the SMD anti-sulfuration plant lamp described in the first aspect, and the preparation method includes:

[0015] Clean the surface of the bracket and dry the cleaned bracket;

[0016] Perform vacuum coating on the functional area of the bracket to form a second coating with a second preset thickness;

[0017] Fix the light-emitting chip on the bracket after cleaning and drying to obtain a number of LED lamp beads;

[0018] Perform vacuum coating on each of the LED lamp beads to form a first coating with a first preset thickness on the surface of the LED lamp beads;

[0019] Perform vacuum coating on each of the LED lamp beads to form a third coating with a third preset thickness on the surface of the first coating

[0020] Perform post-treatment on each of the LED lamp beads to obtain the SMD anti-sulfuration plant lamp.

[0021] In summary, the beneficial effects of the present invention are as follows:

[0022] The SMD anti-sulfuration plant lamp and its preparation method provided by the embodiments of the present invention form a layer of alumina, silicon oxide or silicon nitride coating with strong chemical stability on the surface of the LED lamp beads, effectively isolating the erosion of external sulfur-containing gases, significantly improving the anti-sulfuration ability of the LED lamp beads, reducing the influence of the sulfuration reaction on the metal part of the lamp beads, and prolonging the service life of the lamp beads. The vacuum coating process can achieve uniform deposition of the coating, ensuring the same protection effect in each area on the surface of the LED lamp beads, and avoiding the weak links caused by uneven manual coating of the traditional coating. By improving the anti-sulfuration ability and environmental resistance of the LED lamp beads, the present invention can effectively reduce the light decay of the lamp beads during long-term use, maintain a high light output efficiency, and improve the lighting effect of the plant lamp. Since the coating of the present invention has excellent corrosion resistance and durability, it can effectively prevent the penetration of corrosive substances in the environment, reduce the premature failure of the LED lamp beads due to environmental deterioration, and thus significantly prolong the service life of the plant lamp. In summary, the present invention solves the problems of poor anti-sulfuration ability and uneven coating in the prior art by adopting the vacuum coating technology and high-quality coating materials, provides more reliable protection for the SMD plant lamp, and improves the stability and service life of the product. Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required to be used in the embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to these drawings, and all of these are within the protection scope of the present invention.

[0024] Figure 1 It is a schematic flowchart of the preparation method of the SMD anti-sulfuration plant lamp according to the embodiment of the present invention. Detailed Embodiments

[0025] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be implemented without some of these specific details. The following description of the embodiments is only provided to provide a better understanding of the present invention by showing examples of the present invention.

[0026] It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0027] Embodiment 1

[0028] The embodiment of the present invention provides an SMD sulfur-proof plant lamp, comprising:

[0029] A plurality of LED lamp beads, wherein the LED lamp beads include a bracket and a light-emitting chip, the light-emitting chip is mounted on the bracket, the light-emitting wavelength of the light-emitting chip belongs to a preset wavelength range, and the light-emitting wavelengths of the light-emitting chips of different LED lamp beads are the same or different;

[0030] The surface of the LED lamp bead is provided with a first coating by vacuum coating, the first coating has a first preset thickness, and the material of the first coating is one or a combination of alumina, silica, or silicon nitride.

[0031] Specifically, the embodiment of the present invention provides an SMD sulfur-proof plant lamp, and its core innovation lies in coating a first coating composed of one or a combination of materials such as alumina (Al2O3), silica (SiO2), silicon nitride (Si3N4), etc. on the surface of the LED lamp bead through a vacuum coating process. The main function of this coating is to improve the sulfur-proof performance of the LED lamp bead, especially its performance in harsh environments such as high temperature, high humidity, and sulfur-rich gases.

[0032] The LED lamp bead includes a bracket and a light-emitting chip. The emission wavelength of the light-emitting chip is within a preset wavelength range, and different wavelengths can be selected according to the spectral requirements of different plants. This design allows the lighting effect of the plant lamp to be customized according to the lighting needs of different plants. Different LED lamp beads can adopt the same or different emission wavelengths to adapt to the photosynthetic requirements of different plants.

[0033] The material of the first coating is composed of one or a combination of aluminum oxide, silicon oxide, or silicon nitride. These materials have high chemical stability, hardness, and good electrical insulation, and can provide strong protection in different environments.

[0034] Aluminum oxide has excellent corrosion resistance, especially stable chemical properties in high-temperature environments, so it can effectively prevent the surface of the LED lamp bead from being corroded by sulfides.

[0035] Silicon oxide has high heat resistance and moisture resistance, and at the same time has strong resistance to ultraviolet rays and chemical corrosion, which can improve the durability of the LED lamp bead in a humid environment.

[0036] Silicon nitride is a very hard and heat-resistant material, which can provide a stronger protective layer. Especially in high-temperature and high-humidity environments, it can effectively prevent the performance of the lamp bead from decreasing.

[0037] The thickness of the first coating is set to a first preset thickness according to specific protection requirements. This thickness can ensure that the coating can provide sufficient protection while not affecting the light-emitting effect of the LED lamp bead or increasing too much thermal resistance.

[0038] In an embodiment of the present invention, the preset wavelength range includes one or a combination of a first wavelength range of 360 - 410 nm, a second wavelength range of 410 - 500 nm, a third wavelength range of 500 - 600 nm, a fourth wavelength range of 600 - 700 nm, and a fifth wavelength range of 700 - 1000 nm.

[0039] Specifically, in the embodiment of the present invention, the preset wavelength range includes the following bands: 360 - 410 nm, 410 - 500 nm, 500 - 600 nm, 600 - 700 nm, and 700 - 1000 nm. These wavelength ranges respectively correspond to the effects of different lights on plant growth and photosynthesis, and the growth environment of plants can be optimized by precisely regulating the spectrum of the plant lamp.

[0040] The first wavelength range of 360 - 410 nm is violet light. Violet light has a certain impact on plant photosynthesis and morphogenesis, but it is not as strong as blue and red light. Violet light has a special effect on plant photomorphogenesis, which can affect the morphological development and growth direction of plants. Violet light helps plants grow and develop in short-day environments and regulates plant morphological characteristics, such as affecting the growth of plant stems. Violet light helps thicken plant leaves, which is beneficial to enhancing the photosynthesis ability of plants. The violet light band has an exciting effect on the synthesis of anthocyanins and can affect the color and aesthetic characteristics of plants. When irradiated with violet light, some plants will activate special metabolic pathways and promote the synthesis of components in plants (such as plant hormones and secondary metabolites).

[0041] The second wavelength range of 410 - 500 nm is blue light. Blue light has a strong impact on plant growth and photosynthesis and can regulate plant growth morphology and photosynthesis. Specifically, blue light can significantly promote plant photosynthesis, especially in the wavelength bands of 430 nm and 450 nm, which play an important role in plant chloroplasts. Moreover, blue light has the effect of inhibiting excessive plant growth, especially inhibiting the growth of plant stem segments, and can help plants maintain a short and thick morphology. The blue light band helps the differentiation and growth of plant roots, promotes root development, and supports the differentiation of multiple lateral branches and buds. The blue light band also helps the synthesis of anthocyanins and beneficial substances such as vitamin C, which is beneficial to the overall health of plants.

[0042] The third wavelength range of 500 - 600 nm is green light. Green light has a certain promoting effect on plant photosynthesis and morphogenesis, but its impact is smaller compared to blue and red light. A small amount of green light can enhance photosynthesis, especially increasing the photosynthetic efficiency of plants under higher light intensities. For some algae plants, green light can promote their growth, especially playing an important role in the photosynthesis of aquatic plants. Excessive green light may inhibit the excessive growth of plant stems and keep plants a certain degree of short and compact.

[0043] The fourth wavelength range of 600 - 700 nm is red light. Red light is one of the most important wavelength ranges in plant photosynthesis and has a significant impact on plant growth and development. The specific effects of red light include:

[0044] Accelerate photosynthesis: Red light plays a crucial role in promoting plant photosynthesis, carbohydrate synthesis, etc. Red light is especially helpful for the synthesis of plant sugars.

[0045] Promote plant height increase and leaf expansion: Red light especially has a promoting effect on long-day plants, which can accelerate plant development, promote plant leaf division, and leaf expansion.

[0046] Photoperiod regulation: Red light can also regulate the photoperiod of plants, affect plant flowering and development, extend the light exposure time, and promote plant growth.

[0047] Affect plant photomorphogenesis: Red light has a significant impact on plant photomorphogenesis, helping to control plant morphological characteristics, such as promoting plant branching and stem growth.

[0048] The fifth wavelength range of 700 - 1000 nm is far red light, which plays an important role in plant photomorphogenesis, growth regulation, flowering, etc. Far red light can stimulate the elongation of plant cells, promote the elongation of plant stems, and has a unique role in promoting plant flowering and seed germination, especially in regulating the flowering period of plants and the seed germination speed.

[0049] The combination of far red light and 660 nm red light can accelerate photosynthesis and improve the photosynthetic efficiency of plants. The combination of far red light and red light can regulate plant photomorphogenesis, such as plant height, branching pattern, etc. Moreover, far red light promotes the vertical growth of plants, especially during the elongation growth stage.

[0050] By adopting a spectrum covering these specific wavelength ranges in the SMD anti - sulfur plant lamp, precise regulation of the plant growth process can be achieved. Lights of different wavelengths can be customized according to the needs of different plant growth stages to optimize plant growth processes such as photosynthesis, photomorphogenesis, flowering, and fruit development. Specifically, violet light in the range of 360 - 410 nm promotes photomorphogenesis and anthocyanin synthesis, blue light in the range of 410 - 500 nm enhances photosynthesis and inhibits unnecessary stem node elongation, green light in the range of 500 - 600 nm helps increase photosynthesis and promote the growth of certain plants in small amounts, red light in the range of 600 - 700 nm contributes to photosynthesis, plant height, and leaf enlargement, while far red light in the range of 700 - 1000 nm stimulates plant elongation growth, flowering, and seed germination and other growth processes.

[0051] Preferably, the material of the first coating is silicon dioxide, a functional area is provided on the bracket, and a second coating is provided on the functional area by vacuum coating. Among them, the material of the second coating is the same as that of the first coating, the second coating has a second preset thickness, and the first preset thickness is less than the second preset thickness.

[0052] Specifically, the material of the first coating is silica, and the material of the second coating is the same as that of the first coating, that is, the second coating is also silica. The preset thickness of the first coating is less than that of the second coating. This means that in the embodiments of the present invention, there will be two layers of silica coatings with different thicknesses respectively, aiming to improve the performance of the coating and enhance its protective effect. The second coating is the main protective layer, providing a strong protective effect, especially against vulcanization and corrosion, etc. The first coating, as a supplementary layer, can enhance the uniformity of the coating and avoid the problem of local stress concentration caused by a thick coating. By superimposing two layers of silica coatings, multiple protections are provided, which helps to improve the abilities of anti-vulcanization, moisture-proof and anti-aging.

[0053] The design of the two-layer coating makes the coating more uniform and stable, reducing the risk of possible coating peeling or damage. The presence of the second layer of film can balance the hardness and flexibility of the film, enabling the coating to resist external physical damage and avoid cracks caused by excessive hardening.

[0054] The optical properties of the silica coating, such as refractive index, light transmittance, etc., can affect the light output of the LED lamp bead. By adjusting the coating thickness, the scattering and transmission of light can be optimized, thereby improving the light efficiency of the plant lamp. The thin-layer design of the second coating helps to improve the light transmittance, reduce the loss of light reflection, and at the same time does not affect the protective effect of the first coating.

[0055] The silica coating itself has strong chemical stability and high-temperature resistance, and can be used for a long time in high-humidity, high-temperature and corrosive environments. By providing the second coating on the first coating, the failure problem caused by the peeling or aging of the coating can be effectively avoided.

[0056] In one embodiment, the LED lamp bead includes a phosphor, and the phosphor is a fluoride.

[0057] In this embodiment, the LED lamp bead includes a fluoride phosphor, which means that the light-emitting material used in the LED lamp bead is a fluoride-type phosphor. Common ones are KSF phosphor (strontium potassium fluoride phosphor) or other types of fluoride-based phosphors. Fluoride phosphors usually have high chemical stability, can maintain good physical and chemical properties under high temperature or corrosive environments, and are not easy to react with sulfides in the environment. Therefore, it has good sulfidation resistance for LED lamp beads in high-temperature sulfidation environments. Fluoride-based phosphors usually have low surface activity, can effectively prevent gases (especially sulfide gases) from reacting with the surface of the phosphor, thus avoiding phosphor degradation and light output attenuation. The stability and low reactivity of fluoride phosphors make them not easily affected by the external environment (such as sulfide gases) during use. Therefore, they can significantly extend the service life of LED lamp beads and reduce the failure of lamp beads caused by reasons such as sulfidation.

[0058] Preferably, a third coating is further provided on the surface of the first coating. The material of the third coating is AF glue, and the third coating has a third preset thickness, which is less than the first preset thickness.

[0059] AF (amorphous fluoropolymer) glue is usually used for surface coatings, which can prevent fingerprints, stains and water droplets from adhering, keep the surface clean, and improve the stain resistance. Applying AF glue on the surface of LED lamp beads can reduce the accumulation and adhesion of surface grease, dust and stains during use, keep the lamp bead surface clean, and reduce the light decay and light output efficiency decline caused by pollution. Designing the thickness of the third coating to be less than that of the first coating can ensure that the protective effect of the AF glue does not affect the protective performance of the previous silica coating.

[0060] Preferably, the first preset thickness is 100 nm, the second preset thickness is 300 nm, and the third preset thickness is 30 nm.

[0061] Specifically, the second coating with a larger thickness (300 nm) serves as the main protective layer, which provides strong physical and chemical protection. The first coating has a relatively thin thickness (100 nm), and its function is to further enhance the uniformity of the coating and improve the protective effect. The thin coating helps to maintain the protective performance without affecting the light output efficiency of the LED lamp beads. This coating can optimize the light transmittance and scattering effect on the premise of ensuring the surface uniformity and anti-sulfuration of the LED lamp beads. The AF glue layer plays a role in anti-fouling and anti-fingerprint. The AF glue layer is thin, which can avoid obvious influence on the light transmittance and provide lasting anti-fouling ability.

[0062] In a comparative example 1, the LED lamp beads were not subjected to anti-sulfuration treatment, that is, there was no first coating, second coating and third coating. The experimental conditions were that the experimental temperature was 85°C ± 5°C, the sublimated sulfur concentration was 1.0 g / 1000 mL, and the experiment lasted for 69 hours (Ta = 85°C ± 5°C, 69 hours). After the test, the LED lamp wire was significantly blackened, and there was no dead lamp phenomenon, but the bottom of the bracket was slightly blackened;

[0063] In a comparative example 2, only a 300-nm second coating was provided on the surface of the bracket functional area. The phosphor used in the LED lamp beads was a conventional phosphor, which refers to containing aluminate and nitride. The experiment was carried out under the same conditions as in comparative example 1. After the test, the LED wire was significantly blackened and there was a dead lamp phenomenon (1 PCS of dead lamp (1 wafer died in the double crystal combination));

[0064] In a comparative ratio 3, only a 300-nm second coating is provided on the surface of the bracket functional area. The phosphor used for the LED lamp beads is a fluoride phosphor, such as KSF phosphor. Experiments are carried out under the same conditions. After the test, the LED lamp wire is significantly blackened, but there is no dead lamp phenomenon;

[0065] In a comparative ratio 4, a 100-nm first coating is provided on the surface of the LED lamp beads, and a 300-nm second coating is provided on the surface of the bracket functional area. The phosphor used for the LED lamp beads is a conventional phosphor. Conventional powder refers to those containing aluminates and nitrides. Experiments are carried out under the same conditions. After the test, the LED lamp wire is significantly blackened, and there is no dead lamp phenomenon;

[0066] In a comparative ratio 5, a 100-nm first coating is provided on the surface of the LED lamp beads, and a 300-nm second coating is provided on the surface of the bracket functional area. The phosphor used for the LED lamp beads is a fluoride phosphor, such as KSF phosphor. Experiments are carried out under the same conditions. After the test, the LED lamp wire is slightly blackened, and there is no dead lamp phenomenon;

[0067] In a comparative ratio 6, a 100-nm first coating is provided on the surface of the LED lamp beads, a 300-nm second coating is provided on the surface of the bracket functional area, and a 30-nm third coating is provided on the surface of the first coating. The phosphor used for the LED lamp beads is a conventional phosphor. Conventional powder refers to those containing aluminates and nitrides. Experiments are carried out under the same conditions. After the test, the LED lamp wire is slightly blackened, and there is no dead lamp phenomenon;

[0068] In a preferred embodiment, a 100-nm first coating is provided on the surface of the LED lamp beads, a 300-nm second coating is provided on the surface of the bracket functional area, and a 30-nm third coating is provided on the surface of the first coating. The phosphor used for the LED lamp beads is a conventional phosphor. Conventional powder refers to those containing aluminates and nitrides. Experiments are carried out under the same conditions. After the test, the LED lamp wire is not blackened, and there is no dead lamp phenomenon;

[0069] In a comparative ratio 7, a 200-nm second coating is provided on the surface of the bracket functional area. The phosphor used for the LED lamp beads is a conventional phosphor. Conventional powder refers to those containing aluminates and nitrides. Experiments are carried out under the same conditions. After the test, the LED lamp wire is slightly blackened, and there is no dead lamp phenomenon;

[0070] In a comparative ratio 8, a 400-nm second coating is provided on the surface of the bracket functional area. The phosphor used for the LED lamp beads is a conventional phosphor. Conventional powder refers to those containing aluminates and nitrides. Experiments are carried out under the same conditions. After the test, the LED lamp wire is significantly blackened, and there are dead lamps. There are 9 dead lamps (1 dead chip in a double-chip combination);

[0071] This experiment systematically compared the performance of LED lamp beads under different anti-sulfuration treatment conditions, covering the effects of different coating settings and phosphor types. The experiment evaluated the sulfur resistance of LED lamp beads by simulating a high-temperature sulfurization environment (85°C ± 5°C, sublimed sulfur 1.0 g / 1000 mL, for 69 hours). The main observation indicators included the blackening of the wire and the phenomenon of dead lamp beads. Without any coating protection, the wire became significantly blackened, but there was no dead lamp bead phenomenon. There was slight blackening at the bottom of the bracket, indicating that even without a coating, the LED lamp beads were still affected by sulfurization to a certain extent.

[0072] In a sulfurization environment, LED lamp beads using fluoride phosphors (such as KSF phosphor) showed better anti-sulfuration ability compared to those using conventional phosphors (aluminate and nitride systems). Although the wire still showed blackening, the phenomenon of dead lamp beads was significantly reduced. This indicates that fluoride phosphors can effectively inhibit the sulfurization reaction in a high-temperature sulfurization environment and reduce the performance degradation caused by sulfurization.

[0073] The experimental results showed that the coating played a key role in protecting LED lamp beads from sulfurization. Specifically, the combination of a 100-nm first coating and a 300-nm second coating (such as in Comparative Example 4 and Comparative Example 5) could significantly slow down the impact of sulfurization on LED lamp beads. Especially in the case of fluoride phosphors, it showed better sulfur resistance, with a significantly reduced degree of blackening of the wire and no dead lamp bead phenomenon. This combined coating could effectively block the penetration of sulfides and reduce the impact of the sulfurization reaction on the internal components of LED lamp beads.

[0074] Further optimized by adding a 30-nm third coating (such as in Comparative Example 6 and the preferred embodiment), the experimental results showed that this three-layer coating scheme provided the best anti-sulfuration effect. Under the condition of conventional phosphors, the wire of the LED lamp beads was hardly blackened, and the phenomenon of dead lamp beads was completely avoided. This combined scheme not only provided excellent protection performance but also ensured the long life and stability of LED lamp beads. It is of great significance for the long-term reliability and performance maintenance of LEDs.

[0075] The choice of coating thickness directly affects the sulfurization tolerance of LED lamp beads. From the experimental results in Comparative Example 7 and 8, a 200-nm coating could provide good protection, with only slight blackening of the wire and no dead lamp bead phenomenon. However, a 400-nm coating showed poor performance, resulting in obvious blackening of the wire and a relatively serious dead lamp bead phenomenon (9 dead lamp beads). This result indicates that an overly thick coating may have an adverse impact on the thermal management and heat dissipation performance of LED lamp beads, and even exacerbate the sulfurization reaction in some cases. Therefore, the coating thickness should be reasonably designed according to actual needs to balance the protection effect and thermal management requirements.

[0076] Based on the experimental results of each group, the best anti-sulfuration design is as follows: coat a first coating with a thickness of 100 nm and a second coating with a thickness of 300 nm on the surface of the LED lamp bead, and apply a third coating with a thickness of 30 nm on the surface of the first coating, and use fluoride phosphor at the same time. This design can effectively reduce the negative impact of sulfuration on the LED lamp bead and ensure its long-term stable operation in high-temperature and sulfuration environments. For future optimization directions, further research can be considered on the optimization of coating materials and thickness, as well as the anti-sulfuration characteristics of other types of phosphors, so as to be more widely applied to various LED lighting products.

[0077] Example 2

[0078] Based on the SMD anti-sulfuration plant lamp of Example 1, please refer to Figure 1 , the embodiment of the present invention provides a preparation method of an SMD anti-sulfuration plant lamp for preparing the SMD anti-sulfuration plant lamp described in the first aspect, and the preparation method includes:

[0079] S1. Clean the surface of the bracket and dry the cleaned bracket;

[0080] Specifically, if there are oil stains, dust or other impurities on the surface of the bracket, these pollutants will affect the bonding effect between the LED light-emitting chip and the bracket in the subsequent steps, or affect the adhesion of the coating. Cleaning is to remove these impurities and provide an ideal surface to ensure the smooth progress of the subsequent process. Drying is to avoid the residual moisture, which may cause the light-emitting chip to be not firmly bonded, or affect the uniform deposition of the coating on the surface of the bracket, thus affecting the performance of the LED lamp bead.

[0081] Wipe the surface of the bracket with solvents such as isopropyl alcohol and deionized water to remove oil stains, dust or other impurities. An ultrasonic cleaning device can be used to put the bracket into the solvent for ultrasonic cleaning to further clean the surface of the bracket. After cleaning, use a drying device to dry the bracket to ensure that the surface of the bracket is completely clean and free of moisture. The cleaned surface of the bracket helps to improve the bonding strength between the LED chip and the bracket and enhance the overall performance and stability of the LED lamp bead.

[0082] S2. Perform vacuum coating on the functional area of the bracket to form a second coating with a second preset thickness;

[0083] The bracket is an important component of the LED lamp bead, usually made of metal or other materials, and is used to support the light-emitting chip. The "functional area" of the bracket generally refers to the part of the bracket that is specially designed to perform certain specific functions. These functional areas may include heat dissipation areas, connection areas, or other areas that require special treatment. By performing vacuum coating on the functional area of the bracket, a specific coating is formed on the surface of the bracket, usually with a specific thickness (the second preset thickness), to meet the specific requirements of the functional area. The thickness and material of the coating are precisely controlled to ensure that it has the required performance, such as improving corrosion resistance, enhancing adhesion, and improving heat dissipation performance.

[0084] S3. Fix the light-emitting chip on the bracket after cleaning and drying to obtain a number of LED lamp beads, wherein the emission wavelengths of the number of LED lamp beads belong to the preset wavelength range;

[0085] Specifically, fixing the light-emitting chip on the bracket is to ensure the electrical connection and heat conduction of the light-emitting chip, while maintaining the physical stability between the chip and the bracket. Selecting a suitable wavelength range is to ensure that the spectrum of the plant lamp meets the needs of plant growth. Different wavelength ranges have different effects on different growth stages and characteristics of plants. Common fixing methods include using conductive glue, lead-free solder, etc. to fix the light-emitting chip at a predetermined position on the bracket. During the fixing process, ensure good contact between the electrodes of the light-emitting chip and the electrodes of the bracket. Select an appropriate light-emitting chip according to the needs of plant growth. Different wavelength ranges (such as 360 - 410nm, 410 - 500nm, 500 - 600nm, 600 - 700nm, and 700 - 1000nm) have different effects on the photosynthesis, photomorphology, anthocyanin synthesis, etc. of plants.

[0086] S4. Perform vacuum coating treatment on each of the LED lamp beads to form a first coating with a first preset thickness on the surface of the LED lamp beads;

[0087] Vacuum coating refers to depositing a coating material on the surface of the LED lamp bead to form a protective coating through physical vapor deposition (PVD) techniques such as evaporation or sputtering in a vacuum environment. The main function of the coating is to protect the LED lamp bead from environmental influences, such as moisture, corrosive gases (such as hydrogen sulfide), etc., to prevent the LED lamp bead from sulfuration, light decay, or damage. Select a suitable target material according to the requirements of the coating, and deposit these materials on the surface of the LED lamp bead through high-frequency magnetron sputtering or evaporation techniques. Adjust the equipment parameters, such as deposition rate, power, air pressure, etc., according to the required coating characteristics to ensure that the coating is uniform and has sufficient adhesion. Vacuum coating can effectively improve the quality of the coating, enhance the anti-sulfuration, anti-moisture, and anti-corrosion capabilities. The uniform coating improves the stability of the LED lamp bead, enabling it to still work stably in a harsh environment and extending its service life.

[0088] S5. Perform vacuum coating on each of the LED lamp beads to form a third coating with a third preset thickness on the surface of the first coating.

[0089] This step further processes the LED lamp beads that already have the first coating. Through vacuum coating technology, a third coating with a specific thickness (the third preset thickness) is formed on the surface of the first coating. The thickness and material of this coating are carefully designed to meet the functional requirements of the LED lamp beads, such as improving antioxidant properties, enhancing optical performance, and improving high-temperature resistance. Precise control of the thickness of the third coating helps ensure the long-term stability and performance of the LED lamp beads.

[0090] S6. Perform post-treatment on each of the LED lamp beads to obtain the SMD anti-sulfuration plant lamp.

[0091] Post-treatment refers to the further processing of LED lamp beads after basic assembly and coating, such as curing, inspection, testing, etc., to ensure that the LED lamp beads meet the quality standards. If a coating material that requires thermal curing is used, it needs to be cured by heating or ultraviolet irradiation. Through light efficiency testing, stability testing, and environmental testing, etc., ensure the stable performance of the LED lamp beads under various conditions. Finally, install the processed LED lamp beads onto a circuit board or a lamp fixture to complete the final assembly of the plant lamp. The post-treatment step ensures the quality, stability, and performance of the LED lamp beads, and avoids light decay or failure caused by production defects. Through post-treatment, the reliability of the LED lamp beads can be improved, ensuring their performance during long-term use and enhancing the market competitiveness of the product.

[0092] Preferably, the step of performing vacuum coating on each of the LED lamp beads to form a first coating with a first preset thickness on the surface of the LED lamp beads includes:

[0093] S31. According to the material of the first coating, obtain the target material for vacuum coating. Among them, the material of the first coating is silicon dioxide, and the target material is solid silicon dioxide particles;

[0094] The target material refers to the material used for evaporation or sputtering during the vacuum coating process, usually having the same or similar chemical composition as the coating material to be deposited. The target material will be excited under vacuum conditions and deposited on the surface of the LED lamp beads to form a coating. Solid pure silicon is a silicon material without doping with other elements and is usually used as a target for the deposition of silicon dioxide. According to the requirements of the coating material, select a suitable target material to ensure the coating quality and deposition effect. The silicon dioxide coating is usually formed by sputtering or evaporation using a solid pure silicon target, so solid pure silicon needs to be selected as the target material.

[0095] S32. Place the LED lamp beads and the target material at designated positions in the reaction chamber of the vacuum coating machine respectively;

[0096] Specifically, a vacuum coating machine is a device used to evaporate or sputter materials onto the surface of an object. It generally includes a reaction chamber, a target, a heating device, and a gas delivery system. The reaction chamber is a sealed cavity in the vacuum coating machine that houses the LED lamp beads and the target to be coated. Vacuum pumping and atmosphere control are carried out in this chamber to provide a coating environment. Correct placement of the LED lamp beads and the target in the reaction chamber can ensure the uniformity of the coating process and the quality of the coating. By reasonably arranging the positions of the LED lamp beads and the target, ensure uniform deposition of the coating and avoid unnecessary influences such as concentration of sputtered materials or uneven air flow.

[0097] S33. Obtain vacuum coating parameters according to the target material corresponding to the first coating and the first preset thickness, where the vacuum coating parameters include: evaporation source temperature, target vacuum degree, and gas charging rate;

[0098] Specifically, the core purpose of this step is to derive appropriate vacuum coating process parameters based on the properties of the target material, such as melting point, vapor pressure, etc., and the requirements of the first coating, such as film thickness and quality requirements. These parameters will directly affect the quality, uniformity, and physical and chemical properties of the film layer. Therefore, it is crucial to correctly set the evaporation source temperature, target vacuum degree, and gas charging rate. Based on the evaporation characteristics of silicon dioxide (such as its melting point and vapor pressure), select a reasonable temperature range. Generally, the temperature of the target material should be set above its melting point, but not too high to avoid affecting the film layer quality or causing excessive evaporation. The higher the vacuum degree, the better the evaporation efficiency of the evaporation source and the more stable the film layer quality. Generally, the vacuum degree is set within a reasonable range according to the vapor pressure of silicon dioxide. Select an appropriate gas charging rate according to the specific requirements of the vacuum coating. Too fast or too slow gas charging will affect the film layer quality. Common gases such as argon are usually controlled for flow rate in a low-pressure environment.

[0099] S34. Evaporate the target material according to the vacuum coating parameters to form a first coating on the surface of the LED lamp beads;

[0100] The purpose of this step is to evaporate the target material in a vacuum environment and deposit it on the surface of the LED lamp beads to form a coating with the required thickness by using the vacuum coating parameters (evaporation source temperature, vacuum degree, gas charging rate) set in the previous step. This process will directly affect the quality of the coating and the final performance of the LED lamp beads.

[0101] At the set evaporation source temperature, heat the target material until it starts to evaporate. The evaporation source needs to be precisely controlled to prevent overheating or temperature fluctuations. Control the vacuum degree to ensure that the evaporation effect of the evaporation source meets the expectations. If the vacuum degree is too high or too low, it will affect the evaporation rate and cause unstable film layer quality. Control the gas filling rate to ensure that the atmosphere conditions are suitable for the stable growth of the film layer during the evaporation of silicon dioxide. During the evaporation process, monitor the film thickness and temperature to ensure that the film layer reaches the required preset thickness.

[0102] S35. When the thickness of the coating reaches the first preset thickness, stop the vacuum coating process and cool the LED lamp bead.

[0103] During the coating process, use a thickness sensor (such as reflection interferometry or optical sensor) to monitor the coating thickness in real time to ensure that it gradually reaches the preset first thickness target. Ensure that the coating process stops when the preset thickness is reached to avoid uneven film layers or affecting the performance of the LED lamp bead due to over-deposition. Subsequently, through the cooling process, ensure that the film layer stably adheres to the surface of the LED lamp bead at room temperature. Through real-time thickness monitoring, ensure that the film layer thickness precisely reaches the preset target, avoiding overcoating or undercoating. Through the cooling process, thermal stress-induced film peeling or deformation can be avoided, ensuring that the coating stably adheres to the surface of the LED lamp bead at room temperature and improving performance and stability during long-term use.

[0104] In one embodiment, step S33 includes:

[0105] S331. Divide the vacuum coating process into at least three coating stages according to the physical and chemical properties of the target material and the first preset thickness, where the thickness growth amount and / or the target deposition rate are different for different coating stages;

[0106] In the vacuum coating process, dividing the coating process into multiple stages is to achieve uniform and precise control of the coating thickness, especially when the coating requires high precision or different deposition rates or physical and chemical reaction characteristics may be encountered during the deposition of materials. Through stage-by-stage control, the deposition process can be better adjusted to ensure that the performance requirements such as the quality, uniformity, and adhesion of the coating are met.

[0107] During the evaporation or deposition of different materials, their deposition rates, adsorption characteristics, and deposition behaviors may be different. For example, the deposition rates, reaction activities, and gas adsorption properties of silicon dioxide (SiO 2 ) and AF glue will be different, so different deposition parameters need to be used for different stages.

[0108] The thickness increment refers to the change in the coating thickness at each stage, which is usually achieved by controlling the deposition rate at each stage. For example, in the first stage, the thickness increment of the film layer may be small (such as 0 - 20 nm) because we need to ensure the uniformity and adhesion of the coating. In the second stage, the deposition rate can be increased to rapidly accumulate the film layer thickness, and finally, in the third stage, precise final adjustment is achieved by slowing down the deposition rate.

[0109] In different coating stages, according to the deposition behavior of the material and the final requirements of the film layer, the target deposition rate will vary. In the initial stage, a lower deposition rate can ensure the uniformity and interlayer adhesion of the film layer; while in the middle stage, the deposition rate is appropriately increased to ensure higher efficiency and a larger film layer thickness; in the final stage, the deposition rate is reduced to avoid surface unevenness or holes caused by excessive accumulation.

[0110] For example, in the first stage, deposition may occur at a low speed (such as 2 - 5 nm / s) to ensure the smoothness of the film layer; in the second stage, the deposition rate can be appropriately increased (such as 10 - 15 nm / s) to accelerate the layering; in the third stage, the deposition rate is reduced (such as 1 - 3 nm / s) to ensure the final precision of the film layer.

[0111] S332. For each coating stage, obtain a number of initial parameter combinations of the vacuum coating parameters that meet the corresponding target deposition rate;

[0112] Specifically, each deposition stage requires different deposition rates and film qualities, and the target deposition rate directly determines the parameters that need to be adjusted during the vacuum coating process. While achieving the target deposition rate at each stage, it is necessary to select appropriate initial parameter combinations to ensure that the target deposition rate can be achieved under the given conditions. The initial parameter combination is the setting of the vacuum coating equipment before any adjustment, including the initial set values of parameters such as the evaporation source temperature, gas filling rate, and vacuum degree. These initial settings provide the starting conditions for the actual deposition process. For each deposition stage, the target deposition rate determines the range of the target vacuum degree and evaporation source temperature. By performing simulation calculations on each vacuum coating parameter or based on empirical rules, the initial parameter combination required to meet the target deposition rate can be determined.

[0113] S333. Take the coating stage with the largest thickness increment as the reference stage;

[0114] Specifically, the reference stage refers to the stage with the largest thickness increment among all coating stages. It is selected as a reference point to compare the adjustment differences of other stages. By selecting the stage with the largest thickness increment as the reference stage, the control accuracy can be ensured in the most important stage, thus affecting the coating quality of subsequent stages.

[0115] Among multiple coating stages, the stage with the largest thickness increase is usually the growth stage because the main accumulation of the film layer occurs at this time. By selecting this stage as the reference stage, it can be ensured that the parameter adjustment of other stages is carried out around the most critical and influential stage, thus making the overall coating process more coordinated.

[0116] Since the growth stage has a greater impact on the film layer thickness, its physical conditions (such as temperature, vacuum degree, gas flow rate, etc.) need to be maintained with high stability. Therefore, selecting it as the reference stage helps to maintain the consistency of the whole process.

[0117] S334. According to the preset screening rules, screen the initial parameter combinations of the reference stage to obtain the target parameter combinations;

[0118] Specifically, the initial parameter combination is only the starting point and needs to be adjusted according to the specific requirements of different stages. The screening process can eliminate inappropriate parameter combinations to ensure the best deposition quality in the actual coating process. The preset screening rules are usually determined according to the physical properties of the material (such as melting point, evaporation temperature, etc.) and the requirements of the deposition rate. The screened target parameter combinations will ensure the most suitable deposition rate and film layer quality in the reference stage. Analyze the initial parameters of the reference stage according to the preset screening rules (such as the relationship between temperature, gas filling rate and vacuum degree), and select the most suitable parameter combination. For example, if the evaporation source temperature is too high, it will cause the film layer to be too thick or form an uneven film layer, then the temperature should be reduced. The screening rules may also include comparing the effects of different gas filling rates to find the best gas flow rate.

[0119] In one embodiment, when screening the initial parameter combinations, preferentially select the combinations with a high matching degree between the deposition rate and the stage thickness increase. For example, select the parameter combinations with the deposition rate within the target range and consistent with the change trend of the expected thickness increase. The reason for this rule is that there is a direct relationship between the deposition rate and the thickness increase during the coating process. If the deposition rate is too fast, it may lead to uneven material accumulation or premature entry into the growth stage, affecting the quality of the film layer. If the deposition rate is too slow, it will result in reduced coating efficiency, and even the thickness increase in some stages fails to meet the expected requirements. Therefore, ensuring the matching of the deposition rate and the thickness increase helps to achieve the expected coating effect and avoid problems such as insufficient deposition or uneven film layer.

[0120] In another embodiment, preferentially select the parameter combinations that remain stable within the predetermined vacuum degree range to ensure that the fluctuation of the vacuum degree change during the whole coating stage is controlled within the set tolerance range (such as ±5%).

[0121] The influence of vacuum degree on the vacuum coating process is extremely important. Too high or too low vacuum degree will affect the evaporation and deposition efficiency of the coating material, resulting in uneven film layer quality. To ensure the stability of the coating process, it is necessary to ensure that the vacuum degree remains stable within an appropriate range. If the vacuum degree fluctuates too much, it may cause defects during the coating process, thereby affecting the quality of the final product. By selecting a parameter combination with stable vacuum degree, the negative impact of the external environment on the coating quality can be minimized.

[0122] In another embodiment, during screening, select a parameter combination that can stabilize the gas filling rate, and consider the influence of the gas composition in the atmosphere on material deposition. Prioritize those parameter combinations that can ensure an appropriate atmosphere. During the vacuum coating process, the stability of the gas filling rate and the atmosphere composition directly affects the uniformity of the deposition process and the chemical properties of the coating. If the gas filling rate is too high or too low, it may result in uneven film thickness or unstable chemical structure of the coating material. On the other hand, the atmosphere composition (such as oxygen, nitrogen or other gases) has an important impact on the microstructure and properties of the coating. For example, too much oxygen may cause oxidation, while nitrogen may affect the hardness and gloss of the thin film. Therefore, the screening rules should ensure that the gas filling rate and the atmosphere composition are within an appropriate range to ensure the film layer quality and consistency.

[0123] The preset screening rules can be adjusted according to the actual situation, and no specific restrictions are made here.

[0124] S335. Obtain the degree of difference between the initial parameter combinations of the remaining coating stages and the target parameter combination of the reference stage;

[0125] Comparing the degree of difference in parameter combinations of each stage can understand the difference of each stage relative to the reference stage, so as to reduce the mutation or uneven transition between stages, thereby ensuring the uniformity of the film layer and the stability of the film layer quality. The degree of difference refers to the change amount between the coating parameters (such as deposition rate, evaporation source temperature, gas filling rate, etc.) of different stages. When calculating the difference, usually two factors are considered:

[0126] (1) Numerical difference: For example, the deposition rate in the first stage is 2nm / s, while in the second stage it is 10nm / s, and the numerical difference between the two is 8nm / s.

[0127] (2) Physical and chemical reaction difference: If the deposition rate in a certain stage increases too fast, it may cause quality problems of the film layer (such as unevenness, cracks, etc.), and the impact of this physical change also needs to be considered.

[0128] In one embodiment, according to the adjustment difficulty, the magnitude of the adjustment amount and the influence on the film layer quality of each stage, different weights can be assigned to the degree of difference of each parameter. For example:

[0129] The difference in deposition rate has a great influence on the uniformity of the film layer, so a relatively high weight (such as 0.5) is assigned. The temperature difference has a great influence on the adhesion and optical properties of the film layer, but the difficulty of adjustment is relatively small, and a medium weight (such as 0.3) is assigned. The gas filling rate may mainly affect the reaction atmosphere of the film layer and has an indirect influence on the deposition effect, and a relatively low weight (such as 0.2) can be assigned.

[0130] Through the above weighted calculation, the degree of difference between the initial parameter combination of the remaining coating stages and the target parameter combination of the reference stage can be obtained.

[0131] S336. Determine the target parameter combination of the remaining coating stages according to the degree of difference;

[0132] In one embodiment, the initial parameter combination with the smallest degree of difference can be selected, which is equivalent to selecting those parameter combinations with smaller change amounts and the least influence on the film layer, avoiding the adverse effect of too large adjustment amplitude on the film layer quality. By selecting the parameter combination with the smallest degree of difference, the instability caused by parameter adjustment can be effectively reduced, ensuring the consistency of the film layer quality in each stage.

[0133] In some cases, the combination with the smallest difference may not be the best process parameter, but it can be used as a conservative choice to ensure the stability of the overall process, especially when large adjustments are not allowed under the process conditions.

[0134] In one embodiment, step S331 specifically includes:

[0135] S3311. Obtain the physical and chemical properties of the target material corresponding to the first coating, and the physical and chemical properties include: vapor pressure, melting point, and surface energy;

[0136] Specifically, the main reasons for obtaining these three physical and chemical properties of vapor pressure, melting point, and surface energy are that they have important influences on film growth, adhesion, film layer uniformity, and quality during the vacuum coating process. Vapor pressure is the ability of a material to transform into a gaseous state at a specific temperature, indicating the tendency of a substance to transform from a solid or liquid state into a gaseous state. During the vacuum coating process, the target material needs to be heated to a certain temperature to evaporate. Materials with high vapor pressure are more likely to evaporate, while materials with low vapor pressure require higher temperatures to evaporate.

[0137] During the contact stage between the coating and the substrate, if the vapor pressure is too high, the evaporation rate of the material is relatively fast, which may lead to uneven deposition and affect the adhesion quality of the film layer. Materials with low vapor pressure are more suitable for forming a uniform initial film layer. Materials with high vapor pressure may accelerate the deposition process during the growth stage, but may also lead to pores, bubbles, or uneven films in the film layer. Therefore, the control of vapor pressure can help optimize the structure and quality of the film layer.

[0138] The melting point is the temperature at which a material changes from a solid state to a liquid state. Materials with lower melting points usually start to evaporate more easily at lower temperatures. Therefore, during the adhesion stage, the film layer of low-melting-point materials is likely to be deposited evenly, and the film layer adhesion is relatively strong. High-melting-point materials require higher heating temperatures to achieve evaporation, which may lead to poor adhesion of the film layer in the initial stage or the formation of an uneven thin film. High-melting-point materials may cause unstable deposition rates during the evaporation process and require more precise temperature control.

[0139] Surface energy refers to the energy possessed per unit area of the surface, which is usually related to the binding strength of the atoms on the material surface. The higher the surface energy, the higher the surface energy of the material, and the stronger the adhesion between the material and the substrate is usually.

[0140] By referring to the material database or literature, obtain the vapor pressure, melting point, and surface energy data of the target material (such as silicon dioxide). These physical and chemical properties will be used in subsequent steps to determine key parameters such as temperature control and vacuum setting during the film coating process.

[0141] S3312. According to the physical and chemical properties, divide the vacuum coating process into at least three coating stages with the first preset thickness as the scale, where the coating stages sequentially include an adhesion stage, a growth stage, and a stable stage;

[0142] Specifically, in this step, the vacuum coating process is divided into at least three stages according to the physical and chemical properties of the target material. The goal of each stage is to achieve different film layer growth characteristics. The process control strategies for each stage are different, and corresponding adjustments are set according to the material characteristics.

[0143] The key point of the adhesion stage is to ensure good adhesion between the coating and the substrate. Therefore, a relatively low deposition rate and a moderate evaporation source temperature are usually controlled during this stage. The thickness of the film layer grows rapidly during the growth stage, requiring a higher deposition rate and precise control of the evaporation temperature. The deposition rate is relatively low during the stable stage to ensure the uniformity of the coating and the stability of the final thickness.

[0144] S3313. Determine the thickness increase amounts of the adhesion stage and the growth stage according to the vapor pressure and the melting point, where the thickness increase amount of the adhesion stage is negatively correlated with the vapor pressure and positively correlated with the melting point, and the thickness increase amount of the growth stage is negatively correlated with both the melting point and the vapor pressure;

[0145] Specifically, the thickness increment refers to the change in the film layer thickness during the vacuum coating process, that is, the thickness of the coating deposited in a certain stage. During the adhesion stage and the growth stage, the evaporation rate of the material directly affects the thickness growth rate of the coating. The higher the vapor pressure, the faster the evaporation rate, resulting in a relatively rapid thickening of the film layer. Materials with lower melting points can evaporate more easily, so the thickness increment in the adhesion stage may be larger. Optimize the coating process based on these relationships.

[0146] Materials with higher vapor pressures mean that the material can change from solid or liquid state to gaseous state at a lower temperature, and the evaporation rate is faster. This usually leads to too rapid deposition of the initial film layer, forming a rough coating, resulting in poor adhesion and poor film uniformity.

[0147] During the adhesion stage, too high a vapor pressure may cause excessive diffusion of the molecules of the material during deposition or insufficient contact with the surface, affecting the adhesion between the film layer and the substrate. Therefore, materials with lower vapor pressures can instead provide more stable and uniform deposition conditions at this stage, contributing to the formation of a better adhesion layer. Materials with higher melting points usually start to evaporate at higher temperatures, which means that a longer heating time is required to bring them to a suitable evaporation state. During this process, the temperature stability during evaporation of the material is better, and the evaporation uniformity is higher, avoiding the uneven deposition caused by temperature fluctuations.

[0148] In addition, materials with higher melting points usually have stronger surface adhesion and are more likely to form a firm adhesion layer on the substrate surface, contributing to the improvement of the quality of the initial coating. Therefore, a higher melting point helps to achieve more stable film layer deposition during the adhesion stage, and the thickness growth is relatively stable.

[0149] During the growth stage, materials with higher vapor pressures have a faster evaporation rate, which may lead to too rapid deposition of the film layer, and then cause defects such as surface roughness and cracks in the film layer, affecting the quality of the film layer.

[0150] Too high a vapor pressure may lead to an unsatisfactory aggregation mode of the deposited substances during evaporation, and the particles may form larger particle clusters or irregular film layers on the surface. To ensure the uniformity and stability of the film layer, it is necessary to control the vapor pressure to adapt to the deposition rate in the growth stage to ensure the smoothness and high quality of the film layer. Materials with higher melting points require higher temperatures to evaporate. During the growth stage, too high an evaporation temperature will cause the material to condense too quickly when deposited on the substrate surface, possibly forming a thick and non-uniform coating.

[0151] In this stage, materials with too high a temperature will cause instability during the film layer deposition process, affecting the quality of the film layer. Therefore, it is necessary to control the relationship between the melting point and the temperature to ensure that the material is deposited at an appropriate rate and uniformly during the deposition process, avoiding excessive temperature fluctuations or too fast evaporation rate.

[0152] S3314. Determine the thickness increment of the stable stage according to the melting point and surface energy, which is positively correlated with both the melting point and the surface energy;

[0153] In the stable stage, the thickness growth of the film layer tends to be stable. This stage mainly involves the densification, smoothness, and optimization of the final quality of the thin film. At this stage, most of the coating has been deposited. The main purpose is to further optimize the quality of the coating, reduce defects, and make the thin film more stable and uniform. At this time, the growth rate of the film layer slows down, and the focus of deposition is to optimize the density, uniformity, and physical properties of the film layer. The following details the influence of the melting point and surface energy on the thickness increment of the stable stage and their positive correlation.

[0154] During the deposition process of high-melting-point materials, due to their higher thermal stability, they can better adapt to temperature changes, reduce deposition non-uniformity and changes in the thin film structure. Therefore, when the thickness increment in the stable stage is large, high-melting-point materials can effectively control the deposition rate, promote the densification and uniformity of the thin film, and reduce internal stress and surface defects.

[0155] The evaporation process of materials with a relatively high melting point is relatively gentle, reducing the influence of unstable evaporation at high temperatures. This helps to form a thin film of higher quality in the stable stage. Therefore, in this stage, the thickness increment will be positively correlated with the melting point.

[0156] Surface energy is a physical quantity that describes the interaction between the surface molecules of a material and the air interface. It affects the adhesion, wettability, and surface smoothness of the material surface with other substances. Materials with higher surface energy have stronger hydrophilic or lipophilic properties and can better chemically or physically interact with the substrate surface, thereby enhancing the adhesion and uniformity of the coating.

[0157] In the later stable stage, materials with higher surface energy can more easily form a uniform thin film on the substrate surface and reduce surface defects, such as bubbles, cracks and other adverse phenomena. Due to the higher surface energy, the molecules of the material will be more evenly distributed on the substrate surface during the deposition process, thereby reducing irregular deposition on the surface.

[0158] Materials with higher surface energy are beneficial to the "self - balance" effect of the thin film during the stable stage. That is, the film layer can spread better on the surface of the substrate during the deposition process, thus promoting the stable growth of the coating. As the thickness of the film layer increases, the surface energy of the material helps reduce the stress accumulation during the deposition process, improves the structure of the thin film, and enables the film layer to continue to thicken smoothly at a slower growth rate. The combined effect of these two factors results in a relatively large thickness increase during the stable stage. Materials with high melting points and high surface energies can continue to optimize the quality of the thin film through a relatively slow growth process, reduce defects, and improve the density, uniformity, and stability of the thin film. Therefore, the thickness increase during the stable stage is positively correlated with both the melting point and the surface energy.

[0159] S3315. Fine - tune the preset deposition speed for the corresponding coating stage according to the thickness increase to obtain the target deposition speed;

[0160] Different coating stages correspond to different deposition requirements. The coating deposition methods, film layer structures, and quality requirements are different for each stage. Therefore, it is necessary to dynamically adjust the deposition speed according to the thickness increase in each stage. During the adhesion stage, the deposition speed is usually slow to ensure that the coating adheres firmly to the surface of the substrate. During the growth stage, the deposition speed is fast to increase the thickness of the film layer, but the surface quality still needs to be controlled. During the stable stage, the deposition speed is usually low to optimize the quality of the thin film, reduce defects, and improve the uniformity of the thin film.

[0161] If the thickness increase of the film layer is small in a certain stage, it may be necessary to increase the deposition speed and deposition rate to ensure that the film layer can grow smoothly according to the predetermined plan. If the thickness increase of the film layer is too large in a certain stage, it may be necessary to slow down the deposition speed to avoid excessive stress accumulation in the film layer or quality problems. By fine - tuning the deposition speed, the thickness growth process of the film layer can be controlled more precisely to ensure that the quality and performance of the film layer in each stage meet the expected requirements.

[0162] Preferably, the evaporating the target material according to the vacuum coating parameters to form a first coating on the surface of the LED lamp bead includes:

[0163] S341. Determine the function model according to the difference degree between the evaporation source temperatures of each coating stage. The function model includes linear functions, exponential functions, and polynomial functions;

[0164] Specifically, the temperature of the evaporation source usually changes gradually during the film coating process, and different stages may exhibit different change laws. To reasonably control the film coating process, it is necessary to perform mathematical modeling on the temperature change. Selecting an appropriate function model can more accurately predict the temperature change and optimize the temperature control. The degree of difference in temperature change determines which function model to choose. For example, if the temperature difference in each stage is small and the change is gentle, a linear function can be selected; if the difference is large and the change is rapid, an exponential function may be more suitable; if the temperature change law is complex, a polynomial function can be selected.

[0165] The linear function is applicable to the situation where the temperature change in each film coating stage is relatively gentle and the change amplitude is small. It assumes that the temperature change is uniform, that is, as time or thickness increases, the temperature change is linear.

[0166] The exponential function is applicable to situations that require rapid changes. For example, rapid heating is required in the initial stage, while a relatively high temperature may need to be maintained or the temperature may gradually decrease in the stable stage. The exponential model can accurately represent this rapid change process.

[0167] The polynomial function is applicable to situations where the temperature change is very complex or contains multiple change trends. If the temperature change during the film coating process has trends of acceleration, deceleration, or twists and turns, a polynomial function can be used to accurately fit these complex temperature changes.

[0168] By reasonably selecting the function model, the law of temperature change can be accurately described, ensuring more precise temperature control during the vacuum film coating process, and thus improving the film layer quality.

[0169] S342. According to the evaporation source temperature in each film coating stage, perform curve fitting through the said function model to obtain a temperature control curve;

[0170] By fitting the temperature data, a mathematical curve (such as a linear, exponential, or polynomial function) describing the temperature change law can be obtained, which can accurately reflect the temperature change in different film coating stages. This temperature control curve can be used as a reference during the actual film coating process, and control parameters such as the heating power and cooling rate of the evaporation source can be adjusted according to the curve. If a linear function is selected, use a simple linear regression method to fit the temperature data; if an exponential function or polynomial function is selected, use corresponding non-linear fitting methods, such as the least squares method or polynomial regression.

[0171] S343. Based on the said temperature control curve, perform curve fitting respectively according to the target vacuum degree and gas filling rate in each film coating stage to obtain a gas rate control curve and a vacuum degree control curve respectively;

[0172] The degree of vacuum and the gas filling rate are usually not constant, but gradually change over time or with the progress of the deposition process. In order to precisely control the changes of these parameters and avoid affecting the film quality due to inaccurate control, it is necessary to fit the changes of these parameters over time or thickness to obtain the corresponding control curves.

[0173] The changes in the degree of vacuum and the gas filling rate should be coordinated with the temperature change. The control curves obtained by fitting can help achieve more precise control. Using the data fitting method of the aforementioned S342, control curves are generated for the degree of vacuum and the gas filling rate respectively. These curves will describe how the degree of vacuum and the gas flow rate change at different times or thicknesses, ensuring the control accuracy during the film coating process.

[0174] S344. Perform vacuum coating treatment on the LED lamp beads according to the temperature control curve, the gas rate control curve, and the degree of vacuum control curve;

[0175] The vacuum coating treatment is used to deposit films on the surface of the LED lamp beads. These films can have different functions, such as protective films, optical films, or functional thin films. By precisely controlling the vacuum coating parameters, the performance of the LED lamp beads can be improved, such as increasing brightness, stability, lifespan, etc. Adjust the temperature of the evaporation source according to the temperature control curve to keep it changing stably at different stages; adjust the gas flow rate according to the gas rate control curve to ensure that the gas filling rate meets the coating requirements; adjust the degree of vacuum in real time according to the degree of vacuum control curve to ensure that the vacuum environment at each stage meets the requirements.

[0176] In the actual vacuum coating process, the current temperature, gas flow rate, and degree of vacuum are obtained through real-time monitoring sensors and compared with the preset curves. If a deviation is found, the system will make corresponding automatic adjustments to ensure that the temperature, gas flow rate, and degree of vacuum are within the specified range. The four parameters of temperature, thickness, degree of vacuum, and gas flow rate directly affect the evaporation efficiency of the evaporation source, the adhesion, and uniformity of the film layer, etc. Therefore, monitoring these parameters can effectively ensure that the process conditions at each stage are strictly controlled.

[0177] The monitoring data can provide feedback information for the subsequent automatic adjustment and adaptive adjustment, forming a closed-loop control system.

[0178] S346. During a coating stage, for one or more of the temperature control curve, the gas rate control curve, and the degree of vacuum control curve through the real-time data and the preset adaptive control algorithm;

[0179] Adaptive control algorithm is a control algorithm that automatically adjusts process parameters based on real-time data feedback. It judges the difference between the current state and the target state through the algorithm model and makes appropriate adjustments. During the coating process, the parameter data obtained through real-time monitoring can be used to dynamically adjust the process curves (temperature control curve, gas rate control curve, vacuum degree control curve) to ensure that the process parameters always meet the target requirements. The adaptive control algorithm adjusts the process curve by analyzing the deviation between the real-time data and the target data, aiming to optimize the coating quality and stability. According to the difference between the real-time data and the target data, a suitable algorithm (such as PID control, fuzzy control, etc.) is selected to dynamically adjust the control curves of temperature, gas flow rate, and vacuum degree. According to different coating stages, one or more control curves may be adjusted.

[0180] S347. After a coating stage ends, compare the real-time data of this stage with the adjusted temperature control curve, gas rate control curve, and vacuum degree control curve to obtain the stage deviation amount.

[0181] Specifically, the deviation amount refers to the gap between the actual parameters (such as temperature, gas flow rate, etc.) and the target parameters (the values calculated through the control curve). For example, if the actual temperature is higher or lower than the target temperature, the temperature deviation amount will have a positive or negative value. Similarly, the gas rate and vacuum degree will also be calculated according to the difference between the target value and the actual value. After each stage ends, analyze and compare the data such as temperature, gas flow rate, and vacuum degree in the actual coating process to calculate the deviation amount. Through these deviation amounts, the process execution situation of each stage can be evaluated and provide a basis for subsequent adjustments. The stage deviation amount is the difference between the actual process parameters (such as temperature, gas flow rate, vacuum degree) and the target set value after a coating stage ends, usually expressed by calculating the deviation between the actual value and the target value. The stage deviation amount reflects the process execution difference of each stage and can be used as a feedback signal for subsequent optimization and adjustment.

[0182] S348. Determine the corresponding deviation adjustment capacity according to the thickness growth amount and the target deposition rate of the remaining coating stages. The deviation adjustment capacity is positively correlated with the thickness growth amount and negatively correlated with the target deposition rate.

[0183] The deviation adjustment capacity refers to how much deviation adjustment can be accepted during a certain coating stage without affecting the stability of the entire process and the final result. It is a parameter determined after considering the actual situation of each stage, and it controls the possible adjustment range within the stage. If the thickness increase in a certain stage is large, it means that its adjustment space is larger and it has more adjustment capabilities to cope with possible deviations, ensuring that the thickness and quality of the film layer meet the requirements; when the target deposition rate is high, it means that the coating work in this stage is faster and more concentrated, so the adjustment space for each stage will be relatively smaller. A high deposition rate means higher control precision requirements, and the deviation adjustment capacity cannot be too large, otherwise it will lead to process instability. Therefore, the deviation adjustment capacity will be smaller. In the case of a high deposition rate, the adjustment space is limited, and excessive adjustment will affect the coating quality, so the deviation adjustment capacity is small. When the deposition rate is low, the changes in each stage are not so rapid, and a larger range of deviation adjustment is allowed. By reasonably setting the deviation adjustment capacity for each stage, over-adjustment is avoided, ensuring that the process for each stage can be precisely executed.

[0184] S349. Determine several adjustment plans for the remaining coating stages according to the stage deviation amount and the deviation adjustment capacity;

[0185] Specifically, after determining the deviation adjustment capacity, in order to eliminate or reduce the process differences between coating stages, a specific adjustment plan is determined. This plan will tell the operating system how to allocate the adjustment amount to each stage. Based on the deviation amounts and adjustment capacities of different stages, multiple possible adjustment plans are designed. Each plan corresponds to a different adjustment strategy, which may involve changes in temperature, gas flow rate, and vacuum degree. Based on the existing process rules, adjustment capacity, and target deposition rate, multiple adjustment plans are calculated, and the system automatically selects the most suitable plan. By comparing multiple adjustment plans, the most suitable plan can be selected for process adjustment to minimize the deviation between each stage and ensure the coating quality.

[0186] S3410. Obtain the curve deviation degree between the remaining coating stages after being adjusted by the adjustment plan through weighted operation;

[0187] Specifically, after completing the adjustment of a certain stage, it is necessary to evaluate the process curves (such as temperature curve, gas flow rate curve, vacuum degree curve) of the remaining stages to ensure that the adjusted curves can minimize the deviation in subsequent stages. By performing weighted operations, the deviation degree between each stage is calculated, which can quantify the adjustment effect and help select the optimal adjustment plan. The weights can be based on the importance of the stage (for example, the initial stage has a greater impact on the film layer quality and can be given a higher weight) or the sensitivity of the process curve. Then, through the weighted average method, the comprehensive deviation degree of each plan is obtained.

[0188] S3411. Adjust one or more of the temperature control curve, gas rate control curve, and vacuum degree control curve in the remaining stages according to the adjustment plan with the smallest curve deviation degree;

[0189] After calculating the deviation of different adjustment plans, select the plan with the smallest deviation degree for actual operation to ensure the optimization of the process curve in the remaining stages, thereby reducing errors and achieving the expected film layer quality and performance. According to the optimal adjustment plan, adjust the process curve in the remaining stages. Specifically, it includes adjusting one or more of the temperature control curve, gas rate control curve, and vacuum degree control curve to ensure that the process parameters in each stage are close to the target requirements. While implementing the adjustment plan, continuously monitor the actual data to ensure the effective implementation of the adjusted parameters and promptly adjust any situation deviating from the target.

[0190] S3412. After all coating stages are completed, obtain the first coating.

[0191] This step marks the end of the coating process, aiming to ensure that through precise control of each stage, a uniform coating that meets the design requirements is finally formed. After this step is completed, the first coating will be formed on the surface of the LED lamp bead.

[0192] In summary, the SMD anti-sulfuration plant lamp and its preparation method provided by the embodiments of the present invention form a coating of aluminum oxide, silicon oxide, or silicon nitride with strong chemical stability on the surface of the LED lamp bead, effectively isolating the erosion of external sulfide gases, significantly improving the anti-sulfuration ability of the LED lamp bead, reducing the impact of the sulfuration reaction on the metal part of the lamp bead, and extending the service life of the lamp bead. The vacuum coating process can achieve uniform deposition of the coating, ensuring the same protection effect in each area on the surface of the LED lamp bead and avoiding the weak links caused by uneven manual coating of the traditional coating. By improving the anti-sulfuration ability and environmental resistance of the LED lamp bead, the present invention can effectively reduce the light decay of the lamp bead during long-term use, maintain a high light output efficiency, and improve the lighting effect of the plant lamp. Due to the excellent corrosion resistance and durability of the coating of the present invention, it can effectively prevent the penetration of corrosive substances in the environment and reduce the premature failure of the LED lamp bead due to environmental deterioration, thereby significantly extending the service life of the plant lamp. In summary, the present invention solves the problems of poor anti-sulfuration ability and uneven coating in the prior art by adopting the vacuum coating technology and high-quality coating materials, provides more reliable protection for the SMD plant lamp, and improves the stability and service life of the product.

[0193] It should be clear that the present invention is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present invention is not limited to the specific steps described and shown. Those skilled in the art can make various changes, modifications, and additions, or change the order between steps after understanding the spirit of the present invention.

[0194] The functional blocks shown in the structural block diagrams described above can be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application-specific integrated circuit (ASIC), appropriate firmware, a plug-in, a function card, and so on. When implemented in software, the elements of the present invention are programs or code segments used to perform the required tasks. The program or code segment can be stored in a machine-readable medium or transmitted via a data signal carried in a carrier wave on a transmission medium or a communication link. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical discs, hard disks, fiber optic media, radio frequency (RF) links, and so on. The code segment can be downloaded via a computer network such as the Internet, an intranet, etc.

[0195] It should also be noted that the exemplary embodiments mentioned in the present invention describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above steps. That is, the steps can be executed in the order mentioned in the embodiments, or different from the order in the embodiments, or several steps can be executed simultaneously.

[0196] As described above, the above is only the specific implementation manner of the present invention. Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules, and units described above can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated here. It should be understood that the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present invention.

Claims

1. A method for preparing an SMD anti-sulfurization plant lamp, characterized in that: The SMD anti-sulfur plant lamp includes: A plurality of LED lamp beads, wherein the LED lamp beads include a bracket and a light-emitting chip, the light-emitting chip is mounted on the bracket, and the light-emitting wavelengths of the light-emitting chips of different LED lamp beads are the same or different; The surface of the LED lamp bead is provided with a first coating by vacuum coating, the first coating has a first preset thickness, the material of the first coating is a combination of one or more of aluminum oxide, silicon oxide, or silicon nitride, a functional area is provided on the bracket, the functional area is provided with a second coating by vacuum coating, the second coating has a second preset thickness, a third coating is further provided on the surface of the first coating, the third coating has a third preset thickness, the first coating and the second coating are made of the same material, the first preset thickness is greater than the third preset thickness, and the second preset thickness is greater than the first preset thickness; The preparation method comprises: Cleaning the surface of the bracket and drying the cleaned bracket; Performing vacuum coating on the functional area of ​​the bracket to form a second coating having a second preset thickness; Fixing the light-emitting chip on the cleaned and dried bracket to obtain a plurality of LED lamp beads; Performing vacuum coating treatment on each of the LED lamp beads to form a first coating layer having a first preset thickness on the surface of the LED lamp beads, comprising: According to the material of the first coating, obtaining a target material for vacuum coating, wherein the target material is solid silicon dioxide particles; Placing the LED lamp beads and the target material at designated positions in the reaction chamber of the vacuum coating machine respectively; According to the target material corresponding to the first coating and the first preset thickness, vacuum coating parameters are obtained, wherein the vacuum coating parameters include: evaporation source temperature, target vacuum degree and gas filling rate, and the vacuum coating parameters are obtained by the following steps: According to the physicochemical properties of the target material and the first preset thickness, the vacuum coating process is divided into at least three coating stages, wherein the thickness growth amount and / or the target deposition speed are different in different coating stages; For each coating stage, obtaining a number of initial parameter combinations of the vacuum coating parameters that meet the corresponding target deposition rate; The coating stage with the largest thickness increase is taken as the benchmark stage; According to the preset screening rules, the initial parameter combination of the benchmark phase is screened to obtain the target parameter combination; Obtaining the degree of difference between the initial parameter combinations of the remaining coating stages and the target parameter combination of the reference stage; Determining target parameter combinations for the remaining coating stages according to the degree of difference; Determine vacuum coating parameters according to target parameter combinations of each coating stage; According to the vacuum coating parameters, the target material is evaporated to form a first coating on the surface of the LED lamp bead; When the thickness of the coating reaches a first preset thickness, the vacuum coating process is stopped and the LED lamp bead is cooled; Performing vacuum coating treatment on each of the LED lamp beads to form a third coating layer having a third preset thickness on the surface of the first coating layer; Each of the LED lamp beads is post-processed to obtain the SMD anti-sulfurization plant lamp.

2. The method for preparing the SMD anti-sulfurization plant lamp according to claim 1, characterized in that: The light emitting wavelength of the light emitting chip belongs to a preset wavelength range, which includes a combination of one or more of a first wavelength range of 360-410nm, a second wavelength range of 410-500nm, a third wavelength range of 500-600nm, a fourth wavelength range of 600-700nm and a fifth wavelength range of 700-1000nm.

3. The method for preparing the SMD anti-sulfurization plant lamp according to claim 1, characterized in that: The materials of the first coating layer and the second coating layer are silicon dioxide, and the material of the third coating layer is AF glue.

4. The method for preparing the SMD anti-sulfurization plant lamp according to claim 3, characterized in that: The LED lamp bead includes fluorescent powder, and the fluorescent powder is fluoride.

5. The method for preparing the SMD anti-sulfurization plant lamp according to claim 1, characterized in that: The first preset thickness is 100 nm, the second preset thickness is 300 nm, and the third preset thickness is 30 nm.

6. The method for preparing the SMD anti-sulfurization plant lamp according to claim 1, characterized in that: The step of obtaining vacuum coating parameters according to the target material corresponding to the first coating and the first preset thickness includes: Acquiring physical and chemical properties of a target material corresponding to the first coating, wherein the physical and chemical properties include: vapor pressure, melting point, and surface energy; According to the physical and chemical properties, the vacuum coating process is divided into at least three coating stages based on the first preset thickness, wherein the coating stages include an attachment stage, a growth stage, and a stabilization stage in sequence; Determine the thickness growth amount in the attachment stage and the growth stage according to the vapor pressure and the melting point, wherein the thickness growth amount in the attachment stage is negatively correlated with the vapor pressure and positively correlated with the melting point, and the thickness growth amount in the growth stage is negatively correlated with both the melting point and the vapor pressure; According to the melting point and the surface energy, the thickness growth amount in the stable stage is determined, which is positively correlated with the melting point and the surface energy; According to the thickness growth amount, the preset deposition speed of the corresponding coating stage is fine-tuned to obtain the target deposition speed.

7. The method for preparing the SMD anti-sulfurization plant lamp according to claim 6, characterized in that: The step of evaporating the target material according to the vacuum coating parameters to form a first coating on the surface of the LED lamp bead includes: Determining a function model according to the degree of difference between the evaporation source temperatures in each deposition stage, wherein the function model includes a linear function, an exponential function, and a polynomial function; According to the evaporation source temperature in each coating stage, curve fitting is performed through the function model to obtain a temperature control curve; Based on the temperature control curve, curve fitting is performed according to the target vacuum degree and gas filling rate of each coating stage to obtain a gas rate control curve and a vacuum degree control curve respectively; Performing vacuum coating treatment on the LED lamp beads according to the temperature control curve, the gas rate control curve and the vacuum degree control curve; Monitor the real-time data during the vacuum coating process, including temperature data, thickness data, vacuum degree data and gas flow data; In a coating stage, one or more of a temperature control curve, a gas rate control curve, and a vacuum control curve are adjusted by using the real-time data and a preset adaptive control algorithm; When a coating stage is finished, the real-time data of the stage is compared with the adjusted temperature control curve, gas rate control curve and vacuum control curve to obtain the stage deviation; Determine a corresponding deviation adjustment capacity according to the thickness growth amount and the target deposition rate of the remaining deposition stage, wherein the deviation adjustment capacity is positively correlated with the thickness growth amount and negatively correlated with the target deposition rate; Determining a plurality of adjustment schemes for each remaining coating stage according to the stage deviation amount and the deviation adjustment capacity; Obtaining, by weighted calculation, the curve deviation degree between the remaining coating stages after adjustment by the adjustment scheme; Adjust one or more of the temperature control curve, the gas rate control curve, and the vacuum control curve of the remaining stage according to the adjustment scheme with the smallest curve deviation; After all coating stages are completed, the first coating is obtained.

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