An ultra-low temperature and ultra-vacuum device for chip ion trap

Abstract

The present invention discloses an ultra-low temperature and ultra-vacuum device for chip ion traps, which relates to the fields of low temperature refrigeration and quantum computing, and includes an upper cover plate, a lower cover plate, a vacuum cover, a cold plate structure, and a working chamber. The upper cover plate, the lower cover plate, and the first sealing gasket cooperate to form a first sealing structure; the upper cover and the lower cover are respectively in seal contact with each other, and a second sealing structure is formed with the second sealing gasket. The refrigerator includes a first cold head and a second cold head, which extend to the first heat exchange cavity and the second heat exchange cavity, respectively, to provide cooling for the first cold plate and the second cold plate, respectively. The present invention realizes an ultra-high vacuum environment inside the device through the combination of the first sealing structure and the second sealing structure, and at the same time, a metal bellows and the upper cover plate are used to realize a soft connection design, and the isolation design of the first heat exchange cavity and the second heat exchange cavity is used to avoid the hard connection design of the cold head and the cold plate, thereby realizing a low-vibration ultra-low temperature and ultra-vacuum working environment for the chip ion trap.

Description

Technical Field

[0001] The invention relates to the fields of low-temperature refrigeration and quantum computing, and in particular to an ultra-low temperature and ultra-vacuum device applied to a chip ion trap. Background Art

[0002] Quantum mechanics, developed in the early 20th century, fundamentally changed humanity's understanding of the entire physical world. After more than a century of research, the predictions made by quantum mechanics have been verified by a large number of experiments. Many scientific and technological innovations and advances are based on the principles of quantum mechanics, and quantum information is a typical example. In 1982, after P. Benioff and R. Feynman proposed an idea to build a computer using the principles of quantum mechanics, people began to try to use various quantum systems to build quantum computers. After decades of development, quantum computing research has achieved many results, including research on quantum algorithms and research on the physical implementation of quantum computers. At present, there are many alternative options for information carriers of quantum computers, including photons, atoms in optical lattices, superconducting Josephson junctions, ion traps, nuclear spins, and quantum dots.

[0003] Quantum computers are much faster than traditional computers in some specific quantum algorithms. One of the more promising quantum computing solutions is the ion trap, which is a device that uses the interaction between electric charge and electromagnetic field to restrain the movement of charged particles. It is often used in atomic spectroscopy research to improve the accuracy of spectral measurements. There are two main types of new ion trap configurations. One is a three-dimensional chip ion trap with segmented electrodes similar to the structure of a macroscopic linear ion trap, called a three-dimensional chip ion trap. The other is an ion trap with electrodes distributed on the same surface, called a surface chip ion trap.

[0004] The design and processing of three-dimensional chip ion traps are relatively complex, but they can complete all the standard steps to achieve quantum computing. The surface chip ion trap uses a different design from the three-dimensional surface ion trap. The chip trap is a two-dimensional structure with all electrodes located on the same surface. In fact, this design is derived from the linear ion trap. The disadvantage of the chip trap structure is that its potential well depth is relatively shallow, but its light transmittance is very good and the processing technology is compatible with semiconductor processing technology. The manufacturing process is mature and the implementation is more convenient. Therefore, the chip trap has received widespread attention, and there are many research results in this area.

[0005] In order to study certain ions, the ion trap must usually be placed in an ultra-high vacuum (better than 5.0×10 -10On the other hand, the thermal motion of molecules is closely related to temperature. The lower the temperature, the less violent the molecular motion. In order to weaken the motion ability of the ions being studied, the ion trap must be placed in a low-temperature environment (less than 4.2 K). That is, a low-temperature ultra-high vacuum environment is essential for the ion trap device. Summary of the invention

[0006] The present invention is proposed to alleviate or solve at least one aspect or at least one point of the above problems.

[0007] An ultra-low temperature ultra-vacuum device applied to a chip ion trap of the present invention comprises an upper cover plate, a lower cover plate is arranged below the upper cover plate, a vacuum cover is connected below the lower cover plate, and N first windows are arranged on the outer circumference of the vacuum cover;

[0008] The upper cover plate is connected with a refrigerator, a first pipeline, a second pipeline, a third pipeline, a first adapter plate, and a first fastening bolt. The upper side ring of the outer circumference of the upper cover plate is provided with a first upward protrusion, and the lower side ring is provided with a first groove;

[0009] The upper cover plate is in contact with the lower cover plate, the lower side ring of the outer circumference of the lower cover plate is provided with a second downward protrusion, and the upper side ring is provided with a second groove;

[0010] The second groove and the first groove form a first sealing groove, and the first sealing groove cooperates with the first sealing gasket to form a first sealing structure;

[0011] The upper cover plate and the lower cover plate are respectively in contact with the sealing ring, and the upper ring of the sealing ring is provided with a third groove, and the third groove cooperates with the second sealing gasket to form a second sealing structure;

[0012] The upper cover plate, the lower cover plate and the vacuum cover form a closed space, and a cold plate structure is arranged in the closed space. The cold plate structure includes a first cold plate and a second cold plate, and the second cold plate is detachably connected to the working chamber;

[0013] The working chamber comprises a chamber wall, the chamber wall forms a closed vacuum structure, N second windows are arranged on the outer surface of the chamber wall, and a chip ion trap workbench is arranged inside the chamber wall;

[0014] In the enclosed space, the lower cover plate and the first cold plate form a first cavity, the first cold plate and the second cold plate form a second cavity, and the second cold plate and the vacuum cover form a third cavity;

[0015] A first heat exchange cavity is disposed in the first cavity, and a second heat exchange cavity is disposed in the second cavity;

[0016] The refrigerator comprises a first cold head and a second cold head, wherein the first cold head extends into the first heat exchange cavity, and the second cold head extends into the second heat exchange cavity.

[0017] Preferably, the first sealing gasket is a metal sealing ring, comprising a body, a positioning ring is arranged on the body, a third protrusion is arranged on the head of the body, and the first sealing groove is formed with a groove matching the first sealing gasket;

[0018] Preferably, the sealing ring includes a first sealing ring and a second sealing ring, which are symmetrically arranged, and a third bolt hole and a fourth bolt hole are arranged on the outer circumference of the sealing ring. The third bolt hole and the fourth bolt hole are symmetrically distributed on the outer circumferential surface of the sealing ring, and a fourth groove is arranged at the center of the inner circumferential surface of the sealing ring, and a third groove is arranged at the center of the fourth groove, and the width of the third groove is greater than the depth.

[0019] Preferably, the second sealing gasket includes a solid ring body, a spring is wound on the outer circumference of the solid ring body, the outer side of the spring is coated with a plating layer, the upper cover plate and the lower cover plate are abutted, the first guide surface and the second guide surface are abutted with the extrusion surface, and the outer circumferential surface of the upper cover plate and the lower cover plate and the third groove form a structure matching the second sealing gasket.

[0020] Preferably, the refrigerator includes a first connecting part, the first connecting part is connected to the upper cover plate, the first heat exchange cavity is provided with a first heat conducting part around the outer circumference of the bottom, the first heat conducting part is connected to a first heat exchange plate on its outer circumference, the lower part of the first heat exchange plate abuts against the first cold plate, the second heat exchange cavity is provided with a second heat conducting part around the outer circumference of the bottom, the second heat conducting part is connected to a second heat exchange plate on its outer circumference, the lower part of the second heat exchange plate abuts against the second cold plate.

[0021] Preferably, the first heat exchange chamber is a closed structure, the second cold head penetrates the bottom plate of the first heat exchange chamber, the second heat exchange chamber is a closed structure, the first heat exchange chamber and the second heat exchange chamber are filled with helium, and a through hole begins to be formed on the first cold plate, and the diameter of the through hole is larger than the outer circumference diameter of the second heat exchange chamber.

[0022] Preferably, the working chamber is fixed on the lower surface of the second cold plate, a third heat conducting part is arranged on the upper surface of the working chamber, an upper end surface of the third heat conducting part abuts against the lower surface of the second cold plate, and a second adapter plate is arranged on the side surface of the chamber wall.

[0023] Preferably, the chip ion trap workbench includes a base, one surface of the base is provided with more than two radio frequency (RF) electrodes and more than one pair of direct current (DC) electrodes, the two radio frequency (RF) electrodes are formed with holes, the other surface of the base is connected to a third heat conducting portion penetrating through the top surface of the chamber wall, a connecting column is provided on the upper surface of the chamber wall, and the connecting column connects the chamber wall to the second cold plate.

[0024] Preferably, the axes of the first window and the second window coincide, and the axis of the hole groove can pass through one of the second windows and the first window in sequence. The first window and the second window are used to project laser into the working chamber, and the remaining first windows and the second windows are used as objective lens windows to display the working status in the working chamber.

[0025] Preferably, the refrigerator is a pulse tube refrigerator, the first pipeline is connected to the vacuum pump, the second pipeline is connected to the first helium storage device, the third pipeline is connected to the second helium storage device, the first adapter plate is connected to the external power supply and signal source, and the first fastening bolt ring is arranged on the upper cover plate to lock the upper cover plate and the lower cover plate.

[0026] The present invention provides an ultra-low temperature and ultra-vacuum device for a chip ion trap.

[0027] Through the combination of the first sealing structure and the second sealing structure, an ultra-high vacuum environment is achieved inside the device. At the same time, a low-vibration pulse tube refrigerator is used for cooling, and a metal bellows is used to achieve a soft connection with the upper cover plate. The isolated first heat exchange chamber and the second heat exchange chamber are designed and connected to an external helium storage device, respectively, which is conducive to achieving an operating temperature of 50K for the first cold plate and 4K for the second cold plate. In the present invention, a hard connection between the cold head and the cold plate is avoided, thereby providing a low-vibration ultra-low temperature and ultra-vacuum working environment for the chip ion trap. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a three-dimensional schematic diagram of an ultra-low temperature and ultra-vacuum device applied to a chip ion trap according to an exemplary embodiment of the present invention;

[0029] Figure 2 A front view of an ultra-low temperature and ultra-vacuum device applied to a chip ion trap according to an exemplary embodiment of the present invention;

[0030] Figure 3 A top view of an ultra-low temperature and ultra-vacuum device applied to a chip ion trap according to an exemplary embodiment of the present invention;

[0031] Figure 4 It is a schematic assembly diagram of an ultra-low temperature and ultra-vacuum device applied to a chip ion trap according to an exemplary embodiment of the present invention, with the vacuum cover and the lower cover plate removed;

[0032] Figure 5 It is a schematic assembly diagram of an ultra-low temperature and ultra-vacuum device applied to a chip ion trap according to an exemplary embodiment of the present invention, with the second sealing ring removed;

[0033] Figure 6 It is a schematic diagram of assembling an upper cover plate, a lower cover plate and a first metal gasket of an ultra-low temperature and ultra-vacuum device applied to a chip ion trap according to an exemplary embodiment of the present invention;

[0034] Figure 7 It is a bottom view of an upper cover plate, a lower cover plate and a first sealing gasket of an ultra-low temperature ultra-vacuum device applied to a chip ion trap according to an exemplary embodiment of the present invention after being assembled;

[0035] Figure 8 for Figure 7 Sectional view at AA;

[0036] Fig. 9 for Figure 8 A local schematic diagram of location I;

[0037] Fig.10 A top view of an upper cover plate, a lower cover plate, a second sealing gasket and a sealing ring after being assembled according to an exemplary embodiment of the present invention;

[0038] Fig.11 for Fig.10 Cross-sectional view at BB;

[0039] Fig.12 for Fig.11 A partial schematic diagram of location II;

[0040] Fig.13 It is a left side view of a second sealing gasket according to an exemplary embodiment of the present invention;

[0041] Fig.14 for Fig.13 Sectional view at CC of ;

[0042] Fig.15 for Fig.14 A partial schematic diagram of location III;

[0043] Fig.16 A schematic diagram of removing the plating layer from the second sealing gasket according to an exemplary embodiment of the present invention;

[0044] Fig.17 It is a left side view of a first sealing gasket according to an exemplary embodiment of the present invention;

[0045] Fig.18 for Fig.17 Cross-sectional view at DD;

[0046] Fig.19 for Fig.18 A partial schematic diagram of IV;

[0047] Fig. 20 It is a schematic diagram of assembling a cold plate, an upper cover plate, a lower cover plate and a refrigerator according to an exemplary embodiment of the present invention;

[0048] Fig.21 It is a schematic assembly diagram of a refrigerator, a first heat exchange chamber, and a second heat exchange chamber according to an exemplary embodiment of the present invention;

[0049] Fig. 22 It is a schematic diagram of assembling a refrigerator and a first heat exchange chamber according to an exemplary embodiment of the present invention;

[0050] Fig.23 A front view of a refrigerator according to an exemplary embodiment of the present invention;

[0051] Fig.24 is a perspective view of a working chamber according to an exemplary embodiment of the present invention;

[0052] Fig.25 A half-section view of a working chamber according to an exemplary embodiment of the present invention;

[0053] Fig.26 A three-dimensional diagram of a chip ion trap workbench according to an exemplary embodiment of the present invention;

[0054] Fig. 27 is a front view of a sealing ring according to an exemplary embodiment of the present invention;

[0055] Fig.28 is a three-dimensional diagram of an upper cover plate according to an exemplary embodiment of the present invention;

[0056] Fig.29 is a three-dimensional diagram of a lower cover plate according to an exemplary embodiment of the present invention;

[0057] Fig.30 It is a three-dimensional diagram of a first heat exchange fin according to an exemplary embodiment of the present invention.

[0058] in:

[0059] 1-upper cover, 12-first pipe, 13-second pipe, 14-third pipe, 15-first adapter plate, 16-first fastening bolt, 17-first protrusion, 171-first guide surface, 18-first groove, 19-first bolt hole;

[0060] 2-lower cover plate, 21-second bolt hole, 22-second protrusion, 221-second guide surface, 28-second groove;

[0061] 3-vacuum cover, 31-first window;

[0062] 4-first sealing gasket, 41-positioning ring, 42-third protrusion, 43-body;

[0063] 5-cold plate structure, 51-first cold plate, 52-second cold plate, 53-through hole, 56-first heat exchange fin, 57-second heat exchange fin;

[0064] 6-working chamber, 61-second window, 62-chamber wall, 63-second adapter plate, 64-connecting column, 65-third heat conducting part;

[0065] 7-chip ion trap workbench, 71-base, 72-RF electrode, 73-DC electrode, 74-hole slot;

[0066] 8-refrigeration machine, 81-first connection part, 82-first cold head, 83-second cold head, 84-first heat exchange chamber,

[0067] 85-second heat exchange cavity, 86-first heat transfer part, 87-second heat transfer part;

[0068] 9-sealing ring, 92-third groove, 93-second sealing gasket, 931-solid ring body, 932-spring, 933-plating, 94-third bolt hole, 95-fourth bolt hole, 96-extrusion surface, 97-fourth groove, 98-first sealing ring, 99-second sealing ring. DETAILED DESCRIPTION

[0069] The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the overall inventive concept of the present invention, and should not be construed as a limitation of the present invention. In the present invention, the same reference numerals represent the same or similar components.

[0070] The features described herein can be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided to illustrate only some of the many possible ways to implement the methods, devices, and / or systems described herein, which will be clear after understanding the disclosure of the present invention.

[0071] Although terms such as "first", "second", and "third" may be used herein to describe various members, components, regions, layers, or portions, these members, components, regions, layers, or portions should not be limited by these terms. Instead, these terms are only used to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion.

[0072] In the specification, when an element (such as a layer, a region, or a substrate) is described as being “on”, “connected to”, or “coupled to” another element, the element may be directly “on”, “connected to”, or “coupled to” another element, or one or more other elements may be present therebetween. Conversely, when an element is described as being “directly on”, “directly connected to”, or “directly coupled to” another element, there may be no other elements present therebetween.

[0073] The terms used herein are only used to describe various examples and are not intended to limit the disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms "comprise", "include" and "have" indicate the presence of the described features, quantities, operations, components, elements and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements and / or combinations thereof.

[0074] In order to enable those skilled in the art to use the contents of the present invention, the following exemplary embodiments may be provided in combination with specific application scenarios, specific systems, parameters of devices and components, and specific connection methods. However, for those skilled in the art, these embodiments are only examples, and the general principles defined herein may be applied to other embodiments and application scenarios without departing from the spirit and scope of the present invention.

[0075] According to an exemplary embodiment of the present invention, Figure 1 , 3 As shown in Figure 20, an ultra-low temperature and ultra-vacuum device applied to a chip ion trap includes an upper cover plate 1, to which a pulse tube refrigerator 8 is connected, the pulse tube refrigerator 8 provides a cold source required for a low temperature environment for the chip ion trap to work, the refrigerator 8 includes a first connecting portion 81, the first connecting portion 81 is a metal bellows, the metal bellows can absorb the vibration of the pulse tube refrigerator 8, and reduce the impact on the chip ion trap, the metal bellows is welded to the upper cover plate 1; the first pipeline 12 is connected to a vacuum pump, the vacuum pump includes a molecular pump for first-level vacuum extraction and an ion pump for second-level vacuum extraction; the second pipeline 13 is connected to a first helium storage device to provide helium to a first heat exchange chamber 84, the third pipeline 14 is connected to a second helium storage device to provide helium to a second heat exchange chamber 85; a plurality of connectors are arranged on the first adapter plate 15, and the connectors are used to connect an external power supply and a signal source.

[0076] like Figure 3 , 5 As shown in -9, 17-19, 27-29, the upper side ring of the outer circumference of the upper cover plate 1 is provided with an upward first protrusion 17, and the lower side ring is provided with a first groove 18; the lower side ring of the outer circumference of the lower cover plate 2 is provided with a downward second protrusion 22, and the upper side ring is provided with a second groove 28, the upper cover plate 1 and the lower cover plate 2 are abutted together, and the first groove 18 and the second groove 28 form a first annular sealing groove;

[0077] The first sealing gasket 4 is a metal gasket, including a main body 43, on which a positioning ring 41 is arranged, and the positioning ring 41 ensures that the axis of the first sealing gasket 4 coincides with the upper cover plate 1 without deviation, thereby ensuring the sealing effect, and the head of the main body 43 is a wedge-shaped third protrusion 42, and the first sealing groove is formed with a groove matching the first sealing gasket 4, and the depth of the groove is less than the height of the third protrusion 42.

[0078] The first fastening bolt 16 is arranged on the upper cover plate 1 to lock the upper cover plate 1, the lower cover plate 2 and the first sealing gasket 4, and form a first sealing structure with the first sealing groove;

[0079] The sealing methods of vacuum devices are mainly divided into rubber seals or metal seals. The rubber gaskets used for rubber seals are not only low in cost, but also have better reliability in vacuum sealing. However, the rubber material has a high degassing rate and a strong permeation effect, and may become the main gas source in ultra-high vacuum systems. In addition, rubber gaskets are prone to sealing failure in high and low temperature environments. The acquisition of ultra-high vacuum usually requires baking the system to above 200°C to accelerate the desorption of gas and moisture attached to the wall of the vacuum chamber, while rubber gaskets cannot withstand such high temperatures. Metal seals have a lower leakage rate, and metal gaskets have a low degassing rate, are radiation-resistant, and are resistant to high and ultra-low temperature environments. Therefore, the first sealing gasket 4 of the present invention adopts a sealing gasket to ensure the realization of an ultra-vacuum working environment.

[0080] like Figure 1 , 5 As shown in Figures 16, 19 and 27-29, the sealing ring 9 includes a first sealing ring 98 and a second sealing ring 99. The first sealing ring 98 and the second sealing ring 99 are symmetrical structures and are abutted together to form a complete sealing ring 9. A fourth groove 97 is arranged at the center of the inner circumference of the sealing ring 9. A third groove 92 is arranged at the center of the fourth groove 97. The width of the third groove 92 is greater than its depth. A third bolt hole 94 and a fourth bolt hole 95 are arranged on the outer circumference of the sealing ring 9. The third bolt hole 94 and the fourth bolt hole 95 are symmetrically distributed on the outer circumference of the sealing ring 9.

[0081] When the first sealing structure is formed, the upper cover plate 1 and the lower cover plate 2 are respectively in contact with the sealing ring 9, and the third groove 92 and the outer circumferential surfaces of the upper cover plate 1 and the lower cover plate 2 form a second sealing groove;

[0082] The second sealing gasket 93 includes a solid ring body 931 located in the center of the gasket. The material of the solid ring body 931 is a hard metal layer for dispersing the discrete rotational force transmitted from the spring. A spring 932 is wound around the outer circumference of the solid ring body 931. The spring 932 is an annular spiral spring welded end to end to provide ultra-high rebound characteristics. The outside of the spring 932 is coated with a coating 933. The coating 933 is a soft metal coating, such as aluminum, copper or silver, for blocking the leakage channel to achieve sealing.

[0083] The upper cover plate 1 and the lower cover plate 2 are abutted, the first sealing ring 98 and the second sealing ring 99 are closed, the outer circumferential surfaces of the upper cover plate 1 and the lower cover plate 2 extend into the fourth groove 97, the first guide surface 171 and the second guide surface 221 are abutted against the extrusion surface 96, and bolts are used to pass through the third bolt holes 94 and the first bolt holes 19 to fix the sealing ring 9 to the upper cover plate 1, and bolts are used to pass through the fourth bolt holes 95 and the second bolt holes 21 to fix the sealing ring 9 to the lower cover plate 2. Under the guidance of the first guide surface 171 and the second guide surface 221, the sealing ring 9 and the upper cover plate 1 and the lower cover plate 2 are fastened and connected. At this time, the outer circumferential surfaces of the upper cover plate 1 and the lower cover plate 2 and the third groove 92 form a second sealing groove matching the second sealing gasket 93, and the second sealing groove and the second sealing gasket 93 cooperate to form a second sealing structure.

[0084] like Figure 1 , 4 As shown in , 20-23 and 30, the lower cover plate 2 is fixed to the vacuum cover 3 by welding, and the upper cover plate 1, the lower cover plate 2 and the vacuum cover 3 form an enclosed space. A cold plate structure 5 is arranged in the enclosed space. The cold plate structure 5 includes a first cold plate 51 and a second cold plate 52, and the refrigerator 8 includes a first cold head 82 and a second cold head 83.

[0085] In the closed space, the lower cover plate 2 and the first cold plate 51 form a first cavity, a first heat exchange cavity 84 is provided in the first cavity, and the first cold head 82 extends into the first heat exchange cavity 84;

[0086] The first heat exchange cavity 84 is a closed structure of a cylindrical hollow cavity, which is filled with helium. A first annular heat conducting portion 86 is arranged around the outer circumference of the bottom. The inner circumference of the first heat conducting portion 86 contacts the helium. A plurality of first heat exchange fins 56 are connected to the outer circumference at equal intervals. The lower part of the first heat exchange fins 56 abuts against the first cold plate 51.

[0087] The circumferential diameter of the inner arc surface of the upper part of the first heat exchange plate 56 is the same as the diameter of the outer circumference of the first heat conducting part 86, which can achieve a good fit and ensure good heat exchange efficiency. The lower surface of the lower part is a plane, which can achieve a good fit with the first cold plate 51, ensuring good heat exchange efficiency and enabling the first cold plate 51 to reach an operating temperature of 50K.

[0088] like Figure 1 , 4, 20-23 and 30, the first cold plate 51 and the second cold plate 52 form a second cavity, and a second heat exchange cavity 85 is arranged in the second cavity. The second heat exchange cavity 85 is a closed structure of a cylindrical hollow cavity filled with helium. The bottom plate of the first heat exchange cavity 84 separates the first heat exchange cavity 84 from the second heat exchange cavity 85. The second cold head 83 penetrates the bottom plate of the first heat exchange cavity 84 and extends into the second heat exchange cavity 85. The first cold plate 51 is provided with a through hole 53 with a diameter larger than the outer circumference diameter of the second heat exchange cavity 85 to avoid the second heat exchange cavity 85 from being blocked. The hot cavity 85 is rigidly connected to the first cold plate 51 to transmit vibrations. A second annular heat conducting portion 87 is provided on the outer circumference of the bottom of the second heat exchange cavity 85. The inner circumference of the second heat conducting portion 87 is in contact with the helium. A number of second heat exchange fins 57 are equidistantly connected on the outer circumference. The lower portion of the second heat exchange fins 57 abuts against the second cold plate 52. The second heat exchange fins 57 have the same structure as the first heat exchange fins 56 and can fit well with the second cold plate 52, thereby ensuring good heat exchange efficiency and enabling the second cold plate 52 to reach an operating temperature of 4K.

[0089] Exemplarily, the first heat exchange fin 56 and the second heat exchange fin 57 are copper braids, which have high thermal conductivity and shock absorption, thereby preventing the vibration of the refrigerator from being transmitted to the cold plate through the first heat exchange cavity 84 and the second heat exchange cavity 85.

[0090] like Figure 1 , 2 , 4, 20 and 24-26, the second cold plate 52 and the vacuum cover 3 form a third cavity, the lower surface of the second cold plate 52 is detachably connected to the working chamber 6, the working chamber 6 includes a chamber wall 62, the chamber wall 62 forms a closed vacuum structure, and a chip ion trap workbench 7 is arranged inside;

[0091] Exemplarily, a connecting column 64 is provided on the upper surface of the chamber wall 62, a threaded hole is provided on the connecting column 64, a bolt passes through the second cold plate 52 and is screwed on the connecting column 64, and the working chamber 6 is fixed on the lower surface of the second cold plate 52, a third heat conducting part 65 is provided on the upper surface of the working chamber 6, and the upper end surface of the third heat conducting part 65 abuts against the lower surface of the second cold plate 52, and a chip ion trap workbench 7 is provided inside the working chamber 6;

[0092] The chip ion trap workbench 7 includes a base 71, one surface of which is provided with at least two RF electrodes 72 arranged in parallel along the axial direction, and one or more DC electrodes 73 are provided on both sides of the RF electrodes 72. The two RF electrodes 72 are formed with hole grooves 74. The other surface of the base 71 is connected to the third heat conducting part 65 penetrating the top surface of the chamber wall 62.

[0093] A second adapter plate 63 is disposed on the side of the chamber wall 62 ; a plurality of connectors are disposed on the second adapter plate 63 , and the connectors are used to connect to an external power source and a signal source.

[0094] Exemplarily, the vacuum cover 3 is cylindrical, and N first windows 31 are arranged on the outer circumference; the chamber wall 62 is a hexagonal cylindrical cavity, and N second windows 61 are arranged on the outer surface of the chamber wall 62, and the second window 61 is located at the center of the second adapter plate 63. The first window 31 and the second window 61 are arranged correspondingly, and the axes of the first window 31 and the second window 61 coincide with each other. The axis of the hole groove 74 can pass through one of the second windows 61 and the first window 31 in sequence. The first window 31 and the second window 61 are used to project laser into the working chamber 6, and the remaining first windows 31 and the second window 61 are used as objective mirror windows to display the working status in the working chamber 6.

[0095] Working principle:

[0096] First, the chip ion trap workbench 7 is placed in the working chamber 6, and the working chamber 6 is vacuumed to make the vacuum degree in the working chamber 6 reach ultra-high vacuum (better than 5.0×10 -10 Pa) environment, then fix the working chamber 6 on the lower surface of the second cold plate 52 of the cold plate structure 5, and then put the cold plate structure 5 into the vacuum cover 3. At this time, assemble the upper cover plate 1, the lower cover plate 2 and the first sealing gasket 4, and fasten them with the first fastening bolts 16 to form a first sealing structure;

[0097] Then, the first sealing ring 98 and the second sealing ring 99 are spliced ​​together, and bolts are passed through the third bolt holes 94 and the fourth bolt holes 95 to fix the upper cover plate 1, the lower cover plate 2 and the second sealing gasket 93 in the fourth groove 97. The outer circumferential surfaces of the third groove 92, the second sealing gasket 93, the upper cover plate 1 and the lower cover plate 2 form a second sealing structure.

[0098] Turn on the vacuum pump and extract the air from the device through the first pipe 12 to achieve an ultra-high vacuum degree (better than 5.0×10 -10 Pa) environment, start the refrigerator 8 for cooling, the cold energy of the first cold head 82 is transferred to the first heat conducting part 86 through the helium in the first heat exchange cavity 84, and the first heat conducting part 86 transfers the cold energy to the first cold plate 51 through the first heat exchange fin 56, so that the first cold plate 51 reaches the working temperature of 50K; the cold energy of the second cold head 83 is transferred to the second heat conducting part 87 through the helium in the second heat exchange cavity 85, and the second heat conducting part 87 transfers the cold energy to the second cold plate 52 through the second heat exchange fin 57, so that the second cold plate 52 reaches the working temperature of 4K. At this time, the laser is used to shoot into the hole slot 74 through the first window 31 and the second window 61 to perform ion operation.

[0099] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes may be made to the embodiments and combinations of elements may be made without departing from the principles and spirit of the invention, the scope of the invention being defined by the appended claims and their equivalents.

Claims

1. An ultra-low temperature and ultra-vacuum device for chip ion trap, characterized in that: It comprises an upper cover plate (1), a lower cover plate (2) is arranged below the upper cover plate (1), a vacuum cover (3) is connected below the lower cover plate (2), and N first windows (31) are arranged on the outer circumference of the vacuum cover (3); The upper cover plate (1) is connected to a refrigerator (8), a first pipeline (12), a second pipeline (13), a third pipeline (14), a first adapter plate (15), and a first fastening bolt (16); an upper ring of an outer circumference of the upper cover plate (1) is provided with a first upward protrusion (17), and a lower ring is provided with a first groove (18); The upper cover plate (1) is in contact with the lower cover plate (2); a second protrusion (22) is provided on the lower side ring of the outer circumference of the lower cover plate (2); and a second groove (28) is provided on the upper side ring; The second groove (28) and the first groove (18) form a first sealing groove, and the first sealing groove cooperates with the first sealing gasket (4) to form a first sealing structure; The upper cover plate (1) and the lower cover plate (2) are respectively in contact with the sealing ring (9); the upper ring of the sealing ring (9) is provided with a third groove (92); the third groove (92) cooperates with the second sealing gasket (93) to form a second sealing structure; An enclosed space is formed by the upper cover plate (1), the lower cover plate (2) and the vacuum cover (3), and a cold plate structure (5) is arranged in the enclosed space. The cold plate structure comprises a first cold plate (51) and a second cold plate (52), and the second cold plate (52) is detachably connected to a working chamber (6); The working chamber (6) comprises a chamber wall (62), the chamber wall (62) forms a closed vacuum structure, N second windows (61) are arranged on the outer surface of the chamber wall (62), and a chip ion trap workbench (7) is arranged inside the chamber wall (62); In the enclosed space, the lower cover plate (2) and the first cold plate (51) form a first cavity, the first cold plate (51) and the second cold plate (52) form a second cavity, and the second cold plate (52) and the vacuum cover (3) form a third cavity; A first heat exchange cavity (84) is disposed in the first cavity, and a second heat exchange cavity (85) is disposed in the second cavity; The refrigerator (8) comprises a first cold head (82) and a second cold head (83), wherein the first cold head (82) extends into the first heat exchange cavity (84), and the second cold head (83) extends into the second heat exchange cavity (85).

2. The ultra-low temperature and ultra-vacuum device for chip ion trap according to claim 1, characterized in that: The first sealing gasket (4) is a metal sealing ring, comprising a body (43), a positioning ring (41) being arranged on the body (43), a third protrusion (42) being arranged at the head of the body (43), and the first sealing groove being formed with a groove matching the first sealing gasket (4).

3. The ultra-low temperature and ultra-vacuum device for chip ion trap according to claim 2, characterized in that: The sealing ring (9) comprises a first sealing ring (98) and a second sealing ring (99), which are symmetrically arranged. A third bolt hole (94) and a fourth bolt hole (95) are arranged on the outer circumference of the sealing ring (9). The third bolt hole (94) and the fourth bolt hole (95) are symmetrically distributed on the outer circumferential surface of the sealing ring (9). A fourth groove (97) is arranged at the center of the inner circumferential surface of the sealing ring (9). A third groove (92) is arranged at the center of the fourth groove (97). The width of the third groove (92) is greater than its depth.

4. The ultra-low temperature and ultra-vacuum device for chip ion trap according to claim 2, characterized in that: The second sealing gasket (93) comprises a solid ring body (931), a spring (932) is wound on the outer circumference of the solid ring body (931), the outer surface of the spring (932) is coated with a coating (933), the upper cover plate (1) and the lower cover plate (2) are in abutment with each other, the first guide surface (171) and the second guide surface (221) are in abutment with the extrusion surface (96), and the outer circumferential surfaces of the upper cover plate (1) and the lower cover plate (2) and the third groove (92) form a structure matching the second sealing gasket (93).

5. The ultra-low temperature and ultra-vacuum device for chip ion trap according to claim 3, characterized in that: The refrigerator (8) comprises a first connection portion (81), the first connection portion (81) being connected to the upper cover plate (1); a first heat-conducting portion (86) being provided around the outer circumference of the bottom of the first heat-exchange cavity (84); a first heat-exchange fin (56) being connected to the outer circumference of the first heat-conducting portion (86); a lower portion of the first heat-exchange fin (56) abutting against the first cold plate (51); a second heat-conducting portion (87) being provided around the outer circumference of the bottom of the second heat-exchange cavity (85); a second heat-exchange fin (57) being connected to the outer circumference of the second heat-conducting portion (87); a lower portion of the second heat-exchange fin (57) abutting against the second cold plate (52).

6. The ultra-low temperature and ultra-vacuum device for chip ion trap according to claim 3, characterized in that: The first heat exchange chamber (84) is a sealed structure, the second cold head (83) penetrates the bottom plate of the first heat exchange chamber (84), the second heat exchange chamber (85) is a sealed structure, the first heat exchange chamber (84) and the second heat exchange chamber (85) are filled with helium, and a through hole (53) is initially formed on the first cold plate (51), and the diameter of the through hole (53) is larger than the outer circumference diameter of the second heat exchange chamber (85).

7. The ultra-low temperature and ultra-vacuum device for chip ion trap according to claim 1, characterized in that: The working chamber (6) is fixedly mounted on the lower surface of the second cold plate (52), a third heat conducting portion (65) is arranged on the upper surface of the working chamber (6), an upper end surface of the third heat conducting portion (65) is in contact with the lower surface of the second cold plate (52), and a second adapter plate (63) is arranged on the side surface of the chamber wall (62).

8. The ultra-low temperature and ultra-vacuum device for chip ion trap according to claim 1, characterized in that: The chip ion trap workbench (7) comprises a base (71), one surface of which is provided with two or more radio frequency (RF) electrodes (72) and one or more direct current (DC) electrodes (73), the two radio frequency (RF) electrodes (72) being provided with hole grooves (74), the other surface of the base (71) being connected to a third heat conducting portion (65) penetrating the top surface of a chamber wall (62), a connecting column (64) being provided on the upper surface of the chamber wall (62), the connecting column (64) connecting the chamber wall (62) to a second cold plate (52).

9. The ultra-low temperature and ultra-vacuum device for chip ion trap according to claim 8, characterized in that: The axes of the first window (31) and the second window (61) coincide with each other, and the axis of the hole groove (74) can sequentially pass through one of the second windows (61) and the first window (31). The first window (31) and the second window (61) are used to project laser light into the working chamber (6), and the remaining first windows (31) and the second windows (61) are used as objective lenses to display the working status in the working chamber (6).

10. The ultra-low temperature and ultra-vacuum device for chip ion trap according to claim 1, characterized in that: The refrigerator (8) is a pulse tube refrigerator, the first pipeline (12) is connected to a vacuum pump, the second pipeline (13) is connected to a first helium storage device, the third pipeline (14) is connected to a second helium storage device, the first adapter plate (15) is connected to an external power source and a signal source, and the first fastening bolt (16) is arranged on the upper cover plate (1) to lock the upper cover plate (1) and the lower cover plate (2).

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