Chip cold solder joint detection device

Abstract

The invention provides a chip pseudo soldering detection device, belongs to the technical field of detection devices, and mainly aims to solve the problem of low comprehensiveness of pin pseudo soldering problem detection in chip pseudo soldering by the existing detection device, and the chip pseudo soldering detection device comprises a detection shell which is internally provided with a vibration cavity, a visual detection cavity and a thermal imaging detection cavity in sequence along the horizontal direction, a control cavity is formed in the end, close to the vibration cavity, of the detection shell, a control assembly is arranged in the control cavity, a vibration assembly is arranged in the vibration cavity, a chip frame is arranged on the top of the vibration assembly, a visual detection assembly is arranged in the visual detection cavity, a thermal imager is arranged in the thermal imaging detection cavity, and three sets of laser transmitting tubes are arranged in the detection shell. The same movable conveying assembly is arranged at the bottoms of the two first guide rails. The chip is subjected to vibration operation through the vibration assembly, and then the pins of the chip are subjected to visual detection and thermal imaging detection through the visual detection assembly and the thermal imager, so that the detection comprehensiveness is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of detection devices, and more specifically, particularly relates to a chip cold solder joint detection device. Background Art

[0002] With the continuous development of electronic technology, integrated circuit chips, as the core components of electronic products, have been widely used in communications, consumer electronics, industrial control and other fields. When the chip is welded, cold solder joints often occur. Pin cold solder joints are a common defect in chip cold solder joints. They are mainly caused by improper welding process or environmental factors that lead to the inability to reliably connect the pins and the pads. When performing detection, traditional detection devices have low comprehensiveness in detecting pin cold solder joints in chip cold solder joints, and traditional detection devices are less convenient to use. Summary of the invention

[0003] In order to solve the above technical problems, the present invention provides a chip cold solder joint detection device to solve the technical problems in the prior art that the traditional detection device has low comprehensiveness in detecting the pin cold solder joint problem in the chip cold solder joint during detection, and the traditional detection device is less convenient to use.

[0004] The purpose and effect of a chip cold solder joint detection device of the present invention are achieved by the following specific technical means: A chip cold solder joint detection device comprises a detection shell, wherein a vibration cavity, a visual detection cavity and a thermal imaging detection cavity are sequentially opened in the detection shell in the horizontal direction, a control cavity is opened at one end of the detection shell close to the vibration cavity, a control component is arranged in the control cavity, a vibration component is arranged in the vibration cavity, a chip frame is arranged on the top of the vibration component, a chip body to be detected is arranged in the chip frame, a visual detection component is arranged in the visual detection cavity, a thermal imager is arranged in the thermal imaging detection cavity, three groups of laser emitting tubes are arranged in the detection shell, two groups of first guide rails are passed through one side of the detection shell, the same group of movable conveying components are arranged at the bottom of the two groups of first guide rails, the conveying component comprises a conveying plate and a laser receiving tube, and the conveying plate and the laser emitting tube are both arranged above the vibration component.

[0005] As a further solution of the present invention, a vibration table is provided at the bottom of the vibration cavity, a vibration groove is provided at the top of the vibration table, four groups of vibration columns and four groups of vibration motors are provided in the vibration groove, the four groups of vibration columns and the four groups of vibration motors are arranged in sequence in a ring shape, the same group of vibration plates are provided on the top of the four groups of vibration columns, a vibration placement piece is provided on the top of the vibration plate, and the chip frame is provided in the vibration placement piece.

[0006] As a further solution of the present invention, the four groups of vibration columns are respectively arranged on the inner sides of the four groups of vibration motors, four groups of vibration planes are respectively opened on one side of the four groups of vibration columns, the four groups of vibration planes are respectively facing the four groups of vibration motors, the vibration ends of the four groups of vibration motors are respectively in contact with the four groups of vibration planes, the bottoms of the four groups of vibration motors are all connected to the vibration table, four groups of vibration protection covers are respectively arranged above the four groups of vibration motors, the bottoms of the four groups of vibration protection covers are all connected to the vibration table, and the bottom of the vibration table is connected to the detection shell.

[0007] As a further solution of the present invention, four groups of mounting protrusions are arranged on the top of the vibration plate, and the four groups of mounting protrusions are symmetrically arranged on both sides of the vibration placement piece, and four groups of fixed cylinders are respectively clamped in the four groups of mounting protrusions, and four groups of fixing pins are respectively arranged on the pneumatic rods of the four groups of fixed cylinders, and two groups of fixing holes are symmetrically opened on both sides of the vibration placement piece and the chip frame, and the four groups of fixing pins respectively pass through the fixing holes on the four groups of vibration placement pieces and are penetrated into the fixing holes on the four groups of chip frames, and four groups of mounting shells are respectively arranged on the top of the four groups of mounting protrusions.

[0008] As a further solution of the present invention, the visual detection component includes a camera, two groups of LED arrays and an adjustment motor; a second guide rail is provided at the bottom of the visual detection cavity; a movable second electric slider is provided on the second guide rail; two groups of adjustment seats are provided on the top of the second electric slider; the two groups of adjustment seats are provided with the same group of rotatable adjustment rods; the adjustment motor is provided at one end of the adjustment rod; the main shaft of the adjustment motor is provided in the adjustment rod; the camera is provided on the adjustment rod; two groups of fixing rings are respectively provided on both sides of the camera; the two groups of fixing rings are both sleeved on the adjustment rod; two groups of LED mounting columns are respectively provided on both sides of the second guide rail; the two groups of LED arrays are respectively provided on the tops of the two groups of LED mounting columns; and two groups of filter covers are respectively provided on the tops of the two groups of LED mounting columns.

[0009] As a further solution of the present invention, the control component includes a data acquisition module, a control module, a visual recognition module and a clock module. A control installation board is provided at one end of the control cavity. The data acquisition module, the control module, the visual recognition module and the clock module are all arranged on the control installation board in a vertical direction. The data acquisition module, the control module, the visual recognition module and the clock module are all arranged in an staggered manner. The control component also includes a power supply module, and the power supply module is arranged at the bottom of the control installation board.

[0010] As a further solution of the present invention, two groups of movable first electric sliders are respectively arranged on the two groups of the first guide rails, the same group of connecting parts are arranged at the bottom of the two groups of the first electric sliders, a telescopic cylinder is arranged on the top of the connecting part, the conveying plate is arranged at the bottom of the connecting part, the pneumatic rod of the telescopic cylinder passes through the connecting part and is connected to the conveying plate, the laser receiving tube is clamped on the side of the conveying plate close to the three groups of laser emitting tubes, four groups of electromagnets are arranged at the bottom of the conveying plate, four groups of mounting holes are opened on the top of the chip frame, four groups of metal blocks are respectively arranged in the four groups of mounting holes, the four groups of metal blocks correspond to the four groups of electromagnets, and a chip fixing part is clamped on the top of the chip frame.

[0011] As a further solution of the present invention, a first mounting platform is provided at one end of the visual detection cavity, wherein one group of the laser emitting tubes is clamped in the first mounting platform, two groups of second mounting platforms are provided in the thermal imaging detection cavity, and the other two groups of laser emitting tubes are respectively clamped in the two groups of the second mounting platforms, and the three groups of laser emitting tubes and the laser receiving tubes are at the same height, a thermal imaging mounting frame is provided on one side of the thermal imaging detection cavity, a power connection board is provided on the top of the thermal imaging mounting frame, and multiple groups of detection probes are provided on the top of the power connection board, and the number of the multiple groups of detection probes is the same as the pins of the chip body to be detected, the thermal imager is provided on the top of the thermal imaging mounting frame, and a completion placement table is provided at the bottom of the thermal imaging detection cavity.

[0012] As a further solution of the present invention, a vibration door is provided at the opening of the vibration cavity, an installation frame is provided inside the vibration door, a transparent glass plate is provided inside the installation frame, an installation door is provided at the top of the vibration cavity, a detection door is provided at the opening of the visual detection cavity, a shading pad is bonded to one end of the detection door, an operation display panel is provided at one end of the detection door, a start switch and a relay switch are provided at the bottom of the operation display panel, a control door is provided at the opening of the control cavity, a ventilation slot is penetrated at one end of the control door, a dustproof net is provided in the ventilation slot, two groups of storage drawers for storing the chip body after detection are provided in the detection shell, and placement pads are provided in both groups of the storage drawers.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. When the device detects the chip, the chip can be vibrated by setting the vibration component. During the vibration process, if there is a cold solder joint, the cold solder joint may fall off due to the vibration, thereby improving the detection effect of the thermal imager and the visual inspection component on the chip in the subsequent chip inspection process. Subsequently, through the setting of the conveying component, the chip can be subjected to visual inspection and thermal imaging inspection, realizing the function of vibrating the chip before inspection, thereby improving the comprehensiveness of the device for cold solder joint detection of chip pins.

[0014] 2. When in use, the device can be operated semi-automatically. The user only needs to install the chip in the chip frame, and then place the chip frame in the vibration placement piece, and then start the device through the start switch. When the chip enters the visual inspection cavity, the user can control the camera's shooting angle and the horizontal position of the camera through the operation display panel. After the visual inspection is completed, the user can press the relay switch to allow the chip to enter the next inspection step. The device can perform inspection semi-automatically, is easy to operate, and improves convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of a chip cold solder joint detection device of the present invention; Figure 2 It is an exploded diagram of a chip cold solder joint detection device of the present invention; Figure 3 It is a front view of a detection shell in a chip cold solder joint detection device of the present invention; Figure 4 It is a right view of a detection shell in a chip cold solder joint detection device of the present invention; Figure 5 for Figure 4 Sectional view of AA in the middle; Figure 6 It is a structural schematic diagram of a power connection board and a detection probe in a chip cold solder joint detection device of the present invention; Figure 7 It is a structural schematic diagram of a visual detection component in a chip cold solder joint detection device of the present invention; Figure 8 It is a schematic diagram of the structure after the visual detection component in a chip cold solder joint detection device of the present invention is disassembled; Fig. 9 It is a schematic diagram of the structure after the first mounting platform and the laser emitting tube in a chip cold solder joint detection device of the present invention are separated; Fig.10 It is a structural schematic diagram of a vibration component in a chip cold solder joint detection device of the present invention; Fig.11 It is a schematic diagram of the structure after the vibration component in a chip cold solder joint detection device of the present invention is disassembled; Fig.12 yes Fig.11 Enlarged view of area a in the middle; Fig.13 It is a structural schematic diagram of a conveying component in a chip cold solder joint detection device of the present invention; Fig.14 It is a schematic diagram of the structure after the transport component in a chip cold solder joint detection device of the present invention is disassembled; Fig.15It is a structural schematic diagram of a control component in a chip cold solder joint detection device of the present invention; Fig.16 It is a principle block diagram of a control module in a chip cold solder joint detection device of the present invention; Fig.17 The present invention is a flow chart of the steps of a chip cold solder joint detection method.

[0016] In the figure, the corresponding relationship between the component names and the figure numbers is as follows: 100, detection housing; 101, vibration chamber; 102, visual detection chamber; 103, thermal imaging detection chamber; 104, control chamber; 105, vibration door; 106, installation frame; 107, transparent glass plate; 108, detection door; 109, light shielding mat; 110, operation display panel; 111, start switch; 112, relay switch; 113, control door; 114, dust screen; 115, installation door; 116, storage storage drawer; 117, placement pad; 118, vibration table; 119, vibration trough; 120, vibration column; 121, vibration motor; 122, vibration plate; 123, vibration plane; 124, vibration protection cover; 125, mounting protrusion; 126, fixed cylinder; 127, fixed pin; 128, mounting shell; 129, vibration placement piece; 130, chip frame; 131, chip body; 132, first guide rail; 133 , first electric slider; 134, connecting piece; 135, telescopic cylinder; 136, conveying plate; 137, laser receiving tube; 138, electromagnet; 139, metal block; 140, chip fixing piece; 141, first mounting platform; 142, second mounting platform; 143, laser emitting tube; 144, thermal imaging mounting frame; 145, power board; 146, detection probe; 147, completion placement platform; 148, second guide rail; 149, second electric slider; 150, adjustment seat; 151, adjustment rod; 152, adjustment motor; 153, camera; 154, fixing ring; 155, LED mounting column; 156, LED array; 157, filter cover; 158, control mounting plate; 159, control module; 160, visual recognition module; 161, data acquisition module; 162, clock module; 163, power module; 164, thermal imager. DETAILED DESCRIPTION

[0017] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the technical solutions of the present invention, but cannot be used to limit the scope of protection of the present invention.

[0018] Embodiment 1: As shown in the attached Figures 1 to 17 As shown: The present invention provides a chip cold solder joint detection device, comprising a detection shell 100, wherein a vibration cavity 101, a visual detection cavity 102 and a thermal imaging detection cavity 103 are sequentially opened in the detection shell 100 along the horizontal direction, a control cavity 104 is opened at one end of the detection shell 100 close to the vibration cavity 101, a control component is arranged in the control cavity 104, a vibration component is arranged in the vibration cavity 101, and the vibration component is used to vibrate the chip, and judge whether there is a cold solder joint by applying appropriate mechanical vibration to the chip. When vibrating, if there is a cold solder joint on the pin of the chip, the solder joint of the cold solder joint will loosen or fall off, which is convenient for subsequent visual inspection and thermal imaging inspection to detect the cold solder joint of the chip. The chip frame 130 is provided on the top of the vibration component, and the chip body 131 to be detected is provided in the chip frame 130. Before the detection, the user can install the chip into the chip frame 130. The chip frame 130 can protect the chip during the detection process to prevent the chip from directly contacting the components used for detection in the detection device and preventing the chip from being damaged. A through groove is provided at the bottom of the chip frame 130, so that the thermal imager 164 and the camera 153 can directly shoot or detect the pin solder joints of the chip. A visual detection component is provided in the visual detection cavity 102, and the visual detection component can be used to detect the chip. The solder joints of the chip are visually inspected. A thermal imager 164 is provided in the thermal imaging detection chamber 103. The temperature distribution of the solder joints can be detected by the thermal imager 164. When the pins of the chip are energized, the normal solder joints have good electrical conductivity and relatively uniform temperature distribution, and there will be no local overheating. However, due to poor contact, the resistance of the cold solder joints is large, and more heat is generated. The thermal imager 164 will show an area with abnormally high temperature. Three groups of laser emitting tubes 143 are provided in the detection housing 100. Two groups of first guide rails 132 are provided on one side of the detection housing 100. The bottom of the two groups of first guide rails 132 is provided with the same group of movable conveying components. During the inspection, the chip is transported from the vibration chamber 101 to the thermal imaging inspection chamber 103 through the transport component, and passes through the visual inspection chamber 102 on the way, so as to gradually perform cold solder joint inspection on the chip. The transport component includes a transport plate 136 and a laser receiving tube 137. The transport plate 136 and the laser emitting tube 143 are both arranged above the vibration component. The laser receiving tube 137 is electrically connected to the control module 159. When the transport component passes through any group of laser emitting tubes 143, when the laser receiving tube 137 receives the laser emitted by the laser emitting tube 143, the laser receiving tube 137 will send a trigger signal to the control module 159, so that the device will take corresponding action.

[0019] A vibration table 118 is arranged at the bottom of the vibration cavity 101, and a vibration groove 119 is opened on the top of the vibration table 118. The vibration groove 119 is used to install four groups of vibration motors 121 and four groups of vibration columns 120. Four groups of vibration columns 120 and four groups of vibration motors 121 are arranged in the vibration groove 119. The four groups of vibration columns 120 and the four groups of vibration motors 121 are arranged in sequence in a ring shape. The same group of vibration plates 122 are arranged on the top of the four groups of vibration columns 120, and a vibration placement piece 129 is arranged on the top of the vibration plate 122. A chip frame 130 is arranged in the vibration placement piece 129.

[0020] Four groups of vibration columns 120 are respectively arranged on the inner side of four groups of vibration motors 121, and four groups of vibration planes 123 are respectively opened on one side of the four groups of vibration columns 120. The four groups of vibration planes 123 are respectively oriented towards the four groups of vibration motors 121, and the vibration ends of the four groups of vibration motors 121 are respectively in contact with the four groups of vibration planes 123. When the vibration motor 121 is working, the vibration will be transmitted from the vibration column 120 to the vibration plate 122, and then the chip can be vibrated, so that the solder joints of the chip will fall off or loosen. The bottoms of the four groups of vibration motors 121 are all connected to the vibration table 118, and four groups of vibration protection covers 124 are respectively arranged above the four groups of vibration motors 121. The bottoms of the four groups of vibration protection covers 124 are all connected to the vibration table 118, and the bottom of the vibration table 118 is connected to the detection shell 100. Before visual inspection and thermal imaging inspection, vibration inspection is first performed to conduct an initial check on the solder joints of the chip pins.

[0021] Four groups of mounting protrusions 125 are arranged on the top of the vibration plate 122, and the four groups of mounting protrusions 125 are symmetrically arranged on both sides of the vibration placement piece 129. Four groups of fixed cylinders 126 are respectively clamped in the four groups of mounting protrusions 125. The fixed cylinders 126 are electrically connected to the control module 159. Four groups of fixing pins 127 are respectively arranged on the pneumatic rods of the four groups of fixed cylinders 126. Two groups of fixing holes are symmetrically opened on both sides of the vibration placement piece 129 and the chip frame 130. The four groups of fixing pins 127 pass through the four groups of fixing holes respectively, and are penetrated. In the other four groups of fixing holes, four groups of mounting shells 128 are respectively arranged on the top of the four groups of mounting protrusions 125. When the user places the chip frame 130 into the vibration placement piece 129, the start switch 111 can be pressed, and then the start switch 111 sends an electrical signal to the control module 159. The control module 159 receives the electrical signal to control the start of the fixing cylinder 126. The pneumatic rod of the fixing cylinder 126 pushes the fixing pin 127 to be inserted into the fixing hole on the chip frame 130, thereby fixing the chip frame 130 during the vibration process.

[0022] The visual detection component includes a camera 153, two groups of LED arrays 156 and an adjustment motor 152. A second guide rail 148 is provided at the bottom of the visual detection chamber 102. A movable second electric slider 149 is provided on the second guide rail 148. The second electric slider 149 is electrically connected to the control module 159. The user can control the second electric slider 149 through the operation display panel 110 to adjust the horizontal position of the camera 153. Two groups of adjustment seats 150 are provided on the top of the second electric slider 149. The same group of rotatable adjustment rods 151 are inserted in the two groups of adjustment seats 150. An adjustment motor 152 is provided at one end of the adjustment rod 151. The adjustment motor 152 is electrically connected to the control module 159. The user can control the adjustment motor 152 through the operation display panel 110 to adjust the camera 153. The camera angle can be adjusted. The main shaft of the adjusting motor 152 is inserted into the adjusting rod 151. When the adjusting motor 152 is working, the main shaft of the adjusting motor 152 will drive the adjusting rod 151 to rotate together with the main shaft, so as to adjust the angle. A camera 153 is arranged on the adjusting rod 151. Two groups of fixing rings 154 are respectively arranged on both sides of the camera 153. The two groups of fixing rings 154 have a fixing effect on the camera 153. The two groups of fixing rings 154 are both sleeved on the adjusting rod 151. Two groups of LED mounting columns 155 are respectively arranged on both sides of the second guide rail 148. Two groups of LED arrays 156 are respectively arranged on the top of the two groups of LED mounting columns 155. The chip can be illuminated by the LED array 156 to improve the shooting effect of the camera 153 on the chip. Two groups of filter covers 157 are respectively arranged on the top of the two groups of LED mounting columns 155.

[0023] The control component includes a data acquisition module 161, a control module 159, a visual recognition module 160 and a clock module 162. A control mounting plate 158 is provided at one end of the control cavity 104. The data acquisition module 161, the control module 159, the visual recognition module 160 and the clock module 162 are all arranged on the control mounting plate 158 in a vertical direction. The data acquisition module 161, the control module 159, the visual recognition module 160 and the clock module 162 are arranged in an interlaced manner. The interlaced arrangement can improve the heat dissipation effect and prevent heat accumulation. The control component also includes a power module 163. The power module 1 63 is arranged at the bottom of the control mounting plate 158, the power supply module 163 provides power for the device, the control module 159 can select the stm32f103c8t6 model, the data acquisition module 161 can select the NR-EN16 model, the data acquisition module 161 is electrically connected to the control module 159, the clock module 162 can select the SD2059 model, the clock module 162 is electrically connected to the control module 159, the visual recognition module 160 can select the K210 model, the visual recognition module 160 is electrically connected to the control module 159, and the camera 153 is electrically connected to the visual recognition module 160.

[0024] When the camera 153 takes a picture of the chip, the camera 153 sends the picture to the visual recognition module 160 via an electrical signal. The visual recognition module 160 detects and judges the solder joints in the chip picture. The detection result of the visual recognition module 160 is collected by the data acquisition module 161. After the collection is completed, the collected data is sent to the control module 159 via an electrical signal. The control module 159 forwards the data to the operation display panel 110, so that the user can view the relevant detection data through the operation display panel 110.

[0025] Two groups of movable first electric sliders 133 are respectively arranged on the two groups of first guide rails 132, and the first electric sliders 133 are electrically connected to the control module 159. The same group of connecting pieces 134 are arranged at the bottom of the two groups of first electric sliders 133, and a telescopic cylinder 135 is arranged at the top of the connecting piece 134, and the telescopic cylinder 135 is electrically connected to the control module 159. A conveying plate 136 is arranged at the bottom of the connecting piece 134, and a pneumatic rod of the telescopic cylinder 135 passes through the connecting piece 134 and is connected to the conveying plate 136. A laser receiving tube 137 is clamped on one side of the conveying plate 136 close to the three groups of laser emitting tubes 143, and four groups of electromagnets 138 are arranged at the bottom of the conveying plate 136. Four groups of mounting holes are opened at the top of the chip frame 130, and four groups of metal blocks 139 are respectively arranged in the four groups of mounting holes. The four groups of metal blocks 139 correspond to the four groups of electromagnets 138. A chip fixing part 140 is provided on the top of the frame 130, and the user can fix the chip in the chip frame 130 through the chip fixing part 140. When the user puts the chip frame 130 into the vibration placement part 129 and turns on the start switch 111, the control module 159 controls the vibration component to start, and at the same time, the clock module 162 starts timing. When the clock module 162 ends the timing, the control module 159 controls the vibration component to turn off, and controls the electromagnet 138 to be energized. At the same time, the telescopic cylinder 135 works, so that the pneumatic rod of the telescopic cylinder 135 drives the conveying plate 136 to move downward, thereby inserting the electromagnet 138 into the installation slot, so that the electromagnet 138 is magnetically connected to the metal block 139. Subsequently, the pneumatic rod of the telescopic cylinder 135 moves upward, driving the conveying plate 136 to reset, and the first electric slider 133 moves toward the direction of the visual inspection chamber 102.

[0026] A first mounting platform 141 is provided at one end of the visual inspection chamber 102, in which a group of laser emitting tubes 143 are clamped in the first mounting platform 141. When the first electric slider 133 enters the visual inspection chamber 102 and the laser receiving tube 137 receives the laser emitted by the laser emitting tube 143 in the visual inspection chamber 102, the laser receiving tube 137 sends a trigger signal to the control module 159, so that the control module 159 stops the operation of the first electric slider 133, so that the visual inspection component can detect the chip. After the detection is completed, the user can press the relay switch 112, so that the first electric slider 133 restarts and continues to move toward the thermal imaging detection chamber 103.

[0027] Two groups of second mounting platforms 142 are arranged in the thermal imaging detection chamber 103, and the other two groups of laser emitting tubes 143 are respectively clamped in the two groups of second mounting platforms 142. The three groups of laser emitting tubes 143 and the laser receiving tube 137 are at the same height. A thermal imaging mounting frame 144 is arranged on one side of the thermal imaging detection chamber 103, and a power connection board 145 is arranged on the top of the thermal imaging mounting frame 144. A plurality of groups of detection probes 146 are arranged on the top of the power connection board 145. The number of the plurality of detection probes 146 is the same as the number of pins of the chip body 131 to be detected. The detection probes 146 are electrically connected to the control module 159. When the first electric slider 133 enters the thermal imaging detection cavity 103 and the laser receiving tube 137 receives the laser emitted by the laser emitting tube 143 which is in the thermal imaging detection cavity 103 and close to the visual detection cavity 102, the control module 159 stops the operation of the first electric slider 133, the telescopic cylinder 135 starts, and the pneumatic rod moves downward, so that the chip pin contacts the detection probe 146. The detection probe 146 powers on the chip. At this time, the clock module 162 starts timing. After the timing ends, the telescopic cylinder 135 resets, and the first electric slider 133 continues to move forward.

[0028] A thermal imager 164 is arranged on the top of the thermal imaging mounting frame 144. The thermal imager 164 can be of the TFNMW101 model. A completion placement table 147 is arranged at the bottom of the thermal imaging detection chamber 103. The thermal imager 164 is electrically connected to the data acquisition module 161. The thermal imager 164 can detect the temperature distribution of the solder joint after the chip is powered on for a certain period of time, and the data acquisition module 161 can collect the detection results and send them to the control module 159 in the form of electrical signals. Then, the control module 159 forwards the detection data to the operation display panel 110. The user can view the relevant data through the operation display panel 110. The operation display panel 110 can be of the IDP type. Model C170, when the laser receiving tube 137 receives the laser emitted by the laser emitting tube 143 far away from the visual inspection chamber 102, the control module 159 stops the operation of the first electric slider 133, the telescopic cylinder 135 starts, and the pneumatic rod moves downward to place the chip frame 130 into the completion placement table 147. At the same time, the electromagnet 138 is powered off, and then the first electric slider 133 and the telescopic cylinder 135 are reset, and the user can take the inspected chip from the completion placement table 147.

[0029] A vibration door 105 is provided at the opening of the vibration chamber 101, a mounting frame 106 is provided in the vibration door 105, a transparent glass plate 107 is provided in the mounting frame 106, a mounting door 115 is provided at the top of the vibration chamber 101, a detection door 108 is provided at the opening of the visual detection chamber 102, a shading pad 109 is bonded to one end of the detection door 108, and the shading pad 109 can prevent external light from entering the visual detection chamber 102 through the gap between the detection door 108 and the detection housing 100, and an operation display is provided at one end of the detection door 108. Panel 110, a start switch 111 and a relay switch 112 are arranged at the bottom of the operation display panel 110, a control door 113 is arranged at the opening of the control cavity 104, a ventilation slot is penetrated at one end of the control door 113, a dustproof net 114 is arranged in the ventilation slot, and two groups of storage drawers 116 for storing the chip body 131 after the test are arranged in the detection shell 100, and a placement pad 117 is arranged in both groups of storage drawers 116, and the user can place the chip to be tested or the chip after the test in the storage drawer 116.

[0030] The present invention also provides a chip cold solder joint detection method, comprising the following steps: Step 1: Preparation The chip body 131 to be tested is placed in the chip frame 130. After the placement is completed, the chip fixing member 140 is inserted into the top of the chip frame 130 to fix the chip body 131 to be tested. Then, the chip frame 130 loaded with the chip body 131 to be tested is placed in the vibration placement member 129. Step 2: Vibration Operation The start switch 111 is pressed to start the device. At this time, the four sets of fixed cylinders 126 are started, and the pneumatic rods of the four sets of fixed cylinders 126 respectively drive the four sets of fixed pins 127 to pass through the four sets of fixed holes on the vibration placement piece 129, and are inserted into the four sets of fixed holes of the chip frame 130 to fix the chip frame 130. Subsequently, the four sets of vibration motors 121 are started to vibrate the four sets of vibration columns 120, and the four sets of vibration columns 120 transmit the vibration to the vibration plate 122 and the vibration placement piece 129, thereby vibrating the chip frame 130. Step 3: Shipping Operation After the vibration operation is completed, the telescopic cylinder 135 is started, and the pneumatic rod drives the conveying plate 136 to move downward, so that the four groups of electromagnets 138 at the bottom of the conveying plate 136 are inserted into the mounting grooves on the chip frame 130. By energizing the four groups of electromagnets 138, the four groups of electromagnets 138 generate magnetic force and are magnetically connected to the four groups of metal blocks 139. Then, the pneumatic rod of the telescopic cylinder 135 moves upward, driving the chip frame 130 to move upward at the same time. Then, the two groups of first electric slides 133 move toward the visual inspection chamber 102. Step 4: Visual Inspection When the laser receiving tube 137 receives the laser emitted from the laser emitting tube 143 provided in the visual inspection chamber 102, the two groups of first electric sliders 133 stop moving, and the cold solder joint of the pins of the chip body 131 to be inspected can be visually inspected through the cooperation of the camera 153 and the visual recognition module 160. The data acquisition module 161 collects data on the inspection result of the visual recognition module 160 and sends it to the control module 159 through an electrical signal. The control module 159 then forwards it to the display operation panel 110. At the same time, the user can control the shooting angle of the camera 153 through the operation display panel 110, or control the second electric slider 149 to move on the second guide rail 148, so as to adjust different inspection angles. After the inspection is completed, the user can press the relay switch 112. Step 5: Power on When the relay switch 112 is pressed, the two groups of first electric sliders 133 are moved toward the thermal imaging detection chamber 103 through the transport operation again. After entering the thermal imaging detection chamber 103, when the laser receiving tube 137 receives the laser emitted from one group of laser emitting tubes 143 in the thermal imaging detection chamber 103, the two groups of first electric sliders 133 stop moving. At the same time, the pneumatic rod of the telescopic cylinder 135 drives the transport plate 136 to move downward, so that the pins of the chip body 131 to be detected are in contact with the multiple groups of detection probes 146, and the chip body 131 to be detected is energized through the multiple groups of detection probes 146; Step 6: Thermal imaging detection After the clock module 162 completes the timing, the two groups of first electric sliders 133 continue to move forward, so that the thermal imager 164 can detect the pin solder joint of the chip body 131 to be detected, and the data acquisition module 161 collects data on the detection result of the visual recognition module 160, and sends it to the control module 159 through an electrical signal, and the control module 159 forwards it to the operation display panel 110. When the laser receiving tube 137 receives the laser emitted by another group of laser emitting tubes 143 in the thermal imaging detection cavity 103, the two groups of first electric sliders 133 stop moving. At this time, the pneumatic rod of the telescopic cylinder 135 drives the conveying plate 136 to move downward, and the four groups of electromagnets 138 are powered off, so that the chip frame 130 is separated from the conveying plate 136, and the chip frame 130 is placed in the completion placement table 147. The two groups of first electric sliders 133 move and reset, and the user can take out the chip body 131 after the detection, and view the detection results through the operation display panel 110.

[0031] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A chip cold solder joint detection device, characterized in that: The invention comprises a detection shell (100), wherein a vibration cavity (101), a visual detection cavity (102) and a thermal imaging detection cavity (103) are sequentially provided in the detection shell (100) along a horizontal direction, a control cavity (104) is provided at one end of the detection shell (100) close to the vibration cavity (101), a control component is provided in the control cavity (104), a vibration component is provided in the vibration cavity (101), a chip frame (130) is provided on the top of the vibration component, a chip body (131) to be detected is provided in the chip frame (130), and the visual detection cavity (102) and the thermal imaging detection cavity (103) are provided in sequence. A visual detection component is arranged in the detection cavity (102), a thermal imager (164) is arranged in the thermal imaging detection cavity (103), three groups of laser emitting tubes (143) are arranged in the detection housing (100), two groups of first guide rails (132) are passed through one side of the detection housing (100), and the bottom of the two groups of first guide rails (132) are provided with the same group of movable conveying components, the conveying components include a conveying plate (136) and a laser receiving tube (137), and the conveying plate (136) and the laser emitting tube (143) are both arranged above the vibration component.

2. A chip cold solder joint detection device according to claim 1, characterized in that: A vibration table (118) is arranged at the bottom of the vibration cavity (101), a vibration groove (119) is opened at the top of the vibration table (118), four groups of vibration columns (120) and four groups of vibration motors (121) are arranged in the vibration groove (119), the four groups of vibration columns (120) and the four groups of vibration motors (121) are arranged in sequence in a ring shape, the same group of vibration plates (122) are arranged on the top of the four groups of vibration columns (120), a vibration placement piece (129) is arranged on the top of the vibration plate (122), and the chip frame (130) is arranged in the vibration placement piece (129).

3. A chip cold solder joint detection device according to claim 2, characterized in that: The four groups of vibration columns (120) are respectively arranged inside the four groups of vibration motors (121); four groups of vibration planes (123) are respectively opened on one side of the four groups of vibration columns (120); the four groups of vibration planes (123) are respectively oriented toward the four groups of vibration motors (121); the vibration ends of the four groups of vibration motors (121) are respectively in contact with the four groups of vibration planes (123); the bottoms of the four groups of vibration motors (121) are respectively connected to the vibration table (118); four groups of vibration protection covers (124) are respectively arranged above the four groups of vibration motors (121); the bottoms of the four groups of vibration protection covers (124) are respectively connected to the vibration table (118); and the bottom of the vibration table (118) is connected to the detection housing (100).

4. A chip cold solder joint detection device according to claim 2, characterized in that: Four groups of mounting protrusions (125) are arranged on the top of the vibration plate (122), and the four groups of mounting protrusions (125) are symmetrically arranged on both sides of the vibration placement piece (129). Four groups of fixed cylinders (126) are respectively clamped in the four groups of mounting protrusions (125), and four groups of fixed pins (127) are respectively arranged on the pneumatic rods of the four groups of fixed cylinders (126). Two groups of fixing holes are symmetrically opened on both sides of the vibration placement piece (129) and the chip frame (130). The four groups of fixing pins (127) respectively pass through the fixing holes on the four groups of vibration placement pieces (129) and are penetrated into the fixing holes on the four groups of chip frames (130). Four groups of mounting shells (128) are respectively arranged on the top of the four groups of mounting protrusions (125).

5. A chip cold solder joint detection device according to claim 1, characterized in that: The visual detection component comprises a camera (153), two groups of LED arrays (156) and an adjustment motor (152); a second guide rail (148) is arranged at the bottom of the visual detection chamber (102); a movable second electric slider (149) is arranged on the second guide rail (148); two groups of adjustment seats (150) are arranged on the top of the second electric slider (149); the same group of rotatable adjustment rods (151) are inserted into the two groups of adjustment seats (150); the adjustment motor (152) is arranged at one end of the adjustment rod (151); the adjustment motor (152) The main shaft is passed through the adjusting rod (151), the adjusting rod (151) is provided with the camera (153), two groups of fixing rings (154) are respectively provided on both sides of the camera (153), the two groups of fixing rings (154) are both sleeved on the adjusting rod (151), two groups of LED installation columns (155) are respectively provided on both sides of the second guide rail (148), the two groups of LED arrays (156) are respectively provided on the tops of the two groups of LED installation columns (155), and two groups of filter covers (157) are respectively provided on the tops of the two groups of LED installation columns (155).

6. A chip cold solder joint detection device according to claim 1, characterized in that: The control component comprises a data acquisition module (161), a control module (159), a visual recognition module (160) and a clock module (162); a control mounting plate (158) is provided at one end of the control cavity (104); the data acquisition module (161), the control module (159), the visual recognition module (160) and the clock module (162) are all arranged on the control mounting plate (158) in a vertical direction; the data acquisition module (161), the control module (159), the visual recognition module (160) and the clock module (162) are all arranged in an alternating manner; the control component further comprises a power supply module (163); the power supply module (163) is arranged at the bottom of the control mounting plate (158).

7. A chip cold solder joint detection device according to claim 1, characterized in that: Two groups of movable first electric slide blocks (133) are respectively arranged on the two groups of the first guide rails (132); the same group of connecting pieces (134) are arranged at the bottom of the two groups of the first electric slide blocks (133); a telescopic cylinder (135) is arranged at the top of the connecting piece (134); the transport plate (136) is arranged at the bottom of the connecting piece (134); the pneumatic rod of the telescopic cylinder (135) passes through the connecting piece (134) and is connected to the transport plate (136); the laser connection The receiving tube (137) is clamped on one side of the conveying plate (136) close to the three groups of laser emitting tubes (143); four groups of electromagnets (138) are arranged at the bottom of the conveying plate (136); four groups of mounting holes are opened at the top of the chip frame (130); four groups of metal blocks (139) are respectively arranged in the four groups of mounting holes; the four groups of metal blocks (139) correspond to the four groups of electromagnets (138); and a chip fixing part (140) is clamped on the top of the chip frame (130).

8. A chip cold solder joint detection device according to claim 1, characterized in that: A first mounting platform (141) is provided at one end of the visual detection chamber (102), wherein one group of the laser emitting tubes (143) is clamped in the first mounting platform (141), two groups of second mounting platforms (142) are provided in the thermal imaging detection chamber (103), and the other two groups of the laser emitting tubes (143) are clamped in the two groups of the second mounting platforms (142), respectively. The three groups of the laser emitting tubes (143) and the laser receiving tube (137) are at the same height. A thermal imaging mounting frame (144) is arranged on one side of the thermal imaging mounting frame (144), a power board (145) is arranged on the top of the thermal imaging mounting frame (144), a plurality of groups of detection probes (146) are arranged on the top of the power board (145), and the number of the plurality of groups of detection probes (146) is the same as the number of pins of the chip body (131) to be detected, the thermal imager (164) is arranged on the top of the thermal imaging mounting frame (144), and a completion placement table (147) is arranged at the bottom of the thermal imaging detection chamber (103).

9. A chip cold solder joint detection device according to claim 1, characterized in that: A vibration door (105) is provided at the opening of the vibration chamber (101), a mounting frame (106) is provided in the vibration door (105), a transparent glass plate (107) is provided in the mounting frame (106), a mounting door (115) is provided at the top of the vibration chamber (101), a detection door (108) is provided at the opening of the visual detection chamber (102), a light shielding pad (109) is bonded to one end of the detection door (108), and an operation display panel (110) is provided at one end of the detection door (108). A start switch (111) and a relay switch (112) are provided at the bottom of the operation display panel (110); a control door (113) is provided at the opening of the control chamber (104); a ventilation slot is provided at one end of the control door (113); a dustproof net (114) is provided in the ventilation slot; two groups of storage drawers (116) for storing the chip body (131) after the test are provided in the detection housing (100); and a placement pad (117) is provided in both groups of the storage drawers (116).

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