A needle die testing device and method suitable for multiple processes and stations

Abstract

The present application is suitable for the field of flexible printed circuit board testing, and provides a needle mode testing device and method suitable for multiple processes and multiple stations. The needle mode testing device suitable for multiple processes and multiple stations comprises: a carrier arranged on a flow line and used for placing a flexible circuit board in a bent state; a lower testing module arranged below the carrier and comprising a lateral positioning assembly, a first lateral needle mode assembly and a jacking assembly; the lateral positioning assembly and the first lateral needle mode assembly are arranged on top of the jacking assembly; and an upper testing module arranged above the carrier and comprising a first pressing block testing assembly, a second lateral needle mode assembly and a first ceiling assembly, wherein the first pressing block testing assembly and the second lateral needle mode assembly are arranged on the bottom of the first ceiling assembly. The device and method can greatly reduce equipment cost, increase equipment stability and reduce the investment and cost of maintenance personnel.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of flexible printed circuit board testing, and particularly relates to a pin mode testing device and method suitable for multiple processes and multiple stations. BACKGROUND

[0002] A flexible printed circuit (FPC) is a type of printed circuit board made using flexible substrates. Unlike traditional rigid printed circuit boards, flexible printed circuits have the characteristics of being bendable, foldable, and windable, and can be freely shaped in three-dimensional space, making them suitable for use in products with complex shapes or space limitations. Flexible printed circuits are widely used in various electronic products, such as mobile phones, laptops, digital cameras, medical devices, and automotive electronic systems. Due to their lightweight and bendable characteristics, they are particularly suitable for applications that require space and weight savings, and are also one of the key technologies for achieving miniaturization and high-density assembly.

[0003] To meet the needs of consumers, the mainstream consumer electronics products are gradually updated and replaced, and many suppliers have begun to reduce costs and increase efficiency, requiring lower equipment prices and higher testing requirements to reduce costs. In multi-hole flow line testing automation or multi-process equipment, the equipment has multiple carriers, the carriers have multiple holes, and the equipment only has one station to test the product with a pin mode. In the past, the conventional practice was to position the product on the carrier, and the product positioning and testing pin mode were integrated, which reduced the size chain transmission and reduced the interference of intermediate links, increased the yield, and reduced the risk. However, in the case of multiple carriers and multiple holes, setting a pin mode for each hole of the carrier will greatly increase the number of pin modes, resulting in high equipment costs, and each pin mode needs to be maintained, each pin mode needs to be connected by a wire, which greatly increases the equipment maintenance workload and difficulty, increases the complexity of the carrier, reduces the stability of the equipment, and increases the cost of the equipment. SUMMARY

[0004] The purpose of the embodiment of the present application is to provide a pin mode testing device suitable for multiple processes and multiple stations, aiming to greatly reduce equipment costs and increase equipment stability.

[0005] The embodiment of the present application is implemented as follows: a pin mode testing device suitable for multiple processes and multiple stations, the pin mode testing device suitable for multiple processes and multiple stations comprises:

[0006] A carrier is arranged on a linear flow line and used to place a flexible printed circuit in a bent state.

[0007] A lower testing module is arranged below the carrier and comprises a lateral positioning assembly, a first lateral pin module assembly and a jacking assembly; the lateral positioning assembly and the first lateral pin module assembly are arranged on top of the jacking assembly; the jacking assembly is used to jack up the carrier, the lateral positioning assembly and the first lateral pin module assembly; the lateral positioning assembly is used for X-axis primary positioning of the flexible circuit board; and the first lateral pin module assembly is used for X-axis contact testing of the flexible circuit board.

[0008] An upper testing module is arranged above the carrier and comprises a first pressing block testing assembly, a second lateral pin module assembly and a first ceiling assembly; the first pressing block testing assembly and the second lateral pin module assembly are arranged on the bottom of the first ceiling assembly; the first ceiling assembly is used to drive the first pressing block testing assembly and the second lateral pin module assembly to move downward; the first pressing block testing assembly is used for Z-axis secondary positioning and contact testing of the flexible circuit board; and the second lateral pin module assembly is used for Y-axis contact testing of the flexible circuit board.

[0009] Preferably, the lateral positioning assembly comprises:

[0010] A support frame and a lateral connecting driving device are arranged on top of the jacking assembly.

[0011] A product support block is arranged on the support frame.

[0012] A support limiting block is arranged on the support frame and used to limit the product support block.

[0013] A spring is arranged between the product support block and the support limiting block.

[0014] Preferably, the first lateral pin module assembly comprises:

[0015] A sliding frame and a lateral connecting driving device are used for lateral movement.

[0016] A pin module is arranged on the first sliding frame and used for lateral contact testing.

[0017] Preferably, the first pressing block testing assembly comprises:

[0018] A pressing block cover plate is arranged on the ceiling on the bottom of the first ceiling assembly.

[0019] A pressing block is connected with the pressing block cover plate through a spring.

[0020] A probe is arranged through the pressing block and connected with a pin sleeve protection shell on the pressing block cover plate.

[0021] Preferably, the second lateral pin module assembly comprises:

[0022] A connecting block and a lateral connecting driving device.

[0023] an adapter plate, laterally arranged on the connecting block;

[0024] a probe fixing block, laterally arranged on the adapter plate;

[0025] a double-end spring probe, laterally arranged on the probe fixing block.

[0026] Another object of the present application is a needle mode testing method suitable for multi-process and multi-station, which comprises the following steps:

[0027] placing the bent flexible circuit board on a carrier of a production line;

[0028] when the carrier moves to a working area, a lower testing module lifts up the carrier, and a lateral positioning assembly of the lower testing module completes the shaping and positioning of the flexible circuit board in the horizontal direction;

[0029] controlling the lower movement of an upper testing module, so that a first pressing block testing assembly of the upper testing module realizes the positioning of the flexible circuit board in the Z-axis direction and connects the contacts in the Z-axis direction;

[0030] controlling a second lateral needle mode assembly of the upper testing module to connect the contacts in the Y-axis direction of the flexible circuit board;

[0031] controlling a first lateral needle mode assembly of the lower testing module to connect the contacts in the X-axis direction of the flexible circuit board;

[0032] turning on the circuit to realize detection.

[0033] Another object of the present application is a needle mode testing device suitable for multi-process and multi-station, which comprises:

[0034] a carrier arranged on a rotary disc type production line, used for placing the flexible circuit board in a flat state;

[0035] a lower testing module arranged below the carrier, comprising a platform plate and a longitudinal needle mode assembly arranged on the platform plate, used for contact testing;

[0036] an upper testing module arranged above the carrier, comprising a second pressing block testing assembly and a second ceiling assembly, the second pressing block testing assembly is arranged on the second ceiling assembly, the second ceiling assembly is used to drive the second pressing block testing assembly and the carrier to press down, and the second pressing block testing assembly is used for contact testing of the flexible circuit board.

[0037] Preferably, a bushing is arranged on the carrier, and the lower test module and the upper test module are each provided with a guide shaft, and the bushing is arranged in matched connection with the guide shaft.

[0038] Another purpose of the embodiment of the present application is to provide a needle mold testing method suitable for multiple processes and multiple stations, which comprises the following steps:

[0039] The flattened flexible circuit board is placed on the carrier in the form of a turntable;

[0040] When the carrier is rotated to the working area, the upper test module is controlled to be pressed down, so that the second pressing block testing assembly of the upper test module is connected to the contacts on the upper surface of the flexible circuit board;

[0041] The upper test module is controlled to continue to drive the carrier to be pressed down, so that the longitudinal needle mold assembly of the lower test module is connected to the contacts on the lower surface of the flexible circuit board;

[0042] The circuit is turned on to realize detection.

[0043] The embodiment of the present application provides a needle mold testing device suitable for multiple processes and multiple stations. The device is a needle mold separated testing structure, which is used for batch production of products in the form of molding, bending and flattening on a multiple-hole assembly line and multiple-process equipment. The number of testing needle mold assemblies in the equipment can be significantly reduced. Since the needle mold has a high cost and needs to be frequently maintained, and the maintenance is difficult, the needle mold is a key structure of the testing module, has a direct influence on the testing yield, and each tail of the needle mold has a wire transfer signal. Reducing the needle mold can reduce the corresponding transfer line. Therefore, the device and the method can greatly reduce the equipment cost, increase the equipment stability, and reduce the investment and cost of maintenance personnel. BRIEF DESCRIPTION OF DRAWINGS

[0044] Figure 1 It is a perspective view of the needle mold testing device suitable for multiple processes and multiple stations according to the first embodiment;

[0045] Figure 2 It is a front view of the lower test module according to the second embodiment;

[0046] Figure 3 It is an exploded view of the lateral positioning assembly according to the second embodiment;

[0047] Figure 4 It is a perspective view of the first lateral needle mold assembly according to the second embodiment;

[0048] Figure 5 It is a perspective view of the upper test module according to the second embodiment;

[0049] Figure 6 It is an exploded view of the first pressing block testing assembly according to the second embodiment;

[0050] Figure 7 exploded view of a second lateral needle die assembly of a second embodiment;

[0051] Figure 8 perspective view of a lower test module of a fourth embodiment;

[0052] Figure 9 exploded view of a lower test module of a fourth embodiment;

[0053] Figure 10 perspective view of an upper test module of a fourth embodiment;

[0054] Reference Signs:

[0055] 100, carrier;

[0056] 200, lower test module; 210, lateral positioning assembly; 220, first lateral needle die assembly; 230, jacking assembly; 240, platform plate; 250, longitudinal needle die assembly;

[0057] 300, upper test module; 310, first block test assembly; 320, second lateral needle die assembly; 330, first ceiling assembly; 340, second block test assembly; 350, second ceiling assembly;

[0058] 211, support frame; 212, product support block; 213, support limiting block;

[0059] 221, sliding frame; 222, needle die;

[0060] 251, B2B test needle die; 252, HOTBAR test needle die;

[0061] 311, block cover plate; 312, block; 313, probe;

[0062] 321, connecting block; 322, adapter plate; 323, probe fixing block; 324, double-end spring probe. DETAILED DESCRIPTION

[0063] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0064] It can be understood that the terms "first", "second", etc. used in the present application can be used herein to describe various elements, but unless specifically stated, these elements are not limited by these terms. These terms are only used to distinguish the first element from another element. The direction of X / Y / Z axis mentioned in the present application depends on the construction of the spatial coordinate system. In the case where the scheme does not contradict, the X axis can be the Y axis, the Y axis can be the Z axis, and so on. The "upper", "lower" orientation words used in the present application are used to describe the positional relationship between components, and do not limit the positional relationship in the general sense of space. For example, "upper" and "lower" can also be "left" and "right", "front" and "back", or diagonal relative positional relationship, which is not listed one by one here.

[0065] In the first embodiment, as shown in Figure 1 , a needle mode testing device suitable for multi-process and multi-station is proposed, which comprises a carrier 100, a lower testing module 200 and an upper testing module 300.

[0066] In the present embodiment, the carrier 100 is suitable for two scenarios: one is a straight-line assembly line, suitable for detecting a flexible circuit board in a bent state, corresponding to the second and third embodiments of the present application, as shown in Figure 1 ; the other is a carousel production line, suitable for detecting a flat flexible circuit board, corresponding to the fourth and fifth embodiments of the present application, that is, placing the carrier 100 on a disc provided with multiple stations. Figure 1

[0067] In the second embodiment, as shown in Figures 2-7 , a needle mode testing device suitable for multi-process and multi-station is proposed, which comprises:

[0068] The carrier 100 is arranged on a straight-line assembly line and is used to place a flexible circuit board in a bent state;

[0069] The lower testing module is arranged below the carrier 100 and comprises a lateral positioning assembly 210, a first lateral needle mode assembly 220 and a jacking assembly 230; the lateral positioning assembly 210 and the first lateral needle mode assembly 220 are arranged on top of the jacking assembly 230; the jacking assembly 230 is used to jack up the carrier 100, the lateral positioning assembly 210 and the first lateral needle mode assembly 220; the lateral positioning assembly 210 is used for X-axis positioning of the flexible circuit board; and the first lateral needle mode assembly 220 is used for X-axis contact testing of the flexible circuit board.

[0070] ​The upper test module, arranged above the carrier 100, comprises a first pressing block test assembly 310, a second lateral pin test assembly 320 and a first top plate assembly 330, wherein the first pressing block test assembly 310 and the second lateral pin test assembly 320 are arranged at the bottom of the first top plate assembly 330; the first top plate assembly 330 is used to drive the first pressing block test assembly 310 and the second lateral pin test assembly 320 to move downward, the first pressing block test assembly 310 is used for Z-axis secondary positioning and contact test of the flexible circuit board, and the second lateral pin test assembly 320 is used for Y-axis contact test of the flexible circuit board.

[0071] In the embodiment, the carrier 100 has 20 holes, and 20 products can be simultaneously placed and tested, and the test efficiency is high. The number of holes is determined according to the production situation. The upper test module and the lower test module are arranged above and below the assembly line respectively. The carrier 100 is placed with products and moves along with the assembly line. When reaching the lower part of the upper test module, the device senses the signal. The jacking assembly 230 of the lower test module jacks up the carrier 100 and completes positioning. The upper test module moves downward and presses on the carrier 100 to start testing. A plurality of carriers 100 run on one assembly line. The products are placed in the carrier 100 by the feeding device before the upper assembly line. Then, the carrier 100 moves on the assembly line and reaches the test station when reaching the lower part of the upper test module. The carrier 100 is jacked up by the lower test module. The lower test module has a guide shaft, which cooperates with the bushing of the carrier 100 to complete positioning. The lower test module has a carrier 100 support block. After positioning, the carrier 100 reaches the surface. Then, the lateral positioning assembly 210 of the lower test module moves under the action of the cylinder and contacts the flexible circuit board to realize X-axis primary positioning. Then, the first pressing block test assembly 310 and the second lateral pin test assembly 320 move downward under the pushing of the first top plate assembly 330. The limiting block of the first top plate assembly 330 contacts the carrier plate of the carrier 100, and the pressing is in place. In this process, the first pressing block test assembly 310 contacts the product to complete the secondary positioning of the product. The first pressing block test assembly 310 is provided with a probe, which contacts the contact point of the product for testing the Z-direction point of the product. Then, the second lateral pin test assembly 320 on the top plate moves under the action of the cylinder on the first top plate assembly 330. The second lateral pin test assembly 320 is provided with a probe, which contacts the product to complete the Y-direction contact test of the product. Finally, the first lateral pin test assembly 220 on the lower test module moves under the action of the cylinder and contacts the product to complete the X-direction contact test of the product.

[0072] In the embodiment, the device is a needle mold separation type test structure, which is used for the batch production of products in a bending state on a multi-hole assembly line and multi-process equipment, and can significantly reduce the number of test needle mold assemblies in the equipment. Since the needle mold has a high cost and needs to be maintained frequently, and the maintenance is difficult, the needle mold is a key structure of the test module and has a direct impact on the test yield, and each needle mold tail has a wire adapter signal, and reducing the needle mold can reduce the corresponding adapter circuit, so that the device and method can greatly reduce the equipment cost, increase the equipment stability, and reduce the investment and cost of maintenance personnel.

[0073] In an optimization scheme, as shown in Figure 3 The lateral positioning assembly 210 includes:

[0074] The support frame 211 is laterally connected to the driving device and is arranged on the top of the jacking assembly 230.

[0075] The product support block 212 is arranged on the support frame 211.

[0076] The support limiting block 213 is arranged on the support frame 211 and is used to limit the product support block 212.

[0077] The spring is arranged between the product support block 212 and the support limiting block 213.

[0078] In the optimization scheme, the driving device can be selected from all existing power devices including air cylinders, which act to push the support frame 211 close to the flexible circuit board. Under the driving of the support frame 211, the support limiting block 213 contacts the flexible circuit board to reshape and position the flexible circuit board; and the spring serves as a buffer to avoid damaging the flexible circuit board.

[0079] In an optimization scheme, as shown in Figure 4 The first lateral needle mold assembly 220 includes:

[0080] The sliding frame 221 is laterally connected to the driving device and is used for lateral movement.

[0081] The needle mold 222 is arranged on the first sliding frame 221 and is used for lateral contact test.

[0082] In the optimization scheme, the driving device can be selected from all existing power devices including air cylinders, which act to push the sliding frame 221 close to the flexible circuit board. The sliding frame 221 is slidably arranged above the jacking assembly 230 and can realize reciprocating movement in the X-axis direction. The needle mold is used for X-axis direction contact test.

[0083] In an optimization scheme, as shown in Figure 6 The first pressing block test assembly 310 includes:

[0084] A pressing block cover plate 311 is arranged on the top of the first top plate assembly 330;

[0085] A pressing block 312 is connected to the pressing block cover plate 311 by a spring;

[0086] A probe 313 is connected to the needle sleeve protection shell on the pressing block cover plate 311 and passes through the pressing block 312.

[0087] In the optimization scheme, the pressing block cover plate 311 is fixedly arranged on the top plate, the tail of the probe 313 is connected and protected by the needle sleeve protection shell, and the needle head of the probe 313 is arranged in the needle hole of the pressing block 312. A spring is arranged between the pressing block 312 and the pressing block cover plate 311; when the first pressing block test assembly 310 is pressed down, the limiting block on the top plate will be in contact with the carrier plate of the carrier 100, at which time the pressing is completed and the secondary positioning of the product is completed, and at the same time the probe 313 of the pressing block will be in contact with the contact point on the product for testing the point position of the product in the Z direction.

[0088] In the optimization scheme, after the lateral positioning assembly 210 is positioned, the product is first shaped and positioned, and then the upper test module is pressed down on the carrier 100. Each first pressing block test assembly 310 on the upper test module will be pressed on the corresponding product positioning block. After the product is placed on the product positioning block, the product will rebound after being bent, resulting in uncertainty of the vertical position, so there is uncertainty in the left-right and up-down positions. After the first shaping of the lateral positioning assembly 210, the front and rear degrees of freedom are determined, and the up-down degrees of freedom are left. The first pressing block test assembly 310 is pressed on the product positioning block to perform the second shaping and positioning of the product, and all degrees of freedom are eliminated to completely position the product. In addition to shaping the product, the probe of the first pressing block test assembly 310 can test the point position of the front of the product, and the pressing block and the upper test module have a floating gap to compatible with the position error between the multiple-hole test products.

[0089] In an optimization scheme, as shown in Figure 7 The second lateral needle module assembly 320 includes:

[0090] A connecting block 321 is connected to the driving device laterally;

[0091] An adapter plate 322 is arranged on the connecting block 321 laterally;

[0092] A probe fixing block 323 is arranged on the adapter plate 322 laterally;

[0093] A double-head spring probe 324 is arranged on the probe fixing block 323 laterally.

[0094] In the optimization scheme, the driving device can select all existing power devices including the air cylinder, which acts on the connecting block 321 to push it close to the flexible circuit board. When pushed laterally, the double-end spring probe 324 contacts the Y-axis contact of the product, thereby realizing detection.

[0095] The optimization schemes of the above-described embodiments can be combined in any manner. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described, and however, as long as the combinations of the technical features do not contradict each other, they should be considered within the scope of the present disclosure.

[0096] In a third embodiment, a needle mode testing method suitable for multiple processes and multiple stations is provided, which is suitable for the needle mode testing device suitable for multiple processes and multiple stations described in the second embodiment. The needle mode testing method suitable for multiple processes and multiple stations includes the following steps S102-S112:

[0097] Step S102, placing the bent flexible circuit board on the carrier 100 of the production line;

[0098] Step S104, when the carrier 100 moves to the working area, the lower test module lifts the carrier 100, and the lateral positioning assembly 210 of the lower test module completes the shaping and positioning of the flexible circuit board in the horizontal direction;

[0099] Step S106, controlling the lower movement of the upper test module, so that the first pressing block test assembly 310 of the upper test module realizes the positioning of the flexible circuit board in the Z-axis direction and connects the contacts in the Z-axis direction;

[0100] Step S108, controlling the second lateral needle mode assembly 320 of the upper test module to connect the contacts of the flexible circuit board in the Y-axis direction;

[0101] Step S110, controlling the first lateral needle mode assembly 220 of the lower test module to connect the contacts of the flexible circuit board in the X-axis direction;

[0102] Step S112, turning on the circuit to realize detection.

[0103] In this embodiment, the method adopts a separate detection method, which is used in the case of batch production of products in a molded and bent state on a multi-hole production line and multiple process equipment, can significantly reduce the number of test needle mode assemblies in the equipment, greatly reduce the cost of the equipment, increase the stability of the equipment, and reduce the investment and cost of maintenance personnel.

[0104] In a fourth embodiment, as shown in Figures 8-10 a needle mode testing device suitable for multiple processes and multiple stations is provided, characterized in that the needle mode testing device suitable for multiple processes and multiple stations includes:

[0105] Carrier 100 is set on a rotary assembly line and is used to place flattened flexible circuit boards.

[0106] The lower test module is located below the carrier 100 and includes a platform plate 240 and a longitudinal needle mold assembly 250. The longitudinal needle mold assembly 250 is disposed on the platform plate 240 and is used for contact testing.

[0107] The upper test module is located above the carrier 100 and includes a second pressure block test component 340 and a second second plate assembly 350. The second pressure block test component 340 is located on the second second plate assembly 350. The second second plate assembly 350 is used to drive the second pressure block test component 340 and the carrier 100 to press down. The second pressure block test component 340 is used to perform contact testing on the flexible circuit board.

[0108] The carrier 100 is provided with a bushing, and both the lower test module and the upper test module are provided with guide shafts. The bushing is used to connect with the guide shafts.

[0109] In this embodiment, the jig's disc is mounted on a rotary cylinder. At least two carriers 100 can be mounted on the disc and can rotate to switch between the loading station and the testing station. During testing, the carrier 100 completes product loading at station one. The disc rotates, moving carrier 100 from station one to station two, i.e., the testing station. The upper testing module presses down, and the bushing on the second plate assembly 350 engages with and positions the guide shaft of carrier 100 to ensure engagement accuracy. The second pressing block testing assembly 340 presses down on the product positioning block of carrier 100. Then, carrier 100 and the second plate assembly 350 move downward together until they press down on the lower testing module. The guide shaft of the lower testing module engages with the bushing of carrier 100 to complete positioning. Then, the second plate assembly 350 continues to press down until the top plate limit block presses down on carrier 100, and then the test is performed.

[0110] In this embodiment, the product is in a flat state since it is not bent. After the product is placed into the product positioning block, it is fixed in place. Simultaneously, the product positioning block has vacuum suction holes, generating suction to hold the product in place. The structure of the second pressure block test assembly 340 can refer to the first pressure block test assembly 310 of the second embodiment. After the upper test module presses onto the carrier 100, the spring force in the second pressure block test assembly 340 is moderate, preventing compression that would cause the probe to leak out and press onto the product. There is a spring and a guide shaft between the carrier 100 and the rotating platform. After the carrier 100 contacts the upper test module, it continues to move downwards together until it presses onto the platform plate 240 of the lower test module. The structure of the longitudinal needle mold assembly 250 can adopt the first pressure block test assembly 310 of the second embodiment, or it can adopt the following structure:

[0111] As shown in Figure 9 the longitudinal needle mold assembly 250 includes a guide shaft, a B2B test needle mold 251 and a HOTBAR test needle mold 252, the guide shaft passes through the B2B test needle mold 251 and the HOTBAR test needle mold 252, and a spring is elastically connected between the B2B test needle mold 251 and the HOTBAR test needle mold 252. The needle ejection process is: the upper test module is pressed on the carrier 100, the carrier 100 moves downward together with the upper test module, the product positioning block on the carrier 100 is pressed on the longitudinal needle mold assembly 250 of the lower test module, then the longitudinal needle mold assembly 250 of the lower test module starts one-stage compression needle ejection, then the second block test assembly 340 of the upper test module starts one-stage compression needle ejection, then the longitudinal needle mold assembly 250 and the second block test assembly 340 start overall floating to ensure adhesion. The reason is that the product positioning block on the carrier 100 is adhesion with the longitudinal needle mold assembly 250 of the lower test module, which is the complete positioning of the product, and then the needle can be ejected.

[0112] In a fifth embodiment, a needle mold test method suitable for multiple processes and multiple stations is proposed, which is suitable for the needle mold test device suitable for multiple processes and multiple stations described in the fourth embodiment. The needle mold test method suitable for multiple processes and multiple stations includes the following steps S202-S208:

[0113] Step S202, place the flattened flexible circuit board on the turntable type carrier 100;

[0114] Step S204, when the carrier 100 rotates to the working area, control the upper test module to press down, so that the second block test assembly 340 of the upper test module connects the contact points on the upper surface of the flexible circuit board;

[0115] Step S206, control the upper test module to continue to drive the carrier 100 to press down, so that the longitudinal needle mold assembly 250 of the lower test module connects the contact points on the lower surface of the flexible circuit board;

[0116] Step S208, turn on the circuit to realize detection.

[0117] The specific process of step S206 is: the upper test module is pressed on the carrier 100, the carrier 100 moves downward together with the upper test module, the product positioning block on the carrier 100 is pressed on the longitudinal needle mold assembly 250 of the lower test module, then the longitudinal needle mold assembly 250 of the lower test module starts one-stage compression needle ejection, then the second block test assembly 340 of the upper test module starts one-stage compression needle ejection, then the longitudinal needle mold assembly 250 and the second block test assembly 340 start overall floating to ensure adhesion.

[0118] Comparing the second embodiment and the fourth embodiment, the needle mold testing device and method suitable for multi-process and multi-station, both have the same overall structure, the upper test module, the carrier 100 and the lower test module, and are suitable for multi-process and multi-station needle mold detection, and the difference between the two is as follows:

[0119] Point one: the shaped and bent product is not enough to complete the complete shaping and positioning of the product on the carrier 100, and the upper test module and the lower test module need to be provided with a module for shaping and positioning, such as the lateral positioning assembly 210 and the first pressing block test assembly 310 of the second embodiment; the positioning of the flat product is relatively simple, and the product positioning block and the cover plate on the carrier 100 can complete the product positioning, and the upper test module and the lower test module only contain the test module, and can not contain the module for shaping and positioning.

[0120] Point two: the upper test module of the second embodiment has a downward pressing action, and the lower test module has an upward pressing action, the upper test module of the fourth embodiment has a downward pressing action, and the carrier 100 moves downward together with the upper test module until it is pressed on the lower test module, and the lower test module is fixed. It should be noted that the upward pressing action of the lower test module is not necessary, and is determined according to the specific equipment working condition, and the vertical lifting mechanism that can bear a large load has a high cost, and in the non-essential working condition, it is necessary to consider not to add.

[0121] The above-described embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as limiting the scope of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.

[0122] The above only describes the preferred embodiments of the present application, and does not limit the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A needle die testing device suitable for multiple processes and multiple workstations, characterized in that, The needle die testing device suitable for multiple processes and multiple workstations includes: A carrier, set on the assembly line, is used to hold flexible circuit boards in a bent state; The lower test module, located below the carrier, includes a lateral positioning component, a first lateral pin mold component, and a lifting component; the lateral positioning component and the first lateral pin mold component are located on top of the lifting component; the lifting component is used to lift the carrier, the lateral positioning component, and the first lateral pin mold component; the lateral positioning component is used for the X-axis positioning of the flexible circuit board; and the first lateral pin mold component is used for X-axis contact testing of the flexible circuit board. The upper test module, located above the carrier, includes a first pressure block test assembly, a second lateral pin mold assembly, and a first top plate assembly. The first pressure block test assembly and the second lateral pin mold assembly are located at the bottom of the first top plate assembly. The first top plate assembly is used to drive the first pressure block test assembly and the second lateral pin mold assembly to move downwards. The first pressure block test assembly is used for secondary positioning and contact testing of the flexible circuit board along the Z-axis, and the second lateral pin mold assembly is used for contact testing of the flexible circuit board along the Y-axis. The lateral positioning component includes: A support frame, laterally connected to a drive unit, is mounted together on top of the lifting assembly; Product support blocks are mounted on the support frame; A support limiting block is disposed on the support frame to limit the product support block; A spring is disposed between the product support block and the support limiting block; The first lateral needle mold assembly includes: A sliding frame, with a lateral drive mechanism, is used for lateral movement; A needle mold, mounted on the sliding frame, is used for lateral contact testing; The second lateral needle mold assembly includes: Connecting block, lateral connection to the drive unit; An adapter plate is laterally mounted on the connecting block; The probe fixing block is laterally mounted on the adapter plate; A double-headed spring probe is laterally mounted on the probe fixing block.

2. The needle die testing device suitable for multiple processes and multiple workstations according to claim 1, characterized in that, The first compaction test component includes: A pressure block cover plate is installed on the top plate at the bottom of the first top plate assembly; The pressure block is connected to the pressure block cover plate by a spring; The probe passes through the pressure block and connects to the needle sleeve protective shell on the pressure block cover.

3. A needle die testing method applicable to multiple processes and multiple workstations, characterized in that, The needle die testing method applicable to multiple processes and multiple workstations is applied to the needle die testing device applicable to multiple processes and multiple workstations as described in claim 1 or 2, and specifically includes the following steps: The bent flexible circuit board is placed on a carrier on the production line; When the carrier moves to the working area, the lower test module lifts the carrier, and the lateral positioning component of the lower test module completes the horizontal shaping and positioning of the flexible circuit board. The upper test module is moved downward, so that the first pressing block test component of the upper test module can position the flexible circuit board in the Z-axis direction and connect the contact point in the Z-axis direction; The second lateral pin mold assembly of the control test module is connected to the contact point in the Y-axis direction of the flexible circuit board; The first lateral pin mold assembly of the controlled test module is connected to the contact point in the X-axis direction of the flexible circuit board; Connect the circuit to perform the detection.

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