Current measurement method, semiconductor test board card and semiconductor test equipment

Abstract

The invention is suitable for the technical field of semiconductor testing, and provides a current measurement method, a semiconductor test board card and semiconductor test equipment, and the method comprises the steps: carrying out the sampling of the working current of a specified chip within a sampling time, and obtaining a plurality of first sampling points; acquiring a current change slope of each first sampling point; based on the reference sampling point and each current change slope, identifying the plurality of first sampling points to obtain an identification result; and determining the target current of the specified chip based on the identification result. According to the invention, the stability and accuracy of current measurement can be improved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor testing, and in particular, relates to a current measurement method, a semiconductor testing board, a semiconductor test and a computer program product. Background Art

[0002] In the field of chip testing, current measurement is an important part of the entire testing process. By measuring the current of each pin of the chip at different working stages, it is possible to analyze whether the internal circuit of the chip is working normally, which will directly determine whether the chip can pass the test. Therefore, the stability and accuracy of the current measurement value are particularly important. In addition to directly affecting the production yield, it can also provide a reference for R&D design.

[0003] As the functions of various chips with periodic fluctuations in power consumption become more and more powerful and the number of test items increases, higher requirements are placed on the test accuracy and efficiency of such chips.

[0004] For this type of chip, the traditional current measurement method only obtains the current average value of all sampling points within the sampling time. Since the current fluctuates periodically and the points measured each time cannot be exactly integer multiples of the period, the current value measured each time in the same scenario may fluctuate, or the measurement time may be long and the operation may be cumbersome, affecting the accuracy and efficiency of production testing. Summary of the invention

[0005] In view of this, the embodiments of the present application provide a current measurement method, a semiconductor test board, a semiconductor test and a computer program product, which can obtain accurate and stable output while ensuring test efficiency.

[0006] A first aspect of an embodiment of the present application provides a current measurement method, including:

[0007] Within the sampling time, sampling the working current of the designated chip to obtain a plurality of first sampling points;

[0008] Obtaining a current change slope of each of the first sampling points;

[0009] Based on a reference sampling point and each current change slope, identifying a plurality of the first sampling points to obtain an identification result;

[0010] Based on the identification result, a target current of the designated chip is determined.

[0011] In an implementation of the first aspect, the identifying of the plurality of first sampling points based on the reference sampling point and each current change slope to obtain an identification result includes:

[0012] identifying a second sampling point from the plurality of first sampling points, wherein a current change slope of the second sampling point is the same as a current change slope of the reference sampling point;

[0013] A recognition result is determined based on the sampling points between the reference sampling point and any second sampling point.

[0014] In an implementation of the first aspect, determining a recognition result based on a designated sampling point between the reference sampling point and any one of the second sampling points includes:

[0015] If the number of sampling points between the reference sampling point and any of the second sampling points is lower than a number threshold, a new second sampling point is reselected.

[0016] The number of sampling points between the new second sampling point and the reference sampling point is greater than or equal to the number threshold.

[0017] In an implementation of the first aspect, the identifying the plurality of sampling points based on a reference sampling point and each current change slope to obtain an identification result includes:

[0018] Selecting, from the plurality of sampling points, a third sampling point having a same trend direction as that of the current change at the reference sampling point;

[0019] respectively determining the difference between the current change slope of the reference sampling point and the current change slope of each of the third sampling points;

[0020] Based on the third sampling point whose difference does not exceed the difference threshold and the reference sampling point, a recognition result is determined.

[0021] In an implementation of the first aspect, determining the target current of the designated chip based on the identification result includes:

[0022] If the recognition result includes sampling points, obtaining a first current value of each sampling point of the recognition result;

[0023] All the first current values ​​are weighted and averaged to obtain the target current of the designated chip.

[0024] In an implementation of the first aspect, determining the target current of the designated chip based on the identification result includes:

[0025] If the identification result does not include a sampling point, obtaining a second current value of each of the first sampling points;

[0026] All the second current values ​​are weighted and averaged to obtain the target current of the designated chip.

[0027] In an implementation manner of the first aspect, the operating current of the designated chip is a periodic fluctuating current, and the sampling time is lower than a current fluctuation period of the operating current.

[0028] A second aspect of an embodiment of the present application provides a semiconductor test board, the board comprising:

[0029] A sampling module, used for sampling the working current of a specified chip within a sampling time to obtain a plurality of first sampling points;

[0030] An acquisition module, used for acquiring the current change slope of each of the first sampling points;

[0031] An identification module, configured to identify the plurality of first sampling points based on a reference sampling point and each current change slope, and obtain an identification result;

[0032] A determination module is used to determine a target current of the designated chip based on the identification result.

[0033] A third aspect of an embodiment of the present application provides a semiconductor testing device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the computer device implements the method described in the first aspect above.

[0034] A fourth aspect of the embodiments of the present application provides a computer program product, which stores a computer program. When the computer program is executed by a processor, the method described in the first aspect is implemented.

[0035] In the first aspect of the embodiment of the present application, the working current of the specified chip is sampled within the sampling time to obtain multiple first sampling points, and the current change slope of each first sampling point is obtained. These first sampling points are identified based on the reference sampling point and the current change slope of the first sampling point to obtain an identification result, and then the target current of the specified chip is determined. In this way, valid data in periodic changes can be effectively extracted, the stability of data between different measurements can be achieved, fluctuations can be eliminated, and the measurement time can be significantly shortened, and the test efficiency and accuracy can be improved.

[0036] It can be understood that the beneficial effects of the second to fourth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0038] Figure 1 is a flow chart of an implementation of a current measurement method provided in an embodiment of the present application;

[0039] Figure 2 This is an example diagram of the operating current of a specified chip provided in an embodiment of the present application;

[0040] Figure 3 is a flow chart of the implementation of the sampling point identification method provided in the embodiment of the present application;

[0041] Figure 4 is an example diagram of sampling points with the same slope provided in an embodiment of the present application;

[0042] Figure 5 is another implementation flow chart of the sampling point identification method provided in an embodiment of the present application;

[0043] Figure 6 is a flowchart of a method for determining a target current provided in an embodiment of the present application;

[0044] Figure 7 is a flow chart of the implementation of the current measurement method of the CIS chip provided in the embodiment of the present application;

[0045] Figure 8 is a schematic diagram of a current measuring device provided in an embodiment of the present application;

[0046] Fig. 9 It is a schematic diagram of a computer device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0047] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0048] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0049] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0050] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0051] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0052] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0053] In one embodiment, Figure 1 As shown, a current measurement method is provided, and the method is applied to a computer device for measuring the working current of a chip as an example for description, including the following steps S101 to S104. Among them:

[0054] Step S101: sampling the working current of a designated chip within a sampling time to obtain a plurality of first sampling points.

[0055] In applications, the designated chip refers to a chip in the chip field whose power consumption has periodic fluctuations. The working current of the designated chip presents a periodic fluctuation state.

[0056] For example, if the designated chip is a camera image sensor (CIS) chip, the workflow of the CIS chip can be divided into acquisition parameter configuration, raw data acquisition, data compression and data transmission. The raw data acquisition stage requires the mobilization of all photosensitive transistor circuits on the chip, so the energy consumption of this stage is the largest. The energy consumption of other stages is relatively small, so the working current of the CIS chip will show a periodic fluctuation state. The example diagram of the working current of the CIS chip is as follows: Figure 2 As shown by Figure 2 It can be seen that the working current of the CIS chip has the characteristics of a periodic waveform.

[0057] In applications, when a computer device starts a current measurement for a specified chip, it will last for a period of time, that is, the measurement time is also called the sampling time. During this sampling time, the computer device will continuously sample the working current of the specified chip to obtain multiple sampling points.

[0058] Step S102, obtaining the current change slope of each first sampling point.

[0059] In the application, after the computer device acquires all the first sampling points within the sampling time, it calculates the current change slope of each first sampling point. The current change slope refers to the current change of the working current at the corresponding sampling point. The current change slope can be determined by the difference between two adjacent sampling points.

[0060] For example, the sampling time is N and the sampling frequency is f s , then the number of sampling points N = T × f s , the current value of each first sampling point is recorded as I(t i ), where t i is the sampling time point. The current change slope S(t i ) can be calculated by the difference between two adjacent sampling points. The current change slope is determined by the following formula (1):

[0061]

[0062] Step S103 , identifying a plurality of first sampling points based on the reference sampling point and each current change slope to obtain an identification result.

[0063] In the application, the reference sampling point is the reference for sampling point identification. The computer device can determine the reference sampling point from the first sampling point and identify the first sampling point based on the current change slope of the reference sampling point. The reference sampling point can be the first sampling point in the sampling time.

[0064] In the application, the computer device uses the current change slope of the reference sampling point as the identification basis, and identifies the first sampling point in combination with the identification condition set based on the current change slope. Based on the periodic fluctuation characteristics of the working current of the designated chip, the identification condition can be the same current change slope as the reference sampling point, that is, a sampling point with the same current change slope as the reference sampling point is identified from multiple first sampling points. In addition, considering the influence of noise, the current of the designated chip may not be able to determine the sampling point with the same current change slope as the reference sampling point. Based on this identification condition, the difference between the current change slope of the reference sampling point and the reference sampling point can also be lower than the difference threshold, that is, a sampling point with a difference between the current change slope of the reference sampling point and the reference sampling point is lower than the difference threshold from the multiple first sampling points. It should be noted that the trend of current change indicated by the current change slope of the identified sampling point also needs to be consistent with the trend of current change indicated by the current change slope of the reference sampling point.

[0065] In the application, the identification result includes a plurality of sampling points that meet the identification condition selected from the first sampling points. If the identification condition may be the same current change slope as the reference sampling point, the identification result includes: sampling points between the reference sampling point and at least one second sampling point that has the same current change slope as the reference sampling point. If the identification condition may also be that the difference in current change slope with the reference sampling point is lower than a difference threshold, the identification result includes: all sampling points between the reference sampling point and at least one sampling point whose difference in current change slope with the reference sampling point is lower than the difference threshold.

[0066] Step S104: determining a target current of a designated chip based on the identification result.

[0067] In the application, the computer device determines whether the recognition result includes sampling points that meet the recognition conditions. If included, the current average of all sampling points of the recognition result is directly determined as the target current of the designated chip.

[0068] In an application, if the identification result does not include a sampling point that meets the identification conditions, it means that the sampling time is too short compared to the current variation period, and the average current value of all the first sampling points can be used as the target current of the designated chip.

[0069] In this embodiment, the working current of the specified chip is sampled during the sampling time to obtain multiple first sampling points, and the current change slope of each first sampling point is obtained. These first sampling points are identified based on the reference sampling point and the current change slope of the first sampling point to obtain the identification result, and then the target current of the specified chip is determined. In this way, valid data in periodic changes can be effectively extracted, the stability of data between different measurements can be achieved, fluctuations can be eliminated, and the measurement time can be significantly shortened, and the test efficiency and accuracy can be improved.

[0070] In one embodiment, Figure 3 As shown, the implementation process of step S103 includes the following steps S201 to S202. Among them:

[0071] Step S201 : identifying a second sampling point from a plurality of sampling points, wherein a current change slope of the second sampling point is the same as a current change slope of a reference sampling point.

[0072] In an application, if the identification condition is that the current change slope is the same as that of the reference sampling point, the computer device selects at least one second sampling point having the same current change slope as that of the reference sampling point from the first sampling points.

[0073] For example, Figure 4 As shown, the sampling point at time t1 is taken as the reference sampling point, and the sampling points at times t2, t3, t4, and t5 in the figure are all second sampling points with the same current change slope.

[0074] Step S202: determining a recognition result based on a sampling point between the reference sampling point and any second sampling point.

[0075] In the application, if there is at least one second sampling point, the computer device uses any second sampling point as the third sampling point, and determines the reference sampling point and the third sampling point, as well as all sampling points therebetween, as the recognition result.

[0076] For example, Figure 4 As shown in the figure, the sampling point at time t1 is taken as the reference sampling point, and the sampling points at time t2, t3, t4, and t5 in the figure are all second sampling points. Then the sampling points between t1 and t2 can be used as the recognition result, or the sampling points between t1 and t3 can be used as the recognition result, or the sampling points between t1 and t4 can be used as the recognition result.

[0077] This embodiment can effectively screen out current data with the same current change slope, ensure that the selected data has high consistency, and obtain an accurate current average value in a shorter time.

[0078] In one embodiment, the implementation process of step S203 includes the following: if the number of sampling points between the reference sampling point and any second sampling point is lower than the number threshold, reselecting a new second sampling point; wherein the number of sampling points between the new second sampling point and the reference sampling point is greater than or equal to the number threshold.

[0079] In the application, if the number of sampling points between the reference sampling point and any selected second sampling point is lower than the number threshold, then in order to ensure calculation accuracy, the computer device reselects a new second sampling point, and the number of sampling points between the new second sampling point and the reference sampling point reaches the number threshold.

[0080] Exemplarily, as shown in Figure 4, any second sampling point is a sampling point at time t2. If the number of sampling points between t1 and t2 does not reach the number threshold, a new second sampling point can be selected from t3, t4, and t5. The number of sampling points between the new second sampling point and the reference sampling point needs to reach the number threshold. It should be noted that the computer device can also directly use t5 as any second sampling point, that is, directly use all sampling points between the reference sampling point and the last second sampling point with the same current change slope as the recognition result.

[0081] This embodiment can ensure that when the amount of data is insufficient, the validity and reliability of the data can be improved by reselecting appropriate sampling points, thereby ensuring the accuracy and stability of the final measurement results, avoiding measurement errors caused by insufficient data, and improving the overall efficiency and accuracy of the test.

[0082] In one embodiment, Figure 5 As shown, the implementation process of step S103 includes the following steps S301 to S303. Among them:

[0083] Step S301 : selecting a third sampling point having the same trend direction of current change as that at the reference sampling point from among the plurality of sampling points.

[0084] In applications, due to the presence of noise, it may not be possible to obtain a sampling point with the same current change frequency as the reference sampling point. Therefore, the computer device needs to obtain a sampling point whose difference in current change slope with the reference sampling point is lower than the difference threshold. Since the current change slope has positive slope and negative slope, the positive slope represents the trend direction of the current change as rising, and the negative slope represents the trend direction of the current change as falling. In order to ensure the accuracy of the current calculation, the computer device needs to select a third sampling point with the same trend direction as the current change at the reference sampling point.

[0085] Step S302 , respectively determining the difference between the current change slope of the reference sampling point and the current change slope of each third sampling point.

[0086] In the application, the computer device determines the difference between the current change slope of each third sampling point and the current change slope of the reference sampling point, and compares them with the preset difference threshold to obtain the comparison result.

[0087] Step S303: determining a recognition result based on the third sampling point and the reference sampling point whose difference does not exceed a preset threshold.

[0088] In the application, all sampling points between the third sampling point whose difference does not exceed the difference threshold and the reference sampling point are taken as recognition results.

[0089] This embodiment can effectively screen out sampling points with similar change trends based on the identification method of the difference in current change slope, ensure the consistency of the selected data, improve the accuracy and stability of the measurement results, and at the same time reduce the complexity of data processing and improve test efficiency.

[0090] In one embodiment, Figure 6 As shown, the implementation process of step S104 includes the following steps S401 to S402.

[0091] Step S401: if the recognition result includes sampling points, a first current value of each sampling point of the recognition result is obtained.

[0092] In an application, when the recognition result includes sampling points, the computer device obtains the first current value of each sampling point in the recognition result as basic data for determining the target current of the designated chip.

[0093] Step S402: performing weighted averaging on all first current values ​​to obtain a target current of a designated chip.

[0094] In the application, the computer device performs weighted averaging on the first current values ​​of all sampling points in the identification result, and the desired current average is used as the target current of the designated chip.

[0095] This embodiment can effectively utilize the identified effective sampling points, further improve the accuracy and stability of the measurement results through weighted averaging, reduce the impact of noise and fluctuations, and ensure the reliability of the test results.

[0096] In one embodiment, the implementation process of step S104 further includes: if the identification result does not include the sampling point, obtaining the second current value of each first sampling point; and performing weighted averaging on all the second current values ​​to obtain the target current of the specified chip.

[0097] In applications, if the sampling time is much shorter than the current fluctuation period, the computer device often cannot find a sampling point that meets the identification conditions from the first sampling point, and the number of sampling points in the identification result is zero. The computer device can directly perform a weighted average on the current values ​​of all the first sampling points to obtain the target current of the specified chip.

[0098] This embodiment can ensure the integrity of the data when no sampling points meeting the identification conditions can be found, avoiding the loss of valid data due to overly strict data screening, thereby ensuring the reliability and accuracy of the measurement results, while simplifying the data processing process and improving the flexibility and efficiency of the test.

[0099] In one embodiment, the working current of the designated chip is a periodic fluctuating current, and the sampling time is lower than the current fluctuation period of the working current. In an application, the working current of the designated chip is a periodic fluctuating current, and when the sampling time is lower than the current fluctuation period of the working light, fast and stable current measurement can be achieved.

[0100] The following takes the CIS chip as an example. Figure 7 The current measurement method of the present application is described, wherein, since the CIS chip consumes a high amount of energy during the image acquisition stage, the measured current value presents a periodic change, and the specific period is related to the frequency of its image acquisition, and the frequency changes with the acquisition parameter configuration of the CIS chip. The implementation process of a current measurement operation performed by a computer device includes the following steps S501 to S507:

[0101] Step S501 : collecting a plurality of first sampling points of the working current of the CIS chip within a sampling time.

[0102] In the application, when the computer device starts a current measurement, it will continuously sample the current value within the set sampling time.

[0103] Step S502: determining the current change slope of each first sampling point.

[0104] In the application, after all the first sampling points are collected, the slope of the starting point is calculated.

[0105] Step S503 , searching for at least one second sampling point having the same current change slope as the first first sampling point.

[0106] Step S504, determining whether the second sampling point is found, if found, executing step S505, if not found, executing step S506.

[0107] Step S505 , determining the current averages of all sampling points between the first first sampling point and the last second sampling point.

[0108] Step S506, determining the current average of all first sampling points.

[0109] In the application, if no sampling point with the same current change slope is found in the subsequent data, it is considered that the current sampling time is too short compared to the current change period. The average of all sampling points is directly calculated as the final measurement value, which can achieve fast and stable current measurement.

[0110] Step S507: taking the current average as the target current of the chip.

[0111] In this embodiment, for the test of periodic fluctuating current, the stability of data between different measurements can be achieved and fluctuations can be eliminated. The measurement time is short, and at least less than one cycle of sampling data is required under the premise of small fluctuations. Accurate and stable output can be obtained while ensuring test efficiency.

[0112] The present application also provides a semiconductor test board for executing the steps in the above current measurement method embodiment. Figure 8 As shown, the semiconductor test board 800 provided in the embodiment of the present application includes:

[0113] The sampling module 810 is used to sample the working current of the specified chip within the sampling time to obtain multiple first sampling points.

[0114] The acquisition module 820 is used to acquire the current change slope of each first sampling point.

[0115] The identification module 830 is used to identify the multiple first sampling points based on the reference sampling point and each current change slope to obtain an identification result.

[0116] The determination module 840 is used to determine the target current of the specified chip based on the identification result.

[0117] In one embodiment, the identification module is further used to identify a second sampling point from the plurality of first sampling points, the current change slope of the second sampling point being the same as the current change slope of the reference sampling point; and determine the identification result based on the sampling points between the reference sampling point and any second sampling point.

[0118] In one embodiment, the identification module is further configured to reselect a new second sampling point if the number of sampling points between the reference sampling point and any second sampling point is lower than a number threshold, wherein the number of sampling points between the new second sampling point and the reference sampling point is greater than or equal to the number threshold.

[0119] In one embodiment, the identification module is further used to select a third sampling point having the same trend direction as the current change at the reference sampling point from the multiple sampling points; respectively determine the difference between the current change slope of the reference sampling point and the current change slope of each third sampling point; and determine the identification result based on the third sampling point and the reference sampling point whose difference does not exceed the difference threshold.

[0120] In one embodiment, the determination module is further configured to obtain a first current value of each sampling point of the identification result if the identification result includes sampling points; and perform weighted averaging on all first current values ​​to obtain a target current of the designated chip.

[0121] In one embodiment, the determination module is further configured to obtain the second current value of each first sampling point if the identification result does not include the sampling point; and perform weighted averaging on all the second current values ​​to obtain the target current of the designated chip.

[0122] In one embodiment, the working current of the designated chip is a periodic fluctuating current, and the sampling time is shorter than the current fluctuation period of the working current.

[0123] In applications, each module in the current measuring device may be a software program module, or may be implemented by different logic circuits integrated in a processor, or may be implemented by multiple distributed processors.

[0124] Fig. 9 A schematic diagram of the structure of a semiconductor testing device for a current measurement method provided by an embodiment of the present application. Fig. 9 As shown, the semiconductor testing device 900 of this embodiment includes: at least one processor 910 ( Fig. 9 Only one is shown in the figure) a processor, a memory 920, and a computer program 930 stored in the memory 920 and executable on the at least one processor 910, and when the processor 910 executes the computer program 930, the steps in any of the above-mentioned exception handling method embodiments are implemented.

[0125] The semiconductor testing device 900 may be a computing device such as a desktop computer, a notebook, a PDA, or a cloud server. The semiconductor testing device 900 may include, but is not limited to, a processor 910 and a memory 920. Those skilled in the art will appreciate that Fig. 9 This is only an example of the semiconductor testing device 900 and does not constitute a limitation of the semiconductor testing device 900 . The semiconductor testing device 900 may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, it may also include input and output devices, network access devices, etc.

[0126] The processor 910 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0127] In some embodiments, the memory 920 may be an internal storage unit of the semiconductor test device 900, such as a hard disk or memory of the semiconductor test device 900. In other embodiments, the memory 920 may also be an external storage device of the computer device 900, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the semiconductor test device 900. Further, the memory 920 may also include both an internal storage unit of the semiconductor test device 900 and an external storage device. The memory 920 is used to store an operating system, an application program, a boot loader (BootLoader), data, and other programs, such as the program code of the computer program, etc. The memory 920 may also be used to temporarily store data that has been output or is to be output.

[0128] It should be noted that the information interaction, execution process, etc. between the above-mentioned devices / units are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0129] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0130] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in the above-mentioned method embodiments can be implemented.

[0131] An embodiment of the present application provides a computer program product. When the computer program product runs on a mobile terminal, the mobile terminal can implement the steps in the above-mentioned method embodiments when executing the computer program product.

[0132] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may at least include: any entity or device that can carry the computer program code to the device / terminal device, a recording medium, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electric carrier signal, a telecommunication signal, and a software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk or an optical disk. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electric carrier signals and telecommunication signals.

[0133] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0134] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0135] In the embodiments provided in the present application, it should be understood that the disclosed devices / network equipment and methods can be implemented in other ways. For example, the device / network equipment embodiments described above are merely schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0136] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0137] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A current measurement method, characterized in that: Methods include: Within the sampling time, sampling the working current of the designated chip to obtain a plurality of first sampling points; Obtaining a current change slope of each of the first sampling points; Based on a reference sampling point and each current change slope, identifying a plurality of the first sampling points to obtain an identification result; Based on the identification result, a target current of the designated chip is determined.

2. The current measurement method according to claim 1, characterized in that: The identifying of the plurality of first sampling points based on the reference sampling point and each current change slope to obtain an identification result includes: identifying a second sampling point from the plurality of first sampling points, wherein a current change slope of the second sampling point is the same as a current change slope of the reference sampling point; A recognition result is determined based on the sampling points between the reference sampling point and any second sampling point.

3. The current measurement method according to claim 2, characterized in that: The determining of the recognition result based on the designated sampling point between the reference sampling point and any one of the second sampling points comprises: If the number of sampling points between the reference sampling point and any of the second sampling points is lower than a number threshold, reselecting a new second sampling point; The number of sampling points between the new second sampling point and the reference sampling point is greater than or equal to the number threshold.

4. The current measurement method according to claim 1, characterized in that: The step of identifying the plurality of sampling points based on the reference sampling point and each current change slope to obtain an identification result includes: Selecting, from the plurality of sampling points, a third sampling point having a same trend direction as that of the current change at the reference sampling point; respectively determining the difference between the current change slope of the reference sampling point and the current change slope of each of the third sampling points; Based on the third sampling point whose difference does not exceed the difference threshold and the reference sampling point, a recognition result is determined.

5. The current measuring method according to any one of claims 1 to 4, characterized in that: The step of determining a target current of the designated chip based on the identification result includes: If the recognition result includes sampling points, obtaining a first current value of each sampling point of the recognition result; All the first current values ​​are weighted and averaged to obtain the target current of the designated chip.

6. The current measuring method according to any one of claims 1 to 4, characterized in that: The step of determining a target current of the designated chip based on the identification result includes: If the identification result does not include a sampling point, obtaining a second current value of each of the first sampling points; All the second current values ​​are weighted and averaged to obtain the target current of the designated chip.

7. The current measuring method according to any one of claims 1 to 4, characterized in that: The working current of the designated chip is a periodic fluctuating current, and the sampling time is lower than the current fluctuation period of the working current.

8. A semiconductor test board, characterized in that: The board includes: A sampling module, used for sampling the working current of a specified chip within a sampling time to obtain a plurality of first sampling points; An acquisition module, used for acquiring the current change slope of each of the first sampling points; An identification module, configured to identify the plurality of first sampling points based on a reference sampling point and each current change slope, and obtain an identification result; A determination module is used to determine a target current of the designated chip based on the identification result.

9. A semiconductor testing device, characterized in that: The method comprises a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the computer device implements the method according to any one of claims 1 to 7.

10. A computer program product, characterized in that The invention comprises a computer program, which, when being executed, enables the method according to any one of claims 1 to 7 to be performed.

Images