A reliability test device and test method for an integrated circuit

Abstract

The application discloses a kind of reliability test device and test method of integrated circuit, it is related to integrated circuit test field, including support frame, the both ends of support frame are fixedly connected with support leg, the outer surface of support frame is fixedly connected with conveyor motor, the output of conveyor motor is fixedly connected with transmission unit, the top of support frame is fixedly connected with test unit, the middle part of support frame is provided with water tank, the support frame is fixedly connected with drying unit close to water tank, the end of support frame away from drying unit is fixedly connected with heating bin, the outer surface of heating bin is fixedly connected with heater, the inner wall of heater is fixedly connected with heat preservation curtain, integrated circuit board will be heated in heating bin for a period of time, then the first test unit will carry out performance test to integrated circuit board, then integrated circuit board will be cooled down by water tank and treated by drying unit, finally continue to be detected reliability in the second test unit.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of integrated circuit testing technology, in particular to a reliability testing device and method for integrated circuits. BACKGROUND

[0002] An integrated circuit (IC) is a microelectronic device or component. It uses a certain process to interconnect the required transistors, resistors, capacitors, and inductors in the circuit and wiring together on a small piece or several pieces of semiconductor wafer or dielectric substrate, and then encapsulates them in a tube shell to form a microstructure with the required circuit function. Integrated circuits have the advantages of small size, light weight, few leads and solder points, long service life, high reliability, good performance, and low cost, and are easy to mass-produce. They are widely used in computer, communication equipment, consumer electronics, industrial control, automotive electronics, and almost all electronic equipment fields. They are the core and cornerstone of modern information technology and have promoted the development of electronic equipment towards miniaturization, high performance, and intelligence.

[0003] Reliability testing of integrated circuits includes high-temperature operating life testing and temperature cycling testing. During testing, impurities may exist on the test ports of the integrated circuits, hindering the testing process. SUMMARY

[0004] To solve the technical problems of the prior art, the technical solution adopted by the present application is as follows: the reliability testing device for integrated circuits comprises a support frame, support legs are fixedly connected to both ends of the support frame, a conveyor motor is fixedly connected to the outer surface of the support frame, a transmission unit is fixedly connected to the output end of the conveyor motor, a test unit is fixedly connected to the top of the support frame, the number of test units is two, a water tank is arranged in the middle of the support frame, a drying unit is fixedly connected to the support frame near the water tank, a heating bin is fixedly connected to one end of the support frame away from the drying unit, a heater is fixedly connected to the outer surface of the heating bin, and a heat preservation curtain is fixedly connected to the inner wall of the heater.

[0005] The test unit comprises a support plate one, a servo motor one is fixedly connected to the outer surface of the support plate one, a lead screw is fixedly connected to the output end of the servo motor one, a moving block is threadedly connected to the outer surface of the lead screw, an extension rod is fixedly connected to the bottom of the moving block, and a detection mechanism is fixedly connected to the bottom of the extension rod.

[0006] The detection mechanism includes a support plate two, a circular hole is arranged on the support plate two, the top of the support plate two is fixedly connected with a power supply block, the outer surface of the power supply block is fixedly connected with an electric wire, the bottom of the electric wire is connected with a power port, and the outer surface of the support plate two is fixedly connected with a pretreatment mechanism.

[0007] Preferably, the bottom of the support plate one is fixedly connected with the top of the support frame, the top of the support plate two is fixedly connected with the bottom of the telescopic rod, and the top of the power port is fixedly connected with the bottom of the support plate two.

[0008] Preferably, the pretreatment mechanism includes a support rod one, the bottom of the support rod one is rotatably connected with a rotating rod, the outer surface of the rotating rod is fixedly connected with a support rod two, one end of the support rod two away from the rotating rod is fixedly connected with a protection plate, the bottom of the protection plate is uniformly provided with a brush, the outer surface of the support rod two is fixedly connected with a pull rope, one end of the pull rope away from the support rod two is connected with a magnetic block one, and the inner wall of the magnetic block one is slidably connected with a support column.

[0009] Preferably, the top of the support rod one is fixedly connected with the outer surface of the support plate two, and the bottom of the support column is fixedly connected with the top of the support plate two.

[0010] Preferably, the transmission unit includes a transmission belt, the outer surface of the transmission belt is uniformly provided with a placing groove, the upper part of the placing groove is provided with an integrated circuit block, the integrated circuit block is provided with a power connection end, the transmission belt is fixedly connected with a rubber clamping block near the placing groove, the transmission belt is fixedly connected with a magnetic block two near the rubber clamping block, and the two ends of the transmission belt are fixedly connected with a rack.

[0011] Preferably, the drying unit includes a support plate three, the bottom of the support plate three is fixedly connected with a dryer, the bottom of the dryer is provided with an air outlet, the outer surface of the dryer is fixedly connected with a support rod three, the bottom of the support rod three is fixedly connected with a gas storage plate, the bottom of the gas storage plate is symmetrically provided with a gas distribution port, the bottom of the support plate three is fixedly connected with a support plate four, and the outer surface of the support plate four is fixedly connected with a wiping mechanism.

[0012] Preferably, the wiping mechanism includes a rotating shaft, the outer surface of the rotating shaft is fixedly connected with a sponge block, the two ends of the rotating shaft are fixedly connected with a circular block one, the rotating shaft is fixedly connected with a gear near the circular block one, the outer surface of the circular block one is sleeved with a crawler belt, and the end of the crawler belt away from the circular block one is sleeved with a blowing mechanism.

[0013] Preferably, the blowing mechanism comprises a support rod four, the outer surface of the support rod four is fixedly connected with a round block two, the outer surface of the round block two is fixedly connected with a fan blade, the outer surface of the gas storage plate is fixedly connected with an air outlet pipe, and the outer surface of the air outlet pipe is fixedly connected with a wind collecting pipe.

[0014] Preferably, the bottom of the support plate three is fixedly connected with the top of the support frame, the two ends of the rotating shaft are fixedly connected with the outer surface of the support plate four, and the outer surface of the round block two is sleeved with the track.

[0015] A test method of a reliability test device of an integrated circuit, comprising the following steps:

[0016] S1: first, the integrated circuit is placed into the transmission unit, and the transmission unit drives the integrated circuit to sequentially pass through the heating bin, the test unit, the water tank, the drying unit and the test unit;

[0017] S2: the heating bin places the integrated circuit in a high-temperature environment for a period of time, and then the test unit detects whether the integrated circuit can normally work and its performance parameters, such as output voltage, current and frequency;

[0018] S3: the transmission unit drives the integrated circuit into the water tank to realize rapid cooling, and then the integrated circuit is rapidly dried after passing through the drying unit;

[0019] S4: the test unit detects the integrated circuit again in different temperature environments, and observes the performance change of the chip in the temperature change process, the thermal expansion and shrinkage of the packaging material, and the reliability of the welding point.

[0020] The beneficial effects of the present application are as follows:

[0021] 1: by setting the test unit, when the transmission unit drives the integrated circuit board to move to the bottom of the first test unit, the transmission unit temporarily stops working, the servo motor one drives the screw rod to rotate, and then drives the moving block to move transversely to move to the top of the integrated circuit board, and then the telescopic rod moves downward and makes the power supply port contact with the power supply end on the integrated circuit board.

[0022] 2、The pre-treatment mechanism is arranged, before the power port contacts the power connection on the integrated circuit board, repulsion is generated between the magnetic block one and the magnetic block two, with the downward movement of the supporting plate two, the magnetic block one is pushed upward along the supporting column by repulsion, with the pulling of the pull rope, the rotating rod, the supporting rod two and the protection plate are rotated, so that the protection plate is separated from the power port, the subsequent performance test is facilitated, and in the rotating process of the protection plate, the bottom brush is brushed with the power connection on the integrated circuit, dust falling on the surface of the power connection in the transmission process is scraped, and full contact of the power port with the power connection on the integrated circuit board is avoided.

[0023] 3、The wiping mechanism is arranged, after the integrated circuit board passes through the water tank for cooling, water is attached to the integrated circuit board, and the water needs to be completely removed before performance test, with the movement of the transmission belt, the gear is rotated, the rotating shaft is rotated, the sponge block is wiped with the integrated circuit board, and the water on the integrated circuit board is absorbed by the sponge block, so that subsequent performance detection is facilitated.

[0024] 4、The blowing mechanism is arranged, rotation of the rotating shaft also drives the circular block one to rotate, the circular block two is rotated through the transmission of the track, and the fan blade is rotated, so that air is generated, the air is collected through the air collecting pipe and flows out from the air outlet pipe, hot air generated by the dryer flows out from the two gas distribution openings at the bottom of the air storage plate, the hot air is dried to the power connection on the integrated circuit board, and the water on the power connection is quickly dried. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is the structural schematic diagram of the application.

[0026] Figure 2 It is the structural view of the application.

[0027] Figure 3 It is the structural schematic diagram of the test unit of the application.

[0028] Figure 4 It is the structural schematic diagram of the detection mechanism of the application.

[0029] Figure 5 It is the structural schematic diagram of the pre-treatment mechanism of the application.

[0030] Figure 6 It is the structural schematic diagram of the transmission unit of the application.

[0031] Figure 7 It is Figure 6 The enlarged view of A in the figure.

[0032] Figure 8 It is the structural schematic diagram of the drying unit of the application.

[0033] Figure 9 is the structure of the drying unit of the application.

[0034] Figure 10 is the structure of the wiping mechanism of the application.

[0035] Figure 11 is the structure of the blowing mechanism of the application.

[0036] Figure 12 is the block diagram of the test method of the reliability of the integrated circuit of the application.

[0037] In the figure: 1, support frame; 2, support foot; 3, conveyor motor; 4, conveying unit; 5, test unit; 6, drying unit; 7, heating bin; 8, heater; 9, heat preservation curtain; 10, water tank; 51, support plate one; 52, servo motor one; 53, screw rod; 54, moving block; 55, telescopic rod; 56, detection mechanism; 561, support plate two; 562, round hole; 563, power supply block; 564, electric wire; 565, power-on port; 566, pretreatment mechanism; 5661, support rod one; 5662, rotating rod; 5663, support rod two; 5664, protection plate; 5665, brush; 5666, pull rope; 5667, magnetic block one; 5668, support column; 41, conveying belt; 42, placing groove; 43, integrated circuit block; 44, power connection end; 45, rubber clamping block; 46, magnetic block two; 47, rack; 61, support plate three; 62, dryer; 63, air outlet; 64, support rod three; 65, air storage plate; 66, air distribution port; 67, support plate four; 68, wiping mechanism; 681, rotating shaft; 682, sponge block; 683, gear; 684, round block one; 685, track; 686, blowing mechanism; 6861, support rod four; 6862, round block two; 6863, fan blade; 6864, wind collecting pipe; 6865, air outlet pipe. DETAILED DESCRIPTION

[0038] The application will be further described below in conjunction with the drawings and specific embodiments. The embodiments of the application are given for illustrative and descriptive purposes only, and are not exhaustive or limiting of the application. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are chosen and described in order to best explain the principles of the application and its practical application, and to enable others skilled in the art to understand the application for various embodiments with various modifications as are suited to the particular use contemplated.

[0039] Embodiment one, use Figures 1-12 A reliability test device and test method for an integrated circuit of an embodiment of the application are described as follows.

[0040] As Figures 1-2 The application discloses a reliability testing device of integrated circuit, which comprises a support frame 1, support feet 2 fixedly connected to two ends of the support frame 1, a conveyor motor 3 fixedly connected to an outer surface of the support frame 1, a conveying unit 4 fixedly connected to an output end of the conveyor motor 3, test units 5 fixedly connected to a top of the support frame 1, a water tank 10 arranged in a middle part of the support frame 1, a drying unit 6 fixedly connected to a position close to the water tank 10 of the support frame 1, a heating bin 7 fixedly connected to an end of the support frame 1 away from the drying unit 6, a heater 8 fixedly connected to an outer surface of the heating bin 7, and a heat preservation curtain 9 fixedly connected to an inner wall of the heater 8.

[0041] In the working process of the application, first, the integrated circuit board is placed into the conveying unit 4 for movement, the integrated circuit board is heated in the heating bin 7 for a period of time, then the first test unit 5 tests the performance of the integrated circuit board, the integrated circuit board is cooled by the water tank 10 and treated by the drying unit 6, and finally the integrated circuit board is continuously detected by the second test unit 5.

[0042] As Figure 3 The test unit 5 comprises a support plate one 51, a servo motor one 52 fixedly connected to an outer surface of the support plate one 51, a lead screw 53 fixedly connected to an output end of the servo motor one 52, a moving block 54 threadedly connected to an outer surface of the lead screw 53, an extension rod 55 fixedly connected to a bottom of the moving block 54, and a detection mechanism 56 fixedly connected to a bottom of the extension rod 55.

[0043] As Figure 4 The detection mechanism 56 comprises a support plate two 561, a circular hole 562 arranged on the support plate two 561, a power supply block 563 fixedly connected to a top of the support plate two 561, an electric wire 564 fixedly connected to an outer surface of the power supply block 563, an electrification port 565 fixedly connected to a bottom of the electric wire 564, and a pretreatment mechanism 566 fixedly connected to an outer surface of the support plate two 561.

[0044] When the conveying unit 4 drives the integrated circuit board to move to a bottom of the first test unit 5, the conveying unit 4 temporarily stops working, the servo motor one 52 drives the lead screw 53 to rotate, thereby driving the moving block 54 to move transversely and sequentially move to a position directly above the integrated circuit board, then the extension rod 55 moves downward and makes the electrification port 565 contact the power connection end 44 on the integrated circuit board.

[0045] A bottom of the support plate one 51 is fixedly connected to a top of the support frame 1, a top of the support plate two 561 is fixedly connected to a bottom of the extension rod 55, and a top of the electrification port 565 is fixedly connected to a bottom of the support plate two 561.

[0046] As Figure 5As shown, the pre-processing mechanism 566 includes a support rod one 5661, the bottom of the support rod one 5661 is rotatably connected with a rotating rod 5662, the outer surface of the rotating rod 5662 is fixedly connected with a support rod two 5663, one end of the support rod two 5663 away from the rotating rod 5662 is fixedly connected with a protective plate 5664, the bottom of the protective plate 5664 is uniformly provided with a brush 5665, the outer surface of the support rod two 5663 is fixedly connected with a pull rope 5666, one end of the pull rope 5666 away from the support rod two 5663 is fixedly connected with a magnetic block one 5667, the inner wall of the magnetic block one 5667 is slidably connected with a support column 5668.

[0047] Before the power port 565 contacts the power connection end 44 on the integrated circuit board, because the magnetic block one 5667 and the magnetic block two 46 will produce repulsion, as the support plate two 561 moves downward, the magnetic block one 5667 will be pushed upward along the support column 5668 by the repulsive force, accompanied by the pulling of the pull rope 5666, the rotating rod 5662, the support rod two 5663 and the protective plate 5664 will rotate, so that the protective plate 5664 is separated from the power port 565, facilitating subsequent performance testing, and at the same time in the process of rotating the protective plate 5664, the brush 5665 at the bottom will produce brushing with the power connection end 44 on the integrated circuit, so that the dust falling on the surface of the power connection end 44 in the transmission process is scraped off, avoiding that the power port 565 cannot fully contact the power connection end 44 on the integrated circuit board.

[0048] The top of the support rod one 5661 is fixedly connected with the outer surface of the support plate two 561, and the bottom of the support column 5668 is fixedly connected with the top of the support plate two 561.

[0049] As shown in the figure, Figures 6-7 The transmission unit 4 includes a transmission belt 41, the outer surface of the transmission belt 41 is uniformly provided with a placing groove 42, the integrated circuit block 43 is placed on the upper part of the placing groove 42, the power connection end 44 is arranged on the integrated circuit block 43, the rubber clamping block 45 is fixedly connected to the transmission belt 41 near the placing groove 42, the magnetic block two 46 is fixedly connected to the transmission belt 41 near the rubber clamping block 45, and the two ends of the transmission belt 41 are fixedly connected with the rack 47.

[0050] The magnetic block two 46 will generate a gear 683 with the magnetic block one 5667, and the rubber clamping block 45 can ensure that the integrated circuit board does not separate from the transmission belt 41.

[0051] The specific working process is as follows:

[0052] During operation, servo motor 52 drives lead screw 53 to rotate, which in turn moves moving block 54 laterally to the top of the integrated circuit board. Then, telescopic rod 55 moves downward and contacts the power port 565 with the power terminal 44 on the integrated circuit board. As support plate 561 moves downward, magnetic block 5667 is pushed upward along support column 5668 by repulsive force. With the pull of rope 5666, rotating rod 5662, support rod 5663, and protection plate 5664 rotate, causing protection plate 5664 to detach from power port 565 for subsequent performance testing. During the rotation of protection plate 5664, the bottom brush 5665 brushes against the power terminal 44 on the integrated circuit, removing dust that has fallen onto the surface of power terminal 44 during transmission. This ensures that power port 565 makes full contact with the power terminal 44 on the integrated circuit board and allows for reliability testing.

[0053] Example 2, using Figures 1-12 The following describes a reliability testing apparatus and method for an integrated circuit according to an embodiment of the present invention.

[0054] like Figures 8-9 As shown in the figure, the reliability testing device for integrated circuits of the present invention, based on Embodiment 1, includes a drying unit 6 comprising a support plate 3 61, a dryer 62 fixedly connected to the bottom of the support plate 3 61, an air outlet 63 provided at the bottom of the dryer 62, a support rod 3 64 fixedly connected to the outer surface of the dryer 62, an air storage plate 65 fixedly connected to the bottom of the support rod 3 64, air distribution ports 66 symmetrically provided at the bottom of the air storage plate 65, a support plate 4 67 fixedly connected to the bottom of the support plate 3 61, and a wiping mechanism 68 fixedly connected to the outer surface of the support plate 4 67.

[0055] The dryer 62 heats the air, which flows into the air storage plate 65, and the wiping mechanism 68 absorbs water from the integrated circuit board.

[0056] like Figure 10 As shown, the wiping mechanism 68 includes a rotating shaft 681, a sponge block 682 fixedly connected to the outer surface of the rotating shaft 681, a circular block 684 fixedly connected to both ends of the rotating shaft 681, a gear 683 fixedly connected to the rotating shaft 681 near the circular block 684, a track 685 sleeved on the outer surface of the circular block 684, and an air blowing mechanism 686 sleeved on the end of the track 685 away from the circular block 684.

[0057] After the integrated circuit board passes through the water tank 10 for cooling, water will be attached on the integrated circuit board, and the water needs to be completely removed before performance testing. With the movement of the transmission belt 41, the rack 47 drives the gear 683 to rotate, and then drives the shaft 681 to rotate, so that the sponge block 682 wipes the integrated circuit board, and the sponge block 682 can absorb the water on the integrated circuit board, facilitating subsequent performance detection.

[0058] As shown in Figure 11 The blowing mechanism 686 includes a support rod four 6861, the outer surface of the support rod four 6861 is fixedly connected with a round block two 6862, the outer surface of the round block two 6862 is fixedly connected with a fan blade 6863, the outer surface of the gas storage plate 65 is fixedly connected with an air outlet pipe 6865, and the outer surface of the air outlet pipe 6865 is fixedly connected with a wind collecting pipe 6864.

[0059] The rotation of the shaft 681 also drives the round block one 684 to rotate, and then drives the round block two 6862 to rotate through the transmission of the track 685, and drives the fan blade 6863 to rotate, so as to generate wind power. The wind power flows out of the air outlet pipe 6865 through the wind collecting pipe 6864, and then the hot air generated by the dryer 62 flows out of the two gas outlets 66 at the bottom of the gas storage plate 65, so that the hot air dries the power connection end 44 on the integrated circuit board, and the water on the power connection end 44 is quickly dried.

[0060] The bottom of the support plate three 61 is fixedly connected with the top of the support frame 1, the two ends of the shaft 681 are fixedly connected with the outer surface of the support plate four 67, and the outer surface of the round block two 6862 is sleeved with the track 685.

[0061] As shown in Figure 12 A test method of a reliability test device of an integrated circuit includes the following steps:

[0062] S1: First, the integrated circuit is placed into the transmission unit 4, which drives the integrated circuit to pass through the heating bin 7, the test unit 5, the water tank 10, the drying unit 6 and the test unit 5 in turn;

[0063] S2: The heating bin 7 places the integrated circuit in a high-temperature environment for a period of time, and then the test unit 5 detects whether the integrated circuit can work normally and its performance parameters, such as output voltage, current and frequency;

[0064] S3: The transmission unit 4 drives the integrated circuit into the water tank 10 to achieve rapid cooling, and then the integrated circuit is quickly dried after passing through the drying unit 6;

[0065] S4: the test unit 5 will be detected for different temperature environment in the integrated circuit cycle switching again, to observe the performance of the chip in the process of temperature change, the thermal expansion and shrinkage of the packaging material, the reliability of the solder joint.

[0066] The specific workflow is as follows:

[0067] When working, with the movement of the transmission belt 41, the rack 47 will drive the gear 683 to rotate, and then drive the rotating shaft 681 to rotate, so that the sponge block 682 and the integrated circuit board are wiped, and the sponge block 682 will absorb the moisture on the integrated circuit board. At the same time, the rotation of the rotating shaft 681 will also drive the round block one 684 to rotate, and then drive the round block two 6862 to rotate through the transmission of the track 685, and drive the fan blade 6863 to rotate, so as to generate wind power. The wind power will pass through the wind collecting pipe 6864 and flow out from the air outlet pipe 6865, and then the hot air generated by the dryer 62 will flow out from the two air outlet ports 66 at the bottom of the air storage plate 65, so as to dry the power connection end 44 on the integrated circuit board.

[0068] Obviously, the described embodiments are only part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art and related fields without creative labor shall belong to the scope of protection of the present application. The structures, devices and operation methods not specifically described and explained in the present application are implemented according to the conventional means in the art, unless otherwise specified and limited.

Claims

1. A reliability test apparatus for integrated circuits comprising a support frame, characterised in that: Both ends of the support frame are fixedly connected with support feet, the outer surface of the support frame is fixedly connected with a conveyor motor, the output end of the conveyor motor is fixedly connected with a conveying unit, the top of the support frame is fixedly connected with a test unit, the number of the test unit is two, the middle of the support frame is provided with a water tank, the support frame is fixedly connected with a drying unit close to the water tank, one end of the support frame away from the drying unit is fixedly connected with a heating bin, the outer surface of the heating bin is fixedly connected with a heater, the inner wall of the heater is fixedly connected with a heat preservation curtain; The test unit comprises a support plate one, the outer surface of the support plate one is fixedly connected with a servo motor one, the output end of the servo motor one is fixedly connected with a lead screw, the outer surface of the lead screw is threadedly connected with a moving block, the bottom of the moving block is fixedly connected with an extension rod, and the bottom of the extension rod is fixedly connected with a detection mechanism. The detection mechanism comprises a support plate two, a circular hole is arranged on the support plate two, the top of the support plate two is fixedly connected with a power supply block, the outer surface of the power supply block is fixedly connected with an electric wire, the bottom of the electric wire is connected with a power supply port, and the outer surface of the support plate two is fixedly connected with a pretreatment mechanism. The drying unit comprises a support plate three, the bottom of the support plate three is fixedly connected with a dryer, the bottom of the dryer is provided with an air outlet, the outer surface of the dryer is fixedly connected with a support rod three, the bottom of the support rod three is fixedly connected with a gas storage plate, the bottom of the gas storage plate is symmetrically provided with a gas distribution port, the bottom of the support plate three is fixedly connected with a support plate four, and the outer surface of the support plate four is fixedly connected with a wiping mechanism. The wiping mechanism comprises a rotating shaft, a sponge block is fixedly connected to the outer surface of the rotating shaft, circular blocks one are fixedly connected to the two ends of the rotating shaft, a gear is fixedly connected to the rotating shaft close to the circular blocks one, a track is sleeved with the outer surface of the circular blocks one, and a blowing mechanism is sleeved with one end of the track away from the circular blocks one. The blowing mechanism comprises a support rod four, circular blocks two are fixedly connected to the outer surface of the support rod four, and fan blades are fixedly connected to the outer surface of the circular blocks two.

2. A reliability test apparatus for integrated circuits as claimed in claim 1, characterized in that: The bottom of the support plate one is fixedly connected with the top of the support frame, the top of the support plate two is fixedly connected with the bottom of the extension rod, and the top of the power supply port is fixedly connected with the bottom of the support plate two.

3. A reliability test apparatus for an integrated circuit according to claim 1, characterized by: The pretreatment mechanism comprises a support rod one, a rotating rod is rotatably connected to the bottom of the support rod one, a support rod two is fixedly connected to the outer surface of the rotating rod, a protection plate is fixedly connected to one end of the support rod two away from the rotating rod, brushes are uniformly arranged on the bottom of the protection plate, a pull rope is fixedly connected to the outer surface of the support rod two, a magnetic block one is connected to one end of the pull rope away from the support rod two, and a support column is slidably connected to the inner wall of the magnetic block one.

4. A reliability test apparatus for an integrated circuit according to claim 3, characterized by: The top of the support rod one is fixedly connected with the outer surface of the support plate two, and the bottom of the support column is fixedly connected with the top of the support plate two.

5. The reliability test apparatus for an integrated circuit according to claim 1, wherein: The conveying unit comprises a conveying belt, the outer surface of the conveying belt is uniformly provided with a placing groove, an integrated circuit block is placed on the placing groove, an electric connection end is arranged on the integrated circuit block, the conveying belt is fixedly connected with a rubber clamping block close to the placing groove, a magnetic block two is fixedly connected to the conveying belt close to the rubber clamping block, and a rack is fixedly connected to the two ends of the conveying belt.

6. The reliability test apparatus for an integrated circuit according to claim 1, wherein: The bottom of the support plate three is fixedly connected with the top of the support frame, the two ends of the rotating shaft are fixedly connected with the outer surface of the support plate four, and the outer surface of the circular block two is sleeved with the track.

7. A reliability test apparatus for an integrated circuit according to any one of claims 1 to 6, wherein the test method is implemented by the apparatus. The method comprises the following steps: S1: first, the integrated circuit is placed into the transmission unit, which drives the integrated circuit to pass through the heating bin, the test unit, the water tank, the drying unit and the test unit in turn; S2: the heating bin places the integrated circuit in a high-temperature environment for a period of time, and then the test unit detects whether the integrated circuit can work normally and its performance parameters, such as output voltage, current and frequency; S3: the transmission unit brings the integrated circuit into the water tank to realize rapid cooling, and then the integrated circuit is rapidly dried after passing through the drying unit; S4: the test unit detects the integrated circuit again, which is cycled in different temperature environments, to observe the performance change of the chip in the temperature change process, the thermal expansion and shrinkage of the packaging material, and the reliability of the solder joint.

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