An optical communication module

Abstract

The application provides an optical communication module, which comprises a temperature control circuit, a temperature control component, an optical chip and a master control chip. After starting operation, the temperature control circuit makes the temperature control component at an initial setting target temperature, the master control chip continuously detects the temperature and current intensity and direction of the temperature control component through the temperature control circuit, the master control chip calculates the peripheral environment temperature of the optical chip according to the saved environment temperature and current corresponding table and the detected current intensity and direction, determines whether the target temperature of the temperature control component needs to be adjusted and the adjustment value according to the environment temperature and the saved environment temperature and temperature adjustment value corresponding table, and completes the adjustment through the output signal of the temperature setting, so as to change the temperature distribution in the optical chip and compensate the influence of the change of the external environment temperature on the performance of the optical chip.

Description

Technical Field

[0001] The present invention relates to an optical communication module, and in particular to a temperature control design of an optical communication module. Background Art

[0002] In today's optical communications field, optical chips such as arrayed waveguide gratings (AWGs) and variable optical attenuators (VOAs) are widely used. These devices often exhibit temperature-dependent loss (TDL), meaning their optical performance varies with device temperature. Typically, these devices are temperature-controlled to maintain a target temperature during operation to ensure stable optical performance. However, in practice, while the temperature of the optical chip in close proximity to the temperature control component can be kept constant, the thickness of the optical chip can still affect the internal temperature distribution. This effect becomes significant when the ambient temperature differs significantly from the target temperature. The other side of the optical chip often contains optical paths or optoelectronic connections, making it unsuitable for placing temperature sensors. Placing temperature sensors elsewhere in the module cannot accurately measure the ambient temperature at the location of the optical chip. Summary of the Invention

[0003] The purpose of the present invention is to provide a temperature control solution for an optical communication module to address the shortcomings of the above-mentioned fixed-point temperature control of the optical chip, thereby solving the problem that the optical communication module cannot accurately obtain the ambient temperature of the optical chip location, and can fine-tune the target temperature of the temperature control, change the temperature distribution inside the optical chip, and reduce the impact of the external ambient temperature on the optical chip.

[0004] To this end, the present invention adopts the following technical solutions:

[0005] An optical communication module includes a temperature control circuit, a temperature control component, an optical chip, and a main control chip. The temperature control component is connected to the temperature control circuit via a wire, the wire being used to transmit a temperature control current and a temperature signal of the contact surface between the temperature control component and the optical chip to the temperature control circuit. The main control chip is connected to the temperature control circuit to obtain the current current intensity and direction, as well as the temperature of the temperature control component, and has an output signal for setting a target temperature of the temperature control component. One side of the optical chip is tightly packaged on the temperature control component. After startup, the temperature control circuit sets the temperature control component to an initially set target temperature. The main control chip continuously detects the temperature, current intensity, and direction of the temperature control component through the temperature control circuit. The main control chip calculates the ambient temperature of the optical chip based on a stored table of ambient temperature and current correspondences and the detected current intensity and direction. Based on the ambient temperature and in combination with a stored table of ambient temperature and temperature adjustment values, the main control chip determines whether the target temperature of the temperature control component needs to be adjusted, and the adjustment value. The adjustment is completed through the temperature setting output signal, thereby changing the temperature distribution within the optical chip and compensating for the impact of external ambient temperature changes on the performance of the optical chip.

[0006] On the basis of the above technical solutions, the application can further adopt the following technical solutions, or the combination of these further technical solutions:

[0007] The temperature control assembly includes heating and cooling components and a temperature sensor, or the temperature control assembly includes a heating component and a temperature sensor, and the temperature sensor is located on the contact surface of the temperature control assembly and the optical chip.

[0008] The environment temperature and current corresponding table is generated by the device in the production process of the optical communication module, and the optical communication module is placed in the corresponding high and low temperature environment, and the current and environment temperature corresponding table is formed by detection and interpolation algorithm, and is stored in the memory of the main control chip or the memory of the optical communication module.

[0009] The environment temperature and temperature adjustment value corresponding table is generated by the device in the production process of the optical communication module, and the optical communication module is placed in the corresponding high and low temperature environment, and the adjustment value of the target temperature is confirmed by adjusting the temperature of the temperature control assembly and testing the index data of the optical chip, and the environment temperature and target temperature adjustment value corresponding table is formed and stored in the memory of the main control chip or the memory of the optical communication module.

[0010] In use, if it is detected that the external environment temperature is too low, the target temperature of the temperature control assembly is slightly adjusted higher, and if it is detected that the external environment temperature is too high, the target temperature of the temperature control assembly is slightly adjusted lower.

[0011] The target temperature of the temperature control assembly is determined according to the specific optical characteristics test of the packaged optical chip.

[0012] The application has the following beneficial effects: by increasing the detection of the temperature control current, the external environment temperature is inferred, the problem that the optical communication module cannot accurately obtain the environment temperature of the optical chip position is solved, the target temperature of the temperature control is slightly adjusted, the temperature distribution in the optical chip is changed, the influence of the external environment temperature on the optical chip is reduced, the optical index of the optical chip under different environment temperatures is improved, and the optical chip remains stable. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 is a structural schematic diagram of the application;

[0014] Figure 2 is a combination schematic diagram of the temperature control assembly and the optical chip;

[0015] Figure 3 is an exploded schematic diagram of the temperature control assembly and the optical chip. DETAILED DESCRIPTION

[0016] Below in conjunction with specific embodiment, further set forth the present invention.Should be understood that these embodiments are only used to illustrate the present invention and are not used in limiting the scope of the present invention.In addition, should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms fall equally within the scope limited by the appended claims of the application.

[0017] Reference Figure 1 The present invention provides an optical communication module comprising a temperature control circuit 2, a temperature control component 3, an optical chip 5, and a main control chip 1. The temperature control component 3 is connected to the temperature control circuit 2 via wires. The temperature control component 3 includes heating and cooling components and a temperature sensor 4. The heating and cooling components can be TECs. The heating and cooling components are connected to the temperature control circuit 2 via wires to transmit a temperature control current. The temperature sensor 4 is located on the interface between the temperature control component 3 and the optical chip 2 and is connected to the temperature control circuit 2 via wires to transmit a temperature signal from the interface between the temperature control component and the optical chip to the temperature control circuit 2.

[0018] The main control chip 1 is connected to the temperature control circuit 2, obtains the current intensity and direction currently transmitted to the temperature control component 3, as well as the temperature of the temperature control component 3, and has an output signal for setting the target temperature of the temperature control component 3. An optical chip 5 is encapsulated on one side in close contact with the heating and cooling components of the temperature control component 3. The optical chip 5 has a certain thickness, and the temperature of the side of the optical chip 5 in close contact with the temperature control component 3 is consistent with the heating and cooling components of the temperature control component. Under the influence of the ambient temperature, a temperature gradient is formed within the optical chip 5. After startup, the temperature control circuit 2 sets the temperature control component 3 at the initially set target temperature. The main control chip 1 continuously detects the temperature, current intensity, and direction of the temperature control component through the temperature control circuit 2. Based on a stored table of ambient temperature and current correspondences and the detected current intensity and direction, the main control chip 1 calculates the ambient temperature of the optical chip 5. Based on this ambient temperature, combined with a stored table of ambient temperature and temperature adjustment values, the main control chip 1 determines whether the target temperature of the temperature control component 3 needs to be adjusted, and the adjustment value. The adjustment is completed through the temperature setting output signal, thereby changing the temperature distribution within the optical chip and compensating for the impact of external ambient temperature changes on the performance of the optical chip.

[0019] The ambient temperature and current correspondence table is generated by a high and low temperature environment box during the production process of the optical communication module. The corresponding high and low temperature environment is generated by the high and low temperature environment box equipment. The optical communication module is placed in this environment, detected and formed into a current and ambient temperature correspondence table through an interpolation algorithm, and stored in the memory of the main control chip 1.

[0020] The correspondence table between ambient temperature and temperature adjustment value is formed during the production process of the optical communication module. The corresponding high and low temperature environment is generated by the high and low temperature environment box equipment. The optical communication module is placed in this environment. By adjusting the temperature of the temperature control component and the index data of the test optical chip, the adjustment value of the target temperature is confirmed, and the correspondence table between ambient temperature and target temperature adjustment value is stored in the memory of the main control chip 1.

[0021] During use, if the external environment temperature is detected to be too low, the target temperature of the temperature control component 3 is slightly adjusted higher; if the external environment temperature is detected to be too high, the target temperature of the temperature control component 3 is slightly adjusted lower.

[0022] The target temperature of the temperature control component 3 is determined based on a specific optical characteristic test of the packaged optical chip 5 .

[0023] This embodiment uses a hardware precision temperature control chip as the main control chip 1 of the temperature control circuit. The output temperature control current of the temperature control chip passes through the temperature control component 3 to keep the optical chip 5 at the target temperature. The temperature control temperature is fed back to the temperature control chip through the temperature sensor 4 integrated on the temperature control component 3 via the temperature control circuit to form a closed-loop control. The hardware precision temperature control chip will output a signal according to the current temperature and the target temperature, and automatically adjust the temperature control current to stabilize the temperature control temperature to the target operating temperature of the optical chip 5; the main control chip obtains the current temperature of the optical chip through the temperature feedback 6 output by the precision temperature control circuit, and obtains the temperature control current through the current feedback 7. The main control chip 1 uses a 32-bit MCU to run the program on it.

[0024] After the module is powered on, the main control chip sets the temperature control temperature as the target temperature. After the temperature control reaches the target, it detects the temperature control current, determines the external temperature based on the pre-calibrated and stored data, and determines the fine-tuning value of the target temperature. The fine-tuned target temperature is then set to the temperature control circuit.

[0025] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. Any changes or modifications made by any technician in this field within the field of the present invention are included in the protection scope of the present invention.

Claims

1. An optical communication module, comprising a temperature control circuit, a temperature control component, an optical chip, and a main control chip, characterized in that: The temperature control component is connected to the temperature control circuit through a wire, and the wire is used to transmit the temperature control current and transmit the temperature signal of the contact surface between the temperature control component and the optical chip to the temperature control circuit. The main control chip is connected to the temperature control circuit to obtain the current current intensity and direction, as well as the temperature of the temperature control component, and has an output signal for setting the target temperature of the temperature control component; one side of the optical chip is tightly encapsulated on the temperature control component. After starting up, the temperature control circuit makes the temperature control component at the initially set target temperature. The main control chip continuously detects the temperature and current intensity and direction of the temperature control component through the temperature control circuit. The main control chip calculates the peripheral ambient temperature of the optical chip based on the saved ambient temperature and current correspondence table and the detected current intensity and direction. Based on the ambient temperature, combined with the saved ambient temperature and temperature adjustment value correspondence table, it is determined whether the target temperature of the temperature control component needs to be adjusted, and the adjustment value. The adjustment is completed through the output signal of the temperature setting, thereby changing the temperature distribution inside the optical chip and compensating for the impact of the external ambient temperature change on the performance of the optical chip.

2. An optical communication module according to claim 1, characterized in that: The temperature control component includes heating and cooling components and a temperature sensor, or the temperature control component includes a heating component and a temperature sensor, and the temperature sensor is located on the contact surface between the temperature control component and the optical chip.

3. The optical communication module according to claim 1, wherein: The ambient temperature and current correspondence table is a table generated by the equipment during the production process of the optical communication module. The optical communication module is placed in this environment, and the current and ambient temperature correspondence table is formed through detection and interpolation algorithm, and stored in the memory of the main control chip or the memory of the optical communication module.

4. The optical communication module according to claim 1, wherein: The correspondence table between ambient temperature and temperature adjustment value is formed during the production process of the optical communication module. The corresponding high and low temperature environment is generated by the equipment. The optical communication module is placed in this environment. By adjusting the temperature of the temperature control component and the index data of the test optical chip, the adjustment value of the target temperature is confirmed. The correspondence table between ambient temperature and target temperature adjustment value is stored in the memory of the main control chip or the memory of the optical communication module.

5. The optical communication module according to claim 1, wherein: During use, if the external ambient temperature is detected to be too low, the target temperature of the temperature control component is slightly adjusted higher. If the external ambient temperature is detected to be too high, the target temperature of the temperature control component is slightly adjusted lower.

6. The optical communication module according to claim 1, wherein: The target temperature of the temperature control component is determined based on the specific optical characteristics test of the packaged optical chip.

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