Overload abnormal defect detection result processing method and system, equipment and medium

Abstract

The invention relates to the field of semiconductor chip manufacturing, and discloses an overload abnormal defect detection result processing method and system, equipment and a medium, and the method comprises the steps: firstly obtaining a defect detection result on a target object, and judging whether the defect detection result corresponding to the target object is overload abnormal or not; then, when the defect detection result corresponding to the target object is overloaded and abnormal, determining an overload abnormal category of the defect detection result corresponding to the target object, and transmitting a defect distribution diagram and a defect quantity value corresponding to the target object of a specified category to a statistical process control chart; and intercepting defect distribution diagrams and defect quantity values corresponding to the target objects determined as other overload abnormity categories, namely not transmitting the defect distribution diagrams and the defect quantity values to a statistical process control chart. According to the scheme of the invention, a more accurate statistical technological process control chart is provided for workers to refer to carry out shutdown check and maintenance on the technological equipment, so that the running number of the technological equipment is increased, and the manufacturing time cost of chips is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor chip manufacturing, and in particular to a method, system, device, and medium for processing overload abnormal defect detection results. Background Art

[0002] In the semiconductor manufacturing process, the health status of process equipment (i.e., whether the process equipment is clean) has a direct impact on the output, quality and production cost of chips. With the continuous advancement of chip manufacturing technology, process equipment has become more and more complex, and the health status assessment of equipment has become a key link to ensure production efficiency and product quality. In the chip manufacturing process, defect detection equipment is generally used to scan the wafer in front to determine the number of defects on the wafer; then the process equipment is used to perform a process, and the wafer that has passed the process equipment is scanned again by the defect detection equipment, and the results obtained by the front scan are compared with the results obtained by the back scan. The comparison results are used to determine the health of the process equipment. With the development of the semiconductor industry, laser surface defect detection equipment is applied to the semiconductor field to detect nano-level physical defects. However, the wide range of use of defect detection equipment and the variety of wafers (also known as wafers) will cause the defect detection equipment to detect a large number of overload abnormal defect detection results. Therefore, accurate processing of these overload abnormal defect detection results and accurate shutdown processing and maintenance of process equipment based on the processing results can improve the number of runs and the use efficiency of process equipment.

[0003] At present, when relevant researchers use defect detection equipment to detect wafers, they output the overload abnormal defect detection results in the form of "9999" to the statistical process control chart (i.e., SPC chart). The staff detects the abnormal points in the SPC chart and shuts down the process equipment for inspection and repair based on the abnormal points. However, the inventors found that these overload abnormal defect detection results may not be caused by the process equipment, but are related to the defect detection equipment, the detection program, and the wafer used for detection. The staff shut down the process equipment for inspection and repair based on the overload abnormal defect detection results that are not caused by the process equipment, which reduces the number of runs of the process equipment and increases the manufacturing time cost of the chip.

[0004] In summary, the abnormal points in the statistical process control chart obtained by the existing defect detection equipment overload abnormal defect detection result processing method are inaccurate, resulting in the shutdown inspection and maintenance of the process equipment based on the statistical process control chart obtained by the existing processing method, which reduces the number of process equipment runs, thereby increasing the manufacturing time cost of high-quality chips. Therefore, there is an urgent need for a defect detection equipment overload abnormal defect detection result processing method that can improve the accuracy of abnormal points in the statistical process control chart. Summary of the invention

[0005] The present application provides a method and system, device, and medium for processing overload abnormal defect detection results to solve the problem of inaccurate abnormal points in statistical process control charts obtained by the overload abnormal defect detection result processing method of existing defect detection equipment.

[0006] A first aspect of the present application provides a method for processing an overload abnormal defect detection result of a defect detection device, wherein the defect detection device is used to detect defects on a target object, and the method comprises:

[0007] Obtaining a defect detection result on the target object, wherein the defect detection result on the target object is obtained by scanning the target object with the defect detection device, and the defect detection result on the target object includes a defect distribution map and a defect quantity value corresponding to the target object, and the defect distribution map corresponding to the target object includes location and size information of multiple defects on the target object;

[0008] Determining whether the defect detection result corresponding to the target object is overloaded and abnormal, and determining the overload abnormal category of the defect detection result corresponding to the target object when the defect detection result corresponding to the target object is overloaded and abnormal;

[0009] The defect distribution map and defect quantity value corresponding to the target object determined as the overload abnormality category of "IMC" are transmitted to the statistical process control chart, and the defect distribution map and defect quantity value corresponding to the target object determined as other overload abnormality categories are intercepted and not transmitted to the statistical process control chart.

[0010] In some embodiments of the present application, the following method is used to determine whether the defect detection result corresponding to the target object is overloaded or abnormal:

[0011] Based on a preset threshold and a defect quantity value in a defect distribution map corresponding to the target object, it is determined whether a defect detection result corresponding to the target object is overloaded and abnormal.

[0012] In some embodiments of the present application, when the defect quantity value in the defect distribution map corresponding to the target object is greater than the preset threshold, it is determined that the defect detection result corresponding to the target object is overloaded abnormally.

[0013] In some embodiments of the present application, the defect detection result on the target object includes a text description of each defect in the defect distribution map corresponding to the target object, and each defect in the defect distribution map corresponding to the target object is classified in the following manner:

[0014] Each defect in the defect distribution map corresponding to the target object is classified based on a text description of each defect in the defect distribution map corresponding to the target object.

[0015] In some embodiments of the present application, a text description of each defect in the defect distribution map corresponding to the target object is identified, and when the target text is identified, each defect in the defect distribution map corresponding to the target object is classified into a category corresponding to the target text.

[0016] In some embodiments of the present application, the categories of defects include: AFS, ADC, LPM, Wafer crack, IMC, and the AFS preset threshold, ADC preset threshold, LPM preset threshold, Wafer crack preset threshold, and IMC preset threshold are set accordingly, and the overload abnormality category of the defect detection result corresponding to the target object is determined in the following manner:

[0017] Respectively counting the defect quantity values ​​of the defect categories AFS, ADC, LPM, Wafercrack, and IMC in the defect distribution map corresponding to the target object;

[0018] The statistical defect quantity values ​​of AFS, ADC, LPM, Wafer crack, and IMC categories are compared with the AFS preset threshold, ADC preset threshold, LPM preset threshold, Wafer crack preset threshold, and IMC preset threshold respectively to determine the abnormal category of the overload abnormal defect detection result.

[0019] In some embodiments of the present application, when the statistical defect quantity value of any one of the AFS, ADC, LPM, Wafer crack, and IMC categories is greater than or equal to the preset threshold of the corresponding category, the overload abnormality category of the defect detection result corresponding to the target object is determined to be the corresponding category.

[0020] A second aspect of the present application provides a system for processing overload abnormal defect detection results of a defect detection device, the system comprising:

[0021] A defect detection module, configured to scan a target object to obtain a defect detection result on the target object, wherein the defect detection result on the target object includes a defect distribution map and a defect quantity value corresponding to the target object, and the defect distribution map corresponding to the target object includes location and size information of multiple defects on the target object;

[0022] an overload abnormality category determination module, used to determine whether the defect detection result corresponding to the target object is overload abnormal based on the defect quantity value of the defect distribution map corresponding to the target object, and determine the overload abnormality category of the defect detection result corresponding to the target object when the detection result corresponding to the target object is overload abnormal;

[0023] The statistical process control chart data transmission module transmits the defect distribution map and defect quantity value corresponding to the target object whose overload abnormality category is determined as "IMC defect quantity exceeds upper limit" to the statistical process control chart, and intercepts the defect distribution map and defect quantity value corresponding to the target object determined as other overload abnormality categories, that is, does not transmit them to the statistical process control chart;

[0024] Among them, the overload abnormality category determination module is communicatively connected with the defect detection module, the statistical process control chart data transmission module is communicatively connected with the defect detection module and the overload abnormality category determination module respectively, the overload abnormality category determination module receives the defect detection result on the target object transmitted by the defect detection module, and the statistical process control chart data transmission module transmits or does not transmit the defect detection result on the target object stored in the defect detection module according to the overload abnormality category of the defect detection result corresponding to the target object transmitted by the overload abnormality category determination module.

[0025] A third aspect of the present application provides a method for determining whether a process equipment needs to be shut down for maintenance, the method comprising:

[0026] Obtaining a wafer to be inspected and using it as a target object;

[0027] Based on the target object, a statistical process control chart is obtained by using the overload abnormal defect detection result processing method of the defect detection equipment described in any of the above embodiments, and based on the alarm information of the statistical process control chart, it is decided whether to shut down the process equipment for maintenance.

[0028] A fourth aspect of the present application provides a method for determining whether a process equipment needs to be shut down for maintenance, characterized in that the method comprises:

[0029] Obtaining a wafer to be inspected and using it as a target object;

[0030] Based on the target object, the overload abnormal defect detection result processing system of the defect detection equipment described in the above embodiment is used to obtain a statistical process control chart, and based on the alarm information of the statistical process control chart, it is decided whether to shut down the process equipment for maintenance.

[0031] The fifth aspect of the present application provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the method described in any one of the first aspect, the third aspect, and the fourth aspect of the above-mentioned embodiments when executing the computer program.

[0032] The sixth aspect of the present application provides a computer-readable storage medium having program instructions stored thereon, and when the program instructions are executed by a processor, the method described in any one of the first aspect, the third aspect, and the fourth aspect of the above-mentioned embodiments is implemented.

[0033] This application has the following beneficial effects:

[0034] The overload abnormal defect detection result processing scheme of the defect detection equipment of the present application first obtains the defect detection result on the target object, and determines whether the defect detection result corresponding to the target object is overload abnormal. Then, when the defect detection result corresponding to the target object is overload abnormal, the overload abnormal category of the defect detection result corresponding to the target object is determined, and the defect distribution map and defect quantity value corresponding to the target object with the overload abnormal category of "IMC" are transmitted to the statistical process control chart, and the defect distribution map and defect quantity value corresponding to the target object determined as other overload abnormal categories are intercepted and not transmitted to the statistical process control chart. The scheme of the present application classifies the overload abnormal defect detection results on the target object detected by the defect detection equipment, and then determines whether to transmit the defect distribution map and defect quantity value corresponding to the target object to the statistical process control chart according to the overload abnormal category of the overload abnormal defect detection result, intercepts and filters out the defect distribution map and defect quantity value corresponding to the target object of other overload abnormal categories that will cause "false alarms", and can obtain a more accurate statistical process control chart. The staff will shut down the process equipment for inspection and maintenance according to the abnormal situation reflected in the more accurate statistical process control chart, which increases the number of goods running the process equipment, thereby reducing the manufacturing time cost of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The drawings herein are incorporated into the specification and constitute a part of the specification. These drawings illustrate embodiments consistent with the present application and are used together with the specification to illustrate the technical solution of the present application.

[0036] Figure 1 It is a flowchart of an embodiment of a method for processing overload abnormal defect detection results of a defect detection device provided by the present application;

[0037] Figure 2 It is a flow chart of an embodiment of a method for determining an overload abnormality category of a defect detection result corresponding to a target object provided by the present application;

[0038] Figure 3It is a flowchart of a solution for processing overload abnormal defect detection results of defect detection equipment in the prior art;

[0039] Figure 4 It is a schematic diagram of a framework of an embodiment of an overload abnormal defect detection result processing system for a defect detection device provided by the present application;

[0040] Figure 5 It is a flowchart of a solution for processing overload abnormal defect detection results of defect detection equipment of the prior art and the present application;

[0041] Figure 6 It is a flow chart of an embodiment of a method for determining whether a process equipment needs to be shut down for maintenance provided by the present application;

[0042] Figure 7 It is a flow chart of another embodiment of the method for determining whether process equipment needs to be shut down for maintenance provided by the present application;

[0043] Figure 8 It is a schematic diagram of a framework of an embodiment of an electronic device provided by the present application;

[0044] Fig. 9 It is a schematic diagram of a framework of an embodiment of a computer-readable storage medium provided by the present application. DETAILED DESCRIPTION

[0045] The scheme of the embodiment of the present application is described in detail below in conjunction with the drawings of the specification.

[0046] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0047] The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the objects associated before and after are in an "or" relationship. In addition, "many" in this article means two or more than two. In addition, the term "at least one" in this article means any combination of at least two of any one or more of a plurality of, for example, including at least one of A, B, and C, can mean including any one or more elements selected from the set consisting of A, B, and C.

[0048] As described in the background technology, the abnormal points in the statistical process control chart obtained by the existing defect detection equipment's overload abnormal defect detection result processing method are inaccurate, resulting in the shutdown inspection and maintenance of process equipment based on the statistical process control chart obtained by the existing processing method, reducing the number of process equipment runs, thereby increasing the manufacturing time cost of high-quality chips.

[0049] In order to solve the above problems, the inventors proposed a new solution for processing overload abnormal defect detection results of defect detection equipment. In the solution of the present application, the defect detection results on the target object are first obtained, and it is determined whether the defect detection results corresponding to the target object are overload abnormal. Then, when the defect detection results corresponding to the target object are overload abnormal, the overload abnormal category of the defect detection results corresponding to the target object is determined, and the defect distribution map and defect quantity value corresponding to the target object with the overload abnormal category of "IMC" are transmitted to the statistical process control chart, and the defect distribution map and defect quantity value corresponding to the target object determined to be other overload abnormal categories are intercepted and not transmitted to the statistical process control chart. The solution of the present application classifies the overload abnormality defect detection results on the target object detected by the defect detection equipment, and then determines whether to transmit the defect distribution map and defect quantity value corresponding to the target object to the statistical process control chart according to the overload abnormality category of the overload abnormality defect detection result, intercepts and filters out the defect distribution maps and defect quantity values ​​corresponding to the target objects of other overload abnormality categories that will cause "false alarms", and can obtain more accurate statistical process control charts. The staff can shut down the process equipment for inspection and maintenance based on the abnormal conditions reflected in the more accurate statistical process control charts, thereby increasing the number of runs of the process equipment and reducing the manufacturing time cost of the chip.

[0050] The present application is described in detail below with reference to the accompanying drawings and specific embodiments.

[0051] According to an embodiment of the present application, the present application provides a method for processing overload abnormal defect detection results of a defect detection device, wherein the defect detection device is used to detect defects on a target object, such as Figure 1As shown, the processing method includes: S1, obtaining a defect detection result on the target object, wherein the defect detection result on the target object is obtained by scanning the target object with a defect detection device, and the defect detection result on the target object includes a defect distribution map and a defect quantity value corresponding to the target object, and the defect distribution map corresponding to the target object includes location and size information of multiple defects on the target object; S2, judging whether the defect detection result corresponding to the target object is overloaded abnormally, and when the defect detection result corresponding to the target object is overloaded abnormally, determining the overload abnormality category of the defect detection result corresponding to the target object; S3, transmitting the defect distribution map and defect quantity value corresponding to the target object whose overload abnormality category is determined to be "IMC" to the statistical process control chart, and intercepting the defect distribution map and defect quantity value corresponding to the target object determined to be other overload abnormal categories, that is, not transmitting them to the statistical process control chart.

[0052] In order to more clearly understand the overload abnormal defect detection result processing solution of the defect detection equipment of the present application, steps S2 and S3 are explained in detail below.

[0053] 1. Step S2

[0054] In step S2, it is determined whether the defect detection result corresponding to the target object is overloaded abnormally, and when the defect detection result corresponding to the target object is overloaded abnormally, the overload abnormality category of the defect detection result corresponding to the target object is determined.

[0055] According to one embodiment of the present application, based on a preset threshold and the defect quantity value in the defect distribution map corresponding to the target object, it is determined whether the defect detection result corresponding to the target object is overloaded abnormally. Further, according to another embodiment of the present application, when the defect quantity value in the defect distribution map corresponding to the target object is greater than the preset threshold, it is determined that the defect detection result corresponding to the target object is overloaded abnormally.

[0056] It can be seen from the above embodiments that by introducing a preset threshold and a defect quantity value in a defect distribution map to evaluate the defect detection result of the target object, not only the efficiency and accuracy of defect detection are improved, but also a more comprehensive quality control method is provided.

[0057] According to one embodiment of the present application, the defect detection result on the target object includes a text description of each defect in the defect distribution map corresponding to the target object, and based on the text description of each defect in the defect distribution map corresponding to the target object, each defect in the defect distribution map corresponding to the target object is classified. Further, according to another embodiment of the present application, the text description of each defect in the defect distribution map corresponding to the target object is recognized, and when the target text is recognized, each defect in the defect distribution map corresponding to the target object is classified into the category corresponding to the target text.

[0058] It can be seen from the above embodiments that by classifying the defects on the target object using the text description of each defect, not only can various types of defects be accurately identified and recorded, but also detailed data support can be provided for subsequent quality analysis and production improvement, thereby effectively improving the efficiency and accuracy of product quality control.

[0059] 2. Step S3

[0060] In step S3, the defect distribution map and defect quantity value corresponding to the target object determined as the overload abnormality category of "IMC" are transmitted to the statistical process control chart, and the defect distribution map and defect quantity value corresponding to the target object determined as other overload abnormality categories are intercepted and not transmitted to the statistical process control chart.

[0061] Before introducing step S3, AFS, ADC, LPM, wafer crack and IMC are explained first: AFS (Auto Focus System), LPM (Large Particle Mode), ADC (Analog-to-Digital Converter), wafer crack and IMC (Image Computer).

[0062] According to an embodiment of the present application, the categories of defects include: AFS, ADC, LPM, Wafer crack, and IMC, and the AFS preset threshold, ADC preset threshold, LPM preset threshold, Wafer crack preset threshold, and IMC preset threshold are set accordingly. Figure 2 As shown, the embodiment of the present application determines the overload abnormal category of the defect detection result corresponding to the target object by executing the following steps S31-S32: S31, respectively counting the defect quantity values ​​of the defect categories AFS, ADC, LPM, Wafer crack, and IMC in the defect distribution map corresponding to the target object; S32, comparing the defect quantity values ​​of the AFS, ADC, LPM, Wafer crack, and IMC categories obtained by counting with the AFS preset threshold, ADC preset threshold, LPM preset threshold, Wafer crack preset threshold, and IMC preset threshold, respectively, to determine the abnormal category of the overload abnormal defect detection result. It should be noted that the defect categories listed in this application are only some of the categories in the current field. With the development of technology, if other defect categories are found, they can also be classified using the identification method of this application. There is no specific limitation on the defect categories here.

[0063] (I) Step S31

[0064] In step S31, the defect quantity values ​​of the defect categories AFS, ADC, LPM, Wafer crack, and IMC in the defect distribution map corresponding to the target object are counted respectively.

[0065] According to one embodiment of the present application, the defect quantity values ​​of the defect categories AFS, ADC, LPM, Wafer crack, and IMC in the defect distribution map corresponding to the target object are counted in the following manner: the text description of each defect in the defect distribution map corresponding to the target object is recognized, and when the word "AFS" is recognized, the defect in the defect distribution map corresponding to the target object is classified as the AFS category, and the defect quantity values ​​of the AFS category are counted; the text description of each defect in the defect distribution map corresponding to the target object is recognized, and when the words "ADC", and / or "Haze", and / or "Surfaceimage" are recognized, the defect in the defect distribution map corresponding to the target object is classified as the ADC category, and the defect quantity values ​​of the ADC category are counted; the text description of each defect in the defect distribution map corresponding to the target object is recognized, and when the word "LPM" is recognized, the defect in the defect distribution map corresponding to the target object is classified as the LPM category, and the defect quantity values ​​of the LPM category are counted; the text description of each defect in the defect distribution map corresponding to the target object is recognized, and when the word "Wafer crack" is recognized, the defect in the defect distribution map corresponding to the target object is classified as Wafer crack. crack category, and count the defect quantity values ​​of the wafer crack category; recognize the text description of each defect in the defect distribution map corresponding to the target object, and when the word "IMC" is recognized, classify the defect in the defect distribution map corresponding to the target object into the IMC category, and count the defect quantity values ​​of the IMC category.

[0066] It can be seen from the above embodiments that by identifying the text description of each defect in the defect distribution map corresponding to the target object, and classifying the defects into specific categories such as AFS, ADC, LPM, Wafer crack, IMC, etc., accurate statistics of the number of various defects are achieved. This method not only helps to refine the quality analysis and accurately locate the problem, but also provides a specific direction for the optimization of the production process, thereby effectively improving the overall quality and production efficiency of the product. In addition, through automated classification and statistics, the errors of manual operation are reduced and the speed and accuracy of data processing are improved.

[0067] (ii) Step S32

[0068] In step S32, the statistically obtained defect quantity values ​​of AFS, ADC, LPM, Wafer crack, and IMC categories are compared with the AFS preset threshold, ADC preset threshold, LPM preset threshold, Wafer crack preset threshold, and IMC preset threshold respectively to determine the abnormal category of the overload abnormal defect detection result.

[0069] Among them, according to another embodiment of the present application, when the statistical defect quantity value of any one of the AFS, ADC, LPM, Wafer crack, and IMC categories obtained by statistics is greater than or equal to the preset threshold of the corresponding category, the overload abnormality category of the defect detection result corresponding to the target object is determined to be the corresponding category.

[0070] It can be seen from the above embodiments that by comparing the statistical defect quantity values ​​of AFS, ADC, LPM, Wafer crack, and IMC categories with their corresponding preset thresholds, it is possible to accurately identify which categories of defects exceed the normal range, thereby quickly determining the defect detection results of overload anomalies and their specific anomaly categories. This method not only improves the efficiency and accuracy of anomaly detection, but also helps manufacturers to promptly discover and resolve potential quality problems, avoid product performance degradation or safety risks caused by too many defects, and thus improve the overall product quality level and market competitiveness. At the same time, based on the anomaly detection results of specific categories, companies can more specifically adjust production processes and quality control measures to achieve continuous quality improvement.

[0071] In order to more clearly understand the overload anomaly categories of the defect detection results corresponding to the missing target object, the five categories of AFS, ADC, LPM, Wafer crack, and IMC are explained below in combination with Table 1.

[0072] Table 1

[0073]

[0074] The following describes in detail from the system side the prior art and the overload abnormal defect detection result processing solution of the defect detection equipment proposed in this application in conjunction with the accompanying drawings.

[0075] 1. Existing Technology

[0076] like Figure 3As shown, it shows a flow chart of the overload abnormal defect detection result processing solution of the defect detection equipment in the prior art, the defect management system (Defect Management System, DMS) is used to collect and analyze the data output by the defect detection equipment; the equipment automation system (Equipment Automation Program, EAP) is a program used to connect the automatic control machine and capture the machine data; the engineering data collection system (Engineer Data Collecting, EDC) is used to collect engineering data, collect data from various systems, and process and store them; the statistical process control system (Statistical Process Control, SPC) is a process control tool that uses mathematical statistics methods. It analyzes and evaluates the production process, promptly discovers the signs of systematic factors based on feedback information, and takes measures to eliminate their influence, so that the process is maintained in a controlled state that is only affected by random factors, so as to achieve the purpose of controlling quality.

[0077] from Figure 3 It can be seen that the processing scheme for the overload abnormal defect detection result of the defect detection equipment in the prior art is: after the defect detection equipment detects the wafer, the defect detection result is input into the DMS system for storage and management, the EAP system obtains the defect detection result in the DMS system for analysis, and the EDC system is responsible for converting the overload abnormal defect detection result after EAP analysis into the form of "9999" and inputting it into the SPC, and the statistical process control chart (SPC chart) finally displays the defect detection result and makes an alarm. The above processing method simply and crudely outputs a virtual defect distribution map (map) or an overload abnormal map, which cannot reflect the distribution of the real defects. The corresponding output defect quantity value (value) is "9999", which is often inconsistent with the real value, and enters the "false alarm" (also called false alarm) caused by SPC, which then pollutes the statistical process control chart, and the statistical process control chart obtained by the existing processing method is used to shut down the process equipment for inspection and maintenance, which reduces the number of run-outs of the process equipment, thereby increasing the manufacturing time cost of high-quality chips.

[0078] II. This Application

[0079] According to one embodiment of the present application, Figure 4As shown, the present application provides an overload abnormal defect detection result processing system of a defect detection device, the system comprising: a defect detection module, used to scan a target object to obtain a defect detection result on the target object, wherein the defect detection result on the target object comprises a defect distribution map and a defect quantity value corresponding to the target object, and the defect distribution map corresponding to the target object comprises location and size information of multiple defects on the target object; an overload abnormality category determination module, used to determine whether the defect detection result corresponding to the target object is overload abnormal based on the defect quantity value of the defect distribution map corresponding to the target object, and when the detection result corresponding to the target object is overload abnormal, determine the overload abnormality category of the defect detection result corresponding to the target object; a statistical process control chart data transmission module, which transmits the overload abnormality category The defect distribution map and defect quantity value corresponding to the target object determined as "IMC" are transmitted to the statistical process control chart, and the defect distribution map and defect quantity value corresponding to the target object determined as other overload abnormality categories are intercepted and not transmitted to the statistical process control chart; wherein, the overload abnormality category determination module is communicatively connected with the defect detection module, the statistical process control chart data transmission module is communicatively connected with the defect detection module and the overload abnormality category determination module respectively, the overload abnormality category determination module receives the defect detection result on the target object transmitted by the defect detection module, and the statistical process control chart data transmission module transmits or does not transmit the defect detection result on the target object stored in the defect detection module according to the overload abnormality category of the defect detection result corresponding to the target object transmitted by the overload abnormality category determination module.

[0080] Among them, according to one embodiment of the present application, an equipment automation unit is configured in the overload abnormality category determination module, that is, the EAP system introduced in the prior art, and the equipment automation unit is configured to judge whether the defect detection result corresponding to the target object is overload abnormal based on the defect quantity value of the defect distribution map corresponding to the target object, and determine the overload abnormality category of the defect detection result corresponding to the target object when the detection result corresponding to the target object is overload abnormal.

[0081] In order to more intuitively understand the difference between the prior art and the present application, the following takes the detection of defects on a wafer as an example. Figure 5 Describe the prior art and this application in detail. Figure 5 As shown, it shows a flow chart of the overload abnormal defect detection result processing solution of the defect detection equipment of the prior art and the present application.

[0082] Among them, from Figure 5As can be seen from (a), the processing flow of the prior art is: after obtaining the defect detection results of the wafer, determine whether the defect detection results on the wafer are overloaded and abnormal, and collect all the defect detection results of the wafer in the form of "9999" into the SPC chart, that is, the processing solution for the defect detection results of the prior art is to collect all the wafer detection results into the SPC chart.

[0083] from Figure 5 As can be seen in (b), the processing flow of the present application is as follows: after obtaining the defect detection results of the wafer, the EAP system is used to determine whether the defect detection results on the wafer are overloaded and abnormal, and the defect detection results on the wafer are classified when overloaded and abnormal. The corresponding overload abnormal categories of the defect detection results are AFS, ADC, LPM, Wafer crack, and IMC. The EAP system intercepts the defect detection results of the overload abnormal categories of AFS, ADC, LPM, and Wafer crack, that is, it does not transmit them to the statistical process control chart and only displays the cause of the overload, and the EAP system transmits the defect distribution map and defect quantity value corresponding to the overload abnormal category of IMC to the SPCchart to realize the alarm.

[0084] To sum up, compared with the prior art in which the overload abnormal defect detection results are converted into a virtual defect distribution map and the defect quantity value is "9999" and input into the SPC chart, the SPC chart finally displays the defect detection results and makes an alarm. The processing scheme of the present application classifies the overload abnormal defect detection results on the target object detected by the defect detection equipment, screens out the overload abnormal defect detection results related to the process equipment and transmits them to the SPC chart, while the overload abnormal defect detection results not related to the process equipment are intercepted and not transmitted to the SPC chart. Therefore, a more accurate SPC chart can be obtained. The staff shuts down the process equipment for inspection and maintenance according to the alarm conditions in the more accurate SPC chart, which increases the number of runs of the process equipment and reduces the manufacturing time cost of the chip.

[0085] In order to improve the quality of chip manufacturing, it is necessary to timely and accurately judge and repair the process equipment for manufacturing chips. Therefore, according to an embodiment of the present application, Figure 6 As shown, the present application provides a method for determining whether a process equipment needs to be shut down for maintenance, the method comprising: T1, obtaining a wafer to be inspected and using it as a target object; T2, obtaining a statistical process control chart based on the target object using the overload abnormal defect detection result processing method of the defect detection equipment in any of the above embodiments, and determining whether to shut down the process equipment for maintenance based on the alarm information of the statistical process control chart. In addition, according to another embodiment of the present application, as Figure 7As shown, the present application also provides a method for determining whether a process equipment needs to be shut down for maintenance, the method comprising: P1, obtaining a wafer to be inspected and using it as a target object; P2, based on the target object, using the overload abnormal defect detection result processing system of the defect detection equipment in any of the above embodiments to obtain a statistical process control chart, and based on the alarm information of the statistical process control chart, deciding whether to shut down the process equipment for maintenance.

[0086] From the above description, it can be seen that the above embodiment generates a statistical process control chart by obtaining the wafer to be inspected and using the overload abnormal defect detection result processing method or system of the defect detection equipment, and timely and accurately determines whether the process equipment needs to be shut down for maintenance based on the alarm information in the chart, thereby effectively improving the quality of manufactured chips, preventing production interruptions and product quality degradation caused by equipment failures, optimizing the production process, reducing economic losses, and improving the company's management level and economic benefits.

[0087] Based on the inventive concept of the above embodiments, the present application further provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the method described in the above embodiments when executing the computer program. Figure 8 Provide detailed explanation.

[0088] like Figure 8 As shown, it shows the electronic device of the present application, which may specifically include a processor 110 and a memory 120. The memory 120 is coupled to the processor 110.

[0089] The processor 110 is used to control the operation of the electronic device. The processor 110 may also be referred to as a CPU (Central Processing Unit). The processor 110 may be an integrated circuit chip having the ability to process signals. The processor 110 may also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. A general-purpose processor may be a microprocessor or the processor 110 may also be any conventional processor, etc.

[0090] The memory 120 is used to store computer programs, and may be a random access memory (RAM), a read-only memory (ROM), or other types of storage terminals. Specifically, the memory 120 may include one or more computer-readable storage media, which may be non-transitory or transient. The memory 120 may also include a high-speed random access memory, and a non-volatile memory, such as one or more disk storage terminals, flash memory storage terminals. In some embodiments, the non-transitory computer-readable storage medium in the memory 120 is used to store at least one program code.

[0091] The processor 110 is used to execute the computer program stored in the memory 120 to implement the methods described in the various method embodiments of the present application.

[0092] In some embodiments, the electronic device may further include: a peripheral terminal interface 130 and at least one peripheral terminal. The processor 110, the memory 120 and the peripheral terminal interface 130 may be connected via a bus or a signal line. Each peripheral terminal may be connected to the peripheral terminal interface 130 via a bus, a signal line or a circuit board. Specifically, the peripheral terminal includes: at least one of a radio frequency circuit 140, a display screen 150, an audio circuit 160 and a power supply 170.

[0093] The peripheral terminal interface 130 may be used to connect at least one peripheral terminal related to I / O (Input / output) to the processor 110 and the memory 120. In some embodiments, the processor 110, the memory 120, and the peripheral terminal interface 130 are integrated on the same chip or circuit board; in some other implementations, any one or two of the processor 110, the memory 120, and the peripheral terminal interface 130 may be implemented on a separate chip or circuit board, which is not limited in this embodiment.

[0094] The radio frequency circuit 140 is used to receive and transmit RF (Radio Frequency) signals, also known as electromagnetic signals. The radio frequency circuit 140 communicates with the communication network and other IoT devices through electromagnetic signals, and the radio frequency circuit 140 is the communication circuit of the electronic device. The radio frequency circuit 140 converts the electrical signal into an electromagnetic signal for transmission, or converts the received electromagnetic signal into an electrical signal. Optionally, the radio frequency circuit 140 includes: an antenna system, an RF transceiver, one or more amplifiers, a tuner, an oscillator, a digital signal processor, a codec chipset, an operator identity module card, and the like. The radio frequency circuit 140 can communicate with other terminals through at least one wireless communication protocol. The wireless communication protocol includes but is not limited to: the World Wide Web, a metropolitan area network, an intranet, various generations of mobile communication networks (2G, 3G, 4G and 5G), a wireless local area network and / or a WiFi (Wireless Fidelity) network. In some embodiments, the radio frequency circuit 140 may also include circuits related to NFC (Near Field Communication), which is not limited in this application.

[0095] The display screen 150 is used to display the UI (User Interface). The UI may include graphics, text, icons, videos, and any combination thereof. When the display screen 150 is a touch display screen, the display screen 150 also has the ability to collect touch signals on the surface or above the surface of the display screen 150. The touch signal can be input to the processor 110 as a control signal for processing. At this time, the display screen 150 can also be used to provide virtual buttons and / or virtual keyboards, also known as soft buttons and / or soft keyboards. In some embodiments, the display screen 150 can be one, set on the front panel of the electronic device; in other embodiments, the display screen 150 can be at least two, respectively set on different surfaces of the electronic device or in a folding design; in other embodiments, the display screen 150 can be a flexible display screen, set on a curved surface or a folding surface of the electronic device. Even, the display screen 150 can also be set to a non-rectangular irregular shape, that is, a special-shaped screen. The display screen 150 can be made of materials such as LCD (Liquid Crystal Display), OLED (Organic Light-Emitting Diode, organic light-emitting diode).

[0096] The audio circuit 160 may include a microphone and a speaker. The microphone is used to collect sound waves from the operator and the environment, and convert the sound waves into electrical signals and input them into the processor 110 for processing, or input them into the radio frequency circuit 140 to achieve voice communication. For the purpose of stereo acquisition or noise reduction, there can be multiple microphones, which are respectively arranged in different parts of the electronic device. The microphone can also be an array microphone or an omnidirectional acquisition microphone. The speaker is used to convert the electrical signal from the processor 110 or the radio frequency circuit 140 into sound waves. The speaker can be a traditional film speaker or a piezoelectric ceramic speaker. When the speaker is a piezoelectric ceramic speaker, it can not only convert the electrical signal into sound waves audible to humans, but also convert the electrical signal into sound waves inaudible to humans for purposes such as ranging. In some embodiments, the audio circuit 160 may also include a headphone jack.

[0097] The power supply 170 is used to power various components in the electronic device. The power supply 170 can be an alternating current, a direct current, a disposable battery, or a rechargeable battery. When the power supply 170 includes a rechargeable battery, the rechargeable battery can be a wired rechargeable battery or a wireless rechargeable battery. A wired rechargeable battery is a battery that is charged through a wired line, and a wireless rechargeable battery is a battery that is charged through a wireless coil. The rechargeable battery can also be used to support fast charging technology.

[0098] For a detailed description of the functions and execution processes of each functional module or component in the electronic device embodiment of the present application, reference can be made to the description in the above-mentioned method embodiments of the present application, which will not be repeated here.

[0099] In the several embodiments provided in the present application, it should be understood that the disclosed electronic devices and methods can be implemented in other ways. For example, the various embodiments of the electronic devices described above are only schematic. For example, the division of modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0100] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0101] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0102] Based on the inventive concept of the above embodiment, the present application also provides a computer-readable storage medium storing a computer program, which can be executed by a processor to implement the above projection area calculation method. Fig. 9 The execution process of the above-mentioned embodiment in a computer-readable storage medium is described.

[0103] like Fig. 9 As shown, it shows the computer-readable storage medium of the present application. If the above-mentioned integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium 200. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions / computer programs to enable an IoT device (which can be a personal computer, server, or network terminal, etc.) or a processor (processor) to perform all or part of the steps of each implementation method of the present application. The aforementioned storage medium includes: various media such as a USB flash drive, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a disk or an optical disk, and electronic terminals such as computers, mobile phones, laptops, tablet computers, cameras, etc. having the above-mentioned storage medium.

[0104] The description of the execution process of the program data in the computer-readable storage medium can refer to the description in the above-mentioned method embodiments of the present application, which will not be repeated here.

[0105] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

[0106] Those skilled in the art will appreciate that, in the above method of specific implementation, the order in which the steps are written does not imply a strict execution order and does not constitute any limitation on the implementation process. The specific execution order of the steps should be determined by their functions and possible internal logic.

Claims

1. A method for processing overload abnormal defect detection results of a defect detection device, wherein the defect detection device is used to detect defects on a target object, characterized in that: The method comprises: Acquire a defect detection result on the target object, wherein the defect detection result on the target object is obtained by scanning the target object with the defect detection device, and the defect detection result on the target object includes a defect distribution map and a defect quantity value corresponding to the target object, and the defect distribution map corresponding to the target object includes location and size information of multiple defects on the target object; Determining whether the defect detection result corresponding to the target object is overloaded and abnormal, and determining the overload abnormal category of the defect detection result corresponding to the target object when the defect detection result corresponding to the target object is overloaded and abnormal; The defect distribution map and defect quantity value corresponding to the target object determined as "IMC" for the overload abnormality category are transmitted to the statistical process control chart, and the defect distribution map and defect quantity value corresponding to the target object determined as other overload abnormality categories are intercepted and not transmitted to the statistical process control chart.

2. The method for processing overload abnormal defect detection results of defect detection equipment according to claim 1, characterized in that: The following method is used to determine whether the defect detection result corresponding to the target object is overloaded or abnormal: Based on a preset threshold and a defect quantity value in a defect distribution map corresponding to the target object, it is determined whether a defect detection result corresponding to the target object is overloaded and abnormal.

3. The method for processing overload abnormal defect detection results of defect detection equipment according to claim 2, characterized in that: When the defect quantity value in the defect distribution map corresponding to the target object is greater than the preset threshold, it is determined that the defect detection result corresponding to the target object is overloaded and abnormal.

4. The method for processing overload abnormal defect detection results according to claim 1, characterized in that: The defect detection result on the target object includes a text description of each defect in the defect distribution map corresponding to the target object, and each defect in the defect distribution map corresponding to the target object is classified in the following manner: Each defect in the defect distribution map corresponding to the target object is classified based on a text description of each defect in the defect distribution map corresponding to the target object.

5. The method for processing overload abnormal defect detection results according to claim 4, characterized in that: The text description of each defect in the defect distribution map corresponding to the target object is recognized, and when the target text is recognized, each defect in the defect distribution map corresponding to the target object is classified into a category corresponding to the target text.

6. The method for processing overload abnormal defect detection results according to claim 5, characterized in that: The defect categories include: AFS, ADC, LPM, Wafer crack, and IMC. AFS preset threshold, ADC preset threshold, LPM preset threshold, Wafer crack preset threshold, and IMC preset threshold are set accordingly, and the overload abnormality category of the defect detection result corresponding to the target object is determined in the following manner: Respectively counting the defect quantity values ​​of the defect categories AFS, ADC, LPM, Wafer crack, and IMC in the defect distribution map corresponding to the target object; The statistical defect quantity values ​​of AFS, ADC, LPM, Wafer crack, and IMC categories are compared with the AFS preset threshold, ADC preset threshold, LPM preset threshold, Wafer crack preset threshold, and IMC preset threshold respectively to determine the abnormal category of the overload abnormal defect detection result.

7. The method for processing overload abnormal defect detection results according to claim 6, characterized in that: If the statistical defect quantity value of any one of the AFS, ADC, LPM, Wafer crack, and IMC categories obtained by statistics is greater than or equal to the preset threshold of the corresponding category, the overload abnormality category of the defect detection result corresponding to the target object is determined to be the corresponding category.

8. A system for processing overload abnormal defect detection results of a defect detection device based on the method for processing overload abnormal defect detection results of a defect detection device according to any one of claims 1 to 7, characterized in that: The system comprises: A defect detection module, configured to scan a target object to obtain a defect detection result on the target object, wherein the defect detection result on the target object includes a defect distribution map and a defect quantity value corresponding to the target object, and the defect distribution map corresponding to the target object includes location and size information of multiple defects on the target object; an overload abnormality category determination module, used to determine whether the defect detection result corresponding to the target object is overload abnormal based on the defect quantity value of the defect distribution map corresponding to the target object, and determine the overload abnormality category of the defect detection result corresponding to the target object when the detection result corresponding to the target object is overload abnormal; The statistical process control chart data transmission module transmits the defect distribution map and defect quantity value corresponding to the target object whose overload abnormality category is determined as "IMC defect quantity exceeds upper limit" to the statistical process control chart, and intercepts the defect distribution map and defect quantity value corresponding to the target object determined as other overload abnormality categories, that is, does not transmit them to the statistical process control chart; Among them, the overload abnormality category determination module is communicatively connected with the defect detection module, the statistical process control chart data transmission module is communicatively connected with the defect detection module and the overload abnormality category determination module respectively, the overload abnormality category determination module receives the defect detection result on the target object transmitted by the defect detection module, and the statistical process control chart data transmission module transmits or does not transmit the defect detection result on the target object stored in the defect detection module according to the overload abnormality category of the defect detection result corresponding to the target object transmitted by the overload abnormality category determination module.

9. A method for determining whether a process equipment needs to be shut down for maintenance, characterized in that: The method comprises: Obtaining a wafer to be inspected and using it as a target object; Based on the target object, a statistical process control chart is obtained using the overload abnormal defect detection result processing method of the defect detection equipment as described in any one of claims 1-7, and based on the alarm information of the statistical process control chart, it is decided whether to shut down the process equipment for maintenance.

10. A method for determining whether a process equipment needs to be shut down for maintenance, characterized in that: The method comprises: Obtaining a wafer to be inspected and using it as a target object; Based on the target object, the overload abnormal defect detection result processing system of the defect detection equipment as described in claim 8 is used to obtain a statistical process control chart, and based on the alarm information of the statistical process control chart, it is decided whether to shut down the process equipment for maintenance.

11. An electronic device, characterized in that: The method comprises a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the method according to any one of claims 1 to 7, 9 and 10 when executing the computer program.

12. A computer-readable storage medium having program instructions stored thereon, characterized in that: When the program instructions are executed by a processor, the method according to any one of claims 1 to 7, 9 and 10 is implemented.

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