Test substrate and manufacturing method and test method thereof

Abstract

The invention relates to a test substrate and a manufacturing method and a test method thereof. The test substrate comprises a substrate main body and at least two driving circuits arranged on one side of the substrate main body, each driving circuit comprises at least two detection areas with the same number, and the detection areas are used for arranging light-emitting chips with the same number for detection; in each driving line, the detection area is arranged along the current transmission direction of the driving line, and the arrangement intervals of the detection areas on different driving lines are different; the setting interval of each detection area in any driving circuit is formed by scaling up or scaling down the setting interval of each detection area in the other driving circuit; the difference between the line width and the thickness of each driving circuit does not exceed 10%, and the driving circuits are made of the same material. In some implementation processes, the cost can be reduced, and the verification time interval can be accelerated.

Description

Technical Field

[0001] The present application relates to the field of display manufacturing, and in particular to a test substrate and a manufacturing method and a testing method thereof. Background Art

[0002] During the design and production of display panels, various tests are required to verify the performance and feasibility of production. The light-emitting chip set on the display panel is driven by a driving circuit. Multiple light-emitting chips are usually connected to the driving circuit. These light-emitting chips are at different distances from the power supply end. Light-emitting chips at different positions will face different voltage drops, resulting in different display effects. By testing the brightness uniformity, the feasibility of driving the display panel under the current design can be verified. The thickness of the driving circuit affects its line resistance. The thinner the driving circuit, the greater the line resistance, the greater the voltage drop, which is easy to affect the brightness uniformity. In order to help determine the optimal thickness design of the driving circuit, different test substrates can be provided to form driving circuits of different thicknesses, and tests such as brightness uniformity can be performed to verify the feasibility. However, such a test verification method is costly and the verification process may be long.

[0003] Therefore, how to conduct testing and verification at a lower cost and with higher efficiency is an urgent problem to be solved. Summary of the invention

[0004] In view of the above-mentioned deficiencies of the related art, the purpose of the present application is to provide a test substrate and a manufacturing method and a testing method thereof, aiming to solve the problems in the related art of high cost and long verification time when testing and verifying the thickness design of the driving circuit.

[0005] A test substrate, comprising:

[0006] substrate body;

[0007] At least two drive lines are arranged on one side of the substrate body, each of the drive lines includes at least two detection areas of the same number, and each detection area is used to set the same number of light-emitting chips for detection; in each drive line, the detection area is set along the current transmission direction of the drive line, and the setting intervals of the detection areas on different drive lines are different; the setting interval of each detection area in any drive line is proportionally enlarged or reduced by the setting interval of each detection area in any other drive line; the difference in line width and thickness between each drive line does not exceed 10%, and the materials are the same.

[0008] The above-mentioned test substrate forms at least two different driving lines, and the detection areas thereon are set at different intervals. By utilizing the influence of the line length under the conditions of equal width and thickness, different line resistances of the driving lines are achieved, and the different thicknesses of the driving lines are equivalently simulated. In some implementation processes, the production difficulty is lower and the cost can be reduced. Since fewer test substrates are required for verification and the production conditions are simple, it is beneficial to speed up the verification schedule.

[0009] Optionally, the detection areas on the driving circuit are distributed at equal intervals.

[0010] Optionally, the circuit structures of the detection areas in the test substrate are the same.

[0011] Optionally, the detection area includes a light-emitting chip bonding area and a driving chip bonding area, and each of the driving chip bonding areas is connected to at least two of the light-emitting chip bonding areas.

[0012] Based on the same inventive concept, the present application also provides a method for manufacturing a test substrate, comprising:

[0013] providing a substrate body;

[0014] At least two driving circuits are formed on the substrate body, each of the driving circuits includes at least two detection areas of the same number, and each of the detection areas is used to set the same number of light-emitting chips for detection; in each of the driving circuits, the detection area is set along the current transmission direction of the driving circuit, and the setting intervals of the detection areas on different driving circuits are different; the setting interval of each of the detection areas in any of the driving circuits is proportionally enlarged or reduced by the setting interval of each of the detection areas in any of the driving circuits; the difference in line width and thickness between the driving circuits does not exceed 10%, and the materials are the same.

[0015] The manufacturing method of the above-mentioned test substrate can form a test substrate with at least two different driving lines, on which the detection areas are set at different intervals. By utilizing the influence of the line length under the conditions of equal width and thickness, different line resistances of the driving lines are achieved, and the different thicknesses of the driving lines are equivalently simulated. In some implementation processes, the manufacturing difficulty is lower, and the cost can also be reduced and it is helpful to speed up the verification schedule.

[0016] Based on the same inventive concept, the present application also provides a testing method, including providing the above-mentioned testing substrate;

[0017] Arranging a light-emitting chip in the detection area;

[0018] The light-emitting chip is illuminated to obtain test data.

[0019] The above-mentioned testing method uses the aforementioned testing substrate to test the light-emitting chip, so that a single testing substrate can simulate the testing conditions of at least two driving circuits with different thicknesses. In some implementation processes, the number of testing substrates required is smaller and the testing substrates are also easy to manufacture, which reduces the time and economic cost required for testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of a test substrate structure in the related art;

[0021] Figure 2 A schematic diagram of the structure of a test substrate provided in an embodiment of the present application;

[0022] Figure 3 A schematic diagram of a structure unit of a test area provided in an embodiment of the present application;

[0023] Figure 4 A schematic diagram of the configuration of the test area in each driving circuit provided in the embodiment of the present application;

[0024] Figure 5 A schematic diagram of the basic process of the method for manufacturing a test substrate provided in an embodiment of the present application;

[0025] Figure 6 A schematic diagram of the basic flow of the test method provided in the embodiment of the present application;

[0026] Figure numerals: 100-substrate body; 200-driving circuit; 201-light-emitting chip; 202-driving chip; 203-0Ω resistor; 210-structural unit of test area; 300-FPC; C1-first driving circuit; C2-second driving circuit; C3-third driving circuit; A1, A2, A3, A4, A5, A6, A7, A8, A9-test area. DETAILED DESCRIPTION

[0027] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0029] In the related art, driving circuits of different thicknesses are provided for testing and verification. Such a testing and verification method is costly and the verification process may be long.

[0030] Based on this, the present application hopes to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in the subsequent embodiments.

[0031] The present embodiment provides a test substrate, which includes a substrate body 100 and at least two drive circuits 200 arranged on one side of the substrate body 100. The substrate body 100 of the present embodiment can be glass, ceramic or other insulating materials; the test substrate can be a hard substrate or a flexible substrate, that is, the material of the substrate body 100 can be hard or a flexible insulating material. The drive circuit 200 is used to drive the light-emitting chip 201, and each drive circuit 200 is provided with at least two detection areas, and the number of detection areas in each drive circuit 200 is the same. During the test, it is ensured that the number of light-emitting chips 201 in each drive circuit 200 is also the same, so each detection area is used to set the same number of light-emitting chips 201, for example, the number of pads on the detection area for setting the light-emitting chip 201 is the same.

[0032] In the drive circuit 200, the detection area is set along the current transmission direction of the drive area, that is, in the same drive circuit 200, different detection areas are at different distances from the power supply end. In this embodiment, in different drive circuits 200, the setting intervals of the detection areas are different. For example, in one of the drive circuits 200, each detection area is set at a first interval, and each detection area in another drive circuit 200 is set at a second interval, and the first interval and the second interval are different. If there are three or more detection areas, in actual applications, the detection areas in the same drive circuit 200 can usually be set in an equal interval manner. In this embodiment, the setting interval of the detection area in any drive circuit 200 is proportionally enlarged or reduced for the setting interval of the detection area in another arbitrary drive circuit 200. In the different drive circuits 200, the setting interval ratio of the detection area is not limited to an integer multiple, and can be any multiple according to actual needs. In other words, as long as the setting rules of the detection areas in different drive circuits 200 are the same, it is sufficient. Taking the equal interval setting as an example, no matter what interval the detection areas in each drive circuit 200 are set at, it is equivalent to the result of enlarging or reducing the setting interval of another drive circuit 200. In the implementation mode of non-equal interval setting, the setting interval in each driving circuit 200 is also the result of overall enlargement or reduction. As a specific example, the setting interval of the detection area in one driving circuit 200 is 1, 2, and 3 units respectively, and the setting interval of the detection area in another driving circuit 200 can be 2, 4, and 6 units respectively, or 0.5, 1, 1.5 units respectively, and so on.

[0033] In order to control the variables, the difference between the line width and thickness of each drive circuit 200 does not exceed 10%. In practical applications, it can also be controlled to be no more than 3%, 5%, 7% or even equal as much as possible, that is, the drive circuit 200 is of equal width or substantially equal width, and the thickness is also of equal thickness or substantially equal thickness. In practical applications, in order to keep the thickness the same, the drive circuit 200 can be made by first setting a layer of material and then patterning it, so that the thickness produced is basically equal. The material of the drive circuit 200 can be a conductive material including but not limited to conductive metals. In some embodiments, the drive circuit 200 is a metal conductive layer, that is, it is made of a conductive metal material and forms a pattern. Exemplarily, the drive circuit 200 of this embodiment can be made of at least one of copper, silver, tin, gold, aluminum, tungsten, zinc, nickel, and iron. The drive circuits 200 in this embodiment are made of the same material, that is, they have the same resistivity.

[0034] In the related art, in order to verify the driving conditions of drive circuits 200 of different thicknesses, it is necessary to prepare multiple test substrates, and for the case where the thickness of the drive circuit 200 is extremely small, it is necessary to use a high-cost film forming process for production. On the other hand, drive circuits 200 of different thicknesses may require different processing conditions for production. If the limit of uniformity is not tested, it is necessary to prepare the production conditions of thinner drive circuits 200, which have a great impact on cost and time. The test substrate of this embodiment forms at least two different drive circuits 200, and the detection areas thereon are set at different intervals. By utilizing the influence of the line length under the conditions of equal width and equal thickness, different line resistances of the drive circuit 200 are achieved, and the situation of different thicknesses of the drive circuit 200 is equivalently simulated. In some embodiments, a single test substrate can realize the verification of drive circuits 200 corresponding to different thicknesses, and only one thickness needs to be used during production, so these drive circuits 200 can be formed by only setting the material once on a single substrate. The length control of the driving circuit 200 can be achieved by controlling the forming pattern, which is less difficult to manufacture and can also reduce costs compared to controlling the formation of different thicknesses or widths. Since fewer test substrates are required for verification and the manufacturing conditions are simple, it is helpful to speed up the verification process.

[0035] It can be understood that the resistance of the driving circuit 200 can be calculated by R=ρL / S, where R is the resistance of the driving circuit 200, that is, the line resistance; ρ is the resistivity; L is the length of the driving circuit 200; and S is the cross-sectional area of ​​the driving circuit 200. It can be seen that the driving circuits 200 of different thicknesses actually have different cross-sectional areas S, and thus the line resistance R in the circuit is different; the thickness and width of each driving circuit 200 in this embodiment are the same or substantially the same, that is, the change of the cross-sectional area S is controlled, and by changing the length L, the change of the line resistance R can also be equivalently achieved, and the situation of driving circuits 200 of different thicknesses can be simulated under the same thickness. The technician only needs to use the test substrate of this embodiment for testing and perform a simple conversion to verify the driving situation of the driving circuit 200 at different thicknesses.

[0036] In order to further ensure the accuracy of verification, the circuit structure of the detection area in each test substrate is the same, which ensures that the line resistance of the circuit inside the detection area is consistent, reduces additional variables, and is easy to design and manufacture. However, the internal circuit of the detection area can also have different thicknesses. In some embodiments, the length of the circuit inside the detection area can also be designed to more accurately simulate the situation of driving circuits 200 of different thicknesses.

[0037] In order to better utilize the space of the test substrate, the length of the drive circuit 200 itself in some embodiments is different, and the detection areas are set at both ends of the drive circuit 200, so that the length of the drive circuit 200 is not wasted. In some implementation processes, as many drive circuits 200 as possible can be set on a single test substrate to meet the verification of various specifications.

[0038] In some embodiments, the test substrate includes a driving circuit 200 whose length does not exceed the spacing between the opposite sides of the substrate body 100, and the driving circuit 200 whose length does not exceed the spacing between the opposite sides of the substrate body 100 is arranged in a straight line in a direction perpendicular to the opposite sides of the substrate body 100; the test substrate also includes a driving circuit 200 whose length exceeds the spacing between the opposite sides of the substrate body 100, and the driving circuit 200 whose length exceeds the spacing between the opposite sides of the substrate body 100 is arranged in a serpentine shape, and its parallel part is parallel to the driving circuit 200 whose length does not exceed the spacing between the opposite sides of the substrate body 100. The driving circuit 200 arranged in a straight line or serpentine shape can increase the coverage rate of the driving circuit 200 in a single test substrate, and is also conducive to forming as many different driving circuits 200 as possible to meet the verification of multiple specifications, and the arrangement between these different driving circuits 200 is clear and easy to distinguish, which is conducive to the observation of the results.

[0039] In addition, in addition to the light emitting chip 201 bonding area for bonding the light emitting chip 201, the detection area may also include a driver chip 202 bonding area for driving and controlling the light emitting chip 201, and simulating the actual driving mode in some scenarios during the test verification. In some embodiments, each driver chip 202 bonding area may be connected to at least two light emitting chips 201 bonding areas, that is, in the detection area, the smallest detection unit is one driver chip 202 and two light emitting chips 201.

[0040] In order to increase the accuracy of the test, each detection area in some embodiments includes at least two adjacent driving chip 202 bonding areas, and each driving chip 202 bonding area can be connected to at least two light-emitting chips 201 bonding areas. Therefore, at least two groups of light-emitting chips 201 in a single detection area provide more test samples, which is conducive to accurate results.

[0041] For better understanding, further explanation is given below with reference to specific examples.

[0042] Please see first Figure 1 , a test substrate in the related art is exemplified, which includes a glass substrate body 100 and several columns of drive circuits 200. One end of these drive circuits 200 is provided with a FPC300 (Flexible Printed Circuit, flexible circuit board) pad for each column of drive circuits 200 to connect to the FPC300. In these test substrates, the arrangement of the drive circuits 200 is usually consistent with the display panel, arranged in columns, and the light-emitting chips 201 arranged thereon form an array arrangement.

[0043] like Figure 2 As shown, a test substrate of this example includes a substrate body 100 and three sequentially arranged drive circuits 200. Among them, the first drive circuit C1 is the shortest and is arranged in a straight line from one side of the substrate body 100 to the other side. The other two are second drive circuits C2, whose length is greater than the distance between the two opposite sides of the substrate body 100, and thus arranged in a serpentine shape. In this application, for example Figure 2 The longer side of the second drive circuit C2 or the third drive circuit C3 shown is a parallel portion, and the shorter side is a corner connection portion of the second drive circuit C2; wherein the parallel portion of the second drive circuit C2 or the third drive circuit C3 is parallel to the first drive circuit C1. The drive circuit 200 in the above example is also equivalent to connecting a portion of multiple columns of circuits in a serpentine manner, thereby forming a longer drive circuit 200. In this example, one end of each drive circuit 200 may also include an FPC300 pad for connecting to the FPC300.

[0044] See also Figure 3, a structural unit 210 of a test area is exemplified. The test area in this example includes a light-emitting chip 201 bonding area and a driver chip 202 bonding area. The driver chip 202 bonding area connects 16 light-emitting chips 201 bonding areas. These light-emitting chips 201 bonding areas are arranged in a 4*4 array. The light-emitting chips 201 arranged thereon can be driven and controlled by the driver chip 202 arranged in the driver chip 202 bonding area. Some of the circuits can also be connected by setting a 0Ω resistor 203 and the like. Among them, the circuit parts on both sides are the positive power supply VELD of the light-emitting chip 201, and the circuit parts adjacent thereto are the power supply VDD and the ground GND of the driver chip 202. It should be understood that the structure of the above-mentioned test area is only an example. In actual applications, the structure of the test area can be designed as any other feasible form according to actual conditions. The test areas in this example all have the same structure as described above, that is, in any length of the driving circuit 200, the number of light-emitting chips 201 and the driving chip 202 remains consistent; under ideal conditions (that is, the line width and thickness between the driving circuits 200 can be the same), the voltage drop difference of each driving circuit 200 during the test is only affected by the different intervals between the test areas (that is, the line lengths therebetween).

[0045] Figure 4 The configuration of the test area in each driving circuit 200 is shown in the figure. In this example, the configuration intervals of the test areas are set at equal intervals. In this example, each test area includes two adjacent driving chip 202 bonding areas, and each driving chip 202 bonding area is connected to a plurality of light emitting chips 201 bonding areas. That is, each test area includes two adjacent groups of Figure 3 The structural unit 210 of the test area is shown. The first driving circuit C1 is the shortest, and the test areas therein are closely arranged, which corresponds to the arrangement of the light-emitting chips 201 in the actual display panel. In this example, the first driving circuit C1 includes test areas A1, A2 and A3 in sequence; the second driving circuit C2 includes test areas A4, A5 and A6 in sequence; the third driving circuit C3 includes test areas A7, A8 and A9 in sequence;

[0046] As a specific example, assuming that the resistivity corresponding to the first drive circuit C1 is 0.02Ω*um, the test point resistance R13 of the test area A3 is R13=0.02*L3 / S, where L3 is the distance between the test area A3 and the FPC300 pad of the first drive circuit C1. The length of the second drive circuit C2 is about twice that of the first drive circuit C1 (for ease of calculation, the length of the corner connection part of the second drive circuit C2 is ignored), and the test area A3 and the test area A6 are two corresponding test areas, which are the last test areas of the first drive circuit C1 and the second test circuit, respectively, so L6=2L3, where L6 is the distance between the test area A6 and the FPC300 pad of the second drive circuit C2. Then the test point resistance R23 of the test area A6 is R23=0.02*L6 / S=0.02*2L3 / S. It can be seen that the effect of the test area A6 is equivalent to the effect of the test area A3 when the resistivity of the first drive circuit C1 is 0.04Ω*um (twice 0.02Ω*um). Similarly, in the third drive circuit C3, whose length is about three times that of the first drive circuit C1, the effect of the test area A9 is equivalent to the effect of the test area A3 when the resistivity of the first drive circuit C1 is 0.06Ω*um (three times 0.02Ω*um). Different resistivities also correspond to drive circuits 200 of different thicknesses at the same length and width. In this example, the same corresponding relationship exists between the test areas A1, A4 and A7, and between the test areas A2, A5 and A8, which will not be repeated here. It can be seen that the test substrate of this example can only produce a drive circuit 200 of one thickness, but can be used to verify the driving effects of different thicknesses.

[0047] This embodiment also provides a method for manufacturing a test substrate, see Figure 5 , the steps include but are not limited to:

[0048] S101, providing a substrate body;

[0049] S102, forming at least two driving circuits on the substrate body, each driving circuit including at least two detection areas of the same number, each detection area being used to set the same number of light-emitting chips for detection; in each driving circuit, the detection area is set along the current transmission direction of the driving circuit, and the setting intervals of the detection areas on different driving circuits are different; the setting intervals of the detection areas in any driving circuit are proportionally enlarged or reduced to the setting intervals of the detection areas in another arbitrary driving circuit; the difference in line width and thickness between the driving circuits does not exceed 10%, and the materials are the same;

[0050] The substrate body 100 of this embodiment can be glass, ceramic or other insulating materials; the test substrate can be a hard substrate or a flexible substrate, that is, the material of the substrate body 100 can be hard or a flexible insulating material. The material of the drive circuit 200 can be a conductive material including but not limited to conductive metals. In some embodiments, the drive circuit 200 is a metal conductive layer, that is, it is made of a conductive metal material and forms a pattern. Exemplarily, the drive circuit 200 of this embodiment can be made of at least one of copper, silver, tin, gold, aluminum, tungsten, zinc, nickel, and iron. The structure of the test substrate obtained by the method for making the test substrate of this embodiment can also refer to the above examples, which will not be repeated here.

[0051] Each drive circuit 200 can be formed at the same time or can be formed separately in multiple times, but the one-time simultaneous production can usually have a more consistent thickness, and the production efficiency and cost are also lower. In some implementations, in order to ensure the same or substantially the same thickness, the method of forming at least two drive circuits 200 on the substrate body 100 can be to first set a layer of drive circuit 200 material on the substrate body 100, and then make the material into a drive circuit 200 by patterning. For example, a conductive metal material can be deposited on the substrate body 100 to form a metal film layer, such as the material in the above example, and then the metal film layer is patterned into the pattern of the drive circuit 200 by methods including but not limited to photolithography. On the same substrate, usually only one film thickness can be formed. Therefore, in order to verify the driving conditions of drive circuits 200 of different thicknesses in the related art, it may be necessary to prepare multiple substrates for testing. The test substrate produced by the test substrate production method of this example forms a plurality of different drive circuits 200. By changing the interval between the test areas, the conditions of drive circuits 200 of different thicknesses can be equivalently simulated. In other implementations, the driving circuits 200 may also be formed in other ways, as long as the thickness and width of each driving circuit 200 are substantially the same.

[0052] The method for manufacturing the test substrate described above can produce the test substrate of the aforementioned example. A single test substrate can realize the verification of drive circuits 200 corresponding to different thicknesses, and only one thickness needs to be used during the manufacturing process to control the length of the drive circuit 200. This can be achieved by controlling the forming pattern. Compared with controlling the formation of different thicknesses or widths, the manufacturing difficulty is lower and the cost can also be reduced. Since fewer test substrates are required for verification and the manufacturing conditions are simple, it is beneficial to speed up the verification schedule.

[0053] This embodiment also provides a testing method, see Figure 6 The steps include but are not limited to:

[0054] S201, providing a test substrate;

[0055] The test substrate is the test substrate mentioned above in this application.

[0056] S202, setting a light-emitting chip in a test area;

[0057] The light-emitting chip 201 includes but is not limited to at least one of an ordinary LED (Light Emitting Diode) chip, a Mini LED (Mini Light Emitting Diode) chip, and a Micro LED (MicroLight Emitting Diode) chip, or may also be other semiconductor light-emitting devices. The light-emitting chip 201 may be placed in the test area and bonded in any manner. For example, when the light-emitting chip 201 is a Micro LED chip, it may be transferred to the test area by mass transfer. When the light-emitting chip 201 is a Mini LED chip or an ordinary LED chip, it may be transferred to the test area one by one by Pick&Place (chip picking and placement). The light-emitting chip 201 in the test substrate may be a single color, such as a white light-emitting chip or a blue light-emitting chip; or two or more light-emitting chips 201 may be used, such as red, green, and blue light-emitting chips 201, which is not limited in this embodiment.

[0058] In some implementations, the driving circuit 200 of the test substrate also includes a driving chip 202 bonding area, and the test method further includes setting the driving chip 202 in the test area. It is understandable that before lighting up the light-emitting chip 201, the components in the driving circuit 200 are set up and can achieve the normal lighting action of the light-emitting chip 201.

[0059] S203, lighting up the light-emitting chip and acquiring test data;

[0060] The tests in this embodiment include but are not limited to brightness uniformity tests, current uniformity tests, or other electrical or optical performance tests. For various tests, the effects of drive circuits 200 of different thicknesses can be simulated. Exemplarily, in the test of brightness uniformity or current uniformity, the influence of the voltage drop caused by the drive circuit 200 on the uniformity of brightness or current is mainly tested, thereby judging the feasibility of using a thinner drive circuit 200 to drive the light-emitting chip 201. In this application, the test data is determined according to the actual test items. For example, in the brightness uniformity test, the test data includes the luminous brightness of the light-emitting chip 201. The consistency of the luminous brightness of each light-emitting chip 201 in the drive circuit 200 can be compared to obtain the test result of brightness uniformity; in the test of current uniformity, the test data includes the actual working current of the light-emitting chip 201.

[0061] The testing method of this embodiment adopts the aforementioned testing substrate, so that a single testing substrate can simulate the testing conditions of at least two driving circuits 200 with different thicknesses. After obtaining the test data, the number of testing substrates required in some implementation processes is smaller, and the testing substrate is also easy to manufacture, which reduces the time and economic cost required for testing.

[0062] It should be understood that the application of the present application is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A test substrate, characterized in that: include: substrate body; At least two driving circuits are arranged on one side of the substrate body, each of the driving circuits comprises at least two detection areas of the same number, and each of the detection areas is used to set the same number of light-emitting chips for detection; in each of the driving circuits, the detection areas are arranged along the current transmission direction of the driving circuit, and the detection areas on different driving circuits are arranged at different intervals; The setting interval of each detection area in any one of the driving lines is proportionally enlarged or reduced to the setting interval of each detection area in another arbitrary driving line; The difference in line width and thickness between the driving lines does not exceed 10%, and the materials are the same.

2. The test substrate according to claim 1, characterized in that The at least two driving lines have different lengths, and the detection areas are provided at both ends of the driving lines.

3. The test substrate according to claim 1, wherein: The detection areas on the driving circuit are distributed at equal intervals.

4. The test substrate according to claim 1, wherein: The test substrate includes a driving circuit whose length does not exceed the distance between the two opposite sides of the substrate body, and is arranged in a straight line in a direction perpendicular to the two opposite sides of the substrate body; The test substrate also includes a driving circuit whose length exceeds the spacing between two opposite sides of the substrate body, which is arranged in a serpentine shape and whose parallel portion is parallel to the driving circuit whose length does not exceed the spacing between two opposite sides of the substrate body.

5. The test substrate according to claim 1, wherein: The driving circuit is a metal conductive layer.

6. The test substrate according to claim 1, wherein: The circuit structures of the detection areas in the test substrate are the same.

7. The test substrate according to any one of claims 1 to 6, characterized in that: The detection area includes a light emitting chip bonding area and a driving chip bonding area, and each of the driving chip bonding areas is connected to at least two of the light emitting chip bonding areas.

8. The test substrate according to claim 7, characterized in that: Each of the detection areas includes at least two adjacent driving chip bonding areas.

9. A method for manufacturing a test substrate, characterized in that: include: providing a substrate body; At least two driving circuits are formed on the substrate body, each of the driving circuits includes at least two detection areas of the same number, and each of the detection areas is used to set the same number of light-emitting chips for detection; in each of the driving circuits, the detection areas are set along the current transmission direction of the driving circuit, and the detection areas on different driving circuits are set at different intervals; The setting interval of each detection area in any one of the driving lines is proportionally enlarged or reduced to the setting interval of each detection area in another arbitrary driving line; The difference in line width and thickness between the driving lines does not exceed 10%, and the materials are the same.

10. A testing method, characterized in that: include: Providing a test substrate according to any one of claims 1 to 8; Arranging a light-emitting chip in the detection area; The light-emitting chip is illuminated to obtain test data.

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