A self-adaptive high-precision line repair method and device

Abstract

An adaptive high-precision circuit repair method includes the following steps: S1. Illuminating the sample under test with a light source, a CCD high-resolution camera collects image data to detect circuit defects; S2. Analyzing the collected defect image data with an image analysis device to determine the nozzle repair path, and adaptively adjusting the nozzle operating parameters using empirical formulas; S3. A target electrode is ablated using an electrospark ablation device to produce nanometal particles; S4. A carrier gas flow rate control device is used to adjust the inert gas flow rate to deliver the nanometal particles to a nanoparticle printing and sintering device; S5. A dry aerosol printing nozzle prints the metal nanoparticles at the defect location, and complete circuit repair is achieved through nozzle movement and the assistance of a movable platform under the substrate; S6. Activating a pressurizing pump and heating assembly to pressurize and heat the metal nanoparticles on the substrate within the sintering chamber. This solution improves the efficiency of circuit repair.

Description

Technical Field

[0001] The present invention relates to the technical field of line detection and repair, and in particular to an adaptive high-precision line repair method and device. Background Art

[0002] As the requirements for lightweight and flexible electronic products continue to increase, the size of chips in the electronic packaging industry continues to shrink. The reliability of chips and the need to repair fine circuits during the packaging process have become increasingly urgent issues that need to be addressed. Chip circuits may be damaged or worn during the packaging process. These damages or wear will reduce the service life of the chip and even directly lead to circuit failure. Therefore, many researchers are currently trying to achieve circuit repair for fine circuits on chips in various aspects. However, the current mainstream circuit repair methods either lack precision and cannot achieve high-precision circuit repair, or have problems such as long circuit repair time, low efficiency, and the need to manufacture mask templates during circuit repair, which increases the cost of circuit repair. In response to a series of problems with the current mainstream circuit repair methods in chip packaging, a high-precision and high-efficiency circuit repair method has become the research focus of current researchers. Summary of the Invention

[0003] The purpose of the present invention is to provide an adaptive high-precision line repair method.

[0004] The purpose of the present invention is to provide an adaptive high-precision line repair device.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] An adaptive high-precision line repair method comprises the following steps:

[0007] S1. The light source illuminates the sample to be tested, and the CCD high-resolution camera collects image data to detect defects in the circuit;

[0008] S2. Analyzing the collected defect image data through an image analysis device to derive a nozzle repair path, and using an empirical formula to calculate and adaptively change the nozzle operating parameters;

[0009] S3, preparing nano-metal particles by ablating the target electrode through an electric spark ablation device;

[0010] S4, using a carrier gas flow rate control device to adjust the inert gas flow rate to deliver the nano-metal particles to the nano-particle printing and sintering device;

[0011] S5. Printing metal nanoparticles to the defective position of the circuit through a dry aerosol printing nozzle, and achieving complete repair of the circuit with the assistance of the nozzle movement and the movable platform under the substrate;

[0012] S6. Turn on the pressure pump and the heating component to achieve pressurized heating and sintering of the metal nanoparticles on the substrate in the chamber.

[0013] Preferably, the optical detection device includes a CCD high-resolution camera and a light source;

[0014] The light source is used to irradiate light onto the surface of the object to be measured, and the CCD high-resolution camera collects the surface morphology and light changes of the object to be measured under the irradiation of the light source, and transmits the collected image data to the image analysis device.

[0015] Preferably, the image analysis device analyzes the defect morphology parameters of the circuit to establish a relative coordinate system to derive the running trajectory of the nozzle, and adaptively changes the running parameters of the nozzle by applying empirical formulas based on the defect morphology parameters to ensure good efficiency and quality of circuit repair;

[0016] The operating parameters of the nozzle satisfy the following relationship:

[0017] T is the time required to repair the defect, w is the width of the defect, l is the length of the defect, t is the time required for the nozzle to deposit 1 μm thick nanometal particles, d is the diameter of the nozzle orifice, and ν is the moving speed of the nozzle;

[0018] When repairing the line, the size and depth of the line defect and the time required for line repair can be analyzed and judged to adaptively change the movement speed of the nozzle. When the defect is deep, multiple fillings can be performed to ensure the efficiency and quality of line repair.

[0019] Preferably, the electric spark ablation device includes two target electrodes, an ablation reaction container, a high-voltage electrostatic output device, and an air pipe connection port;

[0020] The two target electrodes are placed opposite to each other in an ablation reaction container, and the two electrodes are respectively connected to a high-voltage electrostatic output device. The ablation reaction container is connected to an inert gas source and a nanoparticle printing and sintering device for ventilation through an air pipe connection port and a connecting air pipe;

[0021] The voltage adjustment range of the high-voltage electrostatic output device is 0-13.6kV, and the current adjustment range is 0-15.6mA. The particle size of the prepared fine-diameter nano-metal particles is 5-10nm. The nano-metal particles prepared by the two target electrodes can be any one of copper, tin, silver, gold, aluminum, copper-tin alloy, copper-tungsten alloy, copper-titanium alloy or copper-chromium alloy.

[0022] Furthermore, the inert gas in the inert gas is any one of helium, nitrogen and argon, and the gas flow rate controlled by the carrier gas flow rate controller is 0-1.6 m / s.

[0023] Furthermore, the nanoparticle printing device comprises a dry aerosol printing nozzle, a movable platform and a pressurized sintering chamber;

[0024] The movable platform is placed in the pressurized sintering chamber, and the circuit substrate is placed and fixed on the movable platform; the dry aerosol printing nozzle is connected to the connecting air pipe, and the pressure pump is connected to the pressurized sintering chamber externally.

[0025] Furthermore, the diameter of the dry aerosol printing nozzle is 0.01um-10um, the width of the repaired line is 0.1um-80um, and the bonding force between the nano-metal particles and the substrate after sintering is 20N / mm 2 -40N / mm 2 .

[0026] Furthermore, the pressurized sintering chamber includes a pressurized chamber, a pressurized pump, and a sensor;

[0027] The pressure pump is connected to the air inlet of the pressure chamber, and the pressure pump introduces inert gas to realize pressurized heating and sintering of the nano metal particles on the circuit; the sensor is used to detect the air pressure inside the pressure chamber; after the sintering work is completed, the gas is discharged through the exhaust port of the pressure chamber. The operating pressure inside the pressure chamber is 0-20MPa.

[0028] Furthermore, the movable platform includes a substrate fixing component, a heating and sintering component, and a three-coordinate system moving component;

[0029] The substrate fixing assembly is used to fix the circuit substrate on the movable platform, so that the substrate can move together with the movable platform to complete the circuit repair; the heating and sintering assembly is used to heat from below to achieve the sintering of nano-metal particles on the circuit; the three-coordinate system moving assembly can realize the free movement of the movable platform to meet the complex movement required during circuit repair.

[0030] An adaptive high-precision circuit repair device, comprising an optical detection device, an acquisition and analysis device, an electric spark ablation device, a carrier gas flow rate control device, a dry aerosol printing nozzle, a pressurized sintering chamber, and a movable platform;

[0031] The pressurized sintering chamber includes an air pressure sensor, a pressurized chamber and a pressurized pump, wherein the pressurized pump is connected to the air inlet of the pressurized chamber, and the air pressure sensor is installed in the pressurized chamber;

[0032] The optical detection device includes a CCD high-resolution camera and a light source, wherein the CCD high-resolution camera is installed in the pressurized chamber, the light source is installed around the CCD high-resolution camera, and the CCD high-resolution camera is connected to the acquisition and analysis device;

[0033] The movable platform includes a substrate fixing component, a heating and sintering component, and a three-coordinate system moving component; the Z-axis of the three-coordinate system moving component is installed with the heating and sintering component, the substrate fixing component is installed above the heating and sintering component, and the CCD high-resolution camera of the heating component is facing the substrate fixing component;

[0034] The carrier gas flow rate control device includes a flow rate control device and an inert gas source. The electric spark sintering device is connected to the dry aerosol printing nozzle through an air pipe. The dry aerosol printing nozzle is located in the pressurized sintering chamber and the dry aerosol printing nozzle is located above the movable platform. The inert gas source is connected to the upstream of the air pipe, and a flow rate control device is provided between the inert gas source and the electric spark sintering device.

[0035] One of the above-mentioned technical solutions has the following beneficial effects: The adaptive high-precision line repair method and device of the present invention differs from current mainstream line repair methods by utilizing fine-diameter nano-metal particles prepared by electrospark ablation and a fine-caliber nozzle to achieve high-precision line repair. Furthermore, in an accompanying detection and analysis device, the empirical formulas described in this patent are used to adaptively change the operating parameters of the nozzle to ensure high efficiency and quality of line repair. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 Flowchart of the process of detecting line defects and repairing the line according to the present invention

[0037] Figure 2 It is the overall structural diagram of the device of the present invention. DETAILED DESCRIPTION

[0038] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0039] like Figure 1-2 As shown, an adaptive high-precision line repair method includes the following steps:

[0040] S1. The light source illuminates the sample to be tested, and the CCD high-resolution camera collects image data to detect defects in the circuit;

[0041] S2. Analyzing the collected defect image data through an image analysis device to derive a nozzle repair path, and using an empirical formula to calculate and adaptively change the nozzle operating parameters;

[0042] S3, preparing nano-metal particles by ablating the target electrode through an electric spark ablation device;

[0043] S4, using a carrier gas flow rate control device to adjust the inert gas flow rate to deliver the nano-metal particles to the nano-particle printing and sintering device;

[0044] S5. Printing metal nanoparticles to the defective position of the circuit through a dry aerosol printing nozzle, and achieving complete repair of the circuit with the assistance of the nozzle movement and the movable platform under the substrate;

[0045] S6. Turn on the pressure pump and the heating component to achieve pressurized heating and sintering of the metal nanoparticles on the substrate in the chamber.

[0046] The adaptive high-precision line repair method and device of this invention differ from current mainstream line repair methods. They utilize fine-diameter nano-metal particles produced by electrospark ablation and a fine-caliber nozzle to achieve high-precision line repair. Furthermore, in an accompanying detection and analysis device, the empirical formulas described in this patent are used to adaptively adjust the nozzle's operating parameters to ensure high line repair efficiency and quality.

[0047] Wherein, the optical detection device includes a CCD high-resolution camera and a light source;

[0048] The light source is used to irradiate light onto the surface of the object to be measured, and the CCD high-resolution camera collects the surface morphology and light changes of the object to be measured under the irradiation of the light source, and transmits the collected image data to the image analysis device.

[0049] The image analysis device analyzes the defect morphology parameters of the circuit to establish a relative coordinate system to derive the nozzle's operating trajectory. By applying the defect morphology parameters to empirical formulas to adaptively change the nozzle's operating parameters, the efficiency and quality of circuit repair are ensured.

[0050] The operating parameters of the nozzle satisfy the following relationship:

[0051] T is the time required to repair the defect, w is the width of the defect, l is the length of the defect, t is the time required for the nozzle to deposit 1 μm thick nanometal particles, d is the diameter of the nozzle orifice, and ν is the moving speed of the nozzle;

[0052] When repairing the line, the size and depth of the line defect and the time required for line repair can be analyzed and judged to adaptively change the movement speed of the nozzle. When the defect is deep, multiple fillings can be performed to ensure the efficiency and quality of line repair.

[0053] The electric spark ablation device includes two target electrodes, an ablation reaction container, a high-voltage electrostatic output device, and an air pipe connection port;

[0054] The two target electrodes are placed opposite to each other in an ablation reaction container, and the two electrodes are respectively connected to a high-voltage electrostatic output device. The ablation reaction container is connected to an inert gas source and a nanoparticle printing and sintering device for ventilation through an air pipe connection port and a connecting air pipe;

[0055] The voltage adjustment range of the high-voltage electrostatic output device is 0-13.6kV, and the current adjustment range is 0-15.6mA. The particle size of the prepared fine-diameter nano-metal particles is 5-10nm. The nano-metal particles prepared by the two target electrodes can be any one of copper, tin, silver, gold, aluminum, copper-tin alloy, copper-tungsten alloy, copper-titanium alloy or copper-chromium alloy.

[0056] By adjusting different voltages and currents to control the preparation conditions of nano-metal particles, the particle size of the prepared fine-diameter nano-metal particles is controlled to be 5-10nm to perform high-precision circuit repair.

[0057] In addition, the inert gas in the inert gas is any one of helium, nitrogen and argon, and the gas flow rate controlled by the carrier gas flow rate controller is 0-1.6 m / s.

[0058] Nano-metal particles of different sizes condensed in the preparation of the electrospark device are sent to the printing device by changing the gas flow rate.

[0059] Furthermore, the nanoparticle printing device comprises a dry aerosol printing nozzle, a movable platform and a pressurized sintering chamber;

[0060] The movable platform is placed in the pressurized sintering chamber, and the circuit substrate is placed and fixed on the movable platform; the dry aerosol printing nozzle is connected to the connecting air pipe, and the pressure pump is connected to the pressurized sintering chamber externally.

[0061] By increasing the pressure, it is ensured that the nano-metal particles and the circuits are in full contact with each other and can be formed; the nano-metal particles are directly printed onto the circuits through a dry aerosol nozzle.

[0062] In addition, the diameter of the dry aerosol printing nozzle is 0.01um-10um, the width of the repaired line is 0.1um-80um, and the bonding force between the nano-metal particles and the substrate after sintering is 20N / mm 2 -40N / mm 2 .

[0063] In addition, the pressurized sintering chamber includes a pressurized chamber, a pressurized pump, and a sensor;

[0064] The pressure pump is connected to the air inlet of the pressure chamber, and the pressure pump introduces inert gas to realize pressurized heating and sintering of the nano metal particles on the circuit; the sensor is used to detect the air pressure inside the pressure chamber; after the sintering work is completed, the gas is discharged through the exhaust port of the pressure chamber. The operating pressure inside the pressure chamber is 0-20MPa.

[0065] By changing the different pressing intensities, the required sintering strength can be obtained by changing different conditions.

[0066] In addition, the movable platform includes a substrate fixing component, a heating and sintering component, and a three-coordinate system moving component;

[0067] The substrate fixing assembly is used to fix the circuit substrate on the movable platform, so that the substrate can move together with the movable platform to complete the circuit repair; the heating and sintering assembly is used to heat from below to achieve the sintering of nano-metal particles on the circuit; the three-coordinate system moving assembly can realize the free movement of the movable platform to meet the complex movement required during circuit repair.

[0068] An adaptive high-precision circuit repair device, comprising an optical detection device 1, an acquisition and analysis device 2, an electric spark ablation device 3, a carrier gas flow rate control device 4, a dry aerosol printing nozzle 5, a pressurized sintering chamber 6, and a movable platform 7;

[0069] The pressurized sintering chamber 6 includes an air pressure sensor 61, a pressurized chamber 62 and a pressurized pump 63. The pressurized pump 63 is connected to the air inlet of the pressurized chamber 62. The air pressure sensor 61 is installed in the pressurized chamber 62.

[0070] The optical detection device 1 includes a CCD high-resolution camera 11 and a light source 12. The CCD high-resolution camera 11 is installed in the pressurized chamber 62. The light source 12 is installed around the CCD high-resolution camera 11. The CCD high-resolution camera is connected to the collection and analysis device 2.

[0071] The movable platform includes a substrate fixing assembly 71, a heating and sintering assembly 72, and a three-coordinate system moving assembly 73; the Z-axis of the three-coordinate system moving assembly 73 is installed with the heating and sintering assembly 72, and the substrate fixing assembly 71 is installed above the heating and sintering assembly. The CCD high-resolution camera 11 of the heating assembly faces the substrate fixing assembly 71;

[0072] The carrier gas flow rate control device 4 includes a flow rate control device 41 and an inert gas source 42. The electric spark sintering device 3 is connected to the dry aerosol printing nozzle 5 through an air pipe. The dry aerosol printing nozzle 5 is located in the pressurized sintering chamber 6. The dry aerosol printing nozzle 5 is located above the movable platform 7. The inert gas source 42 is connected to the upstream of the air pipe. A flow rate control device 41 is provided between the inert gas source and the electric spark sintering device 3.

[0073] The device integrates circuit defect detection, adaptive circuit analysis, nanometal particle manufacturing, and printing and sintering repair functions into a unified system. The nanometal particle preparation, nozzle deposition onto the substrate, and sintering of the repaired circuit are all integrated into a unified system, eliminating the need for additional post-processing. This significantly improves circuit repair processing efficiency and ensures that the sample is not contaminated. The heating and sintering assembly 72 is fixed to the Z-axis of the three-coordinate motion assembly 73 via a thermally insulated mounting bracket. The heating and sintering assembly 72 is an electric heating plate, and the substrate fixing assembly 71 is made of a thermally conductive material. The X- and Y-axes of the three-coordinate motion assembly 73 provide the degrees of freedom for planar movement, while the Z-axis provides the degree of freedom for elevation.

[0074] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and are not to be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will readily conceive of other specific embodiments of the present invention without inventive effort, and such embodiments will fall within the scope of protection of the present invention.

Claims

1. An adaptive high-precision line repair method, characterized in that: The following steps are involved: S1. The light source illuminates the sample to be tested, and the CCD high-resolution camera collects image data to detect defects in the circuit; S2. Analyzing the collected defect image data through an image analysis device to derive a nozzle repair path, and using an empirical formula to calculate and adaptively change the nozzle operating parameters; S3, preparing nano-metal particles by ablating the target electrode through an electric spark ablation device; S4, using a carrier gas flow rate control device to adjust the inert gas flow rate to deliver the nano-metal particles to the nano-particle printing and sintering device; S5. Printing metal nanoparticles to the defective position of the circuit through a dry aerosol printing nozzle, and achieving complete repair of the circuit with the assistance of the nozzle movement and the movable platform under the substrate; S6, turning on the pressure pump and the heating component to achieve pressurized heating and sintering of the metal nanoparticles on the substrate in the chamber; The image analysis device analyzes the defect morphology parameters of the circuit to establish a relative coordinate system to derive the nozzle's operating trajectory. By applying the defect morphology parameters to empirical formulas to adaptively change the nozzle's operating parameters, the efficiency and quality of circuit repair are ensured. The operating parameters of the nozzle satisfy the following relationship: ; This formula is the empirical formula in step S2; where T is the time required to repair the defect, w is the width of the defect, l is the length of the defect, t is the time required for the nozzle to deposit 1 μm thick nanometal particles, and d is the diameter of the nozzle orifice. is the moving speed of the nozzle; When repairing a line, the nozzle's movement speed is adaptively changed by analyzing the size and depth of the line defect and the time required for line repair. When the defect is deep, multiple fillings are performed to ensure good line repair efficiency and quality. The inert gas in the inert gas is any one of helium, nitrogen and argon, and the gas flow rate controlled by the carrier gas flow rate control device is 0-1.6 m / s; The nanoparticle printing device includes a dry aerosol printing nozzle, a movable platform and a pressurized sintering chamber; The movable platform is placed in the pressurized sintering chamber, and the circuit substrate is placed and fixed on the movable platform; the dry aerosol printing nozzle is connected to the connecting air pipe, and the pressure pump is externally connected to the pressurized sintering chamber; The diameter of the dry aerosol printing nozzle is 0.01um-10um, the width of the repaired line is 0.1um-80um, and the bonding strength between the nano metal particles and the substrate after sintering is 20 ; The pressurized sintering chamber includes a pressurized chamber, a pressurized pump, and a sensor; The pressure pump is connected to the air inlet of the pressure chamber, and the pressure pump introduces inert gas to achieve pressurized heating and sintering of the nano-metal particles on the circuit; the sensor is used to detect the air pressure inside the pressure chamber; after the sintering work is completed, the gas is discharged through the exhaust port of the pressure chamber. The operating pressure inside the pressure chamber is 0-20MPa; The movable platform includes a substrate fixing component, a heating and sintering component, and a three-coordinate system moving component; The substrate fixing assembly is used to fix the circuit substrate on the movable platform, so that the substrate can move together with the movable platform to complete the circuit repair; the heating and sintering assembly is used to heat from below to achieve the sintering of nano-metal particles on the circuit; the three-coordinate system moving assembly realizes the free movement of the movable platform to meet the complex movement required during circuit repair.

2. The adaptive high-precision line repair method according to claim 1, characterized in that: The optical detection device includes a CCD high-resolution camera and a light source; The light source is used to irradiate light onto the surface of the object to be measured, and the CCD high-resolution camera collects the surface morphology and light changes of the object to be measured under the irradiation of the light source, and transmits the collected image data to the image analysis device.

3. The adaptive high-precision line repair method according to claim 2, characterized in that: The electric spark ablation device includes two target electrodes, an ablation reaction container, a high-voltage electrostatic output device, and an air pipe connection port; The two target electrodes are placed opposite to each other in an ablation reaction container, and the two electrodes are respectively connected to a high-voltage electrostatic output device. The ablation reaction container is connected to an inert gas source and a nanoparticle printing and sintering device for ventilation through an air pipe connection port and a connecting air pipe; The voltage adjustment range of the high-voltage electrostatic output device is 0-13.6kV, and the current adjustment range is 0-15.6mA. The particle size of the prepared fine-diameter nano-metal particles is 5-10nm. The nano-metal particles prepared by the two target electrodes are any one of copper, tin, silver, gold, aluminum, copper-tin alloy, copper-tungsten alloy, copper-titanium alloy or copper-chromium alloy.

4. An adaptive high-precision line repair device, characterized in that: It includes an optical detection device, a collection and analysis device, an electric spark ablation device, a carrier gas flow rate control device, a dry aerosol printing nozzle, a pressurized sintering chamber and a movable platform; The pressurized sintering chamber includes an air pressure sensor, a pressurized chamber and a pressurized pump, wherein the pressurized pump is connected to the air inlet of the pressurized chamber, and the air pressure sensor is installed in the pressurized chamber; The optical detection device includes a CCD high-resolution camera and a light source, wherein the CCD high-resolution camera is installed in the pressurized chamber, the light source is installed around the CCD high-resolution camera, and the CCD high-resolution camera is connected to the acquisition and analysis device; The movable platform includes a substrate fixing assembly, a heating and sintering assembly, and a three-coordinate system moving assembly; the Z-axis of the three-coordinate system moving assembly is installed with the heating and sintering assembly, the substrate fixing assembly is installed above the heating and sintering assembly, and the CCD high-resolution camera is facing the substrate fixing assembly; The carrier gas flow rate control device includes a flow rate control device and an inert gas source. The electric spark sintering device is connected to the dry aerosol printing nozzle through an air pipe. The dry aerosol printing nozzle is located in the pressurized sintering chamber and the dry aerosol printing nozzle is located above the movable platform. The inert gas source is connected to the upstream of the air pipe, and a flow rate control device is provided between the inert gas source and the electric spark sintering device.

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