Chip picking and positioning equipment for chip packaging

Abstract

The invention discloses chip picking and positioning equipment for chip packaging, and relates to the technical field of chip packaging. The equipment comprises a case, a mounting frame, a conveying assembly and a picking and positioning structure, an adsorption air channel, a screw hole pipe, a limiting air pipe and other parts are arranged in an adsorption arm in the picking and positioning structure, and movement and function control of an adsorption rod are achieved through spiral transmission connection of the screw hole pipe and a spiral ribbon rod and the synergistic effect of the limiting air pipe, a piston compensation air pipe and the like; the screw hole pipe is connected with the track rolling body, and the track rolling body moves in the nearly-surrounding movement track to drive an activating agent roll coating pen and a glue rolling wheel rod on the activating piece and the glue rolling piece to perform activating and glue rolling treatment at chip welding spots and bonding positions, so that the problem that a substrate is not synchronously activated when a chip is picked up and positioned is solved, and the chip picking and positioning efficiency is improved. The connection reliability of the chip and the substrate is improved, integration of multiple functions is realized, time and space are saved, and the stability, reliability and production efficiency of chip packaging are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, in particular to a chip picking and positioning device for chip packaging. Background Art

[0002] In today's era of rapid digital development, chips have become the core driving force of modern technology. From daily electronic devices such as smartphones and laptops to high-end industrial fields such as aerospace and automobile manufacturing, chips are everywhere. As electronic products continue to move towards miniaturization, high performance, and multi-functionality, strict requirements are placed on chip packaging. On the one hand, consumers are pursuing lighter and more portable products, such as the rise of foldable screen mobile phones, which requires chip packaging to be as small as possible to fit into the narrow internal space; on the other hand, the vigorous development of cutting-edge technologies such as 5G communications, artificial intelligence, and big data processing requires chips to have super computing power and high-speed data transmission characteristics. This requires chip packaging to effectively solve the heat dissipation problem while ensuring electrical performance, and create a stable working environment for the chip. In addition, the global chip market is in fierce competition. Major chip manufacturers are optimizing the packaging process to improve the yield, reliability, and overall performance of the chip, striving to seize the initiative in the fierce competition, thereby promoting the continuous innovation of chip packaging technology to meet the growing and diverse needs. The chip packaging process is like a sophisticated technological feast. It is the key transformation of chips from bare die to practical application. It starts with the chip pasting process. With the help of adhesive materials such as silver glue, the fragile chip is accurately fixed on the substrate, just like finding a stable "base" for the chip. This step has extremely high requirements for position accuracy and bonding characteristics. It is followed by wire bonding, which is like building a "bridge" for the chip to communicate with the outside world. Through metal wires such as gold wires, hot pressing or ultrasonic bonding technology is used to tightly connect the chip solder joints to the substrate pins. The diameter of the metal wire and the bonding parameters cannot be lost. The subsequent potting step is like putting a layer of solid "armor" on the chip. Using materials such as epoxy resin, the chip and leads are tightly wrapped under precise control of fluidity and curing conditions to resist external moisture, dust and mechanical shock. Finally, it enters a rigorous testing phase, from electrical performance to functional integrity, and then to reliability testing, one by one. Only chips that have perfectly passed layers of tests can finally enter the market and inject powerful power into various electronic devices.

[0003] Among them, in the chip packaging process, the link before the chip and the substrate are bonded is crucial. The current chip mounting equipment has certain limitations when performing the operation from chip cutting to chip transfer to the substrate surface, that is, before bonding, the solder joints on the substrate surface are not activated simultaneously. This negligence may cause potential problems. Since there may be an oxide layer on the surface of the substrate solder joint if it is not treated, the oxide layer will act as an isolation during the subsequent gold wire bonding process, which will have a negative impact on the gold wire bonding effect, reduce the connection reliability between the chip and the substrate, and ultimately affect the quality and performance of the entire chip packaging.

[0004] To this end, a chip picking and positioning device for chip packaging is proposed. Summary of the invention

[0005] The object of the present invention is to provide a chip picking and positioning device for chip packaging to solve the problem in the background art that the substrate surface is not activated synchronously during the chip picking and positioning process.

[0006] To achieve the above object, the present invention provides the following technical solution: a chip picking and positioning device for chip packaging, comprising: The chassis is the control center and is set before the thermal setting equipment and the gold wire bonding equipment; The mounting frame is connected to the upper surface of the chassis by bolts, and a mounting platform and a conveyor are integrally provided on the upper and lower sides respectively; The conveyor assembly is connected to the upper surface of the chassis through bolts and brackets, and is located on the left and right sides of the mounting frame and is flush with the conveyor of the mounting frame; The pick-up and positioning structure has the ability to move freely in multiple nodes and is connected to the lower surface of the mounting platform of the mounting frame by bolts; The picking and positioning structure includes an adsorption arm, an adsorption air channel is opened at the lower part inside the adsorption arm, one end of the adsorption air channel is communicated with a screw hole tube rotatably arranged at the lower part inside the adsorption arm, the screw hole tube is connected with the screw belt rod through the screw hole, the lower end of the screw belt rod spirally passes through the screw hole tube, and is fixed to the upper end plate of the limiting air pipe slidably arranged inside the adsorption arm, the tube wall of the limiting air pipe slidably limits the piston compensation air pipe set in the tube by the sliding seal through the annular groove, the lower end of the piston compensation air pipe extends out of the limiting air pipe and is fixed to the adsorption rod slidably arranged at the lower part inside the adsorption arm, and is communicated with the through adsorption hole opened at the axial position of the adsorption rod, the circumferential side of the adsorption rod is respectively surrounded and fixed with two piston rods and two hydraulic cylinders, wherein the piston rod sliding seal is set in the piston replenishing fluid channel opened on both sides at the lower part of the adsorption arm, and the hydraulic cylinder is fixedly set inside the adsorption arm; The side surface of the screw hole tube is movably connected with the track rolling body in cooperation with the spring telescopic rod, and the track rolling body is rollingly arranged in a near-circumferential motion path opened inside the adsorption arm, and the side surface of the track rolling body is fixed to one end of the connecting frame inside the near-circumferential motion path, and the other end of the connecting frame extends through the near-circumferential motion path and bends downward to the adsorption end of the adsorption rod, and is movably connected with the activating part and the rubber rolling part arranged on the opposite sides of the adsorption rod in cooperation with the spring rod, wherein the activating part is arranged on the solder joint path of the chip, and the rubber rolling part is arranged on the bonding position of the chip, and is actively driven and pulled by the motion compensation electric push rod slidingly limited in the connecting frame, and the activating part and the rubber rolling part are respectively integrally provided with an activator roller pen and a rubber rolling wheel rod on the side close to the adsorption rod.

[0007] Preferably, the picking and positioning structure further comprises a picking arm, the picking arm is a mechanical arm structure with multiple rotation nodes, and the movable end is connected to the adsorption arm by bolts.

[0008] Preferably, one end of the adsorption air channel passes through one side of the adsorption arm, and an interface for connecting with the suction device is integrally provided at the through port.

[0009] Preferably, the upper surface of the air pipe end plate is provided with a plurality of air holes in an axial ring shape, and the upper surface is fixed to a reset spring sleeved on the outside of the screw rod, and the upper end of the reset spring is fixed to the slide pipe wall opened inside the adsorption arm, so as to limit and reset the movement of the limited air pipe.

[0010] Preferably, the upper end surface of the adsorption rod is connected to a telescopic sleeve by bolts, and the telescopic sleeve is movably sleeved outside the tube defining the air pipe, and the upper end of the telescopic sleeve is fixed to the inner wall of the pre-opened slide groove of the adsorption arm by bolts.

[0011] Preferably, the two piston rods and the two hydraulic cylinders are symmetrically arranged along the axis, and the sides of the adsorption arm corresponding to the piston rehydration fluid channel are respectively provided with input and output one-way interfaces, and the input interface is connected to the supply component inside the adsorption arm through a pipeline.

[0012] Preferably, the path of the near-circular motion track is the same as the trajectory of the welding point, and an arc treatment is performed at the turning position to facilitate turning.

[0013] Preferably, the activating member and the rubber rolling member are respectively provided with interfaces for replenishing materials inside the activating agent roller pen and the rubber rolling wheel rod on the opposite sides of the activating agent roller pen and the rubber rolling wheel rod, and are respectively connected to the output interface of one of the piston replenishing fluid channels through the cooperation of the interface and the pipeline.

[0014] Compared with the prior art, the present invention has the following beneficial effects: The present invention uses the structural design inside the adsorption arm to quantitatively extract the activator and adhesive when adsorbing the chip, and when placing the chip, the activator roller pen and the adhesive roller rod are linked to each other at the solder joint and the chip bonding position, respectively, wherein the solder joint on the surface of the substrate is activated to avoid the negative influence of the oxide layer on the bonding effect during gold wire bonding, so that the connection between the chip and the substrate is more firm and reliable, and in the subsequent packaging process, it can better withstand the influence of various stresses and environmental factors, thereby improving the overall stability of the chip packaging. Qualitativeness and reliability, reducing the risk of chip failure caused by poor connection. Secondly, synchronous glue rolling processing, which not only saves time, but also integrates multiple functions such as chip picking, positioning, solder joint activation and glue rolling, reduces the footprint of the equipment, improves the utilization rate of production space, and simplifies the chip packaging process, reduces the time loss and error risk caused by equipment conversion and process connection, and improves production efficiency. In addition, the whole process has a high degree of automation and the components are closely matched, which greatly improves the production efficiency of chip packaging and reduces the error and labor intensity of manual operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The overall structure of the present invention is Figure 1 .

[0016] Figure 2 The overall structure of the present invention is Figure 2 .

[0017] Figure 3 It is a schematic diagram of the adsorption arm of the present invention.

[0018] Figure 4 It is a cross-sectional view showing the interior of the adsorption arm of the present invention.

[0019] Figure 5 It is a cross-sectional view of the adsorption arm of the present invention.

[0020] Figure 6 Schematic diagram of the adsorption rod and its connection structure of the present invention Figure 1 .

[0021] Figure 7 Schematic diagram of the adsorption rod and its connection structure of the present invention Figure 2 .

[0022] Figure 8 It is a cross-sectional view of the adsorption rod and its connection structure of the present invention.

[0023] In the figure: 1. Chassis; 2. Mounting frame; 3. Transmission assembly; 4. Picking and positioning structure; 41. Pick-up arm; 42. adsorption arm; 421. adsorption airway; 422. near-surrounding motion channel; 423. piston rehydration channel; 43. Adsorption rod; 431. Piston rod; 432. Hydraulic cylinder; 433. Piston compensation air pipe; 4331. Telescopic sleeve; 434. Limiting air pipe; 4341. Screw rod; 4342. Return spring; 435. Screw hole tube; 4351. Spring telescopic rod; 4352. Track rolling body; 436. Connecting frame; 437. Activating part; 4371. Activator roller pen; 438. Rubber rolling part; 4381. Rubber rolling wheel rod; 4382. Motion compensation electric push rod. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] See also Figures 1 to 8 , the present invention provides a technical solution for a chip picking and positioning device for chip packaging: A chip picking and positioning device for chip packaging, comprising: Chassis 1 is the control center and is located before the thermosetting equipment and the wire bonding equipment; The mounting frame 2 is connected to the upper surface of the chassis 1 by bolts, and a mounting platform and a conveyor are integrally provided on the upper and lower sides thereof; The conveying assembly 3 is connected to the upper surface of the chassis 1 by bolts and brackets, and is located on the left and right sides of the mounting frame 2, and is flush with the conveyor of the mounting frame 2; The picking and positioning structure 4 has the ability to move freely at multiple nodes and is connected to the lower surface of the mounting table of the mounting frame 2 by bolts; The picking and positioning structure 4 includes a picking arm 41, which is a mechanical arm structure with multiple rotating nodes, and the movable end is connected to the adsorption arm 42 by bolts. An L-shaped adsorption air channel 421 is opened at the bottom of the adsorption arm 42, and one end of the adsorption air channel 421 passes through one side of the adsorption arm 42, and an interface for connecting with the suction device is integrally provided at the through port. The other end of the adsorption air channel 421 is interconnected with a screw hole tube 435 that is rotatably arranged at the bottom of the adsorption arm 42 from the middle position downward. The screw hole tube 435 is composed of a tube body with a limiting ring and a butterfly screw hole plate connected to the lower end of the tube body by bolts, and the screw hole tube 435 is connected to the screw rod 4341 through a screw hole plate, the lower end of the screw rod 4341 spirally passes through the screw hole tube 435, and is fixed to the upper end plate of the limiting air pipe 434 slidably arranged inside the adsorption arm 42, the upper surface of the end plate of the limiting air pipe 434 is provided with a plurality of air holes along the axis ring, and the upper surface is fixed to the reset spring 4342 sleeved on the outside of the screw rod 4341, and the upper end of the reset spring 4342 is fixed to the slideway wall provided inside the adsorption arm 42, so as to limit and reset the movement of the limiting air pipe 434, the wall of the limiting air pipe 434 is provided with a stepped annular groove from the upper middle position downward, and the The piston compensation air pipe 433 which is set in the pipe through the annular groove is slidably limited. The lower end of the piston compensation air pipe 433 extends out of the limited air pipe 434 and is fixed to the adsorption rod 43 which is slidably set inside the lower part of the adsorption arm 42, and is communicated with the through adsorption hole opened at the axial position of the adsorption rod 43. The lower end of the adsorption rod 43 extends out of the adsorption arm 42. The upper end surface of the adsorption rod 43 is connected with a retractable telescopic sleeve 4331 by bolts, and the telescopic sleeve 4331 is movably sleeved on the outside of the pipe that limits the air pipe 434, and the upper end of the telescopic sleeve 4331 is fixed to the inner wall of the pre-opened slide groove of the adsorption arm 42 by bolts. Two piston rods 431 and two hydraulic cylinders 432 are fixedly arranged around the middle position of the side surface of the adsorption rod 43, and the two piston rods 431 and the two hydraulic cylinders 432 are symmetrically arranged along the axis, wherein the piston rod 431 is slidingly sealed and arranged in the piston refilling channel 423 opened on both sides of the lower part of the adsorption arm 42, and the side surface of the adsorption arm 42 is respectively provided with input and output one-way interfaces corresponding to the piston refilling channel 423, and the input interface is connected with the supply component inside the adsorption arm 42 through a pipeline, and the hydraulic cylinder 432 is fixedly arranged inside the adsorption arm 42, and the output end can pull the adsorption rod 43 to move reciprocatingly up and down; The side of the limiting ring of the screw hole tube 435 is integrally connected with a spring telescopic rod 4351 that can be freely extended and retracted, and is movably connected to the track rolling body 4352 through the spring telescopic rod 4351. The track rolling body 4352 is composed of a rod body and a ball, and is rolled and arranged inside the near-surrounding motion path 422 in cooperation with the spring telescopic rod 4351 under the traction of the screw hole tube 435. The near-surrounding motion path 422 is opened inside the adsorption arm 42, and the path is the same as the trajectory of the welding point, and an arc treatment is made at the turning position to facilitate turning. The lower part of the side of the track rolling body 4352 is fixed to one end of an adjustable connecting frame 436 inside the near-surrounding motion path 422. The connecting frame 436 is composed of a special-shaped connecting rod, an elliptical sleeve frame sleeved on the lower end of the adsorption rod 43, and a sliding limiting box body integrally arranged on the sleeve frame, wherein one end of the special-shaped connecting rod extends out of the near-surrounding motion path 422, bends downward to the adsorption end of the adsorption rod 43 and is fixed to the elliptical sleeve frame, and the elliptical sleeve frame cooperates with the retractable spring rod It is movably connected with the activating member 437 and the rubber rolling member 438 arranged on the opposite sides of the adsorption rod 43, wherein one end of the spring rod connected to the activating member 437 is fixed inside the elliptical sleeve, and the spring rod connected to the rubber rolling member 438 is slidably limited inside the sliding limit box, and the rear side and the right end of the spring rod are respectively fixed to the output end of the motion compensation electric push rod 4382, and the motion compensation electric push rod 4382 is also slidably arranged inside the sliding limit box for compensating the circumferential motion of the rubber rolling member 438, wherein the activating member 437 is arranged on the solder joint path of the chip, and the rubber rolling member 438 is arranged on the bonding position of the chip, and the activating member 437 is integrally provided with an activator roller 4371 on the side close to the adsorption rod 43, and the activating member 437 is integrally provided with an interface for filling the inside of the activator roller 4371 on the opposite side of the activator roller 4371, and is connected with the output interface of one of the piston replenishing liquid channels 423 through the cooperation of the interface and the pipeline; The rubber rolling member 438 is integrally provided with a rubber rolling wheel rod 4381 on one side close to the adsorption rod 43, and the rubber rolling member 438 is integrally provided with an interface for replenishing material inside the rubber rolling wheel rod 4381 on the opposite side of the rubber rolling wheel rod 4381, and is connected with the output interface of one of the piston replenishing liquid channels 423 through the cooperation of the interface and the pipeline. The rubber rolling gap of the rubber rolling wheel rod 4381 is larger than the rolling gap of the activator roller pen 4371, which can ensure that a layer of adhesive of a specified thickness is rolled on the surface of the substrate.

[0026] During operation, the substrate is first placed on the surface of the input side conveying component 3, and the conveying component 3 cooperates with the conveyor under the mounting frame 2 to deliver the substrate to the specified position of the conveyor of the mounting frame 2. Then, the picking arm 41 drives the adsorption arm 42 to the top of the cut chip under the program control of the chassis 1, and adsorbs and picks up the chips one by one. During adsorption, after the adsorption arm 42 is in place, the hydraulic cylinder 432 pushes the adsorption rod 43 out of the adsorption arm 42. During this process, the adsorption rod 43 pulls the piston compensation air pipe 433 and drags the piston rod 431 to quantitatively extract the activator and adhesive at the feeding end, and at the same time pushes the activator 437 and the glue rolling part 438. After the lower end of the adsorption rod 43 contacts the chip, the suction device turns on the vacuum system to grab the chip, and then the hydraulic cylinder 432 pulls up the adsorption rod 43 to reset it, and the piston rod 431 pushes the activator and adhesive to fill the activator roller pen 43. 71 and the rubber roller rod 4381, the picking arm 41 then moves the adsorption arm 42 to the chip bonding designated position above the substrate to place the chip, at this time, the activator roller pen 4371 contacts the solder joint, the rubber roller rod 4381 contacts the previous chip placement position, the hydraulic cylinder 432 continues to pull up the adsorption rod 43, driving a series of component movements, so that the activator roller pen 4371 and the rubber roller rod 4381 are activated and rolled at the solder joint and chip bonding position along the near-circular motion path 422 respectively, the motion compensation electric push rod 4382 ensures that the rubber roller rod 4381 moves within the chip pasting area, and at the same time the piston rod 431 further pushes the activator and the adhesive to be fully rolled, finally, the hydraulic cylinder 432 pushes the adsorption rod 43 to reset, and each component is reset accordingly, and the picking arm 41 transfers the adsorption arm 42 to pick up and position the next chip.

[0027] In summary, the internal structural design of the adsorption arm 42 enables quantitative extraction of activator and adhesive when adsorbing the chip, and when placing the chip, the hydraulic cylinder 432, the screw hole tube 435, the track rolling body 4352 and other components are linked to enable the activator roller pen 4371 and the adhesive roller rod 4381 to activate and adhesively roll the solder joints and chip bonding positions respectively. The solder joints on the surface of the substrate are activated to avoid the negative impact of the oxide layer on the bonding effect during gold wire bonding, so that the connection between the chip and the substrate is more firm and reliable, and in the subsequent packaging process, it can better withstand the influence of various stresses and environmental factors. It improves the overall stability and reliability of chip packaging and reduces the risk of chip failure due to poor connection. Secondly, the synchronous glue rolling process not only saves time, but also integrates multiple functions such as chip picking, positioning, solder joint activation and glue rolling, reducing the footprint of the equipment and improving the utilization rate of production space. It also simplifies the chip packaging process, reduces the time loss and error risk caused by equipment conversion and process connection, and improves production efficiency. In addition, the whole process has a high degree of automation and the components are closely coordinated, which greatly improves the production efficiency of chip packaging and reduces the errors and labor intensity of manual operations.

[0028] Working principle: When working, first place the substrate for chip pasting and bonding on the surface of the conveying component 3 on the input side, so that the conveying component 3 cooperates with the conveyor under the mounting frame 2 to convey the substrate to the specified position of the conveyor of the mounting frame 2, and then the picking arm 41 will drive the adsorption arm 42 under the control of the specified program of the chassis 1, and transfer the adsorption arm 42 to the top of the cut chip, and adsorb and pick up the cut chips one by one. During the adsorption process, when the adsorption arm 42 is transferred to the top of the specified chip, the hydraulic cylinder 432 will push the adsorption rod 43 downward, and then the adsorption rod 43 will move downward along the channel opened inside the adsorption arm 42 to pass through the adsorption arm 42, and when the adsorption rod 43 moves downward, the adsorption rod 43 will synchronously pull the piston compensation air pipe 433 moves downward along the wall of the limiting air pipe 434, while the limiting air pipe 434 does not move. At the same time, the adsorption rod 43 also drags the piston rod 431 downward along the inner wall of the hydraulic cylinder 432, and cooperates with the one-way interface to quantitatively extract the activator and glue stored in the feeding end set inside the adsorption arm 42. Then, as the adsorption rod 43 moves downward, it will contact the activating piece 437 and the rolling rubber piece 438, and push the activating piece 437 and the rolling rubber piece 438 to both sides (if the area of ​​the chip is large, the activating piece 437 and the rolling rubber piece 438 will not be pushed by the adsorption rod 43 during the downward movement process). The relatively moving activating piece 437 and the rolling rubber piece 438 will compress the spring rod connected to the connecting frame 436 until the adsorption rod 43 moves downward. The end contacts the chip surface, and then the suction device will turn on the vacuum system to generate negative pressure to grab the chip, and then the hydraulic cylinder 432 will pull the suction rod 43 upward, so that it will be retracted upward to the initial position along the inner wall of the suction arm 42. At the same time, the suction rod 43 will synchronously push the piston compensation air pipe 433 and the piston rod 431 to reset to the initial position (the suction device is dynamically adjusted, and the chip suction will not be affected), and the piston rod 431 will push the extracted activator and adhesive along the pipeline into the inside of the activator roller pen 4371 and the rubber roller rod 4381, filling the storage space of the activator roller pen 4371 and the rubber roller rod 4381, and then the picking arm 41 will transfer the suction arm 42 to the top of the substrate under the control of the specified program. , and transferred to the designated position for chip bonding, and then the chip will be placed in the designated position for pre-rolling glue under the cooperative control of the suction device. At this time, the ball end of the activator roller pen 4371 contacts the solder joint of the chip placement position, and the rubber roller of the rubber roller rod 4381 contacts the previous chip placement position of the current chip. Then the hydraulic cylinder 432 will continue to pull up the adsorption rod 43, so that it continues to move up along the inner wall of the adsorption arm 42. During the upward movement, the piston compensation air pipe 433 will push the limiting air pipe 434 upward, so that the limiting air pipe 434 slides linearly upward along the inner wall of the adsorption arm 42 under the limitation of the return spring 4342 and the piston compensation air pipe 433, and the upward moving limiting air pipe 434 will push the screw rod 4341 to move upward.When moving upward, the butterfly screw hole at the lower end of the screw hole tube 435 is cooperated (the principle is similar to that of the flying fairy toy) to drive the screw hole tube 435 to rotate inside the adsorption arm 42, and then the rotating screw hole tube 435 will drag the spring telescopic rod 4351 to make its traction track rolling body 4352 move along the near-circular motion path 422 opened inside the adsorption arm 42, and the rolling body 4352 moving along the track of the near-circular motion path 422 will synchronously drag the connecting frame 436 to drive the activating member 437 and the rubber rolling member 438 to move, and then the activating member 437 and the rubber rolling member 438 will drive the activator roller pen 4371 and the rubber rolling wheel rod 4381 to respectively perform activating agent rolling at the welding position of the current chip and the bonding position of the previous chip along the near-circular motion path 422 on the welding point path. The activation and glue rolling process of the diameter and chip bonding position is carried out until the adsorption rod 43, under the upward pulling action of the hydraulic cylinder 432, cooperates with the screw rod 4341 to drive the screw hole tube 435 and the track rolling body 4352 to rotate to the end position along the nearly circular motion path 422. At this time, the solder joint activation and glue rolling have been carried out for nearly a circle. During this process, the motion compensation electric push rod 4382 will actively push and pull the glue rolling part 438 back and forth or left and right, so that it can be moved in the movable limiting box integrally arranged on the connecting frame 436 to ensure that the glue rolling wheel rod 4381 always moves within the area of ​​the chip pasting position. At the same time, as the adsorption rod 43 moves upward, the piston rod 431 will be synchronously dragged to continue to move upward, and then the upward piston rod 431 will further push the piston to replenish the fluid channel 423 to draw the internal The activator and glue taken are respectively poured into the interior of the activator roller pen 4371 and the rubber roller rod 4381 along the pipeline. Since the storage space inside the activator roller pen 4371 and the rubber roller rod 4381 has been filled before, as the activator and glue continue to enter, the activator roller pen 4371 and the rubber roller rod 4381 will fully roll the activator and glue on the solder joints and chip bonding positions, and then the hydraulic cylinder 432 will push the adsorption rod 43 downward to reset it to the initial position again. In this process, due to the downward movement of the adsorption rod 43, the piston compensation air pipe 433 will be separated from the top support of the limiting air pipe 434 under the drive of the adsorption rod 43, and then the limiting air pipe 434 will be compressed under the return spring 4342. Under the action, it will move downward to reset, and the downward limiting air pipe 434 will pull the screw rod 4341 downward, and drive the screw hole tube 435 to rotate in the opposite direction, and then the screw hole tube 435 will cooperate with the spring telescopic rod 4351, the track rolling body 4352 and the connecting frame 436 to drag the activation part 437 and the rolling rubber part 438 to move in the opposite direction and reset along the near-circular motion path 422. At this time, the activator roller pen 4371 and the rolling rubber wheel rod 4381 will continue to activate and roll the rubber along the solder joint path and the chip pasting position. After activation and rolling again, the activator roller pen 4371 and the rolling rubber wheel rod 4381 will be basically emptied, and then the picking arm 41 will transfer the adsorption arm 42 to perform the above steps again to pick up and position the next chip.

[0029] It should be noted that initially, the lower end of the adsorption rod 43 is slightly higher than the rolling ends of the activator roller pen 4371 and the rubber roller rod 4381, and the height is related to the thickness of the rubber roller and the chip thickness, and can be adjusted according to the situation.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip picking and positioning device for chip packaging, characterized in that: include: The chassis (1) is a control center and is arranged before the thermosetting device and the gold wire bonding device; A mounting frame (2) is connected to the upper surface of the chassis (1) by means of bolts, and a mounting platform and a conveyor are integrally provided on the upper and lower sides thereof; The conveying assembly (3) is connected to the upper surface of the chassis (1) by means of bolts and brackets, and is located on the left and right sides of the mounting frame (2), and is arranged flush with the conveyor of the mounting frame (2); The picking and positioning structure (4) has the ability to move freely at multiple nodes and is connected to the lower surface of the mounting table of the mounting frame (2) by bolts; The picking and positioning structure (4) comprises an adsorption arm (42), an adsorption air channel (421) is provided at the lower part of the interior of the adsorption arm (42), one end of the adsorption air channel (421) is communicated with a screw hole tube (435) rotatably arranged at the lower part of the interior of the adsorption arm (42), the screw hole tube (435) is connected to a screw belt rod (4341) by screw transmission through a screw hole, the lower end of the screw belt rod (4341) spirally passes through the screw hole tube (435) and is fixed to an upper end plate of a limiting air tube (434) slidably arranged in the interior of the adsorption arm (42), the wall of the limiting air tube (434) is provided with a ring groove to seal the sliding of the air tube. The piston compensation air pipe (433) inside the adsorption arm (42) is slidably limited, the lower end of the piston compensation air pipe (433) extends through the limiting air pipe (434) and is fixed to the adsorption rod (43) slidably arranged at the lower part of the adsorption arm (42), and is communicated with the through adsorption hole opened at the axial position of the adsorption rod (43), and the circumferential side surface of the adsorption rod (43) is respectively surrounded and fixedly provided with two piston rods (431) and two hydraulic cylinders (432), wherein the piston rod (431) is slidably sealed and arranged in the piston replenishing fluid channel (423) opened on both sides at the lower part of the adsorption arm (42), and the hydraulic cylinder (432) is fixedly arranged inside the adsorption arm (42); The side of the screw hole tube (435) cooperates with the spring telescopic rod (4351) to be movably connected with the track rolling body (4352), and the track rolling body (4352) is rollingly arranged in the near-surrounding motion path (422) opened inside the adsorption arm (42). The side of the track rolling body (4352) is fixed to one end of the connecting frame (436) inside the near-surrounding motion path (422), and the other end of the connecting frame (436) extends out of the near-surrounding motion path (422) and bends downward to the adsorption end of the adsorption rod (43), and cooperates with the spring rod and The activating member (437) and the rubber rolling member (438) arranged on opposite sides of the adsorption rod (43) are movably connected, wherein the activating member (437) is arranged on the solder joint path of the chip, and the rubber rolling member (438) is arranged on the bonding position of the chip, and is actively driven and pulled by a motion compensation electric push rod (4382) slidingly limited in the connecting frame (436). The activating member (437) and the rubber rolling member (438) are respectively integrally provided with an activator roller pen (4371) and a rubber rolling wheel rod (4381) on one side close to the adsorption rod (43).

2. The chip picking and positioning device for chip packaging according to claim 1, characterized in that: The picking and positioning structure (4) further comprises a picking arm (41), wherein the picking arm (41) is a mechanical arm structure with multiple rotation nodes, and a movable end is connected to the adsorption arm (42) via a bolt.

3. The chip picking and positioning device for chip packaging according to claim 1, characterized in that: One end of the adsorption air channel (421) passes through a side surface of the adsorption arm (42), and an interface for connecting with the adsorption equipment is integrally provided at the through-port.

4. The chip picking and positioning device for chip packaging according to claim 1, characterized in that: The upper surface of the end plate of the limiting air tube (434) is provided with a plurality of air holes in a circular shape along the axis, and the upper surface is fixed to a reset spring (4342) sleeved on the outside of the screw rod (4341), and the upper end of the reset spring (4342) is fixed to the wall of a slideway provided inside the adsorption arm (42), thereby limiting the movement and resetting the limiting air tube (434).

5. The chip picking and positioning device for chip packaging according to claim 1, characterized in that: The upper end surface of the adsorption rod (43) is connected to a telescopic sleeve (4331) via bolts, and the telescopic sleeve (4331) is movably sleeved outside the tube defining the air pipe (434), and the upper end of the telescopic sleeve (4331) is fixed to the inner wall of the pre-opened slide groove of the adsorption arm (42) via bolts.

6. The chip picking and positioning device for chip packaging according to claim 1, characterized in that: The two piston rods (431) and the two hydraulic cylinders (432) are symmetrically arranged along the axis, and the side of the adsorption arm (42) corresponding to the piston rehydration channel (423) is respectively provided with input and output one-way interfaces, and the input interface is connected to the supply component inside the adsorption arm (42) through a pipeline.

7. The chip picking and positioning device for chip packaging according to claim 1, characterized in that: The path of the near-circular motion path (422) is the same as the trajectory of the welding point, and a circular arc is made at the turning position to facilitate turning.

8. The chip picking and positioning device for chip packaging according to claim 1, characterized in that: The activating member (437) and the rubber rolling member (438) are respectively provided with interfaces for replenishing materials inside the activating agent roller pen (4371) and the rubber rolling wheel rod (4381) on opposite sides of the activating agent roller pen (4371) and the rubber rolling wheel rod (4381), and are respectively connected to the output interface of one of the piston replenishing liquid channels (423) through the cooperation of the interface and the pipeline.

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