A chip processing device

Abstract

The present invention belongs to the technical field of semiconductor chip processing, and specifically refers to a chip processing device, including a processing main body, and a blanking component arranged on the processing main body. It further includes a downward pressing and pasting mechanism and a drying mechanism. The downward pressing and pasting mechanism is arranged on the processing main body, and the drying mechanism is arranged on the processing main body. Through the setting of the downward pressing and pasting mechanism in this application, the dosage of the conductive paste can be accurately controlled, avoiding the excess or deficiency that may occur during manual operation, thus significantly reducing the waste of the paste, ensuring that the conductive paste is accurately dropped to the specified position only when needed. This improves the utilization rate of the paste, enabling each drop of the paste to exert the maximum effect. By reducing the waste of the conductive paste and increasing the utilization rate, it helps to reduce the production cost.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor chip processing, and specifically refers to a chip processing device. Background Art

[0002] Integrated circuits are an important part of the semiconductor industry. They are miniature electronic devices that integrate components such as transistors, resistors, and capacitors, as well as connecting wires, all on a small semiconductor wafer. This miniaturized structure has greatly promoted the development of electronic devices towards miniaturization, low power consumption, and high reliability. Integrated circuits are widely used in various electronic devices and are the cornerstone of modern information technology.

[0003] During the processing of semiconductor chips, chip mounting is a crucial step. Currently, most chip mounting devices adopt a traditional chip mounting method: first, the chip is attached to a packaging substrate through silver paste using a chip mounting device, and then the substrate is placed in a heating furnace for heating and insulation for a period of time to cure the silver paste, thereby fixing the chip. Although this method is technically mature, there are obvious efficiency bottlenecks. Specifically, the traditional chip mounting method requires a large amount of time in the process turnover. This process not only increases production costs but also limits the overall production capacity of the production line. Summary of the Invention

[0004] To solve the above problems, the present invention proposes a chip processing device.

[0005] The technical solution adopted by the present invention is as follows: The present invention provides a chip processing device, including a processing main body, a blanking component arranged on the processing main body, a downward pressing chip mounting mechanism and a drying mechanism. The downward pressing chip mounting mechanism is arranged on the processing main body, and the drying mechanism is arranged on the processing main body; the downward pressing chip mounting mechanism includes a chip mounting component, a chip mounting adsorption component, a liquid dripping component at the pins and a gas pressure supplement component. The chip mounting component is arranged on the downward pressing chip mounting mechanism, the chip mounting adsorption component is arranged on the chip mounting component, the liquid dripping component at the pins is arranged inside the chip mounting component, and the gas pressure supplement component is arranged on the chip mounting component.

[0006] Further, the processing body includes a processing table, a processing cover is provided at the upper end of the processing table, a base is provided on the processing table, a rotating tube is rotatably provided at the inner bottom end of the base, a rotating table is provided at the upper end of the rotating tube, an annular sliding groove is formed at the upper end of the base, a first slider is slidably provided in the annular sliding groove, the upper end of the first slider is connected to the lower end of the rotating table, a second motor is provided at the inner bottom end of the base, a first bevel gear is provided at the output end of the second motor, a second bevel gear is sleeved on the outer wall of the rotating tube, and the first bevel gear and the second bevel gear are meshed and rotationally connected. A sliding rod is provided on the inner side wall of the processing cover, a first motor is provided on the outer side wall of the processing cover, one end of a first lead screw is installed at the output end of the first motor, and the other end of the first lead screw is rotatably connected to the other inner side wall of the processing cover. A moving block is slidably sleeved on the sliding rod and sleeved on the first lead screw, and the first lead screw is threadedly connected to the moving block.

[0007] Further, the chip mounting assembly includes a first lifting cylinder, the first lifting cylinder is provided at the lower end of the moving block, a chip mounting cavity is provided at the output end of the first lifting cylinder, a partition is provided on the inner side wall of the chip mounting cavity, a conductive paste storage cavity is provided above the partition, and a liquid supplement cavity is connected through the upper end of the chip mounting cavity.

[0008] The chip mounting and adsorbing assembly includes a cavity, the cavity is provided at the lower end of the partition, a first spring is provided at the inner top end of the cavity, a piston is connected to the lower end of the first spring, a second slider is provided at the lower end of the piston, a second connecting rod is connected to the lower end of the second slider, a suction hood is connected to the lower end of the second connecting rod, a first suction cup is connected through the lower end of the suction hood, an air pump is provided on the outer side wall of the chip mounting cavity, the suction end of the air pump is connected to one end of a connecting pipe, and the other end of the connecting pipe is connected through the outer side wall of the suction hood. A flow hole is formed in the partition, the flow hole is provided above the cavity, the piston is slidably provided on the inner side wall of the cavity, and the second slider is slidably provided on the inner side wall of the cavity.

[0009] Further, the liquid dropping assembly at the pin includes a liquid outlet cavity, the upper end of the liquid outlet cavity is connected through the partition, a first connecting rod is provided at the upper inner wall of the liquid outlet cavity, a first sealing plate is provided at the lower inner wall of the liquid outlet cavity, a first blocking hole is formed in the first sealing plate, a second spring is provided at the lower end of the first connecting rod, a first sealing ball is provided at the lower end of the second spring, an output pipe is connected through the lower end of the liquid outlet cavity, and the center of the first sealing ball is provided below the first blocking hole.

[0010] Further, the air pressure supplement component includes a tube body, the lower end of the tube body is connected through the upper end of the liquid supplement cavity, a fixing rod is arranged at the upper end of the inner wall of the tube body, a second sealing plate is arranged at the lower end of the inner wall of the tube body, a second blocking hole is formed in the second sealing plate, a third spring is arranged at the lower end of the fixing rod, a second sealing ball is arranged at the lower end of the third spring, and the center of the second sealing ball is arranged below the second blocking hole.

[0011] Further, the drying mechanism includes a slurry heating component and a preheating component. The slurry heating component is arranged on the rotating table, and the preheating component is arranged on the processing cover.

[0012] Further, the slurry heating component includes a patch mold. The patch mold is arranged at the upper end of the rotating table. A substrate placement groove is arranged inside the patch mold. A first heating sheet is arranged at the inner bottom end of the substrate placement groove. A first heat conducting sheet is arranged at the upper end of the first heating sheet. A fourth spring is arranged at the inner top end of the first suction cup. A heat insulation sheet is arranged at the lower end of the fourth spring. A second heating sheet is arranged at the lower end of the heat insulation sheet. A second heat conducting sheet is arranged at the lower end of the second heating sheet.

[0013] Further, the preheating component includes a third motor. The third motor is arranged at the rear end of the side wall of the processing cover. One end of a second lead screw is installed at the output end of the third motor. The other end of the second lead screw is rotatably connected inside the wall of the processing cover. A sleeve is sleeved on the second lead screw. The second lead screw and the sleeve are in threaded connection. A patch moving plate is connected to one side of the sleeve. A patch placement groove is arranged on the patch moving plate. A third heating sheet is arranged at the inner bottom end of the patch placement groove. A third heat conducting sheet is arranged at the upper end of the third heating sheet.

[0014] Further, the blanking component includes a base. The base is arranged at one side of the upper end of the processing table. A fourth motor is arranged at the inner bottom end of the base. One end of an L-shaped rod is installed at the output end of the fourth motor. A second lifting cylinder is arranged at the lower side of the other end of the L-shaped rod. An electric suction cup is arranged at the output end of the second lifting cylinder.

[0015] The beneficial effects achieved by the present invention with the above structure are as follows:

[0016] (1) The arrangement of the patch mold and the patch moving plate improves the curing efficiency of the patch through two-step heating processes of preheating and heating, and shortens the overall processing time.

[0017] (2) The arrangement of the downward pressing type patch mechanism can accurately control the dosage of the conductive slurry, avoid the excess or deficiency that may occur during manual operation, and thus significantly reduce the waste of the slurry.

[0018] (3) The setting of the downward pressing and pasting mechanism ensures that the conductive paste is accurately dropped onto the specified position only when needed, which improves the utilization rate of the paste and enables each drop of the paste to exert its maximum effect.

[0019] (4) The setting of the downward pressing and pasting mechanism helps reduce the production cost by reducing the waste of conductive paste and improving the utilization rate.

[0020] (5) The setting of the downward pressing and pasting mechanism reduces the need for manual intervention, thus accelerating the production speed. At the same time, since the conductive paste can reach the specified position accurately and quickly, it also helps shorten the overall processing time.

[0021] (6) The setting of the downward pressing and pasting mechanism, with the precise dripping of the conductive paste, helps ensure that each welding area on the substrate obtains the same amount of paste, which enhances the consistency and reliability of the product and improves the quality of the final product.

[0022] (7) The setting of the pasting adsorption component adsorbs the paste through the negative pressure in the first suction cup, ensuring the stability of the paste during movement, avoiding the paste from falling off or being misaligned. At the same time, by continuously heating the paste with the second heating sheet and the second heat conduction sheet, it helps the conductive paste solidify quickly.

[0023] (8) During the pasting process, the second heating sheet continues to heat the paste, ensuring that the conductive paste can solidify quickly when contacting the substrate, improving the welding quality. Description of the Drawings

[0024] To more clearly illustrate the technical solutions of the present invention, the drawings required for description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 It is the front view of a chip processing device of the present invention;

[0026] Figure 2 It is the structural schematic diagram of a chip processing device of the present invention;

[0027] Figure 3 It is the internal structural schematic diagram of the left wall of the processing cover;

[0028] Figure 4 It is the structural schematic diagram of the downward pressing and pasting mechanism;

[0029] Figure 5 It is for Figure 4 The partial enlarged view of part A in

[0030] Figure 6For Figure 4 Partial enlarged view of part B in

[0031] Figure 7 For Figure 4 Partial enlarged view of part C in

[0032] Figure 8 Schematic diagram of the chip mounting die structure

[0033] Figure 9 Schematic diagram of the chip mounting moving plate structure

[0034] Figure 10 Top view of the rotating table

[0035] Among them, 1. Processing main body, 2. Press-down chip mounting mechanism, 3. Drying mechanism, 4. Blanking component, 5. Processing table, 6. Processing cover, 7. Base, 8. Rotating table, 9. Rotating pipe, 10. First motor, 11. First lead screw, 12. Slide bar, 13. Moving block, 14. Second motor, 15. Bevel gear 1, 16. Bevel gear 2, 17. Annular chute, 18. First slider, 19. Chip mounting component, 20. Chip mounting adsorption component, 21. Liquid dropping component at the pin, 22. Air pressure supplement component, 23. First lifting cylinder, 24. Chip mounting cavity, 25. Partition board, 26. Liquid supplement cavity, 27. Conductive paste storage cavity, 28. Cavity, 29. First spring, 30. Second slider, 31. Piston, 32. Flow hole, 33. Air extraction hood, 34. First suction cup, 35. Air pump, 36. Connecting pipe, 37. Liquid outlet cavity, 38. Output pipe, 39. First connecting rod, 40. Second spring, 41. First sealing plate, 42. First sealing ball, 43. First hole plug, 44. Pipe body, 45. Fixed rod, 46. Third spring, 47. Second sealing plate, 48. Second sealing ball, 49. Second hole plug, 50. Paste heating component, 51. Preheating component, 52. Substrate placement groove, 53. Chip mounting die, 54. First heat conducting sheet, 55. First heating sheet, 56. Fourth spring, 57. Second heat conducting sheet, 58. Second heating sheet, 59. Third motor, 60. Second lead screw, 61. Sleeve, 62. Chip mounting moving plate, 63. Chip mounting placement groove, 64. Third heat conducting sheet, 65. Third heating sheet, 66. Fourth motor, 67. Base, 68. L-shaped rod, 69. Electric suction cup, 70. Second lifting cylinder, 71. Second connecting rod, 72. Heat insulation sheet Specific implementation mode

[0036] In order to make the objectives, features, and advantages of the present invention more obvious and understandable, the technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the specific embodiments of the present invention. Obviously, the embodiments described below are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0037] As Figures 1-10 shown, the present invention provides a chip processing device, including a processing main body 1, a blanking component 4 provided on the processing main body 1, and further including a pressing type chip mounting mechanism 2 and a drying mechanism 3. The pressing type chip mounting mechanism 2 is provided on the processing main body 1, and the drying mechanism 3 is provided on the processing main body 1.

[0038] The processing main body 1 includes a processing table 5, a processing cover 6, a base 7, a rotating table 8, a rotating tube 9, a first motor 10, a first lead screw 11, a sliding rod 12, a moving block 13, a second motor 14, a first bevel gear 15, a second bevel gear 16, an annular sliding groove 17, and a first slider 18. A processing cover 6 is provided at the upper end of the processing table 5, a base 7 is provided on the processing table 5, a rotating tube 9 is rotatably provided at the inner bottom end of the base 7, a rotating table 8 is provided at the upper end of the rotating tube 9, an annular sliding groove 17 is opened at the upper end of the base 7, a first slider 18 is slidably provided in the annular sliding groove 17, the upper end of the first slider 18 is connected to the lower end of the rotating table 8, a second motor 14 is provided at the inner bottom end of the base 7, a first bevel gear 15 is provided at the output end of the second motor 14, a second bevel gear 16 is sleeved on the outer wall of the rotating tube 9, and the first bevel gear 15 and the second bevel gear 16 are meshed and rotatably connected. A sliding rod 12 is provided on the inner side wall of the processing cover 6, a first motor 10 is provided on the outer side wall of the processing cover 6, one end of a first lead screw 11 is installed at the output end of the first motor 10, the other end of the first lead screw 11 is rotatably connected to the other inner side wall of the processing cover 6, a moving block 13 is slidably sleeved on the sliding rod 12, the moving block 13 is sleeved on the first lead screw 11, and the first lead screw 11 is threadedly connected to the moving block 13.

[0039] The pressing type chip mounting mechanism 2 includes a chip mounting component 19, a chip mounting adsorption component 20, a liquid dropping component 21 at the pin, and a gas pressure supplement component 22. The chip mounting component 19 is provided on the pressing type chip mounting mechanism 2, the chip mounting adsorption component 20 is provided on the chip mounting component 19, the liquid dropping component 21 at the pin is provided in the chip mounting component 19, and the gas pressure supplement component 22 is provided on the chip mounting component 19.

[0040] The chip component 19 includes a first lifting cylinder 23, a chip cavity 24, a partition 25, a liquid replenishing cavity 26, and a conductive paste storage cavity 27. The first lifting cylinder 23 is arranged at the lower end of the moving block 13. The output end of the first lifting cylinder 23 is provided with the chip cavity 24. A partition 25 is provided on the inner side wall of the chip cavity 24. The conductive paste storage cavity 27 is provided above the partition 25. The upper end of the chip cavity 24 is connected to the liquid replenishing cavity 26 in a through manner.

[0041] The chip adsorption component 20 includes a cavity 28, a first spring 29, a second slider 30, a piston 31, a flow hole 32, an air extraction hood 33, a first suction cup 34, an air pump 35, a connecting pipe 36, and a second connecting rod 71. The cavity 28 is arranged at the lower end of the partition 25. A first spring 29 is provided at the inner top of the cavity 28. The lower end of the first spring 29 is connected to the piston 31. The second slider 30 is provided at the lower end of the piston 31. The lower end of the second slider 30 is connected to the second connecting rod 71. The lower end of the second connecting rod 71 is connected to the air extraction hood 33. The lower end of the air extraction hood 33 is connected to the first suction cup 34 in a through manner. An air pump 35 is provided on the outer side wall of the chip cavity 24. The air extraction end of the air pump 35 is connected to one end of the connecting pipe 36. The other end of the connecting pipe 36 is connected to the outer side wall of the air extraction hood 33 in a through manner. A flow hole 32 is opened on the partition 25. The flow hole 32 is arranged above the cavity 28. The piston 31 is slidably arranged on the inner side wall of the cavity 28. The second slider 30 is slidably arranged on the inner side wall of the cavity 28.

[0042] The liquid dripping component 21 at the pin includes a liquid outlet cavity 37, an output pipe 38, a first connecting rod 39, a second spring 40, a first sealing plate 41, a first sealing ball 42, and a first hole plug 43. The upper end of the liquid outlet cavity 37 is connected to the partition 25 in a through manner. A first connecting rod 39 is provided at the upper end of the inner wall of the liquid outlet cavity 37. A first sealing plate 41 is provided at the lower end of the inner wall of the liquid outlet cavity 37. A first hole plug 43 is opened on the first sealing plate 41. A second spring 40 is provided at the lower end of the first connecting rod 39. A first sealing ball 42 is provided at the lower end of the second spring 40. The lower end of the liquid outlet cavity 37 is connected to the output pipe 38 in a through manner. The center of the first sealing ball 42 is arranged below the first hole plug 43.

[0043] The air pressure supplement component 22 includes a pipe body 44, a fixing rod 45, a third spring 46, a second sealing plate 47, a second sealing ball 48, and a second hole plug 49. The lower end of the pipe body 44 is connected to the upper end of the liquid replenishing cavity 26 in a through manner. A fixing rod 45 is provided at the upper end of the inner wall of the pipe body 44. A second sealing plate 47 is provided at the lower end of the inner wall of the pipe body 44. A second hole plug 49 is opened on the second sealing plate 47. A third spring 46 is provided at the lower end of the fixing rod 45. A second sealing ball 48 is provided at the lower end of the third spring 46. The center of the second sealing ball 48 is arranged below the second hole plug 49.

[0044] The drying mechanism 3 includes a slurry heating assembly 50 and a preheating assembly 51. The slurry heating assembly 50 is arranged on the rotating table 8, and the preheating assembly 51 is arranged on the processing cover 6.

[0045] The slurry heating assembly 50 includes a substrate placement groove 52, a patch mold 53, a first heat conducting sheet 54, a first heating sheet 55, a fourth spring 56, a second heat conducting sheet 57, a second heating sheet 58 and a heat insulation sheet 72. The patch mold 53 is arranged at the upper end of the rotating table 8. A substrate placement groove 52 is arranged inside the patch mold 53. A first heating sheet 55 is arranged at the inner bottom end of the substrate placement groove 52. A first heat conducting sheet 54 is arranged at the upper end of the first heating sheet 55. A fourth spring 56 is arranged at the inner top end of the first suction cup 34. A heat insulation sheet 72 is arranged at the lower end of the fourth spring 56. A second heating sheet 58 is arranged at the lower end of the heat insulation sheet 72. A second heat conducting sheet 57 is arranged at the lower end of the second heating sheet 58.

[0046] The preheating assembly 51 includes a third motor 59, a second lead screw 60, a sleeve 61, a patch moving plate 62, a patch placement groove 63, a third heat conducting sheet 64 and a third heating sheet 65. The third motor 59 is arranged at the rear end of the side wall of the processing cover 6. One end of the second lead screw 60 is installed at the output end of the third motor 59. The other end of the second lead screw 60 is rotatably connected inside the wall of the processing cover 6. The sleeve 61 is sleeved on the second lead screw 60. The second lead screw 60 and the sleeve 61 are in threaded connection. The patch moving plate 62 is connected to one side of the sleeve 61. A patch placement groove 63 is arranged on the patch moving plate 62. A third heating sheet 65 is arranged at the inner bottom end of the patch placement groove 63. A third heat conducting sheet 64 is arranged at the upper end of the third heating sheet 65.

[0047] The blanking component 4 includes a fourth motor 66, a base 67, an L-shaped rod 68, an electric suction cup 69 and a second lifting cylinder 70. The base 67 is arranged on one side of the upper end of the processing table 5. The fourth motor 66 is arranged at the inner bottom end of the base 67. One end of the L-shaped rod 68 is installed at the output end of the fourth motor 66. A second lifting cylinder 70 is arranged on the lower side of the other end of the L-shaped rod 68. The electric suction cup 69 is arranged at the output end of the second lifting cylinder 70.

[0048] During specific use, first place the patch in the patch placement groove 63, start the third heating sheet 65, and the heat generated by the third heating sheet 65 is transferred to the patch through the third heat conducting sheet 64 to preheat the patch. Place the substrate in the substrate placement groove 52, start the first heating sheet 55, and the heat generated by the first heating sheet 55 heats the substrate through the first heat conducting sheet 54. The output end of the first motor 10 rotates to drive the first lead screw 11 to rotate, the rotation of the first lead screw 11 drives the moving block 13 to move, the movement of the moving block 13 drives the down-pressing patch mechanism 2 to move, and align the first suction cup 34 in the down-pressing patch mechanism 2 with the patch in the patch placement groove 63. The output end of the first lifting cylinder 23 moves downward to drive the patch cavity 24 to move downward, the downward movement of the patch cavity 24 drives the first suction cup 34 to move downward. While the first suction cup 34 is moving downward, start the air pump 35 and the second heating sheet 58, and use the negative pressure generated in the first suction cup 34 to adsorb the patch. At this time, the fourth spring 56 is compressed, and at the same time, use the heat generated by the second heating sheet 58 to continue heating the patch through the second heat conducting sheet 57. After the first lifting cylinder 23 resets, the output end of the first motor 10 rotates in the reverse direction, and the moving block 13 resets. At this time, the patch adsorbed by the first suction cup 34 is aligned with the substrate in the substrate placement groove 52. The output end of the first lifting cylinder 23 moves downward to drive the cavity 28 to move downward, the downward movement of the cavity 28 drives the first spring 29 to move downward, the downward movement of the first spring 29 drives the piston 31 and the second slider 30 to move downward, thereby driving the second connecting rod 71 and the air extraction cover 33 to move downward until the patch and the substrate are in contact. At this time, the output end of the first suction cup 34 continues to move downward, and at this time, the first spring 29 is compressed. The conductive paste above the piston 31 enters the conductive paste storage cavity 27 through the flow hole 32. At this time, the first sealing ball 42 is pushed open, and the second spring 40 is stretched. The conductive paste enters the output pipe 38 through the first plug hole 43 and drips at the connection between the welding area of the substrate and the pins of the patch. Since both the substrate and the patch are in a heated state, the conductive paste quickly solidifies. At this time, stop the air pump 35, and the first lifting cylinder 23 resets. Immediately afterwards, the first spring 29 resets, a negative pressure is generated in the conductive paste storage cavity 27, and the second sealing ball 48 is pushed downward. At this time, the third spring 46 is stretched, and air enters the liquid supplement cavity 26 through the second plug hole 49. The output end of the second motor 14 rotates to drive the first bevel gear 15 to rotate, the rotation of the first bevel gear 15 drives the second bevel gear 16 to rotate, the rotation of the second bevel gear 16 drives the rotating pipe 9 to rotate, the rotation of the rotating pipe 9 drives the rotating table 8 to rotate, and the rotation of the rotating table 8 drives the patch mold 53 to rotate, and rotates the patch mold 53 to directly below the second lifting cylinder 70. The output end of the electric suction cup 69 moves downward to drive the second lifting cylinder 70 to move downward, and adsorbs and resets the substrate after patching. The output end of the fourth motor 66 rotates to drive the L-shaped rod 68 to rotate, and places the substrate after patching into the collection box. The output end of the third motor 59 rotates to drive the second lead screw 60 to rotate, and the rotation of the second lead screw 60 drives the sleeve 61 to move.The movement of the sleeve 61 drives the movement of the patch moving plate 62, so that the position of the patch moving plate 62 can be adjusted back and forth, facilitating the picking up of the patch. The above is the overall working process of the present invention, and this step can be repeated during the next use.

[0049] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but rather should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A chip processing device, comprising a processing main body (1) and a blanking assembly (4) arranged on the processing main body (1), characterized in that: It also includes a pressing type chip mounting mechanism (2) and a drying mechanism (3). The pressing type chip mounting mechanism (2) is arranged on the processing main body (1), and the drying mechanism (3) is arranged on the processing main body (1). A processing cover (6) and a rotating table (8) are provided inside the processing main body (1); the pressing type chip mounting mechanism (2) includes a chip mounting component (19), a chip mounting adsorption component (20), a liquid dropping component at the pin (21), and a gas pressure supplement component (22). The chip mounting component (19) is arranged on the pressing type chip mounting mechanism (2). A conductive paste storage cavity (27) is provided inside the chip mounting component (19). The chip mounting adsorption component (20) is arranged on the chip mounting component (19). A first suction cup (34) is provided inside the chip mounting adsorption component (20). The liquid dropping component at the pin (21) is arranged inside the chip mounting component (19), and the liquid dropping component at the pin (21) is used to make the amount of paste dropped in each welding area consistent. The gas pressure supplement component (22) is arranged on the chip mounting component (19), and the gas pressure supplement component (22) is used to supplement the gas pressure in the conductive paste storage cavity (27); the drying mechanism (3) includes a paste heating component (50) and a preheating component (51). The paste heating component (50) is arranged on the rotating table (8), and the preheating component (51) is arranged on the processing cover (6); the paste heating component (50) includes a chip mounting mold (53). The chip mounting mold (53) is arranged at the upper end of the rotating table (8). A substrate placement groove (52) is provided inside the chip mounting mold (53). A first heating sheet (55) is provided at the inner bottom end of the substrate placement groove (52). A first heat conducting sheet (54) is provided above the first heating sheet (55). A fourth spring (56) is provided at the inner top end of the first suction cup (34). A heat insulation sheet (72) is provided at the lower end of the fourth spring (56). A second heating sheet (58) is provided at the lower end of the heat insulation sheet (72). A second heat conducting sheet (57) is provided at the lower end of the second heating sheet (58); the preheating component (51) includes a third motor (59). A third motor (59) is provided at the rear end of the side wall of the processing cover (6). One end of a second lead screw (60) is installed at the output end of the third motor (59). The other end of the second lead screw (60) is rotatably connected inside the wall of the processing cover (6). A sleeve (61) is sleeved on the second lead screw (60). The second lead screw (60) is threadedly connected with the sleeve (61). One side of the sleeve (61) is connected to a chip mounting moving plate (62). A chip mounting placement groove (63) is provided on the chip mounting moving plate (62). A third heating sheet (65) is provided at the inner bottom end of the chip mounting placement groove (63). A third heat conducting sheet (64) is provided above the third heating sheet (65).

2. The chip processing device according to claim 1, wherein: The processing main body (1) includes a processing table (5). A processing cover (6) is provided at the upper end of the processing table (5). A base (7) is provided on the processing table (5). A rotating tube (9) is rotatably provided at the inner bottom end of the base (7). A rotating table (8) is provided at the upper end of the rotating tube (9). An annular sliding groove (17) is formed at the upper end of the base (7). A first slider (18) is slidably provided in the annular sliding groove (17). The upper end of the first slider (18) is connected to the lower end of the rotating table (8). A second motor (14) is provided at the inner bottom end of the base (7). A first bevel gear (15) is provided at the output end of the second motor (14). A second bevel gear (16) is sleeved on the outer wall of the rotating tube (9). The first bevel gear (15) and the second bevel gear (16) are meshed and rotationally connected. A sliding rod (12) is provided on the inner side wall of the processing cover (6). A first motor (10) is provided on the outer side wall of the processing cover (6). One end of a first lead screw (11) is installed at the output end of the first motor (10). The other end of the first lead screw (11) is rotatably connected to the other inner side wall of the processing cover (6). A moving block (13) is slidably sleeved on the sliding rod (12). The moving block (13) is sleeved on the first lead screw (11). The first lead screw (11) is threadedly connected to the moving block (13).

3. The chip processing device according to claim 2, characterized in that: The chip component (19) includes a first lifting cylinder (23). The first lifting cylinder (23) is provided at the lower end of the moving block (13). A chip cavity (24) is provided at the output end of the first lifting cylinder (23). A partition (25) is provided on the inner side wall of the chip cavity (24). An electrically conductive paste storage cavity (27) is provided above the partition (25). A liquid replenishing cavity (26) is connected to the upper end of the chip cavity (24) in a penetrating manner.

4. A chip processing device according to claim 3, characterized in that: The chip adsorption component (20) includes a cavity (28). The cavity (28) is provided at the lower end of the partition (25). A first spring (29) is provided at the inner top end of the cavity (28). The lower end of the first spring (29) is connected to a piston (31). A second slider (30) is provided at the lower end of the piston (31). The lower end of the second slider (30) is connected to a second connecting rod (71). The lower end of the second connecting rod (71) is connected to an air extraction hood (33). The lower end of the air extraction hood (33) is connected to a first suction cup (34) in a penetrating manner. An air pump (35) is provided on the outer side wall of the chip cavity (24). The air extraction end of the air pump (35) is connected to one end of a connecting pipe (36). The other end of the connecting pipe (36) is connected to the outer side wall of the air extraction hood (33) in a penetrating manner. A flow hole (32) is formed in the partition (25). The flow hole (32) is provided above the cavity (28). The piston (31) is slidably provided on the inner side wall of the cavity (28). The second slider (30) is slidably provided on the inner side wall of the cavity (28).

5. A chip processing device according to claim 4, characterized in that: The liquid dripping component (21) at the pin includes a liquid outlet cavity (37). The upper end of the liquid outlet cavity (37) is connected to the partition plate (25) in a through manner. The upper end of the inner wall of the liquid outlet cavity (37) is provided with a first connecting rod (39). The lower end of the inner wall of the liquid outlet cavity (37) is provided with a first sealing plate (41). A first blocking hole (43) is formed in the first sealing plate (41). The lower end of the first connecting rod (39) is provided with a second spring (40). The lower end of the second spring (40) is provided with a first sealing ball (42). The lower end of the liquid outlet cavity (37) is connected to an output pipe (38) in a through manner. The center of the first sealing ball (42) is located below the first blocking hole (43).

6. The chip processing device according to claim 5, wherein: The air pressure supplement component (22) includes a pipe body (44). The lower end of the pipe body (44) is connected to the upper end of the liquid supplement cavity (26) in a through manner. The upper end of the inner wall of the pipe body (44) is provided with a fixed rod (45). The lower end of the inner wall of the pipe body (44) is provided with a second sealing plate (47). A second blocking hole (49) is formed in the second sealing plate (47). The lower end of the fixed rod (45) is provided with a third spring (46). The lower end of the third spring (46) is provided with a second sealing ball (48). The center of the second sealing ball (48) is located below the second blocking hole (49).

7. A chip processing device according to claim 6, characterized in that: The blanking component (4) includes a base (67). The base (67) is arranged on one side of the upper end of the processing table (5). A fourth motor (66) is arranged at the bottom end inside the base (67). One end of an L-shaped rod (68) is installed at the output end of the fourth motor (66). A second lifting cylinder (70) is arranged on the lower side of the other end of the L-shaped rod (68). An electric suction cup (69) is arranged at the output end of the second lifting cylinder (70).

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